JP3923680B2

JP3923680B2 - Cooling device for semiconductor device for vehicle

Info

Publication number: JP3923680B2
Application number: JP19111399A
Authority: JP
Inventors: 英則宮本
Original assignee: Toshiba Corp
Current assignee: Toshiba Corp
Priority date: 1999-07-06
Filing date: 1999-07-06
Publication date: 2007-06-06
Anticipated expiration: 2019-07-06
Also published as: JP2001024124A

Description

【０００１】
【発明の属する技術分野】
本発明は、車両用の床下に取り付けられた半導体装置を冷却する車両用半導体装置の冷却装置に関する。
【０００２】
【従来の技術】
例えば、鉄道車両の床下には、鉄道車両の駆動用あるいは補助電源用の電力を供給するための半導体装置が取り付けられており、半導体装置から発生する熱を冷却装置により大気へ放散するようにしている。
【０００３】
図６は、従来の車両用半導体装置の冷却装置を車両の後部から見た説明図であり、図６（ａ）は車両の後部から見た平面図、図６（ｂ）は車両の後部から見た熱の流れの説明図である。図６（ａ）に示すように、冷却装置は、受熱板４、ヒートパイプ５、放熱フィン６からなる冷却器１で構成される。この冷却器１は後述するように複数個のものが列車の進行方向に並んで配置される。図６（ａ）では車両の後部から見た場合であるので、１個の冷却器１が示されている。
【０００４】
車両２の床下に設けられた半導体装置３からの熱は冷却器１の受熱板４で受熱され、ヒートパイプ５により受熱板４から放熱フィン６に熱輸送が行われる。複数枚の放熱フィン６は所定の間隔でヒートパイプ５に設置されている。この冷却器１は、それぞれの放熱フィン６が半導体装置３の取り付く受熱板４とヒートパイプ５とにより接続されたヒートパイプ式冷却器であり、冷却器１を車体側方側へ突出させて構成されている。
【０００５】
図６（ｂ）に示すように、半導体装置３内の半導体素子７で発生した熱は、図中の矢印方向に流れる。つまり、冷却器１の受熱板４を介してヒートパイプ５により各々の放熱フィン６に熱伝達されて、放熱フィン６から空気に熱を伝達し、この結果温度が高くなった空気を放散することで冷却を行う。
【０００６】
図７は、従来の車両用半導体装置の冷却装置を車両の側面側から見た説明図であり、図７（ａ）は平面図、図７（ｂ）は側面図である。図７（ａ）に示すように、冷却装置は、複数個の冷却器１ａ、１ｂ、１ｃを車両進行方向に並んで配置して構成されている。
【０００７】
従って、冷却装置の各々の冷却器１ａ、１ｂ、１ｃには、車両の走行によって図７（ｂ）に示すように走行風８が当たることになる。走行風８が各々の冷却器１ａ、１ｂ、１ｃの放熱フィン６ａ、６ｂ、６ｃを通過して行くと、各々の放熱フィン６ａ、６ｂ、６ｃからの放熱により、走行風８の温度は徐々に上昇して行く。この様な温度の上昇を、以後熱あおりと言う。走行風８の風速が低い時には熱あおりは大きくなる。
【０００８】
【発明が解決しようとする課題】
ところが、無風状態や自然冷却の条件で製作した冷却器１では、この熱あおりが大きくなると進行方向後段の冷却器１ｃの周囲温度が高くなり、半導体装置３の半導体素子７の温度は無風状態よりも高くなることがあり得る。この熱あおりを充分に考慮するには、冷却器１に、より熱性能の良いものを使うことが必要になり、小型化、軽量化、コストの面で不利になる。
【０００９】
このように、車両の走行風が低い時には、下流側の冷却器１ｂ、１ｃの放熱フィン６ｂ、６ｃは、上流側の熱あおりを受けるため、走行風８が放熱フイン６ｂ、６ｃ部分に流入しない様にするのが好ましい。一方、冷却風風速が大きい時には、熱あおりの値は小さくなり、放熱フィン６ｂの熱性能は向上するので、冷却性能は総合的には向上する。この観点からは走行風８を積極的に取り込むのが得策である。
【００１０】
従来の冷却装置では、走行風８の風速にあわせて走行風８を最適に利用する方策が不十分であり、走行風８で冷却することで機能する冷却装置であっても、車両の低速走行時には熱あおりにより却って逆効果になっている場合がある。
