JP3876407B2 - Optical disk substrate molding method and optical disk substrate molding apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a molding apparatus of the molded side Ho及 beauty optical disk substrate of the optical disk substrate.
[0002]
[Prior art]
Conventionally, as disclosed in Japanese Patent Application Laid-Open No. 2000-117794 and as shown in FIG. 3, when the next shot is injected after the molding of the previous shot is completed and the molded body is taken out, The mold is moved in the mold clamping direction, and a mold clamping force is generated between the movable mold and the fixed mold (S1). Thereafter, the movable side mold is moved in the mold opening direction while injecting the resin material into the mold (S2) (S3). Then, the movable side mold is closed to the mold closing position to generate a clamping force, pressurize (S4), mold into a predetermined shape (S5), open the mold (S6), and take out (S7). ).
[0003]
Alternatively, as shown in FIG. 4, after a clamping force is generated between the movable mold and the fixed mold (S1), the movable mold is moved in the mold opening direction (S3), Thereafter, a method of performing injection (S2) of the resin material (the same as the example shown in FIG. 3 after (S4)) has been adopted.
[0004]
[Problems to be solved by the invention]
However, in the conventional method as described above, when the mold opening operation is performed while injecting the resin material, the flow width of the resin at the start of injection is narrow, so the resin fluidity is poor and the quality is deteriorated. there were.
[0005]
In addition, after moving the movable mold in the mold clamping direction and generating a mold clamping force between the movable mold and the fixed mold, performing mold opening causes a loss of time. There was a problem that the molding tact time became long.
[0006]
The present invention shows the above-mentioned solution to the problems of the prior art, by shortening the die opening and closing operation causes the improved flow of the resin material, molding side of an optical disc substrate which can shorten improved and tact quality Ho及 beauty An object is to provide a molding apparatus.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, the method for molding an optical disk substrate according to the present invention is such that a molding resin material is injected into a gap of a mold, and a mold clamping force is exerted by contact between the movable mold and the fixed mold. A method of forming an optical disk substrate that takes out and pressurizes a resin material and takes out an optical disk substrate that has been molded into a predetermined shape, wherein the molding start position of the movable mold when the optical disk substrate that has been molded in the previous shot is removed position and location, from the molding start position, the closed movable mold to a predetermined position where the mold clamping force is not generated, the resin material injection to from the injection halfway into the mold, the movable mold After the mold is closed to the mold closing position to generate a mold clamping force, pressurizing and molding, the process of taking out the optical disk substrate is repeatedly performed .
[0009]
Opening amount mold during resin material injection is, 0.01 mm or more, rather preferably be less 1.00 mm, the thickness of the optical disc substrate molding is 0.6 mm.
[0011]
Further, the molding device of an optical disk substrate of the present invention includes a mold clamping mechanism, the clamping position detecting means, and a mold clamping force detection means, the clamping force by the fixed mold and the movable mold is generated An apparatus for forming an optical disk substrate for carrying out the method for forming an optical disk substrate according to claim 1, wherein the optical disk substrate formed in the previous shot is taken out. The position of the movable mold at that time is set as the molding start position, and from the molding start position, the movable mold is closed to a predetermined position where no clamping force is generated, and the resin material is injected into the mold and is being injected. And a control device for controlling a series of repetitive operations for taking out the optical disk substrate after the movable side mold is closed to the mold closing position to generate a mold clamping force, pressurize and mold. .
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the invention will be described with reference to the drawings. In addition, in each figure, the same code | symbol is attached | subjected about the same component and detailed description is abbreviate | omitted.
[0013]
FIG. 1 shows a process flow diagram of a molding method according to an embodiment of the present invention. The position of the movable mold when the molded body molded by the previous shot is taken out (S7) is the molding start position. From the molding start position, first, the movable mold is closed to a position where no clamping force is generated. At this time, the mold is still open (S3). Injection is started at this mold opening position (S2), and during the injection, the movable side mold is closed to the mold closing position to generate a clamping force (S4), and molding is performed (S5).
[0014]
In this way, by moving the movable mold until the start of injection from the molded body take-out position to a predetermined position where no clamping force is generated without passing through the touch position, the time until the start of injection is reached. Loss can be reduced, and as a result, molding tact time can be shortened. In addition, since the time loss until the start of injection is reduced, the temperature drop on the mold surface can be reduced, and the transferability is improved.
[0015]
In addition, since the resin is injected in the mold open state, the flow width of the resin is widened, the flowability of the resin is improved, and the influence of the skin layer is reduced, so that the injection time is generally shortened. As a result, the tact time is shortened and the quality of the substrate, particularly the optical characteristics, is improved.
[0016]
Specifically, in the case of an optical disc, the influence of the skin layer can be reduced by increasing the flow width of the resin, and as a result, birefringence is reduced. The mold opening amount at the time of injection is an optical disk, especially in the case of a 0.6 mm thick molded body. If the mold opening amount is too large, the burr on the outer periphery after molding will increase, and a mold clamping force will be generated at the time of injection When the pressure is applied, the surface is already solidified and the transfer is deteriorated. Therefore, the birefringence is most improved when the mold opening amount is from 0.01 mm to 1.00 mm.
[0017]
The optical disk molded substrate obtained by the above method can achieve improved quality due to improved birefringence and improved transferability, improved yield due to improved quality, and improved production capacity due to shorter tact time.
[0018]
FIG. 2 shows a molding apparatus for performing the above-mentioned mold operation. 1 is a servo motor, 2 is a tie bar, 3 is a strain sensor, 4 is a belt, 5 is a crank mechanism, 6 is a toggle mechanism, and 7 is a mold opening / closing. An eject mechanism, 8 is a control device, 9 is a movable platen that holds the movable mold 10a, and 11 is a fixed platen that holds the fixed mold 10b.
[0019]
In the above configuration, the crank mechanism 5 is moved by the rotation of the servo motor 1 and the toggle mechanism 6 is bent so that the movable platen 9 is lowered and the movable mold 10a is opened.
[0020]
Therefore, the position of the movable mold when the molded body molded in the previous shot is taken out is set as a molding start position, and the movable mold 10a is closed from the molding start position to a predetermined position where no clamping force is generated. Then, the resin material is injected into the mold, and the movable mold 10a is closed to the mold closing position from the middle of the injection to generate a clamping force, and pressurize and mold. After molding, the movable mold 10a is further opened and the molded body is taken out. This series of operations is performed according to a program preset in the control device 8. In this way, an optical disk molded body can be obtained.
[0021]
【The invention's effect】
As described above, according to the present invention, the molding start position is set to the position of the movable mold when the optical disk substrate molded in the previous shot is taken out, and injection is performed from this state. The mold opening / closing operation time can be shortened by expanding the flow width, improving the fluidity of the resin, reducing the influence of the skin layer, and repeating the molding or taking-out process . Thereby, improvement in quality and shortening of molding tact can be achieved.
[Brief description of the drawings]
FIG. 1 is a process flow diagram of a molding method in one embodiment of the present invention. FIG. 2 is a configuration diagram of a molding apparatus in one embodiment of the present invention. FIG. 3 is a process flow diagram of a conventional molding method. Process flow diagram of other conventional molding methods 【Explanation of symbols】
DESCRIPTION OF SYMBOLS 1 Servo motor 2 Tie bar 3 Strain sensor 4 Belt 5 Crank mechanism 6 Toggle mechanism 7 Mold opening / closing eject mechanism 8 Control device 9 Movable platen 10a Movable side die 10b Fixed side die 11 Fixed platen

