JP3809048B2 - Composite film - Google Patents
Composite film Download PDFInfo
- Publication number
- JP3809048B2 JP3809048B2 JP2000155167A JP2000155167A JP3809048B2 JP 3809048 B2 JP3809048 B2 JP 3809048B2 JP 2000155167 A JP2000155167 A JP 2000155167A JP 2000155167 A JP2000155167 A JP 2000155167A JP 3809048 B2 JP3809048 B2 JP 3809048B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- thickness
- composite film
- sorbitol
- boil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】
【発明の属する技術分野】
本発明は主に包装後にボイル処理されるハンバーグ、チキン等の加工食品や惣菜等の深絞り包装に好適に使用できる複合フイルムに関する。
【０００２】
【従来の技術】
従来、ボイル用フイルムとしてポリアミド樹脂／ポリエチレン樹脂構成のフイルムが広く用いられている。
【０００３】
しかしながら、ポリアミド樹脂外層品は光沢が良好で、１００℃の高温ボイルにも包装品同士が融着せず、ボイル適性が良好であるが、ポリアミド樹脂外層品は低温下（特に冷凍）では耐ピンホール性が悪いという欠点があった。
【０００４】
一方、ポリアミド樹脂／ポリエチレン樹脂からなる構成のポリアミド樹脂の外層にさらにポリエチレン層を配した複合フイルムは低温下での耐ピンホール性は良好である。
【０００５】
しかしながら、このようなフイルムは高温ボイルに耐え得る高密度のポリエチレン樹脂を外層に配する必要があるが、高密度のポリエチレン樹脂は透明性、光沢に劣るため、包装品の外観を損ねるという問題があった。
【０００６】
また、ポリエチレン樹脂／ポリアミド樹脂／ポリエチレン樹脂構成品を製袋加工する際には外層のポリエチレンがヒートシール熱板に取られ易いため、シール温度を低めに設定する必要があり製袋加工速度を上げることができないという問題があった。
【０００７】
【発明が解決しようとする課題】
本発明は従来技術の前記の問題点を解決しようとするものであり、本発明は絞り包装袋等に適した耐ピンホール性、耐ボイル性、透明性、光沢の優れた新規な複合フイルムを提供することを目的とする。
【０００８】
【課題を解決するための手段】
前記の目的は以下の手段によって達成される。
【０００９】
すなわち、本発明は最内層がヒートシール樹脂層、中間層がポリアミド樹脂層であり、最外層がソルビトール系化合物を５００〜３０００ｐｐｍの範囲で添加してあるポリエチレン樹脂層であることを特徴とする複合フイルムを提案するものであり、前記中間層に、エチレンー酢酸ビニル共重合体けん化物樹脂層を配してなること、前記中間層のポリアミド樹脂をポリオレフイン樹脂層を介して２層以上に分けてなることを含む。
【００１０】
【発明の実施の形態】
以下、本発明を更に詳細に説明する。
【００１１】
本発明は最内層がヒートシール樹脂層、中間層がポリアミド樹脂（以下、Ｎｙという。）層であり、最外層がソルビトール系化合物を５００〜３０００ｐｐｍの範囲で添加してあるポリエチレン樹脂層（以下、ＰＥという。）である複合フイルムからなるものである。
【００１２】
最外層にはＰＥを配するが、このＰＥとしては低密度ポリエチレン樹脂（以下、ＬＤＰＥという。）、直鎖状低密度ポリエチレン（以下、ＬＬＤＰＥという。）エチレンー酢酸ビニル共重合体（以下、ＥＶＡという。）が挙げられるが、耐ピンホール性を考慮すると密度０．８９〜０．９４ｇ／ｃｍ3のαオクテンタイプのものまたは重合時にメタロセン系の触媒を用いたＬＬＤＰＥが好ましい。
【００１３】
また、ＬＤＰＥは耐ピンホール性を考慮すると密度０．９１ 〜０．９３ｇ／ｃｍ3の範囲のＬＤＰＥが好ましい。
【００１４】
また、ＥＶＡは酢酸ビニル含有量が１０ 質量％以下で密度０．９１〜０．９３ｇ／ｃｍ3の範囲のＥＶＡが好ましく用いられる。
【００１５】
酢酸ビニル含有量が１０質量％を越えると耐ボイル性が劣りやすいという問題があり好ましくない。最外層のＰＥに添加するソルビトール系化合物は１００〜５０００ｐｐｍの範囲にする必要があり、好ましくは５００〜３０００ｐｐｍの範囲がよい。
【００１６】
