JP3835472B2 - High frequency transmission line components - Google Patents

Description

The present invention, high-frequency transmission line components, such as delay line components, the high-frequency switch component, the high-frequency filter component, or to high-frequency transmission line component such as a branching filter parts.

  Conventionally, for example, a high-frequency transmission line component shown in FIG. 15 has been proposed. The high-frequency transmission line component 151 includes a dielectric sheet 153 provided with one transmission line 152 made of one transmission line conductor on the surface, a dielectric sheet 153 provided with a ground conductor 154 on the surface, and a protective sheet 153. Etc. are laminated. The dielectric sheet 153 provided with the transmission line 152 on the surface is disposed between the two dielectric sheets 153 provided with the ground conductor 154 on the surface. Therefore, the high-frequency transmission line component 151 includes one transmission line 152 having a predetermined characteristic impedance in one layer between the two ground conductors 154.

  However, since the conventional high-frequency transmission line component 151 comprises the transmission line 152 in a single layer between the two ground conductors 154, the length of the transmission line per layer is increased and the component size is increased. There was a problem.

  Further, since the transmission line 152 is disposed between the two ground conductors 154 in order to shield the transmission line 152 from external electromagnetic field noise, it is formed between the transmission line 152 and the ground conductor 154. Due to the effect of stray capacitance, the characteristic impedance of the transmission line 152 is lowered. Therefore, when this high-frequency transmission line component 151 is used as a branch line such as a bias application circuit, there is a problem that the insertion loss of the main line is large and the bandwidth is narrowed.

  In Patent Document 1, a transmission line conductor is formed on each of a plurality of laminated dielectric substrates, and connected in series so that the traveling directions of the high-frequency signals propagating through these are the same direction, An electric circuit in which one or a plurality of transmission lines is formed is disclosed.

Patent Document 2 discloses a high-frequency switch in which an electric functional element such as a diode / capacitor is provided on a multilayer substrate constituting a transmission line.
Japanese National Patent Publication No. 8-508615 JP 7-31568 A

SUMMARY OF THE INVENTION An object of the present invention is to provide a high-frequency transmission line component that ensures a predetermined characteristic impedance, can be miniaturized, and has excellent frequency characteristics.

In order to achieve the above object, the present invention provides:
In a high-frequency transmission line component formed by laminating a plurality of dielectric layers and a plurality of transmission line conductors ,
Two transmission line conductors formed in a spiral shape in the same direction among the plurality of transmission line conductors are disposed on the main surface of one dielectric layer of the plurality of dielectric layers,
Another substantially S-shaped transmission line conductor of the plurality of transmission line conductors is disposed on the main surface of the other dielectric layer of the plurality of dielectric layers,
The three transmission line conductors are electrically connected in series through via holes to form one transmission line,
The traveling direction of the high-frequency signal propagating through each of the three transmission line conductors is the same direction at a portion close to each other,
It is characterized by.

  As is clear from the above description, according to the present invention, since the transmission line is composed of a plurality of layers, if the characteristic impedance is constant, the length of the transmission line conductor per layer is shorter than the conventional one. I'm sorry. As a result, the high-frequency transmission line can ensure a predetermined characteristic impedance with a smaller size than the conventional one.

  Also, if the conductor widths of the two transmission line conductors adjacent to each other in the stacking direction are made different, it is possible to suppress fluctuations in the characteristic impedance caused by the stacking deviation of the transmission line conductors.

Furthermore, since the traveling directions of the high-frequency signals propagating through the three transmission line conductors are the same in the portions close to each other, the circulation directions of the magnetic flux generated around each of the transmission line conductors are the same. As a result, by bringing the transmission line conductors close to each other , the coupling between the transmission line conductors can be increased, and a desired characteristic impedance can be easily obtained.

  Therefore, even if a transmission line is provided between two ground conductors in order to shield the transmission line from external electromagnetic field noise, transmission due to the effect of stray capacitance formed between the transmission line and the ground conductor It is possible to ensure a certain characteristic impedance by compensating for a decrease in the characteristic impedance of the line. When this high-frequency transmission line is used as a branch line for a bias application circuit or the like, it is possible to suppress a reduction in main line insertion loss and a reduction in bandwidth.

