JP3964899B2 - Image reading device - Google Patents

Image reading device Download PDF

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Publication number
JP3964899B2
JP3964899B2 JP2004323516A JP2004323516A JP3964899B2 JP 3964899 B2 JP3964899 B2 JP 3964899B2 JP 2004323516 A JP2004323516 A JP 2004323516A JP 2004323516 A JP2004323516 A JP 2004323516A JP 3964899 B2 JP3964899 B2 JP 3964899B2
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substrate
case
image reading
light receiving
light
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JP2006135738A (en
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康広 長尾
弘美 緒方
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Rohm Co Ltd
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Rohm Co Ltd
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Priority to JP2004323516A priority Critical patent/JP3964899B2/en
Priority to US11/667,347 priority patent/US20080179493A1/en
Priority to PCT/JP2005/019969 priority patent/WO2006049112A1/en
Priority to CNB2005800372662A priority patent/CN100433781C/en
Priority to TW094138996A priority patent/TW200633492A/en
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N1/00Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
    • H04N1/024Details of scanning heads ; Means for illuminating the original
    • H04N1/028Details of scanning heads ; Means for illuminating the original for picture information pick-up
    • H04N1/03Details of scanning heads ; Means for illuminating the original for picture information pick-up with photodetectors arranged in a substantially linear array
    • H04N1/031Details of scanning heads ; Means for illuminating the original for picture information pick-up with photodetectors arranged in a substantially linear array the photodetectors having a one-to-one and optically positive correspondence with the scanned picture elements, e.g. linear contact sensors
    • H04N1/0318Integral pick-up heads, i.e. self-contained heads whose basic elements are a light-source, a lens array and a photodetector array which are supported by a single-piece frame
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N1/00Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
    • H04N1/00909Cleaning arrangements or preventing or counter-acting contamination from dust or the like
    • HELECTRICITY
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    • H04N1/024Details of scanning heads ; Means for illuminating the original
    • H04N1/028Details of scanning heads ; Means for illuminating the original for picture information pick-up
    • H04N1/02815Means for illuminating the original, not specific to a particular type of pick-up head
    • H04N1/0282Using a single or a few point light sources, e.g. a laser diode
    • H04N1/02835Using a single or a few point light sources, e.g. a laser diode in combination with a light guide, e.g. optical fibre, glass plate
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
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    • H04N1/031Details of scanning heads ; Means for illuminating the original for picture information pick-up with photodetectors arranged in a substantially linear array the photodetectors having a one-to-one and optically positive correspondence with the scanned picture elements, e.g. linear contact sensors
    • H04N1/0311Details of scanning heads ; Means for illuminating the original for picture information pick-up with photodetectors arranged in a substantially linear array the photodetectors having a one-to-one and optically positive correspondence with the scanned picture elements, e.g. linear contact sensors using an array of elements to project the scanned image elements onto the photodetectors
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N1/00Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
    • H04N1/024Details of scanning heads ; Means for illuminating the original
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    • H04N1/0311Details of scanning heads ; Means for illuminating the original for picture information pick-up with photodetectors arranged in a substantially linear array the photodetectors having a one-to-one and optically positive correspondence with the scanned picture elements, e.g. linear contact sensors using an array of elements to project the scanned image elements onto the photodetectors
    • H04N1/0312Details of scanning heads ; Means for illuminating the original for picture information pick-up with photodetectors arranged in a substantially linear array the photodetectors having a one-to-one and optically positive correspondence with the scanned picture elements, e.g. linear contact sensors using an array of elements to project the scanned image elements onto the photodetectors using an array of optical fibres or rod-lenses
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N1/00Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
    • H04N1/04Scanning arrangements, i.e. arrangements for the displacement of active reading or reproducing elements relative to the original or reproducing medium, or vice versa
    • H04N1/19Scanning arrangements, i.e. arrangements for the displacement of active reading or reproducing elements relative to the original or reproducing medium, or vice versa using multi-element arrays
    • H04N1/191Scanning arrangements, i.e. arrangements for the displacement of active reading or reproducing elements relative to the original or reproducing medium, or vice versa using multi-element arrays the array comprising a one-dimensional array, or a combination of one-dimensional arrays, or a substantially one-dimensional array, e.g. an array of staggered elements
    • H04N1/192Simultaneously or substantially simultaneously scanning picture elements on one main scanning line
    • H04N1/193Simultaneously or substantially simultaneously scanning picture elements on one main scanning line using electrically scanned linear arrays, e.g. linear CCD arrays
    • H04N1/1934Combination of arrays
    • HELECTRICITY
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    • H04N1/04Scanning arrangements, i.e. arrangements for the displacement of active reading or reproducing elements relative to the original or reproducing medium, or vice versa
    • H04N1/19Scanning arrangements, i.e. arrangements for the displacement of active reading or reproducing elements relative to the original or reproducing medium, or vice versa using multi-element arrays
    • H04N1/191Scanning arrangements, i.e. arrangements for the displacement of active reading or reproducing elements relative to the original or reproducing medium, or vice versa using multi-element arrays the array comprising a one-dimensional array, or a combination of one-dimensional arrays, or a substantially one-dimensional array, e.g. an array of staggered elements
    • H04N1/192Simultaneously or substantially simultaneously scanning picture elements on one main scanning line
    • H04N1/193Simultaneously or substantially simultaneously scanning picture elements on one main scanning line using electrically scanned linear arrays, e.g. linear CCD arrays
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
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    • H04N2201/02495Constructional details not otherwise provided for, e.g. for ease of assembly, allowing access to the scanning elements, integrated reinforcing members
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    • H04N2201/02497Additional elements, e.g. sheet guide plates, light shields
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    • H04N2201/03104Integral pick-up heads, i.e. self-contained heads whose basic elements are a light source, a lens and a photodetector supported by a single-piece frame
    • H04N2201/03108Components of integral heads
    • H04N2201/03112Light source
    • HELECTRICITY
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    • H04N2201/03104Integral pick-up heads, i.e. self-contained heads whose basic elements are a light source, a lens and a photodetector supported by a single-piece frame
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    • H04N2201/03125Light guide upstream of the scanned picture elements
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
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    • H04N2201/03145Photodetector

Description

本発明は、ファクシミリ装置や各種のスキャナ装置に組み込まれるなどして原稿の画像を読み取るのに用いられる画像読み取り装置に関する。   The present invention relates to an image reading apparatus used for reading an image of a document by being incorporated in a facsimile apparatus or various scanner apparatuses.

