JP3938680B2 - LIQUID CRYSTAL DISPLAY SUBSTRATE, ITS MANUFACTURING METHOD, AND LIQUID CRYSTAL DISPLAY DEVICE EQUIPPED WITH THE SAME - Google Patents

Description

BACKGROUND OF THE INVENTION
The present invention relates to a substrate for a liquid crystal display device used in a display unit such as a personal computer (PC) or a word processor, a liquid crystal display device including the same, and a method for manufacturing the same.
[0001]
[Prior art]
A conventional liquid crystal display device has spherical spacers such as plastic beads having substantially the same particle diameter, which are distributed between substrates in order to maintain a predetermined cell gap. However, when the spherical spacers are dispersed on one substrate before the two substrates are bonded together, it is difficult to uniformly distribute the entire substrate. In the liquid crystal display device in which the spherical spacers are not uniformly distributed, the cell gap is likely to change when the substrate surface is pressurized.
[0002]
On the other hand, JP-A-56-140324, JP-A-63-82405, JP-A-4-93924, JP-A-5-196946 and the like disclose a color filter (CF) substrate. Discloses a method of forming a columnar spacer by laminating a plurality of CF resin layers at the end of the pixel region.
[0003]
FIG. 67 shows the configuration of a CF substrate of a conventional MVA (Multi-domain Vertical Alignment) mode liquid crystal display device for two pixels of red (R) and green (G). FIG. 68 shows a cross section of the CF substrate cut along the line WW in FIG. As shown in FIGS. 67 and 68, a light-shielding film (BM) 102 that shields the pixel region end is formed on the glass substrate 104. CF resin layers R and G are formed in each pixel region defined by the BM 102. On the CF resin layers R and G, linear protrusions (banks) 108 that regulate the alignment of the liquid crystal are formed obliquely with respect to the edge of the pixel region. Columnar spacers 106 are formed in the gaps between the R and G pixels.
[0004]
FIG. 69 shows a cross section in the vicinity of the columnar spacer 106 cut along line XX in FIG. In FIG. 69, the protrusion 108 is not shown. As shown in FIG. 69, the columnar spacer 106 is formed of CF resin layers R, G, blue (B), a common electrode 110, and a resist layer 109, which are sequentially stacked on the BM 102.
[0005]
Next, a conventional method for manufacturing a CF substrate will be described. FIG. 70 shows a manufacturing process of a conventional CF substrate, and FIG. 71 shows a cross section taken along line YY of FIG. 72 shows a cross section taken along line ZZ of FIG. First, as shown in FIGS. 70 and 71, chromium (Cr) or the like is formed on the entire surface of the glass substrate 104 and patterned to form the BM 102. Next, a photosensitive resist in which a red pigment is dispersed (hereinafter referred to as “R resist”) is applied and patterned on the entire surface, and a CF resin layer R is formed in a pixel region for displaying R and a columnar spacer 106 formation region. . Similarly, the CF resin layer G is formed in the pixel region for displaying G and the columnar spacer 106 formation region, and the CF resin layer B is formed in the pixel region (not shown) for displaying B and the columnar spacer 106 formation region. As shown in FIG. 71, each CF resin layer R, G, B has a groove shape with a depth of 1 to 2 μm between the CF resin layers R, G, with about 1/3 of the width of the BM 102 overlapping the BM 102. A gap 112 is formed in which a gap is generated. As shown in FIG. 72, CF resin layers R, G, and B are laminated in this order in the columnar spacer formation region 106 ′.
[0006]
Next, ITO (Indium Tin Oxide) or the like is formed on the entire surface of the CF resin layers R, G, and B to form the common electrode 110. Next, a positive novolac resist is applied to the entire surface and patterned to form the protrusions 108 and the resist layer 109 at the same time, thereby completing the CF substrate shown in FIGS.
[Problems to be solved by the invention]
[0007]
As shown in FIGS. 70 and 71, in the conventional CF substrate, when the CF resin layers R and G are sequentially formed, the depth between the CF resin layers R and G is 1-2 μm adjacent to the columnar spacer formation region 106 ′. The gap portion 112 is formed. Therefore, when a photosensitive resist in which a blue pigment is dispersed (hereinafter referred to as “B resist”) is applied to the entire surface of the CF resin layers R and G, the leveling (planarization) action of the B resist causes a relatively high level. The B resist flows into the gap 102 from the tall columnar spacer formation region 106 ′. As a result, the CF resin layer B in the columnar spacer formation region 106 ′ is formed with a thin film thickness. For the same reason, the resist layer 109 in the columnar spacer formation region 106 ′ is also formed with a thin film thickness. Therefore, in order to form the columnar spacer 106 with which a desired cell gap can be obtained, there is a problem that the CF resin layers R, G, B, etc. must be thickened.
[0008]
Japanese Patent Application Laid-Open No. 10-104639 discloses a method in which a dam is created around the columnar spacer by the first or second CF resin layer, and resist flow is blocked by the dam to increase the height of the columnar spacer. Is disclosed. However, in the above method, it is necessary to form both the columnar spacer and the weir arranged around the columnar spacer on the BM. For this reason, if the width of the BM is narrow, the thickness of the columnar spacer has to be shortened by the amount of the weir, and there is a risk that the compression strength that can resist finger pressing on the panel cannot be obtained. In order to increase the thickness of the columnar spacer, it must be formed outside the BM. In this case, there is a problem that the aperture ratio decreases.
[0009]
An object of the present invention is to provide a substrate for a liquid crystal display device, a liquid crystal display device including the same, and a method for manufacturing the same, in which a desired cell gap can be easily obtained.
Another object of the present invention is to provide a substrate for a liquid crystal display device with high brightness, a liquid crystal display device including the same, and a method for manufacturing the same.
[0010]
[Means for Solving the Problems]
The object is to place a liquid crystal together with a counter substrate arranged opposite to each other, a plurality of pixel regions arranged in a matrix on the substrate, and an end of the pixel region to maintain a cell gap Columnar spacers, and a plurality of color filter resin layers formed in the pixel region and formed at least around the columnar spacers so that no gaps are formed between the adjacent pixel regions. This is achieved by the liquid crystal display device substrate.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
[First Embodiment]
A substrate for a liquid crystal display device according to a first embodiment of the present invention, a liquid crystal display device including the same, and a method for manufacturing the same will be described with reference to FIGS. In this embodiment, the CF resin layer and the resist layer are prevented from flowing out from the columnar spacer formation region by not forming a gap around the columnar spacer. In the present embodiment, the CF resin layer and the resist layer are dried under reduced pressure to prevent the CF resin layer and the resist layer from flowing out of the columnar spacer formation region. Hereinafter, the substrate for a liquid crystal display device according to the present embodiment, the liquid crystal display device including the substrate, and the manufacturing method thereof will be described more specifically with reference to Examples 1-1 to 1-6.
[0012]
(Example 1-1)
First, a substrate for a liquid crystal display device according to Example 1-1, a liquid crystal display device including the same, and a method for manufacturing the same will be described with reference to FIGS. FIG. 1 shows a schematic configuration of the liquid crystal display device according to this embodiment. In the liquid crystal display device, a TFT substrate 2 on which a thin film transistor (TFT) or the like is formed and a CF substrate 4 on which a color filter (CF) or the like is formed are bonded to each other, and a liquid crystal is interposed therebetween. It has an enclosed structure.
[0013]
FIG. 2 shows an equivalent circuit of elements formed on the TFT substrate 2. On the TFT substrate 2, a plurality of gate bus lines 6 extending in the left-right direction in the drawing are formed in parallel with each other, and a plurality of drain bus lines 8 extending in the vertical direction in the drawing so as to intersect with each other at substantially right angles are formed in parallel to each other. ing. Each region surrounded by the plurality of gate bus lines 6 and drain bus lines 8 is a pixel region on the TFT substrate 2 side. A TFT 10 and a pixel electrode 12 are formed in each pixel region. The drain electrode of each TFT 10 is connected to the adjacent drain bus line 8, the gate electrode is connected to the adjacent gate bus line 6, and the source electrode is connected to the pixel electrode 12. A storage capacitor bus line 14 is formed substantially in the center of each pixel region in parallel with the gate bus line 6. These TFT 10, pixel electrode 12, and each bus line 6, 8, 14 are formed by a photolithography process, and are formed by repeating a series of semiconductor processes of “film formation → resist application → exposure → development → etching → resist peeling”. Is done.
[0014]
On the other hand, although not shown, a BM that defines a pixel region on the CF substrate 4 side is formed on the CF substrate 4. One of the CF resin layers R, G, and B is formed in each pixel region on the CF substrate 4 side.
[0015]
Returning to FIG. 1, the TFT substrate 2 sealed with the liquid crystal and disposed opposite to the CF substrate 4 has a gate drive circuit 16 on which a driver IC for driving a plurality of gate bus lines 6 is mounted, and a plurality of drain buses. A drain driving circuit 18 on which a driver IC for driving the line 8 is mounted is provided. The drive circuits 16 and 18 are configured to output a scanning signal and a data signal to a predetermined gate bus line 6 or drain bus line 8 based on a predetermined signal output from the control circuit 20. A polarizing plate 22 is disposed on the substrate surface opposite to the element formation surface of the TFT substrate 2, and a backlight unit 24 is attached to the surface of the polarizing plate 22 opposite to the TFT substrate 2. On the surface of the CF substrate 4 opposite to the CF forming surface, a polarizing plate 26 disposed in crossed Nicols with the polarizing plate 22 is attached.
