JP3835472B2 - High frequency transmission line components - Google Patents

High frequency transmission line components Download PDF

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JP3835472B2
JP3835472B2 JP2004319201A JP2004319201A JP3835472B2 JP 3835472 B2 JP3835472 B2 JP 3835472B2 JP 2004319201 A JP2004319201 A JP 2004319201A JP 2004319201 A JP2004319201 A JP 2004319201A JP 3835472 B2 JP3835472 B2 JP 3835472B2
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transmission line
conductors
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frequency
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充英 加藤
尚樹 中山
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Murata Manufacturing Co Ltd
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Description

本発明は、高周波伝送線路部品、例えば遅延線路部品、高周波スイッチ部品、高周波フィルタ部品、又は分波フィルタ部品等の高周波伝送線路部品に関する。 The present invention, high-frequency transmission line components, such as delay line components, the high-frequency switch component, the high-frequency filter component, or to high-frequency transmission line component such as a branching filter parts.

従来より、例えば高周波伝送線路部品として、図１５に示すものが提案されている。この高周波伝送線路部品１５１は、一つの伝送線路導体からなる１本の伝送線路１５２を表面に設けた誘電体シート１５３と、グランド導体１５４を表面に設けた誘電体シート１５３と、保護用シート１５３等を積層したものである。伝送線路１５２を表面に設けた誘電体シート１５３は、グランド導体１５４を表面に設けた２枚の誘電体シート１５３の間に配設されている。従って、この高周波伝送線路部品１５１は、二つのグランド導体１５４の間に、所定の特性インピーダンスを有する１本の伝送線路１５２を１層で構成している。   Conventionally, for example, a high-frequency transmission line component shown in FIG. 15 has been proposed. The high-frequency transmission line component 151 includes a dielectric sheet 153 provided with one transmission line 152 made of one transmission line conductor on the surface, a dielectric sheet 153 provided with a ground conductor 154 on the surface, and a protective sheet 153. Etc. are laminated. The dielectric sheet 153 provided with the transmission line 152 on the surface is disposed between the two dielectric sheets 153 provided with the ground conductor 154 on the surface. Therefore, the high-frequency transmission line component 151 includes one transmission line 152 having a predetermined characteristic impedance in one layer between the two ground conductors 154.

しかしながら、従来の高周波伝送線路部品１５１は、二つのグランド導体１５４の間に伝送線路１５２を１層で構成するものであったため、一層当たりの伝送線路の長さが長くなり、部品サイズが大きくなるという問題があった。   However, since the conventional high-frequency transmission line component 151 comprises the transmission line 152 in a single layer between the two ground conductors 154, the length of the transmission line per layer is increased and the component size is increased. There was a problem.

また、外部からの電磁界ノイズから伝送線路１５２を遮蔽するため、二つのグランド導体１５４の間に伝送線路１５２を配設しているので、伝送線路１５２とグランド導体１５４との間に形成される浮遊容量の影響により、伝送線路１５２の特性インピーダンスが低くなる。従って、この高周波伝送線路部品１５１を、バイアス印加回路等の分岐線路として用いると、主線の挿入損失が大きく、帯域幅が狭くなるという問題があった。   Further, since the transmission line 152 is disposed between the two ground conductors 154 in order to shield the transmission line 152 from external electromagnetic field noise, it is formed between the transmission line 152 and the ground conductor 154. Due to the effect of stray capacitance, the characteristic impedance of the transmission line 152 is lowered. Therefore, when this high-frequency transmission line component 151 is used as a branch line such as a bias application circuit, there is a problem that the insertion loss of the main line is large and the bandwidth is narrowed.

なお、特許文献１には、積層された複数の誘電性基板のそれぞれに伝送線路導体を形成し、これらを伝搬する高周波信号の進行方向が相互に同方向になるように直列に接続して、一つもしくは複数の伝送線路を形成した電気回路が開示されている。   In Patent Document 1, a transmission line conductor is formed on each of a plurality of laminated dielectric substrates, and connected in series so that the traveling directions of the high-frequency signals propagating through these are the same direction, An electric circuit in which one or a plurality of transmission lines is formed is disclosed.

また、特許文献２には、伝送線路を構成する多層基板にダイオード・コンデンサ等の電気機能素子を設けた高周波スイッチが開示されている。
特表平８−５０８６１５号公報 特開平７−３１２５６８号公報 Patent Document 2 discloses a high-frequency switch in which an electric functional element such as a diode / capacitor is provided on a multilayer substrate constituting a transmission line.
Japanese National Patent Publication No. 8-508615 JP 7-31568 A

そこで、本発明の目的は、所定の特性インピーダンスを確保し、かつ、小型化が可能で周波数特性が優れている高周波伝送線路部品を提供することにある。 SUMMARY OF THE INVENTION An object of the present invention is to provide a high-frequency transmission line component that ensures a predetermined characteristic impedance, can be miniaturized, and has excellent frequency characteristics.

以上の目的を達成するため、本発明は、
複数の誘電体層と複数の伝送線路導体とを積層してなる高周波伝送線路部品において、
前記複数の伝送線路導体のうちの同一方向にスパイラル状に形成された二つの伝送線路導体が、前記複数の誘電体層のうちの一つの誘電体層の主面上に配置され、
前記複数の伝送線路導体のうちの他の一つの略Ｓ字状の伝送線路導体が、前記複数の誘電体層のうちの他の一つの誘電体層の主面上に配置され、
前記三つの伝送線路導体がビアホールを介して電気的に直列に接続され、１本の伝送線路を形成し、
前記三つの伝送線路導体のそれぞれを伝播する高周波信号の進行方向がそれぞれ互いに近接する部分で同方向であること、
を特徴とする。 In order to achieve the above object, the present invention provides:
In a high-frequency transmission line component formed by laminating a plurality of dielectric layers and a plurality of transmission line conductors ,
Two transmission line conductors formed in a spiral shape in the same direction among the plurality of transmission line conductors are disposed on the main surface of one dielectric layer of the plurality of dielectric layers,
Another substantially S-shaped transmission line conductor of the plurality of transmission line conductors is disposed on the main surface of the other dielectric layer of the plurality of dielectric layers,
The three transmission line conductors are electrically connected in series through via holes to form one transmission line,
The traveling direction of the high-frequency signal propagating through each of the three transmission line conductors is the same direction at a portion close to each other,
It is characterized by.

以上の説明で明らかなように、本発明によれば、伝送線路が複数層で構成されているので、特性インピーダンスが一定であれば、一層当たりの伝送線路導体の長さは、従来より短くてすむ。この結果、高周波伝送線路は、従来と比較して小さいサイズで所定の特性インピーダンスを確保することができる。   As is clear from the above description, according to the present invention, since the transmission line is composed of a plurality of layers, if the characteristic impedance is constant, the length of the transmission line conductor per layer is shorter than the conventional one. I'm sorry. As a result, the high-frequency transmission line can ensure a predetermined characteristic impedance with a smaller size than the conventional one.

また、積層方向に隣り合う二つの伝送線路導体のそれぞれの導体幅を異ならせておけば、伝送線路導体の積層ずれによる特性インピーダンスの変動を抑えることができる。   Also, if the conductor widths of the two transmission line conductors adjacent to each other in the stacking direction are made different, it is possible to suppress fluctuations in the characteristic impedance caused by the stacking deviation of the transmission line conductors.

さらに、三つの伝送線路導体のそれぞれを伝播する高周波信号の進行方向が相互に近接する部分で同方向であるため、伝送線路導体のそれぞれの周囲に発生する磁束の周回方向が同方向となる。その結果、伝送線路導体相互の間隔を近接させることにより、伝送線路導体間の結合を大きくすることができ、所望の特性インピーダンスを容易に得ることができる。 Furthermore, since the traveling directions of the high-frequency signals propagating through the three transmission line conductors are the same in the portions close to each other, the circulation directions of the magnetic flux generated around each of the transmission line conductors are the same. As a result, by bringing the transmission line conductors close to each other , the coupling between the transmission line conductors can be increased, and a desired characteristic impedance can be easily obtained.

