JP3973142B2 - Quartz piece support structure of surface mount type crystal unit - Google Patents

Quartz piece support structure of surface mount type crystal unit Download PDF

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JP3973142B2
JP3973142B2 JP2002058017A JP2002058017A JP3973142B2 JP 3973142 B2 JP3973142 B2 JP 3973142B2 JP 2002058017 A JP2002058017 A JP 2002058017A JP 2002058017 A JP2002058017 A JP 2002058017A JP 3973142 B2 JP3973142 B2 JP 3973142B2
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Prior art keywords
crystal
electrode
spot
crystal piece
support structure
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JP2003224446A (en
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茂 木崎
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京セラキンセキヘルツ株式会社
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Description

【０００５】
【課題を解決するための手段】
上記課題を解決する本発明は、パッケージ部材の凹部にマウント部を設け、このマウント部上面に電極パッド部を形成し、この電極パッド部上に、電極が片側２端子の水晶片の端子固着部を導電性接着剤により片側支持固定してなる表面実装型水晶振動子において、前記導電性接着剤は、水晶片のコーナー部で水晶片の中心線から左右対称位置に各２ケ所づつスポット形成され、これらのスポットのうち水晶片の短辺部側のスポットは端子電極との導通位置に、水晶片の長辺部側のスポットは電極端子との非導通又は導通位置に形成され、隣接するスポット同士は非接触位置に配置されていることを特徴とする表面実装型水晶振動子の水晶片支持構造である。
【０００６】
このように、導電性接着剤を水晶片コーナー部の左右各２ケ所にスポット形成し、隣接するスポット同士を非接触位置に配置することで、落下衝撃試験にも十分に絶え得る接着力に優れた表面実装型水晶振動子を提供することが可能となり、求められる１年間の周波数変化率をプラスマイナス１ｐｐｍ以内に保つことができる。
【００１１】
図１には、本発明による水晶片支持構造の第１の実施例が示されている。なお、従来例と共通する部材には同一符号を付して詳細説明は省略する。
本実施例構造では、ＡＴカット型の水晶片５を接着する導電性接着剤６が、この水晶片５のコーナー部であって、水晶片５の中心線ＣＬから左右対称位置の電極パッド部３上に各２ケ所づつスポット形成されている。このスポット形成には、微少スポット用のディスペンサーが用いられる。これらのスポットは、水晶片５の短辺部側で端子電極４ａとの導通位置では導通接着スポット６ａとして、また、水晶片５の長辺部側で電極端子４ａとの非導通位置では接着スポット６ｂとして機能する。そして、隣接する導通接着スポット６ａと接着スポット６ｂ同士は、相互に接触しない非接触位置に配置されている。これで水晶片５は、位置決めして置かれることで、その電極端子４ａと電極パッド部３が電気的に接続した状態で、片側に固着支持される。得られた表面実装型水晶振動子は、水晶片５の左右コーナー部がそれぞれ各２点のスポット６ａ，６ｂにより相互が非接触状態で接着されることになるので、水晶片５の支持固定力が増大し、落下衝撃試験では、水晶片５の端子固定部からの剥離、脱落を防ぎ、歩留まりが向上し、周波数変化率も上記条件内で安定している。
【００１２】
なお、導通接着スポット６ａと接着スポット６ｂは、形成面積を異にして形成することも可能である。図２にはその状態が示されている。これらスポット６ａ，６ｂは、水晶片５の中心線から左右対称となるサイズで形成され、いずれが大きく（あるいは小さく）てもよい。
【００１３】
図３には、本発明による水晶片支持構造の第２の実施例が示されている。この実施例では、電極パッド部３にマウント部２を露出させた非パッド部３ａが形成され、導通接着スポット６ａと接着スポット６ｂが、電極パッド部３と非パッド部３ａの双方に跨って設けられている。したがって、水晶片５がこれに組み付けられた場合、導通接着スポット６ａ，接着スポット６ｂの双方が、端子電極４ａと導通した状態で、マウント部２の露出した非パッド部３ａとも接着することになるので、マウント部２との直接接着が実現され、接着力がさらに向上し、その結果、水晶片５の支持固定力も増大する。
【００１４】
図４には、本発明による水晶片支持構造の第３の実施例が示されている。この実施例では、水晶片５の電極端子４ａに非電極部４ｂが形成され、導通接着スポット６ａが、端子電極４ａと非電極部４ｂの双方に跨って設けられている。したがって、本実施例の水晶片５を、図１の第１の実施例に示すものに代えて電極パッド部３上で支持させた場合、導通接着スポット６ａが、水晶片５の露出した非電極部４ｂとも接着することで水晶片５との直接接着が実現され、接着スポット６ｂの方は、水晶片５と接着することになる。また、本実施例の水晶片５を、図３の第２の実施例に適用した場合、導通接着スポット６ａは、水晶片５の露出した非電極部４ｂ及びマウント部２の露出した非パッド部３ａとも接着し、接着スポット６ｂの方は、電極パッド部３の非パッド部３ｂとも接着することことになる。したがって、本実施例を、第１及び第２の実施例にいずれかに適用しても、接着力がさらに向上し、その結果、水晶片５の支持固定力もさらに増大する。
【００１５】
なお、本発明の水晶片支持構造は、音叉型のものにも適用することができる。図５にその一例が示されている。この音叉型水晶片５を、第１の実施例に示すＡＴカット型のものに置き換え、接着スポット６ｂを電極端子４ａの導通位置に形成することで、第１の実施例と同様の作用、効果を奏することができる。
【００１６】
【発明の効果】
以上説明したように、本発明の水晶片支持構造によれば、導電性接着剤を水晶片の左右２ケ所のスポット形成構造とし、かつ、隣接するスポット同士を非接触位置に配置したので、水晶片の支持固定力に優れ、落下衝撃試験にも十分に絶え得る表面実装型水晶振動子を提供することが可能となり、製品の性能も向上し、求められる１年間の周波数変化率もプラスマイナス１ｐｐｍ以内に保つことができる。
【図面の簡単な説明】
【図１】本発明による表面実装型水晶振動子の支持構造の第１の実施例を示す平面図である。
【図２】図１の支持構造の変化例を示す拡大断面図である。
【図３】本発明構造の第２の実施例を示す電極パッド部付近の平面図である。
【図４】本発明構造の第３の実施例を示す水晶片の部分拡大平面図である。
【図５】本発明構造を音叉型水晶片に適用した平面図である。
【図６】従来の表面実装型水晶振動子の支持構造の一例を示す平面図である。
【図７】図６の断面図である。
【符号の説明】
１ パッケージ部材
２ マウント部
３ 電極パッド部
３ａ 非パッド部
４ 電極
４ａ 端子電極
４ｂ 非電極部
５ 水晶片
６ 導電性接着剤
６ａ 導通接着スポット
６ｂ 接着スポット
ＣＬ 中心線[0005]
[Means for Solving the Problems]
