JP3989236B2 - Lead wire bending method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a lead wire bending method for bending a lead wire of an electronic component such as a laser diode.
[0002]
[Prior art]
Due to the rapid spread of the Internet and intranets, etc., the demand for communication has increased, and further increases in the speed and capacity of optical fiber networks have been demanded. Laser diodes, which are electronic components frequently used in this type of communication field, are becoming smaller and there is a demand for automation of lead wire bending.
[0003]
FIG. 10 shows an example of a laser diode. In this laser diode 20, first to third lead wires 11 to 13 soldered to a printed circuit board are provided on the opposite side of the optical input / output unit 10 with the same circumference. It is provided at intervals of 90 degrees on the top. FIG. 11 is an explanatory view of the bending of the lead wires 11 to 13 of the laser diode 20. The lead wires 11 to 13 are cut to a predetermined length, and then the tip portions are formed on the printed circuit board 15 at regular intervals. It is bent to line up. The leading ends of the lead wires 11 to 13 are soldered to the printed circuit board 15 after bending.
[0004]
The first to third lead wires 11 to 13 are arranged at intervals of 90 degrees on a pitch circle having a diameter of 1.5 mm, for example, and the wire diameter is about 0.3 mm. In addition, a hermetic seal made of glass is applied to the root portions (root portions) of the lead wires 11 to 13.
[0005]
Conventionally, the leading end portion of the lead wire has been manually bent as shown in FIG. Specifically, the cylindrical portion of the laser diode was clamped with a jig, and the tip of the lead wire was pinched with a thin tool such as radio pliers or tweezers and bent.
[0006]
[Problems to be solved by the invention]
Bending lead wires with a wire diameter of about 0.3 mm arranged on a pitch circle having a diameter of 1.5 mm with radio pliers or tweezers is an extremely fine work, and as shown in FIG. In many cases, the tip of ˜13 has a concave shape, which is a difficult task.
[0007]
For this reason, an excessive force is applied to the lead wire during work, and the hermetic seal portion supporting the lead wire is damaged, or the lead wire is peeled off. In addition, the bending of the lead wires becomes uneven, leading to the problem that the tip ends of the lead wires are not aligned on the same plane and soldering to the printed circuit board is not performed well. In addition, there was a problem that lead wires were damaged with radio pliers and tweezers.
[0008]
In addition to manual work, bending methods suitable for automation have also been tried, but no one that can withstand practical use has been realized, and its realization has been awaited.
The present invention has been made to meet such a demand, and the problem to be solved is to realize a lead wire bending method suitable for automation. Another object of the present invention is to realize a lead wire bending method capable of uniformly bending a lead wire without applying an excessive force to the lead wire.
[0009]
[Means for Solving the Problems]
In the lead wire bending method according to claim 1, as shown in FIG. 1, a V-shaped forming step S <b> 1 for expanding the lead wire so that the tip of the lead wire spreads in a V shape when viewed from the side, The lead wire expanded in the V-shaped forming step S1 is pushed back to the center side, the positioning step S2 for positioning the lead wire at the bending start position, and the bending tool tube on the lead wire positioned at the bending start position in the positioning step S2. After the portion is inserted, the lead wire is bent through a bending step S3 in which the bending tool is moved from the bending start position toward the bending end position on the side of the lead wire.
[0010]
In the present invention, after the lead wire is once spread outward, the lead wire is pushed back to the center side, for example, at the V-shaped groove portion of the guide block, so that positioning can be performed accurately. As a result, the cylindrical portion of the bending tool can be easily inserted into the lead wire, and automation can be easily handled.
[0011]
Further bending process of the lead according to claim 1, molded to Brighter over bend the leads of the electronic component which the first to third lead wire 90 degree intervals on the same circumference is at least projected a bending method of lead wire, the V-shape forming step, a wedge-shaped opening member for insertion from the side of the lead wire between the lead wire, the wedge-shaped cross section as viewed from the insertion direction of the distal end side, the insertion direction The wedge-shaped opening member is used in such a way that the distance between the apex portion and the bottom side increases as the distance from the tip of the lead wire increases. The lead wire is positioned so that the ridge line at the apex is parallel to the insertion direction. First, a wedge-shaped opening member is inserted between the first and second lead wires from the side. By inserting a wedge-shaped opening member from the side between the second and third lead wires, The tip of the lead wires is characterized in that the widening in a V-shape.
