JP4001492B2 - Progressive punching die and progressive punching device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a progressive punching die and a progressive punching device, and in particular, CSP (Chip Size Package), BGA (Ball Grid Array), μ-BGA (μ-Ball Grid) used for mounting electronic components. Sequential punch for use in the manufacture of electronic component mounting film carrier tapes (hereinafter simply referred to as “electronic component mounting film carrier tape”) such as Array), TAB (Tape Automated Bonding), COF (Chip On Film), etc. The present invention relates to a die and a progressive punching device.
[0002]
[Prior art]
With the development of the electronics industry, the demand for printed wiring boards for mounting electronic components such as ICs (integrated circuits) and LSIs (large scale integrated circuits) has increased rapidly. High functionality is demanded, and recently, a mounting method using a TAB tape, a COF tape, a T-BGA tape, an ASIC tape, or the like has been adopted as a method for mounting these electronic components. In particular, as electronic devices become lighter, thinner and smaller, electronic components are mounted at a higher density, and in order to improve the reliability of the electronic components, a board having a size substantially corresponding to the size of the electronic components to be mounted is used. The frequency of use of, for example, CSP, BGA, μ-BGA, etc., in which external connection terminals are arranged almost on the entire surface, is increasing.
[0003]
This electronic component mounting film carrier tape is formed on an insulating film made of polyimide, for example, a sprocket hole for transportation, a grid-shaped punching hole composed of a plurality of round holes for mounting solder balls or metal bumps, or bonding. After forming punching holes such as device holes for use, a wiring pattern is formed by patterning the copper foil provided on the surface of the insulating film while transporting the insulating film using sprocket holes, and then necessary Accordingly, it is manufactured through a process of forming a solder resist layer on the wiring pattern.
[0004]
Also, in film carrier tapes for mounting electronic parts such as BGA tapes, after forming a grid-like punching hole by punching an insulating film, metal bumps, solder balls, etc. are mounted in the grid-like punching hole. By doing so, the wiring pattern and the electronic component are connected.
[0005]
In manufacturing such electronic component mounting film carrier tape, when various punched holes are formed in the insulating film, a progressive punching die is used in which the insulating film is intermittently forwarded and punched. For example, when manufacturing a film carrier tape for mounting electronic components such as CSP, BGA, μ-BGA, etc., this progressive punching die is used after punching all the sprocket holes upstream in the transport direction of the insulating film. In the state where the positioning pin is inserted into the sprocket hole and positioned on the downstream side, for example, a grid-like punching hole for mounting a solder ball, a metal bump or the like is punched.
[0006]
Such a progressive punching die is provided with a stripper plate between the punch holder and the lower die plate, and is formed in an insulating film before punching a punching hole with a punching pin fixed to the punch holder. The entire surface other than the holes is sandwiched between the stripper plate and the lower die plate, and the insulating film is positioned and fixed on the lower die plate by the stripper plate.
[0007]
Further, the punch holder is provided with a guide member projecting toward the lower die plate side, and this guide member is slidably fitted in a guide hole provided in the lower die plate, thereby The movement in the vertical direction is restricted.
[0008]
[Problems to be solved by the invention]
However, in the conventional progressive punching die, all the sprocket holes are punched on the upstream side in the conveyance direction of the insulating film and a predetermined number of lattice-like punching holes are formed on the downstream side. The punching load applied to the insulating film is larger than the above. For this reason, at the time of punching, the resistance force received by the punching pin on the downstream side becomes larger than that on the upstream side, and the punch holder is slightly inclined. Thereby, the engagement between the guide member of the punch holder and the guide hole of the lower die plate is deteriorated, and the punching pin enters the oblique direction with respect to the insulating film that is sequentially fed to the predetermined position of the lower die plate. There is a problem that burrs or the like are generated at the opening edges of the sprocket holes and the grid-like punching holes.
[0009]
In addition, when positioning the insulating film by inserting a positioning pin into the sprocket hole punched on the upstream side, the positioning pin comes into contact with the peripheral portion of the sprocket hole, for example, at the contact portion. , Cracks, and bites will occur. This makes it difficult to position the insulating film at a predetermined position, and thus there is a problem that a punched hole cannot be formed at a predetermined position of the insulating film.
[0010]
Further, when the strength of the lower die plate is weak at the time of pressing, there is a problem that the lower die plate is distorted and deformed.
[0011]
A protective film made of a polymer material such as polyethylene terephthalate (PET), for example, on the back surface of the insulating film in order to ensure the transport strength of the relatively thin insulating film due to distortion deformation generated in the lower die plate Etc. are adhered with an adhesive, there is a possibility that foreign matters such as a protective film peeled off from the punched residue at the time of punching may be scattered on the insulating film. When the foreign matter scattered on the insulating film is sandwiched together with the insulating film by the stripper plate, there is a problem that, for example, a dent or a scratch is generated on the insulating film where the foreign matter is scattered.
