JP3944839B2 - COMPOSITE CERAMIC COMPONENT AND MANUFACTURING METHOD THEREOF - Google Patents

Description

【００６６】
【表２】

【００６７】
本発明の試料Ｎｏ．１〜３、５〜４８は、配線・ヴィアの外観、基板の反り、割れが無く、反射損失も−１２．５ｄＢ以下であった。
【００６８】
一方、副成分のない試料Ｎｏ．４は、緻密な低誘電率層が得られなかった。
【００６９】
また、副成分が２０質量％を超える本発明の範囲外の試料Ｎｏ．４９は、焼成時に液相が流出し、形状を保持できなかった。
【００７０】
【発明の効果】
本発明の複合セラミック部品は、アルミナ質絶縁層と、低誘電率の誘電体層とを一体的に積層し、表面および内部の少なくとも一方に導体層が形成された絶縁基板を備えた構造を有し、誘電体層の組成を制御したことにより、高周波領域に対応できる高強度、高熱伝導、低抵抗導体配線の複合セラミック部品を実現した。
【図面の簡単な説明】
【図１】本発明の複合セラミック部品の一実施態様を示す概略断面図である。
【符号の説明】
１・・・アルミナ質絶縁層
２・・・誘電体層
３・・・導体層
３ａ・・・表面導体層
３ｂ・・・内部導体層
４・・・ヴィア
５・・・絶縁基板[0001]
BACKGROUND OF THE INVENTION
The present invention is a composite having a low-resistance conductor on the surface of an insulating layer having a high-strength, high-thermal conductivity, low-dielectric constant part, and can be suitably used for a semiconductor package, an electronic component mounting circuit board, a high-frequency circuit board, or the like. The present invention relates to a ceramic part and a manufacturing method thereof.
[0002]
[Prior art]
In recent years, with high integration and high frequency of semiconductor elements, high density mounting and wiring boards with built-in functions inside circuit components are used. On the other hand, heat generated from the semiconductor device is also increasing due to high integration. In order to eliminate the malfunction of the semiconductor device, a wiring substrate capable of releasing such heat to the outside of the device is required. On the other hand, as an electrical characteristic, signal delay becomes a problem due to an increase in calculation speed, and it has been required to use a conductor having a small conductor loss, that is, a low resistance.
[0003]
As a wiring board on which such a semiconductor element is mounted, a ceramic in which alumina ceramics is used as an insulating board and a conductor layer made of a refractory metal such as W or Mo is deposited on the surface or inside thereof from the viewpoint of reliability. Wiring boards are frequently used.
[0004]
However, in the conductor layer made of these refractory metals, which has been widely used in the past, the resistance can only be lowered to about 8 mΩ / □ at most, heat is generated, the temperature of the wiring board is increased, and signals are easily lost. There was a problem that the wiring length was limited.
[0005]
Therefore, Japanese Patent Laid-Open No. 2000-151045 proposes to reduce the resistance of the conductor layer by simultaneously firing the conductor layer and the insulating layer in which Cu and W or Mo are combined at a temperature as low as 1500 ° C. or less. ing.
[0006]
Further, by integrating insulating layers having different dielectric constants using a composition that can be fired at a low temperature, a low-resistance Cu wiring can be used. Proposed in the gazette.
[0007]
[Problems to be solved by the invention]
However, in the method described in Japanese Patent Application Laid-Open No. 2000-151045, although the conductor layer contains Cu, the resistance is lowered, but since the dielectric constant is as high as about 9 because alumina is used for the insulating layer, the frequency of signals is increased Along with this, there is a problem that in the region where the frequency is about 60 GHz, the loss due to the reflection of the input signal becomes large and the characteristics deteriorate.
[0008]
Further, in the method described in JP-A-10-106880, the insulating layer is made of glass ceramics, and even when tempered glass is used, the bending strength is at most 200 MPa, at the same time, the thermal conductivity is low, and the heat dissipation is low. There was a problem of being bad.
[0009]
An object of the present invention is to provide a composite ceramic component having high thermal conductivity, high strength, and low signal loss in a high frequency region, and a manufacturing method for producing the composite ceramic component by a simple method.
