JP3986078B2 - Transfer film for antenna circuit formation - Google Patents
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- JP3986078B2 JP3986078B2 JP2005143699A JP2005143699A JP3986078B2 JP 3986078 B2 JP3986078 B2 JP 3986078B2 JP 2005143699 A JP2005143699 A JP 2005143699A JP 2005143699 A JP2005143699 A JP 2005143699A JP 3986078 B2 JP3986078 B2 JP 3986078B2
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Description
本発明は、様々な情報を書き込んだ超小型のＩＣチップを組み込んだいわゆるＩＣタグ（荷札）やＩＣカード等の非接触通信媒体に取り付けられている送受信用の無線アンテナの配線を転写により形成するアンテナ回路形成用転写フイルムに関する。 The present invention forms a wiring of a wireless antenna for transmission / reception attached to a non-contact communication medium such as a so-called IC tag (tag) incorporating an ultra-small IC chip in which various information is written or an IC card by transfer. The present invention relates to a transfer film for forming an antenna circuit.
従来、非接触通信媒体に取り付けられている送受信用の無線アンテナのアンテナ線を転写により形成するアンテナ回路形成用転写フイルムが知られている。
特許文献１には、フィルム基材に透明剥離層を介して金属蒸着層を形成し、さらにその上に感熱性接着剤層を形成したホットスタンプ箔が記載されている。
上記ホットスタンプ箔は、フイルム基材側から一定形状の熱型押し具で押圧（いわゆる刻印押し）するか、サーマルヘッドでフイルム基材側から一定のパターン形状を走査することにより、被転写材料であるアンテナ回路用基材に転写して、アンテナ回路用基材上に、感熱性接着剤層及び金属蒸着層からなるアンテナ線が渦巻き形状などの所望のパターン形状に施されたアンテナ回路を形成して、無線アンテナを得るものである。
すなわち、熱転写後には透明剥離層がフイルム基材に残り、透明剥離層と金属蒸着層間で剥離することにより金属蒸着層がアンテナ線の最表面に形成されるものである。
Patent Document 1 describes a hot stamp foil in which a metal vapor-deposited layer is formed on a film substrate via a transparent release layer, and a heat-sensitive adhesive layer is further formed thereon.
The hot stamping foil is made of a material to be transferred by pressing it with a heat-pressing tool having a fixed shape (so-called engraving pressing) from the film substrate side, or scanning a fixed pattern shape from the film substrate side with a thermal head. The antenna circuit is transferred to a base material for an antenna circuit, and an antenna circuit is formed on the antenna circuit base material in which the antenna wire composed of a heat-sensitive adhesive layer and a metal vapor deposition layer is applied in a desired pattern shape such as a spiral shape. Thus, a wireless antenna is obtained.
That is, after thermal transfer, the transparent release layer remains on the film substrate, and the metal vapor deposition layer is formed on the outermost surface of the antenna wire by peeling between the transparent release layer and the metal vapor deposition layer.
一般に、アンテナ回路を形成する方法として、刻印押しで熱転写する場合には所望のアンテナ回路と同じ型の刻印を作製しなければならず、作製に時間を要するので納期が長くなり、またコスト面でも高くなるので、少量生産に不向きである。
他方、サーマルヘッドで熱転写する方法は、納期やコスト面で有利であり、少量生産にも容易に対応できる。
しかし、上記特許文献１記載のホットスタンプ箔を使用して、サーマルヘッドで熱転写する場合には以下に示す欠点があった。
すなわち、ホットスタンプ箔を被転写材料であるアンテナ回路用基材に熱転写して、アンテナ回路用基材上に感熱性接着剤層及び金属蒸着層からなるアンテナ線が所望のパターン形状に施されたアンテナ回路を形成するときに、透明剥離層と金属蒸着層間できれいに剥離でき、透明剥離層の金属蒸着層への転移がなく、転写後の金属蒸着層上に透明剥離層が全く存在せず、アンテナ線の最表面が金属蒸着層で形成されていることが好ましい。
なぜならば、アンテナ線に直接ＩＣチップを載置したり、アンテナ線に別の配線を施したりする際に、金属蒸着層上に透明剥離層が存在する場合には、金属蒸着層上に存在する透明剥離層が導電性の妨げとなるためである。
そして、透明剥離層と金属蒸着層間できれいに剥離するためには、すなわち透明剥離層と金属蒸着層間の良好な剥離性を備えるには、フィルム基材と透明剥離層間の密着力が透明剥離層と金属蒸着層間の密着力よりも強い関係（フィルム基材と透明剥離層間の密着力＞透明剥離層と金属蒸着層間の密着力）を満たすとともに、透明剥離層と金属蒸着層間の密着力があまり強くても弱くてもだめで一定範囲の密着力が必要であり、しかもこれらの条件を、サーマルヘッドで熱転写する際の環境（熱・圧力）下において、ホットスタンプ箔の全ての部分で満たす必要がある。
しかし、上記ホットスタンプ箔の透明剥離層が、ワックス、アクリル系樹脂、シリコーン系樹脂等の、従来から転写フイルムに使用されてきた一般的な剥離剤のみからなっていたので、フィルム基材と透明剥離層間の密着力、及び透明剥離層と金属蒸着層間の密着力にばらつきがあり、上記条件を十分に満たすものではなく、その結果透明剥離層と金属蒸着層間の剥離性にばらつきが発生した。
そして、ホットスタンプ箔を長尺ロールで製造した場合、上記各層間の密着力のばらつきは、ロット間はもちろん、長尺ロールの長さ方向や幅方向でも発生するため、剥離性にもばらつきが生じ、安定したアンテナ回路を形成することが困難であった。
上記の剥離性のばらつきにより、ホットスタンプ箔を被転写材料であるアンテナ回路用基材に熱転写して、アンテナ回路用基材上に感熱性接着剤層及び金属蒸着層からなるアンテナ線が所望のパターン形状に施されたアンテナ回路を形成するときに、透明剥離層と金属蒸着層間の剥離性が悪いと、離型層と金属蒸着層間できれいに剥離できず金属蒸着層が一部転写されないで離型層側に残存してしまい、その結果、部分的にアンテナ線が切れたり、かすれたり、ときには透明剥離層と金属蒸着層が剥離できない場合があった。
さらには、透明剥離層の一部又は全部が金属蒸着層側に転移して、すなわち透明剥離層の一部又は全部が金属蒸着層と共に転写されてしまい、転写後の金属蒸着層上に透明剥離層が一部あるいは全面に形成されてしまう場合があった。
特にこの現象は刻印押しにより熱転写する場合より、サーマルヘッドで熱転写する場合に顕著であり、その結果アンテナ線に直接ＩＣチップを載置したり、アンテナ線に別の配線を施したりする際に、金属蒸着層上に存在する透明剥離層が導電性の妨げとなるため、透明剥離層を除去する必要があった。
従って、透明剥離層を除去する工程が必要となり、生産性が悪いという問題があった。
一方、透明剥離層と金属蒸着層間の剥離性が良すぎると、必要のない部分まで剥離してしまいアンテナ線の線幅が一定しないなどの不具合が生じたり、場合によっては、いわゆる箔散りが生じることもあった。
従って、特許文献１のホットスタンプ箔は、剥離性のばらつきがあるため、所望のアンテナ回路を形成できないものであった。
In general, as a method of forming an antenna circuit, in the case of thermal transfer by stamping, it is necessary to manufacture the same type of stamp as the desired antenna circuit. Since it becomes high, it is not suitable for small-scale production.
