JP3849991B2 - Hollow product molding method and apparatus therefor - Google Patents
Hollow product molding method and apparatus therefor Download PDFInfo
- Publication number
- JP3849991B2 JP3849991B2 JP27693496A JP27693496A JP3849991B2 JP 3849991 B2 JP3849991 B2 JP 3849991B2 JP 27693496 A JP27693496 A JP 27693496A JP 27693496 A JP27693496 A JP 27693496A JP 3849991 B2 JP3849991 B2 JP 3849991B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- fixed
- semi
- molded product
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
- B29C45/006—Joining parts moulded in separate cavities
- B29C45/0062—Joined by injection moulding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
- B29C45/006—Joining parts moulded in separate cavities
- B29C2045/0072—Joining parts moulded in separate cavities the parts to be joined being moulded in a stack mould
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
【0001】
【発明の属する技術分野】
本発明は、合成樹脂製の中空製品の成形法およびそのための装置に関し、特に詳述すれば、中金型を用いかつ成形用ノズルと接合用ノズルとを異にする成形法とそのための装置に関する。
【0002】
【従来の技術】
合成樹脂製の中空成形品を製造する方法は、ブロー成形や熱板溶着、振動溶着、超音波溶着、接着剤による接着等の2分割接合法が知られているが、射出成形のみで得る方法としては特開昭62−87315号公報に開示される。この例を、図6と図7に示すが、従来の中空成形方法は、スプルー2と雄型3と雌型4とを有するスライド金型5と、雄型6と雌型7とを有する可動金型8と、スプルー2に接続される射出シリング9とを備える構造である。半成形品の製造に際し、先ず、図6のように、両金型5、8を対向させ、射出シリンダ9を用い溶融樹脂をスプルー2とランナー10を介して成形空間に注入させ、半成形品を製造する。次いで、可動金型8を左方へ開き、さらにスライド金型5を上方へスライドさせた後、一方の雌型4を他方の雌型7に対向させ、半成形品の開口縁を対向させ、図7に示す状態を得る。同じ射出シリンダ9を用い、他方のスプルー2を介して、対向する半製品の縁まわりに接合用樹脂を注入し、中空最終製品11を得る。次に、両金型5、8を離し、中空最終製品11を両金型5、8から取り出す。
【0003】
【発明が解決しようとする課題】
前述した従来の中空品の成形手法は、半成形品を左右にずらした位置にて同時成形することから大きな型締力を必要とする(型締力は、型締め方向からみた半成形品の投影面積で決まることから、半成形品を左右にずらした配置(並列配置)は同一配置の配置(直列配置)にある場合に比べ、2倍以上の大きさが必要となる。)。
さらに、従来の成形手法は、成形用ノズルと接合用ノズルとを同一とさせているため、半成形品の接合に適した条件(成形樹脂温度、材料、シリンダサイズ等)での溶融樹脂の注入が不可能である欠点を有す。
【0004】
それ故に、本発明は、前述した従来技術の不具合を解消させることを解決すべき課題とする。
【0005】
【課題を解決するための手段】
本発明は、前述した課題を解決するために、固定金型と移動金型との間に中金型を配し、この中金型に成形用ホットランナーを設けるとともに、固定金型に接合用ランナーを設ける基本的技術手段を採用する。
この手段の採用は、中金型を介して、固定金型と移動金型に設けた空間に合成樹脂を射出させ得るので、型締力を従来の値より半減でき(但し、直圧式を用いる)、又、中金型を移動させ、移動金型を固定金型に合せ、固定金型の接合用専用ランナーを用い接合用樹脂を注入させることを可能とさせる。
【0006】
具体的には、本発明は、ホットランナーを有しかつ雄型となる中金型を対向する製品キャビティを有する雌型としての固定金型と移動金型との間に配し、中金型を介して溶融樹脂を製品キャビティに射出し、中金型を移動させかつ移動金型を固定金型に対接させ、固定金型を支持する固定盤側の接合用シリンダを、互いに向き合う半成形品の開口縁まわりに接合用樹脂を供給する流れ長さを略均等とするよう固定盤に当接させて、固定金型に設けた接合用ランナーに接続し、中空半成形品の開口縁まわりに接合用樹脂を注入することを特徴とする中空製品の成形法を提供する。