  Also, in the transmission line, by shortening the length of the part where the transmission line conductors overlap in the stacking direction, the frequency of the high-frequency signal that provides the largest coupling among the high-frequency signals propagating through the transmission line is increased. Can do.

Embodiments of a high-frequency transmission line component according to the present invention will be described below with reference to the accompanying drawings.

[First embodiment, FIGS. 1 to 3]
As shown in FIG. 1, the high-frequency transmission line component 1 includes a dielectric sheet 5 provided with transmission line conductors 2a and 2b and a via hole 6, a dielectric sheet 5 provided with a ground conductor 4, and a protective dielectric sheet. 5 etc.

  Each of the transmission line conductors 2a and 2b has a generally meander shape, the lead-out portion 3a of the transmission line conductor 2a is exposed on the left side of the front side of the sheet 5, and the lead-out portion 3b of the transmission line conductor 2b is a sheet. 5 is exposed on the right side of the side on the near side. Further, the transmission line conductors 2a and 2b are opposed to each other with the sheet 5 interposed therebetween, leaving the lead portions 3a and 3b. In the first embodiment, the transmission line conductors 2a and 2b are arranged so as to completely overlap in the stacking direction (see FIG. 3). However, the arrangement of the transmission line conductors 2a and 2b is not necessarily limited thereto. For example, the transmission line conductors 2a and 2b may be arranged so that approximately half of the conductor widths overlap. The transmission line conductors 2 a and 2 b are electrically connected in series via the via hole 6 to form one transmission line (for example, a 1/4 wavelength distributed constant line) 2.

  The ground conductor 4 is provided in a large area on the surface of the sheet 5. The lead portion 4a of the ground conductor 4 is exposed on the left side of the sheet 5, the lead portion 4b is exposed on the right side of the sheet 5, and the lead portions 4c and 4d are exposed on the left side and right side of the back side of the sheet 5, respectively. is doing.

  The conductors 2a, 2b, and 4 are made of Ag, Pd, Ag-Pd, Cu, or the like, and are formed on the surface of the sheet 5 by a known printing method, sputtering method, vacuum deposition method, or the like. The rectangular dielectric sheet 5 is obtained by kneading dielectric ceramic powder together with a binder or the like into a sheet shape.

  Each sheet 5 having the above configuration is stacked and integrally sintered to form a laminate as shown in FIG. Input terminals 11 and output terminals 13 are respectively formed at the left and right side positions of the side surface portion on the near side of the laminate, and ground terminals 12 and 14 are respectively disposed at the left and right positions of the back side surface portion. It is formed. Furthermore, ground terminals 15 and 16 are formed on the left and right side surfaces of the laminate, respectively. These terminals 11 to 16 are formed by a sputtering method, a vacuum deposition method, a coating baking method or the like.

  The input terminal 11 is electrically connected to one end of the transmission line 2, specifically to the lead-out part 3a of the transmission line conductor 2a. The output terminal 13 is electrically connected to the other end of the transmission line 2, specifically, to the lead-out part 3b of the transmission line conductor 2b. The ground terminals 12, 14, 15, and 16 are electrically connected to the lead portions 4c, 4d, 4a, and 4b of the ground conductor 4, respectively.

  As shown in FIG. 3, the high-frequency transmission line component 1 thus obtained has one transmission line 2 between two ground conductors 4 and 4 arranged above and below, two layers of transmission line conductors 2a and 2b. It consists of Therefore, if the characteristic impedance is constant, the length of the transmission line conductor per layer is about ½ of the conventional length. As a result, the transmission line component 1 can ensure a predetermined characteristic impedance with a small component size as compared with the conventional high-frequency transmission line component.

