JP3884626B2 - Substrate processing apparatus and maintenance method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate processing apparatus for performing processing using a processing liquid on various substrates such as a semiconductor wafer, a glass substrate for a liquid crystal display device, and a glass substrate for a plasma display panel (PDP), and maintenance thereof. Regarding the method.
[0002]
[Prior art]
In the manufacturing process of a semiconductor device or a liquid crystal display device, for example, there is a step of supplying a processing liquid to a substrate to be processed such as a semiconductor wafer or a glass substrate for a liquid crystal display device and cleaning or etching the surface of the substrate to be processed. included. In the substrate processing apparatus for performing such a process, the processing liquid is, for example, sprayed from a nozzle and supplied to the rotating substrate surface while being held by the holding means.
[0003]
The substrate processing apparatus has a processing chamber surrounded by partition walls, and the processing with the processing liquid is performed inside the processing chamber. Although most of the processing liquid after the processing of the substrate is configured to be recovered, the processing liquid sprayed from the nozzle rebounds on the surface of the substrate, so that part of the processing liquid leaves the recovery path. Scatter. However, due to the presence of the partition walls, such scattered processing liquid is not brought outside the processing chamber. The partition wall also serves to block the inside of the processing chamber from the outside atmosphere. For example, foreign substances such as external dust can be blocked, and the substrate can be processed in a clean environment.
[0004]
The partition wall is provided with an opening for performing maintenance work and the like inside the processing chamber. A cover that can be opened and closed is provided so as to cover the opening. The cover is detachably attached to the partition wall and may be removed from the partition wall and opened. Further, the cover is hinge-coupled to the partition wall and may be opened by rotating the hinge as a fulcrum. During the processing of the substrate, the opening is closed by the cover so that the processing liquid inside the processing chamber is not brought outside, and at the same time, foreign matter outside the processing chamber is prevented from entering the processing chamber. When performing the maintenance work, the cover can be opened, and the worker can work by putting his hand through the opening.
[0005]
[Problems to be solved by the invention]
However, such a substrate processing apparatus conventionally has only one cover. For this reason, after processing the substrate, the cover is in a state where the processing liquid adheres to the surface (inner surface) facing the inside of the processing chamber, and foreign matters such as dust adhere to the surface (outer surface) facing the outside of the processing chamber. It becomes.
When opening the cover in such a state during maintenance work, if the cover is moved to the outside of the processing chamber, the processing liquid adhering to the inner surface of the cover is taken out to the outside, for example, spilling on the floor. Further, when the cover is moved to the inside of the processing chamber during the maintenance work, there is a problem that the foreign matter attached to the outer surface of the cover is brought into the processing chamber during the maintenance work and contaminates the inside of the processing chamber.
[0006]
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a substrate processing apparatus in which processing liquid is not taken out of the processing chamber during maintenance.
Another object of the present invention is to provide a substrate processing apparatus in which foreign matter is not brought into the processing chamber during maintenance.
Still another object of the present invention is to provide a maintenance method for a substrate processing apparatus so that the processing liquid is not taken out of the processing chamber.
[0007]
Still another object of the present invention is to provide a maintenance method of a substrate processing apparatus so that foreign matter is not brought into the processing chamber.
[0008]
[Means for solving the problems and effects]
In order to achieve the above object, the invention described in claim 1 is a substrate for processing a substrate using a processing fluid inside a processing chamber (1) surrounded by partition walls (2a, 2b, 2c, 2d, 2e). A processing apparatus comprising an opening (5) formed in the partition wall for maintenance work inside the processing chamber, and an inner cover provided to cover the opening and facing the inside of the processing chamber and (6, 15), this is the inner cover is provided overlaid on the inner cover separately, and an outer cover (7, 16) facing the outside of the processing chamber, said inner cover, said bulkhead The processing chamber is provided in the partition so that a part of the inner cover overlaps with the surface on the processing chamber inner side of the processing chamber, or is rotatable to open to the processing chamber inner side. It is hinged to the inner surface and the outer cover The outer cover is provided so that a part of the outer cover overlaps the surface of the partition wall outside the processing chamber, or the processing is performed in the partition wall so that the partition can be rotated to open to the processing chamber exterior side. A substrate processing apparatus, wherein the substrate processing apparatus is hinge-coupled to a surface on the outdoor side .
