JP3797279B2 - Optical fiber array, manufacturing method thereof, and optical fiber fixing plate - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an optical transmission line forming technique using an optical fiber, and more particularly to an optical fiber array, a manufacturing method thereof, and an optical fiber fixing plate used for carrying out this manufacturing method.
[0002]
[Prior art]
Conventionally, as the two-dimensional optical fiber array, those shown in FIGS. 19 and 20 have already been proposed by the same applicant as the present application (for example, see Japanese Patent Application No. 2001-241180).
[0003]
In the optical fiber array shown in FIGS. 19 and 20, the holding hole J extends from one end of the optical fiber holder 1 to the other end.₁~ J₈And the holding hole J at the end of the holder 1₁~ J₈Positioning hole H corresponding to₁~ H₈A positioning plate 2 having a mounting hole J is mounted, and the holding hole J is mounted with the positioning plate 2 mounted.₁~ J₈To positioning hole H₁~ H₈Each of the optical fibers F₁~ F₈It is configured to be inserted and fixed. According to such an optical fiber array, since the positioning plate 2 can be easily and accurately formed by a thin film process, high-accuracy positioning is possible.
[0004]
[Problems to be solved by the invention]
According to the above-described prior art, since the metal positioning plate 2 is mounted on the end surface of the holder 1, there are the following problems. That is, when the positioning plate 2 is mounted on the end face of the holder 1, it is necessary to precisely align the corresponding positioning hole with respect to each holding hole at the micron level, and the alignment operation is not easy. If such alignment is insufficient, the optical fiber will break during insertion.
[0005]
An object of the present invention is to provide a novel optical fiber array, a manufacturing method thereof, and an optical fiber fixing plate capable of easily and accurately determining the position of an optical fiber at one end of an optical fiber holder.
[0006]
[Means for Solving the Problems]
  An optical fiber array according to the present invention includes:
  One or more optical fibers;
  An optical fiber holder provided so that an optical fiber holding hole corresponding to each optical fiber of the one or more optical fibers penetrates from one end face to the other end face, and at least one of the end faces is provided on the one end face. One provided with a positioning pin insertion hole;
  An optical fiber fixing hole corresponding to each optical fiber holding hole of the optical fiber holder penetrates from one main surface to the other main surface and is provided so as to increase in size as it approaches the other main surface.And the aboveThe other main surface is provided with a positioning pin corresponding to the positioning pin insertion hole.And an optical fiber fixing plate formed by a thin film process,
  The optical fiber fixing plate is attached to one end face of the optical fiber holder so that the positioning pin is fitted into the positioning pin insertion hole, and each optical fiber is attached to a corresponding optical fiber holding hole of the optical fiber holder, and Each optical fiber is inserted into the optical fiber fixing plate in a state of being inserted into the corresponding optical fiber fixing hole of the optical fiber fixing plate.FixedIs. Here, the hole size refers to the diameter of the hole, the dimension of one side of the hole, and the like.
[0007]
According to the optical fiber array of the present invention, the optical fiber holder and the optical fiber fixing plate are mounted by attaching the optical fiber fixing plate to one end face of the optical fiber holder so that the positioning pins are fitted into the positioning pin insertion holes. Since the alignment is performed, the corresponding optical fiber fixing hole of the optical fiber fixing plate can be easily and accurately positioned with respect to each optical fiber holding hole of the optical fiber holder.
[0008]
Further, since the optical fiber fixing plate can be formed with submicron accuracy by a thin film process, the optical fiber can be positioned with high accuracy at one end of the optical fiber holder. The optical fiber fixing plate is attached to one end surface of the optical fiber holder so that the large size end of each optical fiber fixing hole faces the other end of the optical fiber holder. An optical fiber can be easily inserted into the hole.
