JP3973517B2 - Liquid film forming method or liquid film forming apparatus - Google Patents

Liquid film forming method or liquid film forming apparatus Download PDF

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JP3973517B2
JP3973517B2 JP2002252866A JP2002252866A JP3973517B2 JP 3973517 B2 JP3973517 B2 JP 3973517B2 JP 2002252866 A JP2002252866 A JP 2002252866A JP 2002252866 A JP2002252866 A JP 2002252866A JP 3973517 B2 JP3973517 B2 JP 3973517B2
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substrate
processed
radial direction
chemical solution
liquid film
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JP2004095726A (en
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誠 宮原
一寿 伊藤
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CKD Corp
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CKD Corp
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【０００１】
【発明の属する技術分野】
本発明は、被処理基板に対して薬液を螺旋状の軌跡を描くように塗布して成膜を行う液膜形成方法及び液膜形成装置に関し、更に詳細には、被処理基板上に形成された液膜の均一化を図ることができる液膜形成方法及び液膜形成装置に関するものである。
【０００２】
【従来の技術】
半導体デバイス製造におけるリソグラフィ工程では、被処理基板の表面に薬液を塗布する液膜形成方法にスピンコート法が採用されていた。しかし、この方法ではウェハ表面から薬液が多く飛散してしまうために無駄が多く、そうして排出された薬液による環境への影響もあった。また、方形の基板や１２インチ以上の大きい円形基板の場合には、基板の外周部で乱気流が生じて膜厚が不均一になるという問題があった。
そこで従来から、膜厚を均一にしたり、使用する薬液の量を少なくするための方法として、特開２０００−２８８４５０号公報や特開２０００−３５０９５５号公報などで、回転する被処理基板に対して薬液供給ノズルを径方向へ移動させる間に薬液を吐出し、その被処理基板に対して薬液を螺旋状の軌跡を描くようにして塗布する液膜形成方法が採用されている。
【０００３】
そして当該公報には、その液膜形成を行うに際して、被処理基板上を移動する際、薬液供給ノズルからのレジスト液の吐出、その吐出の際の薬液供給速度、薬液供給ノズルの移動、その移動速度、基板の回転、およびその回転速度を適宜制御することが記載されている。
すなわち特開２０００−２８８４５０号公報の方法では、例えば薬液供給ノズルからの薬液の吐出に関し、薬液供給ノズルを基板上で移動している際、薬液の吐出を連続し、または薬液供給ノズルの基板上の位置に応じて薬液の吐出を中断して、膜厚の均一化やレジスト使用量の削減を図るようにしている。そして、特開２０００−３５０９５５号公報の方法では、薬液供給ノズルが移動する間に薬液供給量を漸次多くして基板の中央部と周辺部との間で単位面積あたりの薬液塗布量を等量にして均一な膜を形成するようにしている。
【０００４】
【発明が解決しようとする課題】
しかし、薬液を被処理基板に塗布すると、塗布した直後から薬液の乾燥が始まるため、被処理基板上の最初に塗布した場所と、最後に塗布した場所とでは、薬液の乾燥度の違いが生じ、この乾燥度の違いにより、均一な液膜を形成することができない問題があった。
そこで、本発明は、上述した問題を解決するべく、被処理基板上の最初に薬液を塗布した場所と、最後に薬液を塗布した場所との乾燥度の違いの発生をなるべく防止して、できるだけ均一な液膜を形成することができる優れた液膜形成方法、または液膜形成装置を提供することを目的する。
【０００５】
【課題を解決するための手段】
前記目的を達成するため、本発明の液膜形成方法は、次のような構成により、続いて説明する作用、効果を示す。
（１）回転する被処理基板に対してその上を径方向に移動する薬液供給部から薬液を吐出し、被処理基板上に螺旋状の軌跡を描いて薬液を塗布することにより、被処理基板上に液膜を形成する液膜形成方法において、前記径方向の中心側が薄くて前記径方向の外周側が厚い断面形状となるようなテーパ面を被処理基板側に形成した蓋体でもって前記被処理基板の上方を覆い、前記被処理基板の径方向の中心側より、前記薬液の塗布を開始し、前記径方向の外周側で前記薬液の塗布を終了することを特徴とする。
【０００６】
したがって、（１）に係る液膜形成方法によれば、回転する被処理基板上の最初に塗布した径方向の中心側から乾燥が始まり、最後に塗布した径方向の外周側の乾燥が最後になる場合、径方向の中心側が薄くて外周側が厚い断面形状となるようなテーパ面を被処理基板側に形成した蓋体でもって、前記被処理基板の上方を覆うと、外周側から中心側へ向かう気流が生じるために、塗布開始位置である径方向の中心側の上方において、溶剤の雰囲気を密にする。これにより、被処理基板上の最初に塗布した径方向の中心側と、最後に塗布した径方向の外周側との乾燥度の違いの発生をなるべく防止でき、被処理基板上の最初に塗布した部分の薬液の流動性を確保して、薬液中の固形分を分散させることができるので、できるだけ均一な液膜を形成することができる。
【０００７】
（２）回転する被処理基板に対してその上を径方向に移動する薬液供給部から薬液を吐出し、被処理基板上に螺旋状の軌跡を描いて薬液を塗布することにより、被処理基板上に液膜を形成する液膜形成方法において、前記径方向の中心側が厚くて前記径方向の外周側が薄い断面形状となるようなテーパ面を被処理基板側に形成した蓋体でもって前記被処理基板の上方を覆い、前記被処理基板の径方向の外周側より、前記薬液の塗布を開始し、前記被処理基板の中心側で前記薬液の塗布を終了することを特徴とする。
【０００８】
したがって、（２）に係る液膜形成方法によれば、回転する被処理基板上の最初に塗布した径方向の外周側から乾燥が始まり、最後に塗布した径方向の中心側の乾燥が最後になる場合、径方向の中心側が厚くて外周側が薄い断面形状となるようなテーパ面を被処理基板側に形成した蓋体でもって、前記被処理基板の上方を覆うと、中心側から外周側へ向かう気流が生じるために、塗布開始位置である径方向の外周側の上方において、溶剤の雰囲気を密にする。これにより、被処理基板上の最初に塗布した径方向の外周側と、最後に塗布した径方向の中心側の乾燥度の違いの発生をなるべく防止でき、被処理基板上の最初に塗布した部分の薬液の流動性を確保して、薬液中の固形分を分散させることができるので、できるだけ均一な液膜を形成することができる。
【０００９】
また、前記目的を達成するため、本発明の液膜形成装置は、次のような構成により、続いて説明する作用、効果を示す。
（３）回転する被処理基板に対してその上を径方向に移動する薬液供給部から薬液を吐出し、被処理基板上に螺旋状の軌跡を描いて薬液を塗布することにより、被処理基板上に液膜を形成する液膜形成装置において、前記被処理基板の上方を覆う蓋体の被処理基板側に、前記径方向の中心側が薄くて前記径方向の外周側が厚い断面形状となるようなテーパ面を形成し、前記薬液供給部から前記薬液を吐出する塗布開始位置を、前記径方向の中心側に設定し、前記薬液の塗布終了位置を前記径方向の外周側に設定することを特徴とする。
【００１０】
したがって、（３）に係る液膜形成装置によれば、回転する被処理基板上の塗布開始位置である径方向の中心側から乾燥が始まり、塗布終了位置である径方向の外周側の乾燥が最後になる場合、径方向の中心側が薄くて外周側が厚い断面形状となるようなテーパ面を被処理基板側に形成した蓋体でもって、前記被処理基板の上方を覆うと、径方向の外周側から中心側へ向かう気流が生じるために、塗布開始位置である径方向の中心側の上方において、溶剤の雰囲気を密にする。これにより、被処理基板上の塗布開始位置である径方向の中心側と、塗布終了位置である径方向の外周側との乾燥度の違いの発生をなるべく防止でき、被処理基板上の最初に塗布した部分の薬液の流動性を確保して、薬液中の固形分を分散させることができるので、できるだけ均一な液膜を形成することができる。
【００１１】
（４）回転する被処理基板に対してその上を径方向に移動する薬液供給部から薬液を吐出し、被処理基板上に螺旋状の軌跡を描いて薬液を塗布することにより、被処理基板上に液膜を形成する液膜形成装置において、前記被処理基板の上方を覆う蓋体の被処理基板側に、前記径方向の中心側が厚くて前記径方向の外周側が薄い断面形状となるようなテーパ面を形成し、前記薬液供給部から前記薬液を吐出する塗布開始位置を、前記径方向の外周側に設定し、前記薬液の塗布終了位置を前記被処理基板の中心側に設定することを特徴とする。
【００１２】
したがって、（４）に係る液膜形成装置によれば、回転する被処理基板上の塗布開始位置である径方向の外周側から乾燥が始まり、塗布終了位置である径方向の中心側の乾燥が最後になる場合、径方向の中心側が厚くて外周側が薄い断面形状となるようなテーパ面を被処理基板側に形成した蓋体でもって、前記被処理基板の上方を覆うと、径方向の中心側から外周側へ向かう気流が生じるために、塗布開始位置である径方向の外周側の上方において、溶剤の雰囲気を密にする。これにより、被処理基板上の塗布開始位置である径方向の外周側と、塗布終了位置である径方向の中心側との乾燥度の違いの発生をなるべく防止でき、被処理基板上の最初に塗布した部分の薬液の流動性を確保して、薬液中の固形分を分散させることができるので、できるだけ均一な液膜を形成することができる。
【００１３】
また、前記目的を達成するため、本発明の液膜形成方法は、次のような構成により、続いて説明する作用、効果を示す。
（５）回転する被処理基板に対してその上を径方向に移動する薬液供給部から薬液を吐出し、被処理基板上に螺旋状の軌跡を描いて薬液を塗布することにより、被処理基板上に液膜を形成する液膜形成方法において、前記被処理基板の径方向の中心側より、前記薬液の塗布を開始し、前記径方向の外周側で前記薬液の塗布を終了する場合、前記径方向の中心側が薄くて前記径方向の外周側が厚い断面形状となるようなテーパ面を被処理基板側に形成した蓋体でもって、前記被処理基板の上方を覆って乾燥させることを特徴とする。
【００１４】
したがって、（５）に係る液膜形成方法によれば、回転する被処理基板上の最初に塗布した径方向の中心側から乾燥が始まり、最後に塗布した径方向の外周側の乾燥が最後になる場合、径方向の中心側が薄くて外周側が厚い断面形状となるようなテーパ面を被処理基板側に形成した蓋体でもって、前記被処理基板の上方を覆って乾燥させると、径方向の外周側から中心側へ向かう気流が生じるために、塗布開始位置である径方向の中心側の上方において、溶剤の雰囲気を密にする。これにより、被処理基板上の最初に塗布した径方向の中心側と、最後に塗布した径方向の外周側との乾燥度の違いの発生をなるべく防止でき、できるだけ均一な液膜を形成することができる。
【００１５】
（６）回転する被処理基板に対してその上を径方向に移動する薬液供給部から薬液を吐出し、被処理基板上に螺旋状の軌跡を描いて薬液を塗布することにより、被処理基板上に液膜を形成する液膜形成方法において、前記被処理基板の径方向の外周側より、前記薬液の塗布を開始し、前記被処理基板の中心側で前記薬液の塗布を終了する場合、前記径方向の中心側が厚くて前記径方向の外周側が薄い断面形状となるようなテーパ面を被処理基板側に形成した蓋体でもって、前記被処理基板の上方を覆って乾燥させることを特徴とする。
【００１６】
したがって、（６）に係る液膜形成方法によれば、回転する被処理基板上の最初に塗布した径方向の外周側から乾燥が始まり、最後に塗布した径方向の中心側の乾燥が最後になる場合、径方向の中心側が厚くて外周側が薄い断面形状となるようなテーパ面を被処理基板側に形成した蓋体でもって、前記被処理基板の上方を覆って乾燥させると、径方向の中心側から外周側へ向かう気流が生じるために、塗布開始位置である径方向の外周側の上方において、溶剤の雰囲気を密にする。これにより、被処理基板上の最初に塗布した径方向の外周側と、最後に塗布した径方向の中心側の乾燥度の違いの発生をなるべく防止して、できるだけ均一な液膜を形成することができる。