１００ｐｐｍ未満になると透明性・光沢が悪くなり、包装品同士が融着する問題が発生し、５０００ｐｐｍを越えるとソルビトール系化合物の臭気がきつくなるという問題が発生し好ましくない。
ソルビトール系化合物としてはビス（ｐメチルベンジリデン）ソルビトール、ビス（ｐエチルベンジリデン）ソルビトール等が挙げられるが特に限定されるものではない。
中間層のＮｙとしては６ナイロン、６ー６６ナイロン、１２ナイロン、６ー１２ナイロン等が好適に使用できる。
【００１７】
中間層にはバリアー性を付与するためにエチレン酢酸ビニル共重合体（以下、ＥＶＯＨという。）層を配することが好ましく通常はＮｙ層に隣接して設けられる。このＥＶＯＨとしては、エチレン含有率３０〜６０モル％で、けん化度９５％以上のものが、製膜性、ガスバリアー性の点から好ましい。
【００１８】
上記中間層Ｎｙをポリオレフイン樹脂層を介して２層以上に分けると耐ピンホール性が向上するという効果があり好ましい。最内層のヒートシール樹脂はＬＤＰＥ、ＬＬＤＰＥ、ＥＶＡ、アイオノマー、エチレンアクリル酸メチル共重合体（以下、ＥＡＡという。）等が使用できるが、耐ピンホール性を考慮すると密度０．８９〜０．９２ｇ／ｃｍ3のαーオクテンタイプまたは重合時にメタロセン系の触媒を用いたＬＬＤＰＥが好ましい。 また、本発明の複合フイルムの製膜法は共押出法、ドライラミネート法等が挙げられるが、特に限定されるものではない。
【００１９】
最外層がポリエチレン樹脂の場合該樹脂がヒートシール熱板ヘとられ易く従来はシール温度を低めに設定する必要があったが本発明によればより高めに温度設定できるので製袋加工速度を上げることができるものである。
【００２０】
以下本発明の実施例を示すが本発明はこれに限定されえるものではない。なお、以下の実施例でソルビトールと記載したものはソルビトール系化合物を意味する。
【００２１】
【実施例】
（実施例１）
以下に示した層構成の複合フィルムをＴダイ法による共押出しによって総厚み１３０μｍの複合フイルムを製膜した。
【００２２】
ＬＬＤＰＥ１（厚み30μm）／接着樹脂（以下、ＡＤという。）（厚み10μm）／Ｎｙ（厚み40μm）／ＡＤ（厚み10μm）／ＬＬＤＰＥ２（厚み40μm）
ＬＬＤＰＥ１はＣ8タイプで密度０．９３５ｇ／ｃｍ3、ソルビトール１０００ｐｐｍ添加したＬＬＤＰＥである。
【００２３】
ＬＬＤＰＥ２はＣ8 タイプで密度０．９２１ｇ／ｃｍ3でソルビトール無添加のＬＬＤＰＥである。
【００２４】
（実施例２）
以下に示した層構成の複合フィルムを共押出しによって総厚み１３０μｍの複合フイルムを製膜した。
ＬＬＤＰＥ３（厚み30μm）／ＡＤ（厚み10μm）／Ｎｙ（厚み35μm）／ＥＶＯＨ（厚み10μm）／ＡＤ（厚み10μm）／ＬＬＤＰＥ４（厚み35μm）
ＬＬＤＰＥ３はメタロセン系の触媒を用いたＬＬＤＰＥで密度０．９００ｇ／ｃｍ3でソルビトール２０００ｐｐｍ添加したＬＬＤＰＥである。
【００２５】
ＬＬＤＰＥ４はメタロセン系の触媒を用いたＬＬＤＰＥで密度０．９００ｇ／ｃｍ3でソルビトール無添加のＬＬＤＰＥである。
【００２６】
（実施例３）
以下に示した層構成の複合フィルムを共押出しによって総厚み１３０μｍの複合フイルムを製膜した。
ＬＤＰＥ１（厚み30μm）／ＡＤ（厚み10μm）／Ｎｙ（厚み40μm）／ＡＤ（厚み10μm）／ＬＤＰＥ２（厚み40μm）
ＬＤＰＥ１は密度０．９２０ｇ／ｃｍ3でソルビトール１０００ｐｐｍ添加したＬＤＰＥである。
【００２７】
ＬＤＰＥ２は密度０．９２０ｇ／ｃｍ3でソルビトール無添加のＬＬＤＰＥである。
（実施例４）
以下に示した層構成の複合フィルムを共押出しによって総厚み１３０μｍの複合フイルムを製膜した。
ＥＶＡ１（厚み30μm）／ＡＤ（厚み10μm）／Ｎｙ（厚み35μm）／ＥＶＯＨ（厚み10μm）／ＡＤ（厚み10μm）／ＥＶＡ２（厚み35μm）
ＥＶＡ１は酢酸ビニル含有量５質量％で密度０．９２０ｇ／ｃｍ3、ソルビトール１５００ｐｐｍ添加したＥＶＡである。
【００２８】
ＥＶＡ２は酢酸ビニル含有量５質量％で密度０．９２０ｇ／ｃｍ3、ソルビトール無添加のＥＶＡである。
【００２９】
（比較例１）
以下に示した層構成の複合フィルムを水冷インフレ法による共押出しによって総厚み１３０μｍの複合フイルムを製膜した。
ＬＬＤＰＥ４（厚み30μm）／ＡＤ（厚み10μm）／Ｎｙ（厚み35μm）／ＥＶＯＨ（厚み10μm）／ＡＤ（厚み10μm）／ＬＬＤＰＥ４（厚み35μm）
【００３０】
（比較例２）
以下に示した層構成の複合フィルムをＴダイ法による共押出しによって総厚み１３０μｍの複合フイルムを製膜した。