[0016]
Next, the configuration of the liquid crystal display device substrate according to the present embodiment will be described. FIG. 3 shows the configuration of the substrate for a liquid crystal display device according to the present embodiment for two pixels of R and G. 4 is a cross-sectional view of the substrate for a liquid crystal display device taken along line AA shown in FIG. As shown in FIGS. 3 and 4, the CF substrate 4 has a BM 30 made of low-reflection Cr or the like on a glass substrate 28. On the BM 30, the CF resin layers R and G are formed so that the right end side of the CF resin layer R in the drawing and the left end side of the CF resin layer G in the drawing contact each other. For this reason, a gap 112 as shown in FIGS. 67 and 68 is not formed between the CF resin layers R and G. On the CF resin layers R and G, linear protrusions 32 for regulating the alignment of the liquid crystal are formed. Columnar spacers 34 are formed between the pixel regions (center in FIG. 3). In FIG. 4, the common electrode 40 formed on the CF resin layers R and G is not shown.
[0017]
FIG. 5 is a cross-sectional view showing a configuration in the vicinity of the columnar spacer 34 cut along the line BB shown in FIG. As shown in FIG. 5, the columnar spacer 34 is composed of CF resin layers R, G, and B sequentially stacked on the BM 30, a resist layer 33 formed on the upper layer, and the like. The resist layer 33 is formed of the same material as that of the protrusions 32.
[0018]
Next, a method for manufacturing a substrate for a liquid crystal display device according to the present embodiment will be described with reference to FIGS. 6 to 12 are process cross-sectional views illustrating a method for manufacturing a substrate for a liquid crystal display device according to the present embodiment, and show the same cross section as FIG. First, as shown in FIG. 6, for example, a low reflection Cr film is formed on the entire surface of a transparent glass substrate 28 to form a low reflection Cr film 31. Next, as shown in FIG. 7, for example, a positive novolak resist is applied to the entire surface of the low-reflection Cr film 31 and prebaked to form a resist layer 36 having a thickness of 1.2 μm, for example. Next, as shown in FIG. 8, the resist layer 36 is exposed using an exposure mask (photomask) 38. Next, as shown in FIG. 9, the exposed resist layer 36 is developed and post-baked to form a resist pattern 37. Next, as shown in FIG. 10, etching is performed using the resist pattern 37 as an etching mask. Next, as shown in FIG. 11, the resist pattern 37 is removed to form the BM 30.
[0019]
Next, for example, a photosensitive pigment dispersion type R resist is applied to a film thickness of 1.5 μm on the entire surface of the glass substrate 28 on which the BM 30 is formed. Subsequently, the R resist immediately after coating is forcibly dried by vacuum drying. Thereafter, pre-baking and patterning are performed, and a CF resin layer R is formed in the R pixel region and the columnar spacer formation region 34 'as shown in FIGS. The CF resin layer R is formed so that about ½ of the width of the BM 30 overlaps the BM 30.
[0020]
Next, in the same process as the CF resin layer R, the CF resin layer G is formed in the G pixel region and the columnar spacer formation region 34 ′. The CF resin layer G is formed so that the left end side of the CF resin layer G is in contact with the right end side of the CF resin layer R. Therefore, the gap portion 112 shown in FIGS. 67 and 68 is not formed between both ends. Next, in the same process as the CF resin layers R and G, the CF resin layer B is formed in the B pixel region (not shown) and the columnar spacer formation region 34 ′.
[0021]
FIG. 14 is a cross-sectional view showing a configuration in the vicinity of the columnar spacer formation region 34 ′ cut along the line CC in FIG. As shown in FIG. 14, CF resin layers R, G, and B are laminated in this order in the columnar spacer formation region 34 ′ on the BM 30.
[0022]
Next, ITO or the like is formed on the entire surface, and the common electrode 40 having a thickness of 150 nm, for example, is formed. Next, on the entire surface of the common electrode 40, for example, a positive novolac resist is applied to a thickness of 1.5 μm to form a resist layer. Subsequently, the resist layer immediately after coating is forcibly dried by vacuum drying. Thereafter, pre-baking and patterning are performed to simultaneously form the protrusion 32 and the resist layer 33 of the columnar spacer 34. Through the above steps, the CF substrate 4 of the substrate for a liquid crystal display device according to the present embodiment as shown in FIGS. 3 and 4 is completed.
[0023]
According to the method for manufacturing a substrate for a liquid crystal display device of the present embodiment, the gap portion 112 of the conventional CF substrate shown in FIGS. 67 and 68 is not formed. For this reason, since the CF resin layer B and the resist layer 33 do not flow from the columnar spacer formation region 34 ′ into the gap 112, the leveling property of the CF resin layer B and the resist layer 33 can be lowered. In addition, according to the present embodiment, the CF resin layers R, G, B and the resist layer 33 constituting the columnar spacers are dried under reduced pressure immediately after application, so that the CF resin layers R, G, B, and the resist layer 33 are formed. Leveling properties can be reduced. Therefore, the columnar spacer 34 having a desired height can be formed.
[0024]
(Example 1-2)
Next, a substrate for a liquid crystal display device according to Example 1-2 and a manufacturing method thereof will be described with reference to FIGS. FIG. 15 shows the configuration of the substrate for a liquid crystal display device according to this example with respect to two pixels of R and G. In addition, the same code | symbol is attached | subjected about the component which has the same function effect | action as the component of the board | substrate for liquid crystal display devices by Example 1-1 shown in FIG. 3, and the description is abbreviate | omitted. As shown in FIG. 15, in the CF substrate 4, the right end side of the CF resin layer R and the left end side of the CF resin layer G are in contact with each other only within a distance L (for example, 50 μm) from the columnar spacer 34. 1 is formed. That is, the gap 42 between the CF resin layers R and G is not formed within the distance L from the columnar spacer 34.
[0025]
Next, a method for manufacturing a substrate for a liquid crystal display device according to the present embodiment will be described with reference to FIGS. First, the BM 30 is formed in the same process as the manufacturing method of the substrate for a liquid crystal display device according to Example 1-1 shown in FIGS. Next, for example, a photosensitive pigment dispersion type R resist is applied to a thickness of 1.5 μm on the entire surface of the glass substrate 28 on which the BM 30 is formed. Subsequently, the R resist immediately after coating is forcibly dried by vacuum drying. Thereafter, pre-baking and patterning are performed, and a CF resin layer R is formed in the R pixel region and the columnar spacer formation region 34 'as shown in FIG. The CF resin layer R is formed such that about ½ of the width of the BM 30 overlaps the BM 30 within a distance L from the columnar spacer formation region 34 ′. In the gap portion 42 outside the range, the width of the BM 30 is About 1/3 is formed so as to overlap with BM30.
[0026]
Next, in the same process as the CF resin layer R, the CF resin layer G is formed in the G pixel region and the columnar spacer formation region 34 ′ as shown in FIG. At this time, a gap 112 shown in FIGS. 67 and 68 is formed between the left end side of the CF resin layer G and the right end side of the CF resin layer R within a distance L from the columnar spacer formation region 34 ′. Do not be. Next, the CF resin layer B is formed in the B pixel region and the columnar spacer formation region 34 ′ in the same process as the CF resin layers R and G.
[0027]
Next, ITO or the like is formed on the entire surface, and the common electrode 40 having a thickness of 150 nm, for example, is formed. Next, on the entire surface of the common electrode 40, for example, a positive novolac resist is applied to a thickness of 1.5 μm to form a resist layer. Subsequently, the resist layer immediately after coating is forcibly dried by vacuum drying. Thereafter, pre-baking and patterning are performed to simultaneously form the protrusion 32 and the resist layer 33 of the columnar spacer 34. Through the above steps, the CF substrate 4 of the substrate for a liquid crystal display device according to the present embodiment as shown in FIG. 15 is completed.
[0028]
According to the present embodiment, the same effects as those of the embodiment 1-1 can be obtained. Further, since the right end side of the CF resin layer R and the left end side of the CF resin layer G only need to be in contact with each other only around the columnar spacer 34, the formation of the CF resin layers R, G, and B is performed in Example 1-1. Compared to easier.
[0029]
(Example 1-3)
Next, a substrate for a liquid crystal display device according to Example 1-3 and a manufacturing method thereof will be described with reference to FIGS. FIG. 17 shows the configuration of the substrate for a liquid crystal display device according to this example with respect to two R and G pixels. 18 is a cross-sectional view of the substrate for a liquid crystal display device taken along line DD in FIG. In addition, the same code | symbol is attached | subjected about the component which has the same function effect | action as the component of the board | substrate for liquid crystal display devices by Example 1-1 shown in FIG. 3, and the description is abbreviate | omitted. As shown in FIGS. 17 and 18, for example, a positive novolak resist pattern 37 having a film thickness of 1.2 μm used when patterning the BM 30 remains on the BM 30 without being peeled off. The CF resin layer R is formed so that about 1/3 of the width of the BM 30 (width of the resist pattern 37) overlaps the resist pattern 37, and the CF resin layer G has about 1/3 of the width of the BM 30. It is formed so as to overlap.