On the other hand, the thermal transfer method using a thermal head is advantageous in terms of delivery time and cost, and can easily cope with small-scale production.
However, when the hot stamp foil described in Patent Document 1 is used for thermal transfer with a thermal head, there are the following drawbacks.
That is, a hot stamp foil was thermally transferred to an antenna circuit substrate as a material to be transferred, and an antenna wire composed of a heat-sensitive adhesive layer and a metal vapor deposition layer was applied to the antenna circuit substrate in a desired pattern shape. When forming the antenna circuit, it can be peeled cleanly between the transparent release layer and the metal deposition layer, there is no transition to the metal deposition layer of the transparent release layer, there is no transparent release layer on the metal deposition layer after transfer, It is preferable that the outermost surface of the antenna wire is formed of a metal vapor deposition layer.
This is because, when an IC chip is directly placed on the antenna wire or when another wiring is applied to the antenna wire, if a transparent release layer is present on the metal vapor deposition layer, it exists on the metal vapor deposition layer. This is because the transparent release layer hinders conductivity.
And in order to peel cleanly between a transparent peeling layer and a metal vapor deposition layer, ie, to have good peelability between a transparent peeling layer and a metal vapor deposition layer, the adhesive force between the film substrate and the transparent peeling layer is It satisfies the relationship stronger than the adhesion between the metal deposition layers (adhesion between the film substrate and the transparent release layer> adhesion between the transparent release layer and the metal deposition layer), and the adhesion between the transparent release layer and the metal deposition layer is too strong. However, even if it is weak, a certain range of adhesion is required, and these conditions must be satisfied in all parts of the hot stamping foil under the environment (heat and pressure) when thermal transfer is performed with a thermal head. is there.
However, since the transparent release layer of the hot stamp foil consists only of general release agents conventionally used for transfer films, such as wax, acrylic resin, and silicone resin, it is transparent to the film substrate. There were variations in the adhesion between the release layers and the adhesion between the transparent release layer and the metal deposition layer, which did not sufficiently satisfy the above conditions, and as a result, there was a variation in the peelability between the transparent release layer and the metal deposition layer.
When the hot stamp foil is manufactured with a long roll, the variation in adhesion between the layers occurs not only between lots, but also in the length direction and width direction of the long roll. As a result, it was difficult to form a stable antenna circuit.
Due to the above-mentioned variation in peelability, the hot stamp foil is thermally transferred to the substrate for antenna circuit, which is a material to be transferred, and an antenna wire comprising a heat-sensitive adhesive layer and a metal vapor deposition layer is desired on the antenna circuit substrate. When forming an antenna circuit with a pattern shape, if the peelability between the transparent release layer and the metal vapor deposition layer is poor, it cannot be peeled cleanly between the release layer and the metal vapor deposition layer. In some cases, the antenna wire remains on the mold layer side, and as a result, the antenna wire is partially cut or blurred, and sometimes the transparent release layer and the metal deposition layer cannot be peeled off.
Furthermore, a part or all of the transparent release layer is transferred to the metal vapor deposition layer side, that is, a part or all of the transparent release layer is transferred together with the metal vapor deposition layer, and the transparent release is performed on the metal vapor deposition layer after transfer. In some cases, the layer was formed partially or entirely.
In particular, this phenomenon is more conspicuous when thermal transfer is performed with a thermal head than when thermal transfer is performed by engraving, and as a result, when placing an IC chip directly on the antenna line or when providing another wiring to the antenna line, Since the transparent release layer present on the metal vapor deposition layer hinders conductivity, it was necessary to remove the transparent release layer.
Therefore, a process for removing the transparent release layer is required, and there is a problem that productivity is poor.
On the other hand, if the peelability between the transparent release layer and the metal vapor deposition layer is too good, it may peel off to an unnecessary part, causing a problem such as the line width of the antenna line not being constant, or in some cases, so-called foil scattering occurs. There was also.
Therefore, the hot stamp foil of Patent Document 1 cannot be formed with a desired antenna circuit because of variation in peelability.
本発明は、上記全ての欠点を除去したものであり、刻印押しで熱転写してアンテナ回路を形成する場合はもちろん、サーマルヘッドで熱転写してアンテナ回路を形成する場合でも、アンテナ線が、切れたり、かすれたりすることがなく、線幅が一定しており、所望のパターン形状のアンテナ回路を容易に形成でき、しかもアンテナ線最表面の金属薄膜層上に離型層が存在することがなく、導電性に優れたアンテナ回路を形成できる転写フイルムを提供することを目的とする。 The present invention eliminates all of the above-mentioned drawbacks, and when the antenna circuit is formed by thermal transfer by engraving and stamping, the antenna wire may be cut even when the antenna circuit is formed by thermal transfer with a thermal head. , The line width is constant, the antenna circuit having a desired pattern shape can be easily formed, and there is no release layer on the metal thin film layer on the outermost surface of the antenna line, It is an object to provide a transfer film capable of forming an antenna circuit having excellent conductivity.
［１］本発明は、少なくともプラスチックフイルムの片面に、離型層、金属薄膜層、接着層が順次形成された転写フイルムにおいて、離型層が樹脂と銅フタロシアニン系染料とからなり、かつ下記（Ａ）〜（Ｄ）の条件を満足することを特徴とするアンテナ回路形成用転写フイルム。
（Ａ）樹脂が、アミノ系共重合体樹脂とイソシアネートとからなる
（Ｂ）アミノ系共重合体樹脂とイソシアネートの重量割合が、９９〜５０：１〜５０である
（Ｃ）樹脂の重量に対する銅フタロシアニン系染料の重量割合が、０．１〜２０重量％である
（Ｄ）金属薄膜層の厚さが、３０〜５０００ｎｍである
である。
［２］本発明は、アミノ系共重合体樹脂が、エポキシメラミン共重合樹脂である上記［１］に記載のアンテナ回路形成用転写フイルムである。
［３］本発明は、エポキシメラミン共重合樹脂のエポキシ樹脂とメラミン樹脂との重量比が１０〜４０：２〜２０である上記［２］に記載のアンテナ回路形成用転写フイルムである。
以上の通り、本発明のアンテナ回路形成用転写フイルムは、離型層を樹脂と銅フタロシアニン系染料とからなるものとし、かつ（Ａ）該樹脂を、アミノ系共重合体樹脂とイソシアネートとすること、（Ｂ）アミノ系共重合体樹脂とイソシアネートの重量割合を、９９〜５０：１〜５０とすること（Ｃ）樹脂の重量に対する銅フタロシアニン系染料の重量割合を、０．１〜２０重量％とすること、及び（Ｄ）金属薄膜層の厚さを、３０〜５０００ｎｍとすることにより課題を解決するものである。
[1] The present invention provides a transfer film in which a release layer, a metal thin film layer, and an adhesive layer are sequentially formed on at least one side of a plastic film, the release layer comprising a resin and a copper phthalocyanine dye , and A transfer film for forming an antenna circuit, which satisfies the conditions A) to (D).
