JP4024613B2 - Adsorption device, vacuum processing device and adsorption method - Google Patents

Description

【００１３】
帯電列は、正（＋）に帯電しやすい物質と、負（−）に帯電しやすい物質の序列を示すものであり、上記表１では正（＋）に帯電しやすいものを上側に示し、負（−）に帯電しやすいものを下側に示している。
【００１４】
帯電列上で近い位置にある物質同士を摩擦した場合は帯電量が少なく、離れた位置にある物質同士を摩擦した場合は帯電量が大きくなることが知られており、同じ物質同士を摩擦した場合は帯電量が非常に小さくなることが考えられる。
従って、吸着装置の基板と接触する部分を、該基板と同じ物質で構成すれば、吸着装置の帯電量が小さくなると推測される。
【００１５】
かかる知見にもとづいてなされた請求項１記載の発明は、電極部と、接触部とを有し、吸着対象物の一面を接触面とし、該接触面を前記接触部に接触させ、前記電極部に電圧を印加すると、前記吸着対象物が前記接触部に吸着されるように構成された吸着装置であって、前記接触部は、前記接触面に露出する物質と同じ種類の絶縁物質で構成された吸着装置である。
請求項２記載の発明は、請求項１記載の吸着装置であって、前記接触面に露出する物質は、ポリカーボネートと、ポリエチレンテレフタレートと、ガラスのうちのいずれか１種類の物質からなる吸着装置である。
請求項３記載の発明は、支持体と、電極部と、接触部とを有し、吸着対象物の一面を接触面とし、該接触面を前記接触部に接触させ、前記電極部に電圧を印加すると、前記吸着対象物が前記接触部に吸着されるように構成された吸着装置であって、前記支持体は、金属材料が板状に形成された支持基板と、絶縁材料が膜状に形成された絶縁膜とを有し、前記絶縁膜は前記支持基板上に配置され、前記電極部は前記絶縁膜上に配置され、前記接触部はシート状に形成された絶縁材料で構成され、前記電極部の表面と密着するように配置され、前記接触部は、前記接触面に露出する物質と同じ種類の絶縁物質で構成され、前記吸着対象物を前記接触部に接触させた状態で前記電極部に電圧を印加すると、前記吸着対象物が吸着されるように構成された吸着装置である。
請求項４記載の発明は、請求項３記載の吸着装置であって、前記電極部は前記支持基板上で引き回され、前記接触部は前記電極部間に配置された接着剤によって前記支持体に貼付された吸着装置である。
請求項５記載の発明は、請求項３又は請求項４のいずれか１項記載の吸着装置であって、前記電極部は、銅薄膜がパターニングされて形成された吸着装置である。
請求項６記載の発明は、請求項１記載の吸着装置であって、絶縁材料からなる絶縁板と、前記絶縁板の一面に形成された凹部と、前記絶縁板の前記凹部間に位置する凸部の先端部分で前記接触部が構成され、前記電極部は前記凹部内の前記接触部よりも低い位置に配置され、前記絶縁板は、ガラスと、ポリカーボネートと、ポリエチレンテレフタレートのうち、いずれか１種類の物質で構成された吸着装置である。
請求項７記載の発明は、真空槽と、請求項１乃至請求項６のいずれか１項記載の吸着装置とを有し、前記吸着装置は前記真空槽内に配置され、前記吸着対象物は前記真空槽内で前記吸着装置に吸着されるように構成された真空処理装置である。
請求項８記載の発明は、吸着対象物の一面を接触面とし、前記接触面を吸着装置の接触部表面に接触させた状態で、前記吸着装置の電極に電圧を印加し、前記吸着対象物を吸着する吸着方法であって、前記接触部表面には、前記接触面を構成する物質と同じ種類の絶縁物質を露出させておく吸着方法である。
【００１６】
本発明は上記のように構成されており、真空処理装置では、通常、同種類の吸着対象物を１枚ずつ逐次吸着装置に吸着して、真空槽内で成膜等の処理が行われる。
従って、吸着対象物の接触面に露出する物質は予め分かっているので、その物質と同じ物質で接触部を構成することで、接触部の帯電量を抑えることができる。
【００１７】
吸着装置に、冷却手段や加熱手段のような温度制御手段を内蔵させる、又は、吸着装置の近傍に温度制御手段を配置し、吸着対象物を吸着装置に吸着した状態で、温度制御手段によって吸着装置を加熱又は冷却すれば、吸着対象物を効率良く加熱又は冷却することができる。
【００１８】
吸着対象物がガラス基板であって、その表面にＩＴＯ（インジウム錫酸化物）薄膜を形成し、液晶表示装置のパネルを作製する場合や、吸着対象物がポリカーボネート基板であって、その表面に金属薄膜を形成してコンパクトディスク等の記録媒体を作成する場合、基板の裏面にはＩＴＯ薄膜や金属薄膜が形成されず、基板自身が露出していることが多い。
【００１９】
以上は本発明のうち、第一の発明について説明したが、以下にそれとは異なる第二の発明について説明する。
従来は吸着装置の支持体はセラミックによって構成されており、セラミックを焼成する際に、支持体の寸法及び形状に狂いが生じることがあった。第二の発明の吸着装置は、金属材料の支持基板と、絶縁膜とで支持体が構成されており、その製造に焼成工程がないので、支持体の寸法及び形状に狂いが生じない。
【００２０】
また、電極部の表面に接着剤が付着しないように接着剤を配置すれば、支持体に貼付された接触部は電極部の表面に密着するので、電極部の表面から接触部表面までの距離を小さくすることができる。
【００２１】
本発明第三の発明は、凹部が形成された絶縁板の、該凹部内に、接触部よりも低い位置まで導電材料を配置することで電極部が形成されている。
この吸着装置に吸着対象物を載せると、吸着対象物は接触部に接触するが、電極部には接触しないので、導電材料からなる吸着対象物を吸着することができる。
また、接触面に絶縁材料が露出する吸着対象物を吸着する場合には、絶縁板を吸着対象物と同じ物質で構成しておけば、摩擦による帯電量が小さい。
【００２２】
【発明の実施の形態】
以下で図面を参照し、本発明の実施形態について説明する。
図１の符号１は本発明の一実施形態の真空処理装置であるスパッタリング装置を示しており、図３の符号５はその真空処理装置１で成膜処理される基板を示している。基板５は、例えば、石英ガラスのような板状の絶縁基板である。
【００２３】
図２の符号１０はこの基板５を吸着するのに用いられる、本発明第一例の吸着装置を示している。
この吸着装置１０は、支持体１１と、接触部１７と、接着剤１６と、それぞれ複数本の第一、第二の電極部１５ａ、１５ｂとを有している。
【００２４】
支持体１１はアルミニウム等の金属材料が板状に形成された支持基板１２と、シリコーンゴムのような絶縁材料が膜状に形成された絶縁膜１３とを有しており、絶縁膜１３は支持基板１２の表面に配置されている。
【００２５】
第一、第二の電極部１５ａ、１５ｂは、絶縁膜１３の表面に配置された一定膜厚の銅薄膜がパターニングされて形成されており、第一、第二の電極部１５ａ、１５ｂは、図８に示した従来の吸着装置の電極と同様に、所定間隔を空けて交互に並べられている。
【００２６】