【００１１】
本発明の目的は、走行風の取り入れを最適とし冷却効率を高めた車両用半導体装置の冷却装置を得ることである。
【００１２】
【課題を解決するための手段】
請求項１の発明に係わる車両用半導体装置の冷却装置は、鉄道車両の床下に取付けられた半導体装置の側面に車両進行方向に沿って複数個の冷却器を並べて配置し、前記半導体装置からの熱を前記各々の冷却器の放熱フィンから放熱する車両用半導体装置の冷却装置において、前記鉄道車両が走行したとき前記複数個の冷却器のうち両端部の冷却器に対面する走行風を前記複数個の冷却器の放熱フィンの上方に集めて流すように前記複数個の冷却器の両端部の冷却器から傾斜した整風板を設けたことを特徴とする。
【００１３】
請求項１の発明に係わる車両用半導体装置の冷却装置では、複数個の冷却器のうちの両端部の冷却器に傾斜して設けられた整風板は、鉄道車両が走行したとき
複数個の冷却器のうち両端部の冷却器に対面する走行風を複数個の冷却器の放熱フィンの上方に集めて流す。また、複数個の各々の冷却器の放熱フィンで熱交換された冷却風は、放熱フィンの上方の走行風と合流して流れる。これにより、後段の冷却器の放熱フィンに前段の冷却器の放熱フィンで熱交換された冷却風が流れ込むことがなくなり、冷却効率が向上する。
【００１４】
請求項２の発明に係わる車両用半導体装置の冷却装置は、鉄道車両の床下に取付けられた半導体装置の側面に車両進行方向に沿って複数個の冷却器を並べて配置し、前記半導体装置からの熱を前記各々の冷却器の放熱フィンから放熱する車両用半導体装置の冷却装置において、前記鉄道車両が走行したとき前記複数個の冷却器のうち両端部の冷却器に対面する走行風を前記複数個の冷却器の放熱フィンの上方に集めて流すダクトと、前記ダクトに設けられ前記複数個の冷却器の放熱フィンで熱交換された冷却風を前記ダクト内に取り込むための開口部とを設けたことを特徴とする。
【００１５】
請求項２の発明に係わる車両用半導体装置の冷却装置では、ダクトは、鉄道車両が走行したとき複数個の冷却器のうち両端部の冷却器に対面する走行風を複数個の冷却器の放熱フィンの上方に集めて流す。また、複数個の各々の冷却器の放熱フィンで熱交換された冷却風は、開口部を通してダクト内に流れ込む。これにより、後段の冷却器の放熱フィンに前段の冷却器の放熱フィンで熱交換された冷却風が流れ込むことがなくなり、冷却効率が向上する。
【００１６】
請求項３の発明に係わる車両用半導体装置の冷却装置は、鉄道車両の床下に取付けられた半導体装置の側面に車両進行方向に沿って複数個の冷却器を並べて配置し、前記半導体装置からの熱を前記各々の冷却器の放熱フィンから放熱する車両用半導体装置の冷却装置において、前記鉄道車両が走行したとき走行風の大きさに応じた開度で開き前記複数個の冷却器の放熱フィンに走行風を流す扉を設けたことを特徴とする。
【００１７】
請求項３の発明に係わる車両用半導体装置の冷却装置では、鉄道車両が走行したとき、走行風の大きさに応じた開度で扉が開き、複数個の冷却器の放熱フィンに走行風を流す。走行風が大きいときには、その走行風を各々の冷却器の放熱フィンに流して熱あおりの値を小さくし、走行風が小さいときには走行風を各々の冷却器の放熱フィンに流すことを止めて熱あおりの発生を防ぐ。
【００１８】
【発明の実施の形態】
以下、本発明の実施の形態を説明する。図１は本発明の第１の実施の形態に係わる車両用半導体装置の冷却装置の斜視図である。冷却装置は複数個の冷却器１ａ、１ｂ、１ｃを車両進行方向に並べて配置されている。そして、車両の進行方向の前後端に位置する冷却器１ａ、１ｃの進行方向外側に、走行風８の流れの向きを調整する整風板９が取り付けられている。
【００１９】
図２は、本発明の第１の実施の形態に係わる車両用半導体装置の冷却装置を車両の側面側から見た説明図であり、図２（ａ）は平面図、図２（ｂ）は側面図である。
【００２０】
図２（ａ）に示すように、複数個の冷却器１ａ、１ｂ、１ｃは車両進行方向に並んで配置されており、並んで配置された複数個の冷却器１ａ、１ｂ、１ｃの放熱フィン６ａ、６ｂ、６ｃの車両進行方向外側、それぞれ整風板９が設けられている。この整風板９は、図２（ｂ）に示すように、両端部の冷却器１ａ、１ｃの放熱フィン６ａ、６ｃの上方に走行風８を流すように傾斜して取り付けられている。これにより、車両が走行したとき複数個の冷却器１ａ、１ｂ、１ｃの放熱フィン６ａ、６ｂ、６ｃの上方に走行風が流れる。