(A) The resin comprises an amino copolymer resin and an isocyanate.
(B) The weight ratio of amino copolymer resin and isocyanate is 99-50: 1-50.
(C) The weight ratio of the copper phthalocyanine dye to the weight of the resin is 0.1 to 20% by weight.
(D) The metal thin film layer has a thickness of 30 to 5000 nm .
[2] The present invention provides the antenna circuit forming transfer film according to the above [1], wherein the amino copolymer resin is an epoxy melamine copolymer resin .
[3] The present invention is the antenna film forming transfer film according to the above [2], wherein the weight ratio of the epoxy resin of the epoxy melamine copolymer resin and the melamine resin is 10 to 40: 2 to 20 .
As described above, in the transfer film for forming an antenna circuit of the present invention, the release layer is composed of a resin and a copper phthalocyanine dye, and (A) the resin is an amino copolymer resin and an isocyanate. (B) The weight ratio of the amino copolymer resin and the isocyanate is 99 to 50: 1 to 50. (C) The weight ratio of the copper phthalocyanine dye to the weight of the resin is 0.1 to 20% by weight. And (D) The problem is solved by setting the thickness of the metal thin film layer to 30 to 5000 nm .
本発明のアンテナ回路形成用転写フイルムは、少なくともプラスチックフイルムの片面に、離型層、金属薄膜層、接着層が順次形成された転写フイルムにおいて、離型層が、樹脂と銅フタロシアニン系染料とからなるので、本発明の転写フイルムを被転写材料であるアンテナ回路用基材に熱転写して、アンテナ回路用基材上に接着層及び金属薄膜層からなるアンテナ線が所望のパターン形状に施されたアンテナ回路を形成するときに、刻印押しで熱転写する場合はもちろんサーマルヘッドで熱転写する場合であっても、離型層と金属薄膜層間の剥離性にばらつきがないため、アンテナ線が、切れたり、かすれたりすることがなく、線幅が一定している。
また、離型層と金属薄膜層間の剥離性にばらつきがないため、離型層と金属薄膜層間できれいに剥離でき、転写後のアンテナ線は金属薄膜層が最表面になっており、金属薄膜層上に離型層が存在することがない。
従って、アンテナ線に直接ＩＣチップを載置したり、アンテナ線にさらに別の配線を施したりする際、アンテナ線最表面の金属薄膜層上に離型層が存在していないので、導電性を妨げるものがなく、離型層を除去する工程が不必要で、生産性が良い。
また、より安定した剥離性を得る点から、離型層中の樹脂を、少なくともアミノ系共重合体樹脂を含む樹脂としておけばより好ましく、さらにアミノ系共重合体樹脂をエポキシメラミン共重合樹脂としておけば万全である。
The transfer film for forming an antenna circuit according to the present invention is a transfer film in which a release layer, a metal thin film layer, and an adhesive layer are sequentially formed on at least one surface of a plastic film. The release layer comprises a resin and a copper phthalocyanine dye. Therefore, the transfer film of the present invention was thermally transferred to the substrate for antenna circuit, which is a material to be transferred, and the antenna wire composed of the adhesive layer and the metal thin film layer was applied to the antenna circuit substrate in a desired pattern shape. When forming an antenna circuit, even if thermal transfer is performed by stamping, as well as thermal transfer with a thermal head, there is no variation in the peelability between the release layer and the metal thin film layer. The line width is constant without fading.
In addition, since there is no variation in the peelability between the release layer and the metal thin film layer, it can be peeled cleanly between the release layer and the metal thin film layer, and the metal thin film layer is the outermost surface of the antenna wire after transfer. There is no release layer on top.
Therefore, when placing an IC chip directly on the antenna line or providing another wiring to the antenna line, there is no release layer on the metal thin film layer on the outermost surface of the antenna line. There is nothing to prevent, the process of removing the release layer is unnecessary, and the productivity is good.
From the viewpoint of obtaining more stable releasability, it is more preferable to use the resin in the release layer as a resin containing at least an amino copolymer resin, and the amino copolymer resin as an epoxy melamine copolymer resin. It's perfect.
本発明のアンテナ回路形成用転写フイルムは、被転写材料であるアンテナ回路用基材に熱転写して、アンテナ回路用基材上に、接着層及び金属薄膜層からなるアンテナ線が所望のパターン形状に施されたアンテナ回路を形成するものである。
本発明のアンテナ回路形成用転写フイルムを使用すれば、刻印押しはもちろん、サーマルヘッドで熱転写した場合でも、容易に所望のアンテナ回路を形成することができる。
The transfer film for forming an antenna circuit of the present invention is thermally transferred to an antenna circuit base material, which is a material to be transferred, so that an antenna wire composed of an adhesive layer and a metal thin film layer is formed in a desired pattern shape on the antenna circuit base material. The applied antenna circuit is formed.
If the transfer film for forming an antenna circuit of the present invention is used, a desired antenna circuit can be easily formed even when heat transfer is performed by a thermal head as well as stamping and pressing.
本発明のアンテナ回路形成用転写フイルムに使用するプラスチックフイルムは、被転写材料であるアンテナ回路用基材に熱転写した後には、後で述べる離型層とともにアンテナ回路用基材から剥離されるものであり、ポリエチレンテレフタレートフイルム等のポリエステルフイルム、トリアセテートフイルム、ノルボルネンフイルム、ポリカーボネートフイルム、塩化ビニルフイルム、ポリプロピレンフイルム、アクリルフイルム等の従来公知のプラスチックフイルムが使用できるが、耐熱性の点から、ポリエチレンテレフタレートフイルム等のポリエステルフイルムが特に好ましい。 The plastic film used for the antenna film forming transfer film of the present invention is peeled off from the antenna circuit substrate together with the release layer described later after being thermally transferred to the antenna circuit substrate which is a material to be transferred. Yes, conventionally known plastic films such as polyester film such as polyethylene terephthalate film, triacetate film, norbornene film, polycarbonate film, vinyl chloride film, polypropylene film, acrylic film can be used, but from the viewpoint of heat resistance, polyethylene terephthalate film etc. The polyester film is particularly preferred.