  In addition, when the high-frequency signal that has entered the input terminal 11 propagates through the transmission line 2 and is output from the output terminal 13, as shown in FIG. 1, the traveling direction a of the high-frequency signal that propagates through the transmission line conductor 2a, The traveling direction b of the high-frequency signal propagating through the transmission line conductor 2b is the same direction. Accordingly, the circumferential direction of the magnetic flux generated around each of the transmission line conductors 2a and 2b is the same direction, and the transmission line conductors 2a and 2b are electromagnetically coupled by the magnetic flux circulating in the same direction. As a result, as shown in FIG. 3, a magnetic flux φ that circulates around the transmission line conductors 2 a and 2 b is formed in a portion where the transmission line conductors 2 a and 2 b overlap in the vicinity. Therefore, for example, by setting the distance between the transmission line conductors 2a and 2b to about 25 μm, the coupling between the transmission line conductors 2a and 2b can be increased, and a desired characteristic impedance can be easily obtained.

  Therefore, even if the transmission line 2 is disposed between the two ground conductors 4 in order to shield the transmission line 2 from electromagnetic field noise from the outside, a floating formed between the transmission line 2 and the ground conductor 4. A certain characteristic impedance can be ensured by compensating for a decrease in the characteristic impedance of the transmission line 2 due to the influence of the capacitance. And when using this high frequency transmission line component 1 as branch lines, such as a bias application circuit, the fall of the insertion loss and bandwidth reduction of a main line can be suppressed.

  Further, in the transmission line 2, when the line length of the portion where the transmission line conductors 2a and 2b overlap in the stacking direction is L, a high-frequency signal having a wavelength λ of L = λ / 4 propagates through the transmission line 2. The largest bond occurs. Then, by shortening the line length L of the overlapping portion, the frequency of the high-frequency signal (hereinafter referred to as the center frequency) that can obtain the largest coupling among the high-frequency signals propagating through the transmission line 2 is increased. Can do.

  Further, the conductor width of the transmission line conductors 2a and 2b, the distance between the transmission line conductors 2a and 2b and the ground conductor 4, the overlapping area of the transmission line conductors 2a and 2b, or the distance between the transmission line conductors 2a and 2b is arbitrarily set. By setting, the characteristic impedance can be adjusted to a desired value.

[Second Embodiment, FIGS. 4 to 7]
As shown in FIG. 4, the high-frequency transmission line component 21 includes a dielectric sheet 25 provided with transmission line conductors 22a, 22b, 22c and via holes 26a, 26b, a dielectric sheet 25 provided with a ground conductor 24, and a protection. It is comprised by the dielectric material sheet 25 grade | etc.,.

  Each of the transmission line conductors 22a to 22c has a generally meander shape. The lead-out portions 23a and 23c of the transmission line conductors 22a and 22c are exposed on the left side and the right side of the front side of the sheet 25, respectively. Further, the transmission line conductors 22a to 22c are opposed to each other with the sheet 25 interposed therebetween, leaving the lead portions 23a and 23c, and are electromagnetically coupled. The transmission line conductors 22a to 22c are electrically connected in series via via holes 26a and 26b to form one transmission line 22.

  The ground conductor 24 is provided in a large area on the surface of the sheet 25. The lead portions 24 a and 24 b of the ground conductor 24 are exposed at the left side and the right side of the sheet 25, respectively, and the lead portions 24 c and 24 d are exposed at the left side and right side of the back side of the sheet 25, respectively.

  Each sheet | seat 25 which consists of the above structure is laminated | stacked, and it is set as a laminated body as shown in FIG. 5 by sintering integrally. An input terminal 31 and an output terminal 32 are formed at the left side and the right side of the side surface portion on the near side of the laminate, respectively, and ground terminals 35 and 36 are respectively provided at the left side and the right side of the back side surface portion. The ground terminals 33 and 34 are formed on the left and right side portions, respectively.

  The input terminal 31 is electrically connected to one end of the transmission line 22, more specifically, to the lead-out part 23a of the transmission line conductor 22a. The output terminal 32 is electrically connected to the other end of the transmission line 22, specifically to the lead-out part 23c of the transmission line conductor 22c. The ground terminals 33, 34, 35, and 36 are electrically connected to the lead portions 24a, 24b, 24c, and 24d of the ground conductor 24, respectively.