周知のとおり、この種の画像読み取り装置は、一般的には、合成樹脂製のケースに所定の必要な部品を組み付けて構成されている(たとえば、特許文献1参照)。図6および図7は、このような従来の画像読み取り装置の一例を示している。図示された画像読み取り装置Bは、透明カバー102を上面部に装着したケース101と、このケース101の底部に組み付けられた帯板状の基板103とを有している。ケース101には、リフレクタ106に保持された導光体105と、レンズアレイ107とが組み付けられている。基板103には、光源104と、基板103の長手方向に列状に並ぶセンサICチップ108とが設けられている。光源104から発せられた光は、導光体105を通過した後に透明カバー102を介して原稿Pに照射されて反射し、その反射光は、レンズアレイ107を通過して複数のセンサICチップ108に造り込まれた複数の受光素子(図示略)上において集束するように構成されている。各受光素子からはその受光量に対応した出力レベルの画像信号が出力され、これらの信号に基づいた処理を行なうことにより、読み取り画像が得られるようになっている。   As is well known, this type of image reading apparatus is generally configured by assembling predetermined necessary parts to a synthetic resin case (see, for example, Patent Document 1). 6 and 7 show an example of such a conventional image reading apparatus. The illustrated image reading apparatus B includes a case 101 in which a transparent cover 102 is mounted on an upper surface portion, and a band plate-like substrate 103 assembled to the bottom portion of the case 101. The case 101 is assembled with a light guide 105 held by a reflector 106 and a lens array 107. The substrate 103 is provided with a light source 104 and a sensor IC chip 108 arranged in a line in the longitudinal direction of the substrate 103. The light emitted from the light source 104 passes through the light guide 105 and then irradiates and reflects the original P via the transparent cover 102, and the reflected light passes through the lens array 107 and passes through a plurality of sensor IC chips 108. It is configured to focus on a plurality of light receiving elements (not shown) built in. Each light receiving element outputs an image signal of an output level corresponding to the amount of light received, and a read image is obtained by performing processing based on these signals.

この画像読み取り装置Bにおいて、ケース101の底部の周縁には、下方に突出する周壁部101aが形成されており、基板103は、周壁部101aの内側の凹部101bに嵌入させることによりケース101に組み付けられている。この周壁部101aは、ケース101外部の光や異物がケース101と基板103との間を通じてケース101内に侵入することを防止する機能を有している。基板103の長手方向一端部には、コネクタ109が設けられている。このコネクタ109は、基板103を所望の外部機器と接続するためのものであり、基板103の一方の長手縁部からその一部が突出するように設けられている。このため、周壁部101aのコネクタ109に対応する部分には切欠部101cが形成されており、ケース101に基板103を組み付ける際のコネクタ109と周壁部101aとの干渉が回避されている。   In this image reading apparatus B, a peripheral wall portion 101a that protrudes downward is formed at the periphery of the bottom portion of the case 101, and the substrate 103 is assembled to the case 101 by being fitted into a recess 101b inside the peripheral wall portion 101a. It has been. The peripheral wall portion 101 a has a function of preventing light and foreign matters outside the case 101 from entering the case 101 through between the case 101 and the substrate 103. A connector 109 is provided at one end in the longitudinal direction of the substrate 103. The connector 109 is for connecting the substrate 103 to a desired external device, and is provided so that a part thereof protrudes from one longitudinal edge portion of the substrate 103. For this reason, the notch part 101c is formed in the part corresponding to the connector 109 of the surrounding wall part 101a, and interference with the connector 109 and the surrounding wall part 101a at the time of attaching the board | substrate 103 to the case 101 is avoided.

ここで、切欠部101cは、コネクタ109との干渉を確実に回避するため、あるいは大きさの異なる複数種類のコネクタに対して汎用性を持たせるためなどの理由により、一般的にはコネクタとの干渉部分よりも大きいサイズで形成される。そうすると、基板103をケース101に組み付けた状態では、切欠部101cとコネクタ109との間に比較的大きな隙間c1が生じることとなり、この隙間c1を通じてケース101外部からの光や異物の侵入が許容される。このため、図7に表われているように、ケース101には、切欠部101cに対して受光素子寄りで、かつ切欠部101cに対応する位置に、下方に突出する隔壁部101dを一体形成して、ケース101内の受光素子側に光や異物が侵入するのを防止していた。   Here, the notch 101c is generally connected to the connector 109 for the purpose of surely avoiding interference with the connector 109, or for providing versatility to a plurality of types of connectors having different sizes. It is formed in a size larger than the interference part. Then, in a state where the substrate 103 is assembled to the case 101, a relatively large gap c1 is generated between the notch 101c and the connector 109, and light and foreign matter are allowed to enter from the outside of the case 101 through the gap c1. The For this reason, as shown in FIG. 7, the case 101 is integrally formed with a partition wall portion 101 d that protrudes downward at a position closer to the light receiving element than the notch portion 101 c and corresponding to the notch portion 101 c. Thus, light and foreign matter are prevented from entering the light receiving element side in the case 101.

しかしながら、上記従来技術による画像読み取り装置Bでは、異物の侵入防止が十分ではなかった。具体的には、基板103をケース101に組み付けた際に、各部品の寸法の許容差によって、隔壁部101dの先端と基板103の表面との間に微小な隙間が生じる場合がある。また、隔壁部101dと基板103上の実装部品との干渉を回避するなどの目的で、隙間c2が積極的に設けられることもある。そうすると、この隙間c2を通じてケース101内の受光素子側に異物が侵入して受光素子上に付着する場合があり、この場合、受光素子において光を適正に感知することができず、読み取り画像の質が悪くなるといった不具合が生じていた。   However, in the image reading apparatus B according to the above-described prior art, the intrusion prevention of foreign matters has not been sufficient. Specifically, when the substrate 103 is assembled to the case 101, a minute gap may be generated between the front end of the partition wall 101d and the surface of the substrate 103 due to the tolerance of the dimensions of each component. Further, the gap c <b> 2 may be positively provided for the purpose of avoiding interference between the partition wall 101 d and the mounted component on the substrate 103. Then, foreign matter may enter the light receiving element side in the case 101 through the gap c2 and adhere to the light receiving element. In this case, the light cannot be properly sensed by the light receiving element, and the quality of the read image is increased. There was a problem such as worsening.