[0012]
Since the wedge-shaped opening member has a pointed shape, it can be easily inserted between the first and second lead wires and between the second and third lead wires. The third lead wire can be expanded outward in a V shape. Therefore, the V-shaped forming operation is easy and suitable for automation.
[0013]
In the lead wire bending method according to claim 2 , in the positioning step, a guide block having a guide groove having a V-shaped cross section in which the outer peripheral surface of the lead wire engages with the contact surface with the lead wire is used. The lead wire is positioned at the bending start position by moving the guide block with the lead wire engaged with the groove.
[0014]
In the present invention, since the outer peripheral surface of the lead wire is engaged with the guide groove having a V-shaped cross section of the guide block in a pressed state, the relative positional relationship between the lead wire and the guide block is accurately maintained, and the lead wire is further positioned. It can be done accurately.
[0015]
In the bending method of the lead wire according to claim 3 , in the bending process, a conical lead wire introduction surface is provided in the opening of the cylindrical portion of the bending tool fitted to the lead wire, and the lead wire and the bending wire are bent. The amount of lead wire inserted into the bending tool when mating with the tool is set to a small value when the lead wire bending amount is large, and the bending tool is bent from the bending start position after mating with the lead wire. The movement to the end position is characterized by not only the movement toward the side of the lead wire but also the movement in the direction approaching the root portion side of the lead wire.
[0016]
In the present invention, the insertion of the lead wire is facilitated by the action of the conical lead wire introduction surface. In addition, the amount of insertion of the lead wire into the bending tool is changed according to the bending amount of the lead wire, or the bending tool is moved in the direction approaching the root side of the lead wire. When moving to, the relative displacement between the lead wire and the inner peripheral surface of the cylindrical part of the bending tool is reduced, and no excessive force is applied to the lead wire. Damage and peeling can be avoided. Further, the hermetic seal portion that supports the lead wire can be prevented from being damaged. In addition, since the bending force efficiently acts on the lead wire, the tip end portion of the lead wire can be easily arranged on the same plane, and the soldering to the printed circuit board or the like is also good.
[0017]
In the invention according to claim 4 , in order to further improve the accuracy of bending, in the bending process, the lead wire is offset so as to cancel out the return amount of the lead wire generated when the bending tool is removed from the lead wire after the bending process. The bending tool after the end of the fitting is tilted, and the bending tool is moved from the bending start position to the bending end position in this tilted state.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
The embodiment of the present invention will be described by taking as an example the case where the lead wire of the laser diode shown in FIG. 10 is bent as shown in FIG. Hereinafter, the following steps (1) to (3) in this embodiment will be specifically described.
(1) V-shaped forming step: The lead wire is spread so that the tip of the lead wire spreads in a V shape when viewed from the side.
(2) Positioning step: The lead wire expanded in the V-shaped forming step is pushed back to the center side, and the lead wire is positioned at the bending start position.
(3) Bending process: After inserting the cylindrical part of the bending tool into the lead wire positioned at the bending start position in the positioning process, the bending tool is moved from the bending start position to the bending end position on the side of the lead wire. Let
[0019]
First, in the V-shaped forming step, as shown in FIG. 2, the laser diode 20 in which the first, second, and third lead wires 11, 12, and 13 are protruded at 90 ° intervals on the same circumference. The wedge-shaped opening member 30 is inserted between the lead wires 11 and 12 and between the lead wires 12 and 13.
[0020]
As shown in FIGS. 2 and 3, the wedge-shaped opening member 30 has an apex portion 31 as the wedge-shaped cross section (hatched portion S in FIG. 2) viewed from the distal end side in the insertion direction is farther from the distal end in the insertion direction. And the base 32 has a substantially triangular cross-sectional shape that increases the distance L. In other words, the insertion-side distal end portion of the wedge-shaped opening member 30 has a triangular pyramid shape with a tip pointed in the insertion direction.