従って、外部からの電磁界ノイズから伝送線路を遮蔽するため、二つのグランド導体の間に伝送線路を配設しても、伝送線路とグランド導体との間に形成される浮遊容量の影響による伝送線路の特性インピーダンスの低下を補償して、一定の特性インピーダンスを確保することができる。そして、この高周波伝送線路を、バイアス印加回路等の分岐線路として用いる場合には、主線の挿入損失の低下及び帯域幅縮小を抑えることができる。   Therefore, even if a transmission line is provided between two ground conductors in order to shield the transmission line from external electromagnetic field noise, transmission due to the effect of stray capacitance formed between the transmission line and the ground conductor It is possible to ensure a certain characteristic impedance by compensating for a decrease in the characteristic impedance of the line. When this high-frequency transmission line is used as a branch line for a bias application circuit or the like, it is possible to suppress a reduction in main line insertion loss and a reduction in bandwidth.

また、伝送線路において、伝送線路導体が積層方向に重なっている部分の線路長を短くすることで、伝送線路を伝播する高周波信号のうちで最も大きな結合が得られる高周波信号の周波数を高くすることができる。   Also, in the transmission line, by shortening the length of the part where the transmission line conductors overlap in the stacking direction, the frequency of the high-frequency signal that provides the largest coupling among the high-frequency signals propagating through the transmission line is increased. Can do.

以下、本発明に係る高周波伝送線路部品の実施例について添付図面を参照して説明する。 Embodiments of a high-frequency transmission line component according to the present invention will be described below with reference to the accompanying drawings.

［第１実施例、図１〜図３］
図１に示すように、高周波伝送線路部品１は、伝送線路導体２ａ，２ｂ及びビアホール６をそれぞれ設けた誘電体シート５と、グランド導体４を設けた誘電体シート５と、保護用誘電体シート５等にて構成されている。 [First embodiment, FIGS. 1 to 3]
As shown in FIG. 1, the high-frequency transmission line component 1 includes a dielectric sheet 5 provided with transmission line conductors 2a and 2b and a via hole 6, a dielectric sheet 5 provided with a ground conductor 4, and a protective dielectric sheet. 5 etc.

伝送線路導体２ａ，２ｂは、それぞれ大略ミアンダ形状をしており、伝送線路導体２ａの引出し部３ａはシート５の手前側の辺の左側部に露出し、伝送線路導体２ｂの引出し部３ｂはシート５の手前側の辺の右側部に露出している。さらに、伝送線路導体２ａ，２ｂは、引出し部３ａ，３ｂを残して、シート５を挟んで対向している。第１実施形態では、伝送線路導体２ａ，２ｂは積層方向に完全に重なり合うように配置されている（図３参照）。ただし、伝送線路導体２ａ，２ｂの配置は必ずしもこれに限るものではなく、例えば、導体幅の略半分が重なり合うように伝送線路導体２ａ，２ｂを配置してもよい。伝送線路導体２ａ，２ｂは、ビアホール６を介して電気的に直列に接続され、１本の伝送線路（例えば１／４波長の分布定数線路）２を形成する。   Each of the transmission line conductors 2a and 2b has a generally meander shape, the lead-out portion 3a of the transmission line conductor 2a is exposed on the left side of the front side of the sheet 5, and the lead-out portion 3b of the transmission line conductor 2b is a sheet. 5 is exposed on the right side of the side on the near side. Further, the transmission line conductors 2a and 2b are opposed to each other with the sheet 5 interposed therebetween, leaving the lead portions 3a and 3b. In the first embodiment, the transmission line conductors 2a and 2b are arranged so as to completely overlap in the stacking direction (see FIG. 3). However, the arrangement of the transmission line conductors 2a and 2b is not necessarily limited thereto. For example, the transmission line conductors 2a and 2b may be arranged so that approximately half of the conductor widths overlap. The transmission line conductors 2 a and 2 b are electrically connected in series via the via hole 6 to form one transmission line (for example, a 1/4 wavelength distributed constant line) 2.

グランド導体４は、シート５の表面に広面積に設けられている。グランド導体４の引出し部４ａはシート５の左辺に露出し、引出し部４ｂはシート５の右辺に露出し、引出し部４ｃ，４ｄはそれぞれシート５の奥側の辺の左側部及び右側部に露出している。   The ground conductor 4 is provided in a large area on the surface of the sheet 5. The lead portion 4a of the ground conductor 4 is exposed on the left side of the sheet 5, the lead portion 4b is exposed on the right side of the sheet 5, and the lead portions 4c and 4d are exposed on the left side and right side of the back side of the sheet 5, respectively. is doing.

導体２ａ，２ｂ，４はＡｇ，Ｐｄ，Ａｇ−Ｐｄ，Ｃｕ等からなり、シート５の表面に、周知の印刷法やスパッタリング法や真空蒸着法等の方法によって形成される。矩形状誘電体シート５は、誘電体セラミック粉末を結合剤等と共に混練したものをシート状にしたものである。   The conductors 2a, 2b, and 4 are made of Ag, Pd, Ag-Pd, Cu, or the like, and are formed on the surface of the sheet 5 by a known printing method, sputtering method, vacuum deposition method, or the like. The rectangular dielectric sheet 5 is obtained by kneading dielectric ceramic powder together with a binder or the like into a sheet shape.

以上の構成からなる各シート５は積み重ねられ、一体的に焼結されることにより、図２に示すように積層体とされる。積層体の手前側の側面部の左側及び右側の位置には、それぞれ入力端子１１及び出力端子１３が形成され、奥側の側面部の左側及び右側の位置には、それぞれグランド端子１２，１４が形成される。さらに、積層体の左右の側面部には、それぞれグランド端子１５，１６が形成される。これらの端子１１〜１６は、スパッタリング法、真空蒸着法、あるいは塗布焼付等の方法にて形成される。   Each sheet 5 having the above configuration is stacked and integrally sintered to form a laminate as shown in FIG. Input terminals 11 and output terminals 13 are respectively formed at the left and right side positions of the side surface portion on the near side of the laminate, and ground terminals 12 and 14 are respectively disposed at the left and right positions of the back side surface portion. It is formed. Furthermore, ground terminals 15 and 16 are formed on the left and right side surfaces of the laminate, respectively. These terminals 11 to 16 are formed by a sputtering method, a vacuum deposition method, a coating baking method or the like.

入力端子１１は伝送線路２の一方の端部、具体的には伝送線路導体２ａの引出し部３ａに電気的に接続している。出力端子１３は伝送線路２の他方の端部、具体的には伝送線路導体２ｂの引出し部３ｂに電気的に接続している。グランド端子１２，１４，１５，１６は、それぞれグランド導体４の引出し部４ｃ，４ｄ，４ａ，４ｂに電気的に接続している。   The input terminal 11 is electrically connected to one end of the transmission line 2, specifically to the lead-out part 3a of the transmission line conductor 2a. The output terminal 13 is electrically connected to the other end of the transmission line 2, specifically, to the lead-out part 3b of the transmission line conductor 2b. The ground terminals 12, 14, 15, and 16 are electrically connected to the lead portions 4c, 4d, 4a, and 4b of the ground conductor 4, respectively.

こうして得られた高周波伝送線路部品１は、図３に示すように、上下に配置された二つのグランド導体４，４の間に、１本の伝送線路２が伝送線路導体２ａと２ｂの２層で構成されている。従って、特性インピーダンスが一定であれば、一層当たりの伝送線路導体の長さは、従来の略１／２となる。この結果、伝送線路部品１は、従来の高周波伝送線路部品と比較して、小さい部品サイズで所定の特性インピーダンスを確保することができる。   As shown in FIG. 3, the high-frequency transmission line component 1 thus obtained has one transmission line 2 between two ground conductors 4 and 4 arranged above and below, two layers of transmission line conductors 2a and 2b. It consists of Therefore, if the characteristic impedance is constant, the length of the transmission line conductor per layer is about ½ of the conventional length. As a result, the transmission line component 1 can ensure a predetermined characteristic impedance with a small component size as compared with the conventional high-frequency transmission line component.

