JP3928583B2 - Method for manufacturing light emitting device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to a light emitting device including a plurality of light emitting elements.SetIt relates to a manufacturing method.
[0002]
[Prior art]
In recent years, in the field of light emitting devices, a semiconductor laser (LD; laser diode) (hereinafter referred to as a multiwavelength laser) in which a plurality of light emitting portions having different emission wavelengths is formed on the same substrate (or base) has been actively used. Has been developed. As an example of such a multi-wavelength laser, for example, as shown in FIG. 16, there is a laser in which a plurality of light emitting portions having different emission wavelengths are formed in one chip (so-called monolithic multi-wavelength laser). This multi-wavelength laser includes, for example, a laser oscillation unit 201 formed by growing an AlGaAs-based semiconductor material using a vapor phase growth method, and a laser oscillation unit formed by growing an AlGaInP-based semiconductor material. 202 is arranged in parallel on one surface side of the substrate 212 made of GaAs (gallium arsenide) through the separation groove 211. In this case, the oscillation wavelength of the laser oscillation unit 201 is a 700 nm band (for example, 780 nm), and the oscillation wavelength of the laser oscillation unit 202 is a 600 nm band (for example, 650 nm).
[0003]
In addition to the structure shown in FIG. 16, as shown in FIG. 17, a plurality of semiconductor lasers LD having different emission wavelengths are disposed on the substrate 221 for arrangement.₁, LD₂Have been proposed (so-called hybrid multi-wavelength laser). However, the so-called monolithic type described above is more effective in that the light emitting point interval can be controlled with high accuracy.
[0004]
These multi-wavelength lasers are used, for example, as a laser light source of an optical disc apparatus. Currently, in an optical disc apparatus, a semiconductor laser beam of 700 nm band is generally used for reproducing a CD (Compact Disk) and recording such as a CD-R (CD recordable), a CD-RW (CD Rewritable), or an MD (Mini Disk). It is used for recording and playback of possible optical discs. Further, a 600 nm band semiconductor laser beam is used for recording / reproduction of a DVD (Digital Versatile Disk). Accordingly, by mounting the multi-wavelength laser as described above on the optical disc apparatus, it is possible to record or reproduce any of a plurality of existing types of optical discs. Moreover, the laser oscillation units 201 and 202 are on the same substrate (so-called hybrid type semiconductor lasers LD).₁, LD₂Are arranged in parallel on the same arrangement substrate), a single laser light source package is required, and an optical system such as an objective lens or a beam splitter for recording / reproducing various optical disks is used. It is possible to simplify the configuration of the optical system by reducing the number of parts, and to realize downsizing and cost reduction of the optical disc apparatus.
[0005]
Incidentally, in recent years, it has been demanded to further increase the density of an optical disk by using a semiconductor laser that emits light of a shorter wavelength. As a constituent material of a semiconductor laser that meets such demands, nitride-based III-V group compound semiconductors (hereinafter also referred to as GaN-based semiconductors) typified by GaN, AlGaN mixed crystals and GaInN mixed crystals are known. ing. This semiconductor laser using a GaN-based semiconductor can generate an oscillation wavelength of around 400 nm, which is the limit wavelength of an optical disk that can be recorded and reproduced using an existing optical system, so that it can be used for next-generation optical disks. It is attracting much attention as a light source for recording and playback devices. It is also expected as a light source for full-color displays using the three primary colors of RGB. Therefore, development of a multiwavelength laser having a GaN-based laser oscillation unit is desired.
[0006]
Conventionally, as a multi-wavelength laser having a GaN-based laser oscillation unit, for example, as shown in FIG. 18, an AlGaAs-based laser oscillation unit 201, an AlGaInP-based laser oscillation unit 202, and a GaN-based laser oscillation unit 203, There has been proposed a multi-wavelength laser formed in parallel on one surface side of a SiC (silicon carbide) substrate 231 via separation grooves 211a and 211b (see Japanese Patent Application Laid-Open No. 11-186651).
[0007]
[Problems to be solved by the invention]
However, when a so-called monolithic multi-wavelength laser is manufactured, the GaN-based material and the AlGaAs-based or AlGaInP-based material have different lattice constants, so that they are integrated on one chip on the same substrate. There was a problem that it was difficult.
[0008]
In addition, since the so-called hybrid type multi-wavelength laser has a problem in that the controllability of the emission point interval is inferior, as described above, when three or more semiconductor lasers are arranged in parallel on the arrangement substrate, The malfunction that it is inferior to controllability of a light emission point space | interval will arise.
[0009]
  The present invention has been made in view of such problems,Its purpose isIt can be easily manufactured and the light emission position can be accurately controlled.Method for manufacturing light emitting deviceIs to provide.
[0010]
[Means for Solving the Problems]
  A method of manufacturing a light emitting device according to the present invention includes forming a first light emitting element on the surface of a first substrate that is insulating and transparent in the visible region,,One electrode of the first light emitting elementandAfter forming each of the other electrodes, a step of forming the first wiring on the back surface of the first substrate while observing the position of the one electrode from the first substrate side, and two second wirings are formed The first light-emitting element on which the first wiring is formed is bonded on the insulating support base so that one electrode and the other electrode are electrically connected to the second wiring, respectively. And a step of bonding the first light emitting element to the support base, and then forming a second electrode on the surface of the second substrate and having one electrode on the second substrate and the other electrode on the back surface of the second substrate. The light emitting element
And a step of bonding one electrode to the first substrate so as to be electrically connected to the first wiring.
[0015]
  According to the inventionIn the method for manufacturing a light emitting device, since the first substrate is transparent in the visible region, after forming the first light emitting element on the surface of the first substrate, the first light emitting element is formed from the first substrate side. While observing one of the electrodes, the first wiring can be accurately formed at a position where the electrode of the second light-emitting element is connected in a later process, and thus the light-emitting region of the first light-emitting element and the second The position of the light emitting region of the light emitting element is accurately controlled.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0017]
[First Embodiment]
FIG. 1 shows a cross-sectional structure of a light emitting device 10A according to the first embodiment of the present invention. The light-emitting device 10A includes a support base 11, a first light-emitting element 20 disposed on one surface side of the support base 11, and a second light-emitting device 20 disposed on the opposite side of the first light-emitting element 20 from the support base 11. The light emitting element 30 is provided.
[0018]
The support base 11 is made of a metal such as copper (Cu), for example, and has a role of a heat sink that dissipates heat generated in the first light emitting element 20 and the second light emitting element 30. The support base 11 is also electrically connected to an external power source (not shown), and also has a role of electrically connecting the first light emitting element 20 to the external power source.
[0019]
The first light emitting element 20 is, for example, a semiconductor laser that can emit light having a wavelength of about 400 nm. The first light-emitting element 20 includes, for example, an n-type cladding layer 22 made of, for example, a nitride-based III-V compound semiconductor on the support base 11 side of the first substrate 21 made of a nitride-based III-V compound semiconductor. The active layer 23, the degradation preventing layer 24, the p-type cladding layer 25, and the p-side contact layer 26 are stacked in this order from the first substrate 21 side. Here, the nitride-based III-V group compound semiconductor means at least one of the group 3B elements in the short period periodic table and at least nitrogen (of the group 5B in the short period periodic table) ( N).
[0020]
Specifically, the first substrate 21 is made of, for example, n-type GaN to which silicon (Si) is added as an n-type impurity, and has a thickness in the stacking direction (hereinafter simply referred to as thickness). Is, for example, 80 to 100 μm. GaN is a transparent material in the visible region (about 380 to 800 nm). GaN is a material having a high thermal conductivity of about 1.3 W / (cm · K) and excellent thermal conductivity. The first substrate 21 uses this characteristic to generate the second light emission. It functions as a heat sink that dissipates heat generated in the element 30.
