JP3965365B2 - Tip cleaning device for soldering iron - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a solder iron tip cleaning device for removing solder dust attached to the tip of a solder iron, and more specifically, the solder waste at the tip is peeled off by air sprayed from a nozzle. The present invention relates to the tip purifier.
[0002]
[Prior art]
As this type of purification apparatus using air, the one described in Japanese Utility Model Publication No. 62-29178 has been known. In this case, an injection nozzle is provided inside a box-shaped case, and by blowing compressed air from the injection nozzle, the solder debris attached to the tip is blown off and peeled off.
[0003]
However, since the conventional purification device was designed to inject high-speed air in a small box-shaped case with an open upper surface, the injected air hits the inner wall surface of the case together with the solder scraps, and is reflected. There was a problem in terms of hygiene and safety, such that they were easily ejected from the top surface, and they scattered around and contaminated the work environment and burned workers.
[0004]
[Problems to be solved by the invention]
The technical problem of the present invention is to provide a sanitary and safe soldering iron purifying device in which air jetted from a jet nozzle is not jetted out and scattered together with solder scraps. is there.
[0005]
[Means for Solving the Problems]
In order to solve the above-described problems, according to the present invention, a cleaner part that peels off and collects solder scraps attached to the tip of a soldering iron by injecting air from an injection nozzle, and a suction hose that draws air in the cleaner part A vacuum part that sucks and purifies through the air and discharges it to the outside, and a first air source for supplying air to the spray nozzle, and the cleaner part has solder scraps peeled off from the tip A tray for dropping and collecting the liquid is provided, and a connection port for connecting the suction hose is provided on a side surface of the cleaner portion. The vacuum portion is connected with air from the cleaner portion. this together with the tray for collecting by dropping the larger weight of the sucked solder debris is provided, a filter for removing particulates in the air to be discharged is provided in Solder 鏝用 soldering tip cleaning device is provided, wherein.
[0006]
In the purification device of the present invention having the above-described configuration, when the tip of the solder scrap is inserted into the cleaner portion and air is sprayed from the spray nozzle toward the tip, the solder scrap is blown off by this air. Is peeled off. And most of the peeled solder scraps are collected by this cleaner part. On the other hand, the air in the cleaner section is sucked by the vacuum section, purified by a filter or the like, and then discharged to the outside. Moreover, the solder waste sucked into the vacuum part from the cleaner part together with the air is collected here.
Thus, according to the present invention, high-temperature solder scraps are scattered together with air to contaminate the work environment and do not cause burns to the worker, so that it is hygienic and safe.
[0007]
According to a specific configuration aspect of the present invention, the vacuum unit generates a negative pressure at the suction port by supplying a high-speed air flow to the input port, and the input port of the ejector and the second air And a switching valve that opens and closes a flow path between the ejector and the suction port of the ejector is connected to the cleaner portion via the suction hose.
Thus, by using an ejector driven by air for suction, the vacuum part can be reduced in size with a simple configuration as compared with the case of using a large motor-driven vacuum pump.
[0009]
In the present invention, the switching valve is a pilot-type switching valve that opens and closes a valve member with pilot air, and the pilot port of the switching valve is connected to the first air source. One air source serves as both an injection air source and a pilot air source.
[0010]
This greatly simplifies the control mechanism of the switching valve, and there is no need to separately provide an electrical control device as in the case of using an electromagnetic valve as the switching valve.
[0011]
According to a more specific configuration aspect of the present invention, the cleaner portion and the vacuum portion are formed as separate units. Among these, the cleaner portion has a box-shaped cleaner case , a lid body that covers the upper surface of the cleaner case and has a tip insertion opening at a position near one end, and an air injection port facing the cleaner case. The spray nozzle includes the tray and the hose connection port. The vacuum section includes the ejector and the switching valve in a box-shaped vacuum case, and includes the tray and the filter.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 shows the overall configuration of the tip cleaning device of the present invention with symbols, and this cleaning device blows away the solder scraps adhering to the tip 5a of the solder tip 5 by air injection from the injection nozzle 4. A cleaner unit 1 that peels and collects, a vacuum unit 2 that sucks and purifies air in the cleaner unit 1, and a first air source 3 for supplying air to the spray nozzle 4. Have.
[0013]
The cleaner unit 1 and the vacuum unit 2 are formed as individual units, and are connected to each other by a suction hose 6, and their specific configurations are as follows.
[0014]
First, as shown in FIGS. 2 and 3, the cleaner unit 1 has a rectangular box-shaped cleaner case 10 made of metal or heat-resistant synthetic resin. A bracket 11 is attached to the outer wall surface on one axial end side of the cleaner case 10, and a nozzle support member 12 is provided on the bracket 11, and the injection nozzle 4 is connected to the nozzle support member 12 at the tip air. With the spray port 4a facing the inside of the cleaner case 10, the tilt angle around the horizontal axis and the orientation around the vertical axis are adjustable. A connection port 14 for connecting the air pipe 13 is provided on the side surface of the injection nozzle 4, and one end of the air pipe 13 made of a flexible tube such as synthetic rubber or synthetic resin is connected to the connection port 14. It is connected via a pipe joint 15. The other end of the air pipe 13 is connected to the first air source 3 via an electromagnetic valve 16 as shown in FIG.