[0009]
In addition, the alphanumeric characters in parentheses represent corresponding components in the embodiments described later. Hereinafter, this is the same in this section.
Each of the inner cover and the outer cover may be composed of a plurality of separated parts.
According to the present invention, the foreign matter outside the processing chamber adheres only to one surface of the outer cover facing the outside of the processing chamber. Further, since the other surface of the outer cover is covered with the inner cover, the processing liquid scattered in the processing chamber does not adhere to the substrate during processing. Therefore, when the outer cover is opened, the processing liquid is not taken out of the processing chamber by moving the outer cover to the outside of the processing chamber.
[0010]
The processing liquid scattered in the processing chamber adheres only to one surface of the inner cover facing the processing chamber. Further, since the other surface of the inner cover is covered with the outer cover, no foreign matter is attached thereto. Therefore, when the inner cover is opened, the foreign matter is not brought into the processing chamber by moving the inner cover into the processing chamber.
According to a second aspect of the present invention, the inner cover may be detachable from the partition wall and may be disposed in the processing chamber after removal.
[0011]
The inner cover can be removed while the inner cover is in the vicinity of the partition wall. The removed inner cover can be moved to the side to be separated from the opening. Therefore, even when the space for opening and closing the inner cover in the processing chamber is not wide, the inner cover can be opened and closed. The removed inner cover can be arranged in an appropriate space in the processing chamber to perform maintenance work in the processing chamber.
According to a third aspect of the present invention, the inner cover may be detachable from the partition wall and may be disposed outside the processing chamber after being removed.
[0012]
According to the present invention, the removed inner cover can be arranged outside the processing chamber when performing a large-scale maintenance work.
According to a fourth aspect of the present invention, the outer cover may be detachable from the partition wall, and may be disposed outside the processing chamber after being removed.
With such a configuration, the outer cover can be opened and closed even when the space for opening and closing the outer cover outside the processing chamber is not wide.
[0013]
The inner cover or the outer cover and the partition wall may be detachably fixed by being tightened with screws or bolts. Alternatively, the inner cover or the outer cover includes a locking member, the partition includes an engaging member, and the inner cover or the outer cover is attached to and detached from the partition by engaging the locking member with the engaging member. It may be fixed as possible .
[0014]
When the inner cover is hinged to the partition wall so that it can be rotated to open to the inside of the processing chamber , the inner cover can be opened without removing it from the partition wall. Can be opened and closed. If there is sufficient space for opening and closing the inner cover in the processing chamber, such a configuration can be adopted.
Upper Kigai cover, if you are hinged to the bulkhead so as to be rotated to open the process chamber outer side, the outer cover, so it is possible to open without removing from the partition wall, easily Can be opened and closed. If there is sufficient space for opening and closing the outer cover outside the processing chamber, such a configuration can be adopted.
[0015]
The inner cover or the outer cover and the partition may be detachable at the hinge portion.
The invention according to claim 5 is the maintenance method for a substrate processing apparatus according to any one of claims 1 to 4 , wherein the outer cover is moved away from the opening and moved outside the processing chamber. A substrate processing apparatus comprising: a step; a step of moving the inner cover away from the opening and moving the inner cover to the inside of the processing chamber; and a maintenance of the inside of the processing chamber from the opening. This is a maintenance method.
[0016]
By this maintenance method, an effect similar to that described as the effect of claim 1 can be obtained.