[0010]
[Means for Solving the Problems]
The present invention controls the composition of the low dielectric constant material when the high strength, high thermal conductivity alumina and the low dielectric constant material are integrated, and by co-firing, the reflection of the input signal is achieved even in a high frequency region of about 60 GHz. This is based on the knowledge that loss can be reduced.
[0011]
Moreover, even when the subcomponent exceeds 10 mass% in the total amount and is contained in a proportion of 20 mass% or less, by precisely controlling the firing temperature to 1200 to 1300 ° C., it is dense and the substrate warpage or This is based on the knowledge that a composite ceramic part that suppresses the occurrence of cracks can be realized.
[0012]
That is, by co-firing, the alumina insulating layer and the dielectric layer having a lower dielectric constant than the alumina insulating layer are laminated and integrated, and the surface and internal At least one of An insulating substrate having a conductor layer formed thereon, wherein the dielectric layer has forsterite and cordierite as a main crystal phase, and as a subcomponent, at least one of Zn, Mn, and alkaline earth metal and Lead-free and non-alkali borosilicate glass At least one of In an amount of 0.1 to 10% by mass in the total amount, or by simultaneous firing, an alumina insulating layer and a dielectric layer having a lower dielectric constant than the alumina insulating layer are laminated and integrated. And the surface and internal At least one of An insulating substrate having a conductor layer formed thereon, wherein the dielectric layer has forsterite and cordierite as a main crystal phase, and as a subcomponent, at least one of Zn, Mn, and alkaline earth metal and Lead-free and non-alkali borosilicate glass At least one of In a total amount exceeding 10% by mass and not more than 20% by mass. As a result, the alumina insulating layer and the dielectric layer have high adhesion, and the strength and thermal conductivity are remarkably improved as compared with glass ceramics. Further, by setting the composition of the dielectric layer having a low dielectric constant as described above, it is possible to reduce signal loss in the high frequency region.
[0013]
In particular, the dielectric layer preferably contains cordierite in a proportion of 20 to 40% by mass in the total amount. This reduces the difference in thermal expansion coefficient with the alumina insulating layer, effectively suppresses the peeling and cracking from the alumina insulating layer, and the relative dielectric constant of the low dielectric constant ceramic insulating layer is 6 or less. It is possible to suppress signal loss more effectively.
[0014]
The bending strength of the alumina insulating layer is preferably 350 MPa or more. Thereby, it can reduce that a board | substrate breaks at the time of automatic mounting of an element, etc., and a yield falls.
[0015]
Further, the alumina insulating layer contains 2 to 15% by mass of Mn in terms of oxide, 2 to 15% by mass of Si in terms of oxide, and at least one of Mg, Ca, B, Nb, Cr and Co. While containing 0.1 to 4% by mass in terms of oxide, the relative density is preferably 95% or more. Thereby, it becomes easy to maintain the strength and thermal conductivity of the alumina insulating layer.
[0016]
Furthermore, the conductor layer Is , Cu The 10-70% by volume, W and Mo At least one of It is preferable to contain in the ratio of 30-90 volume%. Thereby, it becomes easy to reduce the resistance of the conductor layer formed on the surface of the alumina insulating layer or in the via hole.
[0017]
In addition, the method for producing a composite ceramic component of the present invention includes an oxide powder containing at least one of Zn, Mn, and an alkaline earth metal with respect to forsterite powder and cordierite powder. and Lead-free and non-alkali borosilicate glass powder At least one of Was obtained by laminating the low dielectric green sheet and the alumina green sheet after applying a conductor paste to the low dielectric green sheet and alumina green sheet containing 0.1 to 10% by mass in the total amount The laminate is fired at 1200 to 1500 ° C. As a result, it is possible to simultaneously fire the alumina ceramics excellent in strength and thermal conductivity and the dielectric layer having a low dielectric constant, and further, it is possible to form a conductor layer inside and on the surface of the substrate.
