JP3917313B2 - Transfer jig for semiconductor manufacturing products - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor product transport jig used when transporting a flat semiconductor product such as a semiconductor wafer or a liquid crystal panel between manufacturing processes.
[0002]
[Prior art]
For example, in the manufacturing process of semiconductor wafers or liquid crystal panels (hereinafter collectively referred to as “semiconductor manufactured products”), various process treatments are performed, and one of them is the rotation of a semiconductor manufactured product. There is a step of forming a coating film on the surface with a viscous mucus in a state of being allowed to stand. When a semiconductor product is transported from such a coating film forming process to the next manufacturing process, a transport jig having the members shown in FIGS. 9 and 10 is used.
[0003]
FIG. 9 is an external perspective view showing an example of a conventional jig for transporting a semiconductor product, and FIG. 10 is an enlarged view showing an enlarged main part of the transport jig shown in FIG. As shown in the drawing, in the conventional transfer jig X, when the semiconductor wafer W having mucus (not shown) attached to the surface W1 is transferred between manufacturing processes while being kept horizontal, the outer peripheral portion W2 of the semiconductor wafer W is shown. The guide member 100 is provided to support and support at three locations. Each guide member 100 is fixed to a C-shaped arm member 110 so as to be equiangular with each other along the circumferential direction, and an inner peripheral portion X1 of the arm member 110 is opened to accommodate the semiconductor wafer W. ing. Further, as shown in FIG. 10, the contact surface 100 a of the guide member 100 in contact with the semiconductor wafer W is formed in a hypotenuse shape with a posture that advances toward the center side of the semiconductor wafer W as it goes downward. The contacted semiconductor wafer W can be detached from the guide member 100 upward. More specifically, the contact surface 100a of the guide member 100 is formed in an arc shape along the circumferential direction, and the outer peripheral portion W2 of the semiconductor wafer W is in line contact with the contact surface 100a. Each guide member 100 is integrated with an auxiliary member 120 that supports the lower surface of the semiconductor wafer W.
[0004]
That is, at the location where the semiconductor wafer W with mucus attached is delivered, the semiconductor wafer W in a posture seated on the guide member 100 is held horizontally, and the three pins 130 from below the inner peripheral portion X1 of the arm member 110 are held. Is pushed up. Then, when the tip 130a of each pin 130 comes into contact with the lower surface of the semiconductor wafer W, the semiconductor wafer W maintained in the horizontal posture is detached from the guide member 100 and lifted upward as it is. After that, the guide member 100 is removed together with the arm member 110, and the semiconductor wafer W is left in a state of being held at the tip 130a of the pin 130. Finally, the semiconductor wafer W is transferred to the next processing step by another transfer mechanism (not shown), and after the processing is finished, the semiconductor wafer W is placed on the tip 130a of the pin 130 again, and then the previous separation order is It is in a state of being seated on the guide member 100 in the reverse procedure. As described above, the semiconductor wafer W is transferred between the manufacturing steps by the transfer jig X.
[0005]
[Problems to be solved by the invention]
However, although the conventional semiconductor manufacturing product transport jig X can transport the semiconductor wafer W in a state where mucus is adhered, a highly viscous one may be used as such mucus. The mucus reaches the outer peripheral portion W2 of the semiconductor wafer W during transportation. In such a case, the mucus adhering to the outer peripheral portion W2 of the semiconductor wafer W contacts the guide member 100 when the semiconductor wafer W is detached from the guide member 100. Since the surface 100a sticks to the surface 100a in a string-like manner, there has been a problem that the separation fails. The reason why the highly viscous mucus sticks to the contact surface 100a of the guide member 100 is considered to be because the outer peripheral portion W2 of the semiconductor wafer W is in line contact with the contact surface 100a.
[0006]
The present invention has been conceived under the circumstances described above, and when a semiconductor product with mucus adhered is conveyed, the semiconductor product is reliably delivered without being affected by the viscosity of the mucus. It is an object of the present invention to provide a transfer jig for semiconductor manufactured products.
[0007]
DISCLOSURE OF THE INVENTION
In order to solve the above problems, the present invention takes the following technical means.
[0008]
That is, when the semiconductor product transport jig provided by the present invention transports between the manufacturing processes while keeping the flat plate semiconductor product with mucus adhering horizontally, the outer periphery of the semiconductor product is spread over various places. A jig for transporting a semiconductor product having a guide member for supporting and supporting, wherein the contact portion of the guide member that contacts the outer periphery of the semiconductor product has teeth that are alternately uneven along the outer periphery. A plurality of rows are formed, and the outer shape along the vertical direction of the teeth row is formed in a hypotenuse shape with a posture that advances toward the center of the semiconductor product and curves concavely as it goes downward. It is said.
