JP3950129B2 - Laser heating device - Google Patents

Laser heating device Download PDF

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JP3950129B2
JP3950129B2 JP2004240328A JP2004240328A JP3950129B2 JP 3950129 B2 JP3950129 B2 JP 3950129B2 JP 2004240328 A JP2004240328 A JP 2004240328A JP 2004240328 A JP2004240328 A JP 2004240328A JP 3950129 B2 JP3950129 B2 JP 3950129B2
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laser
laser light
optical waveguide
waveguide member
heating apparatus
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JP2006055885A (en
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徹 渡辺
貴志 千葉
昌彦 寺田
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Sakaguchi Dennetsu KK
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Sakaguchi Dennetsu KK
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本発明はレーザ加熱装置、特に一度に大きな面積を所望の温度分布に加熱することができるレーザ加熱装置に関するものである。   The present invention relates to a laser heating device, and more particularly to a laser heating device capable of heating a large area to a desired temperature distribution at a time.

従来、半導体基板等を加熱するためにYAGレーザや炭酸ガスレーザ加熱装置を用いてスポット移動方式、線状ビーム照射方式、スキャニング方式で加熱したり、ストライプ幅の広い高出力半導体レーザ加熱装置を用いて加熱していた(特許文献1)。
特開平10−94892号
Conventionally, a YAG laser or a carbon dioxide laser heating device is used to heat a semiconductor substrate or the like using a spot moving method, a linear beam irradiation method, a scanning method, or a high-power semiconductor laser heating device with a wide stripe width. It was heated (Patent Document 1).
JP-A-10-94892

然しながら、上記スポット移動方式及びスキャニング方式はいずれも加熱すべき位置をレーザ光で走査する方式であるから加熱すべき部分の全体にレーザ光を一度に照射することができず、処理効率が落ちる。また、線状ビーム照射方式やストライプ幅の広い高出力半導体レーザ加熱装置においては、線状でしか加熱することができず一度に大きな面積を所望の温度分布で加熱することができないという欠点があった。   However, since both the spot moving method and the scanning method are methods in which the position to be heated is scanned with the laser beam, the entire portion to be heated cannot be irradiated with the laser beam at one time, and the processing efficiency decreases. In addition, the linear beam irradiation method and the high-power semiconductor laser heating apparatus with a wide stripe width have the disadvantage that they can only be heated linearly and a large area cannot be heated at a desired temperature distribution at a time. It was.

本発明は上記の欠点を除くようにしたものである。   The present invention eliminates the above-mentioned drawbacks.

本発明のレーザ加熱装置は、中心位置の第1のレーザ光源と、この第1のレーザ光源から放射される第1のレーザ光を導く第1の光導波部材と、上記第1のレーザ光源を中心とする円周方向に互いに離間した複数の第2のレーザ光源と、この複数の第2のレーザ光源から放射される複数の第2のレーザ光を導く第2の光導波部材とよりなり、上記第1の光導波部材が上記第1のレーザ光を入射せしめる一端面と、上記第1のレーザ光を放射せしめる、上記一端面より広い面積を有する他端面とを有し、上記第2の光導波部材が上記複数の第2のレーザ光源からの上記複数の第2のレーザ光を夫々入射せしめる上記第1のレーザ光源を中心とする円周方向に互いに離間した複数の一端面と、上記第2のレーザ光を放射せしめる、上記第2の光導波部材の上記複数の一端面より広い面積を有する複数の他端面とより成り、上記第2の光導波部材の上記複数の他端面が合体して上記第1の光導波部材の上記他端面の外周に同心状に配置される管状面を形成することを特徴とする。 The laser heating apparatus of the present invention includes a first laser light source at a central position, a first optical waveguide member that guides the first laser light emitted from the first laser light source, and the first laser light source. A plurality of second laser light sources spaced apart from each other in the circumferential direction around the center, and a second optical waveguide member for guiding a plurality of second laser lights emitted from the plurality of second laser light sources, one end face of said first optical waveguide member allowed to incident the first laser beam, allowed to emit the first laser beam, possess the other end face having a larger area than the end surface, the second A plurality of end faces spaced apart from each other in a circumferential direction around the first laser light source, the optical waveguide member allowing the plurality of second laser lights from the plurality of second laser light sources to enter, respectively; The second light beam that emits a second laser beam. An outer periphery of the other end surface of the first optical waveguide member formed by combining the other end surfaces of the second optical waveguide member. A tubular surface disposed concentrically is formed .