[0018]
Also, oxide powder containing at least one of Zn, Mn, and alkaline earth metal with respect to forsterite powder and cordierite powder and Lead-free and non-alkali borosilicate glass powder At least one of Is applied to a low dielectric green sheet and an alumina green sheet containing 10% by mass in a total amount of 20% by mass or less, and the low dielectric green sheet and the alumina green sheet are laminated. The obtained laminate is fired at 1200 to 1300 ° C. Thereby, even if there are many subcomponents, a dielectric layer having a low dielectric constant can be fired at the same time, and a conductor layer can be formed inside and on the surface of the substrate.
[0019]
In particular, prior to the lamination of the low dielectric green sheet and the alumina green sheet, the low dielectric green sheet and Alumina green sheet At least one of Preferably, a via hole is formed in the via hole and a conductor paste is filled in the via hole. As a result, three-dimensional wiring is possible inside the ceramic, and the multilayer ceramic substrate can be easily reduced in size, and functions such as capacitors and inductors can be incorporated.
[0020]
Furthermore, it is preferable to produce the low dielectric green sheet by adding the cordierite powder at a ratio of 20 to 40% by mass in the total amount. Thereby, the difference in thermal expansion coefficient with the alumina green sheet can be matched, and warpage and cracks during firing can be reduced.
[0021]
Furthermore, Mn ₂ O _Three 2-15% by mass, SiO ₂ 2 to 15 mass%, MgO, Mg (OH) ₂ , MgCO _Three , CaO, Ca (OH) ₂ , CaCO _Three , B ₂ O _Five , Nb ₂ O _Five , Cr ₂ O _Three And Co _Three O _Four It is preferable that at least one of them be mixed so that 0.1 to 4% by mass and the balance is alumina powder, and then molded to produce an alumina green sheet. Thereby, even if the firing temperature is reduced, it is easy to improve the product yield while maintaining the strength and thermal conductivity of the alumina insulating layer.
[0022]
Furthermore, 10 to 70% by volume of Cu powder, W powder and Mo powder At least one of Are preferably mixed at a rate of 30 to 90% by volume to produce the conductor paste. This makes it easy to form a low-resistance conductor layer even at a firing temperature of 1200 ° C. to 1500 ° C., which is higher than the melting point of Cu.
[0023]
DETAILED DESCRIPTION OF THE INVENTION
The composite ceramic component of the present invention will be described with reference to the drawings. FIG. 1 is a schematic cross-sectional view of a composite ceramic component of the present invention. That is, the alumina insulating layer 1 which is a thin layer sintered body mainly composed of alumina and the dielectric layer 2 having a lower dielectric constant than the alumina insulating layer 1 are integrally laminated. A conductor layer 3 and vias 4 including the surface conductor layer 3 a and the inner conductor layer 3 b are formed on the surface and inside of the insulating substrate 5.
[0024]
According to the present invention, it is important that the dielectric layer 2 has forsterite and cordierite as the main crystal phase. Forsterite is necessary to make the dielectric constant lower than that of the alumina insulating layer 1, and cordierite reduces the difference in thermal expansion coefficient with the alumina insulating layer 1 and reduces the residual stress due to firing. Generation | occurrence | production of the curvature and crack of a board | substrate can be suppressed.
[0025]
The thermal expansion coefficient of the dielectric layer 2 can be determined by adjusting the contents of forsterite and cordierite, and in particular, cordierite is 20 to 40% by mass, more preferably 25 to 35% by mass. preferable.
[0026]
Further, as a subcomponent, at least one of Zn, Mn and alkaline earth metal and Lead-free and non-alkali borosilicate glass At least one of It is important to include This subcomponent promotes the reaction with the alumina green sheet during firing, increases the adhesive strength with the alumina insulating layer 1, and ensures the integration of the alumina insulating layer 1 and the dielectric layer 2.
[0027]
In particular, it is important that the above-mentioned subcomponent is 0.1 to 10% by mass in the total amount in the dielectric layer 2, particularly 1 to 8% by mass, and further 3 to 6% by mass. Is preferred. Further, it is important that the above-mentioned subcomponent is contained in a proportion of more than 10% by mass and not more than 20% by mass in the total amount in the dielectric layer 2, and in particular, 12 to 19% by mass and 14 to 18% by mass are included. preferable. If the amount is less than 0.1% by mass, the effect of addition may not be sufficiently obtained. If the amount exceeds 20% by mass, the liquid phase flows out even at a firing temperature of 1200 ° C., and the shape of the dielectric layer 7 This is because the substrate cannot be held and warping or cracking of the substrate occurs.