[0012]
If, for example, a wiring pattern or the like is formed while conveying the insulating film in which such a problem has occurred, a defective formation of the wiring pattern or the like occurs, resulting in a defective product, which becomes a serious problem.
[0013]
In view of such circumstances, an object of the present invention is to provide a progressive punching die and a progressive punching device that can reliably form a predetermined punching hole by preventing the punch holder from being inclined.
[0014]
[Means for Solving the Problems]
The first aspect of the present invention for solving the above-mentioned problems is to support an insulating film for a film carrier tape and to have a lower die plate having a recess for forming a punching hole, and sandwich the insulating film between the lower die plate. And a punch holder having a punching pin at a position facing the recess for forming the punching hole and punching the punching pin into the insulating film through the stripper plate to form a punching hole. In the progressive punching die for forming punching holes while intermittently feeding the film intermittently from the upstream side to the downstream side in the transport direction, the punch holders are arranged from the upstream side in the transport direction to the downstream side. Integral holding a punch pin that simultaneously forms punch holes in the insulating film in at least three regions arranged The punching load in the central region is relatively large compared to the sum of the punching loads in the upstream and downstream regions of the three regions, and the punching load between the upstream side and the downstream side is relatively large. A progressive punching die characterized by being set to be substantially equal.
[0015]
In the first aspect, the punching holder is prevented from tilting by making the punching loads in the upstream and downstream regions substantially equal, and the predetermined punching hole is reliably formed without causing damage to the insulating film. be able to.
[0016]
According to a second aspect of the present invention, in the first aspect, the punching pin held by the punch holder is punched into 100 or more holes in a wiring region disposed between the sprocket holes of the insulating film in the central region. The present invention provides a progressive punching die characterized by forming holes at a time.
[0017]
According to the second aspect, it is possible to prevent the punching load applied to the punch holder from the upstream side to the downstream side, and to efficiently form many punching holes.
[0018]
According to a third aspect of the present invention, in the first or second aspect, the punching pin held by the punch holder forms approximately half of the total number of sprocket holes in the upstream region in the transport direction of the insulating film; A progressive punching die is characterized in that a remaining sprocket hole is formed in a downstream region and a lattice-shaped punching hole is formed in the central region.
[0019]
In the third aspect, most of the punching load is generated in the central region, and the punching loads in the upstream and downstream regions are substantially equal, so that the punch holder is prevented from tilting.
[0020]
According to a fourth aspect of the present invention, in the third aspect, the stripper plate corresponding to at least the downstream region is provided to face the insulating film including a portion that forms the remaining sprocket hole. A progressive punching die comprising a pressing portion that comes into contact with the insulating film and a concave portion that is provided in a portion other than the pressing portion and does not substantially come into contact with the insulating film.
[0021]
In the fourth aspect, damage to the surface of the insulating film due to contact with the stripper plate is effectively prevented.
[0022]
According to a fifth aspect of the present invention, in any one of the first to fourth aspects, the guide member protruding from the punch holder is slidably fitted into a guide hole provided in the lower die plate. The movement of the punching pin is restricted by the above, and the clearance between the outer peripheral surface of the guide member and the inner peripheral surface of the guide hole is 2 μm or less.
[0023]
In the fifth aspect, the sliding accuracy of the guide member at the time of punching can be improved, and the tilt of the punch holder is prevented.
[0024]
According to a sixth aspect of the present invention, in any one of the first to fifth aspects, the lower die plate is formed of at least one selected from the group consisting of high-speed steel and cemented carbide. It is in the punching die for progressive.
[0025]
In the sixth aspect, distortion of the lower die plate is prevented from being deformed, and damage to the insulating film due to distortion of the lower die plate is prevented.
[0026]
According to a seventh aspect of the present invention, there is provided the progressive die according to the sixth aspect, wherein the thickness of the lower die plate is 25 mm or more.
[0027]
In the seventh aspect, the deformation of the lower die plate is effectively prevented from occurring, and the insulating film is prevented from being damaged by the deformation of the lower die plate.
[0028]
According to an eighth aspect of the present invention, there is provided a progressive punching apparatus including the progressive punching die according to any one of the first to seventh aspects.
[0029]
In the eighth aspect, the punching holder is prevented from tilting by making the punching loads in the upstream and downstream regions substantially equal, and the predetermined punching hole is surely formed without causing damage to the insulating film. be able to.
[0030]
The present invention relates to a film carrier tape having a grid-like punching hole having a large punching load, such as a BGA tape, which could not be punched satisfactorily with a conventional progressive punching die. By arranging the portion for forming a grid-like punching hole having a large punching load in the central region, the predetermined number of punching holes can be punched with high quality. It is.