[0015]
An openable / closable lid 10a covering the upper surface of the cleaner case 10 is provided with a hook insertion port 17 at a position near the end on the side where the injection nozzle 4 is installed. A tip 5 a of the solder rod 5 is inserted into the cleaner case 10 from the port 17 so as to face the air injection port 4 a at the tip of the injection nozzle 4.
[0016]
On one side surface of the cleaner case 10, a cylindrical hose connection port 20 for connecting the suction hose 6 is provided at a position near the upper end portion of the side surface. Further, an opening 21 is provided at the lower end of the side surface over the entire length of the cleaner case 10, and a tray for collecting solder scraps peeled off from the tip 5 a into the cleaner case 10 from the opening 21. 22 is inserted freely. The tray 22 has a dish shape. A front cover 23 is attached to the front surface of the tray 22, and a handle 24 is attached to the front cover 23. The tray 22 is inserted into the cleaner case 10 through the opening 21. When this is done, the front cover 23 covers the entire opening 21.
[0017]
The solenoid valve 16 is turned on when the soldering iron 5 is cleaned and is switched from the state shown in FIG. 1 to supply air from the first air source 3 to the injection nozzle 4. The solenoid valve 16 may be turned on / off by a switch provided at an appropriate position of the apparatus. However, a sensor for detecting the soldering iron 5 is provided in the cleaner 1 and a detection signal from the sensor is used. You may make it turn on automatically. Alternatively, when the soldering operation is automatically performed by the robot, the control circuit can be configured to control the on / off of the electromagnetic valve 16 in conjunction with the purifying operation of the tip 5a.
[0018]
On the other hand, the vacuum part 2 has a rectangular box-shaped vacuum case 30 made of metal or heat-resistant synthetic resin, as shown in FIGS. 4 to 6, and an ejector 31 and an inside of the vacuum case 30. A switching valve 32 is built in.
[0019]
As shown in principle in FIG. 7, the ejector 31 has a drive nozzle 34, a diffuser 35, and a suction port 36 that leads to a flow path in the diffuser 35. The ejector 31 extends from the drive nozzle 34 to the diffuser 35. A negative pressure is generated at the suction port 36 by flowing a high-speed air flow toward the front. In order to fix the ejector 31 inside the vacuum case 30, a bracket 37 is fixed to the inner wall surface of the vacuum case 30, and two U bolts 38, 38 are attached to the bracket 37. , 38 hold a part 31a of the ejector 31. A hose connection port 39 communicating with the suction port 36 is provided on a side surface of the vacuum case 30, and the other end of the suction hose 6 having one end connected to the cleaner unit 1 is connected to the hose connection port 39. It is connected.
[0020]
Thus, by using the small ejector 31 driven by air as a suction source, the vacuum unit 2 can be reduced in size with a simple configuration compared to the case of using a large vacuum pump driven by a motor. can do.
[0021]
The switching valve 32 is a direct-acting pilot-type spring return type two-port switching valve in which a valve member is opened and closed by pilot air and a return spring 42, as indicated by symbols in FIG. It has an input port S, an output port A, and a pilot port P. The switching valve 32 is supported by another bracket 37 a fixed to the bracket 37, so that the switching valve 32 is disposed at the upper portion of the ejector 31, and the input port S is connected to an input pipe provided in the vacuum case 30. An air pipe 44 is connected to the port 43, the output port A is connected to the input port 45 of the ejector 31 through an air pipe 46, and the pilot port P is connected to a pilot pipe connection port 47 provided in the vacuum case 30. Is connected by a pilot pipe 48. A second air source 49 is connected to the input pipe connection port 43, and a pilot air pipe 13 a branched from the air pipe 13 connecting the injection nozzle 4 and the electromagnetic valve 16 is connected to the pilot pipe connection port 47. It is connected. Therefore, the first air source 3 also serves as a pilot air source for supplying pilot air to the switching valve 32 in addition to the air source for injection.
[0022]
In this way, the switching valve 32 is a pilot-type switching valve driven by pilot air, and pilot air is introduced from the first air source 3 that also serves as a pilot air source. It becomes very simple, and it is not necessary to separately provide an electrical control device as in the case where a solenoid valve is used as the switching valve.
[0023]
The second air source 49 is installed separately from the first air source 3 and has a higher pressure than the first air source 3. However, instead of providing two air sources in this way, only one air source can be provided and shared by the first air source 3 and the second air source 49.
[0024]
The vacuum unit 2 is provided with a filter 51 for purifying the air sucked from the cleaner unit 1 and flowing it out, and a tray 52 for collecting solder scraps sucked together with the air. It has been. The filter 51 is made of a porous material such as a fiber assembly, is held so as to be exchangeable with the filter case 53, and is detachably attached to the rear end wall 30a of the vacuum case 30.
