JP3834427B2 - Graphite jig for cutting single crystal ingot - Google Patents

Graphite jig for cutting single crystal ingot Download PDF

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Publication number
JP3834427B2
JP3834427B2 JP18026598A JP18026598A JP3834427B2 JP 3834427 B2 JP3834427 B2 JP 3834427B2 JP 18026598 A JP18026598 A JP 18026598A JP 18026598 A JP18026598 A JP 18026598A JP 3834427 B2 JP3834427 B2 JP 3834427B2
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Japan
Prior art keywords
cutting
graphite jig
single crystal
crystal ingot
wire
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JP18026598A
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Japanese (ja)
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JP2000006138A (en
Inventor
直人 太田
章博 三浦
正豊 岡崎
泰彰 岡田
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Toyo Tanso Co Ltd
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Toyo Tanso Co Ltd
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Description

【0001】
【発明の属する技術分野】
本発明は半導体や、誘電体に用いる単結晶インゴットをスライス状に切断加工する際に、単結晶インゴットを取り付ける黒鉛治具に関する。
【0002】
【従来の技術】
単結晶インゴットからウェハーを生産する切断加工は内周刃切断装置による加工が主流であった。しかし、インゴットの大口径化に伴い、ブレード厚さの増加による材料歩留りの低下、切断時間の伸長による生産性の低下等が問題となり、インゴットの加工にはワイヤーソーによる加工に移行している。
【0003】
ワイヤーソーは、ワイヤーを高速で送りつづけ、ワイヤーが被処理物と接触すると、砥粒を含むスラリーが供給され、被処理物はスライス状に切断加工される。そのため、硬くて脆い材料を薄く切断するには非常に優れた特性を発揮する。
【0004】
最近になり、切断工程中のワイヤーに電気を流し、切断状態が検知可能な単結晶インゴット等の脆性材料の切断用ワイヤーソーが開発された(特開平8─112748号公報)。切断状態の検知には、処理物を支持する黒鉛治具に予め、切断状態検知用に2種類の電極が埋設され、切断時にワイヤーに流れている電流をそれぞれの電極が検知して行っている。各電極はそれぞれが黒鉛治具が固着されている固定金具を通じ、装置内の制御部に電流検知信号を送るようになっている。具体的には、まず、ワイヤーが、処理物に接触したときに、この処理物を通じ、導電体である黒鉛に埋設された切断開始状態を検知する一方の電極によって、ワイヤーからの電流を検知する。次に、表面を絶縁物層で被覆され、その被覆面が処理物の底面に接合されるように黒鉛治具に設置されたもう一方の電極が、ワイヤーが処理物を切断し、この電極の表面の絶縁層を破った時、即ち切断が終了した状態を検知する。このようにして、ワイヤーに流れている電流をそれぞれの電極が検知して、固定金具を通じて装置の制御部に信号を送ることにより切断状態を認識している。
【0005】
したがって、各電極が埋設されている黒鉛治具と、各電極からの信号を受け取る固定金具とは、絶縁がされていないと何方の電極からの信号であるかを装置が認識できず、装置の誤動作の原因となることがある。
【0006】
そのため、従来は、黒鉛治具と固定金具との間にガラス板等の絶縁物を挟み込み絶縁を確保していた。しかしながら、半導体製造用の単結晶インゴットの切断時にガラス板等の絶縁物を挟み込むこの従来の方法では、これら絶縁物中に含まれる不純物が混入する恐れがあるため、この絶縁物を用いないで切断が可能な方法が望まれている。また、この従来の方法の場合、ガラス板などの絶縁物という余分な部材が必要となり、更にはその接着を行うための余分な工程が増えてしまい、作業効率を向上させる上でも問題となっている。
【0007】