[0021]
The n-type cladding layer 22 has, for example, a thickness of 1 μm and an n-type AlGaN (for example, Al) to which silicon is added as an n-type impurity._0.08Ga_0.92N) It is composed of mixed crystals. For example, the active layer 23 has a thickness of 30 nm and has a different composition._xIn_1-xIt has a multiple quantum well structure of a well layer and a barrier layer formed by N (where x ≧ 0) mixed crystals. The active layer 23 functions as a light emitting part.
[0022]
The degradation preventing layer 24 is, for example, p-type AlGaN (for example, Al) having a thickness of 20 nm and added with magnesium (Mg) as a p-type impurity._0.2Ga_0.8N) It is composed of mixed crystals. The p-type cladding layer 25 has a thickness of 0.7 μm, for example, and p-type AlGaN doped with magnesium as a p-type impurity (for example, Al_0.08Ga_0.92N) It is composed of mixed crystals. The p-side contact layer 26 has, for example, a thickness of 0.1 μm and is composed of p-type GaN to which magnesium is added as a p-type impurity.
[0023]
A part of the p-type cladding layer 25 and the p-side contact layer 26 are formed in a thin band extending in the direction of the resonator (in the direction perpendicular to the paper surface in FIG. 1), and form a so-called laser stripe. As a result, current constriction is performed. The p-side contact layer 26 is provided, for example, in the center of the direction perpendicular to the resonator direction (the direction of the arrow A shown in FIG. 1), and the side surface of the p-side contact layer 26 and the p-type cladding layer The surface opposite to the deterioration preventing layer 24 of 25 is silicon dioxide (SiO 2₂) Or the like. Incidentally, the region of the active layer 23 corresponding to the p-side contact layer 26 is a light emitting region.
[0024]
A p-side electrode 28 is formed on the opposite side of the p-side contact layer 26 from the p-type cladding layer 25. For example, the p-side electrode 28 is formed by sequentially stacking palladium (Pd), platinum (Pt), and gold (Au) from the p-side contact layer 26 side, and is electrically connected to the p-side contact layer 26. ing. The p-side electrode 28 is also electrically connected to the support base 11 via the adhesive layer 12. The adhesive layer 12 is made of, for example, an alloy of gold (Au) and tin (Sn) or tin.
[0025]
In addition, an n-side electrode 29 is provided on the opposite side of the first substrate 21 from the support base 11 so as to correspond to a laser oscillation unit 50 described later. For example, the n-side electrode 29 is formed by sequentially laminating titanium (Ti) and aluminum from the side of the first substrate 21 and alloying them by heat treatment, and is electrically connected to the first substrate 21. Yes. The n-side electrode 29 also has a function as wiring for connecting the laser oscillation unit 50 to an external power source. On the opposite side of the support substrate 11 of the first substrate 21, a wiring 13 is formed through an insulating film 14 for electrical connection to a laser oscillation unit 40 described later of the second light emitting element 30. Has been. The wiring 13 is made of, for example, metal.
[0026]
Further, the first light emitting element 20 has a pair of side surfaces located at the end portions in the resonator direction as resonator end surfaces, and a pair of reflecting mirror films (not shown) are formed on the pair of resonator end surfaces. Yes. Of these pair of reflector films, one is set to reflect the light generated in the active layer 23 with a high reflectance, and the other one is set to reflect with a lower reflectance than this, Light is emitted from the other side.
[0027]
The second light emitting element 30 is, for example, a second substrate 31 and a laser capable of emitting light in a 700 nm band (for example, 780 nm) formed on the support base 11 side of the second substrate 31 via the buffer layer 32. The oscillation unit 40 and the laser oscillation unit 50 capable of emitting light in the 600 nm band (for example, 650 nm) formed on the support base 11 side of the second substrate 31 via the buffer layer 32 are provided. For example, the second substrate 31 has a thickness of about 100 μm and is made of n-type GaAs to which silicon is added as an n-type impurity. The buffer layer 32 has a thickness of 0.5 μm, for example, and is made of n-type GaAs to which silicon is added as an n-type impurity. The laser oscillating unit 40 and the laser oscillating unit 50 are separated by, for example, about 200 μm or less, the resonator direction is aligned with the first light emitting element 20, and the p-side contact layer 26 of the first light emitting element 20 is interposed therebetween. It arrange | positions so that it may correspond. Specifically, an interval between a light emitting region described later of the laser oscillating unit 40 and a light emitting region described later of the laser oscillating unit 50 is about 120 μm, and the light emitting region of the first light emitting element 20 corresponds to the middle. Is located.
[0028]
The laser oscillation unit 40 includes, for example, a group III-V including at least gallium (Ga) among the 3B group elements in the short period type periodic table and at least arsenic (As) among the 5B group elements in the short period type periodic table. Each of the n-type cladding layer 41, the active layer 42, the p-type cladding layer 43, and the p-type cap layer 44 made of a compound semiconductor is laminated in this order from the second substrate 31 side.
[0029]
Specifically, the n-type cladding layer 41 has a thickness of 1.5 μm, for example, and is made of an n-type AlGaAs mixed crystal to which silicon is added as an n-type impurity. The active layer 42 has, for example, a thickness of 40 nm and different Al composition._xGa_1-xIt has a multiple quantum well structure of a well layer and a barrier layer each formed of an As (where x ≧ 0) mixed crystal. The active layer 42 functions as a light emitting portion, and the light emission wavelength is in the 700 nm band, for example. For example, the p-type cladding layer 43 has a thickness of 1.5 μm and is made of a p-type AlGaAs mixed crystal to which zinc is added as a p-type impurity. The p-type cap layer 44 has, for example, a thickness of 0.5 μm and is made of p-type GaAs to which zinc is added as a p-type impurity.
[0030]
Note that a part of the p-type cladding layer 43 and the p-type cap layer 44 are in the form of a thin band extending in the direction of the resonator so as to confine current. Current blocking regions 45 are provided on both sides of the belt-like portion. Incidentally, the region of the active layer 42 corresponding to the p-side cap layer 44 is a light emitting region.
[0031]
A p-side electrode 46 is formed on the opposite side of the p-type cap layer 44 from the p-type cladding layer 43. For example, the p-side electrode 46 is formed by sequentially laminating titanium, platinum, and gold from the p-type cap layer 44 side and alloying them by heat treatment, and is electrically connected to the p-type cap layer 44. The p-side electrode 46 is also electrically connected to the wiring 13 through the adhesive layer 15. The adhesive layer 15 is made of, for example, the same material as the adhesive layer 12.
[0032]
In the laser oscillation unit 50, for example, an n-type cladding layer 52, an active layer 53, a p-type cladding layer 54, and a p-type cap layer 55 are stacked in this order from the second substrate 31 side through a buffer layer 51. It has a configuration. Each of these layers includes, for example, a group III-V compound containing at least indium (In) among the group 3B elements in the short period type periodic table and at least phosphorus (P) among the group 5B elements in the short period type periodic table. Each is constituted by a semiconductor.