一方、上記画像信号は、電気的なノイズの影響を受けやすく、このノイズが画像信号中に混入して、読み取り画像の質が悪くなる場合があった。このため、ケース101内にノイズシールドとしての電極が形成されている場合がある。図8はこのような場合の一例を示しており、基板103上およびケース101の隔壁部101dの下端面に、たとえば導電性に優れる銀ペーストを塗布することにより電極110A,110Bが形成されている。電極110Aは、基板103上に設けられた配線(図示略)に繋がっているとともに、電極110Bは、電極110A上に形成された半田バンプ111を介してグランド接続されている。これにより、ケース101は過剰に帯電することがなく、画像信号中にノイズが混入することは防止される。   On the other hand, the image signal is easily affected by electrical noise, and this noise may be mixed in the image signal, resulting in poor read image quality. For this reason, an electrode as a noise shield may be formed in the case 101. FIG. 8 shows an example of such a case. The electrodes 110A and 110B are formed by applying, for example, silver paste having excellent conductivity on the substrate 103 and the lower end surface of the partition wall 101d of the case 101. . The electrode 110A is connected to wiring (not shown) provided on the substrate 103, and the electrode 110B is grounded via a solder bump 111 formed on the electrode 110A. As a result, the case 101 is not excessively charged, and noise is prevented from being mixed into the image signal.

ところが、上記のような電極110A,110Bを設けた構成によると、電極110A,110Bに含まれる銀粒子が飛散する場合がある。そして、飛散した銀粒子が受光素子上に付着すると、受光素子において光を適正に感知することができず、読み取り画像の質が悪くなってしまう。   However, according to the configuration in which the electrodes 110A and 110B are provided as described above, silver particles contained in the electrodes 110A and 110B may be scattered. If the scattered silver particles adhere to the light receiving element, the light cannot be properly detected by the light receiving element, and the quality of the read image is deteriorated.

特開2004−193773号公報JP 2004-193773 A

本発明は、上記した事情のもとで考え出されたものであって、受光素子上への異物の付着を回避し、適正な読み取り画像を得ることができる画像読み取り装置を提供することを課題としている。   The present invention has been conceived under the circumstances described above, and it is an object of the present invention to provide an image reading apparatus capable of avoiding adhesion of foreign matters on a light receiving element and obtaining an appropriate read image. It is said.

上記課題を解決するため、本発明では、次の技術的手段を講じている。   In order to solve the above problems, the present invention takes the following technical means.

本発明によって提供される画像読み取り装置は、ケースと、上記ケースに組み付けられる帯板状の基板と、上記ケースの内部に収容可能であり、かつ上記基板の長手方向に列状に並ぶように上記基板上に設けられた画像読み取り用の複数の受光素子と、上記ケースおよび上記基板に導電ペーストを塗布することによりそれぞれ形成され、少なくともそれらの一部が互いに対向する電極と、を備えている、画像読み取り装置であって、上記基板上の上記複数の受光素子と上記電極との間には、上記基板の厚み方向に突出する堰部材が設けられていることを特徴としている。 The image reading apparatus provided by the present invention includes a case, a band plate-like substrate assembled to the case, and can be accommodated in the case, and arranged in a row in the longitudinal direction of the substrate. a plurality of light receiving elements of the image reading provided on the substrate, each formed by coating a conductive paste on the case and the board, and includes an electrode in which at least some of them are opposed to each other, the The image reading apparatus is characterized in that a weir member protruding in the thickness direction of the substrate is provided between the plurality of light receiving elements on the substrate and the electrode.

このような構成によれば、受光素子に異物が付着することは適切に回避される。すなわち、複数の受光素子と電極との間の適所には基板の厚み方向に突出する堰部材が設けられているため、電極の成分粒子が飛散しても、その成分粒子は堰部材によって電極側に堰き止められ、基板上に設けられた受光素子上に電極の成分粒子が付着することは適切に回避される。したがって、本発明によれば、適正な読み取り画像を得ることができる。   According to such a structure, it is avoided appropriately that a foreign material adheres to a light receiving element. That is, a weir member that protrudes in the thickness direction of the substrate is provided at an appropriate position between the plurality of light receiving elements and the electrode, so even if the component particles of the electrode are scattered, the component particles are separated from the electrode side by the weir member. It is appropriately avoided that the component particles of the electrode adhere to the light receiving element provided on the substrate. Therefore, according to the present invention, an appropriate read image can be obtained.

本発明の好ましい実施の形態においては、上記基板には上記基板を外部機器と接続するためのコネクタが設けられ、かつ上記ケースには上記コネクタとの干渉を回避するための切欠部が設けられており、上記堰部材は、上記複数の受光素子と上記切欠部との間に設けられている。   In a preferred embodiment of the present invention, the board is provided with a connector for connecting the board to an external device, and the case is provided with a notch for avoiding interference with the connector. The dam member is provided between the plurality of light receiving elements and the notch.

このような構成によれば、切欠部とコネクタとの間に隙間が生じ、この隙間を通じてケース内に異物が侵入した場合であっても、堰部材は複数の受光素子と切欠部との間の適所に設けられているため、ケース内に侵入した異物は堰部材によって切欠部側に堰き止められる。したがって、受光素子上に異物が付着することは適切に回避され、適正な読み取り画像を得ることができる。   According to such a configuration, a gap is generated between the notch portion and the connector, and the dam member is provided between the plurality of light receiving elements and the notch portion even when foreign matter enters the case through the gap. Since it is provided at an appropriate place, the foreign matter that has entered the case is blocked by the weir member on the cutout side. Therefore, it is possible to appropriately avoid foreign matters from adhering to the light receiving element, and an appropriate read image can be obtained.

