JP3933110B2 - Printer device for manufacturing fine parts and method for producing fine parts - Google Patents

Description

  The present invention relates to a printer device for manufacturing a fine part and a method for producing a fine part.

  Conventionally, a printed wiring board uses a substrate in which a copper foil is bonded to the surface of a polyimide film, forms a resist pattern on the copper foil of this substrate by lithography, and then exposes the exposed copper foil by wet etching. It is manufactured by removing and removing the resist on the copper foil by acid treatment. In the production of such a printed wiring board, a large number of printed wiring boards having the same metal wiring pattern are produced by performing a process such as lithography and etching at once on a large area substrate in order to reduce the manufacturing cost.

  However, this manufacturing method is suitable for manufacturing a large number of printed wiring boards having the same metal wiring pattern, but is less efficient when manufacturing printed wiring boards having various metal wiring patterns little by little. It was not right. In addition, since this manufacturing method requires a large-scale factory, the cost for maintaining it is enormous.

  Therefore, in recent years, in order to flexibly respond to various demands, on-demand production of many types of products according to demand and on-desktop factory with the size of the factory itself on the desktop Research and development of a method for producing a printed wiring board by drawing a metal wiring directly on a substrate made of a polyimide film by using an ink jet printer has become active. The metal wiring drawing ink discharged from the ink jet printer is configured by containing metal fine particles as a raw material for metal wiring and a dispersant for preventing aggregation of the metal fine particles in water and an organic solvent. ing.

  However, in some cases, a dispersant or the like remains as an impurity in the metal wiring drawn by the ink jet printer, and the drawn metal wiring may not show the original electric resistance of the metal. Therefore, in order to obtain the inherent electrical resistance of the metal, it was necessary to expose the printed wiring board to a high-temperature environment capable of decomposing impurities in the metal wiring. In this case, the polyimide on which the metal wiring was drawn There was a problem that the substrate made of a film was damaged by heat.

  In addition, although prior art documents related to this case were investigated, no prior art documents related to this case were found.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a printer device for manufacturing a fine component and a method for manufacturing the fine component, which can efficiently produce various fine components according to the demand without requiring a large-scale factory. There is.

  In the present application, “manufactured fine parts” and “manufactured fine parts” include not only producing parts with a minute size (for example, metal wiring), but also parts with a fine size. It also includes manufacturing a component that includes it (eg, a printed wiring board including metal wiring).

The present invention relates to a jetting means for jetting a plasma jet generated by converting a gas into a plasma, and a focusing for focusing a metal plasma generated by introducing metal into the plasma jet jetted from the jetting means. And a preventing means for preventing the metal plasma after focusing by the focusing means from being sprayed onto the substrate , wherein the preventing means is a shutter, and the metal plasma is sprayed onto the substrate when the shutter is open. is, when the shutter is closed by Rukoto is prevented blown to the substrate metal plasma, characterized by drawing a metal wire which is fine component on a substrate, a fine component manufacturing printer device.

Here, in the printer device for manufacturing a fine part according to the present invention, the metal may be a metal vaporized by the occurrence of arc discharge.

In the printer device for manufacturing a fine part according to the present invention, the focusing means may be a magnetic lens.

In the printer device for manufacturing a fine part according to the present invention , the shutter is preferably a silicon shutter.

The present invention also includes a step of introducing a gas into the heating chamber, a step of heating the introduced gas in the heating chamber, a step of introducing a metal into the heated gas, and a step of generating plasma of the introduced metal. If, comprising the steps of focusing the plasma, a step of the presence or absence of blowing of the substrate of the plasma after being focused by controlling the opening and closing of the shutter to draw a metal wire which is fine component on a substrate, the fine It is a manufacturing method of components.

In the method for manufacturing a fine component according to the present invention, the flow rate of plasma sprayed on the substrate is preferably 100 nL / second or less. Here, “nL” means nanoliter.

In the method for manufacturing a fine component according to the present invention, the substrate is a substrate for printed wiring, and metal wiring can be drawn on the substrate by spraying metal plasma onto the substrate.