ここでは、膜厚１７μｍの銅箔がウェットエッチングによってパターニングされ、幅０．２ｍｍの細長の電極部１５ａ、１５ｂが、０．２ｍｍの間隔で形成されている。
【００２７】
接触部１７は上述した基板５と同じ石英ガラスがシート状に形成されて構成されている。支持体１１の電極部１５ａ、１５ｂが配置された面には接着剤１６が塗布されており、接触部１７は接着剤１６によって支持体１１に貼り合わされている。
【００２８】
ここでは、接着剤１６は第一、第二の電極部１５ａ、１５ｂ間の隙間を充填するように塗布されており、第一、第二の電極部１５ａ、１５ｂの表面には接着剤１６が付着していないので、接触部１７は第一、第二の電極部１５ａ、１５ｂの表面に密着している。また、この接着剤１６は絶縁性なので、第一、第二の電極部１５ａ、１５ｂは互いに絶縁されている。
【００２９】
真空処理装置１は真空槽２を有している。真空槽２内の底壁側には台９が配置されている。上述した吸着装置１０は、支持基板１２側の面が台９の表面に密着して配置され、接触部１７表面が真空槽２の天井側に向けられている。
真空槽２内の天井側にはターゲット３が配置されている。ターゲット３は板状に形成されたスパッタリング材料で構成され、その表面が接触部１７の表面に向けられている。
【００３０】
真空槽２に接続された真空排気系８によって真空槽２内に所定圧力の真空雰囲気を形成した後、その真空雰囲気を維持した状態で、上述した基板５を真空槽２内へ搬入する。この基板５の片面を接触面２２とし、該基板５を吸着装置１０に載せ、その接触面２２を接触部１７の表面に接触させる。
【００３１】
第一、第二の電極部１５ａ、１５ｂは真空槽２外に配置された静電チャック電源７に接続されており、静電チャック電源７を起動し、第一、第二の電極部１５ａ、１５ｂに正負の電圧をそれぞれ印加すると、静電吸着力によって基板５が吸着装置１０に吸着され、基板５の接触面２２が接触部１７表面に強く密着する。
【００３２】
台９の内部には、加熱手段であるヒータが設けられており、該ヒータによって台９は予め所定温度まで昇温し、熱伝導により静電吸着装置１０も昇温している。従って、吸着装置１０に密着した基板５も、熱伝導により昇温する。
【００３３】
吸着装置１０には不図示のセンサーが取り付けられており、このセンサーが基板５の温度を測定し、ヒータの通電量を制御することで基板５が温度制御される。
ターゲット３は真空槽２外に配置されたスパッタ電源６に接続されており、真空槽２内にアルゴンガス（Ａｒ）のようなスパッタガスを所定量導入しながら、真空槽２内の真空雰囲気を維持した状態で、スパッタ電源６を起動してターゲット３に直流電圧を印加すると、ターゲット３がスパッタされ、温度制御された基板５の表面に薄膜が成長する。
【００３４】
その薄膜が所定膜厚まで成長したところで、スパッタリングを停止して、成膜工程を終了する。
上述したように、接触部１７は基板５と同じ石英ガラスで構成されているので、吸着装置１０に基板５を吸着させた状態では、同じ物質同士が接触したことになる。
【００３５】
従って、接触部１７及び基板５の帯電量は小さいので、成膜終了後に、第一、第二の電極部１５ａ、１５ｂへの通電を停止すれば、基板５への吸着力が解除され、成膜後の基板５を吸着装置１０から容易に持ち上げることができる。
【００３６】
上述した吸着装置１０にガラス基板５を吸着させた後、電極部１５ａ、１５ｂへの通電を停止し、０秒〜６０秒後にガラス基板５を吸着装置１０から持ち上げた。基板５を吸着装置１０から持ち上げるときに、基板５を接触部１７の表面から離すのに要した力を測定し、その力を残留吸着力とした。
【００３７】
また、比較例として、接触部１７を構成する物質をシリコーンゴムに変えた以外は上記実施例と同じ構成の吸着装置を作製し、第一例の吸着装置１０と同じ条件で残留吸着力を測定した。
【００３８】
通電停止からの経過時間と、残留吸着力との関係を図４に示す。
図４の縦軸は残留吸着力（単位：ｇｆ／ｃｍ²）を、横軸は通電停止後からの経過時間（単位：秒）をそれぞれ示しており、符号Ｌ₁は本発明第一例の吸着装置１０の残留吸着力と経過時間との関係を示し、符号Ｌ₂は比較例の残留吸着力と経過時間との関係を示している。
【００３９】
図４から明かなように、本発明の吸着装置１０と、比較例の吸着装置は、通電中（経過時間０秒）の吸着力は略等しいが、本発明の吸着装置１０では、５秒後に２ｇｆ／ｃｍ²以下まで吸着力が下がったのに対し、比較例は５秒後の吸着力が約５ｇｆ／ｃｍ²と高く、６０秒後の吸着力も約４ｇｆ／ｃｍ²と高いままであった。
これらのことから、接触部１７を基板５と同じ物質で構成すれば、残留吸着力が低くなることが確認された。
【００４０】
以上は、接触部１７が電極部１５ａ、１５ｂ間に充填された接着剤１６で貼付された場合について説明したが、本発明はこれに限定されるものではなく、例えば、支持体１１の端部のみに接着剤を塗布し、該接着剤によって接触部１７を支持体１１に貼付することもできる。
【００４１】
以上は、シート状の接触部１７が支持体１１に貼付された場合について説明したが、本発明はこれに限定されるものではない。
図５の符号２０は本発明第二例の吸着装置を示している。この吸着装置２０は、支持体１１の表面に第一、第二の電極部１５ａ、１５ｂが配置されている点が第一例の吸着装置１０と同じであるが、第一例の吸着装置１０ではシート状の接触部１７が接着剤１６を介して貼付されているのに対し、この吸着装置２０は接着剤を有しておらず、接触部２７は支持体１１の電極部１５ａ、１５ｂが配置された面に直接形成されている。
【００４２】
具体的には、接触部２７はコーティングや蒸着等の成膜方法によって形成されており、第一、第二の電極部１５ａ、１５ｂの表面及び側面と、第一、第二の電極部１５ａ、１５ｂ間に位置する支持体１１表面はこの接触部２７によって覆われている。
この接触部２７も、吸着対象物である基板５と同じ物質で構成されているので、基板５と接触部２７との摩擦によって生じる帯電量は小さい。
【００４３】
以上は、電極部１５ａ、１５ｂの表面及び側面と、電極部１５ａ、１５ｂ間に位置する支持体１１の表面が接触部２７で覆われた場合について説明したが、本発明はこれに限定されるものではない。
図６の符号３０は、本発明第三例の吸着装置を示している。この吸着装置３０の接触部以外の構成は、上述した第二例の吸着装置２０と同じ構成であり、同じ部材には同じ符号を付して説明を省略する。
【００４４】
この吸着装置３０の接触部は上述した基板５と同じ物質で構成され、第一、第二の電極部１５ａ、１５ｂの表面のみにそれぞれ形成されている。図６の符号３７ａは第一の電極部１５ａ表面に形成された第一の接触部を示し、図６の符号３７ｂは第二の電極部１５ｂ表面に形成された第二の接触部を示している。
【００４５】
上述したように、第一、第二の電極部１５ａ、１５ｂは互いに所定間隔を空けて配置されているので、第一、第二の接触部３７ａ、３７ｂは互いに接触せず、第一、第二の接触部３７ａ、３７ｂを導電性材料で構成しても、第一、第二の電極部１５ａ、１５ｂが短絡することがない。
【００４６】