【００２１】
すなわち、車両が走行したとすると、走行風８の流れの向きを調整する整風板９により、走行風８が各々の冷却器１ａ、１ｂ、１ｃの放熱フィン６ａ、６ｂ、６ｃの上方に集められる。この集められた走行風８は、放熱フィン６ａ、６ｂ、６ｃの上部を流れる。そうすると放熱フィン６ａ、６ｂ、６ｃで熱交換された温度が高い空気は走行風８に引張られ、走行風８と合流して流れる。従って、放熱フィン６ａ、６ｂ、６ｃの下部より温度が低い新鮮な外気が取り入れられる。この作用は、走行風の強弱に拘わらず行われるので、上流側の放熱フィン６による熱あおりは発生しない。
【００２２】
この第１の実施の形態によれば、整風板９により走行風８を各々の冷却器１ａ、１ｂ、１ｃの上方に流し、各々の冷却器１ａ、１ｂ、１ｃの放熱フィン６ａ、６ｂ、６ｃに流さないので、上流側の放熱フィン６による熱あおり発生が防止でき冷却効率が向上する。
【００２３】
次に、本発明の第２の実施の形態を説明する。図３は本発明の第２の実施の形態に係わる車両用半導体装置の冷却装置の斜視図である。この第２の実施の形態は、図１に示した第１の実施の形態に対し、整風板９に代えて、車両が走行したとき複数個の冷却器１ａ、１ｂ、１ｃの上方に走行風８を流すダクト１０を設けたものであり、そのダクト１０には複数個の冷却器１ａ、１ｂ、１ｃで熱交換された冷却風をダクト１０内に取り込むための開口部１１が設けられている。この開口部１１は放熱フィン６ａ、６ｂ、６ｃの投影面積程度の大きさである。
【００２４】
図４は、本発明の第２の実施の形態に係わる車両用半導体装置の冷却装置を車両の側面側から見た一部切欠断面図である。図４に示すように、複数個の冷却器１ａ、１ｂ、１ｃは車両進行方向に並んで配置されており、並んで配置された複数個の冷却器１ａ、１ｂ、１ｃの放熱フィン６ａ、６ｂ、６ｃの上部にダクト１０が設けられている。このダクト１０の放熱フィン６ａ、６ｂ、６ｃ側には、開口部１１が設けられており、複数個の各々の冷却器１ａ、１ｂ、１ｃの放熱フィン６ａ、６ｂ、６ｃで熱交換された冷却風は、この開口部１１を通してダクト１０内に流れ込む。
【００２５】
このように、各々の放熱フィン１ａ、１ｂ、１ｃの上部を走行風８がより確実に通過できるので、放熱フィン１ａ、１ｂ、１ｃで熱交換を終えた温度が高い空気は走行風８に引張られ、走行風８と合流して流れる。従って、放熱フィン１ａ、１ｂ、１ｃには、その下部より温度が低い新鮮な外気が取り入れられる。従って、走行風８がダクト１０を流れることにより、より確実に冷却を行うことができる。これにより、後段の冷却器の放熱フィンに前段の冷却器の放熱フィンで熱交換された冷却風が流れ込むことがなくなり、冷却効率が向上する。
【００２６】
次に、本発明の第３の実施の形態を説明する。図５は、本発明の第３の実施の形態に係わる車両用半導体装置の冷却装置を車両の側面側から見た説明図であり、図５（ａ）は平面図、図５（ｂ）は側面図である。
【００２７】
この第３の実施の形態は、図１に示した第１の実施の形態に対し、整風板９に代えて、車両が走行したとき走行風の大きさに応じた開度で開く扉１２を設けたものであり、この扉１２の開閉により複数個の冷却器１ａ、１ｂ、１ｃの放熱フィン６ａ、６ｂ、６ｃに流す走行風を調整するようにしたものである。
【００２８】
図５（ａ）において、車両の進行方向の前後端に位置する放熱フィン６ａ、６ｂの外側に走行風８の大小に応じて開閉する扉１２が軸１３により開閉自在に取り付けられている。
【００２９】
すなわち、この扉１２は軸１３周りに自由に回転できるように支持されているので、走行風８の風速が高くなると、図５（ｂ）に示すように、扉１２が開き走行風８が放熱フィン６ａ、６ｂ、６ｃに当たるようになる。一方、走行風８の風速が低い時には扉１２はほとんど開かず、従って、放熱フィン６ａ、６ｂ、６ｃは自冷として作用する。上流側の放熱フィン６からの熱あおりもない。
【００３０】
図５（ｂ）に示すように、走行風８の風速が高く扉１２が開いているときは、放熱フィン６ａ、６ｂ、６ｃに当たる風速が高くなっているので、熱あおりより冷却器１ａ、１ｂ、１ｃの熱性能の向上が支配的である。その結果として、走行風８を遮蔽した時よりも熱性能は向上する。
【００３１】
このように、第３の実施の形態では、走行風８の取り入れが最適となるように扉１２で放熱フィン６ａ、６ｂ、６ｃに当たる風速を調整できるので、冷却効率を高めることができる。