[0021]
When the wedge-shaped opening member 30 is inserted, the ridge line 33 of the apex angle portion 31 is arranged in parallel to the insertion direction, and the apex angle portion 31 of the wedge-shaped cross section is located on the root portion side of the lead wires 11 to 13. It arrange | positions so that 32 may be located in the front end side of the lead wires 11-13.
[0022]
When the V-shaped forming operation is performed, first, the wedge-shaped opening member 30 is inserted into the space between the root portions of the first and second lead wires 11 and 12 from the side (direction A in FIG. 4). This A direction is a direction substantially orthogonal to the central axis of the laser diode 20 (the central axis of the pitch circle of the lead wires 11 to 13). As the amount of insertion increases, the lower edge of the slope 35 comes into contact with the lead wire 11 and spreads outward in the direction orthogonal to the A direction, and the lower edge of the slope 36 extends to the lead wires 12 and 13. Contact and push them outward in the direction perpendicular to the A direction.
[0023]
Here, the maximum value of the distance L (see FIG. 2) between the apex portion 31 and the base 32 is set longer than the lead wires 11 to 13, and when the wedge-shaped opening member 30 is inserted by a predetermined amount or more, the lead wire The leading end of 11 runs on the slope 35, and the leading ends of the lead wires 12 and 13 run on the slope 36. After this riding, as can be seen from FIG. 3, even if the insertion amount of the wedge-shaped opening member 30 is further increased, the opening angle of the lead wires 11 to 13 does not increase, so it is easy to make the opening angle constant. is there. The positions of the lead wires 11 to 13 in this state are the positions indicated by the broken lines in FIG.
[0024]
Next, the wedge-shaped opening member 30 is pulled out from between the first and second lead wires 11 and 12, and is laterally inserted into the space between the root portions of the second and third lead wires 12 and 13 (direction B in FIG. 4). ) This B direction is a direction substantially orthogonal to the central axis of the laser diode 20 and the A direction. As the amount of insertion increases, the lower edge of the slope 35 now contacts the lead wires 11 and 12 and pushes them outward in the direction perpendicular to the B direction, while the lower edge of the slope 36 leads to the lead wire. 13 is pushed and spread in the outer direction perpendicular to the B direction. When the wedge-shaped opening member 30 is inserted until the leading ends of the lead wires 11 and 12 run on the slope 35 and the leading end of the lead wire 13 rides on the slope 36, the lead wires 11 to 13 are finally positioned as indicated by solid lines in FIG. To be bent. This position is a position where the lead wires 11 to 13 spread in a V shape when viewed from the side. Therefore, the wedge-shaped opening member 30 is pulled out between the second and third lead wires 12 and 13, and the V-shaped forming process is completed.
[0025]
Since the wedge-shaped opening member 30 has a pointed shape, it can be easily inserted between the first and second lead wires 11 and 12 and between the second and third lead wires 12 and 13. The first to third lead wires 11 to 13 can be spread outwardly in a V shape simply by being inserted. Therefore, the V-shaped forming operation is easy and suitable for automation. In particular, in the case of the shape shown in FIGS. 2 and 3, since the tip is inserted between the root portions of the first to third lead wires 11 to 13, even if the tip is recessed as shown in FIG. Can be easily performed.
[0026]
In the next positioning step, the lead wires 11 to 13 that have been spread in the V-shaped forming step are pushed back to the center side, and the lead wires 11 to 13 are positioned at the bending start position. An example is shown in FIG. In FIG. 5, the positioning of the first lead wire 11 is shown, the positional relationship in a plan view is shown in the upper stage, and the positional relationship in the front view is shown in the lower stage.
[0027]
This uses a guide block 40 having a guide groove 41 having a V-shaped cross section in which the outer peripheral surface of the lead wires 11 to 13 is engaged with the contact surface with the lead wires 11 to 13. The lead wires 11 to 13 are positioned at the bending start position by moving the guide block 40 in a state in which 13 is engaged.