[0009]
  The manufacturing method of the optical fiber array according to the present invention is as follows:
  One or a plurality of optical fibers and an optical fiber holding hole corresponding to each of the one or a plurality of optical fibers are provided so as to penetrate from one end surface to the other end surface, An optical fiber holder provided with at least one positioning pin insertion hole, and an optical fiber fixing hole corresponding to each optical fiber holding hole of the optical fiber holder penetrate from one main surface to the other main surface and the other It is provided to increase in size as it approaches the main surfaceAnd the aboveThe other main surface is provided with a positioning pin corresponding to the positioning pin insertion hole.Optical fiber fixing plate formed by thin film processAnd a step of preparing
  Attaching the optical fiber fixing plate to one end surface of the optical fiber holder so that the positioning pin is fitted into the positioning pin insertion hole;
  Each optical fiber is inserted into one end face of the optical fiber holder from the other end face side of the optical fiber holder, and the corresponding optical fiber holding hole of the optical fiber holder and the optical fiber fixing plate are attached. Inserting into a corresponding optical fiber fixing hole of
  The optical fiber fixing plate is attached to one end face of the optical fiber holder, and each optical fiber is inserted into the corresponding optical fiber holding hole of the optical fiber holder and the corresponding optical fiber fixing hole of the optical fiber fixing plate. And fixing each optical fiber to the optical fiber fixing plate with
Is included.
[0010]
According to the manufacturing method of the optical fiber array of the present invention, the above-described optical fiber array of the present invention can be easily and accurately manufactured.
[0011]
In the manufacturing method of the optical fiber array according to the present invention, the optical fiber fixing plate is attached to one end face of the optical fiber holder, and each optical fiber corresponds to the corresponding optical fiber holding hole of the optical fiber holder and the optical fiber fixing plate. Each optical fiber is fixed to the optical fiber holder while being inserted into the optical fiber fixing hole, and one optical surface of the optical fiber fixing plate is polished while each optical fiber is fixed to the optical fiber fixing plate and the optical fiber holder. May be flattened. If it does in this way, the edge part of an optical fiber holder can be made into a flat and clean surface, and a coupling loss can be reduced when couple | bonding with another optical device.
[0012]
In the manufacturing method of the optical fiber array of the present invention, the positioning pin insertion hole of the optical fiber holder has a depth larger than the length of the positioning pin of the optical fiber fixing plate, and the optical fiber fixing plate is attached to one of the optical fiber holders. Each optical fiber is attached to the end face and inserted into the corresponding optical fiber holding hole of the optical fiber holder and the corresponding optical fiber fixing hole of the optical fiber fixing plate. The optical fiber fixing plate and the positioning pin are removed in a state where the optical fiber is fixed to the optical fiber fixing plate and the optical fiber holder in a state where the optical fiber is fixed to the optical fiber fixing plate and the optical fiber holder. Remove the holder section shallower than the predetermined position on one end face side of the optical fiber holder and flatten the removal surface. It may be to maintain the fixed state of the optical fiber from the predetermined position at one end surface of the optical fiber holder in the back of the holder section, using the remaining portion of the positioning pin insertion holes as the guide pin insertion holes by. In this way, another optical device (or connector) can be easily and accurately coupled to one end face side of the optical fiber holder using the guide pin insertion hole and the guide pin.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 shows a state before assembly of a two-dimensional optical fiber array according to an embodiment of the present invention. A cross-section after assembly along the line XX ′ of FIG. 1 is shown in FIG. A cross-section after assembly along the line YY 'is shown in FIG.
[0014]
The optical fiber holder 10 is made of ceramic (for example, zirconia), alumina, quartz, or the like, and is also called a ferrule. The holder 10 is a cylindrical thing as an example, and the diameter of the holder 10 can be about 6 mm.
[0015]
The holder 10 is provided with a holding hole group H including a number of optical fiber holding holes respectively corresponding to a large number (for example, 64) of optical fibers (optical fiber core wires) in the optical fiber group F. A number of optical fiber holding holes in the holding hole group H extend substantially in parallel in the holder 10 and are arranged in a matrix on one end face of the holder 10, and between adjacent optical fiber holding holes. The pitch P (see FIG. 5) can be 0.25 mm. Optical fiber holding hole H in holding hole group H₁₁~ H₁₄2 are provided so as to penetrate from one end face of the holder 10 to the other end face and increase in size (diameter) as approaching the other end face as shown in FIG.₁₁~ H₁₄Each has an optical fiber F₁₁~ F₁₄Can be inserted. Such a hole configuration is defined as H in the holding hole group H.₁₁~ H₁₄The same applies to other holding holes. The reason for increasing the diameter of each holding hole as it approaches the other end face of the holder 10 is to facilitate the insertion of the corresponding optical fiber.