  According to the printer device and the method for manufacturing a fine part of the present invention, various fine parts can be efficiently produced according to the demand without requiring a large-scale factory. Become.

  Embodiments of the present invention will be described below. In the drawings of the present specification, the same reference numerals represent the same or corresponding parts.

(Embodiment 1)
FIG. 1 is a schematic enlarged cross-sectional view of a preferred example of a part of a printer device for manufacturing a fine part according to the present invention. Referring to FIG. 1, a thermal spray gun 1 installed in a printer device for manufacturing a fine part according to the present invention is formed with a hollow cylindrical insulator 2, which is also hollow and adjacent to the insulator 2. An anode 3 made of copper (Cu), and a conductive metal container 4 disposed opposite to the anode 3 with the insulator 2 interposed therebetween and closing an opening at an end face of the insulator 2; A heating chamber 5 surrounded by the insulator 2, the anode 3, and the metal container 4, a tubular gas introduction part 6 penetrating a part of the wall surface of the insulator 2 and connected to the heating chamber 5; A cathode 7 made of tungsten (W) fitted in a protruding portion 4a of the metal container 4 toward the heating chamber 3 and installed in the heating chamber 5, and a part of the wall surface of the anode 5 passing through the heating chamber 5 A tubular metal supply path 8 that is connected, and the metal supply path 8 is made of silicon (Si). It is coupled with the interior of the granulating chamber 9 through an opening formed in the wall of the granulation chamber 9.

  A magnetic lens 10 is installed adjacent to the anode 3 of the spray gun 1, and a Si shutter 11 is installed at a predetermined distance from the magnetic lens 10.

  Further, the metal wires 12a and 12b fitted into the energizing sleeves 13a and 13b are directed toward the inside of the granulation chamber 9 from the end of the wall surface facing the wall surface where the opening of the granulation chamber 9 is formed. A gas introduction pipe 14 for introducing an inert gas such as argon (Ar) or helium (He) into the granulation chamber 9 is installed between the metal wires 12a and 12b.

  In the printer apparatus of the present invention having such a structure, first, an inert gas such as Ar or He is introduced into the heating chamber 5 from the gas introduction portion 6 of the thermal spray gun 1. Next, a voltage is applied between the anode 3 and the cathode 7 to cause an arc discharge between these electrodes. Then, the inert gas introduced into the heating chamber 5 is heated by being turned into plasma, and a high-temperature and high-speed plasma jet 15 is ejected toward the outside of the heating chamber 5. In the spray gun 1, cooling water is introduced from the direction of the arrow 20 a, passes through the anode 3, the insulator 2, and the metal container 4, and is discharged from the direction of the arrow 20 b. The anode 3 and the cathode 7 are cooled by this cooling water. Further, since the central portion of the cathode surface 7a on the plasma jet 15 ejection side is a concave surface, the plasma jet 15 once converges and then spreads and ejects again.

  On the other hand, an inert gas is also introduced into the granulating chamber 9, and an arc discharge is generated between the metal wires 12a and 12b by applying an AC pulse voltage between the metal wires 12a and 12b through the energizing sleeves 13a and 13b. Arise. Then, the inert gas introduced into the granulation chamber 9 is turned into plasma and becomes high-temperature gas plasma 21, whereby the metal wires 12a and 12b are uniformly melted, and the metal constituting the metal wires 12a and 12b is vaporized. To do. The vaporized metal is transported and supplied to the plasma jet 15 through the metal supply path 8. Then, at least part of the metal supplied to the plasma jet 15 is turned into plasma, and metal plasma is generated in the plasma jet 15.

  Then, after the metal plasma in the plasma jet 15 is ejected to the outside of the heating chamber 5, it is focused by the magnetic lens 10. The focused metal plasma is blown onto the surface of the polyimide film 16 which is a substrate for printed wiring as the object to be processed at the same time as the shutter 11 made of Si having a high metal plasma spray preventing effect is opened. The metal particles constituting the metal plasma adhere to the top.