The present invention for solving the above-mentioned problems is provided with a mount part in a recess of a package member, an electrode pad part is formed on the upper surface of the mount part, and a terminal fixing part of a crystal piece having two terminals on one side on the electrode pad part. In the surface-mount type crystal resonator in which the conductive adhesive is supported and fixed on one side by a conductive adhesive, the conductive adhesive is spot-formed at two corners in the left and right symmetrical positions from the center line of the crystal piece at the corner of the crystal piece. Of these spots, the spot on the short side of the crystal piece is formed at the conduction position with the terminal electrode, and the spot on the long side of the crystal piece is formed at the non-conduction or conduction position with the electrode terminal. The crystal piece support structures of the surface-mount type crystal resonator are characterized in that they are arranged at non-contact positions.
[0006]
In this way, conductive adhesive is spot-formed on each of the left and right corners of the crystal piece corner, and the adjacent spots are placed in non-contact positions, providing excellent adhesive strength that can withstand drop impact tests. In addition, it is possible to provide a surface-mounted crystal resonator, and the required frequency change rate for one year can be kept within plus or minus 1 ppm.
[0011]
FIG. 1 shows a first embodiment of a quartz piece support structure according to the present invention. In addition, the same code | symbol is attached | subjected to the member which is common in a prior art example, and detailed description is abbreviate | omitted.
In the structure of the present embodiment, the conductive adhesive 6 for bonding the AT-cut type crystal piece 5 is the corner portion of the crystal piece 5, and the electrode pad portion 3 located symmetrically with respect to the center line CL of the crystal piece 5. Two spots are formed on each of them. For the spot formation, a dispenser for a minute spot is used. These spots are conductive adhesion spots 6a at the conduction position with the terminal electrode 4a on the short side of the crystal piece 5, and are adhesion spots at the non-conduction position with the electrode terminal 4a on the long side of the crystal piece 5. 6b functions. And the adjacent conduction | attachment adhesion | attachment spot 6a and adhesion | attachment spot 6b are arrange | positioned in the non-contact position which does not contact mutually. Thus, the crystal piece 5 is positioned and placed, and is fixedly supported on one side in a state where the electrode terminal 4a and the electrode pad portion 3 are electrically connected. In the obtained surface-mounted crystal resonator, the left and right corner portions of the crystal piece 5 are bonded to each other in a non-contact state by two spots 6a and 6b, respectively. In the drop impact test, peeling and dropping of the crystal piece 5 from the terminal fixing portion are prevented, the yield is improved, and the frequency change rate is also stable within the above conditions.
[0012]
The conductive adhesion spot 6a and the adhesion spot 6b can be formed with different formation areas. FIG. 2 shows this state. These spots 6a and 6b are formed in a size that is symmetrical with respect to the center line of the crystal piece 5, and any of them may be large (or small).
[0013]
FIG. 3 shows a second embodiment of the quartz piece support structure according to the present invention. In this embodiment, a non-pad portion 3a in which the mount portion 2 is exposed is formed on the electrode pad portion 3, and a conductive adhesive spot 6a and an adhesive spot 6b are provided across both the electrode pad portion 3 and the non-pad portion 3a. It has been. Therefore, when the crystal piece 5 is assembled thereto, both the conductive adhesion spot 6a and the adhesion spot 6b are adhered to the exposed non-pad portion 3a of the mount portion 2 in a state where both of the conductive adhesion spot 6a and the adhesion spot 6b are electrically connected to the terminal electrode 4a. Therefore, direct adhesion with the mount portion 2 is realized, and the adhesion force is further improved. As a result, the support fixing force of the crystal piece 5 is also increased.