  As shown in FIG. 6A, the high-frequency transmission line component 21 obtained in this way has a single transmission line 22 between the two ground conductors 24, 24 arranged above and below, and transmission line conductors 22a and 22b. If the characteristic impedance is constant, the length of the transmission line conductor per layer becomes 1/3 of the conventional one. Therefore, the transmission line component 21 can be reduced in size as compared with the conventional high-frequency transmission line component.

  Here, as shown in FIG. 6B, the transmission line component is compared with a transmission line component having a structure in which only one of the transmission line conductors 22a to 22c is disposed between the pair of ground conductors 24. If the distance T1 between the ground conductor 24 and the transmission line conductor 22a (or 22b, 22c) is about 150 μm, the distance T2 between the transmission line conductors 22a to 22c can be about 25 μm. Accordingly, the dimension T4 of the transmission line component having the structure shown in FIG. 6B is about 900 μm, whereas the dimension T3 of the transmission line component 21 of the second embodiment can be suppressed to about 350 μm. .

  Also, as shown in FIG. 4, the traveling directions a, b, and c of the high-frequency signals propagating through the transmission line conductors 22a, 22b, and 22c are the same direction. Therefore, as shown in FIG. 6A, a magnetic flux φ that circulates around the transmission line conductors 22a to 22c is formed at the portion where the transmission line conductors 22a, 22b, and 22c overlap in close proximity. As a result, the transmission line component 21 can increase the coupling between the transmission line conductors 22a to 22c by securing a predetermined distance between the transmission line conductors 22a to 22c, and easily obtain a desired characteristic impedance. be able to.

  Further, in order to adjust the characteristic impedance to a predetermined value, the conductor width of the transmission line conductors 22a to 22c, the distance between the transmission line conductors 22a to 22c and the ground conductor 24, or the distance between the transmission line conductors 22a to 22c is arbitrarily set. can do. In particular, as shown in FIG. 7, if the conductor widths of the transmission line conductors 22 a and 22 c located on the outermost side and the transmission line conductor 22 b located on the inner side are different in the stacking direction, transmission is performed. This is effective because fluctuations in characteristic impedance due to misalignment of the line conductors 22a to 22c can be suppressed.

[Third embodiment, FIGS. 8 and 9]
As shown in FIG. 8, the high frequency transmission line component 41 includes a dielectric sheet 45 provided with transmission line conductors 42a and 42c, a dielectric sheet 45 provided with a transmission line conductor 42b, and a dielectric provided with a ground conductor 44. The sheet 45 is composed of a protective dielectric sheet 45 and the like.

  Each of the transmission line conductors 42a to 42c has a generally meander shape. The lead-out portions 43a and 43c of the transmission line conductors 42a and 42c are exposed at the center left side position and the right side position of the front side of the sheet 45, respectively. Further, the transmission line conductors 42a to 42c are opposed to each other with the sheet 45 interposed therebetween except for the lead portions 43a and 43c, and are electromagnetically coupled. Transmission line conductors 42a to 42c are electrically connected in series via via holes 46a and 46b to form one transmission line 42.

  The ground conductor 44 is provided on the surface of the sheet 45 in a wide area. The lead portions 44a and 44b of the ground conductor 44 are exposed at the left side and the right side of the sheet 45, respectively, and the lead portions 44c and 44d are exposed at the center left side and the right side of the back side of the sheet 45, respectively.

  Each sheet 45 having the above configuration is stacked and integrally sintered to form a laminate as shown in FIG. An input terminal 51 and an output terminal 52 are formed at the center left side and right side positions of the side surface portion on the near side of the laminate, respectively, and ground terminals 55, respectively are provided at the center left side and right side positions of the back side surface portion. 56 is formed, and ground terminals 53 and 54 are formed on the left and right side portions, respectively.

  The input terminal 51 is electrically connected to one end of the transmission line 42, specifically to the lead-out part 43a of the transmission line conductor 42a. The output terminal 52 is electrically connected to the other end of the transmission line 42, specifically, to the lead-out part 43c of the transmission line conductor 42c. The ground terminals 53, 54, 55, and 56 are electrically connected to the lead portions 44a, 44b, 44c, and 44d of the ground conductor 44, respectively.