【発明が解決しようとする課題】
本発明は、前記問題点を鑑みなされたものであり、切断状態を検知できるワイヤー式切断装置で、単結晶インゴットを切断する際に、黒鉛治具と装置に取り付ける固定金具との絶縁を確実に行なうことが可能となる単結晶インゴット切断用黒鉛治具を提供することにある。
【0008】
【課題を解決するための手段】
すなわち、本発明の請求項1の発明は、一面が、柱状の単結晶インゴットの側面を一体的に固着可能な凹面に形成され、前記凹面と対向する他面が、切断装置側の金型に取付可能な取付面に形成され、前記インゴットの切断時に部分的に切断される黒鉛製の治具であって、前記取付面の全面に絶縁性高分子膜が形成されてなる単結晶インゴット切断用黒鉛治具である。
【0009】
黒鉛治具の取付面に予め、絶縁性高分子膜を形成することにより、接着剤によって固定金具に取り付ける際に接着剤の塗布ムラ等の取付けの不具合があっても、予め形成させた絶縁性高分子膜によって黒鉛治具と装置間の絶縁が完全に確保できる。また、絶縁物から来る不純物量も大幅に低減できる。
【0010】
請求項2の発明は、前記絶縁性高分子膜の厚みが1〜100μmである請求項1記載の単結晶インゴット切断用黒鉛治具である。
【0011】
膜厚が1μm以下の場合、膜面に傷等が発生した場合、その傷を通し、電気が流れる場合などがあるため好ましくない。また、厚みは100μm程度まで形成させることは可能であるが、さらに厚くすることにより、膜の剥離が起こりやすく、また、膜にボイドが発生し易くなり、剥離面や、ボイドを通し電流が装置に流れる場合も考えられる。これらのことから、5μm〜50μmの範囲がさらに好ましい。
【0012】
請求項3の発明は、前記切断装置は、単結晶インゴットを切断するワイヤーに電流を流して、切断状態を検知し、自動切断ができるワイヤー式切断装置である請求項1又は2記載の単結晶インゴット切断用黒鉛治具である。
【0013】
予め、黒鉛治具の固定金具への取付面に絶縁性膜を形成させていることにより、切断状態を検知する電極からの信号を装置が確実に認識でき、装置誤動作が防止できる。
【0014】
【発明の実施の形態】
以下に、本発明の好適な一実施形態を図面を参照しつつ説明する。
【0015】
図1に本発明に係る、切断用黒鉛治具の一例の概略図を示す。図において、黒鉛治具1は、黒鉛基材11と絶縁性高分子膜12とからなる。
【0016】
使用する黒鉛基材11の材質には特に制限はなく、一般的な製法で作製された黒鉛材ならば特に問題はない。この黒鉛基材11を柱状の単結晶インゴットが一体的に固定できるように円弧状の凹面11aに加工する。また、切断状態を検知する電極を埋設する孔13を加工する。ここで、被処理品が一体的に固定できるならば、凹面11aに加工する形状は特に円弧状である必要はなく、矩形状などでも構わない。
【0017】
次に、この加工された凹面11aに対向する固定金具への取付面11b一面に絶縁性高分子膜を塗布する。ここで、取付面11bは図示の如き平面に限られたものでなく、接着剤の付着性を良くするために細かい溝が形成され凹凸状になっている面等でもかまわない。また、取付面11bは装置側の取付け部に合わせて加工され、装置側の取付け部と接する部分をいう。さらに、取付面11b以外の側面11c、11dにも塗布することにより、絶縁がより確実に確保できるため好ましい。形成する絶縁性高分子膜12は耐熱温度が80℃以上のものであれば、特に制限がなく、熱可塑性樹脂、熱硬化性樹脂どちらでもよく、単独もしくは混合して用いても構わない。ここで、該黒鉛治具を固定金具に接着剤により固定する場合は、使用する接着剤との相性を考慮し、形成する高分子膜の材質を適宜選択する必要がある。機械的に固定する場合はこの限りではない。
【0018】
絶縁性高分子膜12に使用可能な樹脂は熱可塑性樹脂としてポリスチレン、ポリエチレン、ポリプロピレンなどのポリオレフィン類、ポリエチレンテレフタレートなどのポリエステル類、ポリカーボネート類、ポリアミド類、ポリイミド等があり、熱硬化性樹脂としてはエポキシ樹脂、フェノール樹脂、メラミン樹脂等が挙げられる。これら樹脂を単独若しくは2種類以上を組み合わせて塗布する。黒鉛治具の固定金具への固定に接着剤を使う場合に、相性のよい高分子は、特にエポキシ樹脂、ポリイミド樹脂等である。塗布方法は刷毛塗り、スプレー塗りなど適宜選択し塗布する。ここではエポキシ樹脂を接触面全面に約20μmの均一な厚さになるよう塗布し、樹脂を最高到達温度350℃の乾燥機内で硬化させる。
【0019】
以上のようにして形成された絶縁性高分子膜12を有する黒鉛治具1に切断完了検知用の表面が絶縁物で被覆された電極26を黒鉛治具1の14に設置し、単結晶インゴット22を接着剤により固着する。接着剤は黒鉛治具1の凹面11aの底部全面に塗布し、その上に単結晶インゴットを置く。
【0020】
図2には単結晶インゴット22が接着剤によって黒鉛治具1に固着された状態の概略図を示す。図中の21は装置に固定する際の固定金具、22は単結晶インゴット、23はワイヤーソー、24は切断開始状態を検知する電極、25は電極24からの信号を固定金具21に伝えるケーブル、26は切断完了を検知する電極、27は電極26の信号を固定金具21に伝えるケーブルを示す。