【００３２】
【発明の効果】
以上述べたように、本発明によれば、前段の冷却器の放熱フィンによる熱あおりを防止できるので、冷却効率を高めることができる。また、冷却器の放熱フィンに走行風を取り入れる場合には、走行風による熱あおりの影響を小さくなるようにして走行風を取り入れるので、適正に冷却効率を高めることができる。このように、冷却性能が向上することで半導体装置の温度上昇が低減されて信頼性も向上し、冷却器の小型化を図ることができる。
【図面の簡単な説明】
【図１】図１は、本発明の第１の実施の形態に係わる車両用半導体装置の冷却装置の斜視図である。
【図２】図２は、本発明の第１の実施の形態に係わる車両用半導体装置の冷却装置を車両の側面側から見た説明図であり、図２（ａ）は平面図、図２（ｂ）は側面図である。
【図３】図３は、本発明の第２の実施の形態に係わる車両用半導体装置の冷却装置の斜視図である。
【図４】図４は、本発明の第２の実施の形態に係わる車両用半導体装置の冷却装置を車両の側面側から見た一部切欠断面図である。
【図５】図５は、本発明の第３の実施の形態に係わる車両用半導体装置の冷却装置を車両の側面側から見た説明図であり、図５（ａ）は平面図、図５（ｂ）は側面図である。
【図６】図６は、従来の車両用半導体装置の冷却装置を車両の後部から見た説明図であり、図６（ａ）は車両の後部から見た平面図、図６（ｂ）は車両の後部から見た熱の流れの説明図である。
【図７】図７は、従来の車両用半導体装置の冷却装置を車両の側面側から見た説明図であり、図７（ａ）は平面図、図７（ｂ）は側面図である。
【符号の説明】
１冷却器
２車両
３半導体装置
４受熱板
５ヒートパイプ
６放熱フィン
７半導体素子
８走行風
９整風板
１０ダクト
１１開口部
１２扉
１３軸[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a vehicular semiconductor device cooling apparatus for cooling a vehicular semiconductor device mounted under a vehicle floor.
[0002]
[Prior art]
For example, a semiconductor device for supplying electric power for driving or auxiliary power of a rail vehicle is attached under the floor of the rail vehicle, and heat generated from the semiconductor device is dissipated to the atmosphere by a cooling device. Yes.
[0003]
6A and 6B are explanatory views of a conventional cooling device for a semiconductor device for a vehicle as viewed from the rear part of the vehicle. FIG. 6A is a plan view as viewed from the rear part of the vehicle, and FIG. It is explanatory drawing of the flow of the seen heat. As shown in FIG. 6A, the cooling device includes a cooler 1 that includes a heat receiving plate 4, a heat pipe 5, and heat radiating fins 6. As will be described later, a plurality of the coolers 1 are arranged side by side in the traveling direction of the train. Since it is a case where it sees from the rear part of a vehicle in Fig.6 (a), the one cooler 1 is shown.