また、入力端子１１に入った高周波信号が、伝送線路２を伝播して出力端子１３から出力される場合、図１に示すように、伝送線路導体２ａを伝播する高周波信号の進行方向ａと、伝送線路導体２ｂを伝播する高周波信号の進行方向ｂとが同方向となる。従って、伝送線路導体２ａ，２ｂのそれぞれの周囲に発生する磁束の周回方向が同方向となり、伝送線路導体２ａと２ｂはこの相互に同方向に周回する磁束によって電磁気的に結合することになる。これにより、図３に示すように、伝送線路導体２ａと２ｂが近接して重なり合う部分において、伝送線路導体２ａ及び２ｂを中心として周回する磁束φが形成される。このため、例えば伝送線路導体２ａと２ｂの間隔を２５μｍ程度に設定することにより、伝送線路導体２ａと２ｂ間の結合を大きくすることができ、所望の特性インピーダンスを容易に得ることができる。   In addition, when the high-frequency signal that has entered the input terminal 11 propagates through the transmission line 2 and is output from the output terminal 13, as shown in FIG. 1, the traveling direction a of the high-frequency signal that propagates through the transmission line conductor 2a, The traveling direction b of the high-frequency signal propagating through the transmission line conductor 2b is the same direction. Accordingly, the circumferential direction of the magnetic flux generated around each of the transmission line conductors 2a and 2b is the same direction, and the transmission line conductors 2a and 2b are electromagnetically coupled by the magnetic flux circulating in the same direction. As a result, as shown in FIG. 3, a magnetic flux φ that circulates around the transmission line conductors 2 a and 2 b is formed in a portion where the transmission line conductors 2 a and 2 b overlap in the vicinity. Therefore, for example, by setting the distance between the transmission line conductors 2a and 2b to about 25 μm, the coupling between the transmission line conductors 2a and 2b can be increased, and a desired characteristic impedance can be easily obtained.

従って、外部からの電磁界ノイズから伝送線路２を遮蔽するため、二つのグランド導体４の間に伝送線路２を配設しても、伝送線路２とグランド導体４との間に形成される浮遊容量の影響による伝送線路２の特性インピーダンスの低下を補償して、一定の特性インピーダンスを確保することができる。そして、この高周波伝送線路部品１を、バイアス印加回路等の分岐線路として用いる場合には、主線の挿入損失の低下及び帯域幅縮小を抑えることができる。   Therefore, even if the transmission line 2 is disposed between the two ground conductors 4 in order to shield the transmission line 2 from electromagnetic field noise from the outside, a floating formed between the transmission line 2 and the ground conductor 4. A certain characteristic impedance can be ensured by compensating for a decrease in the characteristic impedance of the transmission line 2 due to the influence of the capacitance. And when using this high frequency transmission line component 1 as branch lines, such as a bias application circuit, the fall of the insertion loss and bandwidth reduction of a main line can be suppressed.

さらに、伝送線路２において、伝送線路導体２ａ，２ｂが積層方向に重なっている部分の線路長をＬとすると、Ｌ＝λ／４となる波長λの高周波信号が伝送線路２を伝播した際に、最も大きな結合が生じる。そして、この重なっている部分の線路長Ｌを短くすることで、伝送線路２を伝播する高周波信号のうちで最も大きな結合が得られる高周波信号の周波数（以下、中心周波数と記す）を高くすることができる。   Further, in the transmission line 2, when the line length of the portion where the transmission line conductors 2a and 2b overlap in the stacking direction is L, a high-frequency signal having a wavelength λ of L = λ / 4 propagates through the transmission line 2. The largest bond occurs. Then, by shortening the line length L of the overlapping portion, the frequency of the high-frequency signal (hereinafter referred to as the center frequency) that can obtain the largest coupling among the high-frequency signals propagating through the transmission line 2 is increased. Can do.

さらに、伝送線路導体２ａ，２ｂの導体幅、あるいは伝送線路導体２ａ，２ｂとグランド導体４の間隔、あるいは伝送線路導体２ａと２ｂの重なり面積、あるいは伝送線路導体２ａ，２ｂ相互の間隔を任意に設定することにより、特性インピーダンスを所望の値に調整することができる。   Further, the conductor width of the transmission line conductors 2a and 2b, the distance between the transmission line conductors 2a and 2b and the ground conductor 4, the overlapping area of the transmission line conductors 2a and 2b, or the distance between the transmission line conductors 2a and 2b is arbitrarily set. By setting, the characteristic impedance can be adjusted to a desired value.

［第２実施例、図４〜図７］
図４に示すように、高周波伝送線路部品２１は、伝送線路導体２２ａ，２２ｂ，２２ｃ及びビアホール２６ａ，２６ｂをそれぞれ設けた誘電体シート２５と、グランド導体２４を設けた誘電体シート２５と、保護用誘電体シート２５等にて構成されている。 [Second Embodiment, FIGS. 4 to 7]
As shown in FIG. 4, the high-frequency transmission line component 21 includes a dielectric sheet 25 provided with transmission line conductors 22a, 22b, 22c and via holes 26a, 26b, a dielectric sheet 25 provided with a ground conductor 24, and a protection. It is comprised by the dielectric material sheet 25 grade | etc.,.

伝送線路導体２２ａ〜２２ｃは、それぞれ大略ミアンダ形状をしている。伝送線路導体２２ａ，２２ｃの引出し部２３ａ，２３ｃは、それぞれシート２５の手前側の辺の左側部及び右側部に露出している。さらに、伝送線路導体２２ａ〜２２ｃは、引出し部２３ａ、２３ｃを残して、シート２５を挟んで対向し、電磁気的に結合している。伝送線路導体２２ａ〜２２ｃは、ビアホール２６ａ，２６ｂを介して電気的に直列に接続され、１本の伝送線路２２を形成する。   Each of the transmission line conductors 22a to 22c has a generally meander shape. The lead-out portions 23a and 23c of the transmission line conductors 22a and 22c are exposed on the left side and the right side of the front side of the sheet 25, respectively. Further, the transmission line conductors 22a to 22c are opposed to each other with the sheet 25 interposed therebetween, leaving the lead portions 23a and 23c, and are electromagnetically coupled. The transmission line conductors 22a to 22c are electrically connected in series via via holes 26a and 26b to form one transmission line 22.

グランド導体２４は、シート２５の表面に広面積に設けられている。グランド導体２４の引出し部２４ａ，２４ｂはそれぞれシート２５の左辺及び右辺に露出し、引出し部２４ｃ，２４ｄはそれぞれシート２５の奥側の辺の左側部及び右側部に露出している。   The ground conductor 24 is provided in a large area on the surface of the sheet 25. The lead portions 24 a and 24 b of the ground conductor 24 are exposed at the left side and the right side of the sheet 25, respectively, and the lead portions 24 c and 24 d are exposed at the left side and right side of the back side of the sheet 25, respectively.

以上の構成からなる各シート２５は積み重ねられ、一体的に焼結されることにより、図５に示すように積層体とされる。積層体の手前側の側面部の左寄り及び右寄りの位置には、それぞれ入力端子３１及び出力端子３２が形成され、奥側の側面部の左寄り及び右寄りの位置には、それぞれグランド端子３５，３６が形成され、左右の側面部には、それぞれグランド端子３３，３４が形成される。   Each sheet | seat 25 which consists of the above structure is laminated | stacked, and it is set as a laminated body as shown in FIG. 5 by sintering integrally. An input terminal 31 and an output terminal 32 are formed at the left side and the right side of the side surface portion on the near side of the laminate, respectively, and ground terminals 35 and 36 are respectively provided at the left side and the right side of the back side surface portion. The ground terminals 33 and 34 are formed on the left and right side portions, respectively.

入力端子３１は伝送線路２２の一方の端部、具体的には伝送線路導体２２ａの引出し部２３ａに電気的に接続している。出力端子３２は伝送線路２２の他方の端部、具体的には伝送線路導体２２ｃの引出し部２３ｃに電気的に接続している。グランド端子３３，３４，３５，３６は、それぞれグランド導体２４の引出し部２４ａ，２４ｂ，２４ｃ，２４ｄに電気的に接続している。   The input terminal 31 is electrically connected to one end of the transmission line 22, more specifically, to the lead-out part 23a of the transmission line conductor 22a. The output terminal 32 is electrically connected to the other end of the transmission line 22, specifically to the lead-out part 23c of the transmission line conductor 22c. The ground terminals 33, 34, 35, and 36 are electrically connected to the lead portions 24a, 24b, 24c, and 24d of the ground conductor 24, respectively.

こうして得られた高周波伝送線路部品２１は、図６（Ａ）に示すように、上下に配置された二つのグランド導体２４，２４の間に、１本の伝送線路２２が伝送線路導体２２ａと２２ｂと２２ｃの３層で構成されているので、特性インピーダンスが一定であれば、一層当たりの伝送線路導体の長さは従来の１／３となる。従って、伝送線路部品２１を従来の高周波伝送線路部品と比較して小型にすることができる。   As shown in FIG. 6A, the high-frequency transmission line component 21 obtained in this way has a single transmission line 22 between the two ground conductors 24, 24 arranged above and below, and transmission line conductors 22a and 22b. If the characteristic impedance is constant, the length of the transmission line conductor per layer becomes 1/3 of the conventional one. Therefore, the transmission line component 21 can be reduced in size as compared with the conventional high-frequency transmission line component.