プラスチックフイルムの厚さは、１〜５０μｍが好ましく、より好ましくは６〜１６μｍである。
厚さが、１μｍより薄いと、転写フイルムの加工時に、該転写フイルムにしわが生じたり、場合によっては破れたりして作業性が悪くなるので好ましくない。
厚さが、５０μｍより厚いと、サーマルヘッドで熱転写する場合に、サーマルヘッドの熱が伝わり難くなり、転写速度が低下して生産性が悪くなったり、場合によっては所望のパターン形状のアンテナ回路を形成できなくなるので好ましくない。
従って、プラスチックフイルムの厚さは、転写フイルム加工時のしわや破れ、生産性等の点から１〜５０μｍが好ましく、６〜１６μｍであれば万全である。
The thickness of the plastic film is preferably 1 to 50 μm, more preferably 6 to 16 μm.
If the thickness is less than 1 μm, the transfer film is wrinkled or broken in some cases during processing of the transfer film, and the workability is deteriorated.
If the thickness is greater than 50 μm, it is difficult to transfer the heat of the thermal head when the thermal transfer is performed by the thermal head, the transfer speed is lowered and the productivity is deteriorated. In some cases, an antenna circuit having a desired pattern shape is required. Since it cannot be formed, it is not preferable.
Accordingly, the thickness of the plastic film is preferably 1 to 50 μm from the viewpoint of wrinkles, tears, productivity, etc. during transfer film processing, and 6 to 16 μm is perfect.
本発明のアンテナ回路形成用転写フイルムに形成される離型層は、樹脂と特定の染料すなわち銅フタロシアニン系染料とからなり、アンテナ回路用基材に熱転写した後には、プラスチックフイルムとともにアンテナ回路用基材から剥離されるものである。
離型層が、樹脂のみからなるものではなく、樹脂と特定の染料である銅フタロシアニン系染料とからなるので、本発明の転写フイルムをアンテナ回路用基材に熱転写して、アンテナ回路用基材上に接着層、及び金属薄膜層からなるアンテナ線が所望のパターン形状に施されたアンテナ回路を形成するときに、刻印押しで熱転写する場合はもちろんサーマルヘッドで熱転写する場合であっても離型層と金属薄膜層間できれいに剥離でき、転写後のアンテナ線は金属薄膜層が最表面になっており、金属薄膜層上に離型層が存在することがなく、またアンテナ線が、切れたり、かすれたりすることもないので、線幅が一定するのである。
The release layer formed on the transfer film for forming an antenna circuit of the present invention is composed of a resin and a specific dye, that is, a copper phthalocyanine dye, and after being thermally transferred to the base for an antenna circuit, together with the plastic film, the release circuit layer. It is peeled from the material.
The release layer is not composed of resin alone, but is composed of resin and copper phthalocyanine dye, which is a specific dye, so that the transfer film of the present invention is thermally transferred to the antenna circuit substrate, and the antenna circuit substrate When forming an antenna circuit with an antenna line consisting of an adhesive layer and a metal thin film layer formed in a desired pattern shape on the top, it is possible to release the mold even when performing thermal transfer with a thermal head as well as thermal transfer with stamping. The metal wire layer is the outermost surface of the antenna wire after transfer, and there is no release layer on the metal thin film layer. The line width is constant because there is no fading.
離型層に使用する樹脂は、該樹脂に後で述べる銅フタロシアニン系染料を混入することにより、離型層としての機能、すなわちプラスチックフイルムと密着し、かつ熱転写後に金属薄膜層との間できれいに剥離できるものであれば特に制限はなく、アミノ系共重合体樹脂、アクリル系樹脂、ポリエステル系樹脂、エポキシ系樹脂、ウレタン系樹脂、シリコーン系樹脂等の樹脂を単独で、あるいは混合して使用できる。
また、より安定した剥離性を得る点から、離型層に使用する樹脂をアミノ系共重合体樹脂としておくのが好ましい。
そして、アミノ系共重合体樹脂と他の樹脂を混合して使用する場合には、少なくともアミノ系共重合体樹脂の重量割合は、樹脂全体の重量のうち５０重量％以上であるのが好ましい。
The resin used for the release layer is mixed with a copper phthalocyanine dye, which will be described later, in the resin, so that it functions as a release layer, that is, adheres to the plastic film and cleans between the metal thin film layer after thermal transfer. There is no particular limitation as long as it can be peeled off, and resins such as amino copolymer resins, acrylic resins, polyester resins, epoxy resins, urethane resins, and silicone resins can be used alone or in combination. .
Further, from the viewpoint of obtaining more stable releasability, it is preferable that the resin used for the release layer is an amino copolymer resin.
And when mixing and using amino-type copolymer resin and other resin, it is preferable that the weight ratio of at least amino-type copolymer resin is 50 weight% or more of the weight of the whole resin.
アミノ系共重合体樹脂は、エポキシメラミン共重合樹脂、ブチル化尿素樹脂とエポキシ樹脂との混合樹脂などのアミノエポキシ系樹脂、ブチル化尿素メラミン共縮合樹脂とヤシ油変性アルキッド樹脂との混合樹脂などのアミノアルキッド系樹脂、ブチル化メラミン樹脂とヒドロキシ・メタアクリル樹脂との混合樹脂などのアミノアクリル系樹脂、ブチル化尿素メラミン共縮合樹脂などの尿素メラミン系樹脂等が使用できるが、中でも、さらに安定した剥離性を得る点から、エポキシメラミン共重合樹脂がより好ましい。
特に、エポキシメラミン共重合樹脂の、エポキシ樹脂とメラミン樹脂との重量比が、１０〜４０：２〜２０であるものとしておけば万全である。
Amino copolymer resins include epoxy melamine copolymer resins, amino epoxy resins such as mixed resins of butylated urea resins and epoxy resins, mixed resins of butylated urea melamine co-condensed resins and coconut oil-modified alkyd resins, etc. Amino alkyd resins, aminoacrylic resins such as mixed resins of butylated melamine resins and hydroxy-methacrylic resins, urea melamine resins such as butylated urea melamine co-condensation resins, etc. can be used. An epoxy melamine copolymer resin is more preferable from the viewpoint of obtaining the peelability.
In particular, if the weight ratio of the epoxy resin to the melamine resin in the epoxy melamine copolymer resin is 10 to 40: 2 to 20, it is perfectly possible.