[0004]
Heat from the semiconductor device 3 provided under the floor of the vehicle 2 is received by the heat receiving plate 4 of the cooler 1, and heat is transferred from the heat receiving plate 4 to the radiation fins 6 by the heat pipe 5. The plurality of radiating fins 6 are installed on the heat pipe 5 at a predetermined interval. This cooler 1 is a heat pipe type cooler in which each heat radiation fin 6 is connected by a heat receiving plate 4 to which a semiconductor device 3 is attached and a heat pipe 5, and the cooler 1 is projected to the side of the vehicle body. Has been.
[0005]
As shown in FIG. 6B, the heat generated in the semiconductor element 7 in the semiconductor device 3 flows in the direction of the arrow in the figure. That is, heat is transferred to each radiating fin 6 by the heat pipe 5 through the heat receiving plate 4 of the cooler 1, and heat is transferred from the radiating fin 6 to the air, and as a result, the air whose temperature has been increased is dissipated. Cool down with.
[0006]
7A and 7B are explanatory views of a conventional cooling device for a semiconductor device for a vehicle as viewed from the side of the vehicle. FIG. 7A is a plan view and FIG. 7B is a side view. As shown to Fig.7 (a), the cooling device is comprised by arrange | positioning several cooler 1a, 1b, 1c along with a vehicle advancing direction.
[0007]
Accordingly, each cooler 1a, 1b, 1c of the cooling device is subjected to traveling wind 8 as shown in FIG. 7B by traveling of the vehicle. When the traveling wind 8 passes through the radiating fins 6a, 6b, 6c of the respective coolers 1a, 1b, 1c, the temperature of the traveling wind 8 gradually increases due to heat radiation from the radiating fins 6a, 6b, 6c. Going up. Such an increase in temperature is hereinafter referred to as a hot air. When the wind speed of the traveling wind 8 is low, the thermal tilt becomes large.
[0008]
[Problems to be solved by the invention]
However, in the cooler 1 manufactured under the condition of no wind or natural cooling, the ambient temperature of the cooler 1c at the rear stage in the traveling direction becomes higher as the thermal tilt increases, and the temperature of the semiconductor element 7 of the semiconductor device 3 is higher than that in the windless state. Can also be high. In order to fully consider this thermal tilt, it is necessary to use a cooler 1 with better thermal performance, which is disadvantageous in terms of size reduction, weight reduction, and cost.
[0009]
As described above, when the traveling wind of the vehicle is low, the radiating fins 6b and 6c of the coolers 1b and 1c on the downstream side receive the upstream side heat, so the traveling wind 8 does not flow into the radiating fins 6b and 6c. It is preferable to do so. On the other hand, when the cooling wind speed is high, the value of the thermal tilt is reduced, and the thermal performance of the radiating fin 6b is improved, so that the cooling performance is improved overall. From this point of view, it is a good idea to take in the traveling wind 8 positively.
[0010]
In the conventional cooling device, the method of optimally using the traveling wind 8 according to the wind speed of the traveling wind 8 is insufficient, and even if the cooling device functions by cooling with the traveling wind 8, the vehicle travels at low speed. Sometimes it is counterproductive due to hot air.
[0011]
An object of the present invention is to obtain a cooling device for a semiconductor device for a vehicle that optimizes intake of traveling wind and enhances cooling efficiency.
[0012]
[Means for Solving the Problems]
According to a first aspect of the present invention, there is provided a cooling device for a semiconductor device for a vehicle, wherein a plurality of coolers are arranged side by side along a vehicle traveling direction on a side surface of the semiconductor device attached under a floor of a railway vehicle. In the vehicular semiconductor device cooling apparatus that dissipates heat from the radiating fins of each of the coolers, when the railway vehicle travels, the plurality of traveling winds facing the coolers at both ends of the plurality of coolers An air conditioning plate inclined from the coolers at both ends of the plurality of coolers is provided so as to be collected and flowed above the radiating fins of the individual coolers.
[0013]
In the cooling device for a semiconductor device for a vehicle according to the first aspect of the present invention, the air conditioner plate provided to be inclined to the coolers at both ends of the plurality of coolers is provided when the railway vehicle travels.