[0028]
The insulating layer 1 is made of an alumina sintered body mainly composed of alumina. Specifically, the insulating layer 1 contains aluminum oxide in a proportion of 84% by mass or more, Mn is 2 to 15% by mass in terms of oxide, and Si is an oxide. It is preferable that 2-15 mass% in terms of conversion, and at least one of Mg, Ca, B, Nb, Cr and Co is contained in an amount of 0.1-4 mass% in terms of oxide. When this composition is used, it becomes easy to densify even at a low temperature and maintain high strength and high thermal conductivity.
[0029]
According to the present invention, in order to increase the thermal conductivity and strength of the insulating substrate 5, the relative density of the alumina insulating layer 1 is preferably 95% or more, particularly preferably 97% or more, more preferably 98% or more, and the bending strength is 350 MPa. As described above, it is particularly preferably 400 MPa or more, and more preferably 450 MPa or more. Furthermore, the thermal conductivity is preferably 10 W / m · K or more, particularly 15 W / m · K or more, and more preferably 17 W / m · K or more.
[0030]
The alumina main crystal phase forming the insulating layer 1 exists as granular or columnar crystals, and the average crystal grain size of the main crystal phase is preferably 1.5 to 5 μm. In addition, when the main crystal phase is composed of columnar crystals, the average crystal grain size is based on the minor axis diameter. If the average crystal grain size of the main crystal phase is smaller than 1.5 μm, it tends to be difficult to achieve high thermal conductivity, and if the average grain size is larger than 5 μm, sufficient strength required for use as a substrate material is required. This is because it tends to be difficult to obtain.
[0031]
Further, in this insulating layer 1, SiO 2 ₂ In addition, it is desirable to contain alkaline earth element oxides such as MgO, CaO, SrO, BaO in a ratio of 0.1 to 4% by mass in total in order to enhance the simultaneous sintering property with the Cu-containing conductor.
[0032]
Furthermore, you may contain transition metals, such as W and Mo, in the ratio of 2 mass% or less as a coloring component.
[0033]
Conductor layer 3 is Cu The 10-70% by volume, especially 30-60% by volume, W and Mo At least one of It is preferable to contain in the ratio of 30-90 volume%, especially 40-70 volume%.
The conductor layer 3 having such a composition has a sufficiently low electric resistance, and the conductor layer 3 and Dielectric layer 2 At least one of As a result, the conductor layer 3 is peeled off, the surface of the via 4 becomes uneven, and further, it is easy to suppress problems that the metal of the via 4 is missing during firing.
[0034]
Also, Cu and W of the above composition and Mo At least one of In addition, it is desirable to contain at least one of Zr, Al, Li, Mg, and Zn in an amount of 0.05 to 3.0% by mass in terms of metal element. Thereby, the resistance of the conductor layer 3 can be easily reduced, and the insulating layer 1 and Dielectric layer 2 At least one of There is an effect to further improve the adhesion.
[0035]
Also, according to the present invention, W and Mo At least one of However, it is low that it has a structure that is dispersed and contained in a matrix made of Cu in a state of spherical crystals having an average particle diameter of 1 to 10 μm, or in a state in which several particles are sintered and bonded. Desirable in terms of resistance and shape retention. In particular, from the viewpoint of resistance of the conductor layer, separation of the Cu component, bleeding, etc. and Mo At least one of It is more desirable that the average particle diameter is dispersed with a size of 1.3 to 5 μm, more preferably 1.5 to 3 μm.
[0036]
In the ceramic composite part of the present invention, the Cu component in the surface conductor layer 3a and the inner conductor layer 3b diffuses into the insulating layer 1 and the dielectric layer 2 by simultaneous firing at a temperature exceeding the melting point of Cu. However, according to the present invention, the dielectric layer 2 around the conductor layer 3 containing at least Cu is provided. and Insulating layer 1 At least one of It is desirable that the diffusion distance of Cu to be 20 μm or less, particularly 10 μm or less. Thereby, the insulation between the conductor layers 3 is ensured, and the reliability as a wiring board is enhanced.