[0033]
Specifically, the buffer layer 51 has, for example, a thickness of 0.5 μm and is composed of an n-type InGaP mixed crystal to which silicon is added as an n-type impurity. The n-type cladding layer 52 has a thickness of 1.5 μm, for example, and is composed of an n-type AlGaInP mixed crystal to which silicon is added as an n-type impurity. For example, the active layer 53 has a thickness of 35 nm and has different compositions._xGa_yIn_1-xyIt has a multiple quantum well structure of a well layer and a barrier layer each formed by a mixed crystal of P (where x ≧ 0 and y ≧ 0). The active layer 53 functions as a light emitting part. The p-type cladding layer 54 has a thickness of 1.0 μm, for example, and is made of a p-type AlGaInP mixed crystal to which zinc is added as a p-type impurity. For example, the p-type cap layer 55 has a thickness of 0.5 μm and is made of p-type GaAs to which zinc is added as a p-type impurity.
[0034]
Note that a part of the p-type cladding layer 54 and the p-type cap layer 55 are formed in a thin band shape, and current confinement extended in the direction of the resonator is performed. Current blocking regions 56 are provided on both sides of the belt-like portion. Incidentally, the region of the active layer 53 corresponding to the p-side cap layer 55 is a light emitting region.
[0035]
On the opposite side of the p-type cap layer 55 from the p-type cladding layer 54, a p-side electrode 57 that is electrically connected to the p-type cap layer 55 and has the same configuration as the p-side electrode 46, for example, is provided. The p-side electrode 57 is also electrically connected to the n-side electrode 29 of the first light emitting element 20 via the adhesive layer 16 made of the same material as the adhesive layer 15.
[0036]
Further, the n-side electrode 33 of the laser oscillation units 40 and 50 is formed on the opposite side of the second substrate 31 from the support base 11. For example, the n-side electrode 33 is formed by sequentially laminating an alloy of gold and germanium (Ge), nickel and gold from the second substrate 31 side and alloying them by heat treatment.
[0037]
Further, in the second light emitting element 30, a pair of side surfaces located at the end portions in the resonator direction are respectively resonator end surfaces, and the laser oscillators 40 and 50 are not shown on the pair of resonator end surfaces. A pair of reflecting mirror films is formed. In these pair of reflecting mirror films, the level of reflectivity is set so as to correspond to a pair of reflecting mirror films (not shown) provided in the first light emitting element 20, respectively. The laser oscillation units 40 and 50 of the light emitting element 30 emit light from the same side.
[0038]
The light emitting device 10A having such a configuration is used by being housed inside the package 1, for example, as shown in FIG. The package 1 includes, for example, a disk-shaped support body 2 and a lid body 3 provided on one surface side of the support body 2. Inside the lid 3, the support base 11 is supported by the support 2 to house the light emitting device 10 </ b> A, and the light emitted from the light emitting device 10 </ b> A is extracted from the extraction window 3 a of the lid 3. It has become.
[0039]
The package 1 is provided with a plurality of conductive pins 4 a to 4 d, and the pins 4 a are electrically connected to the support base 11. The other pins 4b to 4d penetrate the support body 2 through, for example, insulating rings 5b to 5d, and are provided from the inside of the lid body 3 to the outside. Wiring 13 is electrically connected to pin 4b via wire 6b, n-side electrode 29 is electrically connected to pin 4c via wire 6c, and n-side electrode is connected to pin 4d via wire 6d. 33 is electrically connected. Here, the package 1 including the four pins 4a to 4d has been described as an example, but the number of pins can be set as appropriate. For example, if the wiring 13 and the support base 11 are connected by a wire, the pin 4b is not necessary and three pins can be provided.
[0040]
Such a light emitting device 10A can be manufactured as follows. 3-5 represents each manufacturing process of the manufacturing method of 10 A of light-emitting devices, respectively.
[0041]
First, as shown in FIG. 3A, for example, a first substrate 21 made of n-type GaN having a thickness of about 400 μm is prepared, and an n-type is formed on the surface of the first substrate 21 by MOCVD. N-type cladding layer 22 made of AlGaN mixed crystal, active layer 23 made of InGaN mixed crystal, deterioration preventing layer 24 made of p-type AlGaN mixed crystal, p-type cladding layer 25 made of p-type AlGaN mixed crystal, and p-type GaN The p-side contact layer 26 is grown sequentially. When these layers are grown, the temperature of the first substrate 21 is adjusted to, for example, 750 ° C. to 1100 ° C.
[0042]
Next, as shown in FIG. 3B, a mask (not shown) is formed on the p-side contact layer 26, and the upper layer portions of the p-side contact layer 26 and the p-type cladding layer 25 are selectively etched. And a p-type cladding layer 25 is exposed on the surface. Subsequently, an insulating layer 27 is formed so as to cover the surface of the p-type cladding layer 25 and the side surface of the p-side contact layer 26 using a mask (not shown) on the p-side contact layer 26.
[0043]
After the insulating layer 27 is formed, for example, palladium, platinum, and gold are sequentially deposited on the surface of the p-side contact layer 26 and the vicinity thereof to form the p-side electrode 28. Further, in order to easily cleave the first substrate 21 in a process described later, the back surface side of the first substrate 21 is lapped and polished, for example, so that the thickness of the first substrate 21 is about 100 μm, for example.
[0044]
Subsequently, the insulating film 14 is formed on the back side of the first substrate 21 corresponding to the position where the laser oscillation unit 40 is disposed, and the wiring 13 is formed thereon. Further, for example, titanium and aluminum are sequentially deposited in accordance with the arrangement position of the laser oscillation unit 50 to form the n-side electrode 29. Specifically, the wiring 13 and the n-side electrode 29 are formed at positions separated from each other by about 60 μm with the p-side contact layer 26 as the center. In this case, in the present embodiment, the first substrate 21 is made of transparent GaN in the visible region, and is made of a nitride III-V compound semiconductor that is also transparent in the visible region on the first substrate 21. Since each layer is laminated, the position of the p-side electrode 28 can be observed from the first substrate 21 side, and alignment in lithography can be performed with high accuracy. That is, the formation positions of the wiring 13 and the n-side electrode 29 can be accurately controlled. Here, since the hardness of GaN constituting the first substrate 21 is high, even if the thickness of the first substrate 21 is about 100 μm, the first substrate 21 is cracked in the lithography process. There is no fear.
[0045]
After the wiring 13 and the n-side electrode 29 are formed, heat treatment is performed to alloy the n-side electrode 29. Thereafter, although not shown here, the first substrate 21 is cleaved with a predetermined width, for example, perpendicular to the length direction of the p-side electrode 28, and a pair of reflecting mirror films are formed on the cleaved surface. Thereby, the 1st light emitting element 20 is produced.
[0046]
On the other hand, as shown in FIG. 4A, for example, a second substrate 31 made of n-type GaAs having a thickness of about 350 μm is prepared, and an n-type is formed on the surface of the second substrate 31 by MOCVD. GaAs buffer layer 32, n-type AlGaAs mixed crystal n-type cladding layer 41, Al_xGa_1-xAn active layer 42 made of an As (where x ≧ 0) mixed crystal, a p-type cladding layer 43 made of p-type AlGaAs mixed crystal, and a p-type cap layer 44 made of p-type GaAs are successively grown. When these layers are grown, the temperature of the second substrate 31 is adjusted to, for example, 750 ° C. to 800 ° C.
[0047]
Next, as shown in FIG. 4B, the resist film R corresponding to the region where the laser oscillation unit 40 is to be formed is formed on the p-type cap layer 44.₁Form. After that, this resist film R₁As a mask, for example, the p-type cap layer 44 is selectively removed using a sulfuric acid-based etching solution, and the p-type cladding layer 43, the active layer 42, and the n-type cladding layer 41 are used using a hydrofluoric acid-based etching solution. Resist film R₁Each part not covered with is selectively removed. After that, resist film R₁Remove.
