JP3808143B2 - Co-extrusion composite film - Google Patents

Co-extrusion composite film Download PDF

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Publication number
JP3808143B2
JP3808143B2 JP25251196A JP25251196A JP3808143B2 JP 3808143 B2 JP3808143 B2 JP 3808143B2 JP 25251196 A JP25251196 A JP 25251196A JP 25251196 A JP25251196 A JP 25251196A JP 3808143 B2 JP3808143 B2 JP 3808143B2
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Japan
Prior art keywords
layer
heat
composite film
thickness
polyamide resin
Prior art date
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Expired - Fee Related
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JP25251196A
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Japanese (ja)
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JPH1095083A (en
Inventor
和秀 石井
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Mitsubishi Plastics Inc
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Mitsubishi Plastics Inc
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Priority to JP25251196A priority Critical patent/JP3808143B2/en
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Description

【0001】
【発明の属する技術分野】
本発明は、食品の深絞り真空包装用蓋材として好適に用いられる複合フイルムに関する。
【0002】
【従来技術とその課題】
従来、食品の深絞り真空包装用蓋材の外層としては延伸ポリプロピレン樹脂フイルム、延伸ポリアミド樹脂フイルム、延伸ポリエステル樹脂フイルム等を用い、シール性フイルムやガスバリア性フイルムと貼合わせ積層して用いられていたが、剛性が強くなり過ぎて、腰が強すぎるという問題や、肉厚の厚いフイルムではシールのコーナー部分に手が当たると痛いため作業性が低下するという問題があった。
【0003】
また、フイルムの柔軟さを付与した蓋材として、無延伸ポリプロピレン樹脂フイルムや、無延伸ポリアミド樹脂フイルムを外層としたものもあるが、ヒートシール時に熱板のとられ跡(熱板転写跡)が付き易く、シール部分の透明性が劣るという問題があった。
【0004】
【課題を解決するための手段】
本発明は上記問題点を解消した、共押出複合フイルムを見出したものであり、その要旨とするところは、
エチレンービニルアルコール樹脂層をガスバリア層とする複合フイルムにおいて、シール層の反対側の最外層に熱変形温度(ASTM D648)が100℃〜180℃の範囲の耐熱性ポリアミド樹脂層を配してなる共押出複合フイルムにある。
【0005】
【発明の実施の形態】
以下、本発明をさらに詳細に説明する。
本発明の共押出複合フイルムでは、シール層の反対側の最外層に熱変形温度が特定範囲の耐熱性ポリアミド樹脂層を配する必要がある。耐熱性ポリアミド樹脂としては、上記熱変形温度範囲の樹脂としては、具体的には、層状の粘土成分の存在下でナイロンモノマーを重合し、ナノコンポジット形成したさせたポリアミド樹脂や、ナイロン6にPPO(ポリフェニレンオキシド)をアロイ化したもの等があるが、特に構造には制約されない。特に前者のナノコンポジットタイプは、エチレンービニルアルコール樹脂層との共押出しも比較的容易に行なえるという利点がある。
【0006】
上記耐熱性ポリアミド樹脂の熱変形温度はASTM D648に準拠し、18.6kgf/cm2 の荷重で測定した数値であり、この温度を100℃〜180℃の範囲、好ましくは120℃〜160℃の範囲とする必要があり、100℃未満では、真空包装の面シール時に蓋材表面が熱板にべたつき易くなり、表面が凹凸になるため透明性が低下するという問題があり、180℃を越える樹脂では、押出温度を高くする必要があり、ガスバリア層を熱劣化させるという問題がある。
【0007】
耐熱性ポリアミド樹脂層は通常のナイロン6、ナイロン6−66、ナイロン12、ナイロン6−12等に比較すると腰が強くなるため厚みは総厚みの3〜20%の範囲とする必要がある。3%未満ではシール時のシール圧により層が破壊され易い傾向があり、20%を超えると、全体の柔らかさが失なわれ耐ピンホール性が悪くなるとともに、共押出しにくい傾向がある。
【0008】
本発明複合フイルムのシール層はシール温度を極力低く押さえることが効率上好ましいため、低融点のものを用いることが好ましく、例えば、アイオノマー、エチレンーアクリル酸共重合体(EAA)、エチレンー酢酸ビニル共重合体(EVA)、エチレンーアクリル酸エステル共重合体(EEA)、エチレンーメタクリル酸共重合体(EMAA)等が挙げられる。さらに若干融点は上がるが低密度ポリエチレン(LDPE)、直鎖状低密度ポリエチレン(LLDPE)も使用できる。またイージーピールタイプについては、凝集破壊、層間剥離タイプの両者が考えられるが、その場合もできるだけシール温度が下げられるような構成にする必要がある。
【0009】
また、ガスバリア層に用いるエチレンービニルアルコール樹脂としては、エチレン含有率が30〜60モル%で、けん化度が95%以上のものが、成形性やガスバリアー性の点から好ましい。ガスバリア層の厚みは3〜30μmの範囲が好ましい。
【0010】
上記の最外層、ガスバリア層及び、シール層以外の層としては、通常のポリアミド樹脂層、例えば、ナイロン6、ナイロン66、ナイロン6−66、ナイロン6T−6I等が好適に使用でき、また、層間の接着力を向上させるためにポリオレフィン系接着樹脂層を設けてもよく、使用するポリオレフィン系接着樹脂としては、不飽和カルボン酸またはその誘導体から選ばれた少なくとも一種のモノマーをグラフトした酸変性ポリオレフィン樹脂が好適に使用でき、層間を強固に接着できる。ポリオレフィン系接着樹脂層の厚みは5μm〜20μmの範囲のものが好適に使用できる。
【0011】
以下、本発明を実施例により説明する。
【0012】
【実施例】
実施例1
層構成:
最外層(第1層):耐熱性ポリアミド樹脂(以下「耐熱性Ny」という 熱変形温度 146℃ ウベナイロン1022C2 宇部興産(株)製)、第2層:カルボン酸変性エチレンー酢酸ビニル共重合体(以下「AD」という)、第3層:ナイロン6−66(以下「Ny」という 熱変形温度 50℃)、第4層:エチレンービニルアルコール樹脂(以下「EVOH」という)、第5層:AD、シール層(第6層):エチレンー酢酸ビニル共重合体(以下「EVA」という 酢酸ビニル5%)を配した構成。
【0013】
厚み:

Figure 0003808143
耐熱性Nyの厚みは総厚みの6%
上記構成の複合フイルムを共押出し成形法により製膜した。ここで、深絞り成形機により底材を成形した(FV6300 大森機械工業(株)製)。底材の構成は、ナイロン6(6Ny 60μm)/AD(10μm)/直鎖状低密度ポリエチレン(LL 130μm)からなり共押出し成形法により製膜したものである。
【0014】
得られた底材にロースハム(400g)を収納後、上記構成の複合フイルムからなる蓋材をヒートシールし真空包装し包装体を得た。
その結果、ヒートシールによるシール部分の透明性は良好であり、また、シール部分は柔らかく、作業上問題はなかった。さらに耐ピンホール性も問題なかった。耐ピンホール性は上記包装体を10個ずつダンボール箱に詰め、0℃の雰囲気下1.5mの高さから底面落下を10回実施し、評価したものであり、全くピンホールが発生しなかった。
【0015】
実施例2
層構成:
シール層(第6層)がEVAとポリブテン−1(30重量%)との混合物である以外は実施例1と同一の構成。
厚み:
Figure 0003808143
耐熱性Nyの厚みは総厚みの6%
実施例1と同様に蓋材として評価した結果、シール部分の透明性、柔軟性、耐ピンホール性は問題なかった。
【0016】
比較例1
層構成及び厚み:
Figure 0003808143
実施例1と同様に蓋材として評価した結果、シール部分の柔軟性と、耐ピンホール性は問題なかったがシール部分の透明性に劣っていた。
【0017】
比較例2
層構成及び厚み:
Figure 0003808143
耐熱性Nyは実施例1、2と同一樹脂
耐熱性Nyの厚みは総厚みの40%
実施例1と同様に蓋材として評価した結果、シール部分の透明性は問題なかったが、シール部分が硬く、また耐ピンホール性に劣っていた。
【0018】
【発明の効果】
上述したように、本発明の共押出複合フイルムは底材とのシール部分の透明性や柔軟性、耐ピンホール性に優れ、食品の深絞り真空包装用蓋材として好適に用いられる。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a composite film suitably used as a lid for deep-drawing vacuum packaging of food.
[0002]
[Prior art and its problems]
Conventionally, stretched polypropylene resin films, stretched polyamide resin films, stretched polyester resin films, etc. have been used as outer layers of food deep-drawing vacuum packaging lids, which have been used by laminating and laminating with sealing films and gas barrier films. However, there is a problem that the rigidity is too strong and the waist is too strong, and in the case of a thick film, there is a problem that workability is deteriorated because it hurts when the corner part of the seal is touched.
[0003]
In addition, as a cover material to which the flexibility of the film is imparted, there is an unstretched polypropylene resin film or an unstretched polyamide resin film as an outer layer, but there is a trace of a hot plate (heat plate transfer trace) during heat sealing. There was a problem that it was easy to stick and the transparency of the seal portion was inferior.
[0004]
[Means for Solving the Problems]
The present invention has found a co-extruded composite film that has solved the above problems, and the gist of the present invention is as follows.
In a composite film having an ethylene-vinyl alcohol resin layer as a gas barrier layer, a heat-resistant polyamide resin layer having a heat deformation temperature (ASTM D648) in the range of 100 ° C. to 180 ° C. is disposed on the outermost layer opposite to the seal layer. Coextruded composite film.
[0005]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in more detail.
In the coextruded composite film of the present invention, it is necessary to dispose a heat-resistant polyamide resin layer having a heat deformation temperature in a specific range on the outermost layer on the opposite side of the seal layer. As the heat-resistant polyamide resin, specifically, as the resin in the above heat deformation temperature range, specifically, a polyamide resin obtained by polymerizing a nylon monomer in the presence of a layered clay component to form a nanocomposite, or nylon 6 with PPO Although there is an alloy of (polyphenylene oxide), the structure is not particularly limited. In particular, the former nanocomposite type has an advantage that it can be relatively easily coextruded with an ethylene-vinyl alcohol resin layer.
[0006]
The heat distortion temperature of the heat-resistant polyamide resin is a numerical value measured under a load of 18.6 kgf / cm 2 in accordance with ASTM D648, and this temperature is in the range of 100 ° C. to 180 ° C., preferably 120 ° C. to 160 ° C. If the temperature is lower than 100 ° C., the surface of the lid material tends to stick to the hot plate at the time of vacuum packaging surface sealing, and the surface becomes uneven, resulting in a decrease in transparency. Then, it is necessary to increase the extrusion temperature, and there is a problem that the gas barrier layer is thermally deteriorated.
[0007]
Since the heat-resistant polyamide resin layer becomes firmer than ordinary nylon 6, nylon 6-66, nylon 12, nylon 6-12, etc., the thickness needs to be in the range of 3 to 20% of the total thickness. If it is less than 3%, the layer tends to be easily broken by the sealing pressure at the time of sealing, and if it exceeds 20%, the entire softness is lost, the pinhole resistance is deteriorated, and coextrusion tends to be difficult.
[0008]