[0031]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the punching die and punching device of the present invention will be described in detail.
[0032]
(Embodiment 1)
FIG. 1 is a partial cross-sectional view of a progressive punching apparatus according to Embodiment 1 of the present invention.
[0033]
As shown in FIG. 1, a progressive punching apparatus 10 includes a progressive punching die 30 that forms a predetermined number of punched holes in an insulating film 20 that is intermittently forwarded, and a delivery roller that feeds the insulating film 20. 11, a take-up roller 12 that winds up an insulating film 20 in which a predetermined number of punched holes are formed and subjected to a predetermined treatment as needed, and is provided on the downstream side of the progressive punching die 30 for insulation. And a forward feed mechanism 13 for feeding the film 20 forward.
[0034]
In the present embodiment, as the predetermined number of punched holes, for example, a sprocket hole for transporting the insulating film, a grid-like punched hole composed of a plurality of round holes for mounting solder balls or metal bumps, and the like are formed. I did it.
[0035]
The progressive die 30 for forming such a punching hole includes an upstream stage portion 30A, a central stage portion 30B, and a downstream stage portion 30C in the transport direction of the insulating film 20.
[0036]
Further, in the present embodiment, the region of the stage portion 30A becomes the first region 70 that forms sprocket holes on both sides in the width direction of the insulating film 20, and the region of the stage portion 30B forms a plurality of lattice-shaped punching holes. And the region of the stage portion 30 </ b> C becomes the third region 72 that forms a sprocket hole in the substantially central portion of the insulating film 20.
[0037]
Furthermore, the progressive mechanism 13 is not particularly limited as long as the insulating film 20 is intermittently forwarded, that is, can be sequentially transported to stop after the insulating film 20 is fed by a certain amount. The thing using a gear, a roller, etc. can be mentioned.
[0038]
In addition, as the insulating film 20, a material having flexibility and chemical resistance and heat resistance can be used. Examples of the material for the insulating film 20 include polyester, polyamide, polyimide, and the like. Particularly, a wholly aromatic polyimide having a biphenyl skeleton (for example, trade name: Upilex; Ube Industries, Ltd.) is preferable. The thickness of the insulating film 20 is generally 25 to 125 μm, preferably 25 to 75 μm. In this embodiment, a polyimide film having a width of 96 mm and a thickness of 75 μm is used.
[0039]
Moreover, although not shown in figure, the conveyance strength of an insulating film is ensured on the back surface of the comparatively thin insulating film used for manufacture of film carrier tapes, such as CSP, BGA, micro-BGA, and COF, for example. Therefore, a protective film made of a polymer material such as polyethylene terephthalate (PET) may be attached.
[0040]
Here, a process of forming a predetermined number of punched holes 22 in the insulating film 20 will be described in detail. FIG. 2 is a schematic plan view of an insulating film in which punched holes are formed.
[0041]
As shown in FIG. 2, a predetermined number of punching holes 22 are respectively formed in the insulating film 20 by a progressive punching die 30. For example, in the present embodiment, the insulating film 20 has two rows of regions to be electronic component mounting film carrier tapes arranged in the longitudinal direction, and the insulating film 20 is insulated at both sides in the width direction and substantially at the center. Sprocket holes 23a and 23b used for transporting the film 20 are respectively formed, and two rows of lattice-shaped punching holes 24 are formed in each portion of the insulating film 20 sandwiched between the sprocket holes 23a and 23b.
[0042]
A process of forming such sprocket holes 23a and 23b and lattice-like punching holes 24 in the insulating film 20 will be described with reference to FIG. FIG. 3 is a schematic diagram illustrating a process of forming a punching hole by the progressive punching apparatus according to the first embodiment of the present invention.
[0043]
First, as shown in FIG. 3, tape guides 80 are attached to both sides in the width direction of the insulating film 20, and the insulating film 20 is forwardly fed along the tape guide 80 by the above-described forward feed mechanism 13. A predetermined portion 21 forming a predetermined number of punched holes 22 in the film 20 is conveyed to the first region 70. Thereafter, for example, seven sprocket holes 23a are formed in the first region 70 on both sides in the width direction of the insulating film 20 in the longitudinal direction.
[0044]
Next, the predetermined portion 21 of the insulating film 20 is conveyed to the second region 71, and then the insulating film 20 is positioned at a predetermined position by the sprocket hole 23 a punched out in the first region 70 and the first region 70. The lattice-like punching holes 24 are formed at eight places at once between the sprocket holes 23a punched in step (b).