[0048]
Subsequently, as shown in FIG. 5A, the buffer layer 51 made of n-type InGaP mixed crystal, the n-type cladding layer 52 made of n-type AlGaInP mixed crystal, Al, for example, by MOCVD._xGa_yIn_1-xyAn active layer 53 made of a P (where x ≧ 0 and y ≧ 0) mixed crystal, a p-type cladding layer 54 made of p-type AlGaInP mixed crystal, and a p-type cap layer 55 made of p-type GaAs are successively grown. When these layers are grown, the temperature of the second substrate 31 is adjusted to about 680 ° C., for example.
[0049]
After that, as shown in FIG. 5B, the resist film R corresponding to the region where the laser oscillation unit 50 is to be formed on the p-type cap layer 55.₂Form. Subsequently, this resist film R₂For example, the p-type cap layer 55 is selectively removed using a sulfuric acid-based etching solution, and the p-type cladding layer 54, the active layer 53, and the n-type are etched using a phosphoric acid-based and hydrochloric acid-based etching solution. The cladding layer 52 is selectively removed, and the buffer layer 51 is selectively removed using a hydrochloric acid-based etching solution. After that, resist film R₂Remove.
[0050]
Resist film R₂6A, as shown in FIG. 6A, for example, a thin strip mask (not shown) is formed on the p-type cap layers 44 and 55, and the p-type cap layers 44 and 55 and the p-type cladding layer are formed. An n-type impurity such as silicon is introduced into the upper layer portions 43 and 54 by ion implantation. Thereby, the region into which the impurity is introduced is insulated and becomes current blocking regions 45 and 56. Here, since the positions of the p-type cap layers 44 and 55 are defined by using a lithography technique, the positions can be accurately controlled.
[0051]
After the current blocking regions 45 and 56 are formed, for example, nickel, platinum and gold are sequentially deposited on the surface of the p-type cap layers 44 and 55 and in the vicinity thereof as shown in FIG. Electrodes 46 and 57 are formed, respectively. Furthermore, the thickness of the second substrate 31 is set to, for example, about 100 μm by, for example, lapping and polishing the back surface side of the second substrate 31. Subsequently, for example, an alloy of gold and germanium, nickel and gold are sequentially deposited on the back surface side of the second substrate 31 to form an n-side electrode 33 common to the laser oscillation units 40 and 50. Thereafter, heat treatment is performed to alloy the p-side electrodes 46 and 57 and the n-side electrode 33, respectively. Further, although not shown here, the second substrate 31 is cleaved with a predetermined width perpendicular to the length direction of the p-side electrodes 46 and 57, for example, and a pair of reflecting mirror films are formed on the cleaved surface. Thereby, the 2nd light emitting element 30 is produced.
[0052]
After producing the first light emitting element 20 and the second light emitting element 30 in this way, the support base 11 is prepared. For example, the insulating layer 27 and the p-side electrode 28 of the first light emitting element 20 are formed by the adhesive layer 12. And the support base 11 are bonded. Further, for example, the p-side electrode 46 of the second light-emitting element 30 and the wiring 13 are bonded by the adhesive layer 15, and the p-side electrode 57 of the second light-emitting element 30 and the first light-emitting element 20 are bonded by, for example, the adhesive layer 16. The p-side electrode 29 is adhered. Thus, the light emitting device 10A shown in FIG. 1 is completed.
[0053]
Here, the wiring 13 and the n-side electrode 29 formed with high positional accuracy using high-precision lithography technology, and the p-type cap layers 44 and 55 formed with high positional accuracy using the same high-precision lithography technology. Since the second light emitting element 30 is disposed in the first light emitting element 20, the positions of the light emitting regions are also accurately controlled.
[0054]
Incidentally, when the support base 11 and the first light emitting element 20 and the first light emitting element 20 and the second light emitting element 30 are bonded at the same time, the adhesive layers 12, 14a, and 14b are formed of the same material. It is preferable. In the case of individually bonding, it is preferable that the adhesive layer to be bonded first is formed of a material having a higher melting point than the material for forming the adhesive layer to be bonded later. Specifically, for example, an adhesive layer to be bonded first is formed from an alloy of gold and tin, and an adhesive layer to be bonded later is formed from tin. Thereby, even if it is not heated more than necessary, it can be satisfactorily adhered to both.
[0055]
The light emitting device 10A is housed in the package 1 as shown in FIG. 2 and operates as follows.
[0056]
In the light emitting device 10A, when a voltage is applied between the n-side electrode 29 and the p-side electrode 28 of the first light emitting element 20 via the pin 4c and the pin 4a of the package 1, current is supplied to the active layer 23. The light is injected and light is emitted by electron-hole recombination, and light having a wavelength of about 400 nm is emitted from the first light emitting element 20. Further, when a predetermined voltage is applied between the n-side electrode 33 and the p-side electrode 46 of the second light emitting element 30 via the pins 4d and 4b, a current is injected into the active layer 42, and the electron − Light emission occurs due to hole recombination, and light having a wavelength in the 700 nm band is emitted from the laser oscillation unit 40. Further, when a predetermined voltage is applied between the n-side electrode 33 and the p-side electrode 57 of the second light emitting element 30 through the pins 4d and 4c, a current is injected into the active layer 53, and the electron − Light emission occurs due to hole recombination, and light having a wavelength in the 600 nm band is emitted from the laser oscillation unit 50. These lights are extracted to the outside of the package 1 through the extraction window 3 a of the package 1.
[0057]
In addition, although heat is also generated during light emission, the heat generated in the laser oscillation unit 40 or the laser oscillation unit 50 is here because the first substrate 21 is made of a material having a relatively high thermal conductivity. Then, it is quickly dissipated through the first substrate 21 and the support base 11. Further, the heat generated in the first light emitting element 20 is quickly dissipated through the support base 11.
[0058]
As described above, according to the light emitting device 10A according to the present embodiment, since the first light emitting element 20 and the second light emitting element 30 are stacked, the nitride-based III-V group compound semiconductor layer and the AlGaAs It is not necessary to grow the AlGaInP-based III-V group compound semiconductor layer on the same substrate, and a multi-wavelength laser having an emission wavelength of about 400 nm can be easily obtained. Therefore, by using this light emitting device 10A, it is possible to easily realize an optical disc device capable of recording / reproducing regardless of the type of the optical disc, for example, with a plurality of types of light sources.
[0059]
In particular, since the first light emitting element 20 is configured to have a nitride III-V compound semiconductor layer and can emit light having a wavelength of around 400 nm, the light emitting device 10A is used as an optical device such as an optical disk device. If it is mounted on the optical disc, it is possible to record / reproduce an optical disc on which information is recorded at a higher density.
[0060]
In addition, since the first substrate 21 is made of a material that is transparent in the visible region, the n-side electrode 29 and the wiring 13 can be formed with high positional accuracy by using the lithography technique. By bonding the p-side electrodes 46 and 57 of the second light emitting element 30 formed with high positional accuracy, the positions of the light emitting area of the first light emitting element 20 and the light emitting area of the second light emitting element 30 are accurately controlled. can do. Furthermore, by setting these intervals to a desired minute value, the light emitted from each light emitting element can be emitted from the region of a minute diameter.
[0061]
In addition, since the first substrate 21 is made of a material having a high thermal conductivity, the heat generated during the light emission in the laser oscillation units 40 and 50 can be promptly supported via the first substrate 21. 11 can be dissipated. Therefore, even if the second light emitting element 30 is provided on the first light emitting element 20, the temperature rise of the second light emitting element 30 can be prevented and the operation can be stably performed for a long time.