[0014]
FIG. 4 shows a third embodiment of the quartz piece support structure according to the present invention. In this embodiment, the non-electrode portion 4b is formed on the electrode terminal 4a of the crystal piece 5, and the conductive adhesion spot 6a is provided across both the terminal electrode 4a and the non-electrode portion 4b. Therefore, when the crystal piece 5 of the present embodiment is supported on the electrode pad portion 3 instead of the one shown in the first embodiment of FIG. 1, the conductive adhesion spot 6a is a non-electrode where the crystal piece 5 is exposed. Bonding with the part 4b realizes direct bonding with the crystal piece 5, and the bonding spot 6b is bonded with the crystal piece 5. Further, when the crystal piece 5 of the present embodiment is applied to the second embodiment of FIG. 3, the conductive adhesion spot 6 a is formed by exposing the non-electrode portion 4 b of the crystal piece 5 and the non-pad portion of the mount portion 2 exposed. 3a is also adhered, and the adhesion spot 6b is also adhered to the non-pad portion 3b of the electrode pad portion 3. Therefore, even if this embodiment is applied to any of the first and second embodiments, the adhesive force is further improved, and as a result, the support fixing force of the crystal piece 5 is further increased.
[0015]
The crystal piece support structure of the present invention can also be applied to a tuning fork type. An example is shown in FIG. The tuning fork type crystal piece 5 is replaced with the AT-cut type shown in the first embodiment, and the adhesion spot 6b is formed at the conduction position of the electrode terminal 4a. Can be played.
[0016]
【The invention's effect】
As described above, according to the crystal piece support structure of the present invention, the conductive adhesive is made into spot forming structures at two places on the left and right sides of the crystal piece, and the adjacent spots are arranged at non-contact positions. It is possible to provide a surface-mount type crystal unit that excels in supporting and fixing the piece and can be used for drop impact tests. The product performance is improved, and the required frequency change rate for one year is plus or minus 1 ppm. Can be kept within.
[Brief description of the drawings]
FIG. 1 is a plan view showing a first embodiment of a support structure for a surface-mounted crystal resonator according to the present invention.
FIG. 2 is an enlarged cross-sectional view showing a variation of the support structure of FIG.
FIG. 3 is a plan view of the vicinity of an electrode pad portion showing a second embodiment of the structure of the present invention.
FIG. 4 is a partially enlarged plan view of a crystal piece showing a third embodiment of the structure of the present invention.
FIG. 5 is a plan view in which the structure of the present invention is applied to a tuning fork crystal piece.
FIG. 6 is a plan view showing an example of a support structure of a conventional surface-mount type crystal resonator.
7 is a cross-sectional view of FIG.
[Explanation of symbols]
1 Package material
2 Mount part
3 Electrode pad part
3a Non-pad part
4 electrodes
4a Terminal electrode
4b Non-electrode part
5 Crystal fragment
6 Conductive adhesive
6a Conductive adhesion spot
6b Adhesive spot
CL center line