[0028]
In the positioning step shown in FIG. 5, first, the guide block 40 is brought close to the lead wire 11 from the outside, and the guide groove 41 is brought into contact with the outer peripheral surface (the state shown in FIG. 5A). In this state, the guide block 40 is moved to the center side of the laser diode 20, the lead wire 11 is pushed back to the bending start position and stopped at the bending start position, and a bending tool 50 described later is attached to the lead wire 11 in this state. The cylindrical portion 51 is inserted from the axial direction (state shown in FIG. 5B). When the fitting between the lead wire 11 and the bending tool 50 is finished, the guide block 40 is retracted from the lead wire 11 (state shown in FIG. 5C).
[0029]
In this positioning step, since the outer peripheral surface of the lead wire 11 is engaged with the guide groove 41 having a V-shaped cross section of the guide block 40 in a pressed state, the relative positional relationship between the lead wire 11 and the guide block 40 is accurately maintained. The lead wire 11 can be positioned more accurately. In addition, even if there is some variation in the position of the lead wire 11 pushed and expanded in the V-shaped forming step, the lead wire 11 can be securely gripped by the guide groove 41 having a V-shaped cross section.
[0030]
In this embodiment, when positioning is performed for one of the lead wires 11 to 13 (for example, the lead wire 11), the lead wire 11 is bent and the bending process is performed. The lead wire positioning operation is started, and the same operation is repeated (for example, the steps are repeated in the order of the end lead wire 13 and the intermediate lead wire 12).
[0031]
In the bending process, after the cylindrical portion 51 of the bending tool 50 is inserted into the lead wires 11 to 13 positioned at the bending start position in the positioning step, the bending direction is directed from the bending start position to the bending end position on the side of the lead wire 12. Then, the bending tool 50 is moved. Here, the bending operation will be described taking the case of bending the lead wire 11 as an example.
[0032]
As shown in FIG. 6, the bending tool 50 used in this embodiment is provided with a conical lead wire introduction surface 52 at the opening of the cylindrical portion 51, and is continuous with the lead wire introduction surface 52. A grip 53 having a small inner diameter and supporting a lead wire 11 is provided.
[0033]
When the lead wire 11 and the bending tool 50 are fitted, the insertion amount L1 of the lead wire 11 into the bending tool 50 is set small when the bending amount M of the lead wire 11 is large, and the bending portion of the lead wire 11 is set. The length L2 is increased. Further, in this embodiment, a support member 55 is provided that abuts against the surface in the bending direction at the base portion of the lead wires 11 to 13 and supports the base portion, so that the lead wires 11 to 13 are bent at the time of bending. The load on the hermetic seal is reduced.
[0034]
When the bending tool 50 moves from the bending start position (position shown in FIG. 6A) to the bending end position (position shown in FIG. 6B), in this embodiment, only the lateral movement of the lead wire 11 is performed. In addition, the lead wire 11 is also moved in a direction approaching the root portion side. That is, L2> L3 is satisfied, and the bending tool 50 moves while drawing an arc with the bending center O in FIG. 6B as the rotation center, or moves in an oblique direction approximate to this arc. I am doing so.
[0035]
In this embodiment, in order to further improve the accuracy of bending, an operation of canceling the return amount of the lead wire 11 that occurs when the bending tool 50 is pulled out from the lead wire 11 after the bending is finished is also performed. That is, as shown in FIG. 7, after completion of fitting with the lead wire 11 (the state of FIG. 7A), an angle θ (for example, 1.5 ° to 2.0 °) that cancels the return amount of the lead wire 11 )), The bending tool 50 is tilted (the state shown in FIG. 7A), and the bending tool 50 is moved from the bending start position to the bending end position in this inclined state (the state shown in FIG. 7C). Thereafter, the bending tool 50 is returned by an angle θ to eliminate the inclination of the bending tool 50 (the state shown in FIG. 7C), and the bending tool 50 is removed from the lead wire 11 (the state shown in FIG. 7D). . When the tilting operation of the bending tool 50 is not performed, the lead wire 11 is opened / closed, but the opening / adjusting state can be eliminated by the tilting operation. The other lead wires 12 and 13 can be bent in the same manner as the lead wire 11.