【００１７】
【発明の実施の形態】
以下、本発明に係る液膜形成方法、または液膜形成装置につき具体化した実施形態に基づいて図面参照しつつ詳細に説明する。図１は、本実施の形態の液膜形成装置を示す模式図である。
【００１８】
螺旋塗布装置１の装置本体２の底面側には、回転駆動モータを備える回転駆動部３が配置され、回転駆動部３から上方に突き出る回転軸３ａの嵌合凹部３ｂに回転テーブル４の下方に突き出る嵌合凸部４ａがはめ込まれている。回転テーブル４の上面には、多孔質からなる円盤状の吸着プレート５が設けられている。吸着プレート５の下方には、吸引用管部５ａが嵌合凸部４ａ及び回転軸３ａを上下方向に貫通するように設けられ、回転軸３ａを覆う処理容器支持部Ｑを水平方向に貫通する吸引用管部Ｑ１が吸引用管部５ａと連結するので、吸引用管部Ｑ１及び吸引用管部５ａを介して吸引装置（図示せず）が、吸着プレート５はその上に載置された被処理基板１０を真空吸着して固定する。そのため、被処理基板１０を回転軸３ａに対してセンタリングした後、被処理基板１０を吸着プレート５を介して吸引する回転テーブル４は、回転駆動部３の回転出力によって所定の回転速度で回転するように構成されている。
【００１９】
処理容器支持部Ｑ上には、被処理基板１０の形状に沿った空間を有する処理容器６が支持され、処理容器６は回転テーブル４及びその上の被処理基板１０を包み込むような形状になっている。そして、その処理容器６の蓋体６ａには、その上から被処理基板１０に対して薬液を落とすためのスリット６ｓが径方向に形成されている。スリット６ｓは、回転テーブル４の中心、すなわち載置された被処理基板の中心から液膜の最外径となる位置まで直線状に切り欠かれている。
【００２０】
装置本体２内には、被処理基板１０へ薬液を塗布するための薬液供給部としての薬液供給ノズル８が移動可能に設けられており、この薬液供給ノズル８は、被処理基板１０の径方向に沿ったスリット６ｓ上を移動できるように処理容器６上に構成されている。具体的には、スライドレール１１とノズル移動モータ１２に連結された回転軸１３とが並設されており、スライドレール１１を摺動して直線往復運動するため、薬液供給ノズル８と回転軸１３との間には、ノズル移動モータ１２の回転力を薬液供給ノズル８の直線運動に変えるボールネジや磁気ネジが構成されている。
【００２１】
薬液供給ノズル８は、薬液を収容した薬液タンク１５に対し、薬液供給ポンプ１６を介してチューブ１７ａ、１７ｂによって接続されている。この薬液供給ポンプ１６は、空気圧供給弁１８からの空気圧によってポンプ室２５上に設けられたダイヤフラム２１を動作させることによって、薬液タンク１５から薬液供給ノズル８へと薬液を所定の圧力で供給するようにしたものである。薬液供給ポンプ１６には、薬液の吐出圧力を検出する圧力センサ２２が内蔵されており、ポンプ室２５の入力側及び出力側には、ポンプ室２５に薬液を蓄えて所定圧で供給するための、薬液供給遮断弁２３と薬液排出遮断弁２４とがそれぞれ設けられている。このような構成により、薬液供給ノズル８から、安定した噴流の薬液が被処理基板１０に対して吐出されることになる。
【００２２】
螺旋塗布装置１は、被処理基板１０の回転数、薬液供給ノズル８の移動速度、そして薬液供給ノズル８からの薬液供給速度（薬液の吐出圧力）をパラメータとして、これらを同時に制御するように構成されており、回転駆動部３に対しては回転用コントローラ３１が、ノズル移動モータ１２に対してはノズル移動用コントローラ３２が、また空気圧供給弁１８と圧力センサ２２にはポンプ用コントローラ３３がそれぞれ接続されている。そして、薬液が被処理基板上に供給される間、被処理基板１０の回転数、薬液供給ノズル８の駆動速度、及び薬液供給ノズル８からの薬液供給速度が各コントローラ３１、３２、３３により管理されるが、更にこれらにはメインコントローラ３０が接続され統括管理できるように構成されている。
【００２３】
螺旋塗布装置１の場合、薬液供給ノズル８から吐出される微細噴流の薬液を、回転する被処理基板１０に対して螺旋状に塗布するいわゆる螺旋塗布を実行する。そのため、回転駆動部３によって回転テーブル４に回転が与えられ、螺旋塗布の実行時には、吸着プレート５に保持された被処理基板１０は、回転駆動部３の出力に応じた所定の回転速度で回転する。また、薬液タンク１５内の薬液が薬液供給ポンプ１６によって薬液供給ノズル８へ圧送され、所定の供給速度の微細噴流となった薬液が、薬液供給ノズル８から直下に吐出されるので、薬液は細い流線となって途切れることなく吐出され、薬液供給ノズル８が被処理基板１０に対して相対的に移動する間に、スリット６ｓを通って被処理基板１０上に供給される。
【００２４】
被処理基板１０に対する薬液の供給は、その中心側から外周側に向けて、又は外周側から中心側に向けて薬液供給ノズル８が移動する際に行われる。薬液供給ノズル８の移動は、ノズル移動モータ１２の駆動によって行われ、回転軸１３に回転が与えられると、その回転が不図示のボールネジや磁気ネジによって薬液供給ノズル８の直線運動に変換される。そのため、薬液供給ノズル８は、スライドレール１１を摺動してスリット６ｓの上方を、吐出口が真下になる姿勢を崩さずに移動していく。そして、薬液供給ノズル８による被処理基板１０全面の塗布の終了後に、薬液供給ノズル８を被処理基板１０以外に退避させ、薬液の吐出を終了するが、被処理基板１０上の液膜を均一にするため、塗布の終了後に更に回転を継続することにより、レベリング処理を行う。
【００２５】
図２は、螺旋塗布のイメージ図であるが、液膜形成時には、回転する被処理基板１０に対して径方向に移動する薬液供給ノズル８から薬液が吐出されると、被処理基板１０上には、図示するように微細噴流の薬液が流線になって渦巻き状に順次供給されていく。そして渦巻き状に供給された薬液は広がって隣接する薬液同士が結合し、被処理基板１０上には一つの液膜が形成される。
図３は、処理容器６内の構成及び回転駆動部３等を拡大して示す断面図である。被処理基板１０の上方を覆う蓋体６ａの被処理基板１０側には、前記径方向の中心側６ｘが薄くて前記径方向の外周側６ｙが厚い断面形状となるようなテーパ面６ｚが形成されている。そのため、蓋体６ａの径方向の中心側６ｘは、被処理基板１０上に大きい空間（空間長さＬ１＝５．５ｍｍ）が形成されているのに対して、蓋体６ａの径方向の外周側６ｙは、被処理基板１０上に小さい空間（空間長さＬ２＝３．５ｍｍ）が形成されることになる。この場合、蓋体６ａの径方向の中心から径方向の最外周までの距離はおよそ１２０ｍｍであり、また、被処理基板１０上の小さい空間（空間長さＬ２＝３．５ｍｍ）は、被処理基板１０上の大きい空間（空間長さＬ１＝５．５ｍｍ）のおよそ６割程度となる。
【００２６】
図４は、図３の場合の気流の流れ等を示すイメージ図である。蓋体６ａの被処理基板１０側に中心側６ｘから外周側６ｙに向かって下るテーパ面６ｚが形成されている場合、薬液供給ノズル８から薬液を吐出する塗布開始位置を、被処理基板１０の前記径方向の中心側１０ａに設定し、薬液の塗布終了位置を被処理基板１０の径方向の外周側１０ｂに設定する。すると、図４に示すように、被処理基板１０上から揮発する薬液には、外周側１０ｂから中心側１０ａへ向かう気流Ｋ１が生じるために、被処理基板１０上の径方向の中心側１０ａの上方において、溶剤の雰囲気の密の部分Ｋ２を形成することになる。その結果、被処理基板１０上の最初に塗布した径方向の中心側１０ａと、最後に塗布した径方向の外周側１０ｂとの乾燥度の時間的な違いの発生をなるべく防止でき、特に径方向の中心側１０ａにおいて、被処理基板１０上の薬液の流動性を確保して、薬液中の固形分を分散させることができるので、できるだけ均一な液膜を形成することができる。
【００２７】
ここで被処理基板１０の上方を覆う蓋体６ａの被処理基板１０側にテーパ面６ｚを形成しない場合、すなわち、平板状の場合を図５に示すが、図３と同一の部材については同一の符号を付してその説明を省略する。この場合、図５に示すように、蓋体６ａの径方向の中心側６ｘから径方向の外周側６ｙに亘って、被処理基板１０上に一定幅の空間（空間長さＬ３＝３．５ｍｍ）が形成されることになる。その場合の被処理基板１０上の空間における薬液塗布時濃度分布を、図６に示す。
図６は横軸に被処理基板１０上の塗布開始位置（０ｍｍ）から塗布終了位置（最大１００ｍｍ程度）までの位置を表し、縦軸に被処理基板１０から上方へ向かっての距離（最大３．０ｍｍ程度）を表し、グラフは揮発した薬液の同一濃度のポイントを結んだ場合の分布を表している。薬液は有機溶剤を含み、その有機溶剤は塗布するためのものであるが、被処理基板１０上に塗布されると、揮発する性質がある。
このグラフによると、薬液塗布時濃度分布には、塗布開始位置（０ｍｍ）から塗布終了位置（１００ｍｍ）に向かって濃淡があり、また、被処理基板１０から上方へ向かって濃淡があることが分かり、これは塗布開始位置（０ｍｍ）から乾燥が始まり、塗布終了位置（１００ｍｍ）で、乾燥が最後になることを意味している。
【００２８】
こうして形成された被処理基板１０上の液膜は、その後、液膜中にある溶剤を乾燥除去する乾燥除去工程が行われるが、その乾燥除去工程によって、液膜の膜厚は薄くなる。ここで、乾燥除去工程後の液膜の膜厚の状態を、図７及び図８に示す。図７は、被処理基板１０の上方を覆う蓋体６ａが平板状の場合の塗布開始位置（０ｍｍ）から塗布終了位置（１００ｍｍ）までの位置と被処理基板１０上の膜厚との関係を示す。それに対し、図８は、被処理基板１０の上方を覆う蓋体６ａの被処理基板１０側にテーパ面６ｚを形成する場合の塗布開始位置（０ｍｍ）から塗布終了位置（１００ｍｍ）までの位置と被処理基板１０上の膜厚との関係を示す。
それによると、図７は、膜厚４０００オングストロームを基準として上下に大きく振れがあるのに対して、図８は、膜厚４０００オングストロームを基準として上下の振れが少ない。これは、被処理基板１０の上方を覆う蓋体６ａが平板状の場合（図７参照）、膜厚４０００オングストロームを基準として上下に大きく振れて、膜厚が均一でないのに対して、被処理基板１０の上方を覆う蓋体６ａの被処理基板１０側にテーパ面６ｚを形成する場合（図８参照）、膜厚４０００オングストロームを基準として上下の振れが少なく、図７の場合に比べて、膜厚が均一であることを意味する。
【００２９】
このような結果は、被処理基板１０の上方を覆う蓋体６ａの被処理基板１０側にテーパ面６ｚを形成するので、被処理基板１０上から揮発する薬液には、径方向の外周側１０ｂから中心側１０ａへ向かう気流Ｋ１が生じるために（図４参照）、被処理基板１０上の径方向の中心側１０ａの上方において、溶剤の雰囲気の密の部分Ｋ２が形成され、特に径方向の中心側１０ａにおいて、被処理基板上の最初に塗布した部分の薬液の流動性を確保して、薬液中の固形分を分散させることができると推察できるのに対して、被処理基板１０の上方を覆う蓋体６ａの被処理基板１０側にテーパ面６ｚを形成しない平板の場合、このような現象が生じないと推察できる。
薬液供給ノズル８から薬液を吐出して薬液を被処理基板１０に塗布した後、被処理基板１０の上方を蓋体６ａで覆った状態で、被処理基板１０を更に一定時間回転させ続け、蓋体６ａを開けた状態で一定時間だけ回転数を変化させるレベリングを行う。その後、被処理基板１０を、図９に示す乾燥室Ｈ１内に移してベイクして乾燥させるが、ベイクにより有機溶剤が抜けることになる。図９は、乾燥室Ｈ１内を示すイメージ図である。
【００３０】
乾燥室Ｈ１は、図９に示すように、底面部にヒ−タＨ２を備える密閉空間となっており、ヒ−タＨ２と被処理基板１０とが直接に接触しないように、ヒ−タＨ２上に断熱支持材Ｈ３が設けられ、断熱支持材Ｈ３上に被処理基板１０が支持されている。その被処理基板１０の下側には、溶剤雰囲気が回り込まない程度の空間（高さ５ｍｍ程度）が設けられている。この場合、被処理基板１０の径方向の中心側より薬液の塗布を開始し、前記径方向の外周側で前記薬液の塗布を終了するので、乾燥室Ｈ１は、径方向の中心側６ｘが薄くて径方向の外周側６ｙが厚い断面形状となるようなテーパ面６ｚを被処理基板側１０に形成した蓋体６ａでもって前記被処理基板１０の上方を覆って乾燥させる。
このような蓋体６ａでもって、前記被処理基板１０の上方を覆って乾燥させると、径方向の外周側１０ｂから中心側１０ａへ向かう気流Ｋ１が生じるために、塗布開始位置である径方向の中心側１０ａの上方において、溶剤の雰囲気が密になる部分Ｋ２が形成される。そして、被処理基板１０の上方の溶剤雰囲気が飽和状態の場合、特に径方向の中心側において、被処理基板１０上の最初に塗布した径方向の中心側１０ａと、最後に塗布した径方向の外周側１０ｂとの乾燥度の違いの発生をなるべく防止して、できるだけ均一な液膜を形成することができる。
