JP3966927B2 - Packaged array solid electrolytic capacitor structure - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a package type solid electrolytic capacitor in which a capacitor element portion is packaged with a synthetic resin mold portion, and a plurality of capacitor elements are connected to each of the capacitor elements, either temperature or overcurrent. Alternatively, the present invention relates to a structure of a package type array solid electrolytic capacitor which is packaged in one mold portion in a form to which a function of a safety fuse for both is given.
[0002]
[Prior art]
Conventionally, this type of package type array solid electrolytic capacitor has been disclosed in, for example, Japanese Patent Application Laid-Open No. 4-3406 as a prior art. The anode wire protruding from the chip piece in each capacitor element is arranged in parallel so as to be fixed to the anode lead terminal by welding or the like, and the chip piece in each capacitor element, After connecting the cathode lead terminal with temperature or overcurrent, or a safety fuse wire that melts at temperature and overcurrent, the whole of these are connected to a mold part made of a thermosetting synthetic resin such as epoxy resin. The anode lead terminal and the cathode lead terminal are packaged so that a part of the anode lead terminal protrudes from the mold part.
[0003]
[Problems to be solved by the invention]
As described above, a conventional packaged array solid electrolytic capacitor has a plurality of capacitor elements arranged in parallel with a gap between chip pieces in each capacitor element. The interval between the capacitor elements must be increased by the amount of gaps between the chip pieces. Therefore, the length dimension along the column direction of each capacitor element in the mold portion is different from each other. There is a problem that the size of the solid electrolytic capacitor is increased and the weight thereof is increased because the capacitor element is increased by a gap between the chip pieces.
[0004]
Moreover, the conventional packaged array solid electrolytic capacitor has to be connected to each capacitor element and the cathode lead terminal separately by safety fuse wires, in other words, by a plurality of safety fuse wires. Since the connection is required, there is a problem that the manufacturing cost is greatly increased because a large amount of work and materials are required.
[0005]
An object of the present invention is to provide a packaged array solid electrolytic capacitor structure that can solve these problems.
[0006]
[Means for Solving the Problems]
In order to achieve this technical problem, the present invention
“In a portion between the anode lead terminal and the cathode lead terminal, a plurality of capacitor elements each composed of a chip piece, an anode wire protruding from the chip piece, and a cathode film formed on the surface of the chip body, Anode wires protruding from the chip pieces in each capacitor element are arranged in parallel so as to be fixed to the anode lead terminals, and the entirety thereof is formed by a synthetic resin mold part and the anode lead terminals and cathode leads. In a package type array solid electrolytic capacitor in which a part of a terminal is packaged so as to protrude from the mold part,
Side surfaces of adjacent chip pieces among the surfaces of the chip pieces of each capacitor element are formed in a plane parallel to each other with respect to adjacent chip pieces, and between adjacent chip pieces of each chip piece Then, the conductive film as an adhesive applied to the flat portion of the chip piece is bonded so that the cathode films in the chip pieces are electrically connected to each other, and the capacitor elements are integrated. On the other hand, the cathode film in the chip piece of one capacitor element of each capacitor element and the cathode lead terminal are connected by a safety fuse line inside the mold part . "
It was made the composition called.
[0007]
[Operation and effect of the invention]
In this way, the present invention electrically connects the cathode films of the chip pieces to each other with the conductive paste as an adhesive between the chip pieces adjacent to each other among the chip pieces of each capacitor element. The capacitor elements are integrally connected to each other, while the cathode film in the chip piece of one capacitor element among the capacitor elements and the cathode lead terminal are connected to the interior of the mold portion. In this case, the distance between the capacitor elements can be reduced by the amount of adhesion between the chip pieces with the conductive paste as an adhesive. In addition, a single safety fuse wire connecting between the chip piece and the cathode lead terminal of one capacitor element can be used for each capacitor. All of the elements, it is possible to impart the function of the safety fuse for either or both of the temperature and overcurrent.
[0008]
Therefore, according to the present invention, since the interval between the capacitor elements can be narrowed, the length dimension along the column direction of the capacitor elements in the mold part can be reduced, and the solid electrolytic capacitor can be greatly reduced in size and weight. In addition, since the safety fuse wire only needs to be provided for one capacitor element, the labor and material of providing the safety fuse wire can be greatly reduced, and the manufacturing cost can be greatly increased. The effect can be reduced.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings (FIGS. 1 to 4) in the case of an array solid electrolytic capacitor using three capacitor elements.
In this figure, reference numeral 1 denotes three capacitor elements. Each capacitor element 1 includes a chip piece 2, an anode wire 3 protruding from the chip piece 2, and a cathode film formed on the surface of the chip piece 2. 4.
[0010]
Reference numeral 5 denotes the anode lead terminals arranged in a line, and reference numeral 6 denotes one cathode lead terminal. Each of the anode lead terminals 5 is integrally provided with a connection terminal piece 5a, The cathode lead terminal 6 is integrally provided with three connection terminal pieces 6a.
Each capacitor element 1 is welded to each portion between each anode lead terminal 5 and one cathode lead terminal 6, and the anode wire 3 in each capacitor element 1 is welded to each anode lead terminal 5. Are arranged in parallel so as to adhere to each other.