ここで、図６（Ｂ）に示すように、一対のグランド導体２４の間に、伝送線路導体２２ａ〜２２ｃのうちの一つしか配置しない構造を有する伝送線路部品と比較する。グランド導体２４と伝送線路導体２２ａ（又は２２ｂ，２２ｃ）の間隔Ｔ１を１５０μｍ程度とすると、伝送線路導体２２ａ〜２２ｃ相互の間隔Ｔ２は２５μｍ程度にできる。従って、図６（Ｂ）に示されている構造の伝送線路部品の寸法Ｔ４は９００μｍ程度となるのに対して、第２実施形態の伝送線路部品２１の寸法Ｔ３は３５０μｍ程度に抑えることができる。   Here, as shown in FIG. 6B, the transmission line component is compared with a transmission line component having a structure in which only one of the transmission line conductors 22a to 22c is disposed between the pair of ground conductors 24. If the distance T1 between the ground conductor 24 and the transmission line conductor 22a (or 22b, 22c) is about 150 μm, the distance T2 between the transmission line conductors 22a to 22c can be about 25 μm. Accordingly, the dimension T4 of the transmission line component having the structure shown in FIG. 6B is about 900 μm, whereas the dimension T3 of the transmission line component 21 of the second embodiment can be suppressed to about 350 μm. .

また、図４に示すように、伝送線路導体２２ａ，２２ｂ，２２ｃをそれぞれ伝播する高周波信号の進行方向ａ，ｂ，ｃは同方向となる。従って、図６（Ａ）に示すように、伝送線路導体２２ａ，２２ｂ，２２ｃが近接して重なり合う部分において、伝送線路導体２２ａ〜２２ｃをほぼ中心として周回する磁束φが形成される。この結果、伝送線路部品２１は、伝送線路導体２２ａ〜２２ｃ相互の間隔を所定量確保することにより、伝送線路導体２２ａ〜２２ｃ間の結合を大きくすることができ、所望の特性インピーダンスを容易に得ることができる。   Also, as shown in FIG. 4, the traveling directions a, b, and c of the high-frequency signals propagating through the transmission line conductors 22a, 22b, and 22c are the same direction. Therefore, as shown in FIG. 6A, a magnetic flux φ that circulates around the transmission line conductors 22a to 22c is formed at the portion where the transmission line conductors 22a, 22b, and 22c overlap in close proximity. As a result, the transmission line component 21 can increase the coupling between the transmission line conductors 22a to 22c by securing a predetermined distance between the transmission line conductors 22a to 22c, and easily obtain a desired characteristic impedance. be able to.

また、特性インピーダンスを所定値に調整するため、伝送線路導体２２ａ〜２２ｃの導体幅、あるいは伝送線路導体２２ａ〜２２ｃとグランド導体２４の間隔、あるいは伝送線路導体２２ａ〜２２ｃ相互の間隔を任意に設定することができる。特に、図７に示すように、積層方向において、最も外側に位置している伝送線路導体２２ａ，２２ｃと内側に位置している伝送線路導体２２ｂのそれぞれの導体幅を異ならせておけば、伝送線路導体２２ａ〜２２ｃの積層ずれによる特性インピーダンスの変動を抑えることができるので、有効である。   Further, in order to adjust the characteristic impedance to a predetermined value, the conductor width of the transmission line conductors 22a to 22c, the distance between the transmission line conductors 22a to 22c and the ground conductor 24, or the distance between the transmission line conductors 22a to 22c is arbitrarily set. can do. In particular, as shown in FIG. 7, if the conductor widths of the transmission line conductors 22 a and 22 c located on the outermost side and the transmission line conductor 22 b located on the inner side are different in the stacking direction, transmission is performed. This is effective because fluctuations in characteristic impedance due to misalignment of the line conductors 22a to 22c can be suppressed.

［第３実施例、図８及び図９］
図８に示すように、高周波伝送線路部品４１は、伝送線路導体４２ａ，４２ｃを設けた誘電体シート４５と、伝送線路導体４２ｂを設けた誘電体シート４５と、グランド導体４４を設けた誘電体シート４５と、保護用誘電体シート４５等にて構成されている。 [Third embodiment, FIGS. 8 and 9]
As shown in FIG. 8, the high frequency transmission line component 41 includes a dielectric sheet 45 provided with transmission line conductors 42a and 42c, a dielectric sheet 45 provided with a transmission line conductor 42b, and a dielectric provided with a ground conductor 44. The sheet 45 is composed of a protective dielectric sheet 45 and the like.

伝送線路導体４２ａ〜４２ｃは、それぞれ大略ミアンダ形状をしている。伝送線路導体４２ａ，４２ｃの引出し部４３ａ，４３ｃは、それぞれシート４５の手前側の辺の中央左寄りの位置及び右側の位置に露出している。さらに、伝送線路導体４２ａ〜４２ｃは、引出し部４３ａ，４３ｃ等を残してシート４５を挟んで対向し、電磁気的に結合している。伝送線路導体４２ａ〜４２ｃは、ビアホール４６ａ，４６ｂを介して電気的に直列に接続され、１本の伝送線路４２を形成する。   Each of the transmission line conductors 42a to 42c has a generally meander shape. The lead-out portions 43a and 43c of the transmission line conductors 42a and 42c are exposed at the center left side position and the right side position of the front side of the sheet 45, respectively. Further, the transmission line conductors 42a to 42c are opposed to each other with the sheet 45 interposed therebetween except for the lead portions 43a and 43c, and are electromagnetically coupled. Transmission line conductors 42a to 42c are electrically connected in series via via holes 46a and 46b to form one transmission line 42.

グランド導体４４は、シート４５の表面に広面積に設けられている。グランド導体４４の引出し部４４ａ，４４ｂはそれぞれシート４５の左辺及び右辺に露出し、引出し部４４ｃ，４４ｄはそれぞれシート４５の奥側の辺の中央左寄りの位置及び右側の位置に露出している。   The ground conductor 44 is provided on the surface of the sheet 45 in a wide area. The lead portions 44a and 44b of the ground conductor 44 are exposed at the left side and the right side of the sheet 45, respectively, and the lead portions 44c and 44d are exposed at the center left side and the right side of the back side of the sheet 45, respectively.

以上の構成からなる各シート４５は積み重ねられ、一体的に焼結されることにより、図９に示すように積層体とされる。積層体の手前側の側面部の中央左寄り及び右側の位置には、それぞれ入力端子５１及び出力端子５２が形成され、奥側の側面部の中央左寄り及び右側の位置には、それぞれグランド端子５５，５６が形成され、左右の側面部にはそれぞれグランド端子５３，５４が形成される。   Each sheet 45 having the above configuration is stacked and integrally sintered to form a laminate as shown in FIG. An input terminal 51 and an output terminal 52 are formed at the center left side and right side positions of the side surface portion on the near side of the laminate, respectively, and ground terminals 55, respectively are provided at the center left side and right side positions of the back side surface portion. 56 is formed, and ground terminals 53 and 54 are formed on the left and right side portions, respectively.

入力端子５１は伝送線路４２の一方の端部、具体的には伝送線路導体４２ａの引出し部４３ａに電気的に接続している。出力端子５２は伝送線路４２の他方の端部、具体的には伝送線路導体４２ｃの引出し部４３ｃに電気的に接続している。グランド端子５３，５４，５５，５６は、それぞれグランド導体４４の引出し部４４ａ，４４ｂ，４４ｃ，４４ｄに電気的に接続している。   The input terminal 51 is electrically connected to one end of the transmission line 42, specifically to the lead-out part 43a of the transmission line conductor 42a. The output terminal 52 is electrically connected to the other end of the transmission line 42, specifically, to the lead-out part 43c of the transmission line conductor 42c. The ground terminals 53, 54, 55, and 56 are electrically connected to the lead portions 44a, 44b, 44c, and 44d of the ground conductor 44, respectively.