[0030]
FIG. 19 is a cross-sectional view showing a configuration in the vicinity of the columnar spacer 34 cut along the line EE shown in FIG. As illustrated in FIG. 19, the columnar spacer 34 includes a resist pattern 37, CF resin layers R, G, and B, a common electrode 40, and a resist layer 33 that are sequentially stacked on the BM 30. The resist layer 33 is formed of the same material as that of the protrusions 32.
[0031]
Next, a method for manufacturing a substrate for a liquid crystal display device according to this embodiment will be described with reference to FIGS. FIG. 20 is a diagram showing a method for manufacturing a substrate for a liquid crystal display device according to this example, and FIG. 21 is a process sectional view showing a section cut along the line FF in FIG. First, the BM 30 is formed on the glass substrate 28 by the steps shown in FIGS. Next, without peeling off the resist pattern 37 on the BM 30, for example, a photosensitive pigment dispersion type R resist is applied to a thickness of 1.5 μm on the entire surface of the glass substrate 28. Subsequently, the R resist immediately after coating is forcibly dried by vacuum drying. Thereafter, pre-baking and patterning are performed, and a CF resin layer R is formed in the R pixel region and the columnar spacer formation region 34 'as shown in FIGS. The CF resin layer R is formed so that about 1/3 of the width of the BM 30 overlaps the resist pattern 37.
[0032]
Next, in the same process as the CF resin layer R, the CF resin layer G is formed in the G pixel region and the columnar spacer formation region 34 ′. The CF resin layer G is formed so that about 1/3 of the width of the BM 30 overlaps the resist pattern 37. Next, the CF resin layer B is formed in the B pixel region and the columnar spacer formation region 34 ′ in the same process as the CF resin layers R and G.
[0033]
FIG. 22 is a cross-sectional view showing the configuration in the vicinity of the columnar spacer formation region 34 ′ cut along the line GG in FIG. As shown in FIG. 22, a resist pattern 37 and CF resin layers R, G, and B are laminated in this order in the columnar spacer formation region 34 ′ on the BM 30.
[0034]
Next, ITO or the like is formed on the entire surface, and the common electrode 40 having a thickness of 150 nm, for example, is formed. Next, on the entire surface of the common electrode 40, for example, a positive novolac resist is applied to a thickness of 1.5 μm to form a resist layer. Subsequently, the resist layer immediately after coating is forcibly dried by vacuum drying. Thereafter, pre-baking and patterning are performed to simultaneously form the protrusion 32 and the resist layer 33 of the columnar spacer 34. Through the above steps, the CF substrate 4 of the substrate for a liquid crystal display device according to the present embodiment as shown in FIGS. 17 and 18 is completed.
[0035]
According to the present embodiment, the same effects as those of the embodiment 1-1 can be obtained. Further, for example, since it is not necessary to form the CF resin layers R and G so that no gap is generated between the right end side of the CF resin layer R and the left end side of the CF resin layer G, formation of the CF resin layers R, G, and B is possible. However, it becomes easier compared with Example 1-1. Furthermore, since the resist pattern 37 used when patterning the BM 30 is left without being peeled off, the resist pattern 37 is not required to be peeled off, and the manufacturing process can be simplified as compared with the embodiment 1-1. .
[0036]
(Example 1-4)
Next, a substrate for a liquid crystal display device according to Example 1-4 and a method for manufacturing the same will be described with reference to FIGS. FIG. 23 shows the configuration of the substrate for a liquid crystal display device according to this example for two pixels of R and G. 24 is a cross-sectional view of the substrate for a liquid crystal display device taken along line II in FIG. In addition, the same code | symbol is attached | subjected about the component which has the same function effect | action as the component of the board | substrate for liquid crystal display devices by Example 1-1 shown in FIG. 3, and the description is abbreviate | omitted. As shown in FIGS. 23 and 24, a positive novolak resist pattern 37 having a film thickness of 1.2 μm, for example, used for patterning the BM 30 remains on the BM 30 without being peeled off. The CF resin layers R and G are formed so that no gap is formed between the right end side of the CF resin layer R in the drawing and the left end side of the CF resin layer G in the drawing. For this reason, the gap 112 shown in FIGS. 67 and 68 is not formed between the CF resin layers R and G.
[0037]
25 is a cross-sectional view showing a configuration in the vicinity of the columnar spacer 34 cut along the line JJ shown in FIG. As shown in FIG. 25, the columnar spacer 34 includes a resist pattern 37, CF resin layers R, G, and B, a common electrode 40, and a resist layer 33 that are sequentially stacked on the BM 30. The resist layer 33 is formed of the same material as that of the protrusions 32.
[0038]
Next, a method for manufacturing a substrate for a liquid crystal display device according to this embodiment will be described with reference to FIGS. FIG. 26 is a diagram showing a method for manufacturing a substrate for a liquid crystal display device according to this example, and FIG. 27 is a process sectional view showing a section taken along the line KK of FIG. First, the BM 30 is formed on the glass substrate 28 by the steps shown in FIGS. Next, without peeling off the resist pattern 37 on the BM 30, for example, a photosensitive pigment dispersion type R resist is applied to a thickness of 1.5 μm on the entire surface of the glass substrate 28. Subsequently, the R resist immediately after coating is forcibly dried by vacuum drying. Thereafter, pre-baking and patterning are performed, and as shown in FIGS. 26 and 27, a CF resin layer R is formed in the R pixel region and the columnar spacer formation region 34 ′. The CF resin layer R is formed so that about ½ of the width of the BM 30 overlaps the resist pattern 37.
[0039]
Next, in the same process as the CF resin layer R, the CF resin layer G is formed in the G pixel region and the columnar spacer formation region 34 ′. The CF resin layer G is formed so that about ½ of the width of the BM 30 overlaps the resist pattern 37 and no gap is formed between the left end side of the CF resin layer G and the right end side of the CF resin layer R. Next, the CF resin layer B is formed in the B pixel region and the columnar spacer formation region 34 ′ in the same process as the CF resin layers R and G.
[0040]
FIG. 28 is a cross-sectional view showing a configuration in the vicinity of the columnar spacer formation region 34 ′ cut along the line LL in FIG. As shown in FIG. 28, a resist pattern 37 and CF resin layers R, G, and B are laminated in this order in the columnar spacer formation region 34 ′ on the BM 30.
[0041]
Next, ITO or the like is formed on the entire surface, and the common electrode 40 having a thickness of 150 nm, for example, is formed. Next, on the entire surface of the common electrode 40, for example, a positive novolac resist is applied to a thickness of 1.5 μm to form a resist layer. Subsequently, the resist layer immediately after coating is forcibly dried by vacuum drying. Thereafter, pre-baking and patterning are performed to simultaneously form the protrusion 32 and the resist layer 33 of the columnar spacer 34. Through the above steps, the CF substrate 4 of the substrate for a liquid crystal display device according to the present embodiment as shown in FIGS. 23 and 24 is completed.
[0042]
According to the present embodiment, the same effects as those of the embodiment 1-1 can be obtained. Further, since the resist pattern 37 used for patterning the BM 30 is left without being peeled off, the resist pattern 37 is not required to be peeled off, and the manufacturing process is simplified as compared with the embodiment 1-1. it can.
[0043]
FIG. 29 shows a modification of the configuration of the substrate for a liquid crystal display device according to this embodiment. As shown in FIG. 29, in this modification, a resin BM44 having a film thickness of, for example, about 1.2 μm is formed in place of the BM30 and the resist pattern 37 remaining in the upper layer.
[0044]
A method for manufacturing a substrate for a liquid crystal display device according to this modification will be briefly described with reference to FIG. First, a black resin layer is applied to the entire surface of the glass substrate 28 and patterned to form a resin BM44. Next, for example, a photosensitive pigment-dispersed R resist is applied to a thickness of 1.5 μm and patterned on the entire surface of the glass substrate 28, and as shown in FIG. 30, the R pixel region and the columnar spacer formation region 34 are formed. A CF resin layer R is formed at the same time. Next, in the same process as the CF resin layer R, the CF resin layer G is formed in the G pixel region and the columnar spacer formation region 34 ′, and the CF resin layer is formed in the B pixel region and the columnar spacer formation region 34 ′. B is formed. Thereafter, the liquid crystal display substrate according to the present modification is completed through the same steps as in the above embodiment. Also according to this modification, the same effects as those of the first to fourth embodiments can be obtained.
[0045]
(Example 1-5)
Next, a substrate for a liquid crystal display device according to Example 1-5 and a method for manufacturing the same will be described with reference to FIGS. FIG. 31 shows the configuration of the substrate for a liquid crystal display device according to this example with respect to two pixels of B and R. 32 is a cross-sectional view of the substrate for a liquid crystal display device taken along line MM in FIG. In addition, the same code | symbol is attached | subjected about the component which has the same function action as the component of the board | substrate for liquid crystal display devices by Example 1-1 shown in FIG. 3, and the description is abbreviate | omitted. As shown in FIGS. 31 and 32, the substrate for a liquid crystal display device according to this example is a color overlay formed by laminating any two layers of CF resin layers R, G, and B at the end of each pixel region. It has BM46.