The sealing layer of the composite film of the present invention preferably has a low melting point since it is preferable to keep the sealing temperature as low as possible. For example, an ionomer, an ethylene-acrylic acid copolymer (EAA), an ethylene-vinyl acetate copolymer is preferably used. Examples thereof include a polymer (EVA), an ethylene-acrylic acid ester copolymer (EEA), and an ethylene-methacrylic acid copolymer (EMAA). Furthermore, although the melting point is slightly increased, low density polyethylene (LDPE) or linear low density polyethylene (LLDPE) can also be used. Concerning the easy peel type, both cohesive failure and delamination type are conceivable, but in that case as well, it is necessary to have a configuration in which the seal temperature can be lowered as much as possible.
[0009]
Moreover, as ethylene-vinyl alcohol resin used for a gas barrier layer, an ethylene content rate of 30-60 mol% and a saponification degree of 95% or more are preferable from the point of a moldability or gas barrier property. The thickness of the gas barrier layer is preferably in the range of 3 to 30 μm.
[0010]
As the layers other than the outermost layer, the gas barrier layer, and the seal layer, ordinary polyamide resin layers such as nylon 6, nylon 66, nylon 6-66, nylon 6T-6I can be preferably used. A polyolefin-based adhesive resin layer may be provided in order to improve the adhesive strength, and the polyolefin-based adhesive resin used is an acid-modified polyolefin resin grafted with at least one monomer selected from unsaturated carboxylic acids or derivatives thereof Can be preferably used, and the layers can be firmly bonded. A polyolefin adhesive resin layer having a thickness in the range of 5 μm to 20 μm can be suitably used.
[0011]
Hereinafter, the present invention will be described with reference to examples.
[0012]
【Example】
Example 1
Layer structure:
Outermost layer (first layer): heat-resistant polyamide resin (hereinafter referred to as “heat-resistant Ny” heat deformation temperature 146 ° C. Ube nylon 1022C2 manufactured by Ube Industries, Ltd.), second layer: carboxylic acid-modified ethylene-vinyl acetate copolymer (hereinafter referred to as “heat-resistant Ny” “AD”), third layer: nylon 6-66 (hereinafter referred to as “Ny” thermal deformation temperature 50 ° C.), fourth layer: ethylene-vinyl alcohol resin (hereinafter referred to as “EVOH”), fifth layer: AD, Seal layer (sixth layer): a configuration in which an ethylene-vinyl acetate copolymer (hereinafter referred to as “EVA”, 5% vinyl acetate) is disposed.
[0013]
Thickness:
Figure 0003808143
Heat resistant Ny thickness is 6% of total thickness
The composite film having the above structure was formed into a film by a coextrusion molding method. Here, a bottom material was molded by a deep drawing machine (FV6300, manufactured by Omori Machine Industry Co., Ltd.). The bottom material is composed of nylon 6 (6Ny 60 μm) / AD (10 μm) / linear low density polyethylene (LL 130 μm) and formed by coextrusion molding.
[0014]
After the roast ham (400 g) was stored in the obtained bottom material, the cover material composed of the composite film having the above-described structure was heat sealed and vacuum packaged to obtain a package.
As a result, the transparency of the sealed part by heat sealing was good, and the sealed part was soft and there was no problem in operation. Furthermore, there was no problem with pinhole resistance. Pinhole resistance was evaluated by packing the above packaged 10 pieces in a cardboard box 10 times, dropping 10 times from a height of 1.5 m in an atmosphere of 0 ° C, and no pinholes were generated. It was.
[0015]
Example 2
Layer structure:
The same configuration as in Example 1 except that the sealing layer (sixth layer) is a mixture of EVA and polybutene-1 (30 wt%).
Thickness:
Figure 0003808143
Heat resistant Ny thickness is 6% of total thickness
As a result of evaluation as a cover material in the same manner as in Example 1, there was no problem in the transparency, flexibility, and pinhole resistance of the seal portion.
[0016]
Comparative Example 1
Layer structure and thickness:
Figure 0003808143
As a result of evaluation as a cover material in the same manner as in Example 1, there was no problem in the flexibility and pinhole resistance of the seal portion, but the transparency of the seal portion was inferior.
[0017]
Comparative Example 2
Layer structure and thickness:
Figure 0003808143
The heat resistance Ny is the same as in Examples 1 and 2. The thickness of the resin heat resistance Ny is 40% of the total thickness.
As a result of evaluation as a cover material in the same manner as in Example 1, there was no problem in the transparency of the seal portion, but the seal portion was hard and inferior in pinhole resistance.
[0018]
【The invention's effect】
As described above, the coextruded composite film of the present invention is excellent in transparency, flexibility and pinhole resistance of a seal portion with a bottom material, and is suitably used as a lid for deep drawing vacuum packaging of food.