  Here, the flow rate of the metal plasma sprayed onto the polyimide film 16 is preferably 100 nL / second or less. This is because when the flow rate of the metal plasma is higher than 100 nL / sec, the flow rate of the metal plasma is too high and it is difficult to manufacture fine parts. Note that the flow rate of the metal plasma is obtained by dividing the value (nL) obtained by subtracting the mass of the target object before the metal plasma is sprayed from the mass of the target object after the metal plasma is sprayed by the metal plasma spray time (seconds). Is calculated by

  Then, the spray gun 1 moves in accordance with the CAD data of the metal wiring pattern inputted in advance to the computer, and when the shutter 11 is open, the metal wiring made of the metal particles is drawn on the surface of the polyimide film 16, and the shutter 11 Metal wiring is not drawn when closed. Thereby, a metal wiring pattern is formed on the surface of the polyimide film 16, and a printed wiring board is manufactured.

  Accordingly, in the present invention, a printed wiring board including various fine metal wiring patterns can be variously demanded only by sending an instruction from a desktop computer to the printer apparatus of the present invention without requiring a large-scale factory. It can be efficiently manufactured according to the quantity.

  In the present invention, since metal wiring is drawn by spraying metal plasma directly on the surface of the polyimide film instead of a solution containing a dispersant or the like, the metal wiring on which impurities such as the dispersant are drawn is drawn. Since it is not included, high-quality metal wiring can be drawn, and it is not necessary to expose the printed wiring board to a high-temperature environment, so that metal wiring can be drawn efficiently.

(Embodiment 2)
FIG. 2 is a schematic enlarged cross-sectional view of another preferred example of a part of the printer device for manufacturing a fine part according to the present invention. The present embodiment is characterized in that a shutter 11 a made of Si provided with a through hole 18 is installed between the shutter 11 and the polyimide film 16. That is, the metal plasma in the plasma jet 15 ejected by opening the shutter 11 is prevented from being sprayed from locations other than the opening 19 of the shutter 11a due to the presence of the shutter 11a. Therefore, even when the plasma including the metal plasma is insufficiently focused, it is possible to draw a fine metal wiring having the same size as the opening 19.

(Embodiment 3)
FIG. 3 is a schematic enlarged cross-sectional view of still another preferred example of a part of the printer device for manufacturing a fine part according to the present invention. The present embodiment is characterized in that two magnetic lenses 10a and 10b are installed adjacent to each other. That is, since the plasma containing the metal plasma ejected from the heating chamber 5 is focused by the magnetic lens 10a and further focused by the magnetic lens 10b, a finer metal wiring can be drawn on the surface of the polyimide film 16. .

  In the present embodiment, the case where two magnetic lenses are used has been described. Needless to say, three or more magnetic lenses may be used.

(Embodiment 4)
FIG. 4 is a schematic enlarged cross-sectional view of still another preferred example of a part of the printer device for manufacturing a fine part according to the present invention. The present embodiment is characterized in that a powder supply cup 17 is used in place of the granulation chamber 9 shown in FIG. That is, the metal powder can be supplied to the plasma jet 15 through the metal supply path 8 by putting the metal powder through the opening at the top of the powder supply cup 17. The supplied metal powder is turned into plasma in the high temperature plasma jet 15 to generate metal plasma.

  Here, the average particle size of the metal powder supplied to the plasma jet 15 is preferably 0.1 μm or more and 3 μm or less. When the average particle diameter of the supplied metal powder is less than 0.1 μm, the fluidity of the metal powder tends to deteriorate and the metal supply path 8 tends to be clogged. The metal supply path 8 is blocked and the metal supply path 8 tends to be clogged.

(Other)
In the first to fourth embodiments, an XY-axis changing magnetic lens can be used as the magnetic lens. In this case, the drawing direction of the metal wiring can be easily changed by controlling the magnetic lens.

  In the first to fourth embodiments, an electric field lens may be used instead of the magnetic lens, or a combination of the magnetic lens and the electric field lens may be used.