上記の通り、離型層に使用する樹脂は、上記樹脂を単独で、あるいは混合して使用できるが、さらにこれらの樹脂を主剤として、これら主剤にイソシアネート等の硬化剤を混合して、熱硬化型樹脂とするのが好ましい。
硬化剤の種類や混入量は、主剤となる樹脂の種類、銅フタロシアニン系染料の混入量、プラスチックフイルムの種類等により適宜決定すれば良い。
そして、より安定した剥離性を得るためには、アミノ系共重合体樹脂を主剤としてこれにイソシアネート等の硬化剤を混入した熱硬化型樹脂とし、かつアミノ系共重合体樹脂と硬化剤の重量割合を、９９〜５０：１〜５０としておくのが好ましい。
特に、エポキシメラミン共重合樹脂を主剤としてこれにイソシアネートを硬化剤として混入した熱硬化型樹脂とし、かつエポキシメラミン共重合樹脂とイソシアネートの重量割合を、９９〜５０：１〜５０としておけばより好ましく、さらに該エポキシメラミン共重合樹脂のエポキシ樹脂とメラミン樹脂との重量比を１０〜４０：２〜２０としておけば万全である。
As described above, the resin used for the release layer can be used alone or in combination. However, these resins are used as a main agent, and a curing agent such as isocyanate is mixed with these main agents, followed by thermosetting. A mold resin is preferred.
The type and amount of the curing agent may be appropriately determined depending on the type of resin as the main agent, the amount of copper phthalocyanine dye, the type of plastic film, and the like.
In order to obtain more stable releasability, a thermosetting resin in which an amino copolymer resin is a main ingredient and a curing agent such as isocyanate is mixed therein, and the weight of the amino copolymer resin and the curing agent is used. The ratio is preferably set to 99 to 50: 1 to 50.
In particular, it is more preferable to use an epoxy melamine copolymer resin as a main component and a thermosetting resin in which an isocyanate is mixed as a curing agent, and to set the weight ratio of the epoxy melamine copolymer resin and the isocyanate to 99 to 50: 1 to 50. Furthermore, if the weight ratio of the epoxy resin and the melamine resin in the epoxy melamine copolymer resin is set to 10 to 40: 2 to 20, it is perfectly satisfactory.
銅フタロシアニン系染料は、銅フタロシアニン染料及び銅フタロシアニン染料の分子構造中の銅の一部を他の染料に置換した染料である。 The copper phthalocyanine dye is a dye obtained by substituting a part of copper in the molecular structure of a copper phthalocyanine dye and a copper phthalocyanine dye with another dye.
離型層中の樹脂の重量に対する銅フタロシアニン系染料の重量割合は、０．１〜２０重量％が好ましく、より好ましくは１〜５重量％である。
０．１重量％未満では、サーマルヘッドで熱転写した後に、離型層と金属薄膜層間できれいに剥離できず、金属薄膜層の一部あるいは全部が転写されず、アンテナ線が切れたり、かすれたりして、所望のパターン形状のアンテナ回路を形成できない場合があるので好ましくない。
２０重量％を超えると、プラスチックフイルムと離型層との密着力が悪くなったり、離型層の凝集力が弱くなり、サーマルヘッドで熱転写した後に、離型層が金属薄膜層とともに転写され、金属薄膜層上に離型層が存在することになる場合や、あるいは離型層と金属薄膜層間の剥離性が良くなりすぎ、必要のない部分まで剥離してしまいアンテナ線の線幅が一定しなかったり箔散りが生じる場合があるので好ましくない。
The weight ratio of the copper phthalocyanine dye to the weight of the resin in the release layer is preferably 0.1 to 20% by weight, more preferably 1 to 5% by weight.
If it is less than 0.1% by weight, it cannot be peeled cleanly between the release layer and the metal thin film layer after thermal transfer with the thermal head, and part or all of the metal thin film layer is not transferred, and the antenna wire is cut or blurred. This is not preferable because an antenna circuit having a desired pattern shape may not be formed.
If it exceeds 20% by weight, the adhesive force between the plastic film and the release layer is deteriorated or the cohesive force of the release layer is weakened. After the thermal transfer with the thermal head, the release layer is transferred together with the metal thin film layer. When there is a release layer on the metal thin film layer, or the peelability between the release layer and the metal thin film layer is too good, and the unnecessary part is peeled off and the line width of the antenna line is constant. It is not preferable because there may be no foil or foil scattering.
離型層の厚さは、０．０５〜５μｍが好ましく、より好ましくは０．１〜３μｍである。
厚さが、０．０５μｍ未満では、サーマルヘッドで熱転写した後に、離型層と金属薄膜層間できれいに剥離できず、アンテナ線が切れたり、かすれたりする場合があるので好ましくなく、５μｍより厚くても、０．０５〜５μｍの範囲での剥離性より向上することはない。
The thickness of the release layer is preferably 0.05 to 5 μm, more preferably 0.1 to 3 μm.
If the thickness is less than 0.05 μm, it is not preferable because after the thermal transfer with the thermal head, it cannot be peeled cleanly between the release layer and the metal thin film layer, and the antenna wire may be cut or blurred. However, the peelability in the range of 0.05 to 5 μm is not improved.
離型層の形成方法は、グラビアコート法、マイクログラビアコート法、リバースコート法、ダイコート法等の従来公知のコーティング方法が使用できる。 As a method for forming the release layer, conventionally known coating methods such as a gravure coating method, a micro gravure coating method, a reverse coating method, and a die coating method can be used.
本発明のアンテナ回路形成用転写フイルムに形成される金属薄膜層は、該転写フイルムをアンテナ回路用基材に熱転写した後に、アンテナ回路用基材上に、後で述べる接着層と共に所望のパターン形状のアンテナ線を形成するもので、非接触通信媒体に取り付けられている送受信用の無線アンテナとして使用可能な導電性を付与するものである。
従って、金属薄膜層は、無線アンテナとして使用可能な導電性を付与できるものであればよく、銅、銀、金、アルミニウム、ニッケル、クロム、スズ、白金等の金属またはこれらの合金からなる薄膜層が使用可能であるが、中でも導電性に優れた銅薄膜層、銀薄膜層や、安価なアルミニウム薄膜層が好ましい。
The metal thin film layer formed on the antenna circuit forming transfer film of the present invention has a desired pattern shape together with the adhesive layer described later on the antenna circuit substrate after the transfer film is thermally transferred to the antenna circuit substrate. The antenna wire is formed and imparts conductivity that can be used as a radio antenna for transmission and reception attached to a non-contact communication medium.
Therefore, the metal thin film layer may be any film that can provide conductivity that can be used as a radio antenna, and is a thin film layer made of a metal such as copper, silver, gold, aluminum, nickel, chromium, tin, platinum, or an alloy thereof. However, among them, a copper thin film layer, a silver thin film layer and an inexpensive aluminum thin film layer excellent in conductivity are preferable.
