JP3909354B2 - Resin composition - Google Patents

Resin composition Download PDF

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Publication number
JP3909354B2
JP3909354B2 JP2003049871A JP2003049871A JP3909354B2 JP 3909354 B2 JP3909354 B2 JP 3909354B2 JP 2003049871 A JP2003049871 A JP 2003049871A JP 2003049871 A JP2003049871 A JP 2003049871A JP 3909354 B2 JP3909354 B2 JP 3909354B2
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Japan
Prior art keywords
molecular weight
weight polyethylene
high molecular
resin composition
engineering plastic
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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JP2003049871A
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JP2004256707A (en
Inventor
稔 安達
盛一 稲田
淳 福島
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Cluster Technology Co Ltd
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Cluster Technology Co Ltd
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Description

【0001】
【発明の属する技術分野】
本発明は、表面の摩擦特性が高められた成形体を調製し得る樹脂組成物、および該組成物に由来する成形体に関する。
【0002】
【従来の技術】
表面の摩擦特性が高められた成形体が、摺動用部材をはじめとする各種用途に利用されている。このような成形体としては、金属基材表面にポリテトラフルオロエチレンなどのフッ素樹脂をコートした成形体、樹脂に潤滑性の粉末または繊維を混合して得られる成形体などが知られている。例えば、熱可塑性樹脂にグラファイト、二硫化モリブデンなどの粘度鉱物の粉末を混合して得られる成形体;エポキシ樹脂などの熱硬化性樹脂に炭素繊維やアラミド繊維などを混合して得られる摺動部材(特許文献1)などが利用されている。上記成形体のうち、フッ素樹脂をコートした成形体の場合には、フッ素樹脂は一般に溶剤に溶解しないため、該フッ素樹脂を基材表面に付与するには、焼き付け塗工などの工程を必要とする。そのため、金属基材以外の場合には適用できず、製造にあたっても複雑な工程を必要とする。上記潤滑性の粉末または繊維を有する成形体の場合には、成形体表面に粘度鉱物が露出して摩擦係数が低下するが、その程度は未だ不充分である。
【0003】
【特許文献1】
特開平11−130876号公報
【0004】
【発明が解決しようとする課題】
本発明は、上記従来の課題を解決し、その目的とするところは、摺動部材、精密部品などとして好適に利用される成形体を容易に形成し得る組成物、および該組成物由来の成形体を提供することにある。
【0005】
【課題を解決するための手段】
本発明の樹脂組成物は、エンジニアリングプラスチックと超高分子量ポリエチレンとを含有する。
【0006】
本発明の成形体は、エンジニアリングプラスチックを主成分とする基材の表面が、超高分子量ポリエチレンで被覆されている。
【0007】
好適な実施態様においては上記エンジニアリングプラスチックは、ポリエーテルイミド、ポリエーテルスルフォン、ポリエーテルエーテルケトン、およびポリサルフォンでなる群から選択される少なくとも1種である。
【0009】
【発明の実施の形態】
本発明の樹脂組成物に含有されるエンジニアリングプラスチックは、該組成物を用いて成形を行った際に、得られる成形体の本体(基材)部分を構成する材料であり、通常、当該分野でエンジニアリングプラスチックとして知られている樹脂が用いられる。このような樹脂としては、射出成形、押出成形などの成形が可能であり、後述の超高分子量ポリエチレンとの融点(もしくは軟化点)の差が50℃である樹脂が好ましく、100℃以上である樹脂がさらに好ましい。本発明の組成物に含有され得るエンジニアリングプラスチックとしては、ポリエーテルイミド(PEI)、ポリエーテルスルフォン(PES)、ポリエーテルエーテルケトン(PEEK)、およびポリサルフォン(PSF)が挙げられる。
【0010】
