JP3814818B2 - Fan unit with heat sink - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a fan device with a heat sink having an improved structure of a heat receiving portion, and is used, for example, for cooling an MPU (microprocessor unit) of a personal computer.
[0002]
[Problems to be solved by the invention]
For example, an MPU used in a personal computer generates high heat and must be cooled. In this cooling, for example, heat from the MPU is received by the plate and transmitted to the heat radiating portion, and the heat radiating portion is cooled by a fan. Some use heat pipes for heat transport. However, in this type of conventional fan device with a heat sink, heat reception from the MPU is not ideal, and an improvement in cooling performance has been desired.
[0003]
That is, the heat receiving part formed of a general heat conductive material has a drawback that heat receiving resistance is large and heat is not sufficiently transmitted to the heat radiating part and the fan, which are heat exchangers. For example, a plate including a heat radiating portion that is a heat sink is formed using aluminum or the like as a base for weight reduction. However, since aluminum has a small heat capacity, heat receiving resistance increases.
[0004]
Further, when the heat pipe is used, if the heat receiving resistance is large as described above, the heat receiving temperature of the heat pipe is low, the heat pipe cannot perform a sufficient heat transport operation, and the heat transport capability is also lowered.
[0005]
The present invention is intended to solve such problems, and an object thereof is to provide a fan device with a heat sink having excellent cooling performance.
[0006]
[Means for Solving the Problems]
In the fan device with a heat sink according to the first aspect of the present invention, a heat receiving portion that receives heat from the heating element , a plate that transports heat from the heat receiving portion, a heat radiating portion that is thermally connected to the plate, and air is sent to the heat radiating portion. In a fan device with a heat sink comprising a fan and a heat sink using the plate including the heat radiating portion as a heat sink, a cover that forms an air passage is fixed on the plate, and the fan is provided in the cover At the same time, the heat receiving portion and the plate are formed of different materials. In this way, by forming the heat receiving portion and the plate with different materials, a material having thermal conductivity superior to that of the plate is adopted for the heat receiving portion even if the material of the plate is limited in terms of weight or the like. It becomes possible. Thereby, the heat receiving resistance between the heating elements such as the MPU can be reduced, the heat transport amount of the plate is increased, and the cooling performance is improved.
[0007]
Furthermore, in the fan device with a heat sink according to the second aspect of the present invention, the heat transport amount is further increased and the cooling performance is further improved by carrying out heat transport with the heat pipe in combination with the plate.
[0008]
Furthermore, in the fan device with a heat sink according to the third aspect of the present invention, the heat receiving temperature of the heat pipe is increased by receiving heat directly from the heating element by the heat pipe, and therefore, the heat transport capability of the heat pipe can be reliably exhibited. Moreover, the cooling performance of the fan device with a heat sink itself is further improved.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a first embodiment of a fan device with a heat sink according to the present invention will be described with reference to FIGS. Reference numeral 1 denotes a printed wiring board, and 2 denotes an MPU as a heating element attached to the printed wiring board 1. The MPU 2 is cooled by a fan device with a heat sink.
[0010]
This fan device with a heat sink includes a plate 11 made of a material having excellent thermal conductivity, and a heat receiving portion 12 made of a material having higher thermal conductivity than the plate 11. The plate 11 and the heat receiving part 12 are thermally connected to each other by means such as contact, but thermally conductive grease or the like may be interposed in this thermal connection. The plate 11 and the heat receiving portion 12 are made of different materials. The material of the plate 11 is, for example, aluminum, and the material of the heat receiving portion 12 is, for example, copper. As a material for the plate 11 and the heat receiving portion 12, silver, gold, magnesium, or the like can be used in addition to aluminum and copper. The MPU 2 is thermally connected to the heat receiving unit 12.
[0011]
Further, a cover 14 that forms an air passage 13 is fixed to a portion of the plate 11 opposite to the heat receiving portion 12. An intake port 15 is formed on the upper surface of the cover 14, that is, the surface opposite to the plate 11, and an exhaust port 16 is formed on the side surface of the cover 14 opposite to the heat receiving unit 12. Further, a plurality of fins 17 forming a heat radiating portion thermally connected to the plate 11 are formed on the plate 11 forming the heat sink in the cover 14. Further, a fan 18 with a motor is provided in the cover 14 so as to face the intake port 15. The fan 18 is rotationally driven by a motor to generate an airflow A that is sucked into the air passage 13 in the cover 14 from the intake port 15 and discharged from the exhaust port 16 to the outside of the cover 14 through the fins 17. .
[0012]
Next, the operation of the above configuration will be described. The heat generated in the MPU 2 is received by the heat receiving section 12 and is transmitted to the plate 11, and is transported by heat through the plate 11 and carried to the fins 17. These fins 17 are cooled by the air blown from the fan 18. Thereby, MPU2 is cooled.
[0013]