[0036]
In the bending process, the lead wires 11 to 13 can be easily inserted by the action of the conical lead wire introduction surface 52. Further, the amount of insertion of the lead wires 11 to 13 into the bending tool 50 is changed in accordance with the amount of bending of the lead wires 11 to 13, or the bending tool 50 is moved in a direction approaching the root portion side of the lead wires 11 to 13. As a result, when the bending tool 50 is moved to the bending end position, the relative deviation between the lead wires 11 to 13 and the inner peripheral surface of the cylindrical portion 51 of the bending tool 50 is reduced, and the lead wires 11 to 13 are bent. The lead wires 11 to 13 can be prevented from being greatly damaged or peeled off. Further, since the lead wires 11 to 13 are not squeezed, the hermetic seal portion supporting the lead wires 11 to 13 can be prevented from being damaged. In addition, since the bending force acts on the lead wires 11 to 13 efficiently, the tip portions of the lead wires 11 to 13 can be easily arranged on the same plane, and soldering to a printed circuit board or the like is also good. The
[0037]
The bending tool 50 used in this bending process is required to have a high rigidity of the cylindrical part 51. However, in the above-described bending tool 50 having the cylindrical cylindrical part 51, this part becomes thin and the rigidity is insufficient. There is. The bending tool shown in FIGS. 8 and 9 solves this problem (the parts corresponding to those in FIG. 6 are given the same reference numerals). In the bending tool 50 shown in FIGS. 8 and 9, in order to avoid interference with the lead wires 11 to 13, a corner portion 57 of approximately 90 degrees is provided, and an insertion hole for the lead wires 11 to 13 is formed in the vicinity thereof. A thick rigid portion 58 is provided outside the lead wires 11 to 13 (FIG. 9).
[0038]
In addition, handling and driving of the laser diode 20, the wedge-shaped opening member 30, the guide block 40, the bending tool 50, etc. in each of the above steps can be easily realized by using a widely known robot technology.
[0039]
Although the above description is a method of bending a lead wire of a laser diode, the present invention can also be applied to a method of bending a lead wire of another electronic component (a component having a lead wire). The number of lead wires is not limited.
[0040]
Further, a V-shaped forming process without using a wedge-shaped opening member may be adopted, or a positioning process without using a guide block having a guide groove having a V-shaped cross section may be adopted.
Furthermore, in the V-shaped forming step, all lead wires are opened in a V shape, and then positioning and bending are performed one by one. However, a series of steps may be repeated for each lead wire. Alternatively, each step may be performed collectively for a plurality of lead wires. In short, the basic feature of the present invention is that the lead wire is bent through a V-shaped forming step, a positioning step, and a bending step.
[0041]
【The invention's effect】
As described above, according to the first aspect of the present invention, the lead wire is once spread outward, and then the lead wire is pushed back to the center side for positioning, so that positioning can be performed accurately. As a result, the cylindrical portion of the bending tool can be easily inserted into the lead wire, and automation can be easily handled.
[0042]
Furthermore , since the wedge-shaped opening member has a pointed shape, the wedge-shaped opening member can be easily inserted between the first and second lead wires and between the second and third lead wires. The first to third lead wires can be expanded outward in a V shape simply by being inserted, and the V-shaped forming operation is facilitated, and automation is facilitated.
[0043]
According to the invention of claim 2 , since the outer peripheral surface of the lead wire is engaged with the guide groove having a V-shaped cross section of the guide block in a pressed state, the relative positional relationship between the lead wire and the guide block is accurately maintained, Lead wires can be positioned more accurately.
[0044]
According to the invention of claim 3 , the lead wire can be easily inserted by the action of the conical lead wire introduction surface. Also, when the bending tool is moved to the bending end position, the relative displacement between the lead wire and the inner peripheral surface of the bending tool is reduced, and the lead wire is squeezed without applying excessive force to the lead wire. This eliminates the possibility of major damage and peeling of the lead wires. Further, the hermetic seal portion that supports the lead wire can be prevented from being damaged. In addition, since the bending force efficiently acts on the lead wire, the tip end portion of the lead wire can be easily arranged on the same plane, and the soldering to the printed circuit board or the like is also good.
[0045]
According to the invention which concerns on Claim 4 , the precision of bending molding can be improved further.