[0016]
As shown in FIGS. 1 and 3, positioning pin insertion holes 10 a to 10 c are provided on one end face of the holder 10. Of the pin insertion holes 10a to 10c, 10c is a center hole, and the outer shape of the holder 10 is processed using the center hole 10c as a reference. The external dimension accuracy of 0.5 μm or less is possible, and the eccentric accuracy of the center hole 10 c with respect to the external shape can be ± 0.5 μm or less. Each pin insertion hole such as 10a can have a diameter of 1 mm and a length of 3 mm.
[0017]
The optical fiber fixing plate 12 has a circular shape corresponding to the shape of one end face of the holder 10, and is made of a metal such as a Ni—Fe alloy having a thickness of about 50 μm, for example. The fixing plate 12 is provided with a fixing hole group S including a number of optical fiber fixing holes corresponding to the number of optical fiber holding holes in the holding hole group H, respectively. A large number of optical fiber fixing holes in the fixing hole group S are arranged in a matrix, and the pitch between adjacent optical fiber fixing holes can be 0.25 mm, the same as the pitch between the optical fiber holding holes. .
[0018]
Optical fiber fixing hole S in the fixing hole group S₁₁~ S₁₄2 are provided so as to penetrate from one main surface of the fixing plate 12 to the other main surface and increase in size (diameter) as approaching the other main surface as shown in FIG. S₁₁~ S₁₄Each has an optical fiber F₁₁~ F₁₄Can be inserted. Such a hole configuration is represented by S in the fixed hole group S.₁₁~ S₁₄The same applies to other fixing holes. The reason why the diameter of each fixing hole is increased as it approaches the other main surface of the fixing plate 12 is to facilitate the insertion of the corresponding optical fiber.
[0019]
As shown in FIG. 2, a fixing hole S is formed on one main surface of the fixing plate 12.₁₁~ S₁₄Bonding holes M each having a size (diameter) larger than each of the small size ends.₁₁~ M₁₄Is provided and S₁₁~ S₁₄Similar adhesive holes are provided for the other fixing holes. M₁₁The bonding holes such as are used for bonding and fixing the optical fiber to the fixing plate 12. In FIG. 1, for simplicity, M₁₁The illustration of the bonding holes such as is omitted.
[0020]
Positioning pins 12a, 12b, and 12c to be fitted in the pin insertion holes 10a, 10b, and 10c of the holder 10 are provided on the other main surface of the fixing plate 12, respectively. Each positioning pin has a cylindrical shape as an example. It is. The length L of each positioning pin such as 12a is smaller than the depth D of each pin insertion hole such as 10a as shown in FIG. That is, in this embodiment, the depth D of each pin insertion hole such as 10a is set larger than the length L of each positioning pin such as 12a as described later with reference to FIG. When the polishing process is performed, a part of the pin insertion hole such as 10a is left, and this remaining part is used as a guide pin insertion hole. However, when the remaining portion of the pin insertion hole such as 10a is not used, the depth D of the pin insertion hole such as 10a and the length L of the positioning pin such as 12a may be substantially equal.
[0021]
When assembling the optical fiber array of FIG. 1, the fixing plate 12 is held in the holder so that the positioning pins 12a to 12c of the fixing plate 12 are fitted into the pin insertion holes 10a to 10c of the holder 10 as shown in FIG. 10 is attached to one end face. When fixing by fitting is insufficient, the fixing plate 12 may be bonded to the holder 10 using an adhesive. By attaching (fixing) the fixing plate 12 to one end face of the holder 10, the fixing plate 12 is aligned with the holder 10, and each fixing hole of the fixing plate 12 corresponds to a corresponding holding hole of the holder 10. Are aligned so as to communicate with each other.
[0022]
In such an alignment state, as shown in FIG.₁₁And fixing hole S₁₁And bonding hole M₁₁Communication hole, holding hole H₁₂And fixing hole S₁₂And bonding holes₁₂Communication hole, holding hole H₁₃And fixing hole S₁₃And bonding hole M₁₃Communication hole and holding hole H₁₄And fixing hole S₁₄And bonding hole M₁₄In the communication hole with the optical fiber F from the other end face (right side in FIG. 2) of the holder 10₁₁, F₁₂, F₁₃And F₁₄Are inserted through each. The same applies to the communication holes of the other holding holes, the fixing holes, and the bonding holes. Since the optical fiber is inserted into each holding hole and each fixing hole from the large size end, the insertion operation is facilitated. Each optical fiber is bonded and fixed to the fixing plate 12 and the holder 10 while being inserted through the corresponding holding hole, fixing hole and bonding hole.