【００３１】
以上説明したように、本実施の形態によれば、回転する被処理基板１０に対してその上を径方向に移動する薬液供給ノズル８から薬液を吐出し、被処理基板１０上に螺旋状の軌跡を描いて薬液を塗布することにより、被処理基板１０上に液膜を形成する螺旋塗布装置１において、被処理基板１０の上方を覆う蓋体６ａの被処理基板１０側に、径方向の中心側６ｘが薄くて前記径方向の外周側６ｙが厚い断面形状となるようなテーパ面６ｚを形成し、前記薬液供給ノズル８から前記薬液を吐出する塗布開始位置を、前記被処理基板１０の前記径方向の中心側１０ａに設定し、薬液の塗布終了位置を前記被処理基板１０の径方向の外周側１０ｂに設定するので、塗布開始位置である径方向の中心側１０ａから乾燥が始まり、塗布終了位置である径方向の外周側１０ｂの乾燥が最後になる場合、前記蓋体６ａでもって、前記被処理基板１０の上方を覆って乾燥させると、外周側１０ｂから中心側１０ａへ向かう気流Ｋ１が生じるために、塗布開始位置である径方向の中心側１０ａの上方において、溶剤の雰囲気に密の部分Ｋ２が形成される。これにより、被処理基板１０上の塗布開始位置である径方向の中心側１０ａと、塗布終了位置である径方向の外周側１０ｂとの乾燥度の時間的な違いの発生をなるべく防止でき、被処理基板１０上の最初に塗布した部分の薬液の流動性を確保して、レベリングにより薬液中の固形分を分散させることができるので、できるだけ均一な液膜を形成することができる。
【００３２】
次に、他の実施の形態について、図１０乃至図１２を参照して説明する。
図１０は、他の実施の形態の液膜形成装置の要部を拡大して示す断面図であり、図１１は、図１０の場合の気流の流れ等を示すイメージ図であり、図１２は、乾燥室内を示すイメージ図である。図１０乃至図１２に示す部材については、図３、図４及び図９に示す部材と同一の部材についてはそれぞれ同一の符号を付して詳細な説明を省略する。被処理基板１０の上方を覆う蓋体６ａの被処理基板１０側には、径方向の中心側６ｘが厚くて前記径方向の外周側６ｙが薄い断面形状となるようなテーパ面６ｗが形成されている。そのため、蓋体６ａの径方向の中心側６ｘは、被処理基板１０上に小さい空間（空間長さＬ４＝１．５ｍｍ）が形成されているのに対して、蓋体６ａの径方向の外周側６ｙは、被処理基板１０上に大きい空間（空間長さＬ５＝３．５ｍｍ）が形成されることになる。
【００３３】
このように蓋体６ａの被処理基板１０側に径方向の外周側６ｙから中心側６ｘに向かって下るテーパ面６ｗが形成されている場合、薬液供給ノズル８から薬液を吐出する塗布開始位置を、前記被処理基板１０の前記径方向の外周側１０ｂに設定し、前記薬液の塗布終了位置を前記被処理基板１０の径方向の中心側１０ａに設定すると、図１１に示すように、被処理基板１０上から揮発する薬液には、中心側１０ａから外周側１０ｂへ向かう気流Ｋ３が生じるために、被処理基板１０上の径方向の外周側１０ｂの上方において、溶剤の雰囲気の密の部分Ｋ４を形成する。
【００３４】
このように径方向の外周側１０ｂの上方における溶剤の雰囲気の密の部分Ｋ４が形成されると、被処理基板１０上の塗布開始位置である径方向の外周側１０ｂと、塗布終了位置である径方向の中心側１０ａとの乾燥度の時間的な違いの発生をなるべく防止できる。そのため、特に径方向の外周側１０ｂにおいて、被処理基板１０上の薬液の流動性を確保して、レベリングにより薬液中の固形分を分散させることができるので、できるだけ均一な液膜を形成することができると推察される。
【００３５】
また、薬液供給ノズル８から薬液を吐出して薬液を塗布した後、被処理基板１０を、図１２に示す乾燥室Ｈ１内に移してベイクして乾燥させる。乾燥室Ｈ１は、底面部にヒ−タＨ２を備える密閉空間となっており、ヒ−タＨ２上に断熱支持材Ｈ３が設けられ、断熱支持材Ｈ３上に被処理基板１０が支持されている。この場合、被処理基板１０の径方向の外周側１０ｂより、薬液の塗布を開始し、被処理基板１０の中心側１０ａで薬液の塗布を終了するので、乾燥室Ｈ１は、径方向の中心側６ｘが厚くて径方向の外周側６ｙが薄い断面形状となるようなテーパ面６ｗを被処理基板１０側に形成した蓋体６ａでもって被処理基板１０の上方を覆って乾燥させる。
このようなテーパ面６ｗを備える蓋体６ａでもって、前記被処理基板１０の上方を覆って乾燥させると、径方向の中心側１０ａから外周側１０ｂへ向かう気流Ｋ３が生じるために、塗布開始位置である径方向の外周側１０ｂの上方において、溶剤の雰囲気が密になる部分Ｋ４が形成される。これにより、被処理基板１０上の塗布開始位置である径方向の外周側１０ｂと、塗布終了位置である径方向の中心側１０ａとの乾燥度の時間的な違いの発生をなるべく防止できる。そして、特に径方向の外周側１０ｂにおいて、被処理基板１０上の薬液の流動性を確保して、薬液中の固形分を分散させることができるので、できるだけ均一な液膜を形成することができる。
【００３６】
以上説明したように、他の実施の形態によれば、回転する被処理基板１０に対してその上を径方向に移動する薬液供給ノズル８から薬液を吐出し、被処理基板１０上に螺旋状の軌跡を描いて薬液を塗布することにより、被処理基板１０上に液膜を形成する螺旋塗布装置１において、前記被処理基板１０の上方を覆う蓋体６ａの被処理基板１０側に、前記径方向の中心側６ｘが厚くて前記径方向の外周側６ｙが薄い断面形状となるようなテーパ面６ｗを形成し、前記薬液供給ノズル８から前記薬液を吐出する塗布開始位置を、前記径方向の外周側１０ｂに設定し、前記薬液の塗布終了位置を前記被処理基板１０の中心側１０ａに設定する。それにより、回転する被処理基板１０上の塗布開始位置である径方向の外周側１０ｂから乾燥が始まり、塗布終了位置である径方向の中心側１０ａの乾燥が最後になる場合、径方向の中心側６ｘが厚くて外周側６ｙが薄い断面形状となるようなテーパ面を被処理基板１０側に形成した蓋体６ａでもって、前記被処理基板１０の上方を覆うと、中心側１０ａから外周側１０ｂへ向かう気流Ｋ３が生じるために、塗布開始位置である径方向の外周側１０ｂの上方において、溶剤の雰囲気に密の部分Ｋ４が形成される。これにより、被処理基板１０上の塗布開始位置である径方向の外周側１０ｂと、塗布終了位置である径方向の中心側１０ａとの乾燥度の時間的な違いの発生をなるべく防止できる。そして、特に径方向の外周側１０ｂにおいて、被処理基板１０上の薬液の流動性を確保して、薬液中の固形分を分散させることができるので、できるだけ均一な液膜を形成することができる。
【００３７】
尚、径方向の中心側６ｘが厚くて前記径方向の外周側６ｙが薄い断面形状となるようなテーパ面６ｗを形成した蓋体６ａと、径方向の中心側６ｘが薄くて前記径方向の外周側６ｙが厚い断面形状となるようなテーパ面６ｚを形成した蓋体６ａとは、被処理基板１０側のテーパ面が異なるにすぎず、その他同一形状であるので、必要に応じて蓋体６ａを取り替えることができる。それにより、塗布開始位置を被処理基板１０の径方向の中心側１０ａに設定するとともに、薬液の塗布終了位置を被処理基板１０の径方向の外周側１０ｂに設定した場合、乾燥工程において、径方向の中心側６ｘが薄くて前記径方向の外周側６ｙが厚い断面形状となるようなテーパ面６ｚを形成した蓋体６ａを使用するのに対して、塗布開始位置を被処理基板１０の径方向の外周側１０ｂに設定するとともに、薬液の塗布終了位置を被処理基板１０の径方向の中心側１０ａに設定した場合、乾燥工程において、径方向の中心側６ｘが厚くて前記径方向の外周側６ｙが薄い断面形状となるようなテーパ面６ｗを形成した蓋体６ａを使用することができる。
尚、本発明の実施の形態は上述した例に限らず、様々な形態に応用が可能である。例えば、実施の形態では半導体製造装置で製造される半導体ウエハ等の被処理基板に適用したが、別の被処理基板などにも適用可能である。
【００３８】
【発明の効果】
以上説明した通り、（１）に係る発明によれば、回転する被処理基板に対してその上を径方向に移動する薬液供給部から薬液を吐出し、被処理基板上に螺旋状の軌跡を描いて薬液を塗布することにより、被処理基板上に液膜を形成する液膜形成方法において、前記径方向の中心側が薄くて前記径方向の外周側が厚い断面形状となるようなテーパ面を被処理基板側に形成した蓋体でもって前記被処理基板の上方を覆い、前記被処理基板の径方向の中心側より、前記薬液の塗布を開始し、前記径方向の外周側で前記薬液の塗布を終了するので、最初に塗布した径方向の中心側から乾燥が始まり、最後に塗布した径方向の外周側の乾燥が最後になる場合、前記蓋体でもって、前記被処理基板の上方を覆うと、外周側から中心側へ向かう気流が生じるために、塗布開始位置である径方向の中心側の上方において、溶剤の雰囲気が密になる。これにより、被処理基板上の最初に塗布した径方向の中心側と、最後に塗布した径方向の外周側との乾燥度の違いの発生をなるべく防止できる。そして、特に径方向の中心側において、被処理基板上の最初に塗布した部分の薬液の流動性を確保して、薬液中の固形分を分散させることができるので、できるだけ均一な液膜を形成することができる。
【００３９】
また、（２）に係る発明によれば、回転する被処理基板に対してその上を径方向に移動する薬液供給部から薬液を吐出し、被処理基板上に螺旋状の軌跡を描いて薬液を塗布することにより、被処理基板上に液膜を形成する液膜形成方法において、前記径方向の中心側が厚くて前記径方向の外周側が薄い断面形状となるようなテーパ面を被処理基板側に形成した蓋体でもって前記被処理基板の上方を覆い、前記被処理基板の径方向の外周側より、前記薬液の塗布を開始し、前記被処理基板の中心側で前記薬液の塗布を終了するので、最初に塗布した径方向の外周側から乾燥が始まり、最後に塗布した径方向の中心側の乾燥が最後になる場合、前記蓋体でもって、前記被処理基板の上方を覆うと、径方向の中心側から外周側へ向かう気流が生じるために、塗布開始位置である径方向の外周側の上方において、溶剤の雰囲気が密になる。これにより、被処理基板上の最初に塗布した径方向の外周側と、最後に塗布した径方向の中心側の乾燥度の違いの発生をなるべく防止できる。そして、特に径方向の外周側において、被処理基板上の最初に塗布した部分の薬液の流動性を確保して、薬液中の固形分を分散させることができるので、できるだけ均一な液膜を形成することができる。
【００４０】
また、（３）に係る発明によれば、回転する被処理基板に対してその上を径方向に移動する薬液供給部から薬液を吐出し、被処理基板上に螺旋状の軌跡を描いて薬液を塗布することにより、被処理基板上に液膜を形成する液膜形成装置において、前記被処理基板の上方を覆う蓋体の被処理基板側に、前記径方向の中心側が薄くて前記径方向の外周側が厚い断面形状となるようなテーパ面を形成し、前記薬液供給部から前記薬液を吐出する塗布開始位置を、前記径方向の中心側に設定し、前記薬液の塗布終了位置を前記径方向の外周側に設定するので、塗布開始位置である径方向の中心側から乾燥が始まり、塗布終了位置である径方向の外周側の乾燥が最後になる場合、前記蓋体でもって、前記被処理基板の上方を覆うと、外周側から中心側へ向かう気流が生じるために、塗布開始位置である径方向の中心側の上方において、溶剤の雰囲気が密になる。これにより、被処理基板上の塗布開始位置である径方向の中心側と、塗布終了位置である径方向の外周側との乾燥度の違いの発生をなるべく防止できる。そして、特に径方向の中心側において、被処理基板上の最初に塗布した部分の薬液の流動性を確保して、薬液中の固形分を分散させることができるので、できるだけ均一な液膜を形成することができる。
【００４１】
また、（４）に係る発明によれば、回転する被処理基板に対してその上を径方向に移動する薬液供給部から薬液を吐出し、被処理基板上に螺旋状の軌跡を描いて薬液を塗布することにより、被処理基板上に液膜を形成する液膜形成装置において、前記被処理基板の上方を覆う蓋体の被処理基板側に、前記径方向の中心側が厚くて前記径方向の外周側が薄い断面形状となるようなテーパ面を形成し、前記薬液供給部から前記薬液を吐出する塗布開始位置を、前記径方向の外周側に設定し、前記薬液の塗布終了位置を前記被処理基板の中心側に設定するので、塗布開始位置である径方向の外周側から乾燥が始まり、塗布終了位置である径方向の中心側の乾燥が最後になる場合、前記蓋体でもって、前記被処理基板の上方を覆うと、径方向の中心側から外周側へ向かう気流が生じるために、塗布開始位置である径方向の外周側の上方において、溶剤の雰囲気が密になる。これにより、被処理基板上の塗布開始位置である径方向の外周側と、塗布終了位置である径方向の中心側との乾燥度の違いの発生をなるべく防止できる。そして、特に径方向の外周側において、被処理基板上の最初に塗布した部分の薬液の流動性を確保して、薬液中の固形分を分散させることができるので、できるだけ均一な液膜を形成することができる。