[Brief description of the drawings]
FIG. 1 is a principle diagram of the present invention.
FIG. 2 is a conceptual diagram of V-shaped forming.
3A and 3B are diagrams showing a wedge-shaped opening member, where FIG. 3A is a plan view, FIG. 3B is a front view, FIG. 3C is a left side view, and FIG.
FIG. 4 is a diagram illustrating an example of a V-shaped forming operation.
FIG. 5 is a diagram illustrating an example of a positioning operation.
6A and 6B are diagrams illustrating an example of a bending operation, where FIG. 6A shows a state before bending forming, and FIG. 6B shows a state after bending forming.
FIG. 7 is a diagram illustrating another example of a bending operation.
8A and 8B are diagrams showing another example of a bending tool, in which FIG. 8A is a plan view, FIG. 8B is a front view, and FIG. 8C is a longitudinal sectional view.
FIG. 9 is an explanatory diagram of bending by the bending tool of FIG. 8;
FIG. 10 is a diagram showing an example of a laser diode, where (b) shows the right side of (a).
FIGS. 11A and 11B are explanatory diagrams of bending of a lead wire of a laser diode, where FIG. 11B shows the right side surface of FIG. 11A, and FIG. 11C shows the plane surface of FIG.
FIG. 12 is an explanatory diagram of the shape of a lead wire.
[Explanation of symbols]
11 to 13 Lead wire 20 Laser diode 30 Wedge-shaped opening member 31 Vertical corner portion 32 Bottom side 33 Edge lines 35 and 36 Slope 40 Guide block 41 Guide groove 50 Bending tool 51 Tube portion 52 Lead wire introduction surface 53 Grip portion 55 Support member

Claims (4)

A lead wire bending method for bending a lead wire of an electronic component having at least first to third lead wires protruding at 90 degree intervals on the same circumference ,
A V-shaped molding process for expanding the lead wire so that the tip of the lead wire expands in a V shape when viewed from the side;
A positioning step of pushing back the lead wire expanded in the V-shaped forming step back to the center side and positioning the lead wire at a bending start position;
A bending step of moving the bending tool from the bending start position toward the bending end position on the side of the lead wire after inserting the cylindrical portion of the bending tool into the lead wire positioned at the bending start position in the positioning step; ,
In the lead wire bending method ,
In the V-shaped forming step, a wedge-shaped opening member for inserting between the lead wires from the side of the lead wire, the wedge-shaped cross section viewed from the distal end side in the insertion direction becomes more apart from the distal end in the insertion direction. Using a wedge-shaped opening member that increases the distance between the base and the base,
The wedge-shaped opening member is arranged so that the apex angle portion of the wedge-shaped cross section is located on the root portion side of the lead wire, the base is located on the tip end side of the lead wire, and the ridge line of the apex angle portion is parallel to the insertion direction. First, the wedge-shaped opening member is inserted between the first and second lead wires from the side, and then the wedge-shaped opening member is inserted from the side between the second and third lead wires. A method for bending a lead wire, wherein the tip of the wire is expanded in a V shape . In the positioning step, a guide block having a guide groove having a V-shaped cross section in which the outer peripheral surface of the lead wire engages with the contact surface with the lead wire, and the lead wire is engaged with the guide groove. The lead wire bending method according to claim 1, wherein the lead wire is positioned at a bending start position by moving the guide block . In the bending step, a conical lead wire introduction surface is provided in the opening of the cylindrical portion of the bending tool to be fitted with the lead wire, and the lead wire is fitted when the lead wire and the bending tool are fitted. The amount of insertion into the bending tool is set to be small when the bending amount of the lead wire is large, and when moving from the bending start position of the bending tool to the bending end position after completion of fitting with the lead wire, 3. The method of bending a lead wire according to claim 1 , wherein the lead wire is not only moved sideways but also moved in a direction approaching the root portion side of the lead wire. In the bending step, the bending tool after fitting with the lead wire is tilted so as to cancel out the return amount of the lead wire generated when the bending tool is pulled out from the lead wire after the bending step. bending process bending of the lead wire according to claim 3, characterized in that so as to move the bending end position from the starting bending position the tool.

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