[0023]
FIG. 4 shows an example of the bonding / fixing structure at this time.₁₁, F₁₂It shows about. When gluing, the fixing hole S₁₁, S₁₂And adhesive hole M₁₁, M₁₂Are pre-filled with UV (ultraviolet) curable adhesive. And optical fiber F₁₁And F₁₂As shown in FIG.₁₁, S₁₁, M₁₁Communication hole and hole H₁₂, S₁₂, M₁₂The optical fiber F is inserted in the communication holes of₁₁, F₁₂The adhesive is cured by irradiating the adhesive with ultraviolet light. As a result, the optical fiber F₁₁Is an adhesive layer A made of a cured adhesive.₁₁, B₁₁Is fixed to the fixing plate 12 and the holder 10 by the optical fiber F₁₂Is an adhesive layer A made of a cured adhesive.₁₂, B₁₂Thus, the fixing plate 12 and the holder 10 are fixed.
[0024]
Thereafter, the optical fiber protruding from the front surface (one main surface) of the fixing plate 12 is cut. Then, the front surface of the fixing plate 12 is subjected to a polishing process to obtain F₁₁Remaining part after cutting of optical fiber such as₁₁The bulging portion of the adhesive layer such as is removed, and the front surface of the fixing plate 12 is flattened. In this way, the coupling loss can be reduced when the optical fiber array according to the assembly is used in combination with another optical device on the front surface of the fixed plate 12.
[0025]
In such a use example, the adhesive layer B₁₁, B₁₂May be omitted, or each optical fiber may be fixed to the fixing plate 12 using a plated metal instead of the adhesive. Moreover, as a grinding | polishing process, you may perform a diagonal grinding | polishing process as needed.
[0026]
FIG. 5 shows another example of use of the optical fiber array described above, and the same parts as those in FIGS.
[0027]
In the example of FIG. 5, after each optical fiber is bonded and fixed to the fixing plate 12 and the holder 10 as shown in FIG. 4, ZZ ′ is formed on one end face side of the holder 10 as shown in FIGS. The fixing plate 12 and the positioning pins 12a to 12c are removed by polishing to the position of the line, and the holder section in the holder 10 near the pins 12a to 12c is removed to flatten the removal surface. The position of the ZZ ′ line is a position determined deeper than the tip position of each pin such as 12a and shallower than the bottom of each pin insertion hole such as 10a, and each optical fiber is positioned from the position of the ZZ ′ line. B in the back holder section₁₁It is fixed by an adhesive layer. For this reason, when polishing to the Z-Z 'line position, each optical fiber becomes B in the holder section at the back from the Z-Z' line position.₁₁It remains in a state where it is fixed by an adhesive layer. Further, the pin insertion holes 10a to 10c all remain deeper than the Z-Z 'line position.
[0028]
Of the pin insertion holes 10a to 10c, for example, the remaining portions of 10a and 10b are used as guide pin insertion holes. That is, the guide pins 14a and 14b are fitted into the remaining portions of the holes 10a and 10b, respectively, and the pins 14a and 14b protrude from the flat surface corresponding to the ZZ ′ line position by a predetermined length in the fitted state. Let If another optical device (or connector) having a pin insertion hole corresponding to the pins 14a and 14b is prepared, the pins 14a and 14b are fitted into the pin insertion holes of the other optical device (or connector), respectively. The optical fiber array of FIG. 5 can be coupled to other optical devices (or connectors) with low coupling loss. In this case, the coaxiality can be obtained with the external accuracy of the holder 10, and the holder 10 can be positioned in the rotational direction with the positional accuracy of the pins 14a and 14b.
[0029]
As the guide pin insertion holes, the remaining portions of the pin insertion holes 10a and 10c, the remaining portions of the pin insertion holes 10b and 10c, or the remaining portions of the pin insertion holes 10a to 10c may be used. Alternatively, another optical device (or connector) having guide pins 14 a and 14 b may be used, and the guide pins 14 a and 14 b may be inserted into the guide pin insertion holes of the holder 10 to achieve the coupling.