  The high-frequency transmission line component 41 obtained in this way has one transmission line 42 between the two ground conductors 44, 44 arranged above and below, the layers of the transmission line conductors 42a, 42c, and the transmission line conductor 42b. It consists of two layers. Therefore, if the characteristic impedance is constant, the length of the transmission line conductor per layer is shorter than the conventional length. As a result, the transmission line component 41 can be reduced in size as compared with the conventional high-frequency transmission line component.

  Further, as shown in FIG. 8, the traveling directions a, b, and c of the high-frequency signals propagating through the transmission line conductors 42a, 42b, and 42c are the same direction. Therefore, the circulation direction of the magnetic flux generated around each of the transmission line conductors 42a, 42b, and 42c is the same direction. As a result, the transmission line component 41 can increase the coupling between the transmission line conductors 42a to 42c by making the distance between the transmission line conductors 42a to 42c close to each other, and can easily obtain a desired characteristic impedance. it can.

[Fourth embodiment, FIGS. 10 and 11]
As shown in FIG. 10, the high-frequency transmission line component 61 includes a dielectric sheet 65 provided with transmission line conductors 62a and 62b and a via hole 66, a dielectric sheet 65 provided with a ground conductor 64, and a protective dielectric sheet. 65 or the like. The lead-out portion 63a of the transmission line conductor 62a is exposed on the left side of the front side of the sheet 65, and the lead-out portion 63b of the transmission line conductor 62b is exposed on the left side of the front side of the sheet 65. Further, the transmission line conductors 62a and 62b are opposed to each other with the sheet 65 interposed therebetween, leaving the lead portions 63a and 63b. The transmission line conductors 62 a and 62 b are electrically connected in series via the via hole 66 to form one transmission line 62.

  The ground conductor 64 is provided in a large area on the surface of the sheet 65. The lead portions 64a and 64b of the ground conductor 64 are exposed at the left side and the right side of the sheet 65, the lead portion 64c is exposed at the right side of the front side of the sheet 65, and the lead portions 64d and 64e are at the back of the sheet 65, respectively. It is exposed at the right side and the left side of the side.

  Each sheet 65 having the above configuration is stacked and integrally sintered to form a laminate as shown in FIG. Input / output terminals 71 and ground terminals 73 are formed at the left and right positions of the side surface portion on the near side of the laminate, respectively, and ground terminals 72 and 74 are disposed at the left and right positions of the back side surface portion, respectively. The ground terminals 75 and 76 are formed on the left and right side surfaces, respectively.

  The input / output terminal 71 is electrically connected to one end of the transmission line 62, specifically, to the lead-out part 63a of the transmission line conductor 62a. The ground terminal 73 is electrically connected to the other end of the transmission line 62, specifically, the lead-out part 63 b of the transmission-line conductor 62 b and the lead-out part 64 c of the ground conductor 64. The ground terminals 72, 74, 75, and 76 are electrically connected to the lead portions 64e, 64d, 64a, and 64b of the ground conductor 64, respectively. In this embodiment, the lead-out portion 63b of the transmission line conductor 62b and the ground conductor 64 are electrically connected. However, the connection is made only when necessary for the circuit configuration, such as when matching with a circuit. It is what is done.

  The high-frequency transmission line component 61 obtained in this way has the same effects as the transmission line component 1 of the first embodiment.

[Fifth Embodiment, FIGS. 12 to 14]
In the fifth embodiment, a high-frequency switch component will be described as an example of an electronic component having a high-frequency transmission path.

As shown in FIG. 12, the high frequency switch component 81 includes a dielectric sheet 95 provided with transmission line conductors 82a and 82b, a dielectric sheet 95 provided with a ground conductor 84, and a dielectric sheet provided with capacitor conductors 85 and 86. A body sheet 95, a dielectric sheet 95 provided with transmission line conductors 87a to 87c, 88a and 88b, a dielectric sheet 95 provided with pads 107a to 110b with via holes, and the like.