[0037]
The composite ceramic component of the present invention having the above configuration is excellent in strength and thermal conductivity and has low reflection loss of high frequency signals. it can.
[0038]
Next, the manufacturing method of the composite ceramic component of this invention is demonstrated.
[0039]
First, in order to form the insulating layer 1, it is desirable to use a powder having an average particle size of 0.5 to 2.5 μm, particularly 0.5 to 2.0 μm, as an alumina raw material as a main component. When the average particle size is smaller than 0.5 μm, it is difficult to handle the powder and the cost of the powder tends to increase. When larger than 2.5 μm, it may be difficult to fire at a temperature of 1500 ° C. or less. This is because there are many.
[0040]
Also, with respect to the aluminum oxide powder, Mn ₂ O _Three 2-15% by weight of powder, especially 3-7% by weight, SiO ₂ The powder is added in a proportion of 2 to 15% by weight, in particular 3 to 7% by weight. Also, MgO, Mg (OH) as appropriate ₂ , MgCO _Three , CaO, Ca (OH) ₂ , CaCO _Three , B ₂ O _Five , Nb ₂ O _Five , Cr ₂ O _Three And CoO _Three Of these, it is preferable to add at least one powder in an amount of 0.1 to 4% by mass. Thereby, in order to enable firing at a low temperature, a dense alumina insulating layer is obtained, and the metal of the conductor layer 3 and the via 4 melts and flows out at the time of firing while substantially maintaining the strength and the thermal conductivity. This can be prevented and the product yield can be easily increased.
[0041]
Furthermore, transition metal metal powders and oxide powders such as W, Mo, and Cr can be added to the above powder composition as a coloring component in a proportion of 2% by mass or less in terms of metal.
[0042]
On the other hand, in order to form the dielectric layer 2, forsterite powder, cordierite powder, and oxide powder containing at least one of Zn, Mn, and alkaline earth metal as subcomponents and Lead-free and non-alkali borosilicate glass powder At least one of Is preferably added so as to contain 0.1 to 10% by mass in the total amount, or more than 10% by mass and 20% by mass or less, particularly 1 to 8% by mass, and further 3 to 6%. It is preferable to add at a ratio of mass%, or particularly 12 to 19 mass%, more preferably 14 to 18 mass%.
[0043]
By adding the subcomponent in a proportion of 0.1 to 10% by mass or exceeding 10% by mass and not more than 20% by mass, the reaction with the alumina green sheet is promoted at the time of firing, and a strong reaction layer is formed. Making it possible to improve adhesion. Further, the cordierite powder is preferably added in a proportion of 20 to 40% by mass, particularly 25 to 35% by mass in order to enhance the sinterability and reduce the residual stress during firing.
[0044]
Here, the alkaline earth metal of the accessory component is an oxide powder such as Mg, Ca, Sr, Ba, etc. Further, the use of a non-lead / non-alkali borosilicate glass powder has a significant burden on the environment. This is because alkali causes insulation failure between wirings, and examples thereof include Si—Al—B—O, Si—B—Ca—O, and Si—Al—B—Mg—Zn—O.
[0045]
MgO, Al ₂ O _Three , SiO ₂ In addition, at least a part of the forsterite powder and the cordierite powder may be substituted so as to have a composition that precipitates forsterite and cordierite with these composite oxides. In addition to the oxide powder, the oxide may be added as carbonate, nitrate, acetate, or the like capable of forming an oxide by firing.
[0046]
Next, the sheet-like molded object for forming the insulating layer 1 using each mixed powder is produced. The sheet-like molded body can be produced by a known molding method. For example, an organic binder or solvent is added to the above mixed powder to prepare a slurry, and then formed by a doctor blade method, or an organic binder is added to the mixed powder, and a predetermined thickness is obtained by press molding, rolling molding, extrusion molding, or the like. The sheet-like molded body can be produced. Then, via hole conductor through holes may be formed on the sheet-like molded body by a micro drill, a laser, or the like.