【００４２】
また、（５）に係る発明によれば、回転する被処理基板に対してその上を径方向に移動する薬液供給部から薬液を吐出し、被処理基板上に螺旋状の軌跡を描いて薬液を塗布することにより、被処理基板上に液膜を形成する液膜形成方法において、前記被処理基板の径方向の中心側より、前記薬液の塗布を開始し、前記径方向の外周側で前記薬液の塗布を終了する場合、前記径方向の中心側が薄くて前記径方向の外周側が厚い断面形状となるようなテーパ面を被処理基板側に形成した蓋体でもって、前記被処理基板の上方を覆って乾燥させるので、最初に塗布した径方向の中心側から乾燥が始まり、最後に塗布した径方向の外周側の乾燥が最後になり、前記蓋体でもって前記被処理基板の上方を覆って乾燥させると、径方向の外周側から中心側へ向かう気流が生じるために、塗布開始位置である径方向の中心側の上方において、溶剤の雰囲気が密になる。これにより、被処理基板上の最初に塗布した径方向の中心側と、最後に塗布した径方向の外周側との乾燥度の違いの発生をなるべく防止でき、できるだけ均一な液膜を形成することができる。
【００４３】
また、（６）に係る発明によれば、回転する被処理基板に対してその上を径方向に移動する薬液供給部から薬液を吐出し、被処理基板上に螺旋状の軌跡を描いて薬液を塗布することにより、被処理基板上に液膜を形成する液膜形成方法において、前記被処理基板の径方向の外周側より、前記薬液の塗布を開始し、前記被処理基板の中心側で前記薬液の塗布を終了する場合、前記径方向の中心側が厚くて前記径方向の外周側が薄い断面形状となるようなテーパ面を被処理基板側に形成した蓋体でもって、前記被処理基板の上方を覆って乾燥させるので、最初に塗布した径方向の外周側から乾燥が始まり、最後に塗布した径方向の中心側の乾燥が最後になり、前記蓋体でもって前記被処理基板の上方を覆って乾燥させると、径方向の中心側から外周側へ向かう気流が生じるために、塗布開始位置である径方向の外周側の上方において、溶剤の雰囲気が密になる。これにより、被処理基板上の最初に塗布した径方向の外周側と、最後に塗布した径方向の中心側の乾燥度の違いの発生をなるべく防止でき、できるだけ均一な液膜を形成することができる。
【図面の簡単な説明】
【図１】 本実施の形態の液膜形成装置全体を示す模式図である。
【図２】 螺旋塗布のイメージ図である。
【図３】 本実施の形態の液膜形成装置の要部を拡大して示す断面図である。
【図４】 図３の場合の気流の流れ等を示すイメージ図である。
【図５】 比較のために示す一般的な液膜形成装置要部を拡大断面図である。
【図６】 図５の場合の薬液塗布時濃度分布を示す図である。
【図７】 図５の装置で形成された膜厚と位置との関係を示すグラフ図である。
【図８】 図３の装置で形成された膜厚と位置との関係を示すグラフ図である。
【図９】 乾燥室を示すイメージ図である。
【図１０】 他の実施の形態の液膜形成装置の要部を拡大して示す断面図である。
【図１１】 図１０の場合の気流の流れ等を示すイメージ図である。
【図１２】 乾燥室を示すイメージ図である。
【符号の説明】
１ 螺旋塗布装置（液膜形成装置）
２ 装置本体
３ 回転駆動部
４ 回転テーブル
６ 処理容器
６ｓ スリット
６ａ 蓋体
６ｘ 蓋体の径方向の中心側
６ｙ 蓋体の径方向の外周側
６ｚ テーパ面
６ｗ テーパ面
８ 薬液供給ノズル（薬液供給部）
１０ 被処理基板
１０ａ 径方向の中心側
１０ｂ 径方向の外周側
Ｋ１ 気流
Ｋ２ 溶剤雰囲気の密の部分
Ｋ３ 気流
Ｋ４ 溶剤雰囲気の密の部分[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to a liquid film forming method and a liquid film forming apparatus for forming a film by applying a chemical solution to a substrate to be processed so as to draw a spiral trajectory, and more specifically, formed on a substrate to be processed. The present invention relates to a liquid film forming method and a liquid film forming apparatus that can achieve uniform liquid film.
[0002]
[Prior art]
  In a lithography process in semiconductor device manufacturing, a spin coating method has been employed as a liquid film forming method for applying a chemical solution to the surface of a substrate to be processed. However, this method is wasteful because a large amount of chemical solution is scattered from the wafer surface, and the chemical solution thus discharged has an environmental impact. Further, in the case of a square substrate or a large circular substrate of 12 inches or more, there is a problem that turbulence is generated at the outer peripheral portion of the substrate and the film thickness becomes non-uniform.
  Therefore, conventionally, as a method for making the film thickness uniform or reducing the amount of the chemical solution to be used, in JP 2000-288450 A and JP 2000-350955 A, etc. A liquid film forming method is employed in which a chemical solution is discharged while the chemical solution supply nozzle is moved in the radial direction, and the chemical solution is applied to the substrate to be processed so as to draw a spiral trajectory.
[0003]
  In the publication, when the liquid film is formed, when moving on the substrate to be processed, the resist liquid is discharged from the chemical liquid supply nozzle, the chemical liquid supply speed at the time of the discharge, the movement of the chemical liquid supply nozzle, the movement It describes that the speed, the rotation of the substrate, and the rotation speed thereof are appropriately controlled.
  That is, in the method of Japanese Patent Laid-Open No. 2000-288450, for example, regarding the discharge of the chemical solution from the chemical solution supply nozzle, when the chemical solution supply nozzle is moved on the substrate, the discharge of the chemical solution is continued or on the substrate of the chemical solution supply nozzle Depending on the position, the discharge of the chemical solution is interrupted to make the film thickness uniform and reduce the amount of resist used. In the method disclosed in Japanese Patent Laid-Open No. 2000-350955, the amount of the chemical solution supplied is gradually increased while the chemical solution supply nozzle is moved so that the amount of the chemical solution applied per unit area is equal between the central portion and the peripheral portion of the substrate. Thus, a uniform film is formed.
[0004]
[Problems to be solved by the invention]
  However, when the chemical solution is applied to the substrate to be processed, the chemical solution begins to dry immediately after the application, and therefore, there is a difference in the dryness of the chemical solution between the first applied location and the last applied location on the processed substrate. Due to the difference in dryness, there is a problem that a uniform liquid film cannot be formed.
  Therefore, in order to solve the above-described problem, the present invention prevents the occurrence of a difference in dryness between the place where the chemical solution is first applied on the substrate to be processed and the place where the chemical solution is applied last, as much as possible. It is an object to provide an excellent liquid film forming method or liquid film forming apparatus capable of forming a uniform liquid film.
[0005]
[Means for Solving the Problems]
  To achieve the purposeThe liquid film forming method of the present invention exhibits the following operations and effects with the following configuration.