従って、第三例の吸着装置３０は、接触部３７ａ、３７ｂがガラスのような絶縁材料で構成された場合限定されず、例えば、接触部３７ａ、３７ｂをシリコンのような導電材料で構成し、接触部３７ａ、３７ｂと同じ導電材料が接触面に露出した基板を吸着することも可能である。
【００４７】
以上は、支持体１１が支持基板１２と絶縁膜１３で構成された場合について説明したが、本発明はこれに限定されるものではなく、アルミナやセラミックのような絶縁材料からなる単層基板や、支持基板に２層以上の膜や層が積層されたものを支持体１１として用いることができる。
【００４８】
また、接触部が絶縁材料で構成された場合、その絶縁材料はガラスに限定されるものではなく、例えば、ポリカーボネートや、ポリエチレンテレフタレート等種々の絶縁材料を用いることができる。
【００４９】
以上は、電極部１５ａ、１５ｂの表面が接触部１７で覆われた場合について説明したが、本発明はこれに限定されるものではない。図７の符号４０は本発明第四例の吸着装置を示している。
この吸着装置４０は、ガラス板のような絶縁板４１と、グラファイトのような導電材料で構成された電極部４５ａ、４５ｂとを有している。
【００５０】
絶縁板４１はその表面が膜厚方向に掘削されて複数の凹部４６が形成されており、絶縁板４１の表面に上述したような基板５を接触させると、凹部４６間に位置する凸部の先端部分が、上述したような基板５の接触面２２に接触するようになっている。
【００５１】
図７の符号４７は接触面２２と接触する接触部を示しており、絶縁板４１の残りの部分で支持体が構成されている。
電極部４５ａ、４５ｂは、凹部４６内の接触部４７よりも低い位置まで充填された導電材料で構成されており、電極部４５ａ、４５ｂを構成する導電材料は凹部４６の外には存しておらず、接触部４７の表面には、絶縁板４１を構成するガラスが露出している。
【００５２】
各凹部４６の平面形状は細長に形成されており、凹部４６は互いに所定間隔を空けて配置されている。即ち、凹部４６内に配置された電極部４５ａ、４５ｂは互いに所定間隔を空けて並べられており、電極部４５ａ、４５ｂの極性は交互に分けられ、それぞれ正負の電圧が印加されるように構成されている。
【００５３】
上述したように、接触部４７の表面にはガラスが露出しており、ガラスからなる基板５をこの吸着装置４０に載置し、該接触面を接触部４７に接触させると、同じ物質同士が接触したことになるので、摩擦による接触部４７の帯電量が非常に小さい。
【００５４】
以上は絶縁板４１がガラス板で構成された場合について説明したが、本発明はこれに限定されるものではなく、絶縁板としてポリカーボネート板や、ポリエチレンテレフタレート板を用いることができる。
【００５５】
以上は、第一例〜第四例の吸着装置を用い、接触部と同じ物質で構成された基板を吸着する場合について説明したが、本発明はこれに限定されず、接触面に接触部と同じ物質が露出しているものであれば、基板表面に薄膜が積層された積層体を吸着対象物として用いることもできる。
【００５６】
接触部に用いるガラスの種類は石英ガラスに限定されるものではなく、無アルカリガラス、青板ガラス等種々のガラスを用いることができる。この場合、接触部を構成するガラスと、接触面に露出するガラスの種類は同じであることが望ましい。
【００５７】
以上は、電極部が銅薄膜、又は、グラファイトで構成された場合について説明したが、電極部の構成材料は特に限定されるものではなく、アルミニウムのように銅以外の金属材料や、電荷移動錯体等の有機導電体も用いることができる。
【００５８】
以上は、電極部の極性を分ける場合について説明したが、本発明はこれに限定されるものではない。例えば、吸着装置がいずれか一方の極性の電極部のみを有する場合は、真空槽を他方の極性の電極部とし、吸着装置の電極部と真空槽に正負の電圧を印加すれば、接触部に接触させた基板を吸着することができる。
【００５９】
また、本発明の真空処理装置はスパッタリング装置に限定されるものではなく、真空槽内に本発明の第一例〜第四例の吸着装置を備えたものであれば、ＣＶＤ装置等の成膜装置や、あるいはエッチング装置及び吸着搬送装置等も本発明の真空処理装置には含まれる。
【００６０】
【発明の効果】
本発明の吸着装置の接触部は、基板の接触面に露出する物質と同じ物質で構成されているので、接触面を接触部に接触させると、摩擦によって接触部が帯電したとしても、その帯電量は非常に小さい。従って、電極部に通電を停止した後の残留吸着力が小さく、基板を接触部から離す作業が容易であり、また、吸着力の再現性も高い。
【図面の簡単な説明】
【図１】本発明の一実施形態の吸着装置を備えた真空処理装置の構成を説明する図
【図２】本発明の吸着装置の第一例を説明する断面図
【図３】本発明の吸着装置に吸着される基板を説明する断面図
【図４】残留吸着力と経過時間との関係を示すグラフ
【図５】本発明の第二例の吸着装置を説明する断面図
【図６】本発明の第三例の吸着装置を説明する断面図
【図７】本発明の第四例の吸着装置を説明する断面図
【図８】従来の吸着装置を説明する平面図
【図９】従来の吸着装置を説明する断面図
【符号の説明】
１……スパッタリング装置（真空処理装置） ５……基板 １０、２０、３０、４０……吸着装置 １１……支持体 １５ａ、１５ｂ、４５ａ、４５ｂ……電極部 １７、４７……接触部 ２２……接触面 ４１……絶縁板
４６……凹部[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electrostatic adsorption device, and more particularly to an electrostatic adsorption device that adsorbs a glass substrate or a plastic substrate.
[0002]
[Prior art]
8 and 9 indicates a suction device according to the prior art. The adsorption device 121 includes a support 125 in which an insulating material such as ceramic is formed in a plate shape, and first and second electrode portions 126 and 127 made of a conductive material such as graphite. Yes.
[0003]
A plan view of the first and second electrode portions 126, 127 is shown in FIG. The first and second electrode portions 126 and 127 are formed in an elongated shape, and are arranged on the surface of the support 125 in a state of being alternately arranged with a predetermined interval.