本発明の樹脂組成物には、超高分子量ポリエチレンが含有される。超高分子量ポリエチレンとは、粘度平均分子量が1,000,000を超えるポリエチレンである。その粘度平均分子量は好適には、2,000,000〜7,000,000である。
【0011】
この超高分子量ポリエチレンは、組成物全体の重量を基準として10重量%以下、好ましくは0.1〜5.0重量%、さらに好ましくは1.0〜3.0重量%の割合で含有される。この超高分子量ポリエチレンは、約130〜140℃、通常、約136℃の融点を有する。
【0012】
本発明の組成物には、必要に応じて充填剤、添加剤などが含有される。充填剤しては、カーボンファイバーなどが挙げられ、該充填剤が含有される場合には、組成物全体の40〜60重量%、好ましくは約50重量%の割合で含有される。添加剤としては、固体潤滑材、酸化防止剤などが挙げられ、該添加剤は、組成物全体の10重量%以下の割合で含有される。
【0013】
本発明の樹脂組成物を用いて成形体を製造するには、例えば、上記エンジニアリングプラスチック、超高分子量ポリエチレンおよび必要に応じて充填剤などの添加剤を通常の方法によりブレンドし、加熱・混練し、成形を行う。例えば、射出成形、押出成形などにより、所望の成形体が製造される。
【0014】
成形時の熱により、上記エンジニアリングプラスチックは溶融もしくは成形可能な程度にまで軟化し、上記超高分子量ポリエチレンは溶融する。形成された成形体表面には、上記超高分子量ポリエチレンによる薄膜が形成される。成形体内部には、上記超高分子量ポリエチレンが低い割合で存在するか、あるいは実質的に存在しない。上記超高分子量ポリエチレンでなる薄膜は、通常、5μm以下、好ましくは2μm以下である。このような薄膜を有する成形体は表面の摩擦係数が低いため、摺動を目的とする各種部材として好適である。例えば、シリンダーベース、ポールベースなどのビデオ用部品、各種軸受け、歯車などの低摩擦特性を必要とする部品に好適に用いられる。
【0015】
【実施例】
(実施例1)
ポリエーテルイミドを主成分とする複合材料であるエポクラスターAEI501(クラスターテクノロジー社製;重量平均分子量50,000〜60,000のポリエーテルイミド、カーボンファイバー、および粘土鉱物を含む)および超高分子量ポリエチレン(粘度平均分子量:3,500,000)5重量部を400℃で混練し、ペレットを得た。このペレットを用いて、400℃(金型温度170℃)で射出成形することにより、20mm×20mm×3mmの板状の試験片を得た。
【0016】
上記試験片を用い高炭素クロム軸受鋼(SUJ2)試験片(直径3/8インチの球)を1000回にわたり往復摺動させて、摩擦係数を測定した。摺動試験機としては、神鋼造機社製摩擦摩耗試験機を用いた。試験時の温度は22℃、荷重は1960mN、ストローク(振幅幅)は6mm、周波数は2.00Hz(1秒間の往復回数:2)であった。その結果を図1に示す。
【0017】
これとは別に、上記高炭素クロム軸受鋼(SUJ2)試験片の代わりにステンレス鋼(SUS304)試験片を用いて同様の試験を行った。その結果を図2に示す。
【0018】
図1および図2からこの試験片の摩擦係数はいずれも約0.16〜0.17程度であることがわかる。
【0019】
(比較例1)
超高分子量ポリエチレンを用いなかったこと以外は実施例1と同様に試験片を調製し、往復摺動試験を行った。高炭素クロム軸受鋼(SUJ2)試験片を用いた結果を図3に、ステンレス鋼(SUS304)試験片を用いた結果を図4に示す。
【0020】
図3および図4から、超高分子量ポリエチレンを用いない場合は、摩擦係数は0.40〜0.46程度であり、実施例1に比較して2.5倍以上高いことがわかる。
【0021】
【発明の効果】
本発明によれば、このように、表面が超高分子量ポリエチレンでコートされた成形体を容易に製造し得る樹脂組成物および該組成物由来の成形体が提供される。この成形体は、シリンダーベース、ポールベースなどのビデオ用部品、各種軸受け、歯車など低摩擦特性を必要とする部品に広く利用される。
【図面の簡単な説明】
【図1】 超高分子量ポリエチレンを用いた本発明の成形体の摺動試験を行った際における、摺動回数と摩擦係数との関係を示すグラフである。
【図2】 超高分子量ポリエチレンを用いた本発明の成形体の摺動試験を行った際における、摺動回数と摩擦係数との関係を示すグラフである。
【図3】 超高分子量ポリエチレンを用いずに得られた成形体の摺動試験を行った際における、摺動回数と摩擦係数との関係を示すグラフである。
【図4】 超高分子量ポリエチレンを用いずに得られた成形体の摺動試験を行った際における、摺動回数と摩擦係数との関係を示すグラフである。
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a resin composition capable of preparing a molded article having improved surface frictional properties, and a molded article derived from the composition.