【0021】
単結晶インゴット22を固着したのち、黒鉛治具1を装置に取り付ける固定金具21に固定する。この固定には接着剤を用いて行なう方法と、機械的に万力等で締めつけて固定する方法などがある。どちらの場合においても、予め、黒鉛治具1の固定金具21への取付面11bに絶縁性高分子膜12を形成することにより絶縁を確保できる。
【0022】
切断は、固定金具21が固定されたテーブルが図中の矢印で示すように縦、横方向に駆動し、高速で回転するワイヤーソー23によって行なわれる。このワイヤーソー23には切断状態を検知する電流が流れている。ワイヤ─ソー23がインゴット22に接触したとき、ワイヤーソー23に流れる電流はインゴット22を通じ、導電体である黒鉛治具1を通じ電極24によって切断が開始されたことが検知される。つぎに、ワイヤーソー23がインゴット22を切断し、電極26に被覆されている絶縁物を破った時、電極26はワイヤーソー23からの電流を検知し、切断完了と認識し、ワイヤーソー23を離脱させる。その後、テーブルが移動し、新たに切断が開始される。以上の一連の操作を繰り返すことにより、インゴット22をスライス状に切断加工する。
【0023】
また、本発明は黒鉛治具1と固定金具21即ち切断装置との間で絶縁をとることを目的としていることから、より確実に絶縁を保つ為に固定金具21の黒鉛治具11との接触面にも前記樹脂を塗布し、絶縁性高分子膜を形成させてもよい。このように黒鉛治具1と固定金具21の両者それぞれに膜を形成させることで、より一層の絶縁性が得られる。
【0024】
なお、上記した実施の形態では、切断状態検知用に電流を流したワイヤーソーを用いた切断装置への適用例を説明したが、ワイヤー式切断装置に限らず、単結晶インゴットの切断時に電流が発生する他の切断装置にも適用できる。
【0025】
【発明の効果】
本発明は以上のように構成されており、本発明の請求項1の発明により、黒鉛治具と装置間で絶縁が確保でき、切断状態の検知の誤認が防止され、装置の誤動作が防止できる。また、不純物の混入等が防止できる。
【0026】
請求項2の発明によると、請求項1の発明による効果である黒鉛治具と装置間の絶縁の確保が、より一層確実となる。
【0027】
請求項3の発明によると、大口径の単結晶インゴットの切断が容易となり、確実に自動切断加工が可能となり、半導体製造コストの低減効果が得られる。
【図面の簡単な説明】
【図1】本発明に係る単結晶インゴット切断用黒鉛治具の概略図。
【図2】本発明に係る黒鉛治具に単結晶インゴットが固着された状態を示す概略図。
【符号の説明】
1 黒鉛治具
11 黒鉛基材
12 絶縁性高分子膜
21 固定金具
22 単結晶インゴット
23 ワイヤーソー
24 切断状態検知用電極
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a graphite jig for attaching a single crystal ingot when a semiconductor or a single crystal ingot used for a dielectric is cut into slices.
[0002]
[Prior art]
The cutting process for producing a wafer from a single crystal ingot is mainly performed by an inner peripheral cutting apparatus. However, with the increase in diameter of the ingot, there are problems such as a decrease in material yield due to an increase in blade thickness and a decrease in productivity due to an increase in cutting time, and the ingot processing is shifted to a wire saw processing.
[0003]
The wire saw keeps feeding the wire at a high speed, and when the wire comes into contact with the workpiece, slurry containing abrasive grains is supplied, and the workpiece is cut into slices. Therefore, it exhibits very excellent characteristics for thinly cutting hard and brittle materials.