Claims (4)

A molding resin material is injected into the cavity of the mold, a clamping force is generated by contact between the movable mold and the fixed mold, the resin material is pressurized, and the optical disk substrate molded into a predetermined shape is taken out. A method of forming an optical disk substrate ,
The position of the movable mold when removed optical disc substrate molded in the previous shot molding start position, and close the molding start position to a predetermined position where the mold clamping force is not generated the movable mold the resin material from the injection course and injected into the mold, said to generate a clamping force to close the movable mold to the mold closing position, pressure, after molding, repeating the step of taking out the optical disk substrate A method for forming an optical disk substrate, characterized in that: 2. The method for molding an optical disk substrate according to claim 1 , wherein a mold opening amount at the time of resin material injection is 0.01 mm or more and 1.00 mm or less . 3. The method of molding an optical disk substrate according to claim 2, wherein the thickness of the optical disk substrate to be molded is 0.6 mm . A configuration that includes a mold clamping mechanism, a mold clamping position detecting unit, and a mold clamping force detecting unit, and is capable of obtaining in advance a mold position where a mold clamping force is generated by the movable mold and the fixed mold. An optical disk substrate molding apparatus for carrying out the optical disk substrate molding method according to claim 1,
The position of the movable mold when the optical disk substrate molded in the previous shot is taken out is set as a molding start position, and the movable mold is closed from the molding start position to a predetermined position where no clamping force is generated. In the middle of the injection, the movable side mold is closed to the mold closing position to generate a clamping force, pressurize and mold, and then control a series of repeated operations to take out the optical disk substrate. An optical disk substrate molding apparatus comprising a control device .

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