こうして得られた高周波伝送線路部品４１は、上下に配置された二つのグランド導体４４，４４の間に、１本の伝送線路４２が、伝送線路導体４２ａ，４２ｃの層と、伝送線路導体４２ｂの層の２層で構成されている。従って、特性インピーダンスが一定であれば、一層あたりの伝送線路導体の長さは、従来の長さより短くなる。この結果、伝送線路部品４１は、従来の高周波伝送線路部品と比較して小型にすることができる。   The high-frequency transmission line component 41 obtained in this way has one transmission line 42 between the two ground conductors 44, 44 arranged above and below, the layers of the transmission line conductors 42a, 42c, and the transmission line conductor 42b. It consists of two layers. Therefore, if the characteristic impedance is constant, the length of the transmission line conductor per layer is shorter than the conventional length. As a result, the transmission line component 41 can be reduced in size as compared with the conventional high-frequency transmission line component.

また、図８に示すように、伝送線路導体４２ａ，４２ｂ，４２ｃをそれぞれ伝播する高周波信号の進行方向ａ，ｂ，ｃが同方向となる。従って、伝送線路導体４２ａ，４２ｂ，４２ｃのそれぞれの周囲に発生する磁束の周回方向が同方向となる。この結果、伝送線路部品４１は、伝送線路導体４２ａ〜４２ｃ相互の間隔を近接させることにより、伝送線路導体４２ａ〜４２ｃ間の結合を大きくすることができ、所望の特性インピーダンスを容易に得ることができる。   Further, as shown in FIG. 8, the traveling directions a, b, and c of the high-frequency signals propagating through the transmission line conductors 42a, 42b, and 42c are the same direction. Therefore, the circulation direction of the magnetic flux generated around each of the transmission line conductors 42a, 42b, and 42c is the same direction. As a result, the transmission line component 41 can increase the coupling between the transmission line conductors 42a to 42c by making the distance between the transmission line conductors 42a to 42c close to each other, and can easily obtain a desired characteristic impedance. it can.

［第４実施例、図１０及び図１１］
図１０に示すように、高周波伝送線路部品６１は、伝送線路導体６２ａ，６２ｂ及びビアホール６６をそれぞれ設けた誘電体シート６５と、グランド導体６４を設けた誘電体シート６５と、保護用誘電体シート６５等にて構成されている。伝送線路導体６２ａの引出し部６３ａはシート６５の手前側の辺の左側部に露出し、伝送線路導体６２ｂの引出し部６３ｂはシート６５の手前側の辺の左側部に露出している。さらに、伝送線路導体６２ａ，６２ｂは、引出し部６３ａ，６３ｂを残してシート６５を挟んで対向している。伝送線路導体６２ａ，６２ｂはビアホール６６を介して直列に電気的に接続され、１本の伝送線路６２を形成する。 [Fourth embodiment, FIGS. 10 and 11]
As shown in FIG. 10, the high-frequency transmission line component 61 includes a dielectric sheet 65 provided with transmission line conductors 62a and 62b and a via hole 66, a dielectric sheet 65 provided with a ground conductor 64, and a protective dielectric sheet. 65 or the like. The lead-out portion 63a of the transmission line conductor 62a is exposed on the left side of the front side of the sheet 65, and the lead-out portion 63b of the transmission line conductor 62b is exposed on the left side of the front side of the sheet 65. Further, the transmission line conductors 62a and 62b are opposed to each other with the sheet 65 interposed therebetween, leaving the lead portions 63a and 63b. The transmission line conductors 62 a and 62 b are electrically connected in series via the via hole 66 to form one transmission line 62.

グランド導体６４は、シート６５の表面に広面積に設けられている。グランド導体６４の引出し部６４ａ，６４ｂはそれぞれシート６５の左辺及び右辺に露出し、引出し部６４ｃはシート６５の手前側の辺の右側部に露出し、引出し部６４ｄ，６４ｅはそれぞれシート６５の奥側の辺の右側部及び左側部に露出している。   The ground conductor 64 is provided in a large area on the surface of the sheet 65. The lead portions 64a and 64b of the ground conductor 64 are exposed at the left side and the right side of the sheet 65, the lead portion 64c is exposed at the right side of the front side of the sheet 65, and the lead portions 64d and 64e are at the back of the sheet 65, respectively. It is exposed at the right side and the left side of the side.

以上の構成からなる各シート６５は積み重ねられ、一体的に焼結されることにより、図１１に示すように積層体とされる。積層体の手前側の側面部の左側及び右側の位置には、それぞれ入出力端子７１及びグランド端子７３が形成され、奥側の側面部の左側及び右側の位置には、それぞれグランド端子７２，７４が形成され、左右の側面部には、それぞれグランド端子７５，７６が形成される。   Each sheet 65 having the above configuration is stacked and integrally sintered to form a laminate as shown in FIG. Input / output terminals 71 and ground terminals 73 are formed at the left and right positions of the side surface portion on the near side of the laminate, respectively, and ground terminals 72 and 74 are disposed at the left and right positions of the back side surface portion, respectively. The ground terminals 75 and 76 are formed on the left and right side surfaces, respectively.

入出力端子７１は、伝送線路６２の一方の端部、具体的には伝送線路導体６２ａの引出し部６３ａに電気的に接続している。グランド端子７３は伝送線路６２の他方の端部、具体的には伝送線路導体６２ｂの引出し部６３ｂ及びグランド導体６４の引出し部６４ｃに電気的に接続している。グランド端子７２，７４，７５，７６は、それぞれグランド導体６４の引出し部６４ｅ、６４ｄ、６４ａ，６４ｂに電気的に接続している。なお、この実施形態においては、伝送線路導体６２ｂの引出し部６３ｂとグランド導体６４とが電気的に接続されているが、回路とのマッチングをとる場合等、回路構成上必要な場合に限って接続されるものである。   The input / output terminal 71 is electrically connected to one end of the transmission line 62, specifically, to the lead-out part 63a of the transmission line conductor 62a. The ground terminal 73 is electrically connected to the other end of the transmission line 62, specifically, the lead-out part 63 b of the transmission-line conductor 62 b and the lead-out part 64 c of the ground conductor 64. The ground terminals 72, 74, 75, and 76 are electrically connected to the lead portions 64e, 64d, 64a, and 64b of the ground conductor 64, respectively. In this embodiment, the lead-out portion 63b of the transmission line conductor 62b and the ground conductor 64 are electrically connected. However, the connection is made only when necessary for the circuit configuration, such as when matching with a circuit. It is what is done.

こうして得られた高周波伝送線路部品６１は、前記第１実施例の伝送線路部品１と同様の作用効果を奏する。   The high-frequency transmission line component 61 obtained in this way has the same effects as the transmission line component 1 of the first embodiment.

［第５実施例、図１２〜図１４］
第５実施例は、高周波伝送経路を有した電子部品の一例として、高周波スイッチ部品を例にして説明する。 [Fifth Embodiment, FIGS. 12 to 14]
In the fifth embodiment, a high-frequency switch component will be described as an example of an electronic component having a high-frequency transmission path.

図１２に示すように、高周波スイッチ部品８１は、伝送線路導体８２ａ，８２ｂ等を設けた誘電体シート９５と、グランド導体８４を設けた誘電体シート９５と、コンデンサ導
体８５，８６を設けた誘電体シート９５と、伝送線路導体８７ａ〜８７ｃ，８８ａ，８８ｂをそれぞれ設けた誘電体シート９５と、ビアホール付きパッド１０７ａ〜１１０ｂを設けた誘電体シート９５等にて構成されている。 As shown in FIG. 12, the high frequency switch component 81 includes a dielectric sheet 95 provided with transmission line conductors 82a and 82b, a dielectric sheet 95 provided with a ground conductor 84, and a dielectric sheet provided with capacitor conductors 85 and 86. A body sheet 95, a dielectric sheet 95 provided with transmission line conductors 87a to 87c, 88a and 88b, a dielectric sheet 95 provided with pads 107a to 110b with via holes, and the like.

伝送線路導体８７ａ，８７ｂ，８７ｃは、それぞれ大略スパイラル形状をしており、伝送線路導体８７ａの引出し部８９ａはシート９５の奥側の辺の左側部に露出し、伝送線路導体８７ｃの引出し部８９ｃはシート９５の手前側の辺の左側部に露出している。さらに、伝送線路導体８７ａ〜８７ｃは、引出し部８９ａ，８９ｃを残してシート９５を挟んで対向している。これらの伝送線路導体８７ａ〜８７ｃは、シート９５に設けたビアホール１２０ａ、１２０ｂを介して電気的に直列に接続され、１本の伝送線路８７を形成する。この伝送線路８７は、バイアス回路の分岐線路として用いられる。   Each of the transmission line conductors 87a, 87b, 87c has a substantially spiral shape, and the lead-out portion 89a of the transmission line conductor 87a is exposed on the left side of the back side of the sheet 95, and the lead-out portion 89c of the transmission line conductor 87c. Is exposed on the left side of the front side of the sheet 95. Further, the transmission line conductors 87a to 87c are opposed to each other with the sheet 95 interposed therebetween, leaving the lead portions 89a and 89c. These transmission line conductors 87 a to 87 c are electrically connected in series via via holes 120 a and 120 b provided in the sheet 95 to form one transmission line 87. This transmission line 87 is used as a branch line of the bias circuit.