本発明の好ましい実施の形態においては、上記堰部材は、上記複数の受光素子が並ぶ方向と略同方向に延びる帯状部を有する。   In a preferred embodiment of the present invention, the dam member has a belt-like portion extending in substantially the same direction as the direction in which the plurality of light receiving elements are arranged.

このような構成によれば、異物や上記電極の成分粒子を効率よく遮断することが可能であり、帯状部の幅を細幅とすることができる。したがって、堰部材を設ける領域を小さくしつつ、受光素子上に異物や上記電極の成分粒子が付着することを適切に回避することができる。   According to such a configuration, it is possible to efficiently block foreign substances and component particles of the electrode, and the width of the belt-shaped portion can be made narrow. Therefore, it is possible to appropriately avoid the attachment of foreign matter and component particles of the electrode on the light receiving element while reducing the area where the dam member is provided.

本発明の好ましい実施の形態においては、上記堰部材は、合成樹脂製である。さらに本発明では、上記堰部材は、シリコーン樹脂製であることが好ましい。   In a preferred embodiment of the present invention, the dam member is made of synthetic resin. Furthermore, in the present invention, the dam member is preferably made of a silicone resin.

このような構成によれば、堰部材を基板上に設けても、基板上の導電部分と不当に導通することがなく、画像読み取り装置の動作に何ら悪影響を及ぼすことはない。また、堰部材がシリコーン樹脂製であれば、堰部材そのものが粘着性を有することになる。その結果、堰部材に付着した異物が再飛散することがなく、受光素子上に異物が付着するのを回避するうえで好適である。   According to such a configuration, even if the weir member is provided on the substrate, the conductive portion on the substrate is not unduly conducted, and the operation of the image reading apparatus is not adversely affected. If the weir member is made of silicone resin, the weir member itself has adhesiveness. As a result, the foreign matter adhering to the weir member does not scatter again, which is suitable for avoiding the foreign matter from adhering to the light receiving element.

本発明のその他の特徴および利点については、以下に行なう発明の実施の形態の説明から、より明らかになるであろう。   Other features and advantages of the present invention will become more apparent from the following description of the embodiments of the invention.

以下、本発明の好ましい実施の形態について、図面を参照して具体的に説明する。   Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

図1〜図4は、本発明に係る画像読み取り装置の一例を示している。本実施形態の画像読み取り装置Aは、たとえばプラテンローラRによって原稿送りがなされるスキャナの構成部品として用いられるものであり、ケース1、透明カバー2、基板3、光源4、導光体5、リフレクタ6、レンズアレイ7、複数のセンサICチップ8、コネクタ9、電極10A,10B、および堰部材20を具備して構成されている。   1 to 4 show an example of an image reading apparatus according to the present invention. The image reading apparatus A according to the present embodiment is used as, for example, a component of a scanner that is fed by a platen roller R, and includes a case 1, a transparent cover 2, a substrate 3, a light source 4, a light guide 5, and a reflector 6. , A lens array 7, a plurality of sensor IC chips 8, a connector 9, electrodes 10 </ b> A and 10 </ b> B, and a weir member 20.

ケース1は、たとえばカーボンファイバーを含有する合成樹脂製であり、主走査方向に延びた箱型状とされている。透明カバー2は、たとえば平面視形状が細長矩形状のガラス板または合成樹脂板であり、ケース1の上面開口部を閉塞するようにケース1の上面部に装着されている。レンズアレイ7は、主走査方向に延びる細長なブロック状の合成樹脂製のホルダ70に複数のレンズ71を列状に配置させて保持させたものであり、各レンズ71としては、たとえばロッドレンズが用いられている。このレンズアレイ7は、透明カバー2の裏面に対向するようにしてケース1に組み付けられている。   The case 1 is made of, for example, a synthetic resin containing carbon fiber and has a box shape extending in the main scanning direction. The transparent cover 2 is, for example, an elongated rectangular glass plate or synthetic resin plate in plan view, and is attached to the upper surface portion of the case 1 so as to close the upper surface opening of the case 1. The lens array 7 is configured by holding a plurality of lenses 71 arranged in a row on an elongated block-shaped synthetic resin holder 70 extending in the main scanning direction. As each lens 71, for example, a rod lens is used. It is used. The lens array 7 is assembled to the case 1 so as to face the back surface of the transparent cover 2.

光源4は、たとえばR、G、Bの各色の光を発する3種類のLEDチップを一纏めに樹脂パッケージしたものであり、基板3の長手方向一端部の表面に実装されている。   The light source 4 is, for example, a resin package of three types of LED chips that emit light of each color of R, G, and B, and is mounted on the surface of one end portion in the longitudinal direction of the substrate 3.

導光体5は、光源4から発せられた光を透明カバー2の原稿読み取り領域Sの全域に効率よく導くためのものであり、ケース1の長手方向に延びるブロック状を呈している。この導光体5は、たとえばPMMAなどのアクリル系透明樹脂やその他の光透過性に優れる部材により形成されており、各所の表面はすべて鏡面とされている。導光体5の下面には複数の凹部(図示略)が長手方向に所定の間隔を隔てて設けられている。導光体5内を進行する光が上記各凹部に入射すると、その光は種々の方向に散乱反射することとなり、光出射面5aから画像読み取り領域Sに向けて出射することが可能となる。   The light guide 5 is for efficiently guiding the light emitted from the light source 4 to the entire area of the document reading area S of the transparent cover 2, and has a block shape extending in the longitudinal direction of the case 1. The light guide 5 is made of, for example, an acrylic transparent resin such as PMMA, or other members having excellent light transmittance, and the surfaces of the various parts are all mirror surfaces. A plurality of recesses (not shown) are provided on the lower surface of the light guide 5 at predetermined intervals in the longitudinal direction. When light traveling in the light guide 5 is incident on each of the recesses, the light is scattered and reflected in various directions, and can be emitted toward the image reading region S from the light emitting surface 5a.