[0045]
The positioning of the insulating film 20 in the second region 71 may be performed at a predetermined location in the sprocket hole 23a punched out in the first region 70, for example, one of the seven on one side of the sprocket hole 23a. This may be done at three places, and a total of six sprocket holes 23a on both sides. Of course, positioning may be performed with all the sprocket holes 23a punched out in the first region 70, and there is no particular limitation as long as the insulating film 20 can be reliably positioned at a predetermined position.
[0046]
Subsequently, the predetermined portion 21 of the insulating film 20 is conveyed to the third region 72. Thereafter, a sprocket hole 23 b is formed in a substantially central portion of the insulating film 20. In the third region 72, the same number of sprocket holes 23b as the sprocket holes 23a formed in the first region 70 are formed.
[0047]
In the third region 72, similarly to the second region 71, positioning may be performed using the sprocket holes 23 a on both sides in the width direction of the insulating film 20. In any case, using the sprocket hole 23a punched in the first region 70, the insulating film 20 is placed at a predetermined position in at least one of the second region 71 and the third region 72 following the first region 70. What is necessary is just to perform positioning.
[0048]
Thus, if attention is paid to the predetermined portion 21 of the insulating film 20, the punching holes are sequentially formed in the three regions 70 to 72 of the progressive punching die 30, and the entire punching pattern is formed. Considering 20 as a whole, punching is simultaneously performed in the first to third regions 70 to 72. And the sprocket hole 23 and the grid | lattice-like punching hole 24 are continuously formed by repeating the operation | movement mentioned above using the progressive punching apparatus 10 of this embodiment, conveying the insulating film 20 sequentially. At this time, in the present embodiment, since the second and subsequent positioning is performed based on the sprocket hole 23a in which the insulating film 20 is first punched at least in one of the second region 71 and the third region 72, the insulating film A predetermined number of punching holes 22 are accurately punched in the predetermined portion 21 of 20.
[0049]
As described above, in the progressive punching die 30 of the present embodiment, three regions for forming predetermined punching holes are arranged, and for example, lattice-like punching holes 24 for a BGA tape are provided in the first to third punching holes. The second region 71 in the center of the regions 70 to 72 is punched out. On the other hand, the remaining punching holes other than the grid-like punching holes 24, for example, the sprocket holes 23, are divided into the first and third regions 70 and 72 by half.
[0050]
Note that the number of remaining punch holes formed in the first region 70 and the third region 72 is not limited to the above-described one as long as the punch loads in both regions are set to be substantially the same. Alternatively, about 30 to 70% of the total number of remaining punched holes may be punched in the first region 70, and the remaining number may be punched in the third region 72.
[0051]
Thus, in the progressive punching die 30 of the present embodiment, the punch holder is provided by arranging the portion with a large punching load in the center and distributing the portion with a small punching load approximately equally to the upstream side and the downstream side. Can be reliably prevented from tilting, and the progressive punching die 30 can be reliably meshed with each other, so that the insulating film 20 can be prevented from being damaged and the predetermined number of punching holes 22 can be reliably formed. it can.
[0052]
With such a configuration, in the second region 71, for example, 100 or more round holes can be punched at a time, whereby a plurality of grid-like punching holes 24 can be formed with high quality. Can be formed. Of course, in the present embodiment, according to the pattern layout of one grid-like punching hole 24, for example, 2000 or more round holes can be punched in the second region 71 at a time.
[0053]
Here, the progressive punching die constituting the progressive punching device described above will be described in detail with reference to FIG. 4 is a cross-sectional view taken along the arrow in FIG. 3, where (a) is a cross-sectional view taken along the line AA ′, (b) is a cross-sectional view taken along the line BB ′, and (c) is a cross-sectional view taken along the line CC ′. is there.
[0054]
As shown in FIG. 4, the progressive die 30 according to the present embodiment sandwiches the insulating film 20 between the lower die plate 31 and the lower die plate 31 that support the insulating film 20 for the film carrier tape. And a punch holder 33 having a punching pin 38a for forming a punching hole in the insulating film 20 through the stripper plate 32, and the insulating film 20 is arranged side by side from the upstream side in the transport direction to the downstream side. A predetermined number of punched holes 22 are formed in the insulating film 20 while being intermittently fed to the first to third regions 70 to 72.
[0055]
The punch holder 33 is an integral one that holds punching pins 38 a that simultaneously form punching holes in the insulating film 20 in the first to third regions 70 to 72, and is supported by the lower die plate 31. It is provided so as to be movable in the vertical direction. In the present embodiment, a single plate is used as the punch holder 33.
[0056]
Further, a stripper plate 32 that sandwiches the insulating film 20 between the punch holder 33 and the lower die plate 31 is connected by a connecting pin 34 (see FIG. 1). That is, the stripper plate 32 is connected to the lower side of the punch holder 33 by the connecting pins 34 at a predetermined interval. When the punch holder 33 moves downward, the stripper plate 32 also moves downward at the same time. When the stripper plate 32 contacts the insulating film 20 on the lower die plate 31, the distance between the punch holder 33 and the stripper plate 32 gradually increases. It gets smaller.