Claims (2)

エチレン−ビニルアルコール樹脂層をガスバリア層とする複合フイルムにおいて、シール層の反対側の最外層に熱変形温度(ASTM D648)が100℃〜180℃の範囲である、層状の粘土成分の存在下でナイロンモノマーを重合し、ナノコンポジッド成形した耐熱性ポリアミド樹脂層を配してなる深絞り包装用共押出複合フイルム。In a composite film having an ethylene-vinyl alcohol resin layer as a gas barrier layer, in the presence of a layered clay component having a heat deformation temperature (ASTM D648) in the range of 100 ° C. to 180 ° C. on the outermost layer opposite to the seal layer. A coextruded composite film for deep-drawing packaging, which is made of a heat-resistant polyamide resin layer formed by polymerizing nylon monomer and nanocomposite . 耐熱性ポリアミド樹脂層の厚みが総厚みの3〜20%の範囲である請求項1に記載の深絞り包装用共押出複合フイルム。The coextruded composite film for deep-drawing packaging according to claim 1, wherein the thickness of the heat-resistant polyamide resin layer is in the range of 3 to 20% of the total thickness.
JP25251196A 1996-09-25 1996-09-25 Co-extrusion composite film Expired - Fee Related JP3808143B2 (en)

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AU2003289374A1 (en) * 2002-12-17 2004-07-09 Ube Industries, Ltd. Laminate structure excelling in fuel permeation preventing performance
JP4571835B2 (en) * 2004-07-22 2010-10-27 三菱樹脂株式会社 Coextruded composite film for lid of distribution package
KR102504253B1 (en) * 2018-10-31 2023-02-28 (주)태우그린푸드 Vacuum Shrink Packaging Film and Manufacturing Method thereof

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JPS565761A (en) * 1979-06-29 1981-01-21 Asahi Chemical Ind Novel laminate
JP2603314B2 (en) * 1988-10-14 1997-04-23 宇部興産株式会社 Polyamide film
JPH04115927A (en) * 1990-09-07 1992-04-16 Sumitomo Bakelite Co Ltd Multilayer oriented film and its manufacture
JPH04115926A (en) * 1990-09-07 1992-04-16 Sumitomo Bakelite Co Ltd Multilayer oriented film its manufacture
JPH06198821A (en) * 1992-11-10 1994-07-19 Okura Ind Co Ltd Multilayered film for packing retort food

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