[0004]
One end of the first electrode portion 126 is connected to each of the elongated connection terminals 123 arranged perpendicular to the first electrode portion 126. As a result, all the first electrode portions 126 are connected to each other. ing. Similarly, the second electrode portion 127 is also connected to each other by an elongated connection terminal 124.
[0005]
9 corresponds to a cross-sectional view taken along the line XX of FIG. A surface of the support 125 on which the first and second electrode portions 126 and 127 are formed is formed of a film of an insulating material such as silicone rubber, and a contact portion 130 that contacts a substrate described later is formed. The surfaces and side surfaces of the first and second electrode portions 126 and 127 are covered with the contact portion 130.
[0006]
For example, in order to cause the suction device 121 to hold a glass substrate as an object to be suctioned, the suction device 121 and the glass substrate are placed in a vacuum atmosphere, and the glass substrate is placed on the surface of the contact portion 130 of the suction device 121 in the vacuum atmosphere. Make contact.
[0007]
The first and second electrode portions 126 and 127 are connected to the electrostatic chuck power source 122, respectively. The electrostatic chuck power source 122 is activated, and positive and negative with respect to the first and second electrode portions 126 and 127, respectively. When a voltage is applied, the glass substrate receives an electrostatic adsorption force in the direction of the surface of the adsorption device 121, the entire back surface of the glass substrate is adsorbed on the surface of the adsorption device 121, and as a result, the substrate is held by the adsorption device 121.
[0008]
Such a suction device 121 is widely used for holding and transporting a substrate in a process of forming a thin film or a device on the substrate.
By the way, when the glass substrate is brought into contact with the surface of the contact portion 130 or when the glass substrate is separated from the surface of the contact portion 130, friction is generated between the glass substrate and the contact portion 130, and the friction causes the contact portion 130 and the glass substrate. Is positively or negatively charged.
[0009]
In a state where the contact portion 130 and the glass substrate are charged, the adsorption force remains even after the voltage application to the electrode portions 126 and 127 is stopped, and it is difficult to separate the glass substrate from the adsorption device 121. If a new substrate is attracted while the contact portion 130 is charged, there is a problem that the reproducibility of the attracting force is low.
[0010]
[Problems to be solved by the invention]
The present invention was created to meet the above-mentioned demands of the prior art, and an object of the present invention is to provide an adsorption device that has high reproducibility of adsorption force and does not generate residual adsorption force.