[0057]
On the other hand, a guide member 35 projects from the punch holder 33 toward the lower die plate 31, and the guide member 35 is slidably fitted into a guide hole 36 provided in the lower die plate 31. The movement of the punch holder 33 is restricted (see FIG. 1).
[0058]
Further, a friction-resistant bush 37 is provided on the inner surface of the guide hole 36, and the vertical movement of the punch holder 33 is restricted by sliding the bush 37 and the guide member 35 in sliding contact with each other.
[0059]
The clearance between the outer peripheral surface of the guide member 35 and the inner peripheral surface of the guide hole 36 is 4 μm or less in order to improve the sliding accuracy between the guide member 35 and the guide hole 36 when forming the punched hole. Preferably there is. In this embodiment, the thickness is 2 μm or less.
[0060]
Further, as a material for forming the lower die plate 31, for example, high-speed steel (JIS standard; SKH51), cemented carbide (Cemented Carbide Tool Association Standard (CIS); V30), and the outer surface of high-speed steel are coated with cemented carbide. The metal material etc. which were made can be mentioned. Moreover, in order to ensure the desired intensity | strength of the lower die plate 31, it is preferable that it is a thickness of 25 mm or more. In this way, the lower die plate 31 can be prevented from being deformed by distortion by securing the strength by making the material forming the lower die plate 31 friction resistant and high in hardness. Further, by forming the lower die plate 31 with a material having friction resistance and high strength, for example, a plurality of grid-like punching holes 24 constituted by 300 or more round holes can be reliably punched in the second region 71. Can be removed.
[0061]
Further, at the time of pressing, the surface of the lower die plate 31 on the side that supports the insulating film 20, in particular, the opening peripheral edge of the punching pin recess 40 a and the positioning pin recess 43 of the lower die plate 31 to be described later, Since slight damage such as chipping may occur, such a damaged portion is generally formed on the surface of the lower die plate 31 that supports the insulating film 20 at a certain number of times of punching, for example, 50,000. Polishing every shot.
[0062]
In this embodiment, since the lower die plate 31 is formed of a material having friction resistance and high hardness, damage generated in the lower die plate 31 can be reduced, and therefore the insulating film 20 of the lower die plate 31 is supported. A polishing cycle for polishing the surface on the side can be set large. For example, in this embodiment, the lower die plate 31 can be polished in a large polishing cycle of every 400,000 shots.
[0063]
Here, the 1st-3rd area | regions 70, 71, and 72 of this punching die 30 for progressive feeding are demonstrated in detail.
[0064]
As shown in FIG. 4A, the first region 70 of the punch holder 33 is punched to form sprocket holes 23a on both sides in the width direction of the insulating film 20 supported by the lower die plate 31 via the stripper plate 32. The pin 38a is fixed.
[0065]
Further, the first region 70 of the stripper plate 32 is provided with a punching pin insertion hole 39a at a position facing the punching pin 38a, and the first region 70 of the lower die plate 31 is punched to receive the punching pin 38a. A hole forming recess 40a is provided.
[0066]
Furthermore, in the second region 71 of the punch holder 33, as shown in FIG. 4B, the insulating film 20 is inserted into the sprocket hole 23a punched out in the first region 70 through the stripper plate 32. A positioning pin 41 for positioning at a position, and a punching pin 38b for forming a grid-like punching hole 24 between the sprocket holes 23a punched in the first region 70 of the insulating film 20 positioned by the positioning pin 41. It is fixed. The grid-like punched holes 24 are used for connecting, for example, solder balls, metal bumps, etc., and connecting electronic components such as semiconductor ICs and wiring patterns to be mounted.
[0067]
The second region 71 of the stripper plate 32 is provided with a punching pin insertion hole 39b into which the punching pin 38b is inserted and a positioning pin insertion hole 42 into which the positioning pin 41 is inserted.
[0068]
Further, in the second region 71 of the lower die plate 31, a punching hole forming recess 40b that receives the punching pin 38b that has passed through the punching pin insertion hole 39b of the stripper plate 32 and a positioning pin insertion hole 42 of the stripper plate 32 are provided. A positioning pin recess 43 for receiving the passing positioning pin 41 is provided.
[0069]
In such a second region 71, when the punch holder 33 is moved downward together with the stripper plate 32, the positioning pin 41 fixed to the punch holder 33 is inserted into the sprocket hole 23a of the insulating film 20, and the insulating film 20 is predetermined. A predetermined portion of the insulating film 20 positioned at the position and held in this state is sandwiched between the lower die plate 31 and the stripper plate 32 and positioned by the punching pin 38b through the punching pin insertion hole 39b. A grid-like punching hole 24 is punched into the plate.