ＬＬＤＰＥ５（厚み30μm）／ＡＤ（厚み10μm）／Ｎｙ（厚み40μm）／ＡＤ（厚み10μm）／ＬＬＤＰＥ２（厚み40μm）
ＬＬＤＰＥ５はＣ8タイプで密度０．９１８ｇ／ｃｍ3、ソルビトール５０ｐｐｍ添加したＬＬＤＰＥである。
【００３１】
（比較例３）
以下に示した層構成の複合フィルムＴダイ法によるを共押出しによって総厚み１３０μｍの複合フイルムを製膜した。
【００３２】
Ｎｙ（厚み60μm）／ＬＬＤＰＥ２（厚み70μm）
実施例１〜４、比較例１〜３の複合フイルムを使用し、深絞り包装機ＦＶ６３００（大森機械工業社製）にてハンバーグを深絞り包装してパック品を作製し、テスト評価を実施した。
【００３３】
＜評価方法＞
・耐ボイル性
ハンバーグを深絞り包装し、パック品同士を密着させて９８℃（沸騰）×３０分間ボイル処理を行い、パック品のブロッキングの有無を確認した。パック品でブロッキングしなかったものを○印、ブロッキングしたものを×印とした。
・光沢度
ＪＩＳＫ７１０５に従い光沢度を測定し、評価した。
光沢度１２５以上を○印とし、光沢度１１５〜１２５を△印とし、１１５未満を、×印とした。
・透明性
パック品のシール部の面シール部のヘーズを測定した。透明性が良いヘーズが７％以下のものを○印とし、７％を越えるものを×印とした。
【００３４】
・耐ピンホール性
深絞り包装機ＦＶ６３００（大森機械工業社）にてハンバーグを２０個深絞り包装し、−３０℃で２４時間放置後、ダンボールケースに入れて（５段積み）１ｍの高さよりコンクリート面に落下させ、ピンホール発生の有無を確認した。
【００３５】
ピンホールの発生が０パックの場合を○印とし、１〜３パック発生の場合を△印とし、４パック以上発生の場合を×印とした。
【００３６】
【表１】
表１に示すように最外層がＬＤＰＥ、ＥＶＡ、ＬＬＤＰＥ層であり、最外層中のソルビトール系化合物の含有量が５００〜３０００ｐｐｍの範囲内である実施例１〜４はいずれも耐ボイル性、光沢度、透明度、耐ピンホール性は極めて良好である。最外層のＬＬＤＰＥにソルビトール系化合物が添加されていない比較例１、ソルビトール系化合物の添加量が５００ｐｐｍ未満の比較例２は、耐ピンホール性は良好であるが耐ボイル性、光沢度、透明性が劣る。
【００３８】
また、最外層がポリアミド樹脂層からなり、該樹脂層にソルビトール系化合物が添加されていない比較例３は耐ボイル性及び光沢度、透明性は良好であるが耐ピンホール性が劣る。
【００３９】
【発明の効果】
以上述べたように、本発明によれば耐ピンホール性、耐ボイル性、透明性・光沢の優れた、ボイル用のハンバーグ、チキン等の加工食品や惣菜等の包装に好適に用いられる複合フイルムが得られる。[0001]
BACKGROUND OF THE INVENTION
The present invention mainly relates to a composite film that can be suitably used for deep-drawing packaging of processed foods such as hamburgers and chickens and side dishes that are boiled after packaging.
[0002]
[Prior art]
Conventionally, a polyamide resin / polyethylene resin film has been widely used as a film for a boil.
[0003]
However, the outer layer product of the polyamide resin has good gloss, and the packaged products do not fuse with each other even at a high temperature boil at 100 ° C., and the suitability of the boil is good. There was a drawback of poor nature.
[0004]
On the other hand, a composite film in which a polyethylene layer is further arranged on the outer layer of a polyamide resin composed of polyamide resin / polyethylene resin has good pinhole resistance at low temperatures.