[0062]
The light emitting device 10A is used for an optical disk recording / reproducing device as an optical device, for example. FIG. 7 schematically shows the configuration of the optical disc recording / reproducing apparatus. This optical disc recording / reproducing apparatus is for reproducing information recorded on an optical disc using light having different wavelengths and recording information on the optical disc. This optical disc recording / reproducing apparatus includes a light emitting device 10A according to the present embodiment and an emitted light L having a predetermined emission wavelength emitted from the light emitting device 10A based on the control of the control unit 111._outIs guided to the optical disk D and the signal light from the optical disk D (reflected light L_ref) An optical system for reading, that is, a beam splitter 112, a collimator lens 113, a mirror 114, an aperture limiting aperture 115, an objective lens 116, a signal light detection lens 117, a signal light detection light receiving element 118, and a signal light reproduction circuit 119 are provided. I have.
[0063]
In this optical disk recording / reproducing apparatus, for example, the emitted light L having a high intensity emitted from the light emitting device 10 is emitted._outIs reflected by the beam splitter 132, converted into parallel light by the collimator lens 133, and reflected by the mirror 134. The outgoing light L reflected by this mirror 134_outPasses through the aperture limiting aperture 115, is condensed by the objective lens 116, and enters the optical disc D. As a result, information is written on the optical disc D. Further, for example, the weak emitted light L emitted from the light emitting device 10_outIs incident on the optical disk D through each optical system as described above, and then reflected by the optical disk D. This reflected light L_refPasses through the objective lens 116, the aperture limiting aperture 115, the mirror 114, the collimator lens 113, and the beam splitter 112, passes through the signal light detection lens 117, and enters the signal light detection light receiving element 118, where it is converted into an electrical signal. After the conversion, the signal light reproducing circuit 119 reproduces information written on the optical disc D.
[0064]
Note that, as described above, the light emitting device 10A according to the present embodiment can be accommodated in one package, and the emitted light L is emitted from a plurality of light emitting regions whose intervals are precisely defined._outIs coming out. Therefore, when this light emitting device 10A is used, a plurality of outgoing lights L having different wavelengths are used._outCan be guided to a predetermined location using a common optical system. Therefore, simplification, size reduction, and cost reduction of the optical disc recording / reproducing apparatus can be realized. Further, since the error of the light emitting point interval is extremely small, the reflected light L that forms an image on the light receiving portion (the light receiving element 118 for signal light detection)._refCan be prevented from being different depending on each optical disk recording / reproducing apparatus. That is, the optical system can be easily designed and the yield of the optical disc recording / reproducing apparatus can be improved.
[0065]
Further, since the light emitting device 10A of the present embodiment can obtain light emission of three wavelengths of around 400 nm, 600 nm band and 700 nm band, CD-ROM (Read Onry Memory), CD-R, CD-RW, MD In addition to various existing optical disks such as DVD-ROM, DVD-RAM (Random Access Memory), DVD + RW or DVD-R / RW, which are currently proposed as high-capacity rewritable disks, are even higher. Next-generation recordable optical discs having an areal recording density (for example, 20 Gbytes or more) (for example, optical discs used for DVR (Digital Video Recorder) or VDR (Video Disk Recorder) proposed as next-generation optical disc devices) Recording / reproduction can be performed. If such a next-generation recordable large-capacity disk can be used, video data can be recorded and the recorded data (image) can be reproduced with good image quality and good operability.
[0066]
Here, an example in which the light emitting device 10A is applied to an optical disk recording / reproducing apparatus has been described. However, for recording / reproducing an optical disk reproducing apparatus, an optical disk recording apparatus, a magneto-optical disk (MO), or the like. It can be applied not only to optical devices such as magneto-optical disk devices or optical communication devices, but also to devices equipped with an in-vehicle semiconductor laser device that needs to operate at a high temperature.
[0067]
[Second Embodiment]
FIG. 8 shows a cross-sectional structure of a light emitting device 10B according to the second embodiment of the present invention. The light emitting device 10B has the same configuration and function as the light emitting device 10A, except that the second light emitting element 60 is provided instead of the second light emitting element 30 in the light emitting device 10A of the first embodiment. And have an effect. Therefore, the same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted here.
[0068]
The second light emitting element 60 in the present embodiment is a laser oscillating part capable of emitting light of 500 mn band (for example, 520 nm) instead of the laser oscillating part 40 of the second light emitting element 30 in the first embodiment. The rest of the configuration is the same as that of the second light emitting element 30 except that 70 is provided and the buffer layer 32 is not provided.
[0069]
The laser oscillation unit 70 is disposed on the support substrate 11 side of the second substrate 31 via, for example, a buffer layer 71, an n-type cladding layer 72, a guide layer 73, an active layer 74, a guide layer 75, and a p-type cladding layer 76. The first p-type semiconductor layer 77, the second p-type semiconductor layer 78, the p-type superlattice layer 79, and the p-side contact layer 80 are stacked in this order from the second substrate 31 side. Yes. Each of these layers includes, for example, at least one of 2A or 2B group element group in the short period type periodic table made of zinc (Zn), cadmium (Cd), mercury (Hg), beryllium (Be), and magnesium (Mg). It is comprised by the II-VI group compound semiconductor containing a seed | species and at least 1 sort (s) of the 6B group element group in the short period type | mold periodic table which consists of sulfur (S), selenium (Se), and tellurium (Te).
[0070]
Specifically, the buffer layer 71 includes, for example, an n-type GaAs film to which silicon is added as an n-type impurity, a ZnSe film to which chlorine (Cl) is added as an n-type impurity, and chlorine as an n-type impurity. A ZnSSe mixed crystal film is formed in this order from the second substrate 31 side, and its thickness is, for example, 100 nm. For example, the n-type cladding layer 72 has a thickness of 1 μm and is composed of an n-type ZnMgSSe mixed crystal to which chlorine is added as an n-type impurity. The guide layer 73 has, for example, a thickness of 0.1 μm and is composed of an n-type ZnSSe mixed crystal to which chlorine is added as an n-type impurity or an undope-ZnSSe mixed crystal to which no impurity is added. For example, the active layer 74 has a thickness of 20 nm and has a different composition._xCd_1-xIt has a multiple quantum well structure of a well layer and a barrier layer each formed by a mixed crystal of Se (where x ≧ 0). The active layer 74 functions as a light emitting part.
[0071]
The guide layer 75 has, for example, a thickness of 0.1 μm and is composed of a p-type ZnSSe mixed crystal to which nitrogen is added as a p-type impurity or an undope-ZnSSe mixed crystal to which no impurity is added. The p-type cladding layer 76 has a thickness of, for example, 1.0 μm and is composed of a p-type ZnMgSSe mixed crystal to which nitrogen is added as a p-type impurity. The first p-type semiconductor layer 77 has a thickness of 0.2 μm, for example, and is composed of a p-type ZnSSe mixed crystal to which nitrogen is added as a p-type impurity. The second p-type semiconductor layer 78 has, for example, a thickness of 0.2 μm and is made of p-type ZnSe to which nitrogen is added as a p-type impurity. For example, the p-type superlattice layer 79 has a thickness of 35 nm, and a p-type ZnSe film to which nitrogen is added as a p-type impurity and a p-type ZnTe film to which nitrogen is added as a p-type impurity are alternately stacked. It is constituted by. For example, the p-side contact layer 80 has a thickness of 0.1 μm and is made of p-type ZnTe to which nitrogen is added as a p-type impurity.