[0025]
Further, the tray 52 has a dish shape, and a front cover 54 and a handle 55 are attached to the front surface of the tray 52, and the vacuum is provided through an opening 56 provided at the lower end of the rear end wall 30a of the vacuum case 30. It is inserted in the case 30 so that it can be taken in and out.
[0026]
In the tip cleaning device having the above-described configuration, when removing the solder scraps attached to the tip 5a of the solder tip 5, the tip 5a is inserted from the tip insertion opening 17 on the upper surface of the cleaner case 10 in the cleaner portion 1. It is inserted into the cleaner case 10 and brought close to the air injection port 4a at the tip of the injection nozzle 4. When the solenoid valve 16 is switched on accordingly, the compressed air is supplied from the first air source 3 to the injection nozzle 4 and injected from the tip air injection port 4a toward the tip 5a. The solder scraps adhering to the tip 5a are blown off and peeled off from the tip 5a. Most of the peeled solder scrap falls and is collected in the tray 22 of the cleaner unit 1.
[0027]
On the other hand, the air from the first air source 3 is also supplied as pilot air to the pilot port P of the switching valve 32 in the vacuum unit 2 in order to switch the switching valve 32 from the OFF state to the ON state in FIG. The air from the second air source 49 is supplied to the ejector 31 through the switching valve 32. For this reason, a negative pressure is generated at the suction port 36 of the ejector 31, and the air in the cleaner case 10 in the cleaner portion 1 is sucked into the ejector 31 together with the solder scraps not collected in the cleaner case 10. The The sucked air and solder debris are discharged into the vacuum case 30 from the discharge port 57 of the ejector 31. Among these, the heavy solder debris falls on the tray 52 and is collected, and impurities such as fine particles are collected. The air containing the air is purified by the filter 51 and then discharged to the outside.
The solder scraps collected in the trays 22 and 52 in the cleaner unit 1 and the vacuum unit 2 are taken out and processed when a certain amount is accumulated.
[0028]
Thus, by blowing air to the tip 5a of the solder iron 5 in the cleaner portion 1 to separate the solder waste, the air in the cleaner case 10 is sucked into the vacuum portion 2 together with a part of the solder waste, whereby the cleaner It is prevented that high-temperature solder scraps are scattered from the case 10 together with air. As a result, the scattered solder scraps and air do not contaminate the work environment or cause burns to the worker, so that there is an advantage that it is hygienic and safe.
[0029]
【The invention's effect】
As described above, according to the present invention, high-temperature solder scraps are scattered together with air to contaminate the work environment and do not cause burns to the worker. A tip purifier can be obtained.
[Brief description of the drawings]
BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is an overall configuration diagram showing, with symbols, one embodiment of a tip purifier according to the present invention.
FIG. 2 is a partially cutaway front view of a cleaner portion.
FIG. 3 is a plan view of FIG. 2;
FIG. 4 is a longitudinal sectional view of a vacuum part.
5 is a cross-sectional view of FIG.
6 is a right side view of FIG. 4. FIG.
FIG. 7 is a sectional view showing the ejector in principle.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Cleaner part 2 Vacuum part 3 11th air source 4 Injection nozzle 4a Air injection port 5 Solder rod 5a Tip 6 Suction hose 10 Cleaner case 17 Tip insertion port 20 Hose connection port 22 Tray 30 Vacuum case 31 Ejector 32 Switching valve 36 Suction port 39 Hose connection port 42 Return spring 43 Input piping connection port 45 Input port 47 Pilot piping connection port 49 Second air source 51 Filter 52 Tray P Pilot port

Claims (4)

A cleaner part that separates and collects solder debris adhering to the tip of the soldering iron by jetting air from a jet nozzle, and the air in the cleaner part is sucked through a suction hose, purified, and discharged to the outside. A vacuum unit and a first air source for supplying air to the spray nozzle ;
The cleaner section is provided with a tray for dropping and collecting the solder scraps peeled off from the tip, and a connection port for connecting the suction hose to the side surface of the cleaner section. In addition, the vacuum part is provided with a tray for dropping and collecting heavy scraps of the solder scrap sucked together with the air from the cleaner part, and removing fine particles in the discharged air. A filter is provided to
A solder iron tip cleaning device characterized by the above. An ejector that generates a negative pressure at the suction port by supplying a high-speed air flow to the input port, and a switching valve that opens and closes a flow path between the input port of the ejector and the second air source. The tip cleaning device according to claim 1, wherein the suction port of the ejector is connected to the cleaner portion via the suction hose .   The switching valve is a pilot-type switching valve that opens and closes a valve member with pilot air, and a pilot port of the switching valve is connected to the first air source, whereby the first air source is used for injection. The purification apparatus according to claim 2, which serves as both an air source and a pilot air source. The cleaner part and the vacuum part are formed as separate units,
The cleaner section includes a box-shaped cleaner case , a lid body that covers the upper surface of the cleaner case and has a tip insertion opening at a position near one end, and the injection that has an air injection port facing the cleaner case. A nozzle, the tray and the hose connection port,
In addition, the vacuum part includes the ejector and the switching valve in a box-shaped vacuum case, and includes the tray and the filter.
The purification device according to claim 2 or 3, wherein

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