[0046]
FIG. 33 is a cross-sectional view showing the configuration in the vicinity of the columnar spacer 34 cut along the line NN shown in FIG. As shown in FIG. 33, the columnar spacer 34 is composed of CF resin layers B, R, and G, a common electrode 40, and a resist layer 33 that are sequentially stacked. The resist layer 33 is formed of the same material as that of the protrusions 32.
[0047]
Next, a method for manufacturing a substrate for a liquid crystal display device according to the present embodiment will be described with reference to FIGS. FIG. 34 is a diagram showing a method for manufacturing a substrate for a liquid crystal display device according to this example, and FIG. 35 is a process sectional view showing a section cut along the line OO in FIG. First, on the glass substrate 28, for example, a photosensitive pigment dispersed B resist is applied to a film thickness of 1.5 μm. Subsequently, the B resist immediately after coating is forcibly dried by drying under reduced pressure. Thereafter, prebaking and patterning are performed, and as shown in FIGS. 34 and 35, a CF resin layer B is formed in the B pixel region, the columnar spacer formation region 34 ′, and the predetermined color overlap BM46 formation region. Next, CF resin layers R and G are formed in this order in the same process as the CF resin layer B. As shown in FIG. 35, a color overlap BM 46 in which two CF resin layers R, G, and B are stacked is formed at the end of the pixel region.
[0048]
FIG. 36 is a cross-sectional view showing the configuration in the vicinity of the columnar spacer formation region 34 ′ cut along the line PP in FIG. As shown in FIG. 36, CF resin layers B, R, and G are laminated in this order in the columnar spacer formation region 34 ′.
[0049]
Next, ITO or the like is formed on the entire surface, and the common electrode 40 having a thickness of, for example, 150 nm is formed. Next, on the entire surface of the common electrode 40, for example, a positive novolac resist is applied to a thickness of 1.5 μm to form a resist layer. Subsequently, the resist layer immediately after coating is forcibly dried by vacuum drying. Thereafter, pre-baking and patterning are performed, and the protrusion 32 and the resist layer 33 of the columnar spacer 34 are formed simultaneously. Through the above steps, the CF substrate 4 of the substrate for a liquid crystal display device according to the present embodiment as shown in FIGS. 31 and 32 is completed.
[0050]
According to the present embodiment, the same effects as those of the embodiment 1-1 can be obtained. Further, for example, since the CF resin layers R and G may be formed by laminating at the end of the pixel region, the formation of the CF resin layers R, G, and B is facilitated as compared with the embodiment 1-1.
[0051]
(Example 1-6)
Next, a substrate for a liquid crystal display device according to Example 1-6 and a method for manufacturing the same will be described with reference to FIGS. FIG. 37 shows the configuration of the substrate for a liquid crystal display device according to the present embodiment for two pixels of R and B. FIG. 38 is a cross-sectional view of the substrate for a liquid crystal display device taken along line QQ in FIG. In addition, the same code | symbol is attached | subjected about the component which has the same function action as the component of the board | substrate for liquid crystal display devices by Example 1-1 shown in FIG. 3, and the description is abbreviate | omitted.
[0052]
As shown in FIGS. 37 and 38, the TFT substrate 2 has a gate bus line 6 formed on a glass substrate 29 and extending in the left-right direction in the drawing. In addition, a drain bus line 8 extending in the vertical direction in the figure is formed crossing the gate bus line 6 via a gate insulating film 66. A pixel region is defined by both bus lines 6 and 8. A storage capacitor bus line 14 parallel to the gate bus line 6 is formed substantially across the pixel region in the center of the pixel region. A TFT 10 (not shown in FIG. 37) shown in FIG. 2 is formed for each pixel region in the vicinity of the intersection position of the gate bus line 6 and the drain bus line 8.
[0053]
On the TFT substrate 2, CF resin layers R, G, and B are formed for each pixel region (CF-on-TFT structure). On the CF resin layers R, G, and B, linear protrusions 32 that regulate the alignment of the liquid crystal are formed obliquely with respect to the edge of the pixel region.
[0054]
FIG. 39 is a cross-sectional view showing the configuration in the vicinity of the columnar spacer 34 cut along the line RR shown in FIG. As shown in FIG. 39, the columnar spacer 34 is composed of CF resin layers B, R, and G stacked in order, a resist layer 33 formed thereon. The resist layer 33 is formed of the same material as that of the protrusions 32.
[0055]
Next, a method for manufacturing a substrate for a liquid crystal display device according to the present embodiment will be described with reference to FIGS. FIG. 40 is a diagram showing a method for manufacturing a substrate for a liquid crystal display device according to this example, and FIG. 41 is a process sectional view showing a section cut along the line SS in FIG. First, the gate bus line 6, the storage capacitor bus line 14, the gate insulating film 66, and the drain bus line 8 are sequentially formed on the glass substrate 29.
[0056]
Next, for example, a photosensitive pigment dispersion type B resist is applied to the entire surface of the substrate to a thickness of 1.5 μm. Subsequently, the B resist immediately after coating is forcibly dried by drying under reduced pressure. Thereafter, pre-baking and patterning are performed, and a CF resin layer B is formed in the B pixel region and the columnar spacer formation region 34 'as shown in FIGS. The CF resin layer B is formed so that about 1/2 of the width of the drain bus line 8 overlaps the drain bus line 8.
[0057]
Next, in the same process as the CF resin layer B, the CF resin layer R is formed in the R pixel region and the columnar spacer formation region 34 ′. The CF resin layer R is formed so that the right end side is in contact with the left end side of the CF resin layer B. Therefore, the gap portion 112 as shown in FIGS. 67 and 68 is not formed between both ends. Next, the CF resin layer G is formed in the G pixel region and the columnar spacer formation region 34 ′ in the same process as the CF resin layers B and R.
[0058]
42 is a cross-sectional view showing a configuration in the vicinity of the columnar spacer formation region 34 ′ cut along the line TT in FIG. As shown in FIG. 42, CF resin layers B, R, and G are laminated in this order in the columnar spacer formation region 34 ′.
[0059]
Next, ITO or the like is formed on the entire surface and patterned to form the pixel electrode 12. Next, on the entire surface of the pixel electrode 12, for example, a positive novolak resist is applied to a thickness of 1.5 μm to form a resist layer, and the resist layer is forcibly dried by drying under reduced pressure. Thereafter, pre-baking and patterning are performed to simultaneously form the protrusion 32 and the resist layer 33 of the columnar spacer 34. Through the above steps, the TFT substrate 2 of the substrate for a liquid crystal display device according to the present embodiment as shown in FIGS. 37 and 38 is completed.
[0060]
According to this example, even with the TFT substrate 2 having a CF-on-TFT structure, the same effects as those of Example 1-1 can be obtained.
[0061]
Hereinafter, the effect when the liquid crystal device substrate according to the present embodiment is used will be described in detail. 43 and 44 are diagrams for explaining the effects of the substrate for a liquid crystal display device according to each example of the present embodiment.
[0062]
FIG. 43 shows each columnar spacer formation region 34 when three CF resin layers R, G, and B are stacked in the method for manufacturing a substrate for a liquid crystal display device according to Examples 1-1 to 1-6 of the present embodiment. 'Indicates the height of the structure to be formed. The horizontal axis represents each example for forming a structure, and the vertical axis represents the height (μm) of the structure. The broken line in the figure represents the height hb ′ (1.70 μm) of the structure of the conventional columnar spacer forming region 106 ′ shown in FIG. As shown in FIG. 43, the height h1 ′ of the structure in Example 1-1 shown in FIG. 14 is 1.88 μm, which is 0.18 μm higher than the height hb ′ of the conventional structure, and is not shown. The height h2 ′ of the structure in Example 1-2 is 1.80 μm, which is 0.10 μm higher than the height hb ′ of the conventional structure. Further, the height h3 ′ of the structure in Example 1-3 shown in FIG. 22 is 2.30 μm, which is 0.60 μm higher than the height hb ′ of the conventional structure, and Example 1 shown in FIG. The height h4 ′ of the structure at −4 is 2.35 μm, which is 0.65 μm higher than the height hb ′ of the conventional structure. The height h5 ′ of the structure in Example 1-5 shown in FIG. 36 is 1.78 μm, which is 0.08 μm higher than the height hb ′ of the conventional structure, and Example 1-6 shown in FIG. The height h6 ′ of the structure is 1.78 μm, which is 0.08 μm higher than the height hb ′ of the conventional structure.
[0063]
That is, the height h4 ′ of the structure of Example 1-4 having the most remarkable effect can be formed 0.65 μm higher than the height hb ′ of the conventional structure, and the least effective Examples 1-5 and Also in the heights h5 ′ and h6 ′ of the structure of Example 1-6, it can be formed 0.08 μm higher than the height hb ′ of the conventional structure.