[0072]
Note that a part of the first p-type semiconductor layer 77, the second p-type semiconductor layer 78, the p-type superlattice layer 79, and the p-side contact layer 80 are formed in a thin strip extending in the resonator direction. The current is constricted. Current block regions 81 are provided on both sides of the belt-like portion. Incidentally, the region of the active layer 74 corresponding to the p-side contact layer 80 is a light emitting region.
[0073]
On the opposite side of the p-side contact layer 80 from the p-type superlattice layer 79, a p-side electrode 82 is formed. For example, the p-side electrode 82 is formed by sequentially laminating palladium (Pd), platinum, and gold from the p-side contact layer 80 side and alloying them by heat treatment, and is electrically connected to the p-side contact layer 80. Has been. The p-side electrode 82 is also electrically connected to the wiring 13 through the adhesive layer 15.
[0074]
The light emitting device 10B having such a configuration is manufactured in the same manner as in the first embodiment, except that the second light emitting element 60 is formed instead of the second light emitting element 30 of the light emitting device 10A. Can do.
[0075]
That is, when the second light emitting element 60 is manufactured, first, as shown in FIG. 9A, the second substrate 31 made of, for example, n-type GaAs is used in the same manner as in the first embodiment. A buffer layer 51 made of n-type InGaP mixed crystal, an n-type cladding layer 52 made of n-type AlGaInP mixed crystal, and Al_xGa_yIn_1-xyAn active layer 53 made of a P (where x ≧ 0 and y ≧ 0) mixed crystal, a p-type cladding layer 54 made of p-type AlGaInP mixed crystal, and a p-type cap layer 55 made of p-type GaAs are successively grown.
[0076]
Next, as shown in FIG. 9B, silicon dioxide or silicon nitride (Si) is formed by, for example, CVD (Chemical Vapor Deposition) method on the p-type cap layer 55 corresponding to the region where the laser oscillation unit 50 is to be formed._ThreeN_Four) Mask M is formed. Subsequently, using this mask M, for example, etching such as RIE (Reactive Ion Etching) is performed to form a p-type cap layer 55, a p-type cladding layer 54, an active layer 53, and an n-type cladding layer. 52 and the buffer layer 51 are selectively removed.
[0077]
Subsequently, as shown in FIG. 10A, an n-type GaAs film, an n-type ZnSe film, and an n-type ZnSSe are formed on the surface of the second substrate 31 by, for example, MBE (Molecular Beam Epitaxy) method. A buffer layer 71 in which mixed crystal films are stacked in this order, an n-type cladding layer 72 made of an n-type ZnMgSSe mixed crystal, a guide layer 73 made of an n-type ZnSSe mixed crystal, Zn_xSe_1-xAn active layer 74 made of Cd (where x ≧ 0) mixed crystal, a guide layer 75 made of p-type ZnSSe mixed crystal, a p-type cladding layer 76 made of p-type ZnMgSSe mixed crystal, and a first made of p-type ZnSSe mixed crystal. p-type semiconductor layer 77, second p-type semiconductor layer 78 made of p-type ZnSe, p-type superlattice layer 79 in which p-type ZnSe films and p-type ZnTe films are alternately stacked, and p-side made of p-type ZnTe The contact layer 80 is grown sequentially. When these layers are grown, the temperature of the second substrate 31 is adjusted to about 280 ° C., for example. After that, the mask M is removed.
[0078]
After removing the mask M, as shown in FIG. 10B, for example, a mask (not shown) having an opening corresponding to a region where the current block region 56 is to be formed is formed, and chlorine or the like is formed by ion implantation. N-type impurities are introduced to form a current blocking region 56. Further, a mask (not shown) having an opening provided on the entire surface corresponding to a region where the current block region 81 is to be formed is formed, and the p-side contact layer 80, the p-type superlattice layer 79, the second p-type semiconductor layer 78, and An n-type impurity such as chlorine is introduced into the upper layer portion of the first p-type semiconductor layer 77 by ion implantation to form a current blocking region 81. Here, as in the first embodiment, since the lithography technique is used, the positions of the light emitting regions of the laser oscillation units 50 and 70 can be accurately defined.
[0079]
After forming the current blocking regions 56 and 81, as shown in FIG. 11, for example, titanium, platinum and gold are sequentially deposited on the surface of the p-type cap layer 55 and the vicinity thereof to form the p-side electrode 57. . Further, for example, palladium, platinum, and gold are sequentially deposited on the surface of the p-side contact layer 80 and in the vicinity thereof to form the p-side electrode 82. Subsequently, a mask (not shown) is formed corresponding to the region where the laser oscillation parts 50 and 70 are to be formed, and the layers from the p-side contact layer 80 to the buffer layer 71 are selectively removed.
[0080]
After selectively removing the p-side contact layer 80 to the buffer layer 71, the back surface side of the second substrate 31 is lapped and polished, for example, in the same manner as in the first embodiment, and the second substrate 31 An n-side electrode 33 is formed on the back side of the substrate. Subsequently, heat treatment is performed to alloy the p-side electrodes 57 and 82 and the n-side electrode 33, respectively. Finally, the second substrate 31 is cleaved with a predetermined width perpendicular to the length direction of the p-side electrodes 57 and 82, for example, and a pair of reflecting mirror films (not shown) are formed on the cleaved surfaces. Thereby, the 2nd light emitting element 60 is produced.
[0081]
As described above, according to the light emitting device 10B according to the present embodiment, the first light emitting element 20 capable of emitting light in the 400 nm band, the laser oscillation unit 70 capable of emitting light in the 500 nm band, and the light in the 700 nm band. Since the second light emitting element 60 having the laser oscillation unit 50 capable of emitting light is provided, light of three primary colors of red (Red = R), green (Green = G), and blue (Blue = B) is respectively provided. A light emitting device that emits light can be obtained. Therefore, the light emitting device 10B can be used as a light source for a full-color display device in addition to the optical disk device.
[0082]
In the case where the light emitting device 10B is used as a light source of a full color display device, the light emitted from each light emitting portion is desired by appropriately adjusting the composition of the material constituting each active layer 23, 53, 74. The hue can be as follows.
[0083]
FIG. 12 illustrates a schematic configuration of a display device 120 using the light emitting device 10B according to the present embodiment. The display device 120 includes an arrangement substrate 121 and a plurality of light emitting devices 10B according to the present embodiment provided on one surface side of the arrangement substrate 121. These light emitting devices 10B are housed in, for example, the package 1 as shown in FIG. 2, and are arranged in a matrix of M rows × N columns (where M and N are natural numbers). Although not shown in FIG. 12, common wirings 122 and 123 in the column direction and common wirings 124 and 125 in the row direction are formed on the arrangement substrate 121, respectively.
[0084]
FIG. 13 shows a schematic configuration of a drive circuit of the display device 120. Thus, the support base 11 of each light emitting device 10B is connected to the common wiring 122 in the column direction by the wire, and the n-side electrode 33 of the second light emitting element 60 is connected to the common wiring 123 in the column direction by the wire. ing. The wiring 13 is connected to the common wiring 124 in the row direction, and the n-side electrode 29 of the first light emitting element 20 is connected to the common wiring 125 in the column direction by a wire. These common wirings 122 to 125 are connected to a control unit (not shown), and a desired color display is performed according to a signal from the control unit.
[0085]
In the light emitting device 10B of the present embodiment, when a voltage is applied between the n-side electrode 33 and the p-side electrode 82 via the pins 4d and 4b of the package 1 (FIG. 2), the active layer 74 is activated. Current is injected, light is emitted by electron-hole recombination, and operates in the same manner as the light emitting device 10A of the first embodiment except that light having a wavelength of 500 nm band is emitted from the laser oscillation unit 70. .