また、本発明のレーザ加熱装置においては、上記第1の光導波部材の上記他端面が管状面であることを特徴とする。 Further, the laser heating apparatus of the present invention is characterized in that the said other end surface of the first optical waveguide member is a tubular surface.

また、本発明のレーザ加熱装置においては、上記各レーザ光源の出力が互いに異なることを特徴とする。 Further, the laser heating apparatus of the present invention is characterized in that the output of the laser light sources are different from each other.

本発明においては、基板等の被加熱物を広範囲に加熱せしめることができるという大きな利益がある。   In the present invention, there is a great advantage that an object to be heated such as a substrate can be heated in a wide range.

また、レーザ光源の数を増やすことにより、被加熱物を広範囲に加熱せしめることができ、また、各レーザ光源の出力を異ならしめることにより、被加熱面を所望の温度分布で加熱することができる。   Further, by increasing the number of laser light sources, the object to be heated can be heated over a wide range, and by changing the output of each laser light source, the surface to be heated can be heated with a desired temperature distribution. .

以下図面によって本発明の実施例を説明する。   Embodiments of the present invention will be described below with reference to the drawings.

図1〜図3、高出力の第1の半導体レーザ1と、この半導体レーザ1より放射されるレーザ光を導く石英ロッド等からなる第1の光導波部材2とよりなるレーザ加熱装置を示す。上記光導波部材2は、その一端面に上記高出力半導体レーザ1からのレーザ光が入射される棒状部3と、この棒状部3の他端にその一端が接続された、その外径が他端側に向うに従って上記棒状部3の他端外径と同じ外径から徐々にラッパ状に拡大した後一定となる一定の厚さの円管状部4とよりなる。 1 to 3, the first semiconductor laser 1 of the high output, the laser heating apparatus more ing the first optical waveguide member 2 made of quartz rod or the like for guiding the laser beam emitted from the semiconductor laser 1 Show. The optical waveguide member 2 has a rod-shaped portion 3 into which the laser beam from the high-power semiconductor laser 1 is incident on one end surface thereof, and one end connected to the other end of the rod-shaped portion 3 and has an outer diameter other than that. It consists of a tubular portion 4 having a constant thickness, which becomes constant after gradually expanding in the trumpet shape from the same outer diameter as the other end outer diameter of the rod-shaped portion 3 toward the end side.

上記高出力半導体レーザ1から上記棒状部3の一端面に入射されたレーザ光は、上記光導波部材2によって拡がり、基板等の被加熱物(図示せず)を広範囲に加熱できる。 Laser beam incident on one end face of the rod portion 3 from the high output semiconductor laser 1 is spread by the optical waveguide member 2, Ru can extensively heated object to be heated, such as a substrate (not shown).

なお、レーザ光の透過を良くするために、レーザ光が入射される上記棒状部3の一端面を平面研磨し、反射防止膜を設ける。   In order to improve the transmission of the laser beam, one end surface of the rod-like portion 3 on which the laser beam is incident is polished to provide an antireflection film.

また、上記円管状部4の他端面に、コリメートレンズやシリンドリカルレンズなどの各種レンズ(図示せず)を設け、放射光を平行光にして基板等の被加熱物に照射せしめFurther, the other end surface of the circular tubular portion 4, various lenses such as a collimator lens and a cylindrical lens (not shown) is provided, Ru allowed irradiating the object to be heated, such as a substrate to radiation into parallel light.

また、光導波部材2はレーザ光の反射や透過ロスが少なく、耐熱性がよい石英製のものが好ましい。   Further, the optical waveguide member 2 is preferably made of quartz, which has less reflection and transmission loss of laser light and good heat resistance.

また、石英ロッドにグレーディングを設け石英からの光のロスを防止することが望ましい。   It is also desirable to provide a grading on the quartz rod to prevent loss of light from the quartz.

また、光導波部材2の円管状部4は、3角管状、4角管状等の多角管状としてもよい。   Further, the circular tubular portion 4 of the optical waveguide member 2 may be a polygonal tubular shape such as a triangular tubular shape or a quadrangular tubular shape.

なお、上記光導波部材の円管状部4の代わりに上記棒状部3の他端外径と同じ外径から徐々にラッパ状に拡大した後一定となる棒状部(図示せず)を用いてもよい。   Instead of the circular tubular portion 4 of the optical waveguide member, a rod-like portion (not shown) that becomes constant after gradually expanding in a trumpet shape from the same outer diameter as the other end outer diameter of the rod-like portion 3 may be used. Good.

