JP3761870B2 - Wire bonding apparatus and wire bonding method - Google Patents

Wire bonding apparatus and wire bonding method Download PDF

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Publication number
JP3761870B2
JP3761870B2 JP2003105768A JP2003105768A JP3761870B2 JP 3761870 B2 JP3761870 B2 JP 3761870B2 JP 2003105768 A JP2003105768 A JP 2003105768A JP 2003105768 A JP2003105768 A JP 2003105768A JP 3761870 B2 JP3761870 B2 JP 3761870B2
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Prior art keywords
wire
bonding
ball
moving
conductor
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JP2004311844A (en
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康一郎 岡村
康博 手嶋
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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  • Engineering & Computer Science (AREA)
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  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、ワイヤボンディング装置およびワイヤボンディング方法に関し、特に能率よくワイヤボンディングが可能なワイヤボンディング装置およびワイヤボンディング方法に関するものである。
【０００２】
【従来の技術】
従来から、ボンディングパッドなどの第一導電層と、上記第一導電層上に形成された第一ボールと、上記第一導電層と間隔をあけて配置された第二導電層と、上記第二導電層上に形成された第二ボールと、上記第一ボールと第二ボールを接続するボンディングワイヤとを備え、上記ボンディングワイヤを機械的に変形して上記第二ボールを形成した、半導体装置は、例えば後記する特許文献１から公知である。
【０００３】
【特許文献１】
特開２００２−２８０４１４号公報（請求項１、段落番号００１５、図１〜図５）
【０００４】
上記の従来技術では、ボンディングワイヤを機械的に変形して上記第二ボールを形成する場合には、例えばボンディングワイヤを第二導電