  Each of the transmission line conductors 87a, 87b, 87c has a substantially spiral shape, and the lead-out portion 89a of the transmission line conductor 87a is exposed on the left side of the back side of the sheet 95, and the lead-out portion 89c of the transmission line conductor 87c. Is exposed on the left side of the front side of the sheet 95. Further, the transmission line conductors 87a to 87c are opposed to each other with the sheet 95 interposed therebetween, leaving the lead portions 89a and 89c. These transmission line conductors 87 a to 87 c are electrically connected in series via via holes 120 a and 120 b provided in the sheet 95 to form one transmission line 87. This transmission line 87 is used as a branch line of the bias circuit.

  Similarly, each of the transmission line conductors 88a and 88b has a generally meander shape, and the lead-out portion 90a of the transmission line conductor 88a is exposed to the right side of the back side of the sheet 95, and the lead-out portion 90b of the transmission line conductor 88b. Is exposed at the center of the front side of the sheet 95. Further, the transmission line conductors 88a and 88b are opposed to each other with the sheet 95 interposed therebetween, leaving the lead portions 90a and 90b. These transmission line conductors 88 a and 88 b are electrically connected in series via via holes 121 a and 121 b provided in the sheet 95 to form one transmission line 88. The transmission line 88 has a two-layer structure of transmission line conductors 88a and 88b in order to increase the characteristic impedance to about 50Ω, and the interval between the transmission line conductors 88a and 88b is increased. Further, in the case of the transmission line 88, the characteristic impedance is adjusted by making the conductor widths of the transmission line conductors 88a and 88b thicker than the transmission line conductors 87a to 87c of the transmission line 87. The transmission line 88 is used as a main line of the high frequency switch component 81.

  Each of the transmission line conductors 82 a and 82 b has a substantially spiral shape, and the lead-out portion 83 of the transmission line conductor 82 b is exposed at the center of the front side of the sheet 95. Further, the transmission line conductors 82a and 82b face each other with the sheet 95 interposed therebetween, leaving the lead-out portion 83. These transmission line conductors 82 a and 82 b are electrically connected in series via via holes 122 provided in the sheet 95 to form one transmission line 82. The characteristic impedances of the transmission lines 82, 87, and 88 have different values.

  The ground conductor 84 is provided in a large area on the surface of the sheet 95. The lead portion 84 a of the ground conductor 84 is exposed on the left side of the sheet 95, the lead portion 84 b is exposed on the right side of the sheet 95, and the lead portion 84 c is exposed at the center of the back side of the sheet 95.

  Capacitor conductors 85 and 86 are provided on the left and right sides of the surface of the sheet 95, respectively. The lead-out portion 85 a of the capacitor conductor 85 is exposed on the left side of the front side of the sheet 95. These capacitor conductors 85 and 86 face the ground conductor 84 with the sheet 95 interposed therebetween, and form the capacitors C1 and C2 together with the ground conductor 84.

  Further, the lead conductors 100, 101, 102, 103 and the relay conductor 104 are provided on the surface of the sheet 95 on which the transmission line conductor 82a is provided. One end of each of the lead conductors 100 and 101 is exposed at the left side and the right side of the back side of the sheet 95, and one end of each of the lead conductors 102 and 103 is at the center and right side of the front side of the sheet 95, respectively. Exposed. The transmission line conductor 82a is electrically connected to the pad 109b with via hole, and the lead conductors 101, 102, and 103 are electrically connected to the pads 108b, 107a, and 110a with via hole, respectively. The relay conductor 104 is electrically connected to the pads 110b and 108a with via holes, and is also electrically connected to the capacitor conductor 86 via the via holes 123a, 123b, and 123c provided in the sheet 95.

  Each sheet 95 having the above configuration is stacked and integrally sintered to form a laminate as shown in FIG. A voltage control terminal Vc1, an antenna terminal ANT, and a voltage control terminal Vc2 are formed at positions on the left side, center, and right side of the side surface portion on the near side of the laminate. A transmission circuit terminal TX, a ground terminal G3, and a reception circuit terminal RX are formed at positions on the left side, the center, and the right side of the side surface portion on the back side of the laminate. Further, ground terminals G1 and G2 are formed on the left and right side surfaces of the laminate, respectively.