(1)The liquid is discharged onto the substrate to be processed by discharging the chemical from a chemical supply unit that moves in a radial direction on the substrate to be rotated and applying the chemical on the substrate to be processed while drawing a spiral trajectory. In the liquid film forming method for forming a film, the substrate to be processed is formed with a lid formed on the substrate to be processed such that a taper surface is formed on the substrate side with a thin central shape in the radial direction and a thick sectional shape on the outer peripheral side in the radial direction. Covering the upper side, the application of the chemical solution is started from the radial center side of the substrate to be processed, and the application of the chemical solution is terminated on the outer peripheral side in the radial direction.
[0006]
  Therefore, (1)According to the method for forming a liquid film according to the present invention, when drying starts from the center side of the first radial direction applied on the rotating substrate to be processed, and when the drying of the outer peripheral side of the last applied radial direction ends last, the radial direction When the upper side of the substrate to be processed is covered with a lid having a tapered surface on the substrate side to be processed which has a thin cross-sectional shape on the center side and a thick outer periphery side, an air flow from the outer periphery side toward the center side is generated. In addition, the solvent atmosphere is made dense above the radial center as the application start position. As a result, it is possible to prevent the occurrence of a difference in dryness between the radially applied central side first on the substrate to be processed and the radially applied outer peripheral side as much as possible, and the first coating on the substrate to be processed is performed. Since the fluidity of the partial chemical liquid can be secured and the solid content in the chemical liquid can be dispersed, a liquid film that is as uniform as possible can be formed.
[0007]
(2)The liquid is discharged onto the substrate to be processed by discharging the chemical from a chemical supply unit that moves in a radial direction on the substrate to be rotated and applying the chemical on the substrate to be processed while drawing a spiral trajectory. In the liquid film forming method for forming a film, the substrate to be processed is provided with a lid formed on the substrate to be processed such that a taper surface having a thick central portion in the radial direction and a thin cross-sectional shape on the outer peripheral side in the radial direction is formed. Covering the upper side, the application of the chemical solution is started from the outer peripheral side in the radial direction of the substrate to be processed, and the application of the chemical solution is ended at the center side of the substrate to be processed.
[0008]
  Therefore, (2)According to the liquid film forming method according to the present invention, when drying starts from the radially outer peripheral side applied first on the rotating substrate to be processed and the last drying of the central side of the radial direction applied last is the radial direction. If the upper side of the substrate to be processed is covered with a lid having a taper surface on the substrate to be processed such that the center side of the substrate is thick and the outer peripheral side has a thin cross-sectional shape, an air flow from the center to the outer periphery is generated. Furthermore, the solvent atmosphere is made dense above the radially outer peripheral side which is the application start position. As a result, it is possible to prevent the difference in dryness between the radially outer peripheral side applied first on the substrate to be processed and the central side of the last radial direction applied as much as possible, and the first applied portion on the substrate to be processed Since the fluidity of the chemical solution can be ensured and the solid content in the chemical solution can be dispersed, a liquid film that is as uniform as possible can be formed.
[0009]
  Moreover, in order to achieve the said objective, the liquid film forming apparatus of this invention shows the effect | action and effect which are demonstrated subsequently by the following structures.
(3)The liquid is discharged onto the substrate to be processed by discharging the chemical from a chemical supply unit that moves in a radial direction on the substrate to be rotated and applying the chemical on the substrate to be processed while drawing a spiral trajectory. In the liquid film forming apparatus for forming a film, a taper surface having a thin cross-sectional shape on the side of the substrate to be processed covering the upper side of the substrate to be processed and having a thin central side in the radial direction and a thick outer peripheral side in the radial direction And the application start position for discharging the chemical solution from the chemical solution supply unit is set to the center side in the radial direction, and the application end position of the chemical solution is set to the outer peripheral side in the radial direction. .
[0010]
  Therefore, (3)According to the liquid film forming apparatus according to the present invention, when the drying starts from the radial center side that is the application start position on the rotating substrate to be processed and the drying on the outer peripheral side in the radial direction that is the application end position ends last, When the upper side of the substrate to be processed is covered with a lid body formed on the substrate to be processed such that the radial center side is thin and the outer peripheral side has a thick cross-sectional shape, from the radially outer side to the center side Since a flowing air flow is generated, the solvent atmosphere is made dense above the radial center that is the application start position. As a result, it is possible to prevent the occurrence of a difference in dryness between the radial center side as the coating start position on the substrate to be processed and the radial outer periphery side as the coating end position as much as possible. Since the fluidity of the applied chemical solution can be secured and the solid content in the chemical solution can be dispersed, a liquid film that is as uniform as possible can be formed.
[0011]
(4)The liquid is discharged onto the substrate to be processed by discharging the chemical from a chemical supply unit that moves in a radial direction on the substrate to be rotated and applying the chemical on the substrate to be processed while drawing a spiral trajectory. In a liquid film forming apparatus for forming a film, a tapered surface having a cross-sectional shape that is thick on the center side in the radial direction and thin on the outer peripheral side in the radial direction on the substrate side of the lid that covers the substrate to be processed Forming an application start position for discharging the chemical solution from the chemical solution supply unit on the outer peripheral side in the radial direction, and setting an application end position of the chemical solution on the center side of the substrate to be processed. To do.
[0012]
  Therefore, (4)According to the liquid film forming apparatus according to the present invention, when drying starts from the outer peripheral side in the radial direction, which is the application start position on the rotating substrate to be processed, and the drying on the central side in the radial direction, which is the application end position, ends. With a lid having a taper surface on the substrate side to be processed which has a thick radial center side and a thin cross section on the outer periphery side, if the upper side of the substrate to be processed is covered, from the radial center side to the outer periphery side Since a flowing air flow is generated, the solvent atmosphere is made dense above the radially outer peripheral side that is the application start position. As a result, it is possible to prevent the occurrence of a difference in dryness between the radial outer peripheral side, which is the coating start position on the substrate to be processed, and the radial central side, which is the coating end position, as much as possible. Since the fluidity of the applied chemical solution can be secured and the solid content in the chemical solution can be dispersed, a liquid film that is as uniform as possible can be formed.
[0013]
  Moreover, in order to achieve the said objective, the liquid film formation method of this invention shows the effect | action and effect which are demonstrated subsequently by the following structures.
(5)The liquid is discharged onto the substrate to be processed by discharging the chemical from a chemical supply unit that moves in a radial direction on the substrate to be rotated and applying the chemical on the substrate to be processed while drawing a spiral trajectory. In the liquid film forming method for forming a film, when the application of the chemical solution is started from the radial center side of the substrate to be processed and the application of the chemical solution is terminated on the outer peripheral side in the radial direction, A lid having a taper surface on the substrate side to be processed which has a thin center side and a thick cross-sectional shape on the outer peripheral side in the radial direction covers the upper side of the substrate to be processed and is dried.
[0014]
  Therefore, (5)According to the method for forming a liquid film according to the present invention, when drying starts from the center side of the first radial direction applied on the rotating substrate to be processed, and when the drying of the outer peripheral side of the last applied radial direction ends last, the radial direction When a cover body having a tapered surface formed on the substrate to be processed has a thin cross-sectional shape at the center side of the substrate and has a thick outer peripheral side, the upper side of the substrate to be processed is dried to cover the center side from the radially outer side. In order to generate an air flow toward the top, the solvent atmosphere is made dense above the radial center, which is the application start position. As a result, it is possible to prevent a difference in dryness between the radially applied central side on the substrate to be processed first and the radially applied outer peripheral side as much as possible, and to form a liquid film that is as uniform as possible. Can do.
[0015]
(6)The liquid is discharged onto the substrate to be processed by discharging the chemical from a chemical supply unit that moves in a radial direction on the substrate to be rotated and applying the chemical on the substrate to be processed while drawing a spiral trajectory. In the liquid film forming method for forming a film, when the chemical liquid starts to be applied from the outer peripheral side in the radial direction of the substrate to be processed and the chemical liquid application ends on the center side of the substrate to be processed, the radial direction And a lid having a taper surface on the substrate side to be processed which has a thick central side and a thin cross-sectional shape on the outer peripheral side in the radial direction.
[0016]
  Therefore, (6)According to the liquid film forming method according to the present invention, when drying starts from the radially outer peripheral side applied first on the rotating substrate to be processed and the last drying of the central side of the radial direction applied last is the radial direction. The lid has a tapered surface formed on the substrate to be processed such that the center side of the substrate is thick and the outer peripheral side has a thin cross-sectional shape. In order to generate an air flow toward the top, the solvent atmosphere is made dense above the radially outer peripheral side that is the application start position. As a result, it is possible to prevent the difference in dryness between the radially outer side first applied on the substrate to be processed and the center side of the last applied radial direction as much as possible, and form a liquid film as uniform as possible. Can do.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
  Hereinafter, a liquid film forming method or a liquid film forming apparatus according to the present invention will be described in detail with reference to the drawings based on embodiments embodied. FIG. 1 is a schematic view showing a liquid film forming apparatus according to the present embodiment.
[0018]
  On the bottom surface side of the device main body 2 of the spiral coating device 1, a rotation drive unit 3 including a rotation drive motor is disposed, and the fitting recess 3 b of the rotation shaft 3 a protruding upward from the rotation drive unit 3 is below the turntable 4. The protruding fitting convex portion 4a is fitted. On the upper surface of the turntable 4, a disk-like suction plate 5 made of a porous material is provided. Below the suction plate 5, a suction pipe portion 5a is provided so as to penetrate the fitting convex portion 4a and the rotary shaft 3a in the vertical direction, and penetrates the processing container support portion Q covering the rotary shaft 3a in the horizontal direction. Since the suction tube portion Q1 is connected to the suction tube portion 5a, a suction device (not shown) is placed on the suction plate 5 via the suction tube portion Q1 and the suction tube portion 5a. The substrate 10 to be processed is fixed by vacuum suction. Therefore, after the substrate 10 to be processed is centered with respect to the rotation shaft 3 a, the rotary table 4 that sucks the substrate 10 to be processed through the suction plate 5 rotates at a predetermined rotation speed by the rotation output of the rotation drive unit 3. It is configured as follows.
[0019]
  A processing container 6 having a space along the shape of the substrate to be processed 10 is supported on the processing container support portion Q, and the processing container 6 has a shape that encloses the turntable 4 and the substrate 10 to be processed thereon. ing. And the slit 6s for dropping a chemical | medical solution with respect to the to-be-processed substrate 10 from the top is formed in the cover body 6a of the processing container 6 in the radial direction. The slit 6s is cut out linearly from the center of the turntable 4, that is, from the center of the substrate to be processed to a position where the outermost diameter of the liquid film is reached.
[0020]
  A chemical solution supply nozzle 8 as a chemical solution supply unit for applying a chemical solution to the substrate 10 to be processed is movably provided in the apparatus main body 2. The chemical solution supply nozzle 8 is arranged in the radial direction of the substrate 10 to be processed. It is comprised on the processing container 6 so that it can move on the slit 6s along. Specifically, the slide rail 11 and the rotary shaft 13 connected to the nozzle moving motor 12 are arranged in parallel, and slide the slide rail 11 to reciprocate linearly. The ball screw and the magnetic screw which change the rotational force of the nozzle moving motor 12 into the linear motion of the chemical solution supply nozzle 8 are formed between the two.
[0021]
  The chemical solution supply nozzle 8 is connected to a chemical solution tank 15 containing the chemical solution via tubes 17 a and 17 b via a chemical solution supply pump 16. The chemical solution supply pump 16 operates the diaphragm 21 provided on the pump chamber 25 by the air pressure from the air pressure supply valve 18 to supply the chemical solution from the chemical solution tank 15 to the chemical solution supply nozzle 8 at a predetermined pressure. It is a thing. The chemical liquid supply pump 16 has a built-in pressure sensor 22 for detecting the discharge pressure of the chemical liquid, and stores the chemical liquid in the pump chamber 25 on the input side and the output side of the pump chamber 25 and supplies it at a predetermined pressure. A chemical solution supply cutoff valve 23 and a chemical solution discharge cutoff valve 24 are provided. With such a configuration, a stable jet of chemical liquid is discharged from the chemical liquid supply nozzle 8 to the substrate 10 to be processed.