The traveling airflow facing the coolers at both ends of the plurality of coolers is collected and flowed above the radiation fins of the plurality of coolers. Moreover, the cooling air heat-exchanged by the heat radiating fins of each of the plurality of coolers flows together with the traveling air above the heat radiating fins. As a result, the cooling air heat-exchanged by the radiating fins of the former stage cooler does not flow into the radiating fins of the latter stage cooler, and the cooling efficiency is improved.
[0014]
According to a second aspect of the present invention, there is provided a cooling device for a semiconductor device for a vehicle, wherein a plurality of coolers are arranged side by side along a vehicle traveling direction on a side surface of the semiconductor device attached to the bottom of a railway vehicle. In the vehicular semiconductor device cooling apparatus that dissipates heat from the radiating fins of each of the coolers, when the railway vehicle travels, the plurality of traveling winds facing the coolers at both ends of the plurality of coolers A duct that collects and flows above the heat dissipating fins of the individual coolers, and an opening that is provided in the duct and takes in the cooling air heat-exchanged by the heat dissipating fins of the plurality of coolers into the duct. It is characterized by that.
[0015]
In the cooling device for a semiconductor device for a vehicle according to the second aspect of the invention, the duct radiates the traveling wind facing the coolers at both ends of the plurality of coolers when the railway vehicle travels. Collect and flow over the fins. Moreover, the cooling air heat-exchanged by the radiation fins of each of the plurality of coolers flows into the duct through the opening. As a result, the cooling air heat-exchanged by the radiating fins of the former stage cooler does not flow into the radiating fins of the latter stage cooler, and the cooling efficiency is improved.
[0016]
According to a third aspect of the present invention, there is provided a cooling device for a semiconductor device for a vehicle, wherein a plurality of coolers are arranged side by side along a vehicle traveling direction on a side surface of the semiconductor device attached under the floor of a railway vehicle. In the vehicular semiconductor device cooling apparatus for radiating heat from the heat dissipating fins of each of the coolers, the heat dissipating fins of the plurality of coolers are opened at an opening degree corresponding to the magnitude of traveling wind when the railcar travels. It is characterized by providing a door for running wind.
[0017]
In the cooling apparatus for a semiconductor device for a vehicle according to the invention of claim 3, when the railway vehicle travels, the door is opened with an opening degree corresponding to the magnitude of the traveling wind, and the traveling wind is blown to the radiating fins of the plurality of coolers. Shed. When the running wind is large, the running wind is made to flow through the radiating fins of the respective coolers to reduce the value of the thermal tilt, and when the running wind is small, the running wind is stopped from flowing through the radiating fins of the respective coolers. Prevent the occurrence of tilt.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below. FIG. 1 is a perspective view of a cooling apparatus for a semiconductor device for a vehicle according to a first embodiment of the present invention. The cooling device is arranged by arranging a plurality of coolers 1a, 1b, 1c in the vehicle traveling direction. And the wind regulation board 9 which adjusts the direction of the flow of the driving | running | working wind 8 is attached to the outer side of the advancing direction of the cooler 1a, 1c located in the front-back end of the advancing direction of a vehicle.
[0019]
2A and 2B are explanatory views of the cooling device for a semiconductor device for a vehicle according to the first embodiment of the present invention as viewed from the side of the vehicle. FIG. 2A is a plan view and FIG. It is a side view.
[0020]
As shown in FIG. 2A, the plurality of coolers 1a, 1b, and 1c are arranged side by side in the vehicle traveling direction, and the radiating fins of the plurality of coolers 1a, 1b, and 1c arranged side by side. Air conditioning plates 9 are provided on the outer sides in the vehicle traveling direction of 6a, 6b, and 6c, respectively. As shown in FIG. 2 (b), the air conditioning plate 9 is attached so as to incline so that the traveling air 8 flows above the heat radiation fins 6a, 6c of the coolers 1a, 1c at both ends. Thereby, when the vehicle travels, the traveling wind flows above the radiation fins 6a, 6b, 6c of the plurality of coolers 1a, 1b, 1c.