同様に、伝送線路導体８８ａ，８８ｂはそれぞれ大略ミアンダ形状をしており、伝送線路導体８８ａの引出し部９０ａはシート９５の奥側の辺の右側部に露出し、伝送線路導体８８ｂの引出し部９０ｂはシート９５の手前側の辺の中央部に露出している。さらに、伝送線路導体８８ａ，８８ｂは、引出し部９０ａ，９０ｂを残してシート９５を挟んで対向している。これらの伝送線路導体８８ａ，８８ｂは、シート９５に設けたビアホール１２１ａ，１２１ｂを介して電気的に直列に接続され、１本の伝送線路８８を形成する。この伝送線路８８は、特性インピーダンスを５０Ω程度するため、伝送線路導体８８ａと８８ｂの２層構造にして、伝送線路導体８８ａと８８ｂの間隔を大きくしている。さらに、伝送線路８８の場合、伝送線路導体８８ａ，８８ｂの導体幅を伝送線路８７の伝送線路導体８７ａ〜８７ｃより太くすることにより、特性インピーダンスを調整している。この伝送線路８８は、高周波スイッチ部品８１の主線路として用いられる。   Similarly, each of the transmission line conductors 88a and 88b has a generally meander shape, and the lead-out portion 90a of the transmission line conductor 88a is exposed to the right side of the back side of the sheet 95, and the lead-out portion 90b of the transmission line conductor 88b. Is exposed at the center of the front side of the sheet 95. Further, the transmission line conductors 88a and 88b are opposed to each other with the sheet 95 interposed therebetween, leaving the lead portions 90a and 90b. These transmission line conductors 88 a and 88 b are electrically connected in series via via holes 121 a and 121 b provided in the sheet 95 to form one transmission line 88. The transmission line 88 has a two-layer structure of transmission line conductors 88a and 88b in order to increase the characteristic impedance to about 50Ω, and the interval between the transmission line conductors 88a and 88b is increased. Further, in the case of the transmission line 88, the characteristic impedance is adjusted by making the conductor widths of the transmission line conductors 88a and 88b thicker than the transmission line conductors 87a to 87c of the transmission line 87. The transmission line 88 is used as a main line of the high frequency switch component 81.

伝送線路導体８２ａ，８２ｂはそれぞれ大略スパイラル形状をしており、伝送線路導体８２ｂの引出し部８３はシート９５の手前側の辺の中央部に露出している。さらに、伝送線路導体８２ａ，８２ｂは、引出し部８３を残してシート９５を挟んで対向している。これらの伝送線路導体８２ａ，８２ｂは、シート９５に設けたビアホール１２２を介して電気的に直列に接続され、１本の伝送線路８２を形成する。伝送線路８２，８７，８８の特性インピーダンスはそれぞれ異なる値を有している。   Each of the transmission line conductors 82 a and 82 b has a substantially spiral shape, and the lead-out portion 83 of the transmission line conductor 82 b is exposed at the center of the front side of the sheet 95. Further, the transmission line conductors 82a and 82b face each other with the sheet 95 interposed therebetween, leaving the lead-out portion 83. These transmission line conductors 82 a and 82 b are electrically connected in series via via holes 122 provided in the sheet 95 to form one transmission line 82. The characteristic impedances of the transmission lines 82, 87, and 88 have different values.

グランド導体８４は、シート９５の表面に広面積に設けられている。グランド導体８４の引出し部８４ａはシート９５の左辺に露出し、引出し部８４ｂはシート９５の右辺に露出し、引出し部８４ｃはシート９５の奥側の辺の中央部に露出している。   The ground conductor 84 is provided in a large area on the surface of the sheet 95. The lead portion 84 a of the ground conductor 84 is exposed on the left side of the sheet 95, the lead portion 84 b is exposed on the right side of the sheet 95, and the lead portion 84 c is exposed at the center of the back side of the sheet 95.

コンデンサ導体８５，８６は、それぞれシート９５の表面の左側及び右側に設けられている。コンデンサ導体８５の引出し部８５ａはシート９５の手前側の辺の左側部に露出している。これらのコンデンサ導体８５，８６はそれぞれシート９５を挟んでグランド導体８４に対向しており、グランド導体８４と共にコンデンサＣ１，Ｃ２を形成する。   Capacitor conductors 85 and 86 are provided on the left and right sides of the surface of the sheet 95, respectively. The lead-out portion 85 a of the capacitor conductor 85 is exposed on the left side of the front side of the sheet 95. These capacitor conductors 85 and 86 face the ground conductor 84 with the sheet 95 interposed therebetween, and form the capacitors C1 and C2 together with the ground conductor 84.

さらに、伝送線路導体８２ａが設けられているシート９５の表面には、引出し導体１００，１０１，１０２，１０３及び中継導体１０４が設けられている。引出し導体１００，１０１の一端は、それぞれシート９５の奥側の辺の左側部及び右側部に露出し、引出し導体１０２，１０３の一端はそれぞれシート９５の手前側の辺の中央部及び右側部に露出している。そして、伝送線路導体８２ａはビアホール付きパッド１０９ｂに電気的に接続され、引出し導体１０１，１０２，１０３はそれぞれビアホール付きパッド１０８ｂ，１０７ａ，１１０ａに電気的に接続される。中継導体１０４はビアホール付きパッド１１０ｂ及び１０８ａに電気的に接続されると共に、シート９５に設けたビアホール１２３ａ，１２３ｂ，１２３ｃを介してコンデンサ導体８６に電気的に接続される。   Further, the lead conductors 100, 101, 102, 103 and the relay conductor 104 are provided on the surface of the sheet 95 on which the transmission line conductor 82a is provided. One end of each of the lead conductors 100 and 101 is exposed at the left side and the right side of the back side of the sheet 95, and one end of each of the lead conductors 102 and 103 is at the center and right side of the front side of the sheet 95, respectively. Exposed. The transmission line conductor 82a is electrically connected to the pad 109b with via hole, and the lead conductors 101, 102, and 103 are electrically connected to the pads 108b, 107a, and 110a with via hole, respectively. The relay conductor 104 is electrically connected to the pads 110b and 108a with via holes, and is also electrically connected to the capacitor conductor 86 via the via holes 123a, 123b, and 123c provided in the sheet 95.

以上の構成からなる各シート９５は積み重ねられ、一体的に焼結されることにより、図１３に示すように積層体とされる。積層体の手前側の側面部の左側、中央及び右側の位置には、それぞれ電圧制御用端子Ｖｃ１、アンテナ用端子ＡＮＴ及び電圧制御用端子Ｖｃ２が形成される。積層体の奥側の側面部の左側、中央及び右側の位置には、それぞれ送信回路用端子ＴＸ、グランド端子Ｇ３及び受信回路用端子ＲＸが形成される。さらに、積層体の左右の側面部には、それぞれグランド端子Ｇ１，Ｇ２が形成される。   Each sheet 95 having the above configuration is stacked and integrally sintered to form a laminate as shown in FIG. A voltage control terminal Vc1, an antenna terminal ANT, and a voltage control terminal Vc2 are formed at positions on the left side, center, and right side of the side surface portion on the near side of the laminate. A transmission circuit terminal TX, a ground terminal G3, and a reception circuit terminal RX are formed at positions on the left side, the center, and the right side of the side surface portion on the back side of the laminate. Further, ground terminals G1 and G2 are formed on the left and right side surfaces of the laminate, respectively.