  The transmission circuit terminal TX is electrically connected to one end portion of the transmission line 87, specifically, the lead portion 89a of the transmission line conductor 87a and the lead conductor 100. The reception circuit terminal RX is electrically connected to one end portion of the transmission line 88, specifically, the lead portion 90a of the transmission line conductor 88a and the lead conductor 101. The antenna terminal ANT has one end portion of the transmission line 82, specifically, a lead portion 83 of the transmission line conductor 82b, a lead conductor 102, and the other end portion of the transmission line 88, specifically, the transmission line conductor 88b. Is electrically connected to the drawer portion 90b. The voltage control terminal Vc1 is electrically connected to the other end portion of the transmission line 87, specifically, the lead portion 89c of the transmission line conductor 87c and the lead portion 85a of the capacitor conductor 85. The voltage control terminal Vc2 is electrically connected to the lead conductor 103. The ground terminals G1, G2, and G3 are electrically connected to the lead portions 84a, 84b, and 84c of the ground conductor 84, respectively.

  Further, the cathode electrode and the anode electrode of the diode element D1 are soldered to the pads 107a and 107b on the upper surface of the laminate, respectively, and the cathode electrode and the anode electrode of the diode element D2 are soldered to the pads 108a and 108b, respectively. The terminal electrodes of the capacitor element C3 are soldered to the 109a and 109b, respectively, and the terminal electrodes of the resistance element R are soldered to the pads 110a and 110b, respectively.

  FIG. 14 is an electrical equivalent circuit diagram of the high-frequency switch component 81 having the above configuration. The anode of the diode element D1 is connected to the transmission circuit terminal TX. The anode of the diode element D1 is grounded to the ground via a series circuit of a transmission line 87, which is a branch line, and a capacitor C1. A voltage control terminal Vc1 is connected to an intermediate point between the transmission line 87 and the capacitor C1. A control circuit for switching the transmission path of the high frequency switch component 81 is connected to the voltage control terminal Vc1. A series circuit of a transmission line 82 and a capacitor element C3 is connected to both ends (between the anode and the cathode) of the diode element D1. The transmission line 82 and the capacitor element C3 are for ensuring isolation when the diode element D1 is in the OFF state. Furthermore, the cathode of the diode element D1 is connected to the antenna terminal ANT.

  A receiving circuit terminal RX is connected to the antenna terminal ANT via a transmission line 88 which is a main line. Further, the anode of the diode element D2 is connected to the receiving circuit terminal RX. The cathode of the diode element D2 is grounded via the capacitor C2. A voltage control terminal Vc2 is connected to a middle point between the diode element D2 and the capacitor C2 via a resistance element R. A control circuit for switching the transmission path of the high frequency switch component 81 is connected to the voltage control terminal Vc2 in the same manner as the voltage control terminal Vc1.

  Note that, as indicated by a dotted line in FIG. 14, a resistance element Ra for voltage stabilization at the time of reverse bias application is connected in parallel to the diode element D1, or an isolator in the OFF state is connected. A capacitor element Ca for securing the adjustment may be connected. Needless to say, the resistor element Ra, the capacitor element Ca, the transmission line 82, and the capacitor element C3 may be connected to the diode element D2 as well as the diode element D1. When the high-frequency switch component 81 is used, each of the transmission circuit terminal TX, the reception circuit terminal RX, and the antenna terminal ANT is connected to the transmission circuit through a separate coupling capacitor element for bias cut. Connect to receiving circuit and antenna.

  Next, transmission / reception using the high-frequency switch component 81 will be described.

  When transmission is performed, a positive potential difference is applied between the voltage control terminals Vc1 and Vc2. Since this voltage acts as a forward bias voltage for the diode elements D1 and D2, the diode elements D1 and D2 are turned on. At this time, the DC component is cut by the capacitors C1 to C3, and the voltage applied to the voltage control terminals Vc1 and Vc2 is applied only to the circuit including the diode elements D1 and D2. Therefore, the transmission line 88 is grounded by the diode element D2, resonates at the transmission frequency, and the impedance becomes almost infinite. As a result, the transmission signal that has entered the transmission circuit terminal TX is transmitted to the antenna terminal ANT via the diode element D1 with almost no transmission to the reception circuit terminal RX. On the other hand, since the transmission line 87 is grounded via the capacitor C1, it resonates at the transmission frequency, the impedance becomes almost infinite, and the transmission signal is prevented from leaking to the ground side.