[0070]
Further, in the third region 72 of the punch holder 33, a punching pin 38a for forming the same number of sprocket holes 23b as the sprocket holes 23a punched in the first region 70 is provided in a substantially central portion of the insulating film 20. Yes.
[0071]
Similar to the first region, the stripper plate 32 and the lower die plate 31 are provided with punching pin insertion holes 39b and punching hole forming recesses 40a corresponding to the punching pins 38a.
[0072]
Further, as shown in FIG. 4C, the third region 72 of the stripper plate 32 is provided so as to face the insulating film 20 including the portion for forming the sprocket hole 23 b and is in contact with the insulating film 20. A presser portion 50 and a concave portion 51 that is provided at a portion other than the presser portion 50 and that does not substantially contact the insulating film 20 are provided.
[0073]
When the sprocket hole 23b is formed in the third region 72, the presser portion 50 is for pressing the insulating film 20 in a portion where the sprocket hole 23b is formed.
[0074]
On the other hand, the recess 51 prevents the stripper punching hole 24 formed in the insulating film 20 in the second region 72 from being sandwiched by the stripper plate 32. In addition, the depth of such a recessed part 51 is 200-1000 micrometers, for example, Preferably, it is 500-800 micrometers.
[0075]
Thereby, since the peripheral part of the part which punches the insulating film 20 can be clamped by the pressing part 50, the sprocket hole 23b can be formed with high quality without generating a burr or the like.
[0076]
On the other hand, the stripper plate 32 in the portion where the recess 51 is provided does not substantially abut against the insulating film 20, so that the stripper plate 32 is generated at the peripheral edge of the grid-like punching hole 24 by the contact between the insulating film 20 and the stripper plate 32. For example, dents, scratches and the like can be reliably prevented.
[0077]
In addition, you may make it provide such a pressing part 50 and the recessed part 51 in the 1st area | region 70 of the stripper plate 32. FIG. That is, the pressing portion 50 is provided in a portion facing the insulating film 20 including the portion where the sprocket hole 23 a is formed in the first region 70 of the stripper plate 32, and the recess 51 is provided in the stripper plate 32 other than the pressing portion 50. It may be. Thereby, the damage which generate | occur | produces when the stripper plate 32 contacts the part which forms the grid | lattice-like punching hole 24 in the 2nd area | region 71 can be prevented.
[0078]
As described above, the progressive punching die 30 of the present embodiment has the second region in which the punching load is relatively large compared to the sum of the punching loads in the first and third regions 70 and 72. By arranging 71 at the center of the punch holder 33 and setting the punching loads in the first and second regions 70 and 72 to be substantially equal, it is possible to reliably prevent the punch holder 33 from being inclined as a whole. Further, since the clearance between the outer peripheral surface of the guide member 35 protruding from the punch holder 33 and the inner peripheral surface of the guide hole 36 of the lower die plate 31 is set to 2 μm or less, the guide member 35 and the guide hole 36 at the time of punching are set. And the sliding accuracy can be improved. For this reason, the inclination of the punch holder 33 can be more effectively prevented. Accordingly, the guide member 35 and the guide hole 36 can be reliably engaged with each other.
[0079]
In this manner, the punching pins 38a and 38b enter the oblique direction with respect to the insulating film 20 that is sequentially fed to a predetermined position on the lower die plate 31 by reliably engaging the guide member 35 and the guide hole 36. Therefore, for example, it is possible to reliably prevent the occurrence of burrs or the like at the opening edge portions of the sprocket holes 23 and the grid-like punching holes 24 and to form the predetermined number of punching holes 22 with high quality.
[0080]
Further, when the positioning pin 41 is inserted into the sprocket hole 23a punched out in the first region 70 in the second or third region 71, 72, the positioning pin 41 contacts the opening edge of the sprocket hole 23a. Therefore, it is possible to effectively prevent the occurrence of damage such as dents, cracks, and bites. Thereby, since the insulating film 20 can be positioned at a predetermined position, a predetermined number of punched holes 22 can be reliably formed at a predetermined position of the insulating film 20.
[0081]
Furthermore, in this embodiment, the material of the lower die plate 31 is changed to high-speed steel or cemented carbide, and the thickness of the lower die plate 31 is set to 25 mm or more, thereby further improving the distortion of the lower die plate 31. Can be prevented. Thereby, the polishing cycle of the lower die plate 33 can be set large.