上記の構成により、半成形品は直列配置となり大きな型締力を必要としないものとなる。
【0007】
さらに、本発明は、接合用シリンダと協働しかつ半成形品用キャビティを有する固定金型と、直圧式型締装置と協働しかつ半成形品用キャビティを有する移動金型と、移動金型は固定金型に対し接近離反可能であり、さらに、成形用シリンダと協働しかつ両金型間に位置可能な中金型を備え、中金型のホットランナーを介して両キャビティに成形用シリンダを用い、溶融樹脂を射出させ、半成形品を作り、中金型を移動させ移動金型を固定金型に対し型締めし、固定金型を支持する固定盤側の接合用シリンダを、互いに向き合う半成形品の開口縁まわりに接合用樹脂を供給する流れ長さを略均等とするよう固定盤に当接させて、接合用ランナーに接続し、接合用樹脂を対向する半成形品の開口縁まわりに供給させる中空製品の成形装置を提供する。
上記の構成により、接合用シリンダと成形用シリンダを分けることで、半成形品に適した条件で溶融樹脂の注入が可能となる。その上、移動金型を中金型に近接させる速度と固定金型に近接させる速度を切替えることで、生産性の向上が図れる。
【0008】
【発明の実施の形態】
中空製品の成形装置21は、固定盤22に支持された固定金型23を有す。固定金型23は、半成形品のためのキャビティを有しかつ接合用シリンダ24と協働する接合用ランナー25を有す。
固定金型23と向い合い、固定金型23のキャビティと同心の半成形品のためのキャビティを有する移動金型26を、固定金型23に対し接近、離反可能に配す。移動金型26は直圧式の型締装置27からの型締力を受ける構造である。
【0009】
両金型23、26間に中金型28を配す。中金型28の両側面には向い合うキャビティに入るコア29、29を有し、その内部に設けたホットランナー30を成形用シリンダ31に接続可能とさせる。
【0010】
図1に示す関係に固定金型23、中金型28および移動金型26を配置させ、成形用シリンダ31を中金型28のホットランナー30を接続する。成形用シリンダ31を用い、ホットランナー30を介して、溶融樹脂をキャビティ内に射出させ、中空半成形品を作る。
該半成形品を射出成形した後、図2に示す如く、固定金型、移動金型の雌型へ成形品を保持したまま移動金型26への型締力を解放し、移動金型26を左方へずらし、中金型28を両金型23、26間から外し、次に、図3に示すように、移動金型26を固定金型23に密着させる。接合用シリンダ24を固定金型23のランナー25に接続し、互いに向き合う半成形品の開口縁まわりに接合用樹脂を供給させる。
【0011】
向い合う半成形品の接合作業終了後、図4に示す如く、移動金型26を左方へ大きくずらし、さらに、固定金型23を固定盤22から左方へと動かし、移動金型26に支持された中空成形品33を取除き、又、ランナー25内の固形品32を固定金型23から抜取り、これを除去し、図5の状態を作る。
【0012】
次いで、固定金型23をフレーム22に支持させ、中金型28を両金型23、26間に、再び、配置させる。中金型28を固定金型23に密着させ、さらに、この中金型28に移動させ、両者を定着させる。そして、図1の状態を得る。再び、前述した中空成形品33の成形作業をくり返す。
図2の状態から図3の状態への移動金型26のストロークと、図5の状態から図1の状態を得るための移動金型26のストロークとは異なるので、移動金型26のストロークとその移動速度をコンピュータを用い制御させる。
【0013】
型締めは直圧式のものとするが、キャビティを向い合せて半成形品を作るので、金型の型締力は従来に比し、小さな値のもので良い。
【図面の簡単な説明】
【図1】半成形品の成形状態を示す図である。
【図2】中金型を外した状態を示す図である。
【図3】半成形品の接合状態を示す図である。
【図4】中空成形品の取外しを示す図である。
【図5】中金型の再配置を示す図である。
【図6】従来の成形手段を示す図である。
【図7】従来の半成形品の接合状態を示す図である。
【符号の説明】
22 固定盤
23 固定金型
24 接合用シリンダ
25 接合用ランナー
26 移動金型
27 直圧式型締装置
28 中金型
30 ホットランナー
31 成形用シリンダ[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for molding a hollow product made of synthetic resin and an apparatus therefor, and more particularly, to a molding method using an intermediate mold and different molding nozzles and joining nozzles, and an apparatus therefor. .