[0022]
  The spiral coating apparatus 1 is configured to simultaneously control the rotational speed of the substrate 10 to be processed, the moving speed of the chemical liquid supply nozzle 8, and the chemical liquid supply speed (chemical liquid discharge pressure) from the chemical liquid supply nozzle 8 as parameters. A rotation controller 31 is provided for the rotation drive unit 3, a nozzle movement controller 32 is provided for the nozzle movement motor 12, and a pump controller 33 is provided for the air pressure supply valve 18 and the pressure sensor 22. It is connected. While the chemical liquid is supplied onto the substrate to be processed, the number of rotations of the substrate to be processed 10, the driving speed of the chemical liquid supply nozzle 8, and the chemical liquid supply speed from the chemical liquid supply nozzle 8 are managed by the controllers 31, 32, and 33. However, the main controller 30 is further connected to these so that they can be managed in an integrated manner.
[0023]
  In the case of the spiral coating apparatus 1, so-called spiral coating is performed in which the fine jet chemical liquid discharged from the chemical liquid supply nozzle 8 is spirally applied to the rotating substrate 10 to be processed. Therefore, rotation is given to the rotary table 4 by the rotation driving unit 3, and the substrate to be processed 10 held on the suction plate 5 rotates at a predetermined rotation speed according to the output of the rotation driving unit 3 when executing the spiral coating. To do. Further, the chemical liquid in the chemical liquid tank 15 is pumped to the chemical liquid supply nozzle 8 by the chemical liquid supply pump 16, and the chemical liquid that has become a fine jet at a predetermined supply speed is discharged from the chemical liquid supply nozzle 8 directly below, so that the chemical liquid is thin. The stream is discharged without interruption and is supplied onto the substrate 10 through the slit 6 s while the chemical supply nozzle 8 moves relative to the substrate 10.
[0024]
  The chemical liquid is supplied to the substrate 10 to be processed when the chemical liquid supply nozzle 8 moves from the center side toward the outer peripheral side or from the outer peripheral side toward the central side. The chemical solution supply nozzle 8 is moved by driving the nozzle moving motor 12. When rotation is applied to the rotary shaft 13, the rotation is converted into linear motion of the chemical solution supply nozzle 8 by a ball screw or magnetic screw (not shown). . Therefore, the chemical supply nozzle 8 slides on the slide rail 11 and moves above the slit 6s without breaking the posture in which the discharge port is directly below. Then, after the application of the entire surface of the substrate to be processed 10 by the chemical solution supply nozzle 8 is completed, the chemical solution supply nozzle 8 is retracted to a position other than the substrate 10 to be discharged, and the discharge of the chemical solution is completed. Therefore, the leveling process is performed by continuing the rotation after the application is completed.
[0025]
  FIG. 2 is an image diagram of spiral coating. When a liquid film is formed, when a chemical liquid is discharged from the chemical liquid supply nozzle 8 that moves in the radial direction with respect to the rotating substrate 10 to be processed, As shown in the drawing, the chemical solution of the fine jet becomes a streamline and is sequentially supplied in a spiral shape. Then, the chemical solution supplied in a spiral shape spreads and the adjacent chemical solutions are combined with each other, and one liquid film is formed on the substrate 10 to be processed.
  FIG. 3 is an enlarged cross-sectional view showing the configuration inside the processing container 6 and the rotation driving unit 3 and the like. A tapered surface 6z is formed on the substrate 10 side of the lid 6a covering the substrate 10 so that the radial center side 6x is thin and the radial outer periphery 6y is thick. Has been. Therefore, the central side 6x in the radial direction of the lid 6a has a large space (space length L1 = 5.5 mm) formed on the substrate 10 to be processed, whereas the outer circumference in the radial direction of the lid 6a. On the side 6y, a small space (space length L2 = 3.5 mm) is formed on the substrate 10 to be processed. In this case, the distance from the radial center of the lid 6a to the outermost circumference in the radial direction is approximately 120 mm, and a small space (space length L2 = 3.5 mm) on the substrate to be processed 10 is to be processed. This is about 60% of the large space (space length L1 = 5.5 mm) on the substrate 10.
[0026]
  FIG. 4 is an image diagram showing the flow of airflow and the like in the case of FIG. In the case where a tapered surface 6z descending from the central side 6x toward the outer peripheral side 6y is formed on the target substrate 10 side of the lid 6a, the application start position for discharging the chemical solution from the chemical solution supply nozzle 8 is set to the target substrate 10 side. The radial center side 10 a is set, and the chemical application end position is set on the radial outer peripheral side 10 b of the substrate 10 to be processed. Then, as shown in FIG. 4, in the chemical solution that volatilizes from the substrate 10 to be processed, an air flow K1 from the outer peripheral side 10b to the center side 10a is generated. In the upper part, a dense portion K2 of the solvent atmosphere is formed. As a result, it is possible to prevent the occurrence of a time difference in dryness between the radially applied central side 10a on the substrate 10 to be processed and the radially applied outer peripheral side 10b at the end, as much as possible. In the central side 10a, the fluidity of the chemical solution on the substrate 10 to be processed can be ensured and the solid content in the chemical solution can be dispersed, so that a liquid film that is as uniform as possible can be formed.
[0027]
  Here, FIG. 5 shows a case where the tapered surface 6z is not formed on the substrate 10 side of the lid 6a covering the upper portion of the substrate 10 to be processed, that is, a flat plate shape, but the same members as those in FIG. The description is abbreviate | omitted and attached | subjected. In this case, as shown in FIG. 5, a space having a constant width (space length L3 = 3.5 mm) on the substrate 10 to be processed from the radial center side 6x of the lid 6a to the radial outer periphery side 6y. ) Will be formed. FIG. 6 shows the concentration distribution during chemical application in the space on the substrate 10 to be processed in that case.
  In FIG. 6, the horizontal axis represents the position from the coating start position (0 mm) to the coating end position (about 100 mm at the maximum) on the substrate 10 to be processed, and the vertical axis represents the distance (maximum 3) from the substrate 10 to be processed. The graph shows the distribution when the points of the same concentration of the volatilized chemical solution are connected. The chemical solution contains an organic solvent, and the organic solvent is for application, but has a property of volatilizing when applied on the substrate 10 to be processed.
  According to this graph, it is understood that the concentration distribution at the time of chemical solution application has a density from the application start position (0 mm) to the application end position (100 mm) and also from the substrate 10 to be processed upward. This means that the drying starts from the application start position (0 mm) and ends at the application end position (100 mm).
[0028]
  The liquid film on the substrate to be processed 10 formed in this manner is then subjected to a dry removal process for drying and removing the solvent in the liquid film, and the film thickness of the liquid film is reduced by the dry removal process. Here, the state of the film thickness of the liquid film after the drying and removing step is shown in FIGS. FIG. 7 shows the relationship between the position from the coating start position (0 mm) to the coating end position (100 mm) and the film thickness on the target substrate 10 when the lid 6a covering the upper side of the target substrate 10 is flat. Show. On the other hand, FIG. 8 shows the position from the application start position (0 mm) to the application end position (100 mm) when the tapered surface 6z is formed on the substrate 10 side of the lid 6a covering the upper side of the substrate 10 to be processed. The relationship with the film thickness on the to-be-processed substrate 10 is shown.
  According to this, FIG. 7 has a large up and down swing with a film thickness of 4000 angstroms as a reference, whereas FIG. 8 has a small up and down swing with a film thickness of 4000 angstroms as a reference. This is because, when the lid 6a covering the upper side of the substrate 10 to be processed is flat (see FIG. 7), the substrate 6a shakes up and down with respect to a film thickness of 4000 angstroms, and the film thickness is not uniform. When the tapered surface 6z is formed on the substrate 10 side of the lid 6a that covers the upper side of the substrate 10 (see FIG. 8), there is less up-and-down swing with reference to a film thickness of 4000 angstroms, compared to the case of FIG. It means that the film thickness is uniform.
[0029]
  As a result, since the tapered surface 6z is formed on the substrate 10 side of the lid 6a that covers the upper side of the substrate 10 to be processed, the chemical liquid that volatilizes from the substrate 10 has a radially outer peripheral side 10b. As a result, an air flow K1 from the center side 10a to the center side 10a is generated (see FIG. 4), so that a dense portion K2 of the solvent atmosphere is formed above the center side 10a in the radial direction on the substrate 10 to be processed. On the center side 10a, it can be inferred that the fluidity of the chemical solution applied first on the substrate to be processed can be secured and the solid content in the chemical solution can be dispersed. It can be inferred that such a phenomenon does not occur in the case of a flat plate in which the tapered surface 6z is not formed on the substrate 10 side of the lid body 6a covering the substrate.
  After the chemical solution is discharged from the chemical solution supply nozzle 8 to apply the chemical solution to the substrate 10 to be processed, the substrate 10 to be processed is further rotated for a certain period of time while the upper portion of the substrate 10 is covered with the lid 6a. Leveling is performed in which the number of rotations is changed for a predetermined time with the body 6a opened. Thereafter, the substrate to be processed 10 is transferred into the drying chamber H1 shown in FIG. 9 and baked and dried. However, the organic solvent is removed by baking. FIG. 9 is an image view showing the inside of the drying chamber H1.
[0030]
  As shown in FIG. 9, the drying chamber H <b> 1 is a sealed space having a heater H <b> 2 on the bottom surface portion, and the heater H <b> 2 is provided so that the heater H <b> 2 and the substrate to be processed 10 do not directly contact each other. A heat insulating support H3 is provided on the substrate, and the substrate to be processed 10 is supported on the heat insulating support H3. A space (a height of about 5 mm) is provided below the substrate 10 to be treated so that the solvent atmosphere does not enter. In this case, since the application of the chemical liquid is started from the radial center side of the substrate 10 to be processed and the chemical liquid application is completed on the outer peripheral side in the radial direction, the drying chamber H1 has a thin central side 6x in the radial direction. Then, the upper surface of the substrate to be processed 10 is covered with a lid 6a having a tapered surface 6z formed on the substrate to be processed 10 so that the outer peripheral side 6y in the radial direction has a thick sectional shape.
  With such a lid 6a, when the upper side of the substrate 10 to be processed is covered and dried, an air flow K1 from the outer peripheral side 10b in the radial direction toward the central side 10a is generated. A portion K2 where the solvent atmosphere is dense is formed above the center side 10a. When the solvent atmosphere above the substrate to be processed 10 is in a saturated state, the radial center side 10a applied first on the substrate 10 to be processed and the radial direction applied last, particularly on the central side in the radial direction. It is possible to prevent the occurrence of a difference in dryness from the outer peripheral side 10b as much as possible, and to form a liquid film that is as uniform as possible.
[0031]
  As described above, according to the present embodiment, the chemical solution is discharged from the chemical solution supply nozzle 8 that moves in the radial direction on the rotating substrate 10 to be processed, and spirally formed on the substrate 10 to be processed. In the spiral coating apparatus 1 that forms a liquid film on the substrate to be processed 10 by applying a chemical solution while drawing a trajectory, the lid 6a that covers the upper side of the substrate to be processed 10 has a radial direction toward the substrate 10 to be processed. A tapered surface 6z is formed such that the central side 6x is thin and the radial outer peripheral side 6y has a thick cross-sectional shape, and an application start position at which the chemical solution is discharged from the chemical solution supply nozzle 8 is defined on the substrate 10 to be processed. Since it is set to the radial center side 10a and the chemical application end position is set to the radial outer peripheral side 10b of the substrate 10 to be processed, drying starts from the radial center side 10a which is the application start position. Diameter at the end of application When the outer peripheral side 10b is finally dried, the lid 6a covers and covers the top of the substrate 10 to be dried, so that an air flow K1 from the outer peripheral side 10b toward the central side 10a is generated. A dense portion K2 is formed in the solvent atmosphere above the radial center side 10a, which is the application start position. As a result, it is possible to prevent the occurrence of a time difference in dryness between the radial center side 10a, which is the application start position on the substrate 10 to be processed, and the radial outer periphery side 10b, which is the application end position, as much as possible. Since the fluidity of the chemical solution at the first applied portion on the processing substrate 10 can be secured and the solid content in the chemical solution can be dispersed by leveling, a liquid film that is as uniform as possible can be formed.