[0064]
FIG. 44 shows the height of each columnar spacer 34 of the substrate for a liquid crystal display device according to Examples 1-1 to 1-6. The horizontal axis represents each example in which the columnar spacer 34 is formed, and the vertical axis represents the height (μm) of the columnar spacer 34. Moreover, the broken line in the figure represents the height hb (2.45 μm) of the conventional columnar spacer 106 shown in FIG. As shown in FIG. 44, the height h1 of the columnar spacer 34 in Example 1-1 shown in FIG. 5 is 2.65 μm, which is 0.20 μm higher than the height hb of the conventional columnar spacer 106, and is not shown. The height h2 of the columnar spacer 34 in Example 1-2 is 2.55 μm, which is 0.10 μm higher than the height hb of the conventional columnar spacer 106. Further, the height h3 of the columnar spacer 34 in Example 1-3 shown in FIG. 19 is 3.05 μm, which is 0.60 μm higher than the height hb of the conventional columnar spacer 106, and Example 1 shown in FIG. The height h4 of the columnar spacer 34 at −4 is 3.10 μm, which is 0.65 μm higher than the height hb of the conventional columnar spacer 106. The height h5 of the columnar spacer 34 in Example 1-5 shown in FIG. 33 is 2.55 μm, which is 0.10 μm higher than the height hb of the conventional columnar spacer 106, and Example 1-6 shown in FIG. The height h6 of the columnar spacer 34 is 2.55 μm, which is 0.10 μm higher than the height hb of the conventional columnar spacer 106.
[0065]
That is, the height h4 of the columnar spacer 34 of Example 1-4, which has the most remarkable effect, can be formed 0.65 μm higher than the height hb of the conventional columnar spacer 106, and the least effective example 1-5 and Also in the heights h5 and h6 of the columnar spacers 34 of Example 1-6, they can be formed 0.10 μm higher than the height hb of the conventional columnar spacer 106.
[0066]
In this embodiment, the MVA mode liquid crystal display device is described as an example, but the present invention can also be applied to other mode liquid crystal display devices. However, for example, in the TN mode liquid crystal display device, the protrusions 32 for regulating the alignment of the liquid crystal are not formed, and therefore the uppermost resist layer 33 is formed like the columnar spacer 34 of the liquid crystal display device substrate according to the present embodiment. Not. For this reason, it is necessary to prevent the common electrode 40 which is the uppermost layer of the columnar spacer 34 and the pixel electrode 12 on the opposite substrate from being short-circuited.
[0067]
Further, the film thickness (height) of each resin layer such as the CF resin layers R, G, B, the resin BM 44, the resist layer 33 and the like constituting the columnar spacer 34 can be changed. Since the height of the columnar spacer 34 can be adjusted by changing the film thickness of each resin layer, a desired cell gap can be obtained.
[0068]
As described above, according to the present embodiment, a desired cell gap can be easily obtained.
[0069]
[Second Embodiment]
A substrate for a liquid crystal display device according to a second embodiment of the present invention, a liquid crystal display device including the same, and a method for manufacturing the same will be described with reference to FIGS.
The cell gap of the liquid crystal display device is held by spherical spacers or the like dispersed on the substrate. However, if there is a spherical spacer in the display pixel region, light leakage or alignment failure (domain) occurs around the spherical spacer, which degrades the display quality of the liquid crystal display device. For this reason, as an alternative technique, a method of forming a columnar spacer at an arbitrary position on the substrate by patterning a photosensitive resin by a photolithography method is used. The above-described problem can be solved by forming the columnar spacers only in the light-shielding portions shielded by the BM. In addition, since the resin can be applied with a uniform film thickness by spin coating or the like, a columnar spacer with excellent height accuracy can be formed. For this reason, in a liquid crystal display device using columnar spacers, a uniform and highly accurate cell gap can be obtained. One of the forming materials for the columnar spacer is a photocurable acrylic resin negative photosensitive resist.
[0070]
FIG. 45 shows a cross section of a liquid crystal display device in which columnar spacers 70 are formed on the CF substrate 4 side. As shown in FIG. 45, the liquid crystal display device is formed by bonding a CF substrate 4 and a TFT substrate 2 and enclosing a liquid crystal LC between the substrates. The CF substrate 4 has a BM 30 that shields the end of the pixel region on the glass substrate 28. CF resin layers R, G, and B are formed in each pixel region. A common electrode 40 is formed on the entire surface of the CF resin layers R, G, and B.
[0071]
On the other hand, the TFT substrate 2 has pixel electrodes 12 formed in each pixel region on the glass substrate 29. A columnar spacer 70 is formed on the BM 30 of the CF substrate 4 to maintain a cell gap between the CF substrate 4 and the TFT substrate 2.
[0072]
The CF substrate 4 is manufactured as follows, for example. 46 and 47 are process cross-sectional views illustrating the process for manufacturing the CF substrate 4. First, Cr or the like is formed on the glass substrate 28 and patterned to form the BM 30. Next, for example, a pigment-dispersed negative photosensitive acrylic resist is applied and patterned to form CF resin layers R, G, and B in stripes. Next, a transparent conductive film such as ITO is formed on the entire surface of the CF resin layers R, G, and B to form the common electrode 40.
[0073]
Next, a negative photosensitive acrylic resist is applied with a film thickness based on a desired cell gap to form a resist layer 48, and pre-baked at about 90 ° C. to dry the resist layer 48. Next, as shown in FIG. 46, the resist layer 48 is collectively exposed to ultraviolet rays from the surface of the CF substrate 4 (upper side in the drawing) by proximity-type exposure using a large exposure mask 38. Thereafter, development and baking at about 220 ° C. complete a columnar spacer 70 formed at a desired position and height on the CF substrate 4 as shown in FIG.
[0074]
The columnar spacer 70 is usually formed at a position overlapping the BM 30 on the CF substrate 4 or the metal wiring on the TFT substrate 2 when viewed in the direction perpendicular to the substrate surface, that is, outside the display area. Thereby, the alignment defect region of the liquid crystal generated around the columnar spacer 70 is shielded from light, so that the display quality can be prevented from deteriorating. By the way, the line widths of the BM 30 and the metal wiring are becoming increasingly finer due to the recent high-definition and high aperture pattern design of liquid crystal display devices. For this reason, in order to form the columnar spacer 70 at a position overlapping the BM 30 or the metal wiring, it is necessary to reduce the size of the columnar spacer 70.
[0075]
However, the resolution when a negative photosensitive resist is used in proximity type exposure is usually about 10 μm, although it varies depending on the exposure gap. For example, when the columnar spacer 70 having a width of 15 μm is formed, it is necessary to form it on the BM 30 having a line width of 20 μm or more in consideration of the alignment accuracy between the CF substrate 4 and the exposure mask 38. Although it is possible to reduce the resolution to 10 μm or less by using a stepper (projection exposure apparatus), there arises a problem that the tact becomes long and the productivity is lowered. An object of the present embodiment is to provide a substrate for a liquid crystal display device capable of easily forming a columnar spacer, a liquid crystal display device including the same, and a method for manufacturing the same, even when a pattern design with high definition and an increased aperture ratio is performed. It is to provide.
[0076]
In the present embodiment, an opening is provided in the BM 30, and a photocurable negative resist applied on the BM 30 is exposed by back exposure to form the columnar spacer 70 in a self-aligning manner. By doing so, alignment between the CF substrate 4 and the exposure mask 38 becomes unnecessary, and a resolution comparable to that of contact-type exposure can be obtained. For this reason, even if the BM 30 having a narrow line width is formed, the columnar spacer 70 can be formed on the BM 30.
[0077]
Hereinafter, the substrate for the liquid crystal display device according to the present embodiment, the liquid crystal display device including the substrate, and the manufacturing method thereof will be described more specifically with reference to Examples 2-1 and 2-2.
(Example 2-1)
First, a substrate for a liquid crystal display device according to Example 2-1, a liquid crystal display device including the same, and a manufacturing method thereof will be described with reference to FIGS. FIG. 48 is a cross-sectional view showing a schematic configuration of the liquid crystal display device according to the present embodiment. As shown in FIG. 48, the liquid crystal display device is formed by bonding a CF substrate 4 and a TFT substrate 2 and enclosing a liquid crystal LC between the substrates. The CF substrate 4 has a BM 50 that shields the edge of the pixel region on the glass substrate 28. The BM 50 has an opening 52 that transmits at least the photosensitive wavelength of the negative photosensitive resist. CF resin layers R, G, and B are formed in each pixel region. A common electrode 40 is formed on the CF resin layers R, G, and B.
[0078]
On the other hand, the TFT substrate 2 has a pixel electrode 12 formed in each pixel region on a glass substrate 29. A columnar spacer 70 for holding a cell gap between the CF substrate 4 and the TFT substrate 2 is formed on the opening 52 of the BM 50.
[0079]
Next, a substrate for a liquid crystal display device according to this embodiment and a method for manufacturing a liquid crystal display device including the same will be described with reference to FIGS. 49, 51 and 54 show a method of manufacturing a substrate for a liquid crystal display device according to this example. FIGS. 50, 52, 53 and 55 are cross-sectional views taken along the line aa in FIG. It is process sectional drawing shown.
[0080]
First, Cr is formed on the entire surface of the glass substrate 28 and patterned by using a photolithography method to form a BM 50 having an opening 52 as shown in FIGS. Next, as shown in FIGS. 51 and 52, an R resist such as a pigment-dispersed negative photosensitive acrylic resist is applied and patterned to form a CF resin layer R. Subsequently, similarly, CF resin layers G and B are formed. At this time, the CF resin layers R, G, and B are not formed in the opening 52 of the BM 50. Next, a transparent conductive film such as ITO is formed to form the common electrode 40.