[0047]
Thus, with respect to the produced sheet-like molded object, as a conductor component, Cu powder with an average particle diameter of 1-10 micrometers is 10-70 volume%, especially 30-60 volume%, and an average particle diameter is 1-10 micrometers. W powder and Mo powder At least one of 30 to 90% by volume, particularly 40 to 70% by volume, and optionally, at least one of Zr, Al, Li, Mg and Zn is 0.05 to 3.0% by mass in terms of metal element. In particular, a conductor paste containing 0.2 to 2.0% by mass is prepared.
[0048]
When the Cu powder is less than 10% by volume, the resistance of the conductor layer 3 tends to be high. When the Cu powder is more than 70% by volume, the shape retention is improved in simultaneous firing of the alumina insulating layer 1, the dielectric layer 2, and the conductor layer 3. It becomes difficult to maintain, bleeding or disconnection occurs, or the alumina insulating layer 1 and Dielectric layer 2 At least one of The conductor layer 3 is peeled off from the metal or the metal inside the via 4 is lost.
[0049]
Then, the paste is filled in the vias 4 applied to the respective sheet-like molded bodies, and applied to the surface of each sheet-like molded body. When forming the conductor layer, the conductor paste is applied to the insulating layer 1 by a method such as screen printing or gravure printing.
[0050]
In these conductor pastes, 0.05 to 2% by volume of aluminum oxide powder or the same composition powder as the oxide ceramic component forming the insulating layer 1 is used in order to enhance the adhesion to the insulating layer 1. It is also possible to add in proportions.
[0051]
Next, it is important that the sheet-like molded body having the conductor paste on the surface and / or the via 4 is aligned and laminated and pressure-bonded, and then the laminated body is fired under conditions where the firing temperature is 1200 to 1500 ° C. is there. In particular, when the subcomponent is 1 to 10% by mass, it is preferable to fire at 1225 to 1450 ° C, further 1250 to 1400 ° C, and more preferably 1275 to 1350 ° C.
[0052]
In the case where the subcomponent is 1 to 10% by mass, if the firing temperature is lower than 1200 ° C., the alumina insulating layer 1 cannot reach the relative density of 95%, the thermal conductivity and the strength decrease, and the dielectric The body layer 2 cannot be sufficiently densified. On the other hand, if the firing temperature is higher than 1500 ° C., the sintering of W or Mo itself proceeds and it becomes difficult to maintain the uniform structure of the conductor layer 3 due to the flow of Cu, and as a result, low resistance can be maintained. Can not.
[0053]
Moreover, when a subcomponent exceeds 10 mass% and it is 20 mass% or less, it can be baked at 1200-1300 degreeC, Especially 1220-1290 degreeC, Furthermore, 1240-1280 degreeC is preferable at the point of sinterability. Here, when the firing temperature exceeds 1300 ° C., since there are many auxiliary components, the dielectric layer cannot be held, so the substrate is warped or cracked, the reflection loss increases, and the wiring conductor is abnormal. Will occur.
[0054]
The non-oxidizing atmosphere at the time of firing is preferably nitrogen or a mixed atmosphere of nitrogen and hydrogen. In particular, in order to suppress the diffusion of Cu in the conductor layer 3, hydrogen and nitrogen are used. A non-oxidizing atmosphere with a dew point of + 30 ° C. or lower, particularly 0 to 25 ° C. is desirable. When the dew point at the time of firing is higher than + 30 ° C., the conductor material reacts with moisture in the atmosphere during firing to form an oxide film, and the alumina-based insulating layer 1 and Cu of the Cu-containing conductor react with each other. This is because it not only hinders resistance reduction but also promotes Cu diffusion. Note that an inert gas such as an argon gas may be mixed in the firing atmosphere as desired.
[0055]
In the method of manufacturing a composite ceramic component having the above-described configuration, the alumina insulating layer, the dielectric layer 2 and the conductor layer 3 having a small electric resistance can be simultaneously fired. is important. By this method, a composite ceramic part having a low strength, high strength and high thermal conductivity insulating substrate can be realized.