[0030]
According to the above-described embodiment, the fixing plate 12 is attached to the one end surface of the holder 10 so that the positioning pins 12a to 12c are fitted in the pin insertion holes 10a to 10c, thereby fixing the fixing plate 12 to the holder 10. Precise positioning. The fitting accuracy between the positioning pin such as 12a and the pin insertion hole such as 10a is set to ± 0.2 μm, and S with respect to the positioning pin such as 12a₁₁If the positional accuracy of the fixed holes such as is set to ± 0.1 μm, the positional accuracy of each optical fiber end face with respect to the outer shape of the holder 10 can be within 1 μm. In addition, the accuracy of the diameter of each fixing hole of the fixing plate 12 can be 1 μm or less with respect to the outer diameter of the optical fiber. Therefore, at one end of the holder 10, F₁₁It is possible to position the optical fiber with high accuracy.
[0031]
6-13 shows an example of the manufacturing method of an optical fiber fixing plate.
[0032]
In the process of FIG. 6, for example, a Cu / Cr laminate (a laminate in which a Cu layer is stacked on a Cr layer) 22 is formed by sputtering as one of the principal surfaces of a substrate 20 made of glass or quartz. The Cr layer is for improving the adhesion of the Cu layer to the substrate 20, and the thicknesses of the Cr layer and the Cu layer can be about 20 nm and 200 nm, respectively. After the Cu / Cr laminate 22 is formed, the resist layers R corresponding to the desired adhesion hole patterns by photolithography processing, respectively.₁~ R₈Is formed on the Cu / Cr laminate 22.
[0033]
Next, in the step of FIG. 7, the resist layer 24, R₁₁~ R₁₈Form. The resist layer 24 is formed on the Cu / Cr laminate 22 so as to have a circular hole 24a corresponding to the plane pattern of the desired fixing plate, and the resist layer R₁₁~ R₁₈The resist layer R has a circular shape corresponding to a desired fixed hole pattern in the circular hole 24a.₁~ R₈Form on top.
[0034]
In the process of FIG. 8, the resist layer R₁~ R₈, R₁₁~ R₁₈, 24 as a mask, the optical fiber fixing plate 12 made of a Ni—Fe alloy layer is formed by selective plating of a Ni—Fe alloy. At this time, the fixing plate 12 is R₁₁Each of the resist layers is formed so as to move away from each resist layer as it goes upward (having a fixing hole whose size increases as it goes upward).
[0035]
FIG. 14 shows the growth state of the plating layer 12 at this time as a resist layer R.₁, R₁₁Is illustrated. Resist layer R on the Cu / Cr laminate 22₁When viewed from a point P in the vicinity of, the illustrated points Q and R on the surface of the plating layer 12 are equidistant. Since the plating layer 12 isotropically grows, the resist layer R is directly below.₁At the point R where the plating base is not exposed, the plating layer 12 extends from the point P to the resist layer R.₁Overcoming the growth. For this reason, the plating layer (fixed plate) 12 is formed so as to move away from each resist layer as it proceeds upward around each resist layer.
[0036]
In the process of FIG. 9, resist layers Ra to Rc are formed on the fixing plate 12 for photolithography. The resist layers Ra to Rc are formed in a pattern that exposes pin fixing portions corresponding to the roots of the positioning pins 12a to 12c in the fixing plate 12 shown in FIGS.
[0037]
In the step of FIG. 10, a resist layer 26 is formed on the upper surface of the substrate by photolithography. The resist layer 26 is formed so as to have pin forming holes 26a to 26c that are continuous with the pin fixing portions exposed by the resist layers Ra to Rc, respectively, and have a larger size (diameter) than the corresponding pin fixing portions.
[0038]
In the process of FIG. 11, positioning pins 12 a to 12 b made of a Ni—Fe alloy are formed on the fixing plate 12 by selective plating of a Ni—Fe alloy using the resist layers Ra to Rc and 26 as a mask. At this time, each pin such as 12a is formed so as to decrease in diameter (having a mountain-shaped top) as it goes upward.
[0039]
FIG. 15 illustrates the growth state of the plating layer 12a at this time. Since the resist layer Ra that exposes the pin fixing portion whose diameter is smaller than that of the pin formation hole 26a is provided on the plating base layer (fixing plate) 12, the plating growth is performed in the vicinity of the inner periphery in the pin formation hole 26a as compared with the central portion. Is delayed. For this reason, the plating layer (positioning pin) 12a is formed to have a mountain-shaped top. When each pin such as 12a has a mountain-shaped top, the operation of inserting each pin into the corresponding pin insertion hole can be performed smoothly.