[0009]
According to the semiconductor product transport jig provided by the present invention in which the above technical measures are taken, when transporting a semiconductor product with mucus adhering to the outer periphery, the contact between the outer periphery and the guide member The part is in contact with the mucus. In the contact portion of such a guide member, a plurality of tooth rows that are alternately uneven along the outer periphery are formed, so that the outer periphery of the semiconductor manufactured product is in a point contact state with the tooth row. As a result, the sticking force of the semiconductor product is weakened, and the semiconductor product can be lifted upward without difficulty and can be removed from the guide member without difficulty, and the semiconductor product can be reliably delivered without being affected by the viscosity of the mucus. .
[0010]
As a preferred embodiment, at the place where the semiconductor product is delivered between the manufacturing processes, the semiconductor product is placed on and removed from the guide member so that the semiconductor product can be seated on and removed from the guide member. It is possible to employ a configuration in which four or more pins that move up and down in abutment are provided.
[0011]
According to such a configuration, at the delivery location of the semiconductor product, the semiconductor product in a posture seated on the guide member is held horizontally, and four or more pins are pushed up from below. Then, the tip of each pin comes into contact with the lower surface of the semiconductor manufactured product, and the semiconductor manufactured product held in a horizontal posture is detached from the guide member and lifted upward as it is. At this time, depending on the number of four or more pins, the semiconductor manufactured product can be held in a more stable horizontal posture than in the case where the minimum required three pins are used, and the semiconductor manufactured product is detached from the guide member. Even afterward, it is possible to reliably deliver the semiconductor product.
[0012]
Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.
[0014]
FIG. 1 is an external perspective view showing an embodiment of a transport jig for a semiconductor manufactured product according to the present invention. FIG. 2 is an enlarged view showing an enlarged main part of the transport jig shown in FIG. 3 is a plan view showing the top surface of the main part shown in FIG. 2, and FIG. 4 is a cross-sectional view showing a cross section of the main part taken along the line II shown in FIG. In each drawing, only the part that is a feature of the present invention is clearly shown, and other well-known members are not shown.
[0015]
As shown in FIGS. 1 to 4, a transport jig A for a semiconductor product according to the present invention is provided separately from a guide member 10, an arm member 11, and an auxiliary member 12 that are integrated with each other. It is schematically configured to include four pins 13.
[0016]
A circular flat semiconductor wafer W is used as a semiconductor manufactured product to be transported between manufacturing steps. This semiconductor wafer W is obtained by spin-coating the surface W1 with mucus M (see FIG. 4) having a high viscosity of, for example, about 900 cP (centipoise) in order to form a coating film in a predetermined manufacturing process. Specifically, the mucus M is made of a photoresist for forming gold plating bumps, a solution for forming an SOG (spin on glass) film as an interlayer insulating film, or a polyimide resin for forming a passivation film. A solution. The semiconductor wafer W on which the mucus M has been spin-coated is washed with an unnecessary mucus M adhering to the outer peripheral portion W2 and the back surface portion with a rinsing solvent after the coating process. As shown in FIG. 4, a certain amount of mucus M remains in the outer peripheral portion W2 and the back surface portion. The transfer jig A is used when transferring the semiconductor wafer W from such a cleaning process to the next baking process or the like.
[0017]
The transport jig A includes a guide member 10 that supports and supports the outer peripheral portion W2 of the semiconductor wafer W at three locations when the semiconductor wafer W to which the mucus M adheres is transported between manufacturing processes while being kept horizontal. Each guide member 10 is fixed to a C-shaped arm member 11 so as to be equiangular with each other along the circumferential direction, and an inner peripheral portion A1 of the arm member 11 is opened to accommodate the semiconductor wafer W. ing. Such a guide member 10 is made of, for example, Teflon. In addition, a part of the arm member 11 has a large opening 11a so that a pin 13 (described later) can escape from a state where the pin 13 is positioned on the inner peripheral part A1 when the arm member 11 slides horizontally. Is provided. Such an arm member 11 can be slid horizontally through a drive mechanism or the like connected to a proximal end (not shown). Further, on the lower end side of each guide member 10, a preferred auxiliary member 12 extending to the inner peripheral portion A1 side is integrated, and the semiconductor is in a state where the lower surface is in contact with the tip protrusion 12a of the auxiliary member 12. A wafer W is placed. On the other hand, the pins 13 can be moved up and down along the vertical direction separately from the arm member 11 and the like, and each pin 13 is disposed at a fixed position at a location where the semiconductor wafer W is delivered. Further, the tip 13a of each pin 13 is made of, for example, Teflon or the like with the same height so as to be in contact with the lower surface of the semiconductor wafer W. Note that the number of pins 13 is not limited to four, and of course, the number of pins 13 may be more than that.