[0004]
Recently, a wire saw for cutting a brittle material such as a single crystal ingot that can detect the cutting state by supplying electricity to the wire during the cutting process has been developed (Japanese Patent Laid-Open No. 8-112748). For detection of the cutting state, two types of electrodes are embedded in advance in the graphite jig that supports the workpiece to detect the cutting state, and each electrode detects the current flowing in the wire during cutting. . Each electrode is configured to send a current detection signal to a control unit in the apparatus through a fixing bracket to which a graphite jig is fixed. Specifically, first, when a wire comes into contact with a processed object, the current from the wire is detected by one electrode that detects a cutting start state embedded in graphite as a conductor through the processed object. . Next, the other electrode placed on the graphite jig so that the surface is coated with an insulator layer and the coated surface is bonded to the bottom surface of the processed object, the wire cuts the processed object, and this electrode When the surface insulating layer is broken, that is, the state where the cutting is finished is detected. In this way, each electrode detects the current flowing through the wire and sends a signal to the control unit of the apparatus through the fixture to recognize the cut state.
[0005]
Therefore, if the graphite jig in which each electrode is embedded and the fixture that receives the signal from each electrode are not insulated, the device cannot recognize which electrode the signal is from. It may cause malfunction.
[0006]
For this reason, conventionally, an insulator such as a glass plate is sandwiched between the graphite jig and the fixing bracket to ensure insulation. However, in this conventional method of sandwiching an insulator such as a glass plate when cutting a single crystal ingot for semiconductor production, impurities contained in these insulators may be mixed, so cutting without using this insulator There is a need for a method that can do this. In addition, in the case of this conventional method, an extra member such as an insulating material such as a glass plate is required, and an extra step for performing the bonding is increased, which is also a problem in improving work efficiency. Yes.
[0007]
[Problems to be solved by the invention]
The present invention has been made in view of the above problems, and is a wire-type cutting device that can detect the cutting state, and when cutting a single crystal ingot, it reliably insulates the graphite jig and the fixing bracket attached to the device. An object of the present invention is to provide a graphite jig for cutting a single crystal ingot that can be performed.
[0008]
[Means for Solving the Problems]
That is, according to the first aspect of the present invention, one surface is formed as a concave surface capable of integrally fixing a side surface of a columnar single crystal ingot, and the other surface facing the concave surface is a mold on the cutting device side. A graphite jig formed on an attachable attachment surface and partially cut when the ingot is cut, and for cutting a single crystal ingot having an insulating polymer film formed on the entire attachment surface It is a graphite jig.
[0009]
By forming an insulating polymer film on the mounting surface of the graphite jig in advance, even if there is a mounting failure such as uneven application of the adhesive when mounting to the fixture with an adhesive, the insulating property that has been formed in advance The polymer film ensures complete insulation between the graphite jig and the device. In addition, the amount of impurities coming from the insulator can be greatly reduced.
[0010]
The invention according to claim 2 is the graphite jig for cutting a single crystal ingot according to claim 1, wherein the insulating polymer film has a thickness of 1 to 100 μm.
[0011]
In the case where the film thickness is 1 μm or less, when a scratch or the like is generated on the film surface, electricity may flow through the scratch, which is not preferable. Moreover, although it is possible to form the thickness up to about 100 μm, if the thickness is further increased, peeling of the film is likely to occur, and voids are likely to be generated in the film. It is also possible to flow into From these things, the range of 5 micrometers-50 micrometers is still more preferable.
[0012]
The invention according to claim 3 is the wire-type cutting device according to claim 1 or 2, wherein the cutting device is a wire-type cutting device capable of detecting a cutting state by passing an electric current through a wire for cutting the single crystal ingot and automatically cutting the wire. This is a graphite jig for ingot cutting.
[0013]
Since the insulating film is formed in advance on the mounting surface of the graphite jig to the fixture, it is possible for the device to reliably recognize the signal from the electrode that detects the cutting state, and to prevent malfunction of the device.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
A preferred embodiment of the present invention will be described below with reference to the drawings.
[0015]
FIG. 1 shows a schematic diagram of an example of a cutting graphite jig according to the present invention. In the figure, the graphite jig 1 includes a graphite base material 11 and an insulating polymer film 12.