[0021]
That is, when the vehicle travels, the traveling wind 8 is collected above the heat radiation fins 6a, 6b, 6c of the respective coolers 1a, 1b, 1c by the wind regulation plate 9 that adjusts the flow direction of the traveling wind 8. . The collected traveling wind 8 flows over the radiation fins 6a, 6b, 6c. If it does so, the air with the high temperature heat-exchanged by the radiation fin 6a, 6b, 6c will be pulled by the driving | running | working wind 8, and will merge with the driving | running | working wind 8, and will flow. Therefore, fresh outside air whose temperature is lower than that of the lower part of the radiation fins 6a, 6b, 6c is taken in. Since this action is performed regardless of the strength of the traveling wind, no thermal stagnation is generated by the radiating fins 6 on the upstream side.
[0022]
According to the first embodiment, the traveling wind 8 is caused to flow over the coolers 1a, 1b, and 1c by the air-conditioning plate 9, and the radiating fins 6a, 6b, and 6c of the coolers 1a, 1b, and 1c. Therefore, it is possible to prevent the occurrence of heat stagnation due to the upstream radiating fins 6 and to improve the cooling efficiency.
[0023]
Next, a second embodiment of the present invention will be described. FIG. 3 is a perspective view of a cooling device for a semiconductor device for a vehicle according to a second embodiment of the present invention. This second embodiment is different from the first embodiment shown in FIG. 1 in that, instead of the wind regulation plate 9, the traveling wind is above the coolers 1a, 1b, 1c when the vehicle travels. 8 is provided with an opening 11 through which the cooling air heat-exchanged by the plurality of coolers 1a, 1b, 1c is taken into the duct 10. . The opening 11 is about the size of the projected area of the radiation fins 6a, 6b, 6c.
[0024]
FIG. 4 is a partially cutaway cross-sectional view of a vehicular semiconductor device cooling device according to a second embodiment of the present invention as viewed from the side of the vehicle. As shown in FIG. 4, the plurality of coolers 1a, 1b, 1c are arranged side by side in the vehicle traveling direction, and the radiation fins 6a, 6b of the plurality of coolers 1a, 1b, 1c arranged side by side. , 6c is provided with a duct 10. Openings 11 are provided on the heat radiation fins 6a, 6b, 6c side of the duct 10, and the heat exchange is performed by the heat radiation fins 6a, 6b, 6c of the plurality of coolers 1a, 1b, 1c. The wind flows into the duct 10 through the opening 11.
[0025]
Thus, since the traveling wind 8 can pass through the upper portions of the radiation fins 1a, 1b, and 1c more reliably, the air having a high temperature after the heat exchange by the radiation fins 1a, 1b, and 1c is pulled to the traveling wind 8. And flows with the traveling wind 8. Therefore, fresh outside air whose temperature is lower than the lower part is taken into the radiation fins 1a, 1b, 1c. Accordingly, the traveling wind 8 flows through the duct 10, whereby cooling can be performed more reliably. As a result, the cooling air heat-exchanged by the radiating fins of the former stage cooler does not flow into the radiating fins of the latter stage cooler, and the cooling efficiency is improved.
[0026]
Next, a third embodiment of the present invention will be described. FIGS. 5A and 5B are explanatory views of a cooling device for a semiconductor device for a vehicle according to a third embodiment of the present invention as viewed from the side of the vehicle. FIG. 5A is a plan view and FIG. It is a side view.
[0027]
This third embodiment is different from the first embodiment shown in FIG. 1 in that a door 12 that opens at an opening degree corresponding to the magnitude of the traveling wind is used instead of the wind regulation plate 9 when the vehicle travels. The running wind that flows through the heat dissipating fins 6a, 6b, and 6c of the plurality of coolers 1a, 1b, and 1c is adjusted by opening and closing the door 12.
[0028]
In FIG. 5 (a), a door 12 that opens and closes according to the magnitude of the traveling wind 8 is attached to the outside of the radiation fins 6 a and 6 b positioned at the front and rear ends in the traveling direction of the vehicle by a shaft 13 so as to be freely opened and closed.
[0029]
That is, since the door 12 is supported so as to freely rotate around the shaft 13, when the wind speed of the traveling wind 8 increases, the door 12 opens and the traveling wind 8 dissipates heat as shown in FIG. It comes into contact with the fins 6a, 6b, 6c. On the other hand, when the wind speed of the traveling wind 8 is low, the door 12 is hardly opened, and thus the radiating fins 6a, 6b, 6c act as self-cooling. There is no heat from the radiating fin 6 on the upstream side.