In the fifth aspect of the invention, “separate the outer cover / inner cover from the opening” means that the outer cover / inner cover is actually removed from the partition wall, and the outer cover is hinged. / Opening the inner cover. That is, it includes moving the outer cover / inner cover so that the opening closed by the outer cover / inner cover is opened.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a plan view schematically showing the overall configuration of a substrate processing apparatus according to an embodiment of the present invention.
This substrate processing apparatus supplies a processing liquid to the surface of a semiconductor wafer, which is an example of a substrate, and performs processing such as cleaning and etching of the wafer surface. The substrate processing apparatus includes a processing chamber 1 and a wafer processing unit 3 disposed therein. The processing chamber 1 is surrounded by five partition walls 2a to 2e on its side. The partition wall 2a and the partition wall 2d are arranged in parallel, and the partition wall 2b and the partition wall 2e are arranged in a direction orthogonal to these. The partition wall 2c is obliquely connected to the partition wall 2b and the partition wall 2d.
[0018]
A wafer transfer opening 4 is provided in the partition wall 2c. A wafer transfer robot (not shown) is disposed near the wafer transfer opening 4 and outside the processing chamber 1. With this wafer transfer robot, wafer transfer, that is, transfer of unprocessed wafers into the processing chamber 1 and transfer of processed wafers out of the processing chamber 1 are performed through the wafer transfer opening 4. Is called. The wafer transfer opening 4 is opened only during wafer transfer, and is closed during wafer processing.
[0019]
A nozzle N is provided in the vicinity of the wafer processing unit 3. The wafer carried into the processing chamber 1 is held and rotated in the wafer processing unit 3. In this state, a processing liquid is supplied from the nozzle N to the wafer surface, and processing such as cleaning and etching is performed. Although most of the processing liquid that has been processed on the wafer is collected, the processing liquid sprayed from the nozzle N rebounds on the wafer surface, so that part of the processing liquid leaves the recovery path. To the inside of the processing chamber 1.
[0020]
A rectangular maintenance opening 5 is provided in the partition wall 2e. The partition 2e is provided with an inner cover 6 and an outer cover 7 so as to cover the maintenance opening 5. The inner cover 6 includes a left cover 6a, a center cover 6b, and a right cover 6c, which are closely arranged. The center cover 6 b has a bowl-shaped overlapping portion 14. The overlapping portion 14 extends laterally from a position shifted toward the inside of the processing chamber 1 on both side edges of the central cover 6b, and partially overlaps the left cover 6a and the right cover 6c. The left cover 6a, the center cover 6b, and the right cover 6c are arranged so that the outer surfaces thereof are flush with the processing chamber 1. The inner cover 6 and the outer cover 7 are each slightly larger than the maintenance opening 5.
[0021]
With such a configuration, the processing liquid splashed inside the processing chamber 1 passes between the left cover 6a and the central cover 6b, between the central cover 6b and the right cover 6c, or between the inner cover 6 and the partition wall 2e. It is difficult to pass through the outside of the processing chamber 1. Further, foreign matters such as dust outside the processing chamber 1 are difficult to enter the processing chamber 1 through the space between the outer cover 7 and the partition wall 2e.
FIG. 2 is a longitudinal sectional view of the vicinity of the center cover 6b of the substrate processing apparatus shown in FIG. In FIG. 2, the outer cover 7 is not shown.
[0022]
An engagement groove 2g is formed at the lower side of the maintenance opening 5, and the engagement groove 2g is fitted to the lower edge of the center cover 6b. A recess 2 h is formed on the inner side of the processing chamber 1 at the upper side of the maintenance opening 5. The upper end edge of the center cover 6b is fitted with the recess 2h. That is, the central cover 6b and the partition wall 2e (surface on the inside of the processing chamber 1) partially overlap each other and are fixed by the screw 8 at that portion. The screw 8 can be tightened from the outside of the processing chamber 1. A box-shaped handle portion 9 projecting to the inside of the processing chamber 1 is provided at a portion near the upper end of the central cover 6b. You can have it. The left cover 6a and the right cover 6c have the same structure.