[0016]
The material of the graphite substrate 11 to be used is not particularly limited, and there is no particular problem if it is a graphite material produced by a general manufacturing method. The graphite substrate 11 is processed into an arc-shaped concave surface 11a so that the columnar single crystal ingot can be fixed integrally. Further, the hole 13 for embedding the electrode for detecting the cut state is processed. Here, if the article to be processed can be fixed integrally, the shape to be processed into the concave surface 11a is not particularly required to be an arc shape, and may be a rectangular shape or the like.
[0017]
Next, an insulating polymer film is applied to the entire mounting surface 11b to the fixing bracket facing the processed concave surface 11a. Here, the mounting surface 11b is not limited to a flat surface as shown in the drawing, and may be a surface having fine grooves formed in order to improve the adhesiveness of the adhesive. Further, the attachment surface 11b is a portion that is processed in accordance with the attachment portion on the apparatus side and is in contact with the attachment portion on the apparatus side. Furthermore, it is preferable to apply also to the side surfaces 11c and 11d other than the mounting surface 11b because insulation can be ensured more reliably. The insulating polymer film 12 to be formed is not particularly limited as long as the heat resistant temperature is 80 ° C. or higher, and may be either a thermoplastic resin or a thermosetting resin, and may be used alone or in combination. Here, when the graphite jig is fixed to the fixture with an adhesive, it is necessary to appropriately select the material of the polymer film to be formed in consideration of compatibility with the adhesive to be used. This is not the case when mechanically fixed.
[0018]
Resins that can be used for the insulating polymer film 12 include thermoplastic resins such as polyolefins such as polystyrene, polyethylene, and polypropylene, polyesters such as polyethylene terephthalate, polycarbonates, polyamides, polyimides, and the like. An epoxy resin, a phenol resin, a melamine resin, etc. are mentioned. These resins are applied alone or in combination of two or more. In the case where an adhesive is used for fixing the graphite jig to the fixing metal, particularly compatible polymers are epoxy resin, polyimide resin, and the like. The application method is appropriately selected such as brush coating or spray coating. Here, the epoxy resin is applied to the entire contact surface so as to have a uniform thickness of about 20 μm, and the resin is cured in a dryer having a maximum temperature of 350 ° C.
[0019]
The graphite jig 1 having the insulating polymer film 12 formed as described above is provided with an electrode 26 whose surface for detecting the completion of cutting is coated with an insulator on the graphite jig 1 14, and a single crystal ingot 22 is fixed with an adhesive. The adhesive is applied to the entire bottom surface of the concave surface 11a of the graphite jig 1, and a single crystal ingot is placed thereon.
[0020]
FIG. 2 is a schematic view showing a state where the single crystal ingot 22 is fixed to the graphite jig 1 with an adhesive. In the figure, 21 is a fixture for fixing to the apparatus, 22 is a single crystal ingot, 23 is a wire saw, 24 is an electrode for detecting a cutting start state, 25 is a cable for transmitting a signal from the electrode 24 to the fixture 21, Reference numeral 26 denotes an electrode for detecting the completion of cutting, and 27 denotes a cable for transmitting a signal of the electrode 26 to the fixture 21.
[0021]
After the single crystal ingot 22 is fixed, the graphite jig 1 is fixed to a fixing bracket 21 attached to the apparatus. This fixing includes a method of using an adhesive and a method of mechanically fastening with a vise or the like. In either case, insulation can be ensured by previously forming the insulating polymer film 12 on the attachment surface 11b of the graphite jig 1 to the fixture 21.
[0022]
The cutting is performed by a wire saw 23 that is driven at a high speed in a vertical and horizontal direction as indicated by an arrow in the figure on a table to which the fixing metal 21 is fixed. A current for detecting the cutting state flows through the wire saw 23. When the wire-saw 23 comes into contact with the ingot 22, it is detected that the current flowing through the wire saw 23 is started to be cut by the electrode 24 through the ingot 22 and through the graphite jig 1 as a conductor. Next, when the wire saw 23 cuts the ingot 22 and breaks the insulator covered with the electrode 26, the electrode 26 detects the current from the wire saw 23, recognizes that the cutting is complete, and Let go. Thereafter, the table moves and a new cutting is started. By repeating the above series of operations, the ingot 22 is cut into slices.
[0023]
In addition, since the present invention aims to insulate between the graphite jig 1 and the fixture 21, that is, the cutting device, the contact of the fixture 21 with the graphite jig 11 in order to maintain insulation more reliably. The resin may also be applied to the surface to form an insulating polymer film. In this way, by forming films on both the graphite jig 1 and the fixture 21, further insulation can be obtained.