[0011]
[Means for Solving the Problems]
The inventors focused on the contact portion of the adsorption device, and as a result of investigating the constituent material, produced a suction device by replacing the constituent material of the contact portion from silicone rubber to glass, and attached a glass substrate to the adsorption device. When adsorbed, it was found that the amount of charge at the contact portion was very small.
As an index that does not represent the property of the substance being charged by friction, a charging train as shown in Table 1 below is known.
[0012]
[Table 1]

[0013]
The charged column indicates a sequence of substances that are easily charged positively (+) and substances that are easily charged negatively (−). In Table 1, those that are easily charged positively (+) are shown on the upper side. Those that are easily charged negatively (−) are shown on the lower side.
[0014]
It is known that the amount of charge is small when rubbing materials close to each other on the charge train, and the amount of charge is large when rubbing materials distant from each other. In this case, it is conceivable that the charge amount becomes very small.
Therefore, if the portion of the adsorption device that contacts the substrate is made of the same material as the substrate, the charge amount of the adsorption device is estimated to be small.
[0015]
The invention according to claim 1 made on the basis of such knowledge includes an electrode part and a contact part, wherein one surface of the object to be adsorbed is used as a contact surface, and the contact surface is brought into contact with the contact part. The suction device is configured such that when the voltage is applied to the contact portion, the contact portion is made of the same kind of insulating material as the material exposed on the contact surface. Adsorber.
Invention of Claim 2 is the adsorption | suction apparatus of Claim 1, Comprising: The substance exposed to the said contact surface is an adsorption | suction apparatus which consists of any one kind of substance of a polycarbonate, a polyethylene terephthalate, and glass. is there.
The invention according to claim 3 includes a support, an electrode part, and a contact part, wherein one surface of the object to be adsorbed is a contact surface, the contact surface is brought into contact with the contact part, and a voltage is applied to the electrode part. When applied, the adsorption device is configured to adsorb the object to be adsorbed to the contact portion, and the support includes a support substrate in which a metal material is formed in a plate shape, and an insulating material in a film shape. An insulating film formed, the insulating film is disposed on the support substrate, the electrode portion is disposed on the insulating film, and the contact portion is formed of an insulating material formed in a sheet shape, The contact part is arranged so as to be in close contact with the surface of the electrode part, and the contact part is made of an insulating material of the same type as the substance exposed on the contact surface, and the adsorption object is in contact with the contact part. When a voltage is applied to the electrode part, the adsorption object is configured to be adsorbed. And a suction device.
According to a fourth aspect of the present invention, there is provided the adsorption device according to the third aspect, wherein the electrode portion is drawn on the support substrate, and the contact portion is formed by the adhesive disposed between the electrode portions. It is the adsorption device affixed to.
A fifth aspect of the present invention is the adsorption device according to any one of the third or fourth aspect, wherein the electrode portion is an adsorption device formed by patterning a copper thin film .
Invention of Claim 6 is the adsorption | suction apparatus of Claim 1 , Comprising: The insulating plate which consists of insulating materials , the recessed part formed in one surface of the said insulating plate, and the convex located between the said recessed parts of the said insulating plate part is the contact portion consists of a distal end portion of the electrode portion is disposed at a position lower than the contact portion of the recess, wherein the insulating plate includes a glass, a polycarbonate, of polyethylene terephthalate, any one It is an adsorption device composed of various types of substances.
Invention of Claim 7 has a vacuum vessel and the adsorption | suction apparatus of any one of Claim 1 thru | or 6, The said adsorption device is arrange | positioned in the said vacuum vessel, The said adsorption target object is A vacuum processing apparatus configured to be adsorbed by the adsorption apparatus in the vacuum chamber.
According to an eighth aspect of the present invention, a voltage is applied to the electrode of the adsorption device in a state where one surface of the adsorption object is a contact surface and the contact surface is in contact with the contact portion surface of the adsorption device, and the adsorption object This is an adsorption method in which an insulating material of the same type as that constituting the contact surface is exposed on the surface of the contact portion .
[0016]
The present invention is configured as described above, and in a vacuum processing apparatus, usually, the same type of adsorption object is sequentially adsorbed to the adsorption apparatus one by one, and processing such as film formation is performed in a vacuum chamber.
Therefore, since the substance exposed to the contact surface of the adsorption object is known in advance, the charge amount of the contact part can be suppressed by configuring the contact part with the same substance as that substance.
[0017]
The adsorption device incorporates a temperature control means such as a cooling means or a heating means, or a temperature control means is arranged in the vicinity of the adsorption device, and the adsorption object is adsorbed by the adsorption device, and is adsorbed by the temperature control means. If the apparatus is heated or cooled, the adsorption object can be efficiently heated or cooled.
[0018]
When the object to be adsorbed is a glass substrate and an ITO (indium tin oxide) thin film is formed on the surface thereof to produce a panel of a liquid crystal display device, or the object to be adsorbed is a polycarbonate substrate and has a metal on its surface When a recording medium such as a compact disk is formed by forming a thin film, an ITO thin film or a metal thin film is not formed on the back surface of the substrate, and the substrate itself is often exposed.
[0019]
Although the first invention has been described above, the second invention different from the first invention will be described below.
Conventionally, the support of the adsorption device is made of ceramic, and when the ceramic is fired, the size and shape of the support may be distorted. In the adsorption device of the second invention, the support is constituted by the support substrate made of the metal material and the insulating film, and since there is no firing step in its manufacture, there is no deviation in the size and shape of the support.
[0020]
In addition, if the adhesive is arranged so that the adhesive does not adhere to the surface of the electrode part, the contact part affixed to the support adheres closely to the surface of the electrode part, so the distance from the electrode part surface to the contact part surface Can be reduced.
[0021]
In the third invention of the present invention, the electrode portion is formed by disposing the conductive material in a position lower than the contact portion in the recess of the insulating plate in which the recess is formed.
When an adsorption object is placed on the adsorption device, the adsorption object comes into contact with the contact portion, but does not come into contact with the electrode portion, so that the adsorption object made of a conductive material can be adsorbed.