[0081]
Next, a negative photosensitive acrylic resist is applied to the entire surface of the common electrode 40 and prebaked to form a negative resist layer 54. Next, as shown in FIG. 53, ultraviolet rays are irradiated from the back surface of the substrate (downward in the drawing) by a high pressure mercury lamp (not shown). Next, when the exposed negative resist layer 54 is developed, columnar spacers 70 are formed on the openings 52 as shown in FIGS. Next, it is baked at 220 ° C. using a clean oven.
[0082]
An alignment film (not shown) for controlling the alignment of the liquid crystal is formed on the opposing surface of the CF substrate 4 manufactured in the above process and the TFT substrate 2 disposed so as to face each other. The liquid crystal display device shown in FIG. 48 is completed by sealing and attaching a polarizing plate (not shown).
[0083]
In this embodiment, an opening 52 is provided in the BM 30, and the negative photosensitive resist is exposed by back exposure to form the columnar spacers 70 in a self-aligning manner. For this reason, alignment between the CF substrate 4 and the exposure mask 38 is unnecessary. The exposure process can be performed with a tact equivalent to or higher than that of the proximity type exposure, and the columnar spacer 70 with high positional accuracy can be obtained with the same resolution as the contact type exposure. Therefore, even if the pattern design of the BM 30 with high definition and high aperture ratio is performed, the columnar spacer 70 can be easily formed on the BM 30.
[0084]
FIG. 56 is a cross-sectional view showing a modification of the configuration of the substrate for a liquid crystal display device according to this example. As shown in FIG. 56, the substrate for a liquid crystal display device according to this modification has a resin BM56 formed of a black resin instead of the BM50 formed of Cr. Since the resin BM56 has a thicker film thickness than the BM50, the contact area between the columnar spacer 70 and the inner wall surface 72 of the opening 52 increases. For this reason, even when a force is applied in the substrate surface direction when rubbing the alignment film, the columnar spacer 70 can be made difficult to peel off.
[0085]
In the structure of this embodiment, when the columnar spacers 70 are formed of a transparent negative photosensitive resist, in the normally white mode liquid crystal display device, light is transmitted from the opening 52 and the contrast of the display screen is increased. It will decline. In order to prevent this, light leakage can be suppressed by using a colored negative resist having a low light transmittance after firing as a material for forming the columnar spacer 70. As shown in FIG. 57, even if a transparent negative resist is used, light leakage can be prevented by forming a metal wiring 58 such as a bus line or a BM in a region overlapping the columnar spacer 70 on the TFT substrate 2 side. Can be prevented. In the normally black mode liquid crystal display device, since there is no light leakage from the end of the pixel region, the columnar spacer 70 may be formed of a transparent negative resist.
[0086]
(Example 2-2)
Next, a liquid crystal display substrate and a method for manufacturing the same according to Example 2-2 will be described with reference to FIGS. FIG. 58 is a cross-sectional view showing a schematic configuration of the substrate for a liquid crystal display device according to this example. 58A shows the configuration of the columnar spacer 35 formed on the storage capacitor bus line 14 of the TFT substrate 2, and FIG. 58B shows the configuration of the column capacitor 35 formed on the storage capacitor bus line 14 of the TFT substrate 2. The structure of the other columnar spacer 35 'is shown. The TFT substrate 2 according to this embodiment has a CF-on-TFT structure. As shown in FIGS. 58A and 58B, the TFT substrate 2 has columnar spacers 35 and 35 ′ having different heights from the surface of the glass substrate 28.
[0087]
As shown in FIG. 58A, the TFT substrate 2 has a storage capacitor bus line 14 formed on a glass substrate 28. The storage capacitor bus line 14 has an opening 53 ′ in the vicinity of the region where the columnar spacer 35 is formed. A gate insulating film 66 is formed on the storage capacitor bus line 14. On the gate insulating film 66, the drain bus line 8 and the storage capacitor electrode 60 are formed. CF resin layers R, G, and B are formed on the storage capacitor electrode 60. The storage capacitor electrode 60 and the CF resin layers R, G, B have an opening 53 in the vicinity of the formation region of the columnar spacer 35. A planarizing film 68 is formed on the CF resin layers R, G, and B. The planarizing film 68 is opened on the opening 53. The pixel electrode 12 is formed on the planarizing film 68 and on the gate insulating film 66 through the opening 53. A columnar spacer 35 is formed on the pixel electrode 12 in the opening 53.
[0088]
On the other hand, as shown in FIG. 58B, in the formation region of the other columnar spacers 35 ′, unlike the formation region of the columnar spacers 35, the planarizing film 68 is not opened on the opening 53. For this reason, the bottom surfaces of the columnar spacers 35 and 35 ′ are different from each other in height from the surface of the glass substrate 28.
[0089]
Next, a method for manufacturing a substrate for a liquid crystal display device according to this embodiment will be described with reference to FIGS. 59, 61, and 63 are views showing a method of manufacturing a substrate for a liquid crystal display device according to the present embodiment. FIGS. 60, 62, and 64 to 66 are cross sections taken along line bb in FIG. It is process sectional drawing which shows these.
[0090]
First, as shown in FIGS. 59 and 60, Cr, Al, etc. are formed on the entire surface of the glass substrate 28 and patterned to form the storage capacitor bus line 14 and the gate bus line 6 having the opening 53 ′. To do.
[0091]
Next, a silicon nitride film (SiN), amorphous silicon (a-Si), and SiN are continuously formed on the entire surface of the substrate, and a channel protective film is formed by patterning the upper SiN. Next, as shown in FIGS. 61 and 62, for example, Al, titanium (Ti), and molybdenum (Mo) are formed and patterned together with a-Si and underlying SiN, and an opening is formed on the opening 53 ′. A storage capacitor electrode 60 in which 53 is located is formed. At the same time, the drain bus line 8, the drain electrode 62, and the source electrode 64 are formed.
[0092]
Next, as shown in FIGS. 63 and 64, for example, a pigment-dispersed negative photosensitive resist is applied and patterned on the entire surface to form a CF resin layer R opened on the opening 53. Subsequently, CF resin layers G and B opened on the opening 53 are formed in the same process. The CF resin layers R, G and B are formed to extend in the vertical direction in FIG.
[0093]
Next, as shown in FIGS. 65A and 65B, for example, a transparent acrylic resist is applied to the entire surface to form a planarizing film 68. Next, as shown in FIG. 65A, the planarization film 68 opens a predetermined contact hole (not shown) and opens an arbitrary opening 53. Next, a transparent conductive film such as ITO is formed and patterned to form the pixel electrode 12.
[0094]
Next, as shown in FIGS. 66A and 66B, a negative photosensitive resist is applied to the entire surface to form a negative resist layer 55. At this time, the height of the negative resist layer 55 from the surface of the glass substrate 28 differs between the region where the planarization film 68 is opened on the opening 53 and the other regions. Next, after the negative resist layer 55 is dried by pre-baking, ultraviolet rays that are exposed to the negative resist layer 55 are irradiated from the back surface of the substrate (downward in the drawing). Since the gate bus line 6, the drain bus line 8, the storage capacitor bus line 14, and the CF resin layers R, G, B, etc. serve as a light shielding layer and reflect or absorb ultraviolet rays, these metal layers and CF resin layers R, G, B The upper negative resist layer 55 is not exposed to light. On the other hand, the negative resist layer 55 on the opening 53 where the metal layer and the CF resin layers R, G, and B are not formed in the lower layer is exposed to ultraviolet rays irradiated from the back surface of the substrate. After the development processing, the columnar spacers 35 and 35 ′ are formed by baking by post-baking at about 220 ° C. Through the above steps, the TFT substrate 2 shown in FIGS. 58A and 58B is completed.
[0095]
In the present embodiment, the columnar spacers 35 and 35 ′ having different heights from the surface of the glass substrate 28 can be simultaneously formed at an arbitrary position and at an arbitrary arrangement density. In the liquid crystal display panel formed using the TFT substrate 2 according to the present embodiment, the columnar spacer 35 ′ having the higher height usually holds the cell gap, but the panel surface of the liquid crystal display panel is pressurized. When the cell gap becomes narrower, the columnar spacer 35 having a lower height also holds the cell gap. For this reason, the substrate for a liquid crystal display device according to this example can achieve the same effects as those of Example 2-1, and the pressure resistance is improved.
[0096]
Further, when the temperature around the liquid crystal display panel decreases, the liquid crystal contracts and the volume decreases. In the conventional liquid crystal display device, columnar spacers having the same height are formed with a high arrangement density, so it is difficult to reduce the volume in the cell gap. For this reason, the pressure in a cell gap falls and it becomes easy to produce low temperature foaming. On the other hand, in the liquid crystal display device of the present embodiment, the cell gap is maintained only by the high columnar spacers 35 ′ formed at an arbitrary arrangement density, and the columnar spacers 35 having a low height are normal. Is not in contact with the counter substrate surface. When the liquid crystal volume decreases due to a temperature drop or the like, a part of the panel substrate surface descends to the position of the columnar spacer 35 having a low height, and the volume in the cell gap can be reduced. By carrying out like this, generation | occurrence | production of low temperature foaming can be suppressed.