  In the first to fourth embodiments, the printer device of the present invention can be installed in a glove box having an inert gas atmosphere. In this case, impurities are less likely to be mixed into the manufactured fine part, so that a higher quality fine part can be manufactured.

  In the first to fourth embodiments, from the viewpoint of effectively preventing peeling of the metal wiring from the substrate, the metal wiring is drawn after performing the surface treatment of the substrate such as roughening the surface of the substrate. You can also.

  In the first to fourth embodiments, the metal wiring can be drawn as an aggregate of dots by opening and closing the shutter at a high speed.

  In the first to fourth embodiments, a high melting point metal material such as chromium, molybdenum or tungsten, or an oxide, nitride or carbide ceramic material can be sprayed.

(Examples 1-5)
Ar gas is introduced into the heating chamber 5 from the gas introduction part 6 shown in FIG. 4 at a flow rate of 10 ml / second, and the cathode 7 made of tungsten and the anode made of copper are installed in the heating chamber 5 with an interval of about 1 mm. 3 was applied to generate arc discharge by voltage, and then the voltage was set to 0.5 kV to maintain the plasma jet 15.

  Then, silver powder having an average particle diameter of 3 μm was put into the opening of the powder supply cup 17 and supplied to the plasma jet 15 through the metal supply path 8. Here, the silver powder is supplied by adjusting the orifice attached to the powder supply cup 17 and the shaker so that the flow rate of the metal plasma in the plasma jet 15 is 1.4 nL / sec. It was broken. Then, a magnetic field for focusing is generated in the magnetic lens 10 by energizing the magnetic lens 10 to set the focusing diameter of the plasma containing the metal plasma to 10 μm, and then the silicon shutter 11 is opened to form a substrate having a thickness of 30 μm. A linear silver wiring was drawn at a sweep speed (100 to 500 cm / min) shown in Table 1.

  And the presence or absence of the thermal damage of the board | substrate after silver wiring drawing, and the height and width of the cross section of silver wiring were investigated. The survey results are shown in Table 1. The cross section of the drawn silver wiring has a mountain shape, and the height and width of the cross section of the silver wiring is the vertical length (height) between the highest portion near the center of the cross section and the substrate surface. ) And the horizontal length (width) within a range where the presence of silver is recognized by an electron microscope in the cross section.

  As shown in Table 1, no thermal damage was found on the substrate at any of the sweep rates of Examples 1-5.

  Moreover, in any of Examples 1 to 5, it was confirmed that silver wiring having a fine height and width was drawn on the substrate.

  Further, when the volume resistivity of the silver wiring obtained in Examples 1 to 5 was examined, it was 1.70 to 1.95 μΩ / cm which was not much different from general volume resistivity (1.67 μΩ / cm) of silver. A good value of was obtained.

(Examples 6 to 14)
Silver powder is supplied so that the flow rate of the metal plasma is the flow rate shown in Tables 2 and 3 (0.07 to 5.01 nL / sec), and the focused diameter is the value shown in Tables 2 and 3 (2 to 50 μm). In the same manner as in Example 1 except that the plasma containing the metal plasma was focused so that a silver wiring was drawn at a sweep rate of 200 cm / min, a linear film was formed on a polyimide film having a thickness of 30 μm. Drawn silver wiring.

  Then, in the same manner as in Examples 1 to 5, the presence or absence of thermal damage of the substrate after drawing the silver wiring and the height and width of the cross section of the silver wiring were investigated. The survey results are shown in Tables 2 and 3.

  As shown in Table 2 and Table 3, as a result of examining the substrate after drawing the silver wiring, no thermal damage was found in the substrate in any of Examples 6 to 14.

  Moreover, in any of Examples 6 to 14, it was confirmed that silver wiring having a fine height and width was drawn on the substrate.

  Further, it was confirmed that the silver wiring could be drawn even when the focused diameter of the plasma including the metal plasma was reduced to 2 μm as in Example 14.