[0002]
[Prior art]
Molded bodies with improved surface friction characteristics are used in various applications including sliding members. As such a molded body, a molded body in which a metal base surface is coated with a fluororesin such as polytetrafluoroethylene, and a molded body obtained by mixing a resin with a lubricating powder or fiber are known. For example, a molded product obtained by mixing a powder of viscosity mineral such as graphite or molybdenum disulfide with a thermoplastic resin; a sliding member obtained by mixing carbon fiber or aramid fiber with a thermosetting resin such as epoxy resin (Patent document 1) etc. are utilized. Among the above molded products, in the case of a molded product coated with a fluororesin, since the fluororesin is generally not dissolved in a solvent, a process such as baking coating is required to apply the fluororesin to the substrate surface. To do. Therefore, it cannot be applied to cases other than a metal substrate, and a complicated process is required for manufacturing. In the case of a molded body having the above-mentioned lubricating powder or fiber, the viscosity mineral is exposed on the surface of the molded body and the friction coefficient is lowered, but the degree is still insufficient.
[0003]
[Patent Document 1]
[Patent Document 1] Japanese Patent Laid-Open No. 11-130876
[Problems to be solved by the invention]
The present invention solves the above-described conventional problems, and the object thereof is a composition capable of easily forming a molded article suitably used as a sliding member, a precision part and the like, and a molding derived from the composition To provide a body.
[0005]
[Means for Solving the Problems]
The resin composition of the present invention contains engineering plastic and ultra high molecular weight polyethylene .
[0006]
In the molded article of the present invention, the surface of a base material mainly composed of engineering plastic is coated with ultrahigh molecular weight polyethylene .
[0007]
The above engineering plastics in the preferred embodiment, the polyetherimide, a port Riete Rusuru phone, at least one selected from the group consisting of polyetheretherketone and Po Risarufo down.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
The engineering plastic contained in the resin composition of the present invention is a material constituting the main body (base material) portion of a molded article obtained when molding is performed using the composition, Resins known as engineering plastics are used. Such a resin can be molded by injection molding, extrusion molding or the like, and is preferably a resin having a difference in melting point (or softening point) from ultra high molecular weight polyethylene described later of 50 ° C., which is 100 ° C. or higher. A resin is more preferable. The engineering plastics which may be included in the compositions of the present invention, polyetherimide (PEI), Po Riete Rusuru phone (PES), polyether ether ketone (PEEK), and port Risarufon (PSF) can be mentioned.
[0010]
The resin composition of the present invention, ultra-high molecular weight polyethylene is contained. Ultra high molecular weight polyethylene is polyethylene whose viscosity average molecular weight is greater than 1,000,000. The viscosity average molecular weight is preferably 2,000,000 to 7,000,000.
[0011]
This ultra high molecular weight polyethylene is contained in an amount of 10% by weight or less, preferably 0.1 to 5.0% by weight, more preferably 1.0 to 3.0% by weight, based on the weight of the entire composition. . This ultra high molecular weight polyethylene has a melting point of about 130-140 ° C, usually about 136 ° C.
[0012]
The composition of the present invention contains a filler, an additive and the like as necessary. Examples of the filler include carbon fiber. When the filler is contained, it is contained in a proportion of 40 to 60% by weight, preferably about 50% by weight of the whole composition. Examples of the additive include a solid lubricant and an antioxidant, and the additive is contained in a proportion of 10% by weight or less of the entire composition.
[0013]
In order to produce a molded body using the resin composition of the present invention, for example, the above-mentioned engineering plastic, ultra high molecular weight polyethylene and, if necessary, additives such as fillers are blended by a usual method, and heated and kneaded. Perform molding. For example, a desired molded body is manufactured by injection molding, extrusion molding, or the like.
[0014]
The engineering plastic is softened to the extent that it can be melted or molded by heat during molding, and the ultrahigh molecular weight polyethylene is melted. A thin film made of the ultra high molecular weight polyethylene is formed on the surface of the formed molded body. The ultra high molecular weight polyethylene is present in a low proportion or substantially absent in the molded body. The thin film made of ultra high molecular weight polyethylene is usually 5 μm or less, preferably 2 μm or less. Since the molded body having such a thin film has a low coefficient of friction on the surface, it is suitable as various members intended for sliding. For example, it is suitably used for video parts such as a cylinder base and a pole base, various bearings, gears and other parts that require low friction characteristics.
[0015]
【Example】
(Example 1)
Epocluster AEI501 (manufactured by Cluster Technology; including polyetherimide, carbon fiber, and clay mineral having a weight average molecular weight of 50,000 to 60,000) and ultrahigh molecular weight polyethylene which are composite materials mainly composed of polyetherimide (Viscosity average molecular weight: 3,500,000) 5 parts by weight were kneaded at 400 ° C. to obtain pellets. Using this pellet, a 20 mm × 20 mm × 3 mm plate-shaped test piece was obtained by injection molding at 400 ° C. (mold temperature: 170 ° C.).