金属薄膜層の厚さは、３０〜５０００ｎｍ、好ましくは５０〜１０００ｎｍ、より好ましくは１００〜３００ｎｍである。
厚さが、３０ｎｍ未満では必要な導電性が得られないので好ましくなく、５０００ｎｍを超えても導電性はそれ以上向上せず、かえってサーマルヘッドで熱転写する際に、厚すぎて金属薄膜層がきれいに転写でき難くなるので好ましくない。
The thickness of the metal thin film layer is 30 to 5000 nm, preferably 50 to 1000 nm, more preferably 100 to 300 nm.
If the thickness is less than 30 nm, the necessary conductivity cannot be obtained. This is not preferable. If the thickness exceeds 5000 nm, the conductivity is not improved any more. On the other hand, when thermal transfer is performed with a thermal head, the metal thin film layer is too thick. Since transfer becomes difficult, it is not preferable.
金属薄膜層の形成方法は、真空蒸着法、スパッタリング蒸着法、ＥＢ蒸着法、ＣＶＤ蒸着法等の従来公知の方法が使用できる。 As a method for forming the metal thin film layer, a conventionally known method such as a vacuum vapor deposition method, a sputtering vapor deposition method, an EB vapor deposition method, or a CVD vapor deposition method can be used.
本発明のアンテナ回路形成用転写フイルムに形成される接着層は、金属薄膜層上に形成され、前記した通り、転写後には金属薄膜層と共にアンテナ線を形成するものである。
接着層に使用する樹脂は、アンテナ回路用基材の種類により適宜決定すればよく、アクリル系樹脂、ＡＢＳ系樹脂、塩化ビニル系樹脂、塩化ビニル酢酸ビニル共重合体系樹脂、ポリプロピレン系樹脂、ポリエステル系樹脂、ポリエーテル系樹脂、ポリカーボネート系樹脂、シリコーン系樹脂等が使用できる。
The adhesive layer formed on the transfer film for forming an antenna circuit of the present invention is formed on the metal thin film layer, and as described above, after the transfer, the antenna line is formed together with the metal thin film layer.
The resin used for the adhesive layer may be appropriately determined depending on the type of the substrate for the antenna circuit. Acrylic resin, ABS resin, vinyl chloride resin, vinyl chloride vinyl acetate copolymer resin, polypropylene resin, polyester resin Resins, polyether resins, polycarbonate resins, silicone resins and the like can be used.
接着層の厚さは、０．１〜５μｍが好ましい。
厚さが０．１μｍより薄いと、金属薄膜層とアンテナ回路用基材間の密着力が得られ難いので好ましくない。
厚さが５μｍより厚くても、密着力は向上せず、また不経済であり、さらに塗りムラによる外観不良が生じるので好ましくない。
従って、接着層の厚さは、密着力や塗り外観の点等から０．１〜５μｍが好ましい。
The thickness of the adhesive layer is preferably 0.1 to 5 μm.
If the thickness is less than 0.1 μm, it is difficult to obtain an adhesive force between the metal thin film layer and the antenna circuit substrate, which is not preferable.
Even if the thickness is greater than 5 μm, the adhesion is not improved, it is uneconomical, and an appearance defect due to uneven coating occurs, which is not preferable.
Accordingly, the thickness of the adhesive layer is preferably from 0.1 to 5 μm from the viewpoint of adhesion and coating appearance.
接着層の形成方法は、グラビアコート法、マイクログラビアコート法、リバースコート法、ダイコート法等の従来公知のコーティング方法が使用できる。 As a method for forming the adhesive layer, conventionally known coating methods such as a gravure coating method, a micro gravure coating method, a reverse coating method, and a die coating method can be used.
また、サーマルヘッドの熱によるプラスチックフイルムの溶融により、印刷精度が低下したり、サーマルヘッドとプラスチックフイルムの融着によるアンテナ回路形成用転写フイルムの走行不能を招くなどの、いわゆるスティッキング現象を防止する目的で、本発明のアンテナ回路形成用転写フイルムの離型層が形成されている面と反対面側に、シリコン樹脂や界面活性剤等からなるスティッキング防止層を形成してもよく、スティキング防止層を形成したものも、もちろん本発明のアンテナ回路形成用転写フイルムに含まれる。 Also, the purpose is to prevent so-called sticking phenomenon that the printing accuracy is lowered due to the melting of the plastic film due to the heat of the thermal head, and that the transfer film for antenna circuit formation cannot be run due to the fusion of the thermal head and the plastic film. Thus, an anti-sticking layer made of a silicon resin or a surfactant may be formed on the side opposite to the surface on which the release layer of the transfer film for forming an antenna circuit of the present invention is formed. Of course, the transfer film for forming an antenna circuit of the present invention is also included.
［実施例１］
（アンテナ回路形成用転写フイルムの製造）
厚さ１２μｍのポリエチレンテレフタレートフイルムの片面に、エポキシメラミン共重合樹脂（田中ケミカル社製 ４８００−６１２クリアー エポキシ樹脂とメラミン樹脂の重量割合 ２２．５：７．５）３０重量部及びイソシアネート（三井武田ケミカル社製 タケネートＤ１１０Ｎ）７．５重量部からなる樹脂（エポキシメラミン共重合樹脂とイソシアネートの重量割合 ８０：２０）に、銅フタロシアニン染料（ＢＡＳＦ社製 ネオザポンブルーＦＬＥ）１重量部を混入した厚さ０．５μｍの離型層（樹脂の重量に対する銅フタロシアニン染料の重量割合：２．７重量％）をグラビアコート法にて形成し、離型層上に、厚さ２６０ｎｍの銅薄膜層を真空蒸着法にて形成し、さらに銅薄膜層上に、ビニル樹脂、塩化ビニル酢酸ビニル共重合体樹脂、塩化ゴム、及びシリカからなる厚さ０．５μｍの接着層をリバースコート法にて形成し、本発明のアンテナ回路形成用転写フイルムを得た。
（無線アンテナの製造）
上記で得た本発明のアンテナ回路形成用転写フイルムを、アンテナ回路用基材として厚さ３５μｍのポリエチレンテレフタレートフイルムに、サーマルヘッドプリンターを使用して熱転写し、厚さ３５μｍのポリエチレンテレフタレートフイルム上に、接着層及び金属薄膜層からなる線幅１ｍｍで長さが９００ｍｍのアンテナ線が渦巻き形状に施されたアンテナ回路を形成した無線アンテナを得た。
（無線アンテナの評価）
アンテナ線の幅は一定で、断線もなくきれいな渦巻き形状を有していた。
また、アンテナ回路の両端間（渦巻き形状のアンテナ回路の中心部のアンテナ線の端部分と、渦巻き形状のアンテナ回路の最外側のアンテナ線の端部分との間（長さ９００ｍｍ））の抵抗率をテスターを使用して測定したところ、７８Ωであり、通電していることが確認でき、アンテナ線として問題なく使用できるものであった。
さらに、離型層と銅薄膜層間できれいに剥離しており、離型層が銅薄膜層上に転移しておらず、銅薄膜層上に離型層が存在していないことが確認できた。
[Example 1]
(Manufacture of transfer film for antenna circuit formation)
On one side of a 12 μm-thick polyethylene terephthalate film, 30 parts by weight of an epoxy melamine copolymer resin (4800-612 clear epoxy resin and melamine resin by weight ratio 22.5: 7.5) and isocyanate (Takeda Mitsui Chemical) Thickness of 1 part by weight of copper phthalocyanine dye (BASF Neozapon Blue FE) mixed with 7.5 parts by weight of resin (Takenate D110N, manufactured by the company, 80:20 by weight ratio of epoxy melamine copolymer resin and isocyanate) A 0.5 μm thick release layer (weight ratio of copper phthalocyanine dye to resin weight: 2.7% by weight) is formed by a gravure coating method, and a 260 nm thick copper thin film layer is vacuumed on the release layer It is formed by vapor deposition, and on the copper thin film layer, vinyl resin, vinyl chloride vinyl acetate copolymer resin An adhesive layer made of chlorinated rubber and silica having a thickness of 0.5 μm was formed by a reverse coating method to obtain a transfer film for forming an antenna circuit of the present invention.