[0018]
Further, the main point will be described in detail. The contact portion of the guide member 10 in contact with the outer peripheral portion W2 of the semiconductor wafer W protrudes alternately along the arc shape of the outer peripheral portion W2, as well shown in FIGS. An arcuate tooth row portion 10a in which the portion 10aa and the concave portion 10ab are arranged is formed. The tip of the convex portion 10aa, which is the outermost portion along the vertical direction of the tooth row portion 10a, is curved slightly concavely in a posture that advances toward the center of the semiconductor wafer W as it goes downward as shown in FIG. The cross-sectional oblique side shape is formed. Thereby, the semiconductor wafer W in contact with each guide member 10 can be seated from above with respect to the tooth row portion 10a of each guide member 10, and can be detached upward. In the state where the semiconductor wafer W is in contact with each guide member 10, as shown in FIG. 3 and FIG. 4, the outer peripheral portion W2 of the semiconductor wafer W is in point contact with the tip of the convex portion 10aa of the tooth row portion 10a. It is said.
[0019]
Next, the operation of the conveying jig A having the above configuration will be described with reference to the drawings as appropriate.
[0020]
5 and 6 are explanatory views shown for explaining the operation of the transfer jig A. In each drawing, the operation state of the transfer jig A at the delivery position of the semiconductor wafer W is shown. .
[0021]
First, as shown in FIG. 1, the semiconductor wafer W seated on the guide member 10 is held horizontally at a location where the semiconductor wafer W with mucus M (not shown in FIG. 1) is delivered. In this state, the arm member 11 is transported upward from the tip 13a of the pin 13 by the sliding movement. At this time, on the lower surface side of the semiconductor wafer W, the four pins 13 are located facing four locations on the lower surface.
[0022]
After that, as shown in FIG. 5, the pins 13 are pushed up simultaneously from below the inner peripheral portion A1 of the arm member 11 in the stopped state. Then, the tip 13a of each pin 13 comes into contact with the lower surface of the semiconductor wafer W, so that the semiconductor wafer W maintained in the horizontal posture is detached from the guide member 10 and lifted up as it is.
[0023]
At this time, as shown in FIG. 4, the outer peripheral portion W <b> 2 of the semiconductor wafer W and the tooth row portion 10 a of the guide member 10 are in contact with each other through the mucus M. The disengagement operation is hindered. However, since the outer peripheral portion W2 and the dentition portion 10a are in a point contact state, and the mucus M is attached in a point-like manner at such a contact portion, the state where the adhesive force by the mucus M is in line contact, etc. The semiconductor wafer W is easily detached from the state in contact with the guide member 10 upward. Further, the semiconductor wafer W whose lower surface is held by the four pins 13 is held while maintaining a more stable horizontal posture as compared with a case where the minimum required three pins are used.
[0024]
Thereafter, as shown in FIG. 6, the arm member 11 slides back in the direction indicated by the white arrow in the figure, and the guide member 10 and the auxiliary member 12 are integrally removed from the lower surface of the semiconductor wafer W. It is. At this time, the arm member 11 is slid and moved without contacting each pin 13 in a fixed position through the opening 11a. If it does so, the semiconductor wafer W will be in the state left behind in the state hold | maintained at the front-end | tip 13a of each pin 13. FIG. From such a state, the semiconductor wafer W is finally transferred to the next baking step or the like by another transfer mechanism (not shown), and after the processing is finished, the semiconductor wafer W is placed on the tip 13a of the pin 13 again, and then the previous separation. The guide member 10 is placed in a state reverse to the order. By the series of operations of the transfer jig A as described above, the semiconductor wafer W is transferred smoothly and stably between the manufacturing steps.
[0025]
Therefore, according to the transport jig A having the above-described configuration and operation, when transporting the semiconductor wafer W with the mucus M attached to the outer peripheral portion W2, the outer peripheral portion W2 and the tooth row portion 10a of the guide member 10 are It is in a state of contact through the mucus M. In the tooth row portion 10a of such a guide member 10, convex portions 10aa and concave portions 10ab alternately formed in an arc shape are formed along the outer peripheral portion W2, so that the outer peripheral portion W2 of the semiconductor wafer W is at the tip of the convex portion 10aa. The sticking force of the mucus M in a point contact state is weakened, and the semiconductor wafer W can be released from the guide member 10 without difficulty so as to push up the semiconductor wafer W, and the semiconductor wafer is not affected by the viscosity of the mucus M. W can be reliably delivered.
[0026]
Furthermore, as another embodiment different from the above embodiment, conveyance jigs B and C as shown in FIG. 7 or FIG. 8 can be configured.