〜図6は、円周方向に互いに離間した2個の高出力の第2の半導体レーザと、石英等からなる一定の厚さの円管状の第2の光導波部材8とよりなるレーザ加熱装置を示す。上記光導波部材8は上記半導体レーザから放射されるレーザ光が入射される一端面9から他端面10に向って形成した傾斜した切り欠き11により円周方向に上記一端面より広い面積の他端面となる半円管状部12,12に2分割され、上記2分割された他端面が合体して管状面を形成る。 4 to 6, and the second semiconductor laser 5 for two high output apart from each other in the circumferential direction, the more the second optical waveguide member 8 of the constant thickness of the circular tube made of quartz or the like 1 shows a laser heating device. The optical waveguide member 8 has a larger area than the one end surface in the circumferential direction by an inclined notch 11 formed from one end surface 9 to the other end surface 10 on which the laser light emitted from the semiconductor laser 5 is incident. is divided into two semicylindrical portions 12, 12 as the end face, the two divided other end surface that form a tubular surface to coalesce.

上記各半導体レーザから上記各半円管状部12の一端面9に入射されたレーザ光は、上記各半円管状部12内で拡がり、上記各半円管状部12の他端面10から円管状に放射され、基板等の被加熱物(図示せず)を広範囲に加熱できる。 Laser light incident on one end surface 9 of each semicircular tubular portion 12 from each semiconductor laser 5 spreads in each semicircular tubular portion 12 and is tubular from the other end surface 10 of each semicircular tubular portion 12. the emitted, Ru can heat the object to be heated, such as a substrate (not shown) over a wide range.

上記光導波部材を円周方向に分割してレーザ光源の数を増やし、各レーザ光源の出力を夫々制御することにより、被加熱面を所望の温度分布で加熱することができる。 Increasing the number of laser light sources by dividing the optical waveguide member in the circumferential direction, by outputting the respective control of the laser light sources, you are possible to heat the heated surface at a desired temperature distribution.

円管状の光導波部材8切り欠き11により円周方向に3分割以上に分割してレーザ光源を増やすことができる Can increase or Succoth a laser light source is divided into three or more divisions in the circumferential direction by the optical waveguide member 8 notches 11 of the circular tube.

上記光導波部材83角管状、4角管状等の多角管状とすることができる The optical waveguide member 8 may be triangular tubular, polygonal tubular such as square tubular to.

本発明の第の実施例のレーザ加熱装置において、図〜図に示すように、上記図4〜図6に示すレーザ加熱装置の中心部に上記図1〜図3に示すレーザ加熱装置を組み込むようにする。この実施例では光導波部材は、上記中心部における光導波部材2と、この光導波部材2の外周に同心円状に配置せしめた、上記光導波部材2の外径よりその内径が大きい光導波部材8とよりなる。 In laser heating apparatus of the first embodiment of the present invention, as shown in FIGS. 7 to 9, a laser heating shown in FIGS. 1 to 3 in the center of the laser heating apparatus shown in FIG. 4 to FIG. 6 Incorporate the device. In this embodiment, the optical waveguide member is composed of the optical waveguide member 2 in the central portion and an optical waveguide member having an inner diameter larger than the outer diameter of the optical waveguide member 2 arranged concentrically on the outer periphery of the optical waveguide member 2. 8 and so on.

本発明の第の実施例のレーザ加熱装置は上記のような構成であるから、上記棒状部3と一端面9に上記各半導体レーザ1,から入射されたレーザ光は、上記光導波部材2,8内で拡がり、上記各管状部4,12の他端面から夫々放射され、基板等の被加熱物(図示せず)を広範囲に加熱できるようになる。 Since the laser heating apparatus according to the first embodiment of the present invention is configured as described above, the laser light incident on the rod-shaped portion 3 and the one end surface 9 from the semiconductor lasers 1 and 5 is the optical waveguide member. spread within 2,8, are respectively emitted from the other end face of the respective tubular portions 4 and 12, it becomes so that can heat the object to be heated, such as a substrate (not shown) over a wide range.

本発明レーザ加熱装置においては、更にレーザ光源を増やすことができるので、被加熱物を広範囲に加熱でき、また、各半導体レーザの出力を異ならしめることにより、被加熱面を所望の温度分布に加熱することができるという大きな利益がある。 In the laser heating apparatus of the present invention, since the number of laser light sources can be further increased, the object to be heated can be heated over a wide range, and the surface to be heated can be heated to a desired temperature distribution by making the output of each semiconductor laser different. There is a big benefit that you can do.