[0056]
【Example】
As an alumina insulating layer, alumina powder (average particle size 1.8 μm), Mn ₂ O _Three Powder, SiO ₂ Powder, MgO powder, CaO powder, B ₂ O _Five Powder, Nb ₂ O _Five Powder, Cr ₂ O _Three Powder, Co _Three O _Four The powder was prepared in the composition shown in Table 1, and after preparing a slurry by mixing an acrylic binder as a molding organic resin (binder) and toluene as a solvent, a sheet having a thickness of 250 μm was formed by a doctor blade method. Molded into. And the via hole whose hole diameter after baking is 100-200 micrometers was formed in the predetermined location.
[0057]
For dielectric layers with low dielectric constant, forsterite powder, cordierite powder, Zn ₂ SiO _Four Powder, Mn ₂ O _Three Powder, CaO powder, MgO powder, BaO powder, SrO powder and non-lead / non-alkali borosilicate glass powder are prepared in the composition shown in Table 1, and acrylic binder and toluene are used as the molding organic resin (binder). A slurry was prepared by mixing as a solvent. After these slurries were formed into a sheet having a thickness of 250 μm by the doctor blade method, vias having a hole diameter after firing of 100 to 200 μm were formed at predetermined locations.
[0058]
Next, Cu powder having an average particle diameter of 5 μm and W powder or Mo powder having an average particle diameter of 5 μm were mixed at a ratio shown in Table 1, and an acrylic binder was used as a solvent to prepare a conductor paste.
[0059]
Next, the conductor paste was printed and applied onto the sheet-like molded body, and the vias of each sheet-like molded body were filled with the conductor paste. Each sheet-like molded body produced as described above was positioned and laminated and pressure-bonded to produce a molded body laminate.
[0060]
Thereafter, this molded body laminate was degreased in an oxygen-containing atmosphere substantially free of moisture, and then fired in a nitrogen-hydrogen mixed atmosphere having a dew point of 25 ° C. as shown in Table 1. Such composite ceramic parts were made.
[0061]
The specific gravity of the obtained sintered body was measured by the Archimedes method, and the relative density was calculated from the true specific gravity. In addition, warpage and cracking of the entire composite ceramic part were confirmed, and the appearance of wiring and vias was confirmed.
[0062]
The relative dielectric constant was measured at a measurement frequency of 60 GHz by the cavity resonator method based on JIS R1627. Furthermore, the strength of the alumina insulating layer was measured by a three-point bending strength at room temperature based on JIS R1601.
[0063]
The main crystal phase in the dielectric layer was determined by identifying the peak obtained by X-ray diffraction.
[0064]
The content of forsterite and cordierite was measured using X-ray diffraction and lead belt analysis. The reflection loss was measured for a 60 GHz signal using a network analyzer and a wafer probe. Specifically, the value between the substrate on which the ceramic component was mounted and the measurement electrode provided in the ceramic component was measured. The results are shown in Tables 1 and 2.
[0065]
[Table 1]

[0066]
[Table 2]

[0067]
Sample No. of the present invention. 1 to 3 and 5 to 48 had no external appearance of wiring / via, no warpage of the substrate, no cracks, and a reflection loss of −12.5 dB or less.
[0068]
On the other hand, sample no. In No. 4, a dense low dielectric constant layer was not obtained.
[0069]
In addition, the sample No. out of the scope of the present invention in which the minor component exceeds 20% by mass. In No. 49, the liquid phase flowed out during firing, and the shape could not be maintained.
[0070]
【The invention's effect】
The composite ceramic component of the present invention is formed by integrally laminating an alumina insulating layer and a low dielectric constant dielectric layer. and internal At least one of A composite ceramic part with high strength, high thermal conductivity, and low resistance conductor wiring that can handle high frequency regions has been realized by controlling the composition of the dielectric layer by having a structure with an insulating substrate on which a conductor layer is formed. .
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional view showing one embodiment of a composite ceramic component of the present invention.