[0005]
However, such a film needs to be provided with a high-density polyethylene resin that can withstand high-temperature boiling in the outer layer. However, since the high-density polyethylene resin is inferior in transparency and gloss, there is a problem that the appearance of the package is impaired. there were.
[0006]
Also, when bag forming processing of polyethylene resin / polyamide resin / polyethylene resin components, the outer layer polyethylene is easily taken by the heat seal hot plate, so it is necessary to set the sealing temperature lower and increase the bag manufacturing speed. There was a problem that I could not.
[0007]
[Problems to be solved by the invention]
The present invention is intended to solve the above-mentioned problems of the prior art, and the present invention provides a novel composite film excellent in pinhole resistance, boil resistance, transparency, and gloss suitable for drawn packaging bags and the like. The purpose is to provide.
[0008]
[Means for Solving the Problems]
The above object is achieved by the following means.
[0009]
That is, the present invention is characterized in that the innermost layer is a heat seal resin layer, the intermediate layer is a polyamide resin layer, and the outermost layer is a polyethylene resin layer to which a sorbitol compound is added in a range of 500 to 3000 ppm. A composite film is proposed, and an ethylene-vinyl acetate copolymer saponified resin layer is disposed on the intermediate layer, and the polyamide resin of the intermediate layer is divided into two or more layers via a polyolefin resin layer. Including becoming.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in more detail.
[0011]
In the present invention, the innermost layer is a heat seal resin layer, the intermediate layer is a polyamide resin (hereinafter referred to as Ny) layer, and the outermost layer is a polyethylene resin layer (hereinafter referred to as 500 to 3000 ppm) added with a sorbitol-based compound. , And PE)).