[0002]
[Prior art]
As a method of manufacturing a hollow molded product made of a synthetic resin, a two-part joining method such as blow molding, hot plate welding, vibration welding, ultrasonic welding, adhesive bonding, etc. is known, but a method obtained by injection molding alone Is disclosed in Japanese Patent Application Laid-Open No. 62-87315. An example of this is shown in FIGS. 6 and 7, and the conventional hollow molding method is a movable mold having a
[0003]
[Problems to be solved by the invention]
The conventional molding method for hollow products described above requires a large mold clamping force because the half molded products are simultaneously molded at positions shifted to the left and right (the mold clamping force is the same as that of the half molded product viewed from the mold clamping direction). Since it is determined by the projected area, the arrangement in which the semi-molded products are shifted to the left and right (parallel arrangement) needs to be twice or more larger than that in the same arrangement (series arrangement).
Furthermore, the conventional molding method uses the same molding nozzle and joining nozzle, so molten resin injection under conditions suitable for joining semi-molded products (molding resin temperature, material, cylinder size, etc.) Has the disadvantage that is impossible.
[0004]
Therefore, this invention makes it the subject which should be solved to eliminate the malfunction of the prior art mentioned above.
[0005]
[Means for Solving the Problems]
In order to solve the above-described problems, the present invention provides a middle mold between a stationary mold and a movable mold, and provides a molding hot runner in the middle mold, and is used for joining to the stationary mold. Adopt basic technical means to provide runners.
By adopting this means, the synthetic resin can be injected into the space provided in the fixed mold and the movable mold through the middle mold, so that the mold clamping force can be halved from the conventional value (however, the direct pressure type is used). ) Also, the middle mold is moved, the movable mold is matched with the fixed mold, and the joining resin can be injected using the fixed runner for joining the fixed mold.
[0006]
Specifically, the present invention is disposed between the fixed mold and the moving mold as a female mold having a mold cavity that faces the middle mold to be having and male hot runner, middle mold The molten resin is injected into the product cavity via the intermediate mold, the middle mold is moved, the movable mold is brought into contact with the fixed mold, and the fixed cylinder side joining cylinders that support the fixed mold are half-molded facing each other. is brought into contact with the stationary platen to a substantially equal flow lengths for supplying adhesive resin to the opening edge around the goods, and connect to the bonding runner provided in the fixed mold, the opening edge around the hollow semi-molded article The present invention provides a method for forming a hollow product, characterized by injecting a bonding resin into the tube.
With the above configuration, the semi-molded products are arranged in series and do not require a large mold clamping force.
[0007]
Furthermore, the present invention relates to a stationary mold that cooperates with a joining cylinder and has a cavity for a semi-molded product, a movable mold that cooperates with a direct pressure type clamping device and has a cavity for a semi-molded product, and a movable mold. The mold can be moved close to and away from the fixed mold. In addition, it has a middle mold that can be positioned between both molds in cooperation with the molding cylinder, and molded into both cavities via the hot runner of the middle mold. Use a cylinder for injection, inject molten resin, make a semi-molded product, move the middle mold, clamp the moving mold against the fixed mold, and connect the fixed cylinder side joining cylinder that supports the fixed mold The semi-molded product is made to abut against the fixed runner so that the flow length for supplying the bonding resin around the opening edges of the semi-molded products facing each other is substantially uniform, and connected to the bonding runner, and the bonding resin is opposed to each other. A hollow product forming device to be supplied around the opening edge That.