送信回路用端子ＴＸは、伝送線路８７の一方の端部、具体的には伝送線路導体８７ａの引出し部８９ａと、引出し導体１００とに電気的に接続している。受信回路用端子ＲＸは、伝送線路８８の一方の端部、具体的には伝送線路導体８８ａの引出し部９０ａと、引出し導体１０１とに電気的に接続している。アンテナ用端子ＡＮＴは、伝送線路８２の一方の端部、具体的には伝送線路導体８２ｂの引出し部８３と、引出し導体１０２と、伝送線路８８の他方の端部、具体的に伝送線路導体８８ｂの引出し部９０ｂとに電気的に接続している。電圧制御用端子Ｖｃ１は、伝送線路８７の他方の端部、具体的には伝送線路導体８７ｃの引出し部８９ｃと、コンデンサ導体８５の引出し部８５ａとに電気的に接続している。電圧制御用端子Ｖｃ２は、引出し導体１０３に電気的に接続している。グランド端子Ｇ１，Ｇ２，Ｇ３はそれぞれグランド導体８４の引出し部８４ａ，８４ｂ，８４ｃに電気的に接続している。   The transmission circuit terminal TX is electrically connected to one end portion of the transmission line 87, specifically, the lead portion 89a of the transmission line conductor 87a and the lead conductor 100. The reception circuit terminal RX is electrically connected to one end portion of the transmission line 88, specifically, the lead portion 90a of the transmission line conductor 88a and the lead conductor 101. The antenna terminal ANT has one end portion of the transmission line 82, specifically, a lead portion 83 of the transmission line conductor 82b, a lead conductor 102, and the other end portion of the transmission line 88, specifically, the transmission line conductor 88b. Is electrically connected to the drawer portion 90b. The voltage control terminal Vc1 is electrically connected to the other end portion of the transmission line 87, specifically, the lead portion 89c of the transmission line conductor 87c and the lead portion 85a of the capacitor conductor 85. The voltage control terminal Vc2 is electrically connected to the lead conductor 103. The ground terminals G1, G2, and G3 are electrically connected to the lead portions 84a, 84b, and 84c of the ground conductor 84, respectively.

さらに、積層体の上面のパッド１０７ａ，１０７ｂにはそれぞれダイオード素子Ｄ１のカソード電極及びアノード電極が半田付けされ、パッド１０８ａ，１０８ｂにはそれぞれダイオード素子Ｄ２のカソード電極及びアノード電極が半田付けされ、パッド１０９ａ，１０９ｂにはそれぞれコンデンサ素子Ｃ３の端子電極が半田付けされ、パッド１１０ａ，１１０ｂにはそれぞれ抵抗素子Ｒの端子電極が半田付けされる。   Further, the cathode electrode and the anode electrode of the diode element D1 are soldered to the pads 107a and 107b on the upper surface of the laminate, respectively, and the cathode electrode and the anode electrode of the diode element D2 are soldered to the pads 108a and 108b, respectively. The terminal electrodes of the capacitor element C3 are soldered to the 109a and 109b, respectively, and the terminal electrodes of the resistance element R are soldered to the pads 110a and 110b, respectively.

図１４は、以上の構成からなる高周波スイッチ部品８１の電気等価回路図である。送信回路用端子ＴＸにはダイオード素子Ｄ１のアノードが接続されている。ダイオード素子Ｄ１のアノードは、分岐線路である伝送線路８７及びコンデンサＣ１の直列回路を介し、グランドに接地している。伝送線路８７とコンデンサＣ１との中間点には電圧制御用端子Ｖｃ１が接続している。この電圧制御用端子Ｖｃ１には、高周波スイッチ部品８１の伝送路切り換えを行うためのコントロール回路が接続される。ダイオード素子Ｄ１の両端（アノード・カソード間）には、伝送線路８２及びコンデンサ素子Ｃ３の直列回路が接続している。伝送線路８２及びコンデンサ素子Ｃ３は、ダイオード素子Ｄ１がＯＦＦ状態のときのアイソレーションを確保するためのものである。さらに、ダイオード素子Ｄ１のカソードは、アンテナ用端子ＡＮＴに接続している。   FIG. 14 is an electrical equivalent circuit diagram of the high-frequency switch component 81 having the above configuration. The anode of the diode element D1 is connected to the transmission circuit terminal TX. The anode of the diode element D1 is grounded to the ground via a series circuit of a transmission line 87, which is a branch line, and a capacitor C1. A voltage control terminal Vc1 is connected to an intermediate point between the transmission line 87 and the capacitor C1. A control circuit for switching the transmission path of the high frequency switch component 81 is connected to the voltage control terminal Vc1. A series circuit of a transmission line 82 and a capacitor element C3 is connected to both ends (between the anode and the cathode) of the diode element D1. The transmission line 82 and the capacitor element C3 are for ensuring isolation when the diode element D1 is in the OFF state. Furthermore, the cathode of the diode element D1 is connected to the antenna terminal ANT.

アンテナ用端子ＡＮＴには、主線路である伝送線路８８を介して受信回路用端子ＲＸが接続している。さらに、受信回路用端子ＲＸには、ダイオード素子Ｄ２のアノードが接続している。ダイオード素子Ｄ２のカソードは、コンデンサＣ２を介し、グランドに接地している。ダイオード素子Ｄ２とコンデンサＣ２との中間点には、抵抗素子Ｒを介して電圧制御用端子Ｖｃ２が接続している。この電圧制御用端子Ｖｃ２には、前記電圧制御用端子Ｖｃ１と同様に、高周波スイッチ部品８１の伝送路切り換えを行うためのコントロール回路が接続される。   A receiving circuit terminal RX is connected to the antenna terminal ANT via a transmission line 88 which is a main line. Further, the anode of the diode element D2 is connected to the receiving circuit terminal RX. The cathode of the diode element D2 is grounded via the capacitor C2. A voltage control terminal Vc2 is connected to a middle point between the diode element D2 and the capacitor C2 via a resistance element R. A control circuit for switching the transmission path of the high frequency switch component 81 is connected to the voltage control terminal Vc2 in the same manner as the voltage control terminal Vc1.

なお、図１４の中で点線で表示しているように、ダイオード素子Ｄ１に対して並列に、逆バイアス印加時の電圧安定化のための抵抗素子Ｒａを接続したり、ＯＦＦ状態のときのアイソレーションを確保するためのコンデンサ素子Ｃａを接続してもよい。また、ダイオード素子Ｄ２についても、ダイオード素子Ｄ１と同様に、抵抗素子Ｒａ、コンデンサ素子Ｃａ、伝送線路８２及びコンデンサ素子Ｃ３を接続してもよいことは言うまでもない。そして、高周波スイッチ部品８１を使用する際には、送信回路用端子ＴＸ、受信回路用端子ＲＸ及びアンテナ用端子ＡＮＴのそれぞれを、別部品のバイアスカット用のカップリングコンデンサ素子を介して送信回路、受信回路及びアンテナに接続する。   Note that, as indicated by a dotted line in FIG. 14, a resistance element Ra for voltage stabilization at the time of reverse bias application is connected in parallel to the diode element D1, or an isolator in the OFF state is connected. A capacitor element Ca for securing the adjustment may be connected. Needless to say, the resistor element Ra, the capacitor element Ca, the transmission line 82, and the capacitor element C3 may be connected to the diode element D2 as well as the diode element D1. When the high-frequency switch component 81 is used, each of the transmission circuit terminal TX, the reception circuit terminal RX, and the antenna terminal ANT is connected to the transmission circuit through a separate coupling capacitor element for bias cut. Connect to receiving circuit and antenna.

次に、この高周波スイッチ部品８１を用いての送受信について説明する。   Next, transmission / reception using the high-frequency switch component 81 will be described.

送信を行う場合には、電圧制御用端子Ｖｃ１とＶｃ２の間に正の電位差を与える。この電圧は、ダイオード素子Ｄ１，Ｄ２に対して順方向のバイアス電圧として働くため、ダイオード素子Ｄ１，Ｄ２をＯＮ状態にする。このとき、コンデンサＣ１〜Ｃ３によって直流分がカットされ、ダイオード素子Ｄ１，Ｄ２を含む回路にのみ電圧制御用端子Ｖｃ１，Ｖｃ２に加えられた電圧が印加される。従って、伝送線路８８がダイオード素子Ｄ２により接地されて送信周波数で共振し、インピーダンスが略無限大となる。この結果、送信回路用端子ＴＸに入った送信信号は、受信回路用端子ＲＸに殆んど伝送されることなく、ダイオード素子Ｄ１を経てアンテナ用端子ＡＮＴに伝送される。一方、伝送線路８７はコンデンサＣ１を介して接地されているため、送信周波数で共振してインピーダンスが略無限大となり、送信信号がグランド側へ漏れることを防止している。   When transmission is performed, a positive potential difference is applied between the voltage control terminals Vc1 and Vc2. Since this voltage acts as a forward bias voltage for the diode elements D1 and D2, the diode elements D1 and D2 are turned on. At this time, the DC component is cut by the capacitors C1 to C3, and the voltage applied to the voltage control terminals Vc1 and Vc2 is applied only to the circuit including the diode elements D1 and D2. Therefore, the transmission line 88 is grounded by the diode element D2, resonates at the transmission frequency, and the impedance becomes almost infinite. As a result, the transmission signal that has entered the transmission circuit terminal TX is transmitted to the antenna terminal ANT via the diode element D1 with almost no transmission to the reception circuit terminal RX. On the other hand, since the transmission line 87 is grounded via the capacitor C1, it resonates at the transmission frequency, the impedance becomes almost infinite, and the transmission signal is prevented from leaking to the ground side.