[0012]
PE is arranged in the outermost layer. As this PE, a low density polyethylene resin (hereinafter referred to as LDPE), a linear low density polyethylene (hereinafter referred to as LLDPE), an ethylene-vinyl acetate copolymer (hereinafter referred to as EVA). In consideration of pinhole resistance, α-octene type having a density of 0.89 to 0.94 g / cm 3 or LLDPE using a metallocene-based catalyst during polymerization is preferable.
[0013]
Also, LDPE is preferably LDPE having a density in the range of 0.91 to 0.93 g / cm 3 in consideration of pinhole resistance.
[0014]
As EVA, EVA having a vinyl acetate content of 10% by mass or less and a density of 0.91 to 0.93 g / cm 3 is preferably used.
[0015]
If the vinyl acetate content exceeds 10% by mass, there is a problem that the boil resistance tends to be inferior. The sorbitol-based compound added to the outermost PE needs to be in the range of 100 to 5000 ppm, and preferably in the range of 500 to 3000 ppm.
[0016]
If it is less than 100 ppm, the transparency / gloss is deteriorated, and the problem that the packaged products are fused with each other occurs. If it exceeds 5000 ppm, the problem that the odor of the sorbitol-based compound occurs is not preferable.
Examples of the sorbitol-based compound include bis (pmethylbenzylidene) sorbitol, bis (pethylbenzylidene) sorbitol, and the like, but are not particularly limited.
As Ny of the intermediate layer, 6 nylon, 6-66 nylon, 12 nylon, 6-12 nylon and the like can be suitably used.
[0017]
In order to impart barrier properties to the intermediate layer, an ethylene vinyl acetate copolymer (hereinafter referred to as EVOH) layer is preferably provided and usually provided adjacent to the Ny layer. As this EVOH, those having an ethylene content of 30 to 60 mol% and a saponification degree of 95% or more are preferable from the viewpoint of film forming properties and gas barrier properties.
[0018]
If the intermediate layer Ny is divided into two or more layers through a polyolefin resin layer, the effect of improving pinhole resistance is improved. The innermost heat seal resin can be LDPE, LLDPE, EVA, ionomer, ethylene methyl acrylate copolymer (hereinafter referred to as EAA), etc., but considering the pinhole resistance, the density is 0.89 to 0.92 g. The α-octene type of / cm 3 or LLDPE using a metallocene catalyst during polymerization is preferred. In addition, examples of the method for forming a composite film of the present invention include a coextrusion method and a dry lamination method, but are not particularly limited.
[0019]
When the outermost layer is a polyethylene resin, the resin is likely to be applied to a heat-sealing hot plate. Conventionally, it has been necessary to set a lower sealing temperature. However, according to the present invention, the temperature can be set higher, so that the bag making speed is increased. It is something that can be done.
[0020]
Examples of the present invention are shown below, but the present invention is not limited thereto. In addition, what was described as sorbitol in the following examples means a sorbitol compound.
[0021]
【Example】
Example 1
A composite film having a total thickness of 130 μm was formed by coextrusion of the composite film having the following layer structure by the T-die method.
[0022]
LLDPE1 (thickness 30 μm) / adhesive resin (hereinafter referred to as AD) (thickness 10 μm) / Ny (thickness 40 μm) / AD (thickness 10 μm) / LLDPE2 (thickness 40 μm)
LLDPE1 density 0.935 g / cm 3 at C 8 type, sorbitol 1000ppm the added LLDPE.
[0023]
LLDPE2 is a LLDPE of sorbitol additive-free at a density 0.921 g / cm 3 at C 8 type.
[0024]
(Example 2)
A composite film having a total thickness of 130 μm was formed by co-extrusion of the composite film having the layer constitution shown below.
LLDPE3 (thickness 30 μm) / AD (thickness 10 μm) / Ny (thickness 35 μm) / EVOH (thickness 10 μm) / AD (thickness 10 μm) / LLDPE4 (thickness 35 μm)
LLDPE3 is LLDPE using a metallocene-based catalyst and having a density of 0.900 g / cm 3 and 2,000 ppm of sorbitol added.