リフレクタ6は、導光体5の全長寸法に対応した全長寸法を有する第1部材61および第2部材62から構成されており、これらの間で導光体5を挟み込むことにより導光体5を保持するようになっている。第1および第2部材61,62は、光源4から発せられた光が導光体5の外部に不当に漏れることを防止するために、たとえば白色の樹脂により形成され、光反射率の高いものとされている。第1および第2部材61,62には、導光体5を嵌入可能なリフレクト面61a,62aが形成されており、光源4から発せられた光は、導光体5の各所表面での全反射あるいはリフレクト面61a,62aでの反射を繰り返して進行し、導光体5の光照射面5aから原稿読み取り領域Sに向けて照射される。リフレクタ6は、導光体5を一体的に保持した状態でケース1に組み付けられている。   The reflector 6 is composed of a first member 61 and a second member 62 having a total length corresponding to the total length of the light guide 5, and the light guide 5 is sandwiched between them to sandwich the light guide 5. It comes to hold. The first and second members 61 and 62 are made of, for example, a white resin and have high light reflectivity in order to prevent light emitted from the light source 4 from leaking to the outside of the light guide 5. It is said that. Reflective surfaces 61a and 62a into which the light guide 5 can be inserted are formed on the first and second members 61 and 62, and the light emitted from the light source 4 is totally reflected on each surface of the light guide 5. The reflection or reflection on the reflection surfaces 61a and 62a proceeds repeatedly, and is irradiated from the light irradiation surface 5a of the light guide 5 toward the document reading region S. The reflector 6 is assembled to the case 1 with the light guide 5 held integrally.

複数のセンサICチップ8は、複数の受光素子80を備えた集積回路が造り込まれた半導体チップであり、主走査方向(基板3の長手方向)に繋がって列状に並ぶように基板3の表面に実装されている。複数のセンサICチップ8は、基板3がケース1の底部に取り付けられることにより、レンズアレイ7を通過してきた光を各受光素子80で受光できるようになっている。各受光素子80は、光電変換機能を有するものであり、所定の受光面に光を受けると、その受光量に対応したレベルの信号(画像信号)を出力するように構成されている。   The plurality of sensor IC chips 8 is a semiconductor chip in which an integrated circuit including a plurality of light receiving elements 80 is built, and is connected to the main scanning direction (longitudinal direction of the substrate 3) so as to be arranged in a row. Mounted on the surface. The plurality of sensor IC chips 8 are configured such that the light passing through the lens array 7 can be received by the respective light receiving elements 80 when the substrate 3 is attached to the bottom of the case 1. Each light receiving element 80 has a photoelectric conversion function, and is configured to output a signal (image signal) of a level corresponding to the amount of received light when receiving light on a predetermined light receiving surface.

基板3は、たとえばセラミック製の帯板状であり、その長手方向一端部には基板3を所望の外部機器と接続するためのコネクタ9が設けられている。この基板3の表面には、コネクタ9と光源4や複数のセンサICチップ8とを電気的に導通させるための配線(図示略)が設けられている。光源4への電力供給および複数のセンサICチップ8への各種信号の入出力は上記配線とコネクタ9とを介して行なわれる。   The substrate 3 is, for example, a ceramic band plate, and a connector 9 for connecting the substrate 3 to a desired external device is provided at one end in the longitudinal direction. On the surface of the substrate 3, wiring (not shown) for electrically connecting the connector 9, the light source 4, and the plurality of sensor IC chips 8 is provided. Power supply to the light source 4 and input / output of various signals to the plurality of sensor IC chips 8 are performed via the wiring and the connector 9.

基板3は、ケース1の底部開口部を閉塞するようにケース1の底部に組み付けられている。より具体的には、ケース1の底部の周縁には、下方に突出する周壁部1aが形成されており、基板3は、周壁部1aの内側の凹部1bに嵌入させることによりケース1に組み付けられている。この周壁部1aは、ケース1外部の光や塵・埃などの異物がケース1と基板3との間を通じてケース1内に侵入することを防止している。周壁部1aのコネクタ9に対応する部分には切欠部1cが形成されており、ケース1に基板3を組み付ける際のコネクタ9と周壁部1aとの干渉が回避されている。切欠部1cは、コネクタ9との干渉部分よりも大きいサイズとして形成される。したがって、基板3をケース1に組み付けた状態では、切欠部1cとコネクタ9との間に比較的大きな隙間c1が生じている。ケース1には、切欠部1cに対して受光素子80寄りで、かつ切欠部1cに対応する位置に、下方に突出する隔壁部1dが一体形成されている。   The substrate 3 is assembled to the bottom of the case 1 so as to close the bottom opening of the case 1. More specifically, a peripheral wall portion 1a that protrudes downward is formed on the periphery of the bottom portion of the case 1, and the substrate 3 is assembled to the case 1 by being fitted into the concave portion 1b inside the peripheral wall portion 1a. ing. The peripheral wall 1 a prevents foreign matter such as light outside the case 1 and dust / dust from entering the case 1 between the case 1 and the substrate 3. A notch 1c is formed in a portion corresponding to the connector 9 of the peripheral wall 1a, and interference between the connector 9 and the peripheral wall 1a when the substrate 3 is assembled to the case 1 is avoided. The cutout portion 1 c is formed in a size larger than the portion that interferes with the connector 9. Therefore, in a state where the substrate 3 is assembled to the case 1, a relatively large gap c <b> 1 is generated between the notch 1 c and the connector 9. The case 1 is integrally formed with a partition wall portion 1d that protrudes downward from a position corresponding to the notch portion 1c and closer to the light receiving element 80 with respect to the notch portion 1c.