[Explanation of symbols]
1 ... Alumina insulating layer
2 ... Dielectric layer
3. Conductor layer
3a ... surface conductor layer
3b ... Inner conductor layer
4 ... Via
5 ... Insulating substrate

Claims (12)

Insulation in which an alumina insulating layer and a dielectric layer having a dielectric constant lower than that of the alumina insulating layer are laminated and integrated by cofiring, and a conductor layer is formed on at least one of the surface and the inside. comprising a substrate, wherein the dielectric layer is a main crystal phase forsterite and cordierite, as a secondary component, Zn, at least one of the at least one and a non-lead-non-alkali borosilicate glass of Mn and alkaline earth metal A composite ceramic component comprising 0.1 to 10% by mass in the total amount. Insulation in which an alumina insulating layer and a dielectric layer having a dielectric constant lower than that of the alumina insulating layer are laminated and integrated by cofiring, and a conductor layer is formed on at least one of the surface and the inside. comprising a substrate, wherein the dielectric layer is a main crystal phase forsterite and cordierite, as a secondary component, Zn, at least one of the at least one and a non-lead-non-alkali borosilicate glass of Mn and alkaline earth metal A composite ceramic component comprising 10% by mass in a total amount and 20% by mass or less. 3. The composite ceramic component according to claim 1, wherein the dielectric layer contains cordierite in a proportion of 20 to 40% by mass in the total amount. The composite ceramic component according to any one of claims 1 to 3, wherein the alumina insulating layer has a three-point bending strength of 350 MPa or more. The alumina insulating layer is an oxide of at least one of Mg, Ca, B, Nb, Cr and Co, Mn being 2 to 15% by mass in terms of oxide, Si being 2 to 15% by mass in terms of oxide 5. The composite ceramic component according to claim 1, wherein the composite ceramic component is contained in an amount of 0.1 to 4% by mass and has a relative density of 95% or more. The composite ceramic component according to any one of claims 1 to 5, wherein the conductor layer contains 10 to 70% by volume of Cu and 30 to 90% by volume of at least one of W and Mo. Against forsterite powder and cordierite powder, Zn, in at least one of the total amount of oxide powder and lead-free, non-alkali borosilicate glass powder containing at least one of Mn and alkaline-earth metals 0.1 to 10 After applying a conductor paste to the low dielectric green sheet and alumina green sheet containing at a mass percentage, the low dielectric green sheet and the alumina green sheet are laminated, and the resulting laminate is 1200 to 1500 ° C. A method for producing a composite ceramic part, comprising firing. Against forsterite powder and cordierite powder, Zn, at least one oxide powder and lead-free, non-alkali borosilicate glass powder containing at least one of Mn and alkaline earth metals, a 10 mass% in the total amount After the conductive paste is applied to the low dielectric green sheet and the alumina green sheet that are included in a proportion exceeding 20% by mass, the low dielectric green sheet and the alumina green sheet are laminated, and the obtained laminate is 1200. A method for producing a composite ceramic component, comprising firing at ˜1300 ° C. Prior to the lamination of the low dielectric green sheet and the alumina green sheet, a via hole is formed in at least one of the low dielectric green sheet and the alumina green sheet, and a conductor paste is filled in the via hole. The method for producing a composite ceramic part according to claim 7 or 8, characterized in that: The method for producing a composite ceramic component according to any one of claims 7 to 9, wherein the cordierite powder is added at a ratio of 20 to 40% by mass in the total amount to produce the low dielectric green sheet. Mn ₂ O ₃ is 2 to 15% by mass, SiO ₂ is ₂ to 15% by mass, MgO, Mg (OH) ₂ , MgCO ₃ , CaO, Ca (OH) ₂ , CaCO ₃ , B ₂ O ₅ , Nb ₂ O ₅ , at least one of Cr ₂ O ₃ and Co ₃ O ₄ is mixed in an amount of 0.1 to 4% by mass and the balance is alumina powder, and then molded to produce an alumina green sheet. A method for producing a composite ceramic part according to claim 7. 12. The conductor paste is produced by mixing 10 to 70% by volume of Cu powder and at least one of W powder and Mo powder at a rate of 30 to 90% by volume. A method for producing the composite ceramic component as described.

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