(Manufacture of wireless antennas)
The transfer film for forming an antenna circuit of the present invention obtained above was thermally transferred to a polyethylene terephthalate film having a thickness of 35 μm as a substrate for an antenna circuit using a thermal head printer, and the film was then transferred to a polyethylene terephthalate film having a thickness of 35 μm. A radio antenna having an antenna circuit in which an antenna wire having a line width of 1 mm and a length of 900 mm made of an adhesive layer and a metal thin film layer was spirally formed was obtained.
(Evaluation of wireless antenna)
The width of the antenna wire was constant, and it had a clean spiral shape without disconnection.
Also, the resistivity between both ends of the antenna circuit (between the end portion of the antenna wire at the center of the spiral antenna circuit and the end portion of the outermost antenna wire of the spiral antenna circuit (length: 900 mm)) Was measured using a tester and found to be 78Ω, confirming that power was being supplied, and could be used without problem as an antenna wire.
Furthermore, it peeled cleanly between a mold release layer and a copper thin film layer, and it has confirmed that the mold release layer did not transfer on a copper thin film layer, but the mold release layer does not exist on a copper thin film layer.
［比較例１］
（アンテナ回路形成用転写フイルムの製造）
実施例１の離型層に替えて、厚さ０．５μｍで、エポキシメラミン共重合樹脂（田中ケミカル社製 ４８００−６１２クリアー エポキシ樹脂とメラミン樹脂の重量割合 ２２．５：７．５）３０重量部及びイソシアネート（三井武田ケミカル社製 タケネートＤ１１０Ｎ）７．５重量部からなる樹脂のみからなる離型層（実施例１の離型層に銅フタロシアニン染料を混入しなかった離型層）を形成した以外は、実施例１と同様にして、アンテナ回路形成用転写フイルムを得た。
（無線アンテナの製造）
上記で得たアンテナ回路形成用転写フイルムを使用し、実施例１と同様にして無線アンテナを得た。
（無線アンテナの評価）
転写フイルムの離型層と銅薄膜層間の剥離性が悪いので、離型層と銅薄膜層間できれいに剥離できず銅薄膜層が一部転写されないで離型層側に残存していて、その結果アンテナ線は一部切れたり、かすれたりしており、また線幅も一定でなく、きれいな渦巻き形状を有していなかった。
また、無線アンテナの両端間の抵抗率をテスターを使用して測定したところ、測定限界である無限大を示し通電しておらず、無線アンテナとして使用できないものであった。
[Comparative Example 1]
(Manufacture of transfer film for antenna circuit formation)
In place of the release layer of Example 1, the thickness is 0.5 μm, and the epoxy melamine copolymer resin (Tanaka Chemical Co., Ltd. 4800-612 clear epoxy resin and melamine resin weight ratio 22.5: 7.5) 30 weight Part and isocyanate (Takenate D110N manufactured by Mitsui Takeda Chemical Co., Ltd.) 7.5 parts by weight were formed of a release layer (release layer in which the copper phthalocyanine dye was not mixed in the release layer of Example 1). Except for the above, an antenna circuit forming transfer film was obtained in the same manner as in Example 1.
(Manufacture of wireless antennas)
Using the antenna circuit forming transfer film obtained above, a wireless antenna was obtained in the same manner as in Example 1.
(Evaluation of wireless antenna)
Since the peelability between the release layer and the copper thin film layer of the transfer film is poor, the copper thin film layer cannot be transferred cleanly between the release layer and the copper thin film layer, and the copper thin film layer remains on the release layer side without being transferred. The antenna wire was partially cut or faint, the line width was not constant, and it did not have a clean spiral shape.
Moreover, when the resistivity between both ends of the wireless antenna was measured using a tester, the measurement limit was infinite, indicating that the current was not energized and could not be used as a wireless antenna.
［比較例２］
（アンテナ回路形成用転写フイルムの製造）
実施例１の離型層中の樹脂の重量に対する銅フタロシアニン染料の重量割合を、３０重量％にした以外は、実施例１と同様にして、アンテナ回路形成用転写フイルムを得た。
得られたアンテナ回路形成用転写フイルムは、離型層と銅薄膜層間の剥離性が良すぎて、薄散りを生じるものであった。
（無線アンテナの製造）
上記で得たアンテナ回路形成用転写フイルムを使用し、実施例１と同様にして無線アンテナを得た。
（無線アンテナの評価）
転写フイルムの離型層と銅薄膜層間の剥離性が良すぎて、必要のない部分まで銅薄膜層及び接着層が剥離してしまい、アンテナ線の線幅も一定でなく、きれいな渦巻き形状を有していなかった。
また、無線アンテナの両端間の抵抗率をテスターを使用して測定したところ、７０Ωであり、通電していることが確認できたが、上記の通りアンテナ線の線幅が一定でなく、無線アンテナとして使用できないものであった。
[Comparative Example 2]
(Manufacture of transfer film for antenna circuit formation)
A transfer film for forming an antenna circuit was obtained in the same manner as in Example 1 except that the weight ratio of the copper phthalocyanine dye to the weight of the resin in the release layer of Example 1 was changed to 30% by weight.
The obtained transfer film for forming an antenna circuit had a good detachability between the release layer and the copper thin film layer, resulting in thin scattering.
(Manufacture of wireless antennas)
Using the antenna circuit forming transfer film obtained above, a wireless antenna was obtained in the same manner as in Example 1.
(Evaluation of wireless antenna)
The peelability between the release layer of the transfer film and the copper thin film layer is too good, and the copper thin film layer and adhesive layer peel off to the unnecessary part, and the line width of the antenna wire is not constant and has a clean spiral shape. I did not.