[0027]
FIG. 7 is a plan view showing another embodiment of the conveying jig according to the present invention. Briefly describing the conveying jig B according to the other embodiment, the difference between the conveying jig B and the conveying jig A according to the previous embodiment is that the guide member 20 is entirely along the arm member 21. It is in the point provided. In such a conveying jig B, the outer peripheral portion W2 of the semiconductor wafer W and the tooth row portion 20a of the guide member 20 are in contact with each other along the circumferential portion excluding the opening 21a of the arm member 21. Even in such a continuous contact state, the outer peripheral portion W2 and the dentition portion 20a are in a point contact state because the dentition portion 20a is uneven, and the conveyance treatment according to the previous embodiment is performed. The same effect as the tool A can be exhibited.
[0028]
FIG. 8 is a plan view showing still another embodiment of the conveying jig according to the present invention. Briefly describing the transfer jig C shown in this figure, the transfer jig C is different from the transfer jigs A and B according to the above-described embodiment, and a semiconductor product to be transferred is a rectangular flat liquid crystal panel. P. For this reason, the guide members 10 and 20 and the arm members 11 and 21 in the conveying jigs A and B are slightly different in terms of the external shapes. That is, the guide member 30 is formed in a shape along each side P1 to P4 of the liquid crystal panel P, and each guide member 30 is in contact with each side P1 to P4 to stably hold the liquid crystal panel P. The rectangular frame-type arm member 31 is integrated over each part of the four sides. Even in such a conveying jig C, the sides P1 to P4 of the liquid crystal panel P and the tooth row portion 30a of the guide member 30 are in a point contact state because the tooth row portion 30a is uneven. The same effects as those of the conveying jigs A and B according to the previous embodiment can be exhibited. The operation when the liquid crystal panel P is delivered using the transport jig C is slightly different from the case of the transport jig A. The liquid crystal panel P is lifted by a plurality of pins (not shown), and the liquid crystal panel is moved from the tips of these pins. After P is removed, the arm member 31 is slidable after the pin is lowered to below the arm member 31.
[0029]
In addition, the cross-sectional shape of the dentition portions 20 and 30 in the conveying jigs B and C is the same as the cross-sectional shape shown in FIG. 4, and therefore, in other embodiments, the previous embodiment It is clear that the same effect is exhibited.
[0030]
In each of the embodiments described above, the transport jigs A, B, and C for transporting the semiconductor wafer W or the liquid crystal panel P have been described. However, the semiconductor manufactured product to be transported is not limited to such. Needless to say, the present invention can be applied to other semiconductor manufactured products.
[Brief description of the drawings]
FIG. 1 is an external perspective view showing an embodiment of a transport jig for a semiconductor product according to the present invention.
FIG. 2 is an enlarged view showing an enlarged main part of the conveying jig shown in FIG. 1;
3 is a plan view showing an upper surface of a main part shown in FIG. 2. FIG.
4 is a cross-sectional view showing a cross section of a main part taken along line II shown in FIG. 1. FIG.
FIG. 5 is an explanatory view for explaining the operation of the conveying jig.
FIG. 6 is an explanatory view for explaining the operation of the conveying jig.
FIG. 7 is a plan view showing another embodiment of a conveying jig according to the present invention.
FIG. 8 is a plan view showing still another embodiment of a conveying jig according to the present invention.
FIG. 9 is an external perspective view showing an example of a conventional jig for transporting a semiconductor product.
10 is an enlarged view showing an enlarged main part of the conveying jig shown in FIG. 9;
[Explanation of symbols]
10, 20, 30 Guide members 10a, 20a, 30a Tooth row parts 11, 21, 31 Arm member 12 Auxiliary member 13 Pins A, B, C Transfer jig M Mucus W Semiconductor wafer (semiconductor manufactured product)
W2 outer periphery

Claims (2)

This is a semiconductor manufacturing product transport jig equipped with a guide member that supports the outer peripheral part of the semiconductor manufacturing product in various places when transporting between manufacturing processes while keeping the flat semiconductor product with mucus attached horizontally. And
In the contact portion of the guide member in contact with the outer peripheral portion of the semiconductor manufactured product, a plurality of tooth row portions that are alternately uneven along the outer peripheral portion are formed, and the outer shape along the vertical direction of the tooth row portion is A jig for transporting a semiconductor product, characterized in that the jig is formed in a hypotenuse shape that advances to the center side of the semiconductor product as it goes downward and is curved concavely .   In order to allow the semiconductor product to be seated and removed with respect to the guide member, the semiconductor product is moved up and down at locations where the semiconductor product is transferred between manufacturing processes. The semiconductor manufacturing product conveying jig according to claim 1, wherein four or more pins are provided.

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