[0032]
  Next, another embodiment will be described with reference to FIGS.
  FIG. 10 is an enlarged cross-sectional view showing a main part of a liquid film forming apparatus according to another embodiment, FIG. 11 is an image view showing the flow of airflow in the case of FIG. 10, and FIG. It is an image figure which shows a drying chamber. Regarding the members shown in FIGS. 10 to 12, the same members as those shown in FIGS. 3, 4 and 9 are denoted by the same reference numerals, and detailed description thereof is omitted. A tapered surface 6w is formed on the substrate 10 side of the lid 6a that covers the substrate 10 to be processed so that the radial center side 6x is thick and the radial outer periphery 6y is thin. ing. Therefore, the center side 6x in the radial direction of the lid body 6a has a small space (space length L4 = 1.5 mm) formed on the substrate 10 to be processed, whereas the outer circumference in the radial direction of the lid body 6a. On the side 6y, a large space (space length L5 = 3.5 mm) is formed on the substrate 10 to be processed.
[0033]
  Thus, when the taper surface 6w which goes down from the outer peripheral side 6y in the radial direction toward the center side 6x is formed on the substrate 10 side of the lid 6a, the application start position for discharging the chemical solution from the chemical solution supply nozzle 8 is set. 11 is set on the outer peripheral side 10b in the radial direction of the substrate 10 to be processed, and the application end position of the chemical solution is set on the central side 10a in the radial direction of the substrate 10 to be processed, as shown in FIG. The chemical solution that volatilizes from above the substrate 10 generates an air flow K3 from the central side 10a toward the outer peripheral side 10b. Therefore, a dense portion K4 of the solvent atmosphere is located above the radial outer peripheral side 10b on the substrate 10 to be processed. Form.
[0034]
  When the dense portion K4 of the solvent atmosphere above the radially outer peripheral side 10b is formed in this way, the radial outer peripheral side 10b, which is the application start position on the substrate 10 to be processed, and the application end position. It is possible to prevent the occurrence of a temporal difference in dryness with the radial center side 10a as much as possible. Therefore, the fluidity of the chemical solution on the substrate to be processed 10 can be secured and the solid content in the chemical solution can be dispersed by leveling, particularly on the outer peripheral side 10b in the radial direction, so that a liquid film that is as uniform as possible is formed. It is inferred that
[0035]
  Further, after the chemical liquid is discharged from the chemical liquid supply nozzle 8 and applied, the substrate to be processed 10 is moved into the drying chamber H1 shown in FIG. 12 and baked and dried. The drying chamber H <b> 1 is a sealed space having a heater H <b> 2 on the bottom surface, a heat insulating support material H <b> 3 is provided on the heater H <b> 2, and the substrate to be processed 10 is supported on the heat insulating support material H <b> 3. . In this case, since the application of the chemical solution is started from the outer peripheral side 10b in the radial direction of the substrate to be processed 10 and the application of the chemical solution is terminated at the central side 10a of the substrate to be processed 10, the drying chamber H1 The upper surface of the substrate 10 to be processed is covered with a lid 6a having a tapered surface 6w formed on the side of the substrate to be processed 10 so that the outer peripheral side 6y is 6x thick and has a thin cross-sectional shape.
  When the lid 6a having such a tapered surface 6w is covered and dried above the substrate 10 to be processed, an air flow K3 from the radial center side 10a to the outer peripheral side 10b is generated, so that the application start position A portion K4 where the solvent atmosphere is dense is formed above the radially outer peripheral side 10b. Thereby, it is possible to prevent the occurrence of a time difference in the degree of drying between the radial outer peripheral side 10b which is the application start position on the substrate 10 to be processed and the radial central side 10a which is the application end position as much as possible. In particular, on the outer peripheral side 10b in the radial direction, the fluidity of the chemical solution on the substrate 10 to be processed can be secured and the solid content in the chemical solution can be dispersed, so that a liquid film that is as uniform as possible can be formed. .
[0036]
  As described above, according to another embodiment, the chemical solution is discharged from the chemical solution supply nozzle 8 that moves in the radial direction on the substrate 10 to be rotated, and spirally formed on the substrate 10 to be processed. In the spiral coating apparatus 1 that forms a liquid film on the substrate to be processed 10 by applying the chemical solution while drawing the locus of the above, the lid 6a covering the upper side of the substrate to be processed 10 The taper surface 6w is formed such that the radial center 6x is thick and the radial outer periphery 6y is thin, and the application start position for discharging the chemical from the chemical supply nozzle 8 is defined as the radial direction. The chemical liquid application end position is set to the center side 10a of the substrate 10 to be processed. As a result, when drying starts from the radially outer peripheral side 10b that is the coating start position on the rotating substrate 10 to be processed and the drying of the radial center side 10a that is the coating end position is the last, the radial center When the upper side of the substrate to be processed 10 is covered with a lid 6a formed on the substrate 10 to be processed such that the side 6x is thick and the outer peripheral side 6y has a thin cross-sectional shape, Since the air flow K3 toward 10b is generated, a dense portion K4 is formed in the solvent atmosphere above the radial outer peripheral side 10b which is the application start position. Thereby, it is possible to prevent the occurrence of a time difference in the degree of drying between the radial outer peripheral side 10b which is the application start position on the substrate 10 to be processed and the radial central side 10a which is the application end position as much as possible. In particular, on the outer peripheral side 10b in the radial direction, the fluidity of the chemical solution on the substrate 10 to be processed can be secured and the solid content in the chemical solution can be dispersed, so that a liquid film that is as uniform as possible can be formed. .
[0037]
  In addition, the lid body 6a formed with a tapered surface 6w having a thick radial center side 6x and a thin cross-sectional shape of the radial outer peripheral side 6y, and the radial central side 6x is thin and has the radial direction. The lid 6a formed with the tapered surface 6z having a thick cross-sectional shape on the outer peripheral side 6y is only different in the tapered surface on the substrate 10 side to be processed, and has the same shape as the lid 6a. 6a can be replaced. Accordingly, when the application start position is set to the radial center side 10a of the substrate 10 to be processed and the chemical solution application end position is set to the radial outer periphery side 10b of the substrate 10 to be processed, In contrast to using a lid 6a having a tapered surface 6z in which the central side 6x in the direction is thin and the outer peripheral side 6y in the radial direction has a thick cross-sectional shape, the coating start position is the diameter of the substrate 10 to be processed. When the application end position of the chemical solution is set to the radial center side 10a of the substrate 10 to be processed, the radial center side 6x is thick in the drying step and the radial outer periphery is set. It is possible to use a lid body 6a in which a tapered surface 6w is formed so that the side 6y has a thin cross-sectional shape.
  The embodiment of the present invention is not limited to the example described above, and can be applied to various forms. For example, in the embodiment, the present invention is applied to a substrate to be processed such as a semiconductor wafer manufactured by a semiconductor manufacturing apparatus, but the present invention can also be applied to another substrate to be processed.
[0038]
【The invention's effect】
  As explained above,(1)According to the invention, the chemical solution is discharged from the chemical solution supply unit that moves in a radial direction on the substrate to be rotated, and the chemical solution is applied on the substrate to be processed while drawing a spiral trajectory. In the liquid film forming method of forming a liquid film on a substrate to be processed, a lid body having a taper surface on the substrate to be processed which has a thin cross-sectional shape in which the central side in the radial direction is thin and the outer peripheral side in the radial direction is thick Therefore, the upper side of the substrate to be processed is covered, the application of the chemical solution is started from the radial center side of the substrate to be processed, and the application of the chemical solution is finished on the outer peripheral side in the radial direction. When the drying starts from the center side in the radial direction and the last drying on the outer peripheral side in the radial direction is the last, the cover body covers the upper side of the substrate to be processed from the outer periphery side to the center side. Because the air flow toward In the radial direction of the center side of the upper, the solvent atmosphere is dense. Thereby, it is possible to prevent as much as possible a difference in dryness between the radially applied central side on the substrate to be processed and the radially applied outer peripheral side at the end. And, especially on the center side in the radial direction, it is possible to ensure the fluidity of the chemical solution in the first applied part on the substrate to be processed and to disperse the solid content in the chemical solution, so that a liquid film that is as uniform as possible is formed. can do.
[0039]
  Also,(2)According to the invention, the chemical solution is discharged from the chemical solution supply unit that moves in a radial direction on the substrate to be rotated, and the chemical solution is applied on the substrate to be processed while drawing a spiral trajectory. In the liquid film forming method of forming a liquid film on the substrate to be processed, a lid body having a tapered surface formed on the substrate side to be processed such that the radial center is thick and the radial outer periphery is thin. Therefore, the upper side of the substrate to be processed is covered, the application of the chemical solution is started from the outer peripheral side in the radial direction of the substrate to be processed, and the application of the chemical solution is ended at the center side of the substrate to be processed. When drying starts from the outer peripheral side of the applied radial direction and the final drying of the central side of the radial direction is the last, when the upper side of the substrate to be processed is covered with the lid, the central side of the radial direction The air flow from the Above the outer peripheral side of the start position in a radial direction, the solvent atmosphere is dense. As a result, it is possible to prevent the occurrence of a difference in dryness between the radially outer peripheral side applied first on the substrate to be processed and the radial center side applied last. And, especially on the outer circumference side in the radial direction, it is possible to ensure the fluidity of the chemical solution of the first applied part on the substrate to be processed and to disperse the solid content in the chemical solution, so that a liquid film that is as uniform as possible is formed. can do.
[0040]
  Also,(3)According to the invention, the chemical solution is discharged from the chemical solution supply unit that moves in a radial direction on the substrate to be rotated, and the chemical solution is applied on the substrate to be processed while drawing a spiral trajectory. In the liquid film forming apparatus for forming a liquid film on the substrate to be processed, a cross section on the side of the substrate to be processed of the lid that covers the upper side of the substrate to be processed is thin in the central side in the radial direction and thick in the outer peripheral side in the radial direction Forming a tapered surface to form a shape, setting the application start position for discharging the chemical solution from the chemical solution supply unit to the center side in the radial direction, and setting the application end position of the chemical solution to the outer peripheral side in the radial direction Therefore, when the drying starts from the radial center that is the application start position and the drying on the outer peripheral side in the radial direction that is the application end position is the last, the lid is used to move the upper side of the substrate to be processed. When covered, the airflow from the outer periphery to the center is For Jill, above the center side in the radial direction is applied starting position, the solvent atmosphere is dense. Thereby, it is possible to prevent the occurrence of a difference in dryness as much as possible between the radial center side which is the application start position on the substrate to be processed and the radial outer periphery side which is the application end position. And, especially on the center side in the radial direction, it is possible to ensure the fluidity of the chemical solution in the first applied part on the substrate to be processed and to disperse the solid content in the chemical solution, so that a liquid film that is as uniform as possible is formed. can do.