[0023]
FIG. 3 is an exploded perspective view of the substrate processing apparatus shown in FIG.
A plurality of screw holes 10 are formed around the maintenance opening 5 in the partition wall 2e. The outer cover 7 is provided with a through hole 11 at a position corresponding to the screw hole 10. The outer cover 7 is fixed to the partition wall 2e (surface on the outside of the processing chamber 1) by tightening the screw 12 into the screw hole 10 through the through hole 11. A U-shaped handle 13 is attached to the outside of the outer cover 7 in the vicinity of both side ends.
[0024]
Next, the maintenance procedure of the substrate processing apparatus will be described with reference to FIG.
First, all the screws 12 are removed, and the outer cover 7 is removed with the handle 13. The removed outer cover 7 is placed in a suitable place outside the processing chamber 1. Next, the screw 8 is removed, and the handle 9 of the center cover 6b is held and slightly pushed inside the processing chamber 1. As a result, the upper edge of the center cover 6b is disengaged from the recess 2h, and the upper portion thereof is slightly inclined toward the inside of the processing chamber 1. If the handle 9 is lifted up as it is, the lower part of the center cover 6b is disengaged from the engaging groove 2g of the partition wall 2e. The removed central cover 6 b is placed at an appropriate location in the processing chamber 1. For example, it can be placed against the partition wall 2a on the partition wall 2b side around the partition wall 2a. In a similar procedure, the left cover 6a and the right cover 6c are removed and placed in the processing chamber 1.
[0025]
Thereafter, necessary maintenance work is performed, and the inner cover 6 and the outer cover 7 are attached in the reverse order of the removal.
According to the substrate processing apparatus and the maintenance method thereof as described above, foreign matter outside the processing chamber 1 adheres only to one surface of the outer cover 7 facing the outside of the processing chamber 1. Further, since the other surface of the outer cover 7 is covered with the inner cover 6, the processing liquid scattered inside the processing chamber 1 during wafer processing does not adhere. Therefore, as described above, when the outer cover 7 is opened, the processing liquid is not taken out of the processing chamber 1 by moving the outer cover 7 to the outside of the processing chamber 1.
[0026]
The processing liquid scattered inside the processing chamber 1 adheres only to one surface of the inner cover 6 facing the processing chamber 1. Further, since the other surface of the inner cover 6 is covered with the outer cover 7, foreign matter outside the processing chamber 1 is not attached. Therefore, when the inner cover 6 is opened as described above, the foreign matter is not brought into the processing chamber 1 by moving the inner cover 6 into the processing chamber 1.
Inside the processing chamber 1 is a wafer processing unit 3 and the like, and the space available for opening and closing the inner cover 6 is limited. However, in the substrate processing apparatus of the present embodiment, the inner cover 6 can be attached to and detached from the partition wall 2e, so that the inner cover 6 can be opened and closed in a narrow space. Can be placed in place.
[0027]
When performing a large-scale maintenance, the removed inner cover 6 can be arranged outside the processing chamber 1.
FIG. 4 is a schematic plan view showing a configuration in the vicinity of an inner cover and an outer cover of a substrate processing apparatus according to another embodiment of the present invention. Parts having the same configuration as those of the substrate processing apparatus according to the embodiment shown in FIGS.
The inner cover 15 includes a left inner cover 15a and a right inner cover 15b. The left inner cover 15a and the right inner cover 15b are respectively coupled to the partition 2e (surface on the inside of the processing chamber 1) and the hinge 18 in the vicinity of both sides of the maintenance opening 5. The left inner cover 15 a and the right inner cover 15 b are rotatable around the central axis 17 of the hinge 18 so as to open inside the processing chamber 1. When the left inner cover 15a and the right inner cover 15b are closed, they are in close contact with each other. In order to maintain the closed state, the left inner cover 15a, the right inner cover 15b, and the partition 2e can be fixed with screws, magnets, or the like.