[0086]
[Third Embodiment]
FIG. 14 shows a cross-sectional structure of a light emitting device 10C according to the third embodiment of the present invention. The light-emitting device 10C includes the first light-emitting element 90 instead of the first light-emitting element 20 in the light-emitting device 10A of the first embodiment, and the support base 17 instead of the support base 11. Except for this, the rest has the same configuration, operation and effect as the light emitting device 10A of the first embodiment. Therefore, the same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted here.
[0087]
The first light emitting element 90 is greatly different from the first light emitting element 20 in that the constituent material of the first substrate 91 is different. For example, the first light emitting element 90 is made of sapphire having a thickness of about 80 μm. In addition, sapphire is an insulating material and is a transparent material in the visible region like GaN. In addition, the first light emitting element 90 has, for example, the n-side contact layer 93, the n-type cladding layer 22, the active layer 23, and the deterioration preventing layer 24 on the c-plane of the first substrate 91 via the buffer layer 92, for example. The p-type cladding layer 25 and the p-side contact layer 26 are stacked in this order from the first substrate 21 side. An insulating layer 27 is formed on the surface of the p-type cladding layer and the side surface of the p-side contact layer 26, and a p-side electrode 28 is formed on the opposite side of the p-side contact layer 26 from the p-side cladding layer 25. Yes.
[0088]
The buffer layer 92 has a thickness of 30 nm, for example, and is made of undope-GaN to which no impurity is added or n-type GaN to which silicon is added as an n-type impurity. For example, the n-side contact layer 93 has a thickness of 5 μm and is made of n-type GaN to which silicon is added as an n-type impurity.
[0089]
The n-side contact layer 93 is partially provided with an exposed portion where the n-type cladding layer 22, the active layer 23, the deterioration preventing layer 24, the p-type cladding layer 25 and the p-side contact layer 26 are not formed. In this exposed portion, for example, an n-side electrode 94 is formed by sequentially laminating titanium and aluminum from the n-side contact layer 93 side and alloying them by heat treatment. In the present embodiment, the insulating film 27 is provided so as to cover the side surfaces of the p-type cladding layer 25, the degradation preventing layer 24, the active layer 23, and the cladding layer 22.
[0090]
The support base 17 is made of an insulating material having high thermal conductivity such as aluminum nitride (AlN). On one surface side of the support substrate 17, a metal wiring 17 a corresponding to the p-side electrode 28 of the first light emitting element 90 is provided, and a metal wiring 17 b corresponding to the n-side electrode 94 is provided. It has been. The p-side electrode 28 and the wiring 17a, and the n-side electrode 94 and the wiring 17b are bonded to each other through the adhesive layers 12 and 18, respectively.
[0091]
Note that the wiring 13 is provided on the opposite side of the first substrate 91 from the support base 17 as in the first embodiment, and the laser oscillation unit is substituted for the n-side electrode 29 in the first embodiment. A wiring 19 made of metal for connecting 50 to an external power source is provided.
[0092]
The light emitting device 10C is used by being housed in, for example, a package as in the first embodiment. In this package, a mounting table is provided on one surface side of the support, and the support base 17 is mounted on the mounting table. For example, five pins are provided, and each pin and each wiring 13, 17a, 17b are provided. , 19 and the n-side electrode 33 are electrically connected by wires. Also in this case, the number of pins can be set appropriately as in the first embodiment.
[0093]
The light emitting device 10C can be manufactured as follows.
[0094]
First, as shown in FIG. 15A, for example, a first substrate 91 made of sapphire having a thickness of about 400 μm is prepared, and an undope in which no impurity is added to the c-plane of the first substrate 91 by MOCVD. A buffer layer 92 made of -GaN or n-type GaN is grown. In that case, the temperature of the 1st board | substrate 91 shall be 500 degreeC, for example. Next, on the buffer layer 92, an n-side contact layer 93 made of n-type GaN, an n-type cladding layer 22 made of n-type AlGaN mixed crystal, an active layer 23 made of InGaN mixed crystal, and a deterioration made of p-type AlGaN mixed crystal. The prevention layer 24, the p-type cladding layer 25 made of p-type AlGaN mixed crystal, and the p-side contact layer 26 made of p-type GaN are sequentially grown. When growing these layers, the temperature of the first substrate 91 is adjusted to an appropriate temperature of 750 to 1100 ° C., for example.
[0095]
Subsequently, as shown in FIG. 15B, the p-side contact layer 26, the p-type cladding layer 25, the deterioration preventing layer 24, the active layer 23, and the n-type cladding layer 22 are sequentially etched to form an n-side contact layer. A part of 93 is exposed on the surface. After that, a mask (not shown) is formed, and the upper layer portion of the p-type cladding layer 25 and the p-side contact layer 26 are formed into a thin strip shape by using, for example, the RIE method.
[0096]
Next, an insulating layer 27 made of silicon dioxide is formed, for example, by vapor deposition on the side surface of each layer partially etched and the surface of the p-type cladding layer 25. After that, the back surface side of the first substrate 91 is lapped and polished, for example, so that the thickness of the first substrate 91 is about 100 μm, for example.
[0097]
After thinning the first substrate 91, wirings 13 and 19 are formed at predetermined positions on the opposite side of the first substrate 91 from the buffer layer 92, respectively. Here, as in the first embodiment, since the first substrate 91 is made of a transparent material in the visible region, the formation positions of the wirings 13 and 19 are accurately determined as in the first embodiment. Can be controlled.
[0098]
Subsequently, for example, nickel, platinum and gold are sequentially deposited on the surface of the p-side contact layer 26 and in the vicinity thereof to form the p-side electrode 28. Further, for example, titanium and aluminum are sequentially deposited on the surface of the n-side contact layer 93 to form the n-side electrode 94. Further, heat treatment is performed to alloy the p-side electrode 28 and the n-side electrode 94 with each other. After that, although not shown here, the first substrate 91 is cleaved with a predetermined width, for example, perpendicular to the length direction of the p-side electrode 28, and a pair of reflecting mirror films are formed on the cleaved surface. Thereby, the first light emitting element 90 is manufactured.
[0099]
Next, the second light emitting element 30 is manufactured in the same manner as in the first embodiment.
[0100]
After that, a support base 17 having wirings 17a and 17b formed on the surface is prepared, and the p-side electrode 28 of the first light emitting element 90 and the wiring 17a are bonded by the adhesive layer 12, and the n-side by the adhesive layer 18 The electrode 94 and the wiring 17b are bonded. The p-side electrode 46 and the wiring 13 of the second light emitting element 30 are attached by the adhesive layer 15, and the p-side electrode 57 and the wiring 19 are adhered by the adhesive layer 16. Thereby, the light emitting device 10C is completed.
[0101]
As described above, according to the light emitting device 10C according to the present embodiment, since the first substrate 91 is configured by sapphire that is transparent in the visible region, the first substrate 91 is similar to the first embodiment. The positions of the light emitting region of the light emitting element 90 and the light emitting region of the second light emitting element 30 can be accurately controlled.
[0102]
The present invention has been described with reference to the embodiment. However, the present invention is not limited to the above embodiment, and various modifications can be made. For example, in the above embodiment, the first light-emitting elements 20 and 90 and the second light-emitting elements 30 and 60 have been described with reference to an example of a specific laminated structure. , 90 or the second light-emitting elements 30 and 60 may have the same structure. For example, the first light emitting element may be configured to be current confined by the current blocking region in the same manner as the second light emitting elements 30 and 86, and the second light emitting element may be oxidized as in the first light emitting elements 20 and 90. The current may be confined by an insulating layer made of silicon or the like. In the above embodiment, a ridge waveguide type semiconductor laser combining a gain waveguide type and a refractive index waveguide type has been described as an example. However, a gain waveguide type semiconductor laser and a refractive index waveguide type are described. The same can be applied to the semiconductor laser of FIG.