[0041]
  Also,(4)According to the invention, the chemical solution is discharged from the chemical solution supply unit that moves in a radial direction on the substrate to be rotated, and the chemical solution is applied on the substrate to be processed while drawing a spiral trajectory. In the liquid film forming apparatus for forming a liquid film on the substrate to be processed, a cross section in which the central side in the radial direction is thick and the outer peripheral side in the radial direction is thin on the substrate side of the lid that covers the upper side of the substrate to be processed Forming a tapered surface having a shape, setting an application start position for discharging the chemical solution from the chemical solution supply unit on the outer peripheral side in the radial direction, and setting the application end position of the chemical solution to the center side of the substrate to be processed Therefore, when drying starts from the outer peripheral side in the radial direction, which is the application start position, and the drying on the central side in the radial direction, which is the application end position, lasts, with the lid, above the substrate to be processed Covers from the radial center to the outer circumference For air flow occurs Cow, above the outer peripheral side in the radial direction is applied starting position, the solvent atmosphere is dense. As a result, it is possible to prevent the occurrence of a difference in dryness between the radial outer peripheral side which is the application start position on the substrate to be processed and the radial central side which is the application end position as much as possible. And, especially on the outer circumference side in the radial direction, it is possible to ensure the fluidity of the chemical solution of the first applied part on the substrate to be processed and to disperse the solid content in the chemical solution, so that a liquid film that is as uniform as possible is formed. can do.
[0042]
  Also,(5)According to the invention, the chemical solution is discharged from the chemical solution supply unit that moves in a radial direction on the substrate to be rotated, and the chemical solution is applied on the substrate to be processed while drawing a spiral trajectory. In the liquid film forming method for forming a liquid film on the substrate to be processed, the application of the chemical liquid is started from the radial center side of the substrate to be processed, and the chemical liquid coating is ended on the outer peripheral side in the radial direction. In this case, the upper surface of the substrate to be processed is covered with a lid having a tapered surface formed on the substrate to be processed so that the radial center side is thin and the radial outer periphery is thick. Therefore, drying starts from the center side of the radial direction applied first, the drying of the outer peripheral side of the radial direction applied last is the last, and when covering the top of the substrate to be processed with the lid, Airflow from the outer circumference side to the center side in the radial direction To produce, above the center side in the radial direction is applied starting position, the solvent atmosphere is dense. As a result, it is possible to prevent a difference in dryness between the radially applied central side on the substrate to be processed first and the radially applied outer peripheral side as much as possible, and to form a liquid film that is as uniform as possible. Can do.
[0043]
  Also,(6)According to the invention, the chemical solution is discharged from the chemical solution supply unit that moves in a radial direction on the substrate to be rotated, and the chemical solution is applied on the substrate to be processed while drawing a spiral trajectory. In the liquid film forming method for forming a liquid film on the substrate to be processed, application of the chemical liquid is started from the outer peripheral side in the radial direction of the substrate to be processed, and the chemical liquid is applied on the center side of the substrate to be processed. When the process is finished, the cover is formed by covering the upper side of the substrate to be processed with a lid having a tapered surface on the side of the substrate to be processed so that the radial center is thick and the radial outer periphery is thin. Therefore, drying starts from the radially outer peripheral side applied first, and finally, the drying of the central side in the radial direction applied last is performed, and the upper side of the substrate to be processed is covered with the lid and dried. From the radial center to the outer circumference For flow occurs, above the outer peripheral side in the radial direction is applied starting position, the solvent atmosphere is dense. As a result, it is possible to prevent the difference in dryness between the radially outer peripheral side applied first on the substrate to be processed and the central side of the last radial direction applied as much as possible, and to form a liquid film as uniform as possible. it can.
[Brief description of the drawings]
FIG. 1 is a schematic diagram showing the entire liquid film forming apparatus of the present embodiment.
FIG. 2 is an image view of spiral coating.
FIG. 3 is an enlarged cross-sectional view showing a main part of the liquid film forming apparatus according to the present embodiment.
4 is an image diagram showing the flow of airflow and the like in the case of FIG. 3;
FIG. 5 is an enlarged cross-sectional view of a main part of a general liquid film forming apparatus shown for comparison.
6 is a diagram showing a concentration distribution during chemical application in the case of FIG. 5. FIG.
7 is a graph showing the relationship between film thickness and position formed by the apparatus of FIG.
8 is a graph showing the relationship between film thickness and position formed by the apparatus of FIG.
FIG. 9 is an image view showing a drying chamber.
FIG. 10 is an enlarged cross-sectional view showing a main part of a liquid film forming apparatus according to another embodiment.
11 is an image diagram showing the flow of airflow and the like in the case of FIG. 10;
FIG. 12 is an image view showing a drying chamber.
[Explanation of symbols]
1 Spiral coating device (liquid film forming device)
2 Main unit
3 Rotation drive
4 Rotary table
6 processing containers
6s slit
6a Lid
6x radial center side of the lid
6y Outer circumferential side of lid
6z taper surface
6w taper surface
8 Chemical supply nozzle (chemical supply unit)
10 Substrate
10a Center side in the radial direction
10b Radial outer circumference side
K1 Airflow
K2 Dense part of solvent atmosphere
K3 airflow
K4 Dense part of solvent atmosphere

Claims (4)

回転する被処理基板に対してその上を径方向に移動する薬液供給部から薬液を吐出し、被処理基板上に螺旋状の軌跡を描いて薬液を塗布することにより、被処理基板上に液膜を形成する液膜形成方法において、
前記被処理基板からの前記径方向の中心での第１の距離よりも、前記被処理基板からの前記径方向の外周での第２の距離が短くなるようなテーパ面が前記被処理基板側に形成された蓋体で、前記被処理基板の上方を覆い、
前記蓋体に前記径方向の中心側から前記液膜の最外径となる位置まで直線状に切り欠かれたスリットが備えられ、
前記回転する被処理基板に対して、前記蓋体の上部に配置される前記薬液供給部を、前記薬液を吐出しながら、前記スリットに沿って前記被処理基板の前記径方向の中心側より前記径方向の外周側に向けて移動させることを特徴とする液膜形成方法。The liquid is discharged onto the substrate to be processed by discharging the chemical from a chemical supply unit that moves in a radial direction on the substrate to be rotated, and applying a chemical on the substrate to be processed while drawing a spiral trajectory. In a liquid film forming method for forming a film,
The tapered surface is such that the second distance at the outer periphery in the radial direction from the substrate to be processed is shorter than the first distance at the center in the radial direction from the substrate to be processed. a lid body formed in, covers over the substrate to be processed,
The lid is provided with a slit that is linearly cut from the center side in the radial direction to a position that becomes the outermost diameter of the liquid film,
With respect to the rotating substrate to be processed, the chemical solution supply unit disposed on the upper part of the lid body is discharged from the radial center side of the substrate to be processed along the slit while discharging the chemical solution. A liquid film forming method, wherein the liquid film is moved toward an outer peripheral side in a radial direction . 回転する被処理基板に対してその上を径方向に移動する薬液供給部から薬液を吐出し、被処理基板上に螺旋状の軌跡を描いて薬液を塗布することにより、被処理基板上に液膜を形成する液膜形成方法において、
前記被処理基板からの前記径方向の中心での第１の距離よりも、前記被処理基板からの前記径方向の外周での第２の距離が長くなるようなテーパ面が前記被処理基板側に形成された蓋体で、前記被処理基板の上方を覆い、
前記蓋体に前記径方向の中心側から前記液膜の最外径となる位置まで直線状に切り欠かれたスリットが備えられ、
前記回転する被処理基板に対して、前記蓋体の上部に配置される前記薬液供給部を、前記薬液を吐出しながら、前記スリットに沿って前記被処理基板の前記径方向の外周側より前記径方向の中心側に向けて移動させることを特徴とする液膜形成方法。The liquid is discharged onto the substrate to be processed by discharging the chemical from a chemical supply unit that moves in a radial direction on the substrate to be rotated, and applying a chemical on the substrate to be processed while drawing a spiral trajectory. In a liquid film forming method for forming a film,
The tapered surface is such that the second distance at the outer periphery in the radial direction from the substrate to be processed is longer than the first distance at the center in the radial direction from the substrate to be processed. a lid body formed in, covers over the substrate to be processed,
The lid is provided with a slit that is linearly cut from the center side in the radial direction to a position that becomes the outermost diameter of the liquid film,
With respect to the rotating substrate to be processed, the chemical solution supply unit disposed on the upper part of the lid body is discharged from the radially outer side of the substrate to be processed along the slit while discharging the chemical solution. A liquid film forming method, wherein the liquid film is moved toward the center in the radial direction . 被処理基板を回転させる回転手段と、回転する前記被処理基板に対してその上を径方向に移動し、薬液を吐出することで前記被処理基板上に螺旋状の軌跡を描いて薬液を塗布する薬液供給部と、を有する液膜形成装置において、
前記被処理基板の上方であって前記薬液供給部の下側に、前記被処理基板を覆うように蓋体を備え、
前記蓋体は、前記被処理基板からの前記径方向の中心での第１の距離よりも、前記被処理基板からの前記径方向の外周での第２の距離が短くなるようなテーパ面が前記被処理基板側に形成され、前記径方向の中心側から前記液膜の最外径となる位置まで直線状に切り欠かれたスリットが備えられ、
前記薬液供給部は、前記スリットに沿って、前記被処理基板の前記径方向の中心側から前記径方向の外周側に移動するよう設定されていることを特徴とする液膜形成装置。 A rotating means for rotating the substrate to be processed, and a chemical solution is applied on the substrate to be processed by drawing a spiral trajectory by moving the substrate in a radial direction relative to the rotating substrate to be processed and discharging the chemical solution. A liquid film forming apparatus having a chemical liquid supply unit ,
A lid is provided above the substrate to be processed and below the chemical solution supply unit so as to cover the substrate to be processed .
The lid, the than the first distance in the radial direction of the center of the substrate to be processed, wherein the radial second tapered surface as the distance is shortened in the outer periphery of the substrate to be processed A slit formed in a straight line from the center side in the radial direction to a position that becomes the outermost diameter of the liquid film is provided on the substrate to be processed ,
The liquid film forming apparatus , wherein the chemical solution supply unit is set to move from the radial center side of the substrate to be processed to the outer peripheral side in the radial direction along the slit . 被処理基板を回転させる回転手段と、回転する前記被処理基板に対してその上を径方向に移動し、薬液を吐出することで前記被処理基板上に螺旋状の軌跡を描いて薬液を塗布する薬液供給部と、を有する液膜形成装置において、
前記被処理基板の上方であって前記薬液供給部の下側に、前記被処理基板を覆うように蓋体を備え、
前記蓋体は、前記被処理基板からの前記径方向の中心での第１の距離よりも、前記被処理基板からの前記径方向の外周での第２の距離が長くなるようなテーパ面が前記被処理基板側に形成され、前記径方向の中心側から前記液膜の最外径となる位置まで直線状に切り欠かれたスリットが備えられ、
前記薬液供給部は、前記スリットに沿って、前記被処理基板の前記径方向の外周側から前記径方向の中心側に移動するよう設定されていることを特徴とする液膜形成装置。 A rotating means for rotating the substrate to be processed, and a chemical solution is applied on the substrate to be processed by drawing a spiral trajectory by moving the substrate in a radial direction relative to the rotating substrate to be processed and discharging the chemical solution. A liquid film forming apparatus having a chemical liquid supply unit ,
A lid is provided above the substrate to be processed and below the chemical solution supply unit so as to cover the substrate to be processed .
The lid, the than the first distance in the radial direction of the center of the substrate to be processed, wherein the radial second tapered surface as distance increases in the outer periphery of the substrate to be processed A slit formed in a straight line from the center side in the radial direction to a position that becomes the outermost diameter of the liquid film is provided on the substrate to be processed ,
The liquid film forming apparatus , wherein the chemical solution supply unit is set so as to move from the outer peripheral side in the radial direction of the substrate to be processed to the central side in the radial direction along the slit .
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