According to the configuration of the embodiment, since the plate 11 is made of aluminum, the plate 11 can be reduced in weight. Although aluminum has a relatively small heat capacity, the heat receiving portion 12 that receives heat from the MPU 2 is formed of a material such as copper having a higher thermal conductivity than the aluminum that is the material of the plate 11, so that the heat receiving resistance with the MPU 2 Can be reduced, the amount of heat transport of the plate 11 is increased, and the cooling performance is improved.
[0014]
Next, a second embodiment of the fan device with a heat sink according to the present invention will be described with reference to FIGS. Note that portions corresponding to those in the first embodiment are denoted by the same reference numerals and description thereof is omitted. In the second embodiment, a heat pipe 21 serving as a heat transport member extending from a lower position of the heat receiving portion 12 to a lower position of the fin 17 is thermally connected to the lower surface of the plate 11. The heat receiving portion 12 is partially penetrated through a through hole 22 formed in the plate 11, and is thereby in direct contact with the heat pipe 21 for thermal connection.
[0015]
The heat pipe 21 injects a very small amount of working fluid (pure water) into a pipe body made of copper or the like, and is provided with a wick made of copper. When heat is applied to one end (evaporating part) of the heat pipe 21, the working liquid evaporates and moves to the other end (condensing part) of the heat pipe 21 at the speed of sound, and is cooled in this condensing part. The hydraulic fluid liquefied by this cooling returns to the evaporation section by the capillary force of the wick. Thereby, quick heat transport is possible. In the case of the present embodiment, the heat receiving portion 12 side of the heat pipe 21 is an evaporation portion, and the fin 17 side is a condensation portion.
[0016]
Therefore, after the heat generated by the MPU 2 is received by the heat receiving unit 12, the heat is transported to the fins 17 as the heat radiating unit by the heat pipe 21 in addition to the plate 11. Thereby, the amount of heat transport is further increased and the cooling performance is further improved.
[0017]
Next, a third embodiment of the fan device with a heat sink according to the present invention will be described with reference to FIG. Note that portions corresponding to those of the second embodiment are denoted by the same reference numerals and description thereof is omitted. In the third embodiment, in the second embodiment, the heat pipe 21 is passed through the through hole 23 formed in the plate 11, and one end side of the heat pipe 21 is exposed as the heat receiving portion 12 on the plate 11. This is also used as part 12.
[0018]
By directly receiving the heat generated in the MPU 2 by the heat pipe 21 in this way, the heat receiving temperature in the evaporation portion of the heat pipe 21 is increased, so that the working fluid in the heat pipe 21 is surely evaporated and the heat pipe 21 The heat transport capability can be surely exhibited, and the heat transport capability of the heat pipe 21 is improved. Therefore, the cooling performance of the fan device with a heat sink itself is further improved.
[0019]
In addition, this invention is not limited to the said Example, Various deformation | transformation implementation is possible. For example, in the above-described embodiment, the air blowing direction from the exhaust port 16 is opposite to the heat receiving portion 12, but as in the fourth embodiment shown in FIG. 6, the air blowing direction from the fin 17 and the exhaust port 16 is the heat receiving portion. It may be arranged on the 12 side. Furthermore, in the said Example, although demonstrated taking the case where the heat generating body was MPU2, this invention can be utilized also for cooling of heat generating bodies other than MPU.
[0020]
【The invention's effect】
According to the fan device with a heat sink of the first aspect of the present invention, it is possible to reduce the heat receiving resistance between the heat generating element and the cooling performance.
[0021]
Furthermore, according to the fan device with a heat sink of the invention of claim 2, the cooling performance can be further improved.
[0022]
Furthermore, according to the fan device with a heat sink of claim 3, the heat transport capability of the heat pipe can be improved, and the cooling performance can be further improved.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a first embodiment of a fan device with a heat sink according to the present invention.
FIG. 2 is an external perspective view of the same.
FIG. 3 is a cross-sectional view showing a second embodiment of the fan device with a heat sink of the present invention.
FIG. 4 is a cross-sectional view of the vicinity of the heat receiving portion.
FIG. 5 is a sectional view showing a third embodiment of the fan device with a heat sink according to the present invention.
FIG. 6 is a perspective view showing a fourth embodiment of the fan device with a heat sink according to the present invention.
[Explanation of symbols]
2 MPU (heating element)
11 plates
12 Heat receiving part
14 cover
17 Fin (heat dissipation part)
18 fans
21 Heat pipe

Claims (3)

A heat receiving part that receives heat from the heating element, a plate that transports heat from the heat receiving part, a heat radiating part thermally connected to the plate, and a fan that blows air to the heat radiating part, including the heat radiating part In a fan device with a heat sink using a plate as a heat sink, a cover that forms an air passage is fixed on the plate, the fan is provided in the cover, and the heat receiving portion and the plate are made of different materials. A fan device with a heat sink, characterized by being formed.   2. A fan device with a heat sink according to claim 1, further comprising a heat pipe for heat transport in addition to the plate.   3. The fan device with a heat sink according to claim 2, wherein the heat receiving portion is also used as a heat pipe.

Images