JP3807774B2 - Support block manufacturing data creation method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of manufacturing a support block for supporting and supporting a substrate provided in an electronic component mounting machine, an adhesive application device, a cream solder printing machine, and the like, and more particularly, to a method of creating support block production data.
[0002]
[Prior art]
FIGS. 8A and 8B are a perspective view and a sectional view showing a support block of a conventional substrate. As shown in FIGS. 8A and 8B, the support block of the board is constituted by a support plate 32 in which a plurality of holes 32a into which a plurality of metal support pins 31 are inserted are formed. The substrate 34 on which the electronic component 33 is mounted is supported by the support pins 31.
[0003]
[Problems to be solved by the invention]
By the way, the place on the board 34 that can be supported by the support pins 31 should be selected as a place where the electronic component 33 is not mounted and a place where the electronic component 33 is not connected to the board 34. Furthermore, a person has to determine an allowable mounting position shift of the electronic component 33. However, with the recent progress of high-density mounting of electronic components, even the number of places that can be supported by the support pins 31 has been reduced. With the conventional support structure, the support support of the substrate 34 is not stable, As a result, there is a problem that the quality of mounting is deteriorated.
[0004]
In order to solve this problem, it is conceivable to employ a support block that supports the entire surface of the substrate 34 with a relatively soft material that does not apply stress to the electronic component 33 instead of supporting the substrate 34 with the support pins 31.
[0005]
However, when adopting such a support structure, machining data for support block production must be created on the NC machine for grinding support blocks, and how can machining data be created satisfactorily? It becomes a problem.
[0006]
The present invention solves this problem, and an object of the present invention is to provide a support block manufacturing data creation method capable of satisfactorily creating support block manufacturing data.
[0007]
[Means for Solving the Problems]
The present invention in order to solve the above problems, the data for the production by the substrate on which the electronic components are mounted on one surface engraved part of the support block support blocks that support from the one surface Support block manufacturing data created based on pattern data indicating a position for soldering with an electrode of an electronic component in board CAD data, and electronic component outer shape data which is an outer dimension of the electronic component in electronic component data An electronic component to be brought into contact with the support block by selecting and inputting in advance the electronic component to be brought into contact with the support block and setting the electronic component to be in contact with the support surface of the support block for the electronic component to be brought into contact with the support block. for electronic components not the electronic component depth engraved than the thickness of the outer dimensions of the said electronic component profile data Ku, and expect the positional deviation of the electronic component from the pattern data, the electronic components from the misalignment between the external dimension of the electronic component profile data, the support surface of the digging range set by the support block of the electronic component Is set so as not to touch .
[0008]
According to the present invention, data for manufacturing support blocks can be satisfactorily created.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
According to a first aspect of the present invention, data for producing in a substrate that is an electronic component on one surface mount engraved part of the support block support blocks that support from the one surface Is produced based on the pattern data indicating the position for soldering with the electrode of the electronic component in the board CAD data and the electronic component outer shape data which is the outer dimension of the electronic component in the electronic component data. This is a data creation method, in which electronic parts to be brought into contact with the support block are selected and inputted in advance, and for the electronic parts to be brought into contact with the support block, the electronic parts are brought into contact with the support surface of the support block. the depth of the electronic component depth engraved than the thickness of the outer dimensions of the said electronic component profile data for electronic components not part And predicted positional deviation of the electronic component from the pattern data, from the positional deviation and the electronic component contour data of external dimensions, the electronic component dug by setting the range electronic component on the support surface of the support block is intended to be set which is not in contact, according to this, not only the substrate at the support block, to be able to electronic components for supporting suitable support, the support area can widely, stably supported by the support block can do.
[0010]
Below it is described with reference to embodiments of the present invention in FIGS. 1-7. FIG. 1 is a diagram for explaining a procedure for performing a support block machining data creation method according to an embodiment of the present invention.
[0011]
In FIG. 1, reference numeral 1 denotes a support block production data creation unit. In the creation unit 1, CAD data 2 for board design, and component data 4 for each electronic component for mounting included in the mounting device 3 for electronic components. Then, after performing the connecting process 5, an appropriate machining process 6 is performed on the basis of the data related to the support block production, thereby creating machining data 7 for the NC grinder having the support block manufacturing action. In this embodiment, hard rubber is used as the material for the support block. However, the present invention is not limited to this.
[0012]
Next, based on FIGS. 2 to 7, an outline of processing when creating machining data for an NC grinder for producing a support block will be described. 2 (a) and 2 (b), reference numeral 11 denotes a QFP which is an example of an electronic component. When generating support block processing data in the QFP 11 portion, first, an external shape including a lead from the mounting component data 4 is shown. The dimension data LB is read, and the engraving range of the support block 10 is determined in consideration of the preset offset value LO for each part. Next, the thickness data of the QFP 11 is read from the mounting component data 4 and the engraving depth TB is determined.
[0013]
Thus, by automatically selecting a portion that is not suitable for substrate support, such as the lead of the QFP 11, and setting the support surface of the support block 10 while deleting this selected portion, an area suitable for substrate support is appropriately set. It can be set and can be stably supported by the support block 10.
[0014]
Further, when processing data for a support block of an electronic component such as the chip component 12 is created, pattern data for soldering with the electrodes of the chip component 12 as shown in FIGS. Is read from the CAD data 2 for board design, the positional shift amount LZ of the mounted electronic component is predicted in advance, and the engraving range of the support block 10 by the shape data LB of the chip component 12 read from the mounting component data 4 13 is determined. Next, the thickness data of the chip part 12 is read from the mounting part data 4 and the engraving depth TB is determined.