Further, when the object to be adsorbed with the insulating material exposed on the contact surface is adsorbed, if the insulating plate is made of the same material as the object to be adsorbed, the amount of charge due to friction is small.
[0022]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
Reference numeral 1 in FIG. 1 shows a sputtering apparatus which is a vacuum processing apparatus according to an embodiment of the present invention, and reference numeral 5 in FIG. 3 shows a substrate to be film-formed by the vacuum processing apparatus 1. The substrate 5 is a plate-like insulating substrate such as quartz glass, for example.
[0023]
Reference numeral 10 in FIG. 2 denotes a suction apparatus according to the first embodiment of the present invention, which is used to suck the substrate 5.
The adsorption device 10 includes a support 11, a contact portion 17, an adhesive 16, and a plurality of first and second electrode portions 15a and 15b, respectively.
[0024]
The support 11 includes a support substrate 12 in which a metal material such as aluminum is formed in a plate shape, and an insulating film 13 in which an insulating material such as silicone rubber is formed in a film shape. It is arranged on the surface of the substrate 12.
[0025]
The first and second electrode portions 15a and 15b are formed by patterning a copper thin film having a constant thickness disposed on the surface of the insulating film 13, and the first and second electrode portions 15a and 15b are Similar to the electrodes of the conventional adsorption device shown in FIG. 8, the electrodes are alternately arranged at predetermined intervals.
[0026]
Here, a copper foil having a thickness of 17 μm is patterned by wet etching, and elongated electrode portions 15a and 15b having a width of 0.2 mm are formed at intervals of 0.2 mm.
[0027]
The contact portion 17 is configured by forming the same quartz glass as the substrate 5 described above into a sheet shape. An adhesive 16 is applied to the surface of the support 11 on which the electrode portions 15 a and 15 b are arranged, and the contact portion 17 is bonded to the support 11 with the adhesive 16.
[0028]
Here, the adhesive 16 is applied so as to fill a gap between the first and second electrode portions 15a and 15b, and the adhesive 16 is applied to the surfaces of the first and second electrode portions 15a and 15b. Since they are not attached, the contact portion 17 is in close contact with the surfaces of the first and second electrode portions 15a and 15b. Since the adhesive 16 is insulative, the first and second electrode portions 15a and 15b are insulated from each other.
[0029]
The vacuum processing apparatus 1 has a vacuum chamber 2. A base 9 is disposed on the bottom wall side in the vacuum chamber 2. In the adsorption device 10 described above, the surface on the support substrate 12 side is disposed in close contact with the surface of the table 9, and the surface of the contact portion 17 is directed to the ceiling side of the vacuum chamber 2.
A target 3 is disposed on the ceiling side in the vacuum chamber 2. The target 3 is made of a sputtering material formed in a plate shape, and the surface thereof is directed to the surface of the contact portion 17.
[0030]
After a vacuum atmosphere of a predetermined pressure is formed in the vacuum chamber 2 by the evacuation system 8 connected to the vacuum chamber 2, the substrate 5 described above is carried into the vacuum chamber 2 while maintaining the vacuum atmosphere. One side of the substrate 5 is used as a contact surface 22, the substrate 5 is placed on the suction device 10, and the contact surface 22 is brought into contact with the surface of the contact portion 17.
[0031]
The first and second electrode portions 15a and 15b are connected to an electrostatic chuck power source 7 disposed outside the vacuum chamber 2, and the electrostatic chuck power source 7 is activated, and the first and second electrode portions 15a, 15b, When positive and negative voltages are respectively applied to 15b, the substrate 5 is attracted to the attracting device 10 by the electrostatic attraction force, and the contact surface 22 of the substrate 5 is strongly adhered to the surface of the contact portion 17.
[0032]
A heater, which is a heating means, is provided inside the table 9, and the table 9 is heated to a predetermined temperature in advance by the heater, and the electrostatic adsorption device 10 is also heated by heat conduction. Accordingly, the temperature of the substrate 5 that is in close contact with the adsorption device 10 is also increased by heat conduction.
[0033]
A sensor (not shown) is attached to the suction device 10, and the temperature of the substrate 5 is controlled by measuring the temperature of the substrate 5 and controlling the amount of current supplied to the heater.
The target 3 is connected to a sputtering power source 6 disposed outside the vacuum chamber 2, and the vacuum atmosphere in the vacuum chamber 2 is changed while introducing a predetermined amount of sputtering gas such as argon gas (Ar) into the vacuum chamber 2. When the sputtering power source 6 is started and a DC voltage is applied to the target 3 in the maintained state, the target 3 is sputtered and a thin film grows on the surface of the substrate 5 controlled in temperature.
[0034]
When the thin film has grown to a predetermined thickness, sputtering is stopped and the film forming process is terminated.
As described above, since the contact portion 17 is made of the same quartz glass as the substrate 5, the same substances are in contact with each other in a state where the substrate 5 is adsorbed by the adsorption device 10.
[0035]
Therefore, since the charge amounts of the contact portion 17 and the substrate 5 are small, if the energization to the first and second electrode portions 15a and 15b is stopped after the film formation is completed, the adsorption force to the substrate 5 is released, and the formation is completed. The substrate 5 after the film can be easily lifted from the adsorption device 10.
[0036]
After adsorbing the glass substrate 5 to the adsorption device 10 described above, energization to the electrode portions 15a and 15b was stopped, and the glass substrate 5 was lifted from the adsorption device 10 after 0 to 60 seconds. When the substrate 5 was lifted from the suction device 10, the force required to separate the substrate 5 from the surface of the contact portion 17 was measured, and this force was defined as the residual suction force.
[0037]
Further, as a comparative example, an adsorption device having the same configuration as that of the above example except that the material constituting the contact portion 17 is changed to silicone rubber is manufactured, and the residual adsorption force is measured under the same conditions as the adsorption device 10 of the first example. did.
[0038]
FIG. 4 shows the relationship between the elapsed time since the energization stop and the residual adsorption force.