受信を行う場合は、電圧制御用端子Ｖｃ１とＶｃ２の間に負の電位差を与える。この電圧は、ダイオード素子Ｄ１，Ｄ２に対して逆方向のバイアス電圧として働くため、ダイオード素子Ｄ１，Ｄ２はＯＦＦ状態になり、アンテナ用端子ＡＮＴに入った受信信号は、伝送線路８８を経て受信回路用端子ＲＸに伝送され、送信回路用端子ＴＸには殆ど伝送されない。このように、高周波スイッチ部品８１は、電圧制御用端子Ｖｃ１，Ｖｃ２に印加するバイアス電圧をコントロールすることにより、送受の信号の伝送路を切り換えることができる。   When receiving, a negative potential difference is given between the voltage control terminals Vc1 and Vc2. Since this voltage acts as a bias voltage in the reverse direction with respect to the diode elements D1 and D2, the diode elements D1 and D2 are turned off, and the reception signal that has entered the antenna terminal ANT passes through the transmission line 88 to receive circuit. It is transmitted to the terminal RX for transmission and hardly transmitted to the terminal TX for transmission circuit. Thus, the high frequency switch component 81 can switch the transmission path of the transmission / reception signal by controlling the bias voltage applied to the voltage control terminals Vc1 and Vc2.

以上の構成からなる高周波スイッチ部品８１は、二つのグランド導体８４，８４の間に、２本の伝送線路８７，８８が並設され、かつ、それぞれの伝送線路８７，８８が伝送線路導体８７ａ〜８７ｃの３層及び８８ａ，８８ｂの２層で構成されている。さらに、１本の伝送線路８２が伝送線路８２ａ，８２ｂの２層で構成されている。従って、一定の特性インピーダンスを確保する場合、一層当たりの伝送線路の長さは従来より短くてすみ、高周波スイッチ部品８１の小型化を図ることができる。具体的には、９００ＭＨｚ帯の高周波スイッチ部品８１で、従来８×５×３ｍｍのサイズであったものが、５×４×２ｍｍに小型化することができた。   In the high-frequency switch component 81 having the above configuration, two transmission lines 87 and 88 are arranged in parallel between the two ground conductors 84 and 84, and the transmission lines 87 and 88 are connected to the transmission line conductors 87 a to 87-. It is composed of three layers 87c and two layers 88a and 88b. Furthermore, one transmission line 82 is composed of two layers of transmission lines 82a and 82b. Therefore, when a certain characteristic impedance is ensured, the length of the transmission line per layer can be shorter than the conventional one, and the high-frequency switch component 81 can be downsized. Specifically, the high frequency switch component 81 in the 900 MHz band, which has conventionally been 8 × 5 × 3 mm in size, can be reduced to 5 × 4 × 2 mm.

［他の実施例］
なお、本発明に係る高周波伝送線路部品は前記実施例に限定するものではなく、その要旨の範囲内で種々に変更することができる。 [Other Examples]
The high-frequency transmission line component according to the present invention is not limited to the above-described embodiment, and can be variously modified within the scope of the gist thereof.

高周波伝送線路は、占有面積や所望の特性インピーダンスの仕様によってミアンダ形状の他に、スパイラル形状のもの、あるいは、ミアンダ形状とスパイラル形状を組み合わせたもの等であってもよい。さらに、前記実施例は、それぞれ導体が形成された誘電体シートを積み重ねた後、一体的に焼成するものであるが、必ずしもこれに限定されない。シートは予め焼結されたものを用いてもよい。   The high-frequency transmission line may be of a spiral shape or a combination of a meander shape and a spiral shape in addition to the meander shape depending on the specifications of the occupied area and desired characteristic impedance. Further, in the above-described embodiment, the dielectric sheets on which the conductors are formed are stacked and then fired integrally. However, the present invention is not necessarily limited thereto. A sheet that has been sintered in advance may be used.

高周波伝送線路の第１実施例を示す分解斜視図。The disassembled perspective view which shows 1st Example of a high frequency transmission line. 図１に示されている高周波伝送線路の外観を示す斜視図。The perspective view which shows the external appearance of the high frequency transmission line shown by FIG. 図２のＩＩＩ−ＩＩＩ断面図。III-III sectional drawing of FIG. 高周波伝送線路の第２実施例を示す分解斜視図。The disassembled perspective view which shows 2nd Example of a high frequency transmission line. 図４に示されている高周波伝送線路の外観を示す斜視図。The perspective view which shows the external appearance of the high frequency transmission line shown by FIG. （Ａ）は図５のＶＩ−ＶＩ断面図、（Ｂ）は比較例を示す断面図。(A) is VI-VI sectional drawing of FIG. 5, (B) is sectional drawing which shows a comparative example. 図４に示されている高周波伝送線路の変形例を示す分解斜視図。The disassembled perspective view which shows the modification of the high frequency transmission line shown by FIG. 本発明に係る高周波伝送線路の第３実施例を示す分解斜視図。The disassembled perspective view which shows 3rd Example of the high frequency transmission line which concerns on this invention. 図８に示されている高周波伝送線路の外観を示す斜視図。The perspective view which shows the external appearance of the high frequency transmission line shown by FIG. 高周波伝送線路の第４実施例を示す分解斜視図。The disassembled perspective view which shows 4th Example of a high frequency transmission line. 図１０に示されている高周波伝送線路の外観を示す斜視図。The perspective view which shows the external appearance of the high frequency transmission line shown by FIG. 高周波伝送線路を有した電子部品の実施例を示す分解斜視図。The disassembled perspective view which shows the Example of the electronic component which has a high frequency transmission line. 図１２に示されている電子部品の外観を示す斜視図。The perspective view which shows the external appearance of the electronic component shown by FIG. 図１２に示されている電子部品の電気等価回路図。FIG. 13 is an electrical equivalent circuit diagram of the electronic component shown in FIG. 12. 従来の高周波伝送線路を示す分解斜視図。The disassembled perspective view which shows the conventional high frequency transmission line.

符号の説明Explanation of symbols

４１…高周波伝送線路部品
４２…伝送線路
４２ａ〜４２ｃ…伝送線路導体
４５…誘電体シート
41 ... High-frequency transmission line component 42 ... Transmission line 42a-42c ... Transmission line conductor 45 ... Dielectric sheet

Claims (1)

複数の誘電体層と複数の伝送線路導体とを積層してなる高周波伝送線路部品において、
前記複数の伝送線路導体のうちの同一方向にスパイラル状に形成された二つの伝送線路導体が、前記複数の誘電体層のうちの一つの誘電体層の主面上に配置され、
前記複数の伝送線路導体のうちの他の一つの略Ｓ字状の伝送線路導体が、前記複数の誘電体層のうちの他の一つの誘電体層の主面上に配置され、
前記三つの伝送線路導体がビアホールを介して電気的に直列に接続され、１本の伝送線路を形成し、
前記三つの伝送線路導体のそれぞれを伝播する高周波信号の進行方向がそれぞれ互いに近接する部分で同方向であること、
を特徴とする高周波伝送線路部品。 In a high-frequency transmission line component formed by laminating a plurality of dielectric layers and a plurality of transmission line conductors ,
Two transmission line conductors formed in a spiral shape in the same direction among the plurality of transmission line conductors are disposed on the main surface of one of the plurality of dielectric layers,
Another substantially S-shaped transmission line conductor of the plurality of transmission line conductors is disposed on the main surface of the other dielectric layer of the plurality of dielectric layers,
The three transmission line conductors are electrically connected in series through via holes to form one transmission line,
The traveling direction of the high-frequency signal propagating through each of the three transmission line conductors is the same direction at a portion close to each other,
High frequency transmission line parts characterized by
JP2004319201A 2004-11-02 2004-11-02 High frequency transmission line components Expired - Lifetime JP3835472B2 (en)

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