Claims (3)

パッケージ部材の凹部にマウント部を設け、このマウント部上面に電極パッド部を形成し、この電極パッド部上に、電極が片側２端子の水晶片の端子固着部を導電性接着剤により片側支持固定してなる表面実装型水晶振動子において、前記導電性接着剤は、水晶片のコーナー部で水晶片の中心線から左右対称位置に各２ケ所づつスポット形成され、これらのスポットのうち水晶片の短辺部側のスポットは端子電極との導通位置に、水晶片の長辺部側のスポットは電極端子との非導通又は導通位置に形成され、隣接するスポット同士は非接触位置に配置されていることを特徴とする表面実装型水晶振動子の水晶片支持構造。A mounting part is provided in the recess of the package member, and an electrode pad part is formed on the upper surface of the mounting part. On the electrode pad part, the terminal fixing part of the crystal piece having two terminals on one side is supported and fixed on one side by a conductive adhesive. In the surface-mounted crystal resonator, the conductive adhesive is spot-formed at two corners in the left and right symmetrical positions from the center line of the crystal piece at the corner portion of the crystal piece. The spot on the short side is formed at the conduction position with the terminal electrode, the spot on the long side of the crystal piece is formed at the non-conduction or conduction position with the electrode terminal, and adjacent spots are arranged at the non-contact positions. A crystal-piece support structure for a surface-mount crystal unit, characterized in that 前記電極パッド部にマウント部を露出させた非パッド部を形成し、導電性接着剤の各２ケ所のスポットは、電極パッド部と非パッド部に跨って形成されている請求項１に記載の表面実装型水晶振動子の水晶片支持構造。The non-pad part which exposed the mount part to the said electrode pad part is formed, and the spot of each two places of a conductive adhesive is formed ranging over an electrode pad part and a non-pad part. Crystal piece support structure for surface mount crystal units. 前記水晶片の端子電極に非電極部を形成し、導電性接着剤の一方のスポットは、端子電極と非電極部の双方に跨って形成されている請求項１に記載の表面実装型水晶振動子の水晶片支持構造。The surface-mount type crystal vibration according to claim 1, wherein a non-electrode portion is formed on a terminal electrode of the crystal piece, and one spot of the conductive adhesive is formed across both the terminal electrode and the non-electrode portion. Child crystal piece support structure.
JP2002058017A 2002-01-28 2002-01-28 Quartz piece support structure of surface mount type crystal unit Expired - Fee Related JP3973142B2 (en)

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JP3973142B2 true JP3973142B2 (en) 2007-09-12

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