[0025]
LLDPE4 is an LLDPE using a metallocene-based catalyst and having a density of 0.900 g / cm 3 and no sorbitol added.
[0026]
Example 3
A composite film having a total thickness of 130 μm was formed by co-extrusion of the composite film having the layer constitution shown below.
LDPE1 (thickness 30 μm) / AD (thickness 10 μm) / Ny (thickness 40 μm) / AD (thickness 10 μm) / LDPE2 (thickness 40 μm)
LDPE1 is an LDPE with a density of 0.920 g / cm 3 and 1000 ppm of sorbitol added.
[0027]
LDPE2 is LLDPE having a density of 0.920 g / cm 3 and no sorbitol added.
Example 4
A composite film having a total thickness of 130 μm was formed by co-extrusion of the composite film having the layer constitution shown below.
EVA1 (thickness 30 μm) / AD (thickness 10 μm) / Ny (thickness 35 μm) / EVOH (thickness 10 μm) / AD (thickness 10 μm) / EVA2 (thickness 35 μm)
EVA1 is EVA with a vinyl acetate content of 5% by mass, a density of 0.920 g / cm 3 , and 1500 ppm of sorbitol.
[0028]
EVA2 is EVA with a vinyl acetate content of 5% by mass, a density of 0.920 g / cm 3 , and no sorbitol added.
[0029]
(Comparative Example 1)
A composite film having a total thickness of 130 μm was formed by co-extrusion of the composite film having the following layer structure by a water-cooled inflation method.
LLDPE4 (thickness 30 μm) / AD (thickness 10 μm) / Ny (thickness 35 μm) / EVOH (thickness 10 μm) / AD (thickness 10 μm) / LLDPE4 (thickness 35 μm)
[0030]
(Comparative Example 2)
A composite film having a total thickness of 130 μm was formed by coextrusion of the composite film having the following layer structure by the T-die method.
LLDPE5 (thickness 30 μm) / AD (thickness 10 μm) / Ny (thickness 40 μm) / AD (thickness 10 μm) / LLDPE2 (thickness 40 μm)
LLDPE5 density 0.918 g / cm 3 at C 8 type, sorbitol 50ppm the added LLDPE.
[0031]
(Comparative Example 3)
A composite film having a total thickness of 130 μm was formed by coextrusion using a composite film T-die method having the following layer structure.
[0032]
Ny (thickness 60μm) / LLDPE2 (thickness 70μm)
Using the composite films of Examples 1 to 4 and Comparative Examples 1 to 3, hamburgs were deep-drawn and packaged with a deep-drawing packaging machine FV6300 (manufactured by Omori Machine Industry Co., Ltd.) to produce a packed product, and test evaluation was performed. .
[0033]
<Evaluation method>
-The boil-resistant hamburger was deep-drawn and packaged, the packed products were brought into close contact with each other, and boiled at 98 ° C (boiling) for 30 minutes to check whether the packed products were blocked. Packed products that were not blocked were marked with ○, and those that were blocked were marked with ×.
Glossiness Glossiness was measured and evaluated according to JISK7105.
Glossiness of 125 or more was marked with ◯, glossiness of 115 to 125 was marked with Δ, and less than 115 was marked with x.
-The haze of the face seal part of the seal part of the transparent pack product was measured. A haze with good transparency of 7% or less was marked with ◯, and a haze exceeding 7% was marked with x.
[0034]
-20 hamburgers are deep-drawn and packed in a pinhole-resistant deep-drawing packaging machine FV6300 (Omori Machine Industry Co., Ltd.), left at -30 ° C for 24 hours, then placed in a cardboard case (5 stacks) from a height of 1 m It was dropped on the concrete surface and the presence or absence of pinholes was confirmed.
[0035]
The case where the occurrence of pinholes was 0 packs was marked with ◯, the case where 1-3 packs were generated was marked with Δ, and the case where 4 or more packs were generated was marked with X.