[0040]
In the process shown in FIG.₁~ R₈, R₁₁~ R₁₈, Ra to Rc, 24, 26 are removed, and the fixing plate 12 has a fixing hole S.₁₁~ S₁₈And adhesive hole M₁₁~ M₁₈Is granted. As a result, in the fixing plate 14, the fixing hole S is so penetrated from one main surface to the other main surface and increases in size as it approaches the other main surface.₁₁~ S₁₈And the fixing hole S₁₁~ S₁₈Bonding holes M each having a size larger than the small size end in succession to the small size end₁₁~ M₁₈Is formed. Fixing hole S₁₅~ S₁₈Is a fixing hole S along the line X-X 'shown in FIGS.₁₁~ S₁₄Immediately below the array of holes S₁₁~ S₁₄Correspond to the four fixing holes arranged in a line along the arrangement direction.
[0041]
In the process of FIG. 13, the Cu layer in the Cu / Cr laminate 22 is removed by etching, and the fixing plate 12 having the positioning pins 12 a to 12 c is separated from the substrate 20. On the substrate 20, the Cr layer 22a remains.
[0042]
As the optical fiber fixing plate 12 shown in FIGS.₁₁~ M₁₄You may use what abbreviate | omitted adhesion holes, such as. In this case, the fixing plate 12 can be manufactured as shown in FIGS. 16 to 18, two positioning pins 12 a and 12 b and six fixing holes S are used as the fixing plate 12.₂₁~ S₂₆The example which manufactures what has is shown.
[0043]
In the process of FIG. 16, after the Cu / Cr layer 22 is formed on the surface of the substrate 20 in the same manner as described above with reference to FIG. 6, the resist layer 28, R is formed on the Cu / Cr stack 22 by photolithography.₂₁~ R₂₆Form. The resist layer 28 is formed so as to have a circular hole corresponding to the plane pattern of the desired fixing plate, and the resist layer R₂₁~ R₂₆Are formed so as to have a circular pattern corresponding to a desired fixing hole in the circular hole and to increase in size (diameter) from the top to the bottom. Where layer R₂₁~ R₂₆When using a stepper (reduced projection exposure apparatus) to obtain a forward tapered resist shape like
(1) A method of setting the focus position in the resist,
(2) A method of setting a small exposure amount at the bottom of the resist (a method for positive resist),
(3) Method of gradually changing the transmittance of the mask portion in the exposure mask (increasing the transmittance as it goes to the bottom of the resist)
Any one of the methods can be used.
[0044]
Resist layer R₂₁~ R₂₆After forming the resist layer 28, R₂₁~ R₂₆A fixed plate 12 made of a Ni—Fe alloy layer is formed by selective plating of a Ni—Fe alloy using as a mask.
[0045]
In the process of FIG. 17, the fixing plate 12 and the resist layer R₂₁~ R₂₆, 28, a substrate 30 such as glass or quartz is attached to the surface opposite to the substrate 20 side through an adhesive layer 32. Then, by removing the Cu layer of the Cu / Cr layer 22 by an etching process, the fixing plate 12 and the resist layer R held by the substrate 30 are removed.₂₁~ R₂₆, 28, the substrate 20 is separated. FIG. 17 shows the fixing plate 12 and the resist layer R.₂₁~ R₂₆, 28 with the substrate up. As the substrate 30, a peelable resin substrate may be used.
[0046]
In the process of FIG. 18, the positioning pins 12a and 12b are formed on the fixing plate 12 by the same process as described above with reference to FIGS.₂₁~ R₂₆Fixing hole S corresponding to₂₁~ S₂₆Is granted. Each fixing hole is formed to increase in size as the corresponding resist layer progresses from the upper part to the lower part in the process of FIG. 16 and is turned upside down in the process of FIG. As the size increases, it is formed. Thereafter, the adhesive layer 32 is removed by chemical treatment or the like, and the positioning pins 12a and 12b and the fixing holes S are removed from the substrate 30.₂₁~ S₂₆The fixing plate 12 having the above is separated.
[0047]
According to the manufacturing method of the optical fiber fixing plate described above, the hole S₁₁~ S₁₈, M₁₁~ M₁₈, S₂₁~ S₂₆The position and size of the pin and the pitch between the fixing holes and the position and size of the positioning pins such as 12a and 12b can be set with submicron accuracy such as 0.5 μm, and the fixing plate 12 can be manufactured easily and accurately. Can do.