[0097]
In this embodiment, the columnar spacers 35 and 35 ′ are not formed on the CF resin layers R, G, and B. For this reason, the material for forming the CF resin layers R, G, and B does not require compressive strength that can resist finger pressing on the panel surface unlike the material for forming the columnar spacers 35 and 35 '. It becomes easy to select.
[0098]
The substrate for a liquid crystal display device according to the embodiment described above, a method for manufacturing the same, and a liquid crystal display device including the substrate are summarized as follows.
(Appendix 1)
A substrate that sandwiches the liquid crystal together with the opposing substrate disposed oppositely;
A plurality of pixel regions arranged in a matrix on the substrate;
Columnar spacers arranged at the end of the pixel region to maintain a cell gap;
A plurality of color filter resin layers formed in the pixel region and formed so as not to cause a gap between adjacent pixel regions at least around the columnar spacer;
A substrate for a liquid crystal display device, comprising:
[0099]
(Appendix 2)
In the substrate for a liquid crystal display device according to appendix 1,
The columnar spacer is formed by laminating a plurality of the color filter resin layers.
A substrate for a liquid crystal display device.
[0100]
(Appendix 3)
In the substrate for a liquid crystal display device according to appendix 1 or 2,
The plurality of color filter resin layers are formed such that the edges of the color filter resin layers are in contact with each other between the adjacent pixel regions.
A substrate for a liquid crystal display device.
[0101]
(Appendix 4)
In the substrate for a liquid crystal display device according to appendix 1 or 2,
The plurality of color filter resin layers are formed by being stacked between adjacent pixel regions.
A substrate for a liquid crystal display device.
[0102]
(Appendix 5)
The substrate for a liquid crystal display device according to any one of appendices 1 to 4,
A linear protrusion that is formed on the color filter resin layer and regulates alignment of the liquid crystal;
The columnar spacer has a formation layer of the protrusion.
A substrate for a liquid crystal display device.
[0103]
(Appendix 6)
The substrate for a liquid crystal display device according to any one of appendices 1 to 5,
A light-shielding film that shields light from the edge of the pixel region;
A substrate for a liquid crystal display device.
[0104]
(Appendix 7)
In the substrate for liquid crystal display device according to appendix 6,
The light shielding film is made of metal.
A substrate for a liquid crystal display device.
[0105]
(Appendix 8)
In the substrate for liquid crystal display device according to appendix 7,
The resist layer used when patterning the light shielding film remains on the light shielding film.
A substrate for a liquid crystal display device.
[0106]
(Appendix 9)
In the substrate for liquid crystal display device according to appendix 6,
The light shielding film is formed of a black resin.
A substrate for a liquid crystal display device.
[0107]
(Appendix 10)
Forming a first color filter resin layer in the first pixel region and the columnar spacer formation region on the substrate;
The second pixel region adjacent to the first pixel region and the columnar spacer formation region are formed so that no gap is formed between the first color filter resin layer and at least around the columnar spacer formation region. Forming the color filter resin layer 2
A method for manufacturing a substrate for a liquid crystal display device.
[0108]
(Appendix 11)
In the method for manufacturing a substrate for a liquid crystal display device according to appendix 10,
The second color filter resin layer is formed so that an end side thereof is in contact with an end side of the first color filter resin layer.
A method for manufacturing a substrate for a liquid crystal display device.
[0109]
(Appendix 12)
In the method for manufacturing a substrate for a liquid crystal display device according to appendix 10 or 11,
A light shielding film forming layer for defining the pixel region is formed on the substrate;
A resist is applied on the light shielding film forming layer,
Patterning the resist to form a resist pattern;
Etching the light shielding film forming layer using the resist pattern as an etching mask to form a light shielding film,
Forming the color filter resin layer on the resist pattern;
A method for manufacturing a substrate for a liquid crystal display device.
[0110]
(Appendix 13)
In the method for manufacturing a substrate for a liquid crystal display device according to any one of appendices 10 to 12,
The color filter resin layer is dried under reduced pressure.
A method for manufacturing a substrate for a liquid crystal display device.
[0111]
(Appendix 14)
A plurality of pixel regions arranged in a matrix on the substrate;
A light shielding layer formed at an end of the pixel region and having a plurality of openings opened in a predetermined region;
A plurality of columnar spacers disposed in the plurality of openings to form a cell gap and formed of a photocurable resist;
A substrate for a liquid crystal display device, comprising:
[0112]
(Appendix 15)
In the substrate for liquid crystal display device according to appendix 14,
The photo-curable resist is a colored resist
A substrate for a liquid crystal display device.
[0113]
(Appendix 16)
In the liquid crystal display substrate according to appendix 14 or 15,
The opening transmits at least light having a photosensitive wavelength of the photocurable resist.
A substrate for a liquid crystal display device.
[0114]
(Appendix 17)
The substrate for a liquid crystal display device according to any one of appendices 14 to 16,
The plurality of columnar spacers are formed at a plurality of different heights.
A substrate for a liquid crystal display device.
[0115]
(Appendix 18)
A liquid crystal display device having a pair of substrates and a liquid crystal sealed between the pair of substrates,
The substrate for a liquid crystal display device according to any one of appendices 1 to 9 or appendixes 14 to 17 is used for one of the substrates.
A liquid crystal display device.
[0116]
(Appendix 19)
Forming a light shielding layer having a plurality of openings on the substrate;
Applying a photocurable resist on the light shielding layer;
Exposing the photocurable resist from the back surface of the substrate to form a columnar spacer in a self-aligned manner on the opening; and
A method for producing a substrate for a liquid crystal display device, comprising:
[0117]
(Appendix 20)
In the method for manufacturing a substrate for a liquid crystal display device according to appendix 19,
In order to simultaneously form the columnar spacers having a plurality of heights, the method further includes the step of forming the photocurable resist surface having different heights from the substrate surface on the plurality of openings.
A method for manufacturing a substrate for a liquid crystal display device.
[0118]
【The invention's effect】
As described above, according to the present invention, a liquid crystal display device in which a desired cell gap can be easily obtained can be realized.
[Brief description of the drawings]
FIG. 1 is a diagram showing a configuration of a liquid crystal display device according to Example 1-1 of the first embodiment of the present invention.
FIG. 2 is a diagram showing a configuration on the TFT substrate side of the liquid crystal display device according to Example 1-1 of the first embodiment of the present invention;
FIG. 3 is a diagram showing a configuration of a liquid crystal display device substrate according to Example 1-1 of the first embodiment of the present invention;
4 is a cross-sectional view showing a configuration of a liquid crystal display device substrate according to Example 1-1 of the first embodiment of the present invention; FIG.
FIG. 5 is a cross-sectional view showing a configuration of a liquid crystal display device substrate according to Example 1-1 of the first embodiment of the present invention;
6 is a process cross-sectional view illustrating the method for manufacturing the substrate for a liquid crystal display device according to Example 1-1 of the first embodiment of the invention; FIG.
7 is a process sectional view showing the method for manufacturing the substrate for liquid crystal display device according to Example 1-1 of the first embodiment of the invention; FIG.
8 is a process cross-sectional view illustrating the manufacturing method of the substrate for liquid crystal display device according to Example 1-1 of the first embodiment of the invention; FIG.
FIG. 9 is a process cross-sectional view illustrating the manufacturing method of the substrate for the liquid crystal display device according to Example 1-1 of the first embodiment of the invention;
FIG. 10 is a process cross-sectional view illustrating the manufacturing method of the substrate for the liquid crystal display device according to Example 1-1 of the first embodiment of the invention;
FIG. 11 is a process cross-sectional view illustrating the manufacturing method of the substrate for liquid crystal display device according to Example 1-1 of the first embodiment of the invention;
FIG. 12 is a process cross-sectional view illustrating the manufacturing method of the substrate for liquid crystal display device according to Example 1-1 of the first embodiment of the invention;
FIG. 13 is a process cross-sectional view illustrating the method for manufacturing the substrate for a liquid crystal display device according to Example 1-1 of the first embodiment of the invention;
FIG. 14 is a process cross-sectional view illustrating the manufacturing method of the substrate for liquid crystal display device according to Example 1-1 of the first embodiment of the invention;
FIG. 15 is a diagram showing a configuration of a liquid crystal display device substrate according to Example 1-2 of the first embodiment of the present invention;
FIG. 16 is a process cross-sectional view illustrating the manufacturing method of the substrate for liquid crystal display device according to Example 1-2 of the first embodiment of the invention;
FIG. 17 is a diagram showing a configuration of a liquid crystal display device substrate according to Example 1-3 of the first embodiment of the present invention;
18 is a cross-sectional view showing a configuration of a substrate for a liquid crystal display device according to Example 1-3 of the first embodiment of the present invention. FIG.
19 is a cross-sectional view showing a configuration of a substrate for a liquid crystal display device according to Example 1-3 of the first embodiment of the present invention. FIG.
20 is a diagram showing a method of manufacturing a substrate for a liquid crystal display device according to Example 1-3 of the first embodiment of the invention. FIG.
FIG. 21 is a cross-sectional view showing the method of manufacturing the liquid crystal display device substrate according to Example 1-3 of the first embodiment of the present invention;
22 is a cross-sectional view showing the method of manufacturing the liquid crystal display device substrate according to Example 1-3 of the first embodiment of the invention; FIG.