  When receiving, a negative potential difference is given between the voltage control terminals Vc1 and Vc2. Since this voltage acts as a bias voltage in the reverse direction with respect to the diode elements D1 and D2, the diode elements D1 and D2 are turned off, and the reception signal that has entered the antenna terminal ANT passes through the transmission line 88 to receive circuit. It is transmitted to the terminal RX for transmission and hardly transmitted to the terminal TX for transmission circuit. Thus, the high frequency switch component 81 can switch the transmission path of the transmission / reception signal by controlling the bias voltage applied to the voltage control terminals Vc1 and Vc2.

  In the high-frequency switch component 81 having the above configuration, two transmission lines 87 and 88 are arranged in parallel between the two ground conductors 84 and 84, and the transmission lines 87 and 88 are connected to the transmission line conductors 87 a to 87-. It is composed of three layers 87c and two layers 88a and 88b. Furthermore, one transmission line 82 is composed of two layers of transmission lines 82a and 82b. Therefore, when a certain characteristic impedance is ensured, the length of the transmission line per layer can be shorter than the conventional one, and the high-frequency switch component 81 can be downsized. Specifically, the high frequency switch component 81 in the 900 MHz band, which has conventionally been 8 × 5 × 3 mm in size, can be reduced to 5 × 4 × 2 mm.

[Other Examples]
The high-frequency transmission line component according to the present invention is not limited to the above-described embodiment, and can be variously modified within the scope of the gist thereof.

  The high-frequency transmission line may be of a spiral shape or a combination of a meander shape and a spiral shape in addition to the meander shape depending on the specifications of the occupied area and desired characteristic impedance. Further, in the above-described embodiment, the dielectric sheets on which the conductors are formed are stacked and then fired integrally. However, the present invention is not necessarily limited thereto. A sheet that has been sintered in advance may be used.

The disassembled perspective view which shows 1st Example of a high frequency transmission line. The perspective view which shows the external appearance of the high frequency transmission line shown by FIG. III-III sectional drawing of FIG. The disassembled perspective view which shows 2nd Example of a high frequency transmission line. The perspective view which shows the external appearance of the high frequency transmission line shown by FIG. (A) is VI-VI sectional drawing of FIG. 5, (B) is sectional drawing which shows a comparative example. The disassembled perspective view which shows the modification of the high frequency transmission line shown by FIG. The disassembled perspective view which shows 3rd Example of the high frequency transmission line which concerns on this invention. The perspective view which shows the external appearance of the high frequency transmission line shown by FIG. The disassembled perspective view which shows 4th Example of a high frequency transmission line. The perspective view which shows the external appearance of the high frequency transmission line shown by FIG. The disassembled perspective view which shows the Example of the electronic component which has a high frequency transmission line. The perspective view which shows the external appearance of the electronic component shown by FIG. FIG. 13 is an electrical equivalent circuit diagram of the electronic component shown in FIG. 12. The disassembled perspective view which shows the conventional high frequency transmission line.

Explanation of symbols

41 ... High-frequency transmission line component 42 ... Transmission line 42a-42c ... Transmission line conductor 45 ... Dielectric sheet

Claims (1)

In a high-frequency transmission line component formed by laminating a plurality of dielectric layers and a plurality of transmission line conductors ,
Two transmission line conductors formed in a spiral shape in the same direction among the plurality of transmission line conductors are disposed on the main surface of one of the plurality of dielectric layers,
Another substantially S-shaped transmission line conductor of the plurality of transmission line conductors is disposed on the main surface of the other dielectric layer of the plurality of dielectric layers,
The three transmission line conductors are electrically connected in series through via holes to form one transmission line,
The traveling direction of the high-frequency signal propagating through each of the three transmission line conductors is the same direction at a portion close to each other,
High frequency transmission line parts characterized by

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