  Further, when the volume resistivity of the silver wiring obtained in Examples 6 to 14 was examined, as shown in Tables 2 and 3, the volume resistivity of general silver (1.67 μΩ / cm) was not much different. Good values of 1.71 to 1.90 μΩ / cm were obtained.

(Examples 15 to 18)
In Example 15, Example 1 was performed except that copper powder having an average particle diameter of 0.3 μm was supplied so that the flow rate of the metal plasma was 0.5 nL / sec, and wiring was drawn at a sweep rate of 200 cm / min. In the same manner, a linear copper wiring was drawn on a polyimide film having a thickness of 30 μm as a substrate.

  Further, in Example 16, a substrate having a thickness of 30 μm was formed in the same manner as in Example 15 except that the printer device was installed in a glove box that was evacuated and then replaced with an Ar atmosphere to draw copper wiring. A linear copper wiring was drawn on the polyimide film.

  In Example 17, a silicon shutter (diameter: 4 inches, thickness: 0.5 mm) having a through hole having a square opening with a side of 5 μm formed by vapor-phase trench etching is used as a substrate. The printer apparatus was installed so as to face the polyimide film, and the focusing point (focusing diameter: 10 μm) of the plasma containing the metal plasma and the central part of the through hole of the shutter coincided. And it arrange | positioned so that the space | interval between a polyimide film and the said shutter might be set to 200 micrometers. Moreover, about the 30-micrometer-thick polyimide film which is a board | substrate, the substrate surface was roughened using the plasma (output: 200W) which consists of argon and oxygen. Other than that, linear copper wiring was drawn on the substrate in the same manner as in Example 15.

  In Example 18, an XY-axis changing magnetic lens was installed instead of the magnetic lens 10 shown in FIG. 4, and copper wiring was drawn so that a square with a side of 5 μm was drawn 20 times per second with a single stroke. did. In Example 18, copper wiring was drawn in the same manner as Example 17 except that a silicon shutter having a through hole was not used.

  Then, in the same manner as in Examples 1 to 5, the presence or absence of thermal damage of the substrate after drawing the copper wiring, and the height and width of the cross section of the copper wiring were investigated. These survey results are shown in Table 4.

  Moreover, about Examples 15-16, the volume specific resistance of the copper wiring was investigated, respectively. The survey results are shown in Table 4.

  Further, for Examples 16 to 18, is the substrate folded in such a manner that the drawing surface of the substrate on which the copper wiring is drawn becomes the front side, and folded until the back surfaces of the drawing surfaces come into contact with each other, and the copper wiring is peeled off? It was investigated (bending test). Further, it was investigated whether or not the copper wiring was peeled by stretching the substrate until the length of the substrate after drawing the copper wiring was 115% of the length before stretching (15% stretching test). These survey results are shown in Table 4.

  As shown in Table 4, as a result of examining the substrate after drawing the copper wiring, no thermal damage was found on the substrate in any of Examples 15 to 18.

  Moreover, in any of Examples 15 to 18, it was confirmed that copper wiring having a fine height and width was drawn on the substrate.

  In Example 15, most of the copper wiring was changed to copper oxide, and its volume resistivity was as high as 500 μΩ / cm, but in Example 16, it was replaced with Ar atmosphere. Since copper wiring was drawn in the glove box, a good value of 1.95 μΩ / cm for the volume resistivity was obtained.

  Further, in any of Examples 16 to 18, the copper wiring was not peeled off by the bending test, but in Example 16 where the substrate was not surface-treated, the copper wiring was peeled off by the 15% extension test.

(Examples 19 to 22)
Unlike Examples 1-18, Examples 19-22 are characterized by not supplying metal powder but supplying various types of vaporized metals shown in Table 5 generated by arc discharge. . Here, in Examples 19 to 22, the diameters of the metal wires 12a and 12b shown in FIG. 1 are set to 1 mm, and an AC pulse voltage of 15 kV is added to the energizing sleeves 13a and 13b at intervals of 500 milliseconds for each pulse. Inverted and minus to energize. Further, Ar gas was allowed to flow into the granulation chamber 9 at a rate of 5 ml / second. A linear metal wiring was drawn at a sweep rate of 200 cm / min. Except for the above, metal wiring was drawn in the same manner as in Example 1.