Moreover, when the resistivity between both ends of the wireless antenna was measured using a tester, it was confirmed that it was 70Ω and energized. However, the line width of the antenna line was not constant as described above, and the wireless antenna Could not be used as.
［比較例３］
（アンテナ回路形成用転写フイルムの製造）
実施例１の離型層に替えて、厚さ０．５μｍで、アクリル系樹脂のみからなる離型層を形成した以外は、実施例１と同様にして、アンテナ回路形成用転写フイルムを得た。
（無線アンテナの製造）
上記で得たアンテナ回路形成用転写フイルムを使用し、実施例１と同様にして無線アンテナを得た。
（無線アンテナの評価）
転写フイルムの離型層と銅薄膜層間の剥離性が安定していないため、離型層と銅薄膜層間の剥離性が悪い部分では、離型層と銅薄膜層間できれいに剥離できず銅薄膜層が一部転写されないで離型層側に残存していて、その結果アンテナ線は一部切れたり、かすれたりしており、また線幅も一定でなく、きれいな渦巻き形状を有していなかった。
また、プラスチックフイルムと離型層間の密着力が悪い部分では、離型層が銅薄膜層上に転移して、銅薄膜層上に離型層が部分的に存在しているのが確認できた。
さらに、無線アンテナの両端間の抵抗率をテスターを使用して測定したところ、測定限界である無限大を示し通電しておらず、無線アンテナとして使用できないものであった。
[Comparative Example 3]
(Manufacture of transfer film for antenna circuit formation)
A transfer film for forming an antenna circuit was obtained in the same manner as in Example 1 except that a release layer made of only an acrylic resin having a thickness of 0.5 μm was formed instead of the release layer in Example 1. .
(Manufacture of wireless antennas)
Using the antenna circuit forming transfer film obtained above, a wireless antenna was obtained in the same manner as in Example 1.
(Evaluation of wireless antenna)
Because the peelability between the release layer of the transfer film and the copper thin film layer is not stable, the copper thin film layer cannot be peeled cleanly between the release layer and the copper thin film layer at the part where the peelability between the release layer and the copper thin film layer is poor. Was partially transferred and remained on the release layer side. As a result, the antenna wire was partially cut or faint, the line width was not constant, and it did not have a clean spiral shape.
Moreover, in the part where the adhesive force between the plastic film and the release layer was poor, it was confirmed that the release layer was transferred onto the copper thin film layer and the release layer was partially present on the copper thin film layer. .
Furthermore, when the resistivity between the both ends of the wireless antenna was measured using a tester, it showed infinity as the measurement limit and was not energized and could not be used as a wireless antenna.
［比較例４］
（アンテナ回路形成用転写フイルムの製造）
実施例１の離型層に替えて、厚さ０．２μｍで、ワックスのみからなる離型層を形成した以外は、実施例１と同様にして、アンテナ回路形成用転写フイルムを得た。
得られたアンテナ回路形成用転写フイルムは、銅薄膜層を蒸着する際の熱により、ワックスからなる離型層にひずみが生じ、その結果離型層上の銅薄膜層にもひずみが生じて、いわゆる白化現象が発生し、銅薄膜層の金属光沢（銅光沢）を有していなかった。
（無線アンテナの製造）
上記で得たアンテナ回路形成用転写フイルムを使用し、実施例１と同様にして無線アンテナを得た。
（無線アンテナの評価）
転写フイルムの離型層と銅薄膜層間の剥離性が安定していないため、離型層と銅薄膜層間の剥離性が悪い部分では、離型層と銅薄膜層間できれいに剥離できず銅薄膜層が一部転写されないで離型層側に残存していて、その結果アンテナ線は一部切れたり、かすれたりしており、また線幅も一定でなく、きれいな渦巻き形状を有していなかった。
また、アンテナ線は銅光沢を有していなかった。
さらに、プラスチックフイルムと離型層間の密着力が悪い部分では、離型層が銅薄膜層上に転移して、銅薄膜層上に離型層が部分的に存在しているのが確認できた。
また、無線アンテナの両端間の抵抗率をテスターを使用して測定したところ、測定限界である無限大を示し通電しておらず、無線アンテナとして使用できないものであった。
[Comparative Example 4]
(Manufacture of transfer film for antenna circuit formation)
A transfer film for forming an antenna circuit was obtained in the same manner as in Example 1 except that a release layer made of only wax having a thickness of 0.2 μm was formed instead of the release layer of Example 1.
The resulting transfer film for forming an antenna circuit is distorted in the release layer made of wax due to heat generated when the copper thin film layer is deposited, resulting in distortion in the copper thin film layer on the release layer. A so-called whitening phenomenon occurred, and the copper thin film layer did not have a metallic luster (copper luster).
(Manufacture of wireless antennas)
Using the antenna circuit forming transfer film obtained above, a wireless antenna was obtained in the same manner as in Example 1.
(Evaluation of wireless antenna)
Because the peelability between the release layer of the transfer film and the copper thin film layer is not stable, the copper thin film layer cannot be peeled cleanly between the release layer and the copper thin film layer at the part where the peelability between the release layer and the copper thin film layer is poor. Was partially transferred and remained on the release layer side. As a result, the antenna wire was partially cut or faint, the line width was not constant, and it did not have a clean spiral shape.
The antenna wire did not have copper luster.
Furthermore, in the part where the adhesion between the plastic film and the release layer was poor, it was confirmed that the release layer was transferred onto the copper thin film layer and the release layer was partially present on the copper thin film layer. .
Moreover, when the resistivity between both ends of the wireless antenna was measured using a tester, the measurement limit was infinite, indicating that the current was not energized and could not be used as a wireless antenna.
Claims (3)
（Ａ）樹脂が、アミノ系共重合体樹脂とイソシアネートとからなる
（Ｂ）アミノ系共重合体樹脂とイソシアネートの重量割合が、９９〜５０：１〜５０である
（Ｃ）樹脂の重量に対する銅フタロシアニン系染料の重量割合が、０．１〜２０重量％である
（Ｄ）金属薄膜層の厚さが、３０〜５０００ｎｍである In a transfer film in which a release layer, a metal thin film layer, and an adhesive layer are sequentially formed on at least one side of a plastic film, the release layer is composed of a resin and a copper phthalocyanine dye , and the following (A) to (D) An antenna circuit forming transfer film characterized by satisfying the conditions.
(A) The resin comprises an amino copolymer resin and an isocyanate.
(B) The weight ratio of amino copolymer resin and isocyanate is 99-50: 1-50.
(C) The weight ratio of the copper phthalocyanine dye to the weight of the resin is 0.1 to 20% by weight.
(D) The thickness of the metal thin film layer is 30 to 5000 nm.
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| JP2005143699A JP3986078B2 (en) | 2005-05-17 | 2005-05-17 | Transfer film for antenna circuit formation |
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