By separating the joining cylinder and the molding cylinder with the above configuration, the molten resin can be injected under conditions suitable for the semi-molded product. In addition, productivity can be improved by switching the speed at which the moving mold is brought close to the middle mold and the speed at which the moving mold is brought closer to the fixed mold.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
The hollow product molding apparatus 21 has a
A moving
[0009]
A
[0010]
The fixed
After the semi-molded product is injection-molded, as shown in FIG. 2, the clamping force to the moving
[0011]
After the facing semi-molded product is joined, as shown in FIG. 4, the moving
[0012]
Next, the
The stroke of the moving
[0013]
Although the mold clamping is of the direct pressure type, the mold clamping force of the mold may be smaller than that of the conventional one because the semi-molded product is made by facing the cavity.
[Brief description of the drawings]
FIG. 1 is a diagram showing a molded state of a semi-molded product.
FIG. 2 is a view showing a state where a middle mold is removed.
FIG. 3 is a diagram showing a joined state of a semi-molded product.
FIG. 4 is a view showing removal of a hollow molded product.
FIG. 5 is a diagram showing rearrangement of the middle mold.
FIG. 6 is a view showing conventional molding means.
FIG. 7 is a view showing a joining state of a conventional semi-molded product.
[Explanation of symbols]
22 fixed
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27693496A JP3849991B2 (en) | 1996-09-30 | 1996-09-30 | Hollow product molding method and apparatus therefor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27693496A JP3849991B2 (en) | 1996-09-30 | 1996-09-30 | Hollow product molding method and apparatus therefor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH10100186A JPH10100186A (en) | 1998-04-21 |
JP3849991B2 true JP3849991B2 (en) | 2006-11-22 |
Family
ID=17576451
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27693496A Expired - Fee Related JP3849991B2 (en) | 1996-09-30 | 1996-09-30 | Hollow product molding method and apparatus therefor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3849991B2 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4484128B2 (en) * | 2000-10-13 | 2010-06-16 | 株式会社大嶋電機製作所 | Injection molding method and injection molding apparatus |
JP3778127B2 (en) * | 2002-05-10 | 2006-05-24 | 株式会社デンソー | Molding method and molding die for resin hollow product |
CN102688945A (en) * | 2012-06-20 | 2012-09-26 | 太仓市日精模具有限公司 | Step-style middle mold |
KR101656310B1 (en) * | 2015-09-01 | 2016-09-09 | 김재욱 | Manufacturing method of injection molding process mixed blow molding process |
-
1996
- 1996-09-30 JP JP27693496A patent/JP3849991B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH10100186A (en) | 1998-04-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0661789B2 (en) | Injection molding method and apparatus | |
JP3849991B2 (en) | Hollow product molding method and apparatus therefor | |
JPH10272656A (en) | Molding method of hollow article and device therefor | |
JP3566827B2 (en) | Hollow product molding method and apparatus therefor | |
JP3236887B2 (en) | Valve gate type mold equipment | |
JPH0426290B2 (en) | ||
JPH0374892B2 (en) | ||
JPS61121912A (en) | Highly efficient molding machine | |
JP3763768B2 (en) | Injection molding machine | |
JP2740916B2 (en) | Manufacturing method of frame plate | |
JPH07144356A (en) | Multicolor molding apparatus | |
JP3342088B2 (en) | Molding equipment | |
KR940008854A (en) | Clamping Device and Method of Injection Molding Assembly | |
JPH054986Y2 (en) | ||
JPH02151414A (en) | Cassette type mold | |
JP2000301570A (en) | Injection molding machine | |
JPH0667582B2 (en) | Injection molding method and injection molding apparatus | |
JPH03219932A (en) | Double injection molding method | |
JP2902539B2 (en) | Apparatus and method for manufacturing molded articles | |
JP2524293B2 (en) | Molding machine for hollow molded products | |
JP2002225090A (en) | Mold apparatus for injection-molding hollow article | |
JPH11333849A (en) | Mold device for molding multiple materials and method for molding multiple materials used therewith | |
JPH04286616A (en) | Method and mold for injection molding | |
JPH0346891Y2 (en) | ||
JPH08216239A (en) | Mold clamping device of molding machine |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20040512 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20040608 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040726 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20050712 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20050906 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20051012 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20051012 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20051019 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20051012 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20060823 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20060828 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100908 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110908 Year of fee payment: 5 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120908 Year of fee payment: 6 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130908 Year of fee payment: 7 |
|
LAPS | Cancellation because of no payment of annual fees |