[0036]
[Table 1]
As shown in Table 1, the outermost layers are LDPE, EVA, and LLDPE layers, and the contents of sorbitol compounds in the outermost layer are in the range of 500 to 3000 ppm. Glossiness, transparency, and pinhole resistance are very good. Comparative Example sorbitol-based compound in the outermost layer of LLDPE is not added 1, Comparative Example 2 in amount of sorbitol-based compound is less than 500 ppm, the pinhole resistance is good resistance to boiling resistance, gloss, transparency Inferior.
[0038]
Further, Comparative Example 3 in which the outermost layer is composed of a polyamide resin layer and no sorbitol compound is added to the resin layer has good boil resistance, glossiness, and transparency, but is inferior in pinhole resistance.
[0039]
【The invention's effect】
As described above, according to the present invention, the composite film is excellent in pinhole resistance, boil resistance, transparency and gloss, and is suitably used for packaging processed foods such as hamburger and chicken for chickens, side dishes, etc. Is obtained.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000155167A JP3809048B2 (en) | 2000-05-25 | 2000-05-25 | Composite film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000155167A JP3809048B2 (en) | 2000-05-25 | 2000-05-25 | Composite film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001334616A JP2001334616A (en) | 2001-12-04 |
| JP3809048B2 true JP3809048B2 (en) | 2006-08-16 |
Family
ID=18660152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000155167A Expired - Fee Related JP3809048B2 (en) | 2000-05-25 | 2000-05-25 | Composite film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3809048B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5891835B2 (en) * | 2012-02-20 | 2016-03-23 | 四国化工株式会社 | Multi-layer film for deep drawing packaging |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09165476A (en) * | 1995-12-15 | 1997-06-24 | Chisso Corp | Multilayer hollow vessel |
| JP3795133B2 (en) * | 1996-04-30 | 2006-07-12 | 三菱樹脂株式会社 | Hydrocarbon resin film with excellent antifogging properties |
| DE19830975A1 (en) * | 1998-07-10 | 2000-01-13 | Wolff Walsrode Ag | Thermoformable, lubricious film based on polyolefins and polyamide |
-
2000
- 2000-05-25 JP JP2000155167A patent/JP3809048B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001334616A (en) | 2001-12-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5329545B2 (en) | Multilayer film with passive and active oxygen barrier layers | |
| JP6863483B2 (en) | Laminated film and food packaging bag | |
| JP6620438B2 (en) | Low adsorptive coextrusion multilayer sealant film | |
| US9988198B2 (en) | Ovenable heat-sealed package | |
| CA2488905A1 (en) | Frangible heat-sealable films for cook-in applications and packages made thereof | |
| EP3571048B1 (en) | Multilayer non-cross-linked heat-shrinkable packaging films | |
| TW201834862A (en) | Laminated film and food packaging bag | |
| JP3809048B2 (en) | Composite film | |
| EP3595986B1 (en) | Shrink bag having tear opening | |
| TWI569962B (en) | Laminated film | |
| JP2002103542A (en) | Composite film for bottom material of boiling treatment | |
| JP2015036300A (en) | Composite film for food packaging | |
| JP3760003B2 (en) | Coextrusion composite film | |
| JP3808143B2 (en) | Co-extrusion composite film | |
| JP7380189B2 (en) | Laminated film and packaging bags | |
| JP6922966B2 (en) | Multilayer film and packaging | |
| JP2005119282A (en) | Film for packaging edible meat | |
| JP7145636B2 (en) | Easy-open package | |
| JP3040694B2 (en) | Composite multilayer film | |
| JP2951340B2 (en) | Composite film for deep drawing | |
| JPH08332700A (en) | Composite multilayered film | |
| JP2023074225A (en) | Laminated film and package | |
| JP2001113645A (en) | Easy peel lid material film | |
| JP2003276125A (en) | Composite film for packaging food | |
| JPH1135075A (en) | Deep drawn packaging body |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040609 |
|
| RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20040609 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20051125 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20051130 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060130 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060215 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060417 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20060510 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20060519 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090526 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100526 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110526 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110526 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120526 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120526 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130526 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130526 Year of fee payment: 7 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| LAPS | Cancellation because of no payment of annual fees |