[0048]
The present invention is not limited to the above-described embodiment, and can be implemented in various modifications. For example, the following changes are possible.
[0049]
(1) The shape of the optical fiber holder 10 is not limited to a cylindrical shape, and may be a polygonal column (for example, a triangular column, a quadrangular column, or a hexagonal column).
[0050]
(2) The shape of the holding hole or pin insertion hole of the optical fiber holder 10 and the fixing hole of the fixing plate 12 is not limited to a circular shape, but may be a polygon (for example, a triangle, a square, a parallelogram, a hexagon) or the like. May be. When the pin insertion hole of the holder 10 is polygonal, the cross-sectional shape of the positioning pin is also a polygonal shape corresponding to the polygonal shape of the pin insertion hole. In this case, since the positioning pin does not rotate, one positioning pin can be used.
[0051]
(3) This invention is applicable not only to a two-dimensional optical fiber array but also to a one-dimensional optical fiber array or a single-core optical fiber holder (positioning of one optical fiber).
[0052]
【The invention's effect】
As described above, according to the present invention, the optical fiber fixing plate is fitted to the positioning pin insertion hole provided on one end face of the optical fiber holder so that the positioning pin provided on the optical fiber fixing plate is fitted to the optical fiber holder. Since the optical fiber holder and the optical fiber fixing plate are positioned on one end face of the optical fiber holder, the corresponding optical fiber fixing hole of the optical fiber fixing plate can be easily set to each optical fiber holding hole of the optical fiber holder. And can be positioned with high accuracy. The optical fiber fixing plate can be easily and accurately manufactured using a thin film process. Therefore, it is possible to easily and accurately position each optical fiber at one end of the optical fiber holder.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a state before assembly of a two-dimensional optical fiber array according to an embodiment of the present invention.
2 is a cross-sectional view taken along line X-X ′ of FIG. 1 after the optical fiber array is assembled.
3 is a cross-sectional view taken along the line Y-Y ′ of FIG. 1 after the optical fiber array is assembled.
FIG. 4 is an enlarged sectional view showing an optical fiber bonding portion.
FIG. 5 is a perspective view showing an example of use of an optical fiber array.
FIG. 6 is a cross-sectional view showing a Cu / Cr lamination forming step and a resist layer forming step in an example of a method for producing an optical fiber fixing plate according to the present invention.
7 is a cross-sectional view showing a resist layer forming step subsequent to the resist layer forming step of FIG. 6. FIG.
8 is a cross-sectional view showing a selective plating step subsequent to the step of FIG.
9 is a cross-sectional view showing a resist layer forming step that follows the step of FIG. 8. FIG.
10 is a cross-sectional view showing a resist layer forming step that follows the step of FIG. 9. FIG.
11 is a cross-sectional view showing a selective plating step following the step of FIG.
12 is a cross-sectional view showing a resist removal step subsequent to the step of FIG.
13 is a cross-sectional view showing a separation step that follows the step of FIG. 12. FIG.
14 is a cross-sectional view showing a growth state of a plating layer in the selective plating process of FIG.
15 is a perspective view showing a growth state of a plating layer in the selective plating process of FIG.
FIG. 16 is a cross-sectional view showing a Cu / Cr lamination forming step, a resist layer forming step, and a selective plating step in another example of the method for producing an optical fiber fixing plate according to the present invention.
17 is a cross-sectional view showing a substrate replacement step subsequent to the selective plating step of FIG.
18 is a cross-sectional view showing a process of providing positioning pins and fixing holes in the fixing plate using the substrate of FIG.
FIG. 19 is a perspective view showing a conventional two-dimensional optical fiber array.
20 is a cross-sectional view taken along line A-A ′ of FIG.
[Explanation of symbols]
10: optical fiber holder, 10a to 10c: positioning pin insertion hole, 12: optical fiber fixing plate, 12a to 12c: positioning pin, 14a, 14b: guide pin, 20, 30: substrate, 22: Cu / Cr laminate, 22a : Cr layer, 24, 26, 28: Resist layer, S: Fixed hole group, H: Holding hole group, F: Optical fiber group, M₁₁~ M₁₄: Adhesive hole, S₁₁~ S₁₄: Fixed hole, H₁₁~ H₁₄: Holding hole, F₁₁~ F₁₄: Optical fiber, R₁~ R₈, R₁₁~ R₁₈, Ra to Rc, R₂₁~ R₂₆: Resist layer.