[0082]
Thus, since the lower die plate 31 is not distorted and deformed, even if a protective film (not shown) that secures the transport strength is attached to the back surface of the insulating film 20, the protection peeled off from the punched residue at the time of punching. Foreign matter such as a film does not scatter on the insulating film 20. Therefore, the foreign matter scattered on the insulating film 20 is not sandwiched between the stripper plates 32, and, for example, dents and scratches are not generated on the insulating film 20 in that portion.
[0083]
As described above, in the second region 71, the lattice-shaped punching holes 24 for mounting solder balls or the like are formed. However, the present invention is not limited to this. For example, a device hole for bonding wires is used. May be provided. The insulating film in which such device holes are formed is used for manufacturing a general TAB tape.
[0084]
As described above, the positioning pin 41 is fixed to the punch holder 33. However, the positioning pin 41 is not limited to this and may be fixed to the stripper plate 32. At this time, the positioning pin 41 is fixed in a state of protruding a predetermined amount toward the lower die plate 31 side of the stripper plate 32.
[0085]
Further, the stripper plate 32 is connected to the punch holder 33 by the connecting pin 34 to drive the punch holder 33 to move the stripper plate 32. However, the present invention is not limited to this, and the stripper plate and the punch holder are driven separately. You may do it.
[0086]
In the first embodiment described above, the punching holes are punched in the first to third regions 70 to 72. However, the present invention is not limited to this, and the entire punching applied to the punch holder 33 from the upstream side to the downstream side is not limited thereto. If the load is set so that there is no deviation, four or more regions, that is, a plurality of regions formed by the stage part as described above may be arranged. In addition to these regions, a region for positioning only may be provided. One or more may be included. Of course, even with such a configuration, the same effects as described above can be obtained.
[0087]
Furthermore, in the present embodiment, the description has been given using a single plate that is integrally processed as the punch holder 33. However, the punch holder 33 is not particularly limited as long as the punch holder is integrally formed. The punch holder which joined the above plate may be sufficient.
[0088]
The progressive punching die 30 of the present embodiment described above is used for manufacturing a film carrier tape for mounting electronic components. For example, a sprocket hole for transportation, a grid-like punching hole for mounting a solder ball, and a bonding A punching hole such as a device hole or a slit for external connection is formed.
[0089]
Hereinafter, an example of a film carrier tape for mounting electronic components manufactured using the above-described progressive punching die 30 will be described. FIG. 5 is a schematic plan view and a cross-sectional view showing an example of a film carrier tape for mounting electronic components according to Embodiment 1 of the present invention.
[0090]
As shown in FIG. 5, the electronic component mounting film carrier tape 90 of the present embodiment includes a lattice-shaped punching hole 91 formed of round holes for mounting solder balls, and a sprocket hole 92 for transporting the insulating film 20. Are CSP tapes.
[0091]
The film carrier tape used here was a film carrier tape (see FIG. 2) having two rows of wiring pattern regions.
[0092]
Specifically, a grid-shaped punching hole 91 for mounting a solder ball is formed in the central portion of the insulating film 20, and a plurality of transfer sprocket holes 92 are formed in the longitudinal direction on both sides in the width direction of the insulating film 20. ing.
[0093]
Note that such lattice-shaped punching holes 91 and sprocket holes 92 are formed continuously using the above-described progressive punching die 30 while intermittently feeding the insulating film 20.
[0094]
Further, the film carrier tape 90 for mounting electronic components is formed by patterning a copper foil provided on the surface of the insulating film 20 via an adhesive layer (not shown) while conveying the insulating film 20 through the sprocket holes 92. A wiring pattern 93 is formed.
[0095]
Furthermore, a part of the wiring pattern 93 is covered with, for example, a solder resist layer 94 formed using a screen printing method. A plating layer 95 is formed on the wiring pattern 93 not covered with the solder resist layer 94, and the plating layer 95 is also provided on the wiring pattern 93 exposed in the lattice-shaped punching holes 91. As such a plating layer 95, for example, tin plating, solder plating, gold plating, nickel-gold plating, or the like may be appropriately selected according to a mounting method of electronic components, a connection method with external wiring, and the like.
[0096]
The electronic component mounting film carrier tape 90 thus manufactured has solder balls or the like mounted in the lattice-shaped punched holes 91, and then the wiring pattern 93 and the insulating film 20 formed on the surface of the insulating film 20. An electronic component (not shown) mounted on the back surface of the board is connected.
[0097]
Thus, by forming the grid-like punching holes for mounting the solder balls using the progressive punching die 30 of the present invention, the punched grid-like punching holes 91 and the sprocket holes 92 are of high quality. Can be formed. Therefore, since the conveyance failure of the insulating film 20 does not occur when the electronic component mounting film carrier tape 90 is manufactured, the solder pattern can be mounted and the wiring pattern 93 and the electronic component can be well connected.