図3および図4によく表われているように、基板3の上記配線上およびケース1の隔壁部1dの下端面(図4においては破線クロスハッチングで示された領域)には、電極10A,10Bが、少なくともこれらの一部が対向するように形成されている。電極10A,10Bは、たとえば銀ペーストを塗布することにより形成されたものであり、コネクタ9の近傍に位置している。上記銀ペーストは、銀粒子を樹脂バインダーに混入し、さらに有機系樹脂と溶剤からなる粘性媒体に混ぜてペースト状にしたものである。電極10A上の電極10Bに対向する部分には、半田バンプ11が形成されている。電極10Aは上記配線に繋がっているとともに、電極10Bは半田バンプ11および電極10Aを介してグランド接続されている。このことにより、ケース1は過剰に帯電することがなく、上記画像信号中にノイズが混入することは防止されている。   As shown well in FIGS. 3 and 4, the electrodes 10A and 10A are formed on the wiring of the substrate 3 and on the lower end surface of the partition wall 1d of the case 1 (the region indicated by broken line cross-hatching in FIG. 4). 10B is formed so that at least a part of these faces each other. The electrodes 10 </ b> A and 10 </ b> B are formed, for example, by applying a silver paste, and are located in the vicinity of the connector 9. The silver paste is obtained by mixing silver particles into a resin binder and further mixing with a viscous medium composed of an organic resin and a solvent to form a paste. Solder bumps 11 are formed on the electrode 10A facing the electrode 10B. The electrode 10A is connected to the wiring, and the electrode 10B is grounded via the solder bump 11 and the electrode 10A. As a result, the case 1 is not excessively charged, and noise is prevented from being mixed into the image signal.

図3および図4によく表われているように、基板3の表面には、基板3の厚み方向に突出する堰部材20が接着剤などを介して設けられている。堰部材20は、たとえばシリコーン樹脂製であり、主走査方向(基板3の長手方向)に延びる第1帯状部20Aと、副走査方向(基板3の短手方向)に延びる第2帯状部20Bとが一体形成された構成を有している。堰部材20は、切欠部1cおよび電極10A,10Bの位置に対応するように設けられている。本実施形態における基板3およびその周辺の寸法の一例を挙げると、基板3の長手方向の長さは約230mm、基板3の幅W3は約14mm、基板3の表面からケース1の内周底面までの距離H2は約1.2mm、切欠部1cから第1帯状部20Aまでの距離dは約7mmである。また、上記寸法が規定されている場合の堰部材20の各部の寸法は、堰部材20の高さH1が0.55〜1.1mm程度、第1および第2帯状部20A,20Bの幅W1,W2が1〜1.5mm程度、第1帯状部20Aの長さL1が20〜22mm程度、第2帯状部20Bの長さL2が4〜5mm程度とされている。   3 and 4, a weir member 20 that protrudes in the thickness direction of the substrate 3 is provided on the surface of the substrate 3 via an adhesive or the like. The weir member 20 is made of, for example, a silicone resin, and includes a first belt-like portion 20A extending in the main scanning direction (longitudinal direction of the substrate 3), and a second belt-like portion 20B extending in the sub-scanning direction (short direction of the substrate 3). Are integrally formed. The dam member 20 is provided so as to correspond to the positions of the notch 1c and the electrodes 10A and 10B. Taking an example of the dimensions of the substrate 3 and its periphery in the present embodiment, the length of the substrate 3 in the longitudinal direction is about 230 mm, the width W3 of the substrate 3 is about 14 mm, and from the surface of the substrate 3 to the inner peripheral bottom surface of the case 1 The distance H2 is about 1.2 mm, and the distance d from the notch portion 1c to the first belt-like portion 20A is about 7 mm. The dimensions of each part of the weir member 20 when the above dimensions are defined are such that the height H1 of the weir member 20 is about 0.55 to 1.1 mm, and the width W1 of the first and second belt-like parts 20A and 20B. , W2 is about 1 to 1.5 mm, the length L1 of the first belt-like portion 20A is about 20 to 22 mm, and the length L2 of the second belt-like portion 20B is about 4 to 5 mm.

次に、画像読み取り装置Aの作用について説明する。   Next, the operation of the image reading apparatus A will be described.

まず、光源4を発光させると、その光は導光体5に導かれ、導光体5の各所表面での全反射あるいはリフレクタ6のリフレクト面61a,62aでの反射を繰り返して進行し、導光体5の光照射面5aから原稿読み取り領域Sに向けて照射される。すると、画像読み取り領域S上の原稿Pの表面で反射した光はレンズアレイ7の各レンズ71を通過して、センサICチップ8に造り込まれた各受光素子80によって受光される。これにより、複数の受光素子80上には原稿Pの画像が結像されることとなり、各受光素子80から出力される画像信号が処理されて読み取り画像が得られる。   First, when the light source 4 emits light, the light is guided to the light guide 5, and travels repeatedly by being totally reflected on each surface of the light guide 5 or reflected on the reflecting surfaces 61 a and 62 a of the reflector 6. The light is irradiated from the light irradiation surface 5a of the light body 5 toward the document reading area S. Then, the light reflected by the surface of the document P on the image reading area S passes through each lens 71 of the lens array 7 and is received by each light receiving element 80 built in the sensor IC chip 8. As a result, an image of the original P is formed on the plurality of light receiving elements 80, and the image signal output from each light receiving element 80 is processed to obtain a read image.

電極10A,10Bにおいては、その材料である上記銀ペーストに含まれていた溶剤の揮発などに起因して密着力が低下し、電極10A,10Bの表面から銀粒子が飛散する場合がある。堰部材20は、複数の受光素子80と電極10A,10Bとの間において電極10A,10Bの位置に対応するように設けられているため、上記銀粒子が飛散しても、これらは堰部材20によって電極10A,10B側に堰き止められることとなる。したがって、受光素子80上に上記銀粒子が付着することは適切に回避され、適正な読み取り画像を得ることができる。   In the electrodes 10A and 10B, the adhesion may be reduced due to volatilization of the solvent contained in the silver paste that is the material, and silver particles may be scattered from the surfaces of the electrodes 10A and 10B. The weir member 20 is provided between the plurality of light receiving elements 80 and the electrodes 10A and 10B so as to correspond to the positions of the electrodes 10A and 10B. As a result, damming is performed on the electrodes 10A and 10B side. Therefore, adhesion of the silver particles on the light receiving element 80 is appropriately avoided, and an appropriate read image can be obtained.