[0030]
As shown in FIG. 5 (b), when the wind speed of the traveling wind 8 is high and the door 12 is open, the wind speed hitting the radiating fins 6a, 6b, 6c is high. The improvement in thermal performance of 1c is dominant. As a result, the thermal performance is improved as compared with when the traveling wind 8 is shielded.
[0031]
As described above, in the third embodiment, the wind speed hitting the heat radiation fins 6a, 6b, and 6c can be adjusted by the door 12 so as to optimize the intake of the traveling wind 8, so that the cooling efficiency can be increased.
[0032]
【The invention's effect】
As described above, according to the present invention, it is possible to prevent the thermal displacement caused by the heat dissipating fins of the cooler in the previous stage, and thus the cooling efficiency can be increased. Further, when the traveling wind is taken into the radiating fin of the cooler, the traveling wind is taken in such a manner that the influence of the thermal wind caused by the traveling wind is reduced, so that the cooling efficiency can be appropriately increased. Thus, the cooling performance is improved, so that the temperature rise of the semiconductor device is reduced, the reliability is improved, and the size of the cooler can be reduced.
[Brief description of the drawings]
FIG. 1 is a perspective view of a cooling device for a semiconductor device for a vehicle according to a first embodiment of the present invention.
2 is an explanatory view of a cooling device for a semiconductor device for a vehicle according to a first embodiment of the present invention as viewed from the side of the vehicle, FIG. 2 (a) is a plan view, FIG. (B) is a side view.
FIG. 3 is a perspective view of a cooling device for a semiconductor device for a vehicle according to a second embodiment of the present invention.
FIG. 4 is a partially cut cross-sectional view of a cooling device for a semiconductor device for a vehicle according to a second embodiment of the present invention as viewed from the side of the vehicle.
FIG. 5 is an explanatory view of a cooling device for a semiconductor device for a vehicle according to a third embodiment of the present invention as viewed from the side of the vehicle, FIG. 5 (a) is a plan view, FIG. (B) is a side view.
FIG. 6 is an explanatory view of a conventional cooling device for a semiconductor device for a vehicle as viewed from the rear part of the vehicle, FIG. 6 (a) is a plan view as viewed from the rear part of the vehicle, and FIG. It is explanatory drawing of the flow of the heat seen from the rear part of the vehicle.
7 is an explanatory view of a conventional cooling device for a semiconductor device for a vehicle as viewed from the side of the vehicle, FIG. 7 (a) is a plan view, and FIG. 7 (b) is a side view.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Cooler 2 Vehicle 3 Semiconductor device 4 Heat receiving plate 5 Heat pipe 6 Radiation fin 7 Semiconductor element 8 Running air 9 Air conditioning plate 10 Duct 11 Opening 12 Door 13 Axis

Claims

A semiconductor for a vehicle in which a plurality of coolers are arranged side by side along a vehicle traveling direction on a side surface of a semiconductor device mounted under a floor of a railway vehicle, and heat from the semiconductor device is radiated from a radiation fin of each cooler. in the cooling device of the apparatus, to flow collected running wind facing the cooler end portions of the plurality of coolers when the railway vehicle travels over the radiating fins of the plurality of coolers the A cooling device for a semiconductor device for a vehicle, comprising an air conditioning plate inclined from the coolers at both ends of the plurality of coolers .

A semiconductor for a vehicle in which a plurality of coolers are arranged side by side along a vehicle traveling direction on a side surface of a semiconductor device mounted under a floor of a railway vehicle, and heat from the semiconductor device is radiated from a radiation fin of each cooler. In the cooling device of the device,
A duct that collects and flows the running wind facing the coolers at both ends of the plurality of coolers when the railway vehicle travels, and is provided in the duct; A cooling device for a semiconductor device for a vehicle, comprising: an opening for taking in cooling air heat-exchanged by heat radiation fins of a plurality of coolers into the duct.

A semiconductor for a vehicle in which a plurality of coolers are arranged side by side along a vehicle traveling direction on a side surface of a semiconductor device mounted under a floor of a railway vehicle, and heat from the semiconductor device is radiated from a radiation fin of each cooler. An apparatus for cooling a vehicle, comprising: a door that opens at an opening degree corresponding to a magnitude of traveling wind when the railway vehicle travels, and that has a door that allows traveling wind to flow through fins of the plurality of coolers. Cooling device for semiconductor devices.