  And like Example 1-5, after investigating the presence or absence of the thermal damage of the board | substrate after metal wiring drawing, and the height and width of the cross section of metal wiring, the volume specific resistance of metal wiring was investigated. The survey results are shown in Table 5.

  In Example 22, the metal wire used for supplying the vaporized metal was an alloy of tin and silver (the mass ratio of tin and silver was tin: silver = 99: 1).

  As shown in Table 5, no thermal damage was observed on the substrate in any of Examples 19-22.

  Further, in any of Examples 19 to 22, it was confirmed that a metal wiring having a fine height and width was drawn on the substrate, and that a good volume resistivity was obtained.

  It should be understood that the embodiments and examples disclosed herein are illustrative and non-restrictive in every respect. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  As described above, the present invention is not only suitably used for the production of metal wiring as a fine component or a printed wiring board as a fine component, but also for the production of a fine component in MEMS (Micro Electro Mechanical System) technology. Used.

It is a typical expanded sectional view of a preferable example of a part of printer apparatus for fine component manufacture of the present invention. It is a typical expanded sectional view of some other preferable examples of the printer apparatus for fine component manufacture of this invention. FIG. 6 is a schematic enlarged cross-sectional view of still another preferred example of a part of the printer device for manufacturing a fine part according to the present invention. FIG. 6 is a schematic enlarged cross-sectional view of still another preferred example of a part of the printer device for manufacturing a fine part according to the present invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Thermal spray gun, 2 Insulator, 3 Anode, 4 Metal container, 4a Protrusion part, 5 Heating chamber, 6 Gas introduction part, 7 Cathode, 7a Cathode surface by the side of a plasma jet, 8 Metal supply path, 9 Granulation chamber, 10, 10a, 10b Magnetic lens, 11, 11a Shutter, 12a, 12b Metal wire, 13a, 13b Current supply sleeve, 14 Gas introduction tube, 15 Plasma jet, 16 Polyimide film, 17 Powder supply cup, 18 Through hole, 19 Opening Part, 20a, 20b arrow, 21 gas plasma.

Claims (8)

Jetting means for jetting a plasma jet generated by gasification into plasma, and focusing means for focusing the plasma of the metal generated by introducing metal into the plasma jet jetted from the jetting means; And preventing means for preventing the metal plasma after the focusing by the focusing means from being sprayed onto the substrate . The preventing means is a shutter, and when the shutter is open, the metal plasma is blown to the substrate, by Rukoto spraying to the substrate of the plasma of the metal is prevented when said shutter is closed, characterized by drawing a metal wire which is fine component on a substrate, a fine component production Printer device. 2. The printer device for manufacturing a micro component according to claim 1, wherein the metal is a metal vaporized by the occurrence of arc discharge.   3. The printer device for manufacturing a fine part according to claim 1, wherein the focusing means is a magnetic lens.   4. The printer device for manufacturing a fine part according to claim 1, wherein the shutter is a shutter made of silicon.   5. The micro device manufacturing printer device according to claim 1, wherein the ejection unit moves in accordance with data input to a computer in advance. Introducing a gas into the heating chamber; heating the introduced gas in the heating chamber; introducing a metal into the heated gas; generating a plasma of the introduced metal ; wherein comprising the step of focusing the plasma, a step of drawing a metal wire which is fine component on a substrate the presence of blowing into the plasma of the substrate after said focused controlled by opening and closing the shutter, the fine component Manufacturing method. The method of manufacturing a fine component according to claim 6, wherein a flow rate of the plasma sprayed on the substrate is 100 nL / second or less. 8. The method of manufacturing a micro component according to claim 6, wherein the substrate is a printed wiring substrate, and metal wiring is drawn on the substrate by spraying metal plasma on the substrate. Method.

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