[0024]
In the above-described embodiment, an example of application to a cutting device using a wire saw in which a current is passed for detecting a cutting state has been described. It can also be applied to other generated cutting devices.
[0025]
【The invention's effect】
The present invention is configured as described above, and according to the invention of claim 1 of the present invention, insulation can be ensured between the graphite jig and the apparatus, the misdetection of the cutting state can be prevented, and the malfunction of the apparatus can be prevented. . Further, contamination of impurities can be prevented.
[0026]
According to the invention of claim 2, the insulation between the graphite jig and the apparatus, which is the effect of the invention of claim 1, is further ensured.
[0027]
According to the invention of claim 3, it becomes easy to cut a large-diameter single crystal ingot, it is possible to surely perform an automatic cutting process, and an effect of reducing a semiconductor manufacturing cost can be obtained.
[Brief description of the drawings]
FIG. 1 is a schematic view of a graphite jig for cutting a single crystal ingot according to the present invention.
FIG. 2 is a schematic view showing a state in which a single crystal ingot is fixed to a graphite jig according to the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Graphite jig | tool 11 Graphite base material 12 Insulating polymer film 21 Fixing bracket 22 Single crystal ingot 23 Wire saw 24 Cutting state detection electrode

Claims (3)

一面が、柱状の単結晶インゴットの側面を一体的に固着可能な凹面に形成され、前記凹面と対向する他面が、切断装置側の金型に取付可能な取付面に形成され、前記インゴットの切断時に部分的に切断される黒鉛製の治具であって、前記取付面の全面に絶縁性高分子膜が形成されてなる単結晶インゴット切断用黒鉛治具。One surface is formed as a concave surface capable of integrally fixing the side surface of the columnar single crystal ingot, and the other surface facing the concave surface is formed as a mounting surface that can be attached to a die on the cutting device side. A graphite jig for cutting a single crystal ingot, which is a graphite jig partially cut at the time of cutting, wherein an insulating polymer film is formed on the entire mounting surface. 前記絶縁性高分子膜の厚みが1〜100μmである請求項1記載の単結晶インゴット切断用黒鉛治具。The graphite jig for cutting a single crystal ingot according to claim 1, wherein the insulating polymer film has a thickness of 1 to 100 μm. 前記切断装置は、単結晶インゴットを切断するワイヤーに電流を流して、切断状態を検知し、自動切断ができるワイヤー式切断装置である請求項1又は2記載の単結晶インゴット切断用黒鉛治具。3. The graphite jig for cutting a single crystal ingot according to claim 1, wherein the cutting device is a wire type cutting device capable of detecting a cutting state by passing an electric current through a wire for cutting the single crystal ingot and automatically cutting the wire.
JP18026598A 1998-06-26 1998-06-26 Graphite jig for cutting single crystal ingot Expired - Fee Related JP3834427B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18026598A JP3834427B2 (en) 1998-06-26 1998-06-26 Graphite jig for cutting single crystal ingot

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Application Number Priority Date Filing Date Title
JP18026598A JP3834427B2 (en) 1998-06-26 1998-06-26 Graphite jig for cutting single crystal ingot

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Publication number Priority date Publication date Assignee Title
KR100407647B1 (en) * 2001-11-15 2003-11-28 주식회사 실트론 A beam using in a ingots slicing process
KR100929360B1 (en) * 2007-12-27 2009-12-03 주식회사 다우빔 Silicon Ingot Cutting Base for Solar Cell
CN106003442B (en) * 2016-07-25 2018-11-30 宜昌南玻硅材料有限公司 A kind of sticking structure and method for the molten inspection silicon rod cutting in area
CN109927187A (en) * 2019-03-04 2019-06-25 山西中电科新能源技术有限公司 Detect the method and silicon chip slicer sticky stick tooling of silicon rod slicing in place
KR102207437B1 (en) * 2020-09-09 2021-01-27 (주)새한나노텍 Multiingot multisliing device using rotary device
DE112022004749T5 (en) * 2022-03-24 2024-08-14 Mitsubishi Electric Corporation Multi-wire electrical discharge machine, multi-wire electrical discharge machining method, method for producing thin plates and method for producing semiconductor wafers

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