The vertical axis in FIG. 4 indicates the residual adsorption force (unit: gf / cm ² ), and the horizontal axis indicates the elapsed time (unit: seconds) after the energization is stopped. Symbol L ₁ indicates the first example of the present invention. shows the relationship between the elapsed time and the residual suction force of the suction device 10, reference numeral L ₂ shows the relationship between the elapsed time and the residual adsorption force of the comparative example.
[0039]
As is clear from FIG. 4, the adsorption device 10 of the present invention and the adsorption device of the comparative example have substantially the same adsorption force during energization (elapsed time 0 seconds). 2 gf / cm ² while the suction force drops to below, Comparative example was as high as the suction force after 5 seconds to about 5 gf / cm ^2, the suction force after 60 seconds remained high and about 4 gf / cm ² .
From these facts, it was confirmed that if the contact portion 17 is made of the same material as the substrate 5, the residual adsorptive power is lowered.
[0040]
The above has described the case where the contact portion 17 is affixed with the adhesive 16 filled between the electrode portions 15a and 15b. However, the present invention is not limited to this, for example, the end portion of the support 11 It is also possible to apply an adhesive only to the adhesive and affix the contact portion 17 to the support 11 with the adhesive.
[0041]
Although the case where the sheet-like contact part 17 was affixed on the support body 11 was demonstrated above, this invention is not limited to this.
Reference numeral 20 in FIG. 5 represents a suction device according to a second example of the present invention. The adsorption device 20 is the same as the adsorption device 10 of the first example in that the first and second electrode portions 15a and 15b are arranged on the surface of the support 11, but the adsorption device 10 of the first example. Then, the sheet-like contact portion 17 is affixed via the adhesive 16, whereas the adsorption device 20 does not have an adhesive, and the contact portion 27 includes the electrode portions 15 a and 15 b of the support 11. It is directly formed on the arranged surface.
[0042]
Specifically, the contact portion 27 is formed by a film forming method such as coating or vapor deposition, and the surfaces and side surfaces of the first and second electrode portions 15a and 15b, the first and second electrode portions 15a, The surface of the support 11 located between 15b is covered with this contact portion 27.
Since the contact portion 27 is also made of the same material as the substrate 5 that is the object to be adsorbed, the amount of charge generated by friction between the substrate 5 and the contact portion 27 is small.
[0043]
The above has described the case where the surface and side surfaces of the electrode portions 15a and 15b and the surface of the support 11 positioned between the electrode portions 15a and 15b are covered with the contact portion 27, but the present invention is limited to this. It is not a thing.
The code | symbol 30 of FIG. 6 has shown the adsorption | suction apparatus of the 3rd example of this invention. The configuration other than the contact portion of the suction device 30 is the same as that of the suction device 20 of the second example described above, and the same members are denoted by the same reference numerals and description thereof is omitted.
[0044]
The contact portion of the adsorption device 30 is made of the same material as the substrate 5 described above, and is formed only on the surfaces of the first and second electrode portions 15a and 15b. Reference numeral 37a in FIG. 6 indicates a first contact portion formed on the surface of the first electrode portion 15a, and reference numeral 37b in FIG. 6 indicates a second contact portion formed on the surface of the second electrode portion 15b. Yes.
[0045]
As described above, since the first and second electrode portions 15a and 15b are arranged at a predetermined interval, the first and second contact portions 37a and 37b do not contact each other, and the first and second electrode portions 15a and 15b do not contact each other. Even if the second contact portions 37a and 37b are made of a conductive material, the first and second electrode portions 15a and 15b are not short-circuited.
[0046]
Therefore, the suction device 30 of the third example is not limited when the contact portions 37a and 37b are made of an insulating material such as glass. For example, the contact portions 37a and 37b are made of a conductive material such as silicon, It is also possible to adsorb the substrate exposed to the contact surface by the same conductive material as the contact portions 37a and 37b.
[0047]
The above is a description of the case where the support 11 is composed of the support substrate 12 and the insulating film 13, but the present invention is not limited to this, and a single-layer substrate made of an insulating material such as alumina or ceramic, A substrate in which two or more films or layers are laminated on a support substrate can be used as the support 11.
[0048]
Moreover, when a contact part is comprised with an insulating material, the insulating material is not limited to glass, For example, various insulating materials, such as a polycarbonate and a polyethylene terephthalate, can be used.
[0049]
Although the case where the surface of the electrode parts 15a and 15b was covered with the contact part 17 was demonstrated above, this invention is not limited to this. The code | symbol 40 of FIG. 7 has shown the adsorption | suction apparatus of the 4th example of this invention.
The adsorption device 40 includes an insulating plate 41 such as a glass plate and electrode portions 45a and 45b made of a conductive material such as graphite.
[0050]
The surface of the insulating plate 41 is excavated in the film thickness direction to form a plurality of concave portions 46. When the above-described substrate 5 is brought into contact with the surface of the insulating plate 41, the convex portions located between the concave portions 46 are formed. The tip portion comes into contact with the contact surface 22 of the substrate 5 as described above.
[0051]
Reference numeral 47 in FIG. 7 denotes a contact portion that comes into contact with the contact surface 22, and the remaining portion of the insulating plate 41 forms a support.
The electrode parts 45a and 45b are made of a conductive material filled to a position lower than the contact part 47 in the recess 46, and the conductive material constituting the electrode parts 45a and 45b exists outside the recess 46. In addition, the glass constituting the insulating plate 41 is exposed on the surface of the contact portion 47.
[0052]
The planar shape of each recess 46 is formed in an elongated shape, and the recesses 46 are arranged at a predetermined interval from each other. That is, the electrode portions 45a and 45b disposed in the recess 46 are arranged at a predetermined interval from each other, and the polarities of the electrode portions 45a and 45b are alternately divided so that positive and negative voltages are applied respectively. Has been.