[0103]
Furthermore, in the above embodiment, the case where each layer made of a GaN-based, AlGaAs-based, and AlGaInP-based compound is formed by MOCVD is described. However, by other vapor deposition such as MBE or hydride vapor deposition. You may make it form. The hydride vapor deposition method refers to a vapor deposition method in which halogen contributes to transport or reaction. In the second embodiment, the case where each layer made of a ZnSe-based compound is formed by the MBE method has been described. However, it may be formed by another vapor phase growth method such as an MOCVD method.
[0104]
In addition, in the said embodiment, although the specific example was given and demonstrated about the material which comprises the 1st board | substrates 21 and 91 of the 1st light emitting element 20 and 90, you may make it comprise with another material. . However, it is preferable to use a transparent material in the visible region because the effect described in the above embodiment can be obtained, and a material having high thermal conductivity is more preferable. Examples of such a material include aluminum nitride or silicon carbide (SiC).
[0105]
Furthermore, in the third embodiment, the case where the second light emitting element 30 having the AlGaAs laser oscillation section 40 and the AlGaInP laser oscillation section 50 is provided has been described. The device described in the second embodiment (second light emitting element 60) may be provided.
[0106]
In addition, in the above-described embodiment, the case where the first light emitting elements 20 and 90 and the second light emitting elements 30 and 60 are configured to emit light having different wavelengths has been described. , 17, a plurality of first light emitting elements 20, 90 can be stacked on one surface side. Further, a plurality of light emitting elements having different characteristics or structures can be stacked. In that case, the emission wavelengths may be the same or different. When a plurality of light emitting elements having different characteristics are stacked, for example, a low output and a high output can be mixed.
[0107]
Furthermore, in the above embodiment, the case where the first light emitting elements 20 and 90 have one light emitting portion has been described. However, the first light emitting elements 20 and 90 may have a plurality of light emitting portions. Good. Specifically, like the second light emitting element 30, a plurality of laser oscillation units may be provided. In that case, the emission wavelengths of the laser oscillation units may be the same or different. Also, the characteristics or structure may be the same or different.
[0108]
Furthermore, in the above embodiment, the case where the second light emitting elements 30 and 60 have two laser oscillation parts has been described as an example, but the number of laser oscillation parts of the second light emitting element is one. There may be three or more. The emission wavelength, characteristics, and structure of each of these laser oscillation units may be the same or different.
[0109]
In addition, in the above embodiment, the case where the second light emitting elements 30 and 60 are so-called monolithic multi-wavelength lasers has been described. However, in the present invention, the second light emitting element is as shown in FIG. The present invention can also be applied to a so-called hybrid type multi-wavelength laser.
[0110]
Furthermore, in the above-described embodiment, the material constituting the support bases 11 and 17 has been described with specific examples. However, the material may be composed of other materials. However, a material having high thermal conductivity is preferable. For example, in the first and second embodiments, the support base 11 is made of metal. However, as in the third embodiment, the support base is made of an insulating material, and the support base 11 is formed thereon. Wiring may be provided.
[0111]
In addition, in the above-described embodiment, the support bases 11 and 17 are directly supported by the support body 2 when being housed in the package 1. Alternatively, the support bases 11 and 17 may be placed.
[0112]
Furthermore, in the above embodiment, the semiconductor laser is described as a specific example as the light emitting element. However, the present invention also relates to a light emitting device including other light emitting elements such as a light emitting diode (LED). Can be applied.
[0113]
【The invention's effect】
  As described above, the present inventionAccording to the method for manufacturing a light emitting device, since the first substrate of the first light emitting element is transparent in the visible region, the positions of the light emitting region of the first light emitting element and the light emitting region of the second light emitting element Is precisely controlled.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view illustrating a configuration of a light emitting device according to a first embodiment of the invention.
2 is a partially exploded perspective view showing a configuration of a package in which the light emitting device shown in FIG. 1 is housed. FIG.
3 is a cross-sectional view for explaining a method for manufacturing the light-emitting device shown in FIG. 1. FIG.
4 is a cross-sectional view for illustrating a manufacturing step subsequent to FIG. 3. FIG.
FIG. 5 is a cross-sectional view for illustrating a manufacturing step subsequent to FIG. 4;
6 is a cross-sectional view for illustrating a manufacturing step subsequent to FIG. 5. FIG.
7 is a block diagram showing an optical disc recording / reproducing apparatus using the light emitting device shown in FIG. 1. FIG.
FIG. 8 is a cross-sectional view illustrating a configuration of a light emitting device according to a second embodiment of the invention.
9 is a cross-sectional view for explaining a method for manufacturing the light-emitting device shown in FIG. 8. FIG.
10 is a cross-sectional view for explaining a manufacturing step subsequent to FIG. 9; FIG.
11 is a cross-sectional view for explaining a manufacturing step subsequent to FIG. 10; FIG.
12 is a plan view showing a schematic configuration of a display display using the light emitting device shown in FIG.
13 is a configuration diagram showing a main part of a drive circuit of the display device shown in FIG.
FIG. 14 is a cross-sectional view illustrating a configuration of a light emitting device according to a third embodiment of the invention.
15 is a cross-sectional view for explaining a method of manufacturing the light-emitting device shown in FIG.
FIG. 16 is a cross-sectional view illustrating a configuration example of a conventional light emitting device.
FIG. 17 is a cross-sectional view illustrating another configuration example of a conventional light emitting device.
FIG. 18 is a cross-sectional view illustrating still another configuration example of a conventional light emitting device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Package, 2 ... Support body, 3 ... Cover body, 4a-4d ... Pin, 5a-5d ... Insulation ring, 6b-6d ... Wire, 10A, 10B, 10C ... Light-emitting device, 11, 17 ... Support base | substrate, 12 , 15, 16, 18 ... adhesive layer, 14 ... insulating film, 13, 17a, 17b, 19 ... wiring, 20, 90 ... first light emitting element, 21, 91 ... first substrate, 22, 41, 52, 72: n-type cladding layer, 23, 42, 53, 74 ... active layer, 25, 43, 54, 76 ... p-type cladding layer, 26, 80 ... p-side contact layer, 27 ... insulating layer, 28, 46, 57 , 82 ... p-side electrode, 29, 33, 94 ... n-side electrode, 30, 60 ... second light emitting element, 31 ... second substrate, 32, 51, 71, 92 ... buffer layer, 40, 50, 70 ... Laser oscillator, 44, 55, 77 ... p-type cap layer, 45, 56, 1 ... current blocking regions, 93 ... n-side contact layer

Claims (1)

Thereby forming a first light emitting element on a surface of the first substrate transparent in insulating and visible region, over the first light-emitting element, one electrode and the other electrode of the first light emitting element Forming each first wiring on the back surface of the first substrate while observing the position of the one electrode from the first substrate side,
On the insulating support base on which two second wirings are formed, the first light-emitting element on which the first wiring is formed, the one electrode and the other electrode being the second wiring, respectively. Bonding to be electrically connected to,
A second light-emitting element formed on the surface of the second substrate after bonding the first light-emitting element to the support base, and having one electrode on the surface and the other electrode on the back surface of the second substrate And a step of adhering the first electrode to the first substrate so that the one electrode is electrically connected to the first wiring.

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