FIG. 23 is a diagram showing a configuration of a liquid crystal display device substrate according to Example 1-4 of the first embodiment of the present invention;
24 is a cross-sectional view showing a configuration of a substrate for a liquid crystal display device according to Example 1-4 of the first mode for carrying out the invention; FIG.
FIG. 25 is a cross-sectional view showing a configuration of a substrate for a liquid crystal display device according to Example 1-4 of the first mode for carrying out the invention;
FIG. 26 is a process cross-sectional view illustrating the method for manufacturing the substrate for the liquid crystal display device according to Example 1-4 of the first embodiment of the invention;
FIG. 27 is a process cross-sectional view illustrating the manufacturing method of the substrate for liquid crystal display device according to Example 1-4 of the first embodiment of the invention;
FIG. 28 is a process cross-sectional view illustrating the manufacturing method of the substrate for the liquid crystal display device according to Example 1-4 of the first embodiment of the invention;
FIG. 29 is a cross-sectional view showing a configuration of a modification of the substrate for a liquid crystal display device according to Example 1-4 of the first embodiment of the present invention;
30 is a cross-sectional view showing a method of manufacturing a modification of the substrate for a liquid crystal display device according to Example 1-4 of the first embodiment of the invention. FIG.
FIG. 31 is a diagram showing a configuration of a liquid crystal display substrate according to Example 1-5 of the first embodiment of the present invention;
FIG. 32 is a cross-sectional view showing a configuration of a substrate for a liquid crystal display device according to Example 1-5 of the first embodiment of the present invention;
33 is a cross-sectional view showing a configuration of a substrate for a liquid crystal display device according to Example 1-5 of the first embodiment of the present invention; FIG.
34 is a process cross-sectional view illustrating the manufacturing method of the substrate for the liquid crystal display device according to Example 1-5 of the first embodiment of the invention; FIG.
FIG. 35 is a process cross-sectional view illustrating the manufacturing method of the substrate for the liquid crystal display device according to Example 1-5 of the first embodiment of the invention;
FIG. 36 is a process cross-sectional view illustrating the manufacturing method of the substrate for the liquid crystal display device according to Example 1-5 of the first embodiment of the invention;
FIG. 37 is a diagram showing a configuration of a liquid crystal display substrate according to Example 1-6 of the first embodiment of the present invention;
FIG. 38 is a cross sectional view showing the structure of the substrate for a liquid crystal display device according to Example 1-6 of the first embodiment of the present invention;
FIG. 39 is a cross sectional view showing the structure of the substrate for a liquid crystal display device according to Example 1-6 of the first embodiment of the present invention;
40 is a process cross-sectional view illustrating the manufacturing method of the substrate for liquid crystal display device according to Example 1-6 of the first embodiment of the present invention; FIG.
41 is a process cross-sectional view illustrating the manufacturing method of the substrate for the liquid crystal display device according to Example 1-6 of the first embodiment of the invention; FIG.
42 is a process cross-sectional view illustrating the manufacturing method of the substrate for the liquid crystal display device according to Example 1-6 of the first embodiment of the present invention; FIG.
FIG. 43 is a diagram for explaining the effect of the substrate for liquid crystal display device according to the first embodiment of the present invention;
FIG. 44 is a diagram for explaining the effect of the substrate for a liquid crystal display device according to the first embodiment of the present invention;
FIG. 45 is a cross-sectional view showing a configuration of a conventional liquid crystal display device which is a premise of the second embodiment of the present invention.
FIG. 46 is a process cross-sectional view illustrating a conventional method for manufacturing a substrate for liquid crystal display device, which is a premise of a second embodiment of the present invention.
FIG. 47 is a process cross-sectional view illustrating a conventional method for manufacturing a substrate for liquid crystal display device, which is a premise of a second embodiment of the present invention.
48 is a cross-sectional view showing a configuration of a liquid crystal display device according to Example 2-1 of the second embodiment of the present invention; FIG.
FIG. 49 is a diagram showing a method for manufacturing the substrate for liquid crystal display device according to Example 2-1 of the second embodiment of the present invention;
50 is a process cross-sectional view illustrating the manufacturing method of the substrate for the liquid crystal display device according to Example 2-1 of the second embodiment of the invention; FIG.
FIG. 51 is a diagram showing a method for manufacturing the substrate for liquid crystal display device according to Example 2-1 of the second embodiment of the present invention;
52 is a process cross-sectional view illustrating the manufacturing method of the substrate for the liquid crystal display device according to Example 2-1 of the second embodiment of the invention; FIG.
53 is a process cross-sectional view illustrating the manufacturing method of the substrate for the liquid crystal display device according to Example 2-1 of the second embodiment of the invention; FIG.
FIG. 54 is a diagram showing a method for manufacturing the substrate for liquid crystal display device according to Example 2-1 of the second embodiment of the present invention;
FIG. 55 is a process cross-sectional view illustrating the manufacturing method of the substrate for the liquid crystal display device according to Example 2-1 of the second embodiment of the invention;
FIG. 56 is a diagram showing a modification of the substrate for a liquid crystal display device according to Example 2-1 of the second embodiment of the present invention;
FIG. 57 is a diagram showing a modification of the substrate for a liquid crystal display device according to Example 2-1 of the second embodiment of the present invention;
FIG. 58 is a cross-sectional view showing a configuration of a substrate for a liquid crystal display device according to Example 2-2 of the second embodiment of the present invention;
FIG. 59 is a diagram showing a method of manufacturing the liquid crystal display device substrate according to Example 2-2 of the second embodiment of the present invention;
60 is a process cross-sectional view illustrating the manufacturing method of the substrate for the liquid crystal display device according to Example 2-2 of the second embodiment of the invention; FIG.
FIG. 61 is a diagram showing a method for manufacturing the substrate for a liquid crystal display device according to Example 2-2 of the second embodiment of the present invention;
FIG. 62 is a process cross-sectional view illustrating the manufacturing method of the substrate for the liquid crystal display device according to Example 2-2 of the second embodiment of the invention;
FIG. 63 is a diagram showing the method of manufacturing the liquid crystal display device substrate according to Example 2-2 of the second embodiment of the present invention;
FIG. 64 is a process sectional view illustrating the method for manufacturing the substrate for liquid crystal display device according to example 2-2 of the second embodiment of the invention;
FIG. 65 is a process cross-sectional view illustrating the manufacturing method of the substrate for the liquid crystal display device according to Example 2-2 of the second embodiment of the invention;
66 is a process cross-sectional view illustrating the manufacturing method of the substrate for the liquid crystal display device according to Example 2-2 of the second embodiment of the invention; FIG.
FIG. 67 is a diagram illustrating a configuration of a conventional substrate for a liquid crystal display device.
FIG. 68 is a cross-sectional view showing a configuration of a conventional substrate for a liquid crystal display device.
FIG. 69 is a cross-sectional view showing a configuration of a conventional substrate for a liquid crystal display device.
FIG. 70 is a diagram showing a manufacturing process of a conventional substrate for a liquid crystal display device.
FIG. 71 is a cross-sectional view showing a manufacturing process of a conventional substrate for a liquid crystal display device.
FIG. 72 is a cross-sectional view showing a manufacturing process of a conventional substrate for a liquid crystal display device.
[Explanation of symbols]
2 TFT substrate
4 CF substrate
6 Gate bus line
8 Drain bus line
10 TFT
12 pixel electrodes
14 Storage capacity bus line
16 Gate drive circuit
18 Drain drive circuit
20 Control circuit
22, 26 Polarizing plate
24 Backlight unit
28, 29 Glass substrate
30, 50 BM
31 Low reflection Cr film
32 Protrusions
33, 36, 48 Resist layer
34, 35, 70 Columnar spacer
34 'Columnar spacer formation region
37 resist pattern
38 Mask for exposure
40 Common electrode
42 Clearance
44, 56 Resin BM
46 color overlay BM
52, 53 opening
54, 55 Negative resist layer
58 Metal wiring
60 Storage capacitor electrode
62 Drain electrode
64 source electrode
66 Gate insulation film
68 Planarization film
72 inner wall

Claims (3)

Forming a first color filter resin layer in the first pixel region and the columnar spacer formation region on the substrate;
The second pixel region adjacent to the first pixel region and the columnar spacer formation region are formed so that no gap is formed between the first color filter resin layer and at least around the columnar spacer formation region. 2 color filter resin layers are formed ,
A light shielding film forming layer for defining the pixel region is formed on the substrate;
A resist is applied on the light shielding film forming layer,
Patterning the resist to form a resist pattern;
Etching the light shielding film forming layer using the resist pattern as an etching mask to form a light shielding film,
A method for manufacturing a substrate for a liquid crystal display device , wherein the color filter resin layer is formed on the resist pattern . The manufacturing method of the liquid crystal display device substrate according to claim 1,
The method of manufacturing a substrate for a liquid crystal display device, wherein the second color filter resin layer is formed so that an end side thereof is in contact with an end side of the first color filter resin layer. In the manufacturing method of the board | substrate for liquid crystal display devices of Claim 1 or 2 ,
The method for producing a substrate for a liquid crystal display device, wherein the color filter resin layer is dried under reduced pressure.

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