[0016]
Using the above test piece, a high carbon chrome bearing steel (SUJ2) test piece (3/8 inch diameter sphere) was slid back and forth 1000 times to measure the friction coefficient. As the sliding tester, a friction and wear tester manufactured by Shinko Engineering Co., Ltd. was used. The temperature during the test was 22 ° C., the load was 1960 mN, the stroke (amplitude width) was 6 mm, and the frequency was 2.00 Hz (number of reciprocations per second: 2). The result is shown in FIG.
[0017]
Separately, a similar test was performed using a stainless steel (SUS304) test piece instead of the high carbon chromium bearing steel (SUJ2) test piece. The result is shown in FIG.
[0018]
It can be seen from FIGS. 1 and 2 that the friction coefficient of this test piece is about 0.16 to 0.17.
[0019]
(Comparative Example 1)
A test piece was prepared in the same manner as in Example 1 except that ultrahigh molecular weight polyethylene was not used, and a reciprocating sliding test was performed. FIG. 3 shows the results using the high carbon chromium bearing steel (SUJ2) test piece, and FIG. 4 shows the results using the stainless steel (SUS304) test piece.
[0020]
3 and 4, when ultra high molecular weight polyethylene is not used, the friction coefficient is about 0.40 to 0.46, which is 2.5 times higher than that of Example 1.
[0021]
【The invention's effect】
According to the present invention, a resin composition and a molded article derived from the composition that can easily produce a molded article whose surface is coated with ultrahigh molecular weight polyethylene are provided. This molded body is widely used for video parts such as a cylinder base and a pole base, various bearings, gears and other parts that require low friction characteristics.
[Brief description of the drawings]
[1] definitive when performing the sliding test of the molded article of the present invention had use ultra high molecular weight polyethylene is a graph showing the relationship between the number of sliding operations and the coefficient of friction.
[Figure 2] definitive when performing the sliding test of the molded article of the present invention had use ultra high molecular weight polyethylene is a graph showing the relationship between the number of sliding operations and the coefficient of friction.
FIG. 3 is a graph showing the relationship between the number of sliding times and the coefficient of friction when a sliding test is performed on a molded body obtained without using ultrahigh molecular weight polyethylene.
FIG. 4 is a graph showing the relationship between the number of sliding times and the friction coefficient when a sliding test is performed on a molded body obtained without using ultrahigh molecular weight polyethylene.

Claims (4)

エンジニアリングプラスチックと超高分子量ポリエチレンとを含有する樹脂組成物であって、
該エンジニアリングプラスチックが、ポリエーテルイミド、ポリエーテルスルフォン、ポリエーテルエーテルケトン、およびポリサルフォンでなる群から選択される少なくとも1種であり、そして
該エンジニアリングプラスチックと該超高分子量ポリエチレンとの融点の差が100℃以上である、樹脂組成物。
A resin composition containing engineering plastic and ultra-high molecular weight polyethylene ,
The engineering plastics, polyetherimide, polyethersulfone, polyether ether ketone, and at least one selected from the group consisting of polysulfone, and the difference in melting points of the engineering plastic and the ultra high molecular weight polyethylene 100 A resin composition that is at or above ° C.
前記エンジニアリングプラスチックが、ポリエーテルイミドである、請求項1に記載の樹脂組成物。  The resin composition according to claim 1, wherein the engineering plastic is a polyetherimide. エンジニアリングプラスチックを主成分とする基材の表面が、超高分子量ポリエチレンで被覆された成形体であって、
該エンジニアリングプラスチックが、ポリエーテルイミド、ポリエーテルスルフォン、ポリエーテルエーテルケトン、およびポリサルフォンでなる群から選択される少なくとも1種であり、そして
該エンジニアリングプラスチックと該超高分子量ポリエチレンとの融点の差が100℃以上である、成形体。
The surface of the base material mainly composed of engineering plastic is a molded body coated with ultra high molecular weight polyethylene ,
The engineering plastics, polyetherimide, polyethersulfone, polyether ether ketone, and at least one selected from the group consisting of polysulfone, and the difference in melting points of the engineering plastic and the ultra high molecular weight polyethylene 100 A molded body having a temperature of ℃ or higher.
前記エンジニアリングプラスチックが、ポリエーテルイミドである、請求項に記載の成形体。The molded article according to claim 3 , wherein the engineering plastic is polyetherimide.
JP2003049871A 2003-02-26 2003-02-26 Resin composition Expired - Fee Related JP3909354B2 (en)

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