[0098]
The electronic component mounting film carrier tape 90 is not limited to the CSP tape described above, and may be a film carrier tape for mounting electronic components such as BGA, μ-BGA, and TAB.
[0099]
In the present embodiment, the electronic component mounting film carrier tape 90 having two rows of electronic component mounting areas is manufactured. However, the present invention is not limited to this. For example, the electronic component mounting area is divided into one row and divided into one row. It may be a film carrier tape for mounting electronic components.
[0100]
【The invention's effect】
As described above, according to the progressive punching die and the progressive punching device of the present invention, the punching load is relatively large compared to the sum of the punching loads in the first and third regions. Since the area of 2 is arranged in the center of the punch holder and the punching loads in the first and second areas are set to be approximately equal, the punch holder is prevented from tilting and the guide member of the punch holder and the guide hole of the lower die plate are Can be reliably meshed. Therefore, the predetermined punching hole can be reliably formed without causing damage to the insulating film.
[Brief description of the drawings]
FIG. 1 is a partial cross-sectional view of a progressive punching apparatus according to Embodiment 1 of the present invention.
FIG. 2 is a schematic plan view of an insulating film in which punched holes are formed according to Embodiment 1 of the present invention.
FIG. 3 is a schematic view illustrating a process of forming a punching hole by the progressive punching device according to the first embodiment of the present invention.
4 is a cross-sectional view of the progressive die according to Embodiment 1 of the present invention as viewed in the direction of the arrows in FIG. 3, wherein (a) is a cross-sectional view taken along line AA ′, and (b) is a cross-sectional view taken along line BB ′. FIG. 4C is a cross-sectional view taken along the line CC ′.
FIGS. 5A and 5B are a schematic plan view and a cross-sectional view showing an example of a film carrier tape for mounting electronic components according to Embodiment 1 of the present invention. FIGS.
[Explanation of symbols]
10 Punching device for progressive feeding
20 Insulating film
21 Predetermined parts
22 punched holes
23 Sprocket hole
24 lattice punching holes
30 Punching die for progressive feeding
30A, 30B, 30C Stage part
31 Lower die plate
32 Stripper plate
33 Punch holder
34 Connecting pin
35 Guide member
36 Guide hole
37 Bush
38a, 38b Punching pin
39a, 39b Punching pin insertion hole
40a, 40b Recesses for punching holes
41 Positioning pin
42 Positioning pin insertion hole
43 Recess for positioning pin
50 Presser foot
51 recess
60 Forward feed mechanism
70 first region
71 second region
72 3rd area
80 Tape guide
90 Film carrier tape for electronic component mounting

Claims (8)

A lower die plate that supports an insulating film for a film carrier tape and has a punched hole forming recess, a stripper plate that sandwiches the insulating film between the lower die plate, and the punched hole forming recess. A punch holder having a punching pin at a position and punching the punching pin into the insulating film via the stripper plate to form a punching hole, and the insulating film is disposed in a plurality of positions from the upstream side to the downstream side in the transport direction. In the progressive die for forming a punching hole while intermittently feeding to the area of
The punch holder is an integral one that holds punch pins that simultaneously form punch holes in the insulating film in at least three regions arranged side by side from the upstream side in the transport direction, and upstream of the three regions. The punching load in the central region is relatively large compared to the sum of the punching loads in the downstream region, and the punching loads on the upstream side and the downstream side are set to be substantially equal. Punching die for progressive feeding. The punching pin held by the punch holder according to claim 1, wherein the punching hole formed in the wiring region disposed between the sprocket holes of the insulating film in the central region at a time is 100 or more. Punching die for progressive feeding. 3. The punching pin held by the punch holder according to claim 1, wherein the punching pin forms approximately half of the total number of sprocket holes in the upstream region in the transport direction of the insulating film and the remaining sprocket holes in the downstream region. A progressive punching die characterized by forming a grid-like punching hole in the central region. The presser part according to claim 3, wherein the stripper plate corresponding to at least the downstream region is provided facing the insulating film including a portion for forming the remaining sprocket hole, and abuts against the insulating film; A progressive punching die comprising a recess provided in a portion other than the pressing portion and not substantially in contact with the insulating film. 5. The movement of the punching pin is regulated by any one of claims 1 to 4, wherein a guide member protruding from the punch holder is slidably fitted into a guide hole provided in the lower die plate. And a clearance between the outer peripheral surface of the guide member and the inner peripheral surface of the guide hole is 2 μm or less. 6. The progressive die according to claim 1, wherein the lower die plate is formed of at least one selected from the group consisting of high-speed steel and cemented carbide. 7. The progressive die according to claim 6, wherein the lower die plate has a thickness of 25 mm or more. A progressive punching device comprising the progressive punch die according to any one of claims 1 to 7.

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