[0015]
As a result, even when the electronic component is misaligned during mounting, it can be stably supported by the support block 10 without causing any trouble. Further, as shown in FIG. 4, an electronic component in which the upper cap portion is unstable even when fixed by soldering, such as an aluminum electrolytic capacitor 15, or an electronic component in which different shapes are allowed to be mounted at the same mounting position. (OR component 16) and component data 4 to be mounted on an electronic component mounting machine such as odd-shaped connector 17 may be different from actual electronic component thickness data. Therefore, when creating processing data of support block 10 This type of electronic component is designated in advance as an electronic component that is not suitable for support support by the support block 10 from the type code of the component data, and the support surface of the support block is set while deleting the designated portion. In FIG. 4, reference numeral 18 denotes a mounting nozzle of the mounting machine.
[0016]
In this way, by selecting a portion that is not suitable for contact with the support surface of the support block in advance and setting the support surface of the support block while deleting this selected portion, an appropriate area suitable for substrate support is set appropriately. Can be supported stably by the support block 10.
[0017]
Further, as shown in FIGS. 5A and 5B, a specific electronic component can be designated as a selection component 19 for use as a support support surface. That is, the engraving depth is set deeper than the thickness of all the electronic parts not specified at this time so as not to be the support support surface of the support block 10. In the cases shown in FIGS. 5A and 5B, the component surface of each electronic component of the right-handed oblique line portion 20 becomes the support support surface of the support block 10 that supports the substrate.
[0018]
In this way, the parts to be brought into contact with the support surface of the support block 10 are selected and input in advance, set so as not to contact the support surface with respect to non-target electronic components, and to the support surface with respect to target electronic components. By setting so as to be in contact with each other, not only the substrate but also a suitable electronic component can be supported by the support block 10, the support area can be increased, and the support block 10 can be stably supported.
[0019]
In FIG. 6, LD is a width region of the substrate 21, and this width region LD is a contact surface with the transport belt when the substrate 21 is transported by the component mounting machine, and is actually supported and supported by the support block 10. I can't. In this case, a part used for other purposes such as such a width region LD is set in advance when creating support block processing data by specifying in advance as a support prohibited range.
[0020]
In this manner, the area of the substrate 21 that is not desired to be used as the support surface of the support block 10 is input in advance, and the input area is set so that the electronic component or the substrate 21 does not contact the support surface. Thus, a region suitable for substrate support can be set appropriately, and the support block 10 can stably support the substrate.
[0021]
Furthermore, as shown in (a) to (c) of FIG. 7, in the support block machining data subjected to the various processes, W> w is established as compared with the preset simple machining width W. The region is set by changing to the shallowest depth of the engraving depth in contact with the boundary of the region (see FIG. 7C). According to this, the processing work of the support block 10 can be simplified.
[0022]
【The invention's effect】
As described above, according to the support block manufacturing data creation method of the present invention, by combining the board CAD data and the component data of the electronic component to be mounted, the block for supporting the board provided in the mounting machine is manufactured. Support block manufacturing data can be created, and mounting quality can be improved by stabilizing support support.
[Brief description of the drawings]
FIG. 1 is a diagram showing a procedure of a support block machining data creation method according to an embodiment of the present invention. FIGS. 2A and 2B are diagrams when the support block machining data creation method is applied to a QFP. FIG. 3A and FIG. 3B are plan views for explaining the processing outline when the support block machining data creation method is applied to a chip part. FIG. 4 is a simplified front view illustrating an example of an electronic component that is not suitable for contacting the support surface of the support block when performing the support block machining data creation method. FIG. 5A and FIG. ) Is a schematic plan view explaining that the support block machining data creation method is designated as a selected part for using a specific electronic part as a support support surface. FIG. 6 is a simplified plan view for explaining that a part used for another application is designated in advance as a support prohibited range when performing the support block machining data creation method. ) Is a plan view of a support block for performing the support block machining data creation method, a cross-sectional view of the support block before correction, and a cross-sectional view of the support block after correction. FIG. 8A is an outline of a conventional board support block. (B) is an enlarged cross-sectional view of the main part of the board and the support block when the actual board is supported by the conventional board support block with the support pins.
DESCRIPTION OF SYMBOLS 1 Creation part of support block manufacturing data 2 CAD data 3 Mounting machine 4 Component data 5 Join processing 6 Processing 7 Processing data 10 Support block 11 QFP (electronic component)
12 Chip parts (electronic parts)
15 Aluminum electrolytic capacitors (electronic parts)
16 OR parts (electronic parts)
17 Deformed connector (electronic component)
21 Substrate

Claims (1)

The data for manufacturing is one of the board on which electronic components are mounted on a surface engraved part of the support block support blocks that support from the one surface, and the electronic components of the electrode in the circuit board CAD data A support block manufacturing data creation method for creating based on pattern data indicating a position for soldering and electronic component outer shape data which is an outer dimension of the electronic component in the electronic component data,
Select and input in advance the electronic parts to be brought into contact with the support block,
For the electronic parts that come into contact with the support block, the electronic parts are in contact with the support surface of the support block.
For an electronic component that is not an electronic component to be brought into contact with the support block, the engraving depth is deeper than the thickness of the electronic component in the external dimension of the electronic component external data, and the positional deviation of the electronic component from the pattern data is predicted, A support block manufacturing data creation method in which an electronic component digging range is set from the positional deviation and the external dimension of the electronic component external data so that the electronic component does not contact the support surface of the support block.

Images