[0011]
In this case, side surfaces of adjacent chip pieces on the surface of the chip piece 2 in each capacitor element 1 are formed on planes 2a parallel to each other with respect to the adjacent chip pieces. The chip pieces 2 are electrically connected to each other with a conductive paste 7 as an adhesive applied to the flat surface 2a of the surface of the chip pieces 2. The capacitor elements 1 are integrally connected by adhesive bonding so as to be connected .
Then, the cathode film 4 in the chip piece 2 of one capacitor element 1 of the capacitor elements and the cathode lead terminal 6 are connected by a safety fuse line 8, and the safety fuse line 8 is connected to silicon. After covering with a protective resin 9 made of a soft synthetic resin such as a resin, these are entirely connected to a connecting terminal piece 5a in each anode lead terminal 5 by a mold portion 10 made of a thermosetting synthetic resin such as an epoxy resin. Each of the connection terminal pieces 6a in the cathode lead terminal 6 is packaged so as to protrude from the mold part 10, and further, the connection terminal piece 5a in each anode lead terminal 5 and each connection terminal piece 6a in the cathode lead terminal 6 are connected to the mold part. 10 is bent toward the bottom surface.
[0012]
As described above, the anode lead terminal 5 is configured as an integral type for each capacitor element 1 in the same manner as the cathode lead terminal 6 instead of being configured independently for each capacitor element 1 as described above. You can do it.
In this way, between the chip pieces 2 adjacent to each other among the chip pieces 2 in each capacitor element 1 packaged by one mold part 10, the chip pieces 2 are connected with the conductive paste 7 as an adhesive. By bonding the cathode films 4 to each other so as to be electrically connected to each other, the capacitor elements 1 are connected together, so that the interval P between the capacitor elements 1 is set between the chip pieces. Since the gap can be narrowed as much as possible, the length dimension L along the column direction of the capacitor elements 1 in the mold portion 10 can be reduced, and the size and weight can be reduced.
[0013]
Further, the cathode film 4 on the chip piece 2 of each capacitor element 1 is electrically connected to each other by bonding with the conductive paste 7, whereby the cathode film 4 on the chip piece 2 of each capacitor element 1 is electrically connected. Since the capacitor elements 1 are integrally connected, the capacitor element 1 is connected by connecting the chip piece 2 and the cathode lead terminal 6 in one capacitor element 1 with the safety fuse wire 8. In other words, a safety fuse wire is connected between the cathode side and the cathode lead terminal 6, in other words, the safety fuse wire 8 connecting the chip piece 2 and the cathode lead terminal 6 in one capacitor element 1. Thus, all the capacitor elements 1 can be provided with a safety fuse function for either or both of temperature and overcurrent. That.
[0014]
The array solid electrolytic capacitor having the above-described configuration is manufactured by the method described below.
That is, as shown in FIGS. 3 and 4, a lead frame A is used in which a plurality of anode lead terminals 5 and one cathode lead terminal 6 are integrally formed at an appropriate pitch interval in the longitudinal direction. In the middle of phasing the lead frame A in the longitudinal direction, first, a plurality of capacitor elements 1 integrated by adhesion of the conductive paste 7 are fixed to each anode lead terminal 5, or each anode After the capacitor elements 1 are fixed to each of the lead terminals 5, the capacitor elements 1 are integrated by bonding with a conductive paste 7.
[0015]
Next, after the chip piece 2 and the cathode lead terminal 6 in one capacitor element 1 among the capacitor elements are connected by the safety fuse wire 8, a protective resin 9 is applied to the safety fuse wire 8.
Then, after molding the mold part 10 for packaging the whole, and then separating each anode lead terminal 5 and cathode lead terminal 6 from the lead frame A, the connecting terminal piece 5a and each cathode lead terminal 6 in each anode lead terminal 5 are separated. it is to more finished products each connection terminal pieces 6a to be bent toward the bottom surface of the mold portion 10 in.
[Brief description of the drawings]
FIG. 1 is a longitudinal front view of an array solid electrolytic capacitor according to an embodiment of the present invention.
2 is a cross-sectional view taken along the line II-II in FIG.
FIG. 3 is a perspective view showing a capacitor element and a lead frame used in manufacturing the array solid electrolytic capacitor.
FIG. 4 is a perspective view showing a state where the array solid electrolytic capacitor is manufactured.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Capacitor element 2 Chip piece 3 Anode wire 4 Cathode film 5 Anode lead terminal 6 Cathode lead terminal 7 Conductive paste 8 Safety fuse wire 10 Mold part

Claims (1)

A plurality of capacitor elements each composed of a chip piece, an anode wire protruding from the chip piece, and a cathode film formed on the surface of the chip body are provided between the anode lead terminal and the cathode lead terminal. The anode wires protruding from the chip pieces in the capacitor element are arranged in parallel so as to be fixed to the anode lead terminal, and the whole is formed by a synthetic resin mold part, and the anode lead terminal and the cathode lead terminal. In a package type array solid electrolytic capacitor formed by packaging so that a part of the capacitor protrudes from the mold part,
Side surfaces of adjacent chip pieces among the surfaces of the chip pieces of each capacitor element are formed in a plane parallel to each other with respect to adjacent chip pieces, and between adjacent chip pieces of each chip piece Then, the conductive film as an adhesive applied to the flat portion of the chip piece is bonded so that the cathode films in the chip pieces are electrically connected to each other, and the capacitor elements are integrated. On the other hand, the cathode film in the chip piece of one capacitor element among the capacitor elements and the cathode lead terminal are connected by a safety fuse wire inside the mold part. Type array solid electrolytic capacitor structure.

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