[0028]
Similarly, the outer cover 16 also includes a left outer cover 16a and a right outer cover 16b, which are coupled to the partition wall 2e (surface on the outside of the processing chamber 1) by a hinge 20. The left outer cover 16 a and the right outer cover 16 b are rotatable around the central axis 19 of the hinge 20 so as to open to the outside of the processing chamber 1.
When there is a sufficient space for rotating the inner cover 15 inside and outside the processing chamber 1, such a configuration can be adopted. In such a substrate processing apparatus, the inner cover 15 and the outer cover 16 do not need to be lifted and moved and can be easily opened and closed. Further, the inner cover 15 and the outer cover 16 may be configured to be detachable at the hinges 18 and 20. In that case, it is possible to freely select whether the inner cover 15 or the outer cover 16 is opened or closed by rotation or attachment / detachment.
[0029]
The coupling mode between the inner cover and the partition and the coupling mode between the outer cover and the partition can be selected independently. For example, the inner cover may be detachable from the partition wall with screws or the like, and the outer cover may be hinged to the partition wall. The inner cover may be hinged to the partition wall.
Furthermore, the substrate processing apparatus may be for processing a glass substrate for a liquid crystal display device, a glass substrate for a PDP (plasma display panel), or the like. In addition, various changes can be made within the scope of technical matters described in the claims.
[Brief description of the drawings]
FIG. 1 is a plan view showing a simplified overall configuration of a substrate processing apparatus according to an embodiment of the present invention.
2 is a longitudinal sectional view in the vicinity of a central cover of the substrate processing apparatus shown in FIG.
3 is an exploded perspective view of the substrate processing apparatus shown in FIG. 1. FIG.
FIG. 4 is a schematic plan view showing a configuration in the vicinity of an inner cover and an outer cover of a substrate processing apparatus according to another embodiment of the present invention.
[Explanation of symbols]
1 Processing chambers 2a, 2b, 2c, 2d, 2e Bulkhead 5 Maintenance openings 6, 15 Inner cover 7, 16 Outer cover 8, 12 Screw 10 Screw hole 18, 20 Hinge

Claims (5)

A substrate processing apparatus for processing a substrate using a processing fluid inside a processing chamber surrounded by a partition wall,
An opening formed in the partition wall for maintenance work inside the processing chamber;
An inner cover provided to cover the opening and facing the interior of the processing chamber;
The inner cover is provided separately from the inner cover, and is provided with an outer cover facing the outside of the processing chamber ,
The inner cover is provided so that a part of the inner cover overlaps the surface of the partition wall on the processing chamber inner side, or is rotatable so as to open to the processing chamber inner side. In addition, the partition wall is hinged to the processing chamber inner surface.
The outer cover is provided so that a part of the outer cover overlaps a surface of the partition wall on the outside of the processing chamber, or is rotatable so as to open to the outside of the processing chamber. A substrate processing apparatus, wherein the partition wall is hinged to a surface outside the processing chamber .   The substrate processing apparatus according to claim 1, wherein the inner cover is detachable from the partition wall, and can be disposed in the processing chamber after being removed.   The substrate processing apparatus according to claim 1, wherein the inner cover is detachable with respect to the partition wall and can be disposed outside the processing chamber after being removed.   4. The substrate processing apparatus according to claim 1, wherein the outer cover is detachable from the partition wall and can be disposed outside the processing chamber after being removed. A claims 1 to maintenance method of a substrate processing apparatus according to any one of 4, the step of moving the outside of the processing chamber apart the outer cover from the opening, the opening above the cover A maintenance method for a substrate processing apparatus, comprising: a step of moving the substrate away from the inside of the processing chamber; and a step of maintaining the inside of the processing chamber from the opening.

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