また、直径の異なる複数の光導波部材を同心円状に配置せしめ、更にレーザ光源の数を増やすことができる。   Further, a plurality of optical waveguide members having different diameters can be arranged concentrically, and the number of laser light sources can be further increased.

本発明のレーザ加熱装置に組み込み可能なレーザ加熱装置の正面図である。It is a front view of the laser heating apparatus which can be integrated in the laser heating apparatus of this invention. 図1に示すレーザ加熱装置の右側面図である。It is a right view of the laser heating apparatus shown in FIG. 図1に示すレーザ加熱装置の左側面図である。It is a left view of the laser heating apparatus shown in FIG. 本発明のレーザ加熱装置に組み込み可能な他のレーザ加熱装置の正面図である。It is a front view of the other laser heating apparatus which can be integrated in the laser heating apparatus of this invention. に示すレーザ加熱装置の右側面図である。It is a right side view of the laser heating apparatus shown in FIG. に示すレーザ加熱装置の左側面図である。It is a left side view of the laser heating apparatus shown in FIG. 本発明のレーザ加熱装置の第の実施例の正面図である。It is a front view of the 1st Example of the laser heating apparatus of this invention. に示すレーザ加熱装置の右側面図である。It is a right side view of the laser heating apparatus shown in FIG. に示すレーザ加熱装置の左側面図である。It is a left side view of the laser heating apparatus shown in FIG.

符号の説明Explanation of symbols

1 高出力半導体レーザ
2 光導波部材
3 棒状部
4 円管状部
5 光導波部材
6 棒状部
7 棒状部
8 光導波部材
9 一端面
10 他端面
11 切り欠き
12 半円管状部
DESCRIPTION OF SYMBOLS 1 High power semiconductor laser 2 Optical waveguide member 3 Rod-shaped part 4 Circular tubular part 5 Optical waveguide member 6 Rod-shaped part 7 Rod-shaped part 8 Optical waveguide member 9 One end surface 10 Other end surface 11 Notch 12 Semicircular tubular part

Claims (3)

中心位置の第1のレーザ光源と、この第1のレーザ光源から放射される第1のレーザ光を導く第1の光導波部材と、上記第1のレーザ光源を中心とする円周方向に互いに離間した複数の第2のレーザ光源と、この複数の第2のレーザ光源から放射される複数の第2のレーザ光を導く第2の光導波部材とよりなり、上記第1の光導波部材が上記第1のレーザ光を入射せしめる一端面と、上記第1のレーザ光を放射せしめる、上記一端面より広い面積を有する他端面とを有し、上記第2の光導波部材が上記複数の第2のレーザ光源からの上記複数の第2のレーザ光を夫々入射せしめる上記第1のレーザ光源を中心とする円周方向に互いに離間した複数の一端面と、上記第2のレーザ光を放射せしめる、上記第2の光導波部材の上記複数の一端面より広い面積を有する複数の他端面とより成り、上記第2の光導波部材の上記複数の他端面が合体して上記第1の光導波部材の上記他端面の外周に同心状に配置される管状面を形成することを特徴とするレーザ加熱装置。 A first laser light source at a central position, a first optical waveguide member that guides the first laser light emitted from the first laser light source, and a circumferential direction centering on the first laser light source. a plurality of second laser light sources spaced, become more and second waveguide member guiding the second laser beam of the plurality emitted from the plurality of second laser light source, the first optical waveguide member allowed to emit one end face allowed to incident the first laser beam, the first laser light, possess the other end face having a larger area than the end surface, the above second optical waveguide member of the plurality A plurality of second laser beams from two laser light sources respectively incident on a plurality of end faces spaced apart from each other in a circumferential direction around the first laser light source, and the second laser light emitted. The plurality of one end faces of the second optical waveguide member. A tubular structure comprising a plurality of other end faces having a large area, and the plurality of other end faces of the second optical waveguide member are combined and arranged concentrically on the outer periphery of the other end face of the first optical waveguide member. A laser heating apparatus characterized by forming a surface . 上記第1の光導波部材の上記他端面が管状面であることを特徴とする請求項1記載のレーザ加熱装置。 Laser heating apparatus according to claim 1, wherein said the other end face of the first optical waveguide member is a tubular surface. 上記各レーザ光源の出力が互いに異なることを特徴とする請求項1または2記載のレーザ加熱装置。 Laser heating apparatus according to claim 1 or 2, wherein the said output of the laser light sources are different from each other.
JP2004240328A 2004-08-20 2004-08-20 Laser heating device Expired - Fee Related JP3950129B2 (en)

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