[0053]
As described above, glass is exposed on the surface of the contact portion 47, and when the substrate 5 made of glass is placed on the adsorption device 40 and the contact surface is brought into contact with the contact portion 47, the same substances are brought together. Since the contact is made, the amount of charge of the contact portion 47 due to friction is very small.
[0054]
The case where the insulating plate 41 is made of a glass plate has been described above. However, the present invention is not limited to this, and a polycarbonate plate or a polyethylene terephthalate plate can be used as the insulating plate.
[0055]
The above describes the case where the adsorption device of the first to fourth examples is used to adsorb a substrate made of the same material as the contact portion, but the present invention is not limited to this, and the contact surface includes the contact portion and the contact portion. As long as the same substance is exposed, a laminated body in which a thin film is laminated on the substrate surface can be used as an object to be adsorbed.
[0056]
The kind of glass used for the contact portion is not limited to quartz glass, and various glasses such as alkali-free glass and blue plate glass can be used. In this case, it is desirable that the glass constituting the contact portion and the glass exposed on the contact surface are the same.
[0057]
The above is a case where the electrode portion is made of a copper thin film or graphite. However, the constituent material of the electrode portion is not particularly limited, and a metal material other than copper, such as aluminum, or a charge transfer complex. Organic conductors such as these can also be used.
[0058]
The case where the polarities of the electrode portions are divided has been described above, but the present invention is not limited to this. For example, if the adsorption device has only one of the polar electrode parts, if the vacuum chamber is the other polar electrode part and positive and negative voltages are applied to the electrode unit and vacuum tank of the adsorption device, the contact part The contacted substrate can be adsorbed.
[0059]
Further, the vacuum processing apparatus of the present invention is not limited to the sputtering apparatus, and if the first to fourth examples of the adsorption apparatus of the present invention are provided in a vacuum chamber, film formation such as a CVD apparatus is performed. The vacuum processing apparatus of the present invention also includes an apparatus, an etching apparatus, an adsorption transfer apparatus, and the like.
[0060]
【The invention's effect】
Since the contact portion of the adsorption device of the present invention is made of the same material as the material exposed on the contact surface of the substrate, if the contact surface is brought into contact with the contact portion, even if the contact portion is charged by friction, the contact portion is charged. The amount is very small. Therefore, the residual adsorption force after energization of the electrode portion is small, the work of separating the substrate from the contact portion is easy, and the reproducibility of the adsorption force is high.
[Brief description of the drawings]
FIG. 1 is a diagram illustrating a configuration of a vacuum processing apparatus including an adsorption device according to an embodiment of the present invention. FIG. 2 is a cross-sectional view illustrating a first example of the adsorption device of the present invention. FIG. 4 is a cross-sectional view illustrating a substrate adsorbed by the adsorbing device. FIG. 4 is a graph showing the relationship between the residual adsorbing force and elapsed time. FIG. 5 is a cross-sectional view illustrating the adsorbing device of the second example of the present invention. FIG. 7 is a cross-sectional view illustrating a suction device according to a fourth example of the present invention. FIG. 8 is a cross-sectional view illustrating a suction device according to a fourth example of the present invention. Sectional view explaining the adsorption device
DESCRIPTION OF SYMBOLS 1 ... Sputtering apparatus (vacuum processing apparatus) 5 ... Substrate 10, 20, 30, 40 ... Adsorption apparatus 11 ... Support 15a, 15b, 45a, 45b ... Electrode part 17, 47 ... Contact part 22 ... ... Contact surface 41 ... Insulating plate 46 ... Recess

Claims (8)

An electrode portion and a contact portion;
An adsorption device configured such that when one surface of the adsorption object is a contact surface, the contact surface is brought into contact with the contact portion, and a voltage is applied to the electrode portion, the adsorption object is adsorbed by the contact portion. There,
The contact portion is an adsorption device made of an insulating material of the same type as the material exposed on the contact surface.   The adsorption device according to claim 1, wherein the substance exposed to the contact surface is made of any one of polycarbonate, polyethylene terephthalate, and glass. A support, an electrode part, and a contact part, where one surface of the adsorption object is a contact surface, the contact surface is brought into contact with the contact part, and a voltage is applied to the electrode part, the adsorption object is An adsorption device configured to be adsorbed to the contact portion,
The support includes a support substrate in which a metal material is formed in a plate shape, and an insulating film in which an insulating material is formed in a film shape, and the insulating film is disposed on the support substrate,
The electrode portion is disposed on the insulating film,
The contact portion is made of an insulating material formed in a sheet shape, and is arranged so as to be in close contact with the surface of the electrode portion,
The contact portion is made of the same type of insulating material as the material exposed on the contact surface,
An adsorption device configured to adsorb the adsorption object when a voltage is applied to the electrode part in a state where the adsorption object is in contact with the contact part.   The adsorption device according to claim 3, wherein the electrode part is routed on the support substrate, and the contact part is attached to the support by an adhesive disposed between the electrode parts. The adsorption device according to claim 3 , wherein the electrode portion is formed by patterning a copper thin film . An insulating plate made of an insulating material ;
A recess formed on one surface of the insulating plate ;
Wherein the contact portion at the tip portion of the protrusion located between the concave portion of the insulating plate is composed,
The electrode part is disposed at a position lower than the contact part in the recess ,
The adsorption device according to claim 1 , wherein the insulating plate is made of any one of glass, polycarbonate, and polyethylene terephthalate. It has a vacuum vessel and the adsorption device according to any one of claims 1 to 6, the adsorption device is arranged in the vacuum vessel, and the adsorption object is the adsorption device in the vacuum vessel. A vacuum processing apparatus configured to be adsorbed on the surface. An adsorption method for adsorbing the adsorption object by applying a voltage to an electrode of the adsorption device in a state where one surface of the adsorption object is a contact surface and the contact surface is in contact with the contact portion surface of the adsorption device. ,
An adsorption method in which an insulating material of the same type as the material constituting the contact surface is exposed on the surface of the contact portion .

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