また、ケース1外部から隙間c1を通じて異物が侵入し、さらに隔壁部1dの下方の隙間c2を通じてケース1の内部に異物が侵入した場合であっても、堰部材20は、複数の受光素子80と切欠部1cとの間において切欠部1cの位置に対応するように設けられているため、ケース1内に侵入した異物は堰部材20によって切欠部1c側に堰き止められることとなる。したがって、受光素子80上に異物が付着することは適切に回避される。   Even when foreign matter enters from the outside of the case 1 through the gap c1 and further enters the case 1 through the gap c2 below the partition wall 1d, the dam member 20 is connected to the plurality of light receiving elements 80. Since it is provided so as to correspond to the position of the notch portion 1c between the notch portion 1c, the foreign matter that has entered the case 1 is dammed to the notch portion 1c side by the dam member 20. Accordingly, it is possible to appropriately prevent foreign matter from adhering to the light receiving element 80.

本実施形態において、堰部材20は、主走査方向に延びる第1帯状部20Aを有している。言い換えると、この第1帯状部20Aは複数の受光素子80が並ぶ方向と略同方向に延びている。銀粒子や異物は、電極10A,10Bや隙間c1などからその周辺に均一に拡散すると考えられるところ、第1帯状部20Aは複数の受光素子80が並ぶ方向に沿うように形成されているため、銀粒子や異物を効率よく遮断することが可能であり、第1帯状部20Aの幅w1を細幅とすることができる。したがって、堰部材20を設ける領域を小さくしつつ、受光素子80上に銀粒子や異物が付着することを適切に回避することができる。また、第1帯状部20Aを細幅に形成すると、基板3上に適宜設けられたコンデンサやジャンパ(図示略)などの他の部品との干渉を回避し易くなり、好適である。なお、本実施形態では、電極10A,10Bおよびコネクタ9が基板3の一端部に形成されているため、第2帯状部20Bを第1帯状部に対して一体的で、かつ略直交するように設けることにより、第2帯状部20Bよりも基板3の上記一端部側への銀粒子や異物の侵入が適切に防止される。   In the present embodiment, the dam member 20 has a first belt-like portion 20A extending in the main scanning direction. In other words, the first strip portion 20A extends in substantially the same direction as the direction in which the plurality of light receiving elements 80 are arranged. Since silver particles and foreign substances are considered to diffuse uniformly from the electrodes 10A, 10B, the gap c1, and the like to the periphery thereof, the first strip 20A is formed along the direction in which the plurality of light receiving elements 80 are arranged. Silver particles and foreign substances can be efficiently blocked, and the width w1 of the first belt-like portion 20A can be made narrow. Therefore, it is possible to appropriately avoid the adhesion of silver particles or foreign matters on the light receiving element 80 while reducing the area where the dam member 20 is provided. Further, it is preferable to form the first band-shaped portion 20A with a narrow width because it is easy to avoid interference with other components such as capacitors and jumpers (not shown) provided as appropriate on the substrate 3. In the present embodiment, since the electrodes 10A and 10B and the connector 9 are formed at one end of the substrate 3, the second belt-like portion 20B is integrated with the first belt-like portion so as to be substantially orthogonal. By providing, invasion of silver particles and foreign matters to the one end side of the substrate 3 from the second band-like portion 20B is appropriately prevented.

本実施形態においては、堰部材20はシリコーン樹脂製とされている。堰部材20をシリコーン樹脂のような絶縁体によって構成することにより、基板3上の導電部分と不当に導通することがなく、画像読み取り装置Aの動作に何ら悪影響を及ぼすことはない。また、シリコーン樹脂は粘着性を有するため、堰部材20に付着した異物が再飛散することがなく、受光素子に異物が付着するのを回避するうえで好適である。もちろん、本発明における堰部材は、シリコーン樹脂製に限定されるものではなく、電気絶縁性を有する他の合成樹脂などで構成されたものでもよい。   In this embodiment, the dam member 20 is made of silicone resin. By configuring the weir member 20 with an insulator such as a silicone resin, the conductive portion on the substrate 3 is not unduly conducted, and the operation of the image reading apparatus A is not adversely affected. In addition, since the silicone resin has adhesiveness, the foreign matter adhering to the dam member 20 is not scattered again, which is suitable for avoiding the foreign matter from adhering to the light receiving element. Of course, the weir member in the present invention is not limited to the one made of silicone resin, and may be composed of another synthetic resin having electrical insulation.

なお、本発明によって提供される画像読み取り装置は、上記実施形態に限られない。   The image reading apparatus provided by the present invention is not limited to the above embodiment.

上記実施形態においては、堰部材20は第1帯状部20Aと第2帯状部20Bにより構成されていたが、本発明はこれに限定されるものではない。たとえば、図5に示すように、堰部材20は、複数の受光素子80が並ぶ方向に沿う帯状部20Cのみから構成されていてもよい。帯状部20Cのみから構成すると、堰部材20の形状が単純化され、好適である。   In the above embodiment, the weir member 20 is configured by the first belt-shaped portion 20A and the second belt-shaped portion 20B, but the present invention is not limited to this. For example, as shown in FIG. 5, the dam member 20 may be composed of only the belt-like portion 20 </ b> C along the direction in which the plurality of light receiving elements 80 are arranged. If only the belt-like portion 20C is used, the shape of the weir member 20 is simplified, which is preferable.