Claims (5)

One or more optical fibers;
An optical fiber holder provided so that an optical fiber holding hole corresponding to each optical fiber of the one or more optical fibers penetrates from one end face to the other end face, and at least one of the end faces is provided on the one end face. One provided with a positioning pin insertion hole;
Rutotomoni wherein is provided so as to increase the size approaches the main surface of and said other optical fiber fixing hole penetrating from one main surface to the other main surface corresponding to the optical fiber holding hole of said optical fiber holder positioning pins corresponding to the positioning pin insertion holes provided we are on the other main surface, and an optical fiber fixing plate formed by a thin film process,
The optical fiber fixing plate is attached to one end face of the optical fiber holder so that the positioning pin is fitted into the positioning pin insertion hole, and each optical fiber is attached to a corresponding optical fiber holding hole of the optical fiber holder, and The optical fiber array which fixed each optical fiber to the said optical fiber fixing plate in the state inserted in the corresponding optical fiber fixing hole of the said optical fiber fixing plate. One or a plurality of optical fibers and an optical fiber holding hole corresponding to each of the one or a plurality of optical fibers are provided so as to penetrate from one end surface to the other end surface, An optical fiber holder provided with at least one positioning pin insertion hole, and an optical fiber fixing hole corresponding to each optical fiber holding hole of the optical fiber holder penetrate from one main surface to the other main surface and the other major surface positioning pins corresponding to the positioning pin insertion holes provided we are in Rutotomoni the other main surface provided so as to increase the size approaches the, the optical fiber fixing plate formed by a thin film process Steps to prepare,
Attaching the optical fiber fixing plate to one end surface of the optical fiber holder so that the positioning pin is fitted into the positioning pin insertion hole;
Each optical fiber is inserted into one end face of the optical fiber holder from the other end face side of the optical fiber holder, and the corresponding optical fiber holding hole of the optical fiber holder and the optical fiber fixing plate are attached. Inserting into a corresponding optical fiber fixing hole of
The optical fiber fixing plate is attached to one end face of the optical fiber holder, and each optical fiber is inserted into the corresponding optical fiber holding hole of the optical fiber holder and the corresponding optical fiber fixing hole of the optical fiber fixing plate. And fixing each optical fiber to the optical fiber fixing plate. The optical fiber fixing plate is attached to one end face of the optical fiber holder, and each optical fiber is inserted into the corresponding optical fiber holding hole of the optical fiber holder and the corresponding optical fiber fixing hole of the optical fiber fixing plate. Each optical fiber is fixed to the optical fiber holder, and one main surface of the optical fiber fixing plate is polished and flattened in a state where each optical fiber is fixed to the optical fiber fixing plate and the optical fiber holder. The method for producing an optical fiber array according to claim 2. The positioning pin insertion hole of the optical fiber holder has a depth larger than the length of the positioning pin of the optical fiber fixing plate, the optical fiber fixing plate is attached to one end face of the optical fiber holder, and each light Each optical fiber is deeper than the position of the tip of the positioning pin in the optical fiber holder with the fiber inserted into the corresponding optical fiber holding hole of the optical fiber holder and the corresponding optical fiber fixing hole of the optical fiber fixing plate. The optical fiber fixing plate and the positioning pin are removed in a state where each optical fiber is fixed to the optical fiber fixing plate and the optical fiber holder while being fixed in a holder section at a depth from a predetermined position shallower than the bottom of the pin insertion hole. And removing a holder section shallower than the predetermined position on one end face side of the optical fiber holder. By flattening the surface, the fixed state of each optical fiber is maintained in the holder section at the back from the predetermined position on one end face side of the optical fiber holder, and the remaining portion of the positioning pin insertion hole is replaced with the guide pin insertion hole. The method for producing an optical fiber array according to claim 2, wherein: One or more optical fiber holding holes are provided so as to penetrate from one end face to the other end face, and at least one positioning pin insertion hole is provided on the one end face. An optical fiber fixing plate used by being attached to
Rutotomoni wherein is provided so as to increase the size approaches the main surface of and said other optical fiber fixing hole penetrating from one main surface to the other main surface corresponding to the optical fiber holding hole of said optical fiber holder other positioning pin to be fitted into the positioning pin insertion holes provided we are in the main surface, the optical fiber fixing plate formed by a thin film process.

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