上記実施形態における堰部材20およびその周辺の各部の寸法は、その具体的な一例を示したに過ぎず、本発明はこれに限定されるものではない。たとえば、銀粒子や異物は電極10A,10Bや隙間c1などからその周辺に均一に拡散すると考えられるため、電極や隙間などと堰部材との距離が小さくなるように堰部材を配置することが可能であれば、それに対応させて帯状部の長さを小さくしてもよい。また、上記実施形態で示した堰部材の高さH1は、基板3の表面からケース1の内周底面までの距離H2が約1.2mmの場合において好ましい範囲であり、銀粒子や異物が基板3の表面から若干浮遊したとしても、それらを堰き止めるのに十分な高さである。したがって、堰部材の高さH1は、距離H2に応じて適宜設定すればよい。なお、上記実施形態においては堰部材20とケース1の内周底面との間に隙間を設けているが、この隙間をなくして堰部材がケースの内周底面と密着するようにしてもよい。   The dimensions of the weir member 20 and the surrounding portions in the above embodiment are merely specific examples, and the present invention is not limited to this. For example, since silver particles and foreign substances are considered to diffuse uniformly from the electrodes 10A and 10B and the gap c1 to the periphery thereof, the dam member can be arranged so that the distance between the electrode and the gap and the dam member is reduced. If so, the length of the belt-shaped portion may be reduced correspondingly. In addition, the height H1 of the weir member shown in the above embodiment is a preferable range when the distance H2 from the surface of the substrate 3 to the inner peripheral bottom surface of the case 1 is about 1.2 mm. Even if they float slightly from the surface of 3, they are high enough to dam up them. Therefore, the height H1 of the weir member may be appropriately set according to the distance H2. In the above embodiment, a gap is provided between the weir member 20 and the inner peripheral bottom surface of the case 1. However, the weir member may be in close contact with the inner peripheral bottom surface of the case without the gap.

上記実施形態においては、電極10A,10Bはコネクタ9の近傍に設けられていたが、電極およびコネクタが基板の長手方向に離間して設けられている場合にも、本発明は適用することができる。このような場合、電極およびコネクタのそれぞれに対応する位置に分離して堰部材を形成すればよい。   In the above embodiment, the electrodes 10A and 10B are provided in the vicinity of the connector 9, but the present invention can also be applied when the electrodes and the connector are provided apart in the longitudinal direction of the substrate. . In such a case, the dam member may be formed separately at positions corresponding to the electrodes and the connectors.

上記実施形態における画像読み取り装置Aは、プラテンローラによって原稿送りがなされるスキャナに組み付けられて用いられる例であるが、これに限定されるものではない。本発明に係る画像読み取り装置は、いわゆるフラットベッドタイプのスキャナやハンディスキャナなど画像読み取りがなされる種々の機器に組み付けるなどして広く用いることができる。   The image reading apparatus A in the above embodiment is an example used by being assembled in a scanner that is fed by a platen roller, but is not limited to this. The image reading apparatus according to the present invention can be widely used by being assembled in various devices such as a so-called flatbed type scanner and a handy scanner that can read an image.

本発明に係る画像読み取り装置の一例を示す分解斜視図である。1 is an exploded perspective view illustrating an example of an image reading apparatus according to the present invention. 図1のII −II線に沿う断面図である。It is sectional drawing which follows the II-II line | wire of FIG. 図1のIII −III線に沿う断面図である。It is sectional drawing which follows the III-III line | wire of FIG. 図3のIV −IV線に沿う断面図である。It is sectional drawing which follows the IV-IV line of FIG. 本発明に係る画像読み取り装置の他の例を示す図4と同様の図である。It is the same figure as FIG. 4 which shows the other example of the image reading apparatus which concerns on this invention. 従来の画像読み取り装置の一例を示す分解斜視図である。It is a disassembled perspective view which shows an example of the conventional image reading apparatus. 図6のVII −VII線に沿う断面図である。It is sectional drawing which follows the VII-VII line of FIG. 従来の画像読み取り装置の他の例を示す図7と同様の図である。It is a figure similar to FIG. 7 which shows the other example of the conventional image reading apparatus.

符号の説明Explanation of symbols

A 画像読み取り装置
1 ケース
1c 切欠部
3 基板
9 コネクタ
10A,10B 電極
20 堰部材
20A 第1帯状部
80 受光素子
A Image reading device 1 Case 1c Notch 3 Substrate 9 Connector 10A, 10B Electrode 20 Weir member 20A First strip 80 Light receiving element

Claims (5)

ケースと、上記ケースに組み付けられる帯板状の基板と、上記ケースの内部に収容可能であり、かつ上記基板の長手方向に列状に並ぶように上記基板上に設けられた画像読み取り用の複数の受光素子と、上記ケースおよび上記基板に導電ペーストを塗布することによりそれぞれ形成され、少なくともそれらの一部が互いに対向する電極と、を備えている、画像読み取り装置であって、
上記基板上の上記複数の受光素子と上記電極との間には、上記基板の厚み方向に突出する堰部材が設けられていることを特徴とする、画像読み取り装置。
A case, a band plate-like substrate assembled to the case, and a plurality of image reading units provided on the substrate so as to be accommodated in the case and arranged in a line in the longitudinal direction of the substrate a light receiving element, respectively formed by applying a conductive paste to the casing and the base plate comprises an electrode at least part of them facing each other, and an image reading apparatus,
An image reading apparatus, wherein a weir member protruding in the thickness direction of the substrate is provided between the plurality of light receiving elements on the substrate and the electrode.
上記基板には上記基板を外部機器と接続するためのコネクタが設けられ、かつ上記ケースには上記コネクタとの干渉を回避するための切欠部が設けられており、
上記堰部材は、上記複数の受光素子と上記切欠部との間に設けられている、請求項1に記載の画像読み取り装置。
The board is provided with a connector for connecting the board to an external device, and the case is provided with a notch for avoiding interference with the connector.
The image reading apparatus according to claim 1, wherein the dam member is provided between the plurality of light receiving elements and the notch.
上記堰部材は、上記複数の受光素子が並ぶ方向と略同方向に延びる帯状部を有する、請求項1または2に記載の画像読み取り装置。   3. The image reading apparatus according to claim 1, wherein the dam member has a belt-like portion extending in a direction substantially the same as a direction in which the plurality of light receiving elements are arranged. 上記堰部材は、合成樹脂製である、請求項1ないし3のいずれかに記載の画像読み取り装置。   The image reading device according to claim 1, wherein the dam member is made of a synthetic resin. 上記堰部材は、シリコーン樹脂製である、請求項4に記載の画像読み取り装置。   The image reading device according to claim 4, wherein the weir member is made of silicone resin.
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CNB2005800372662A CN100433781C (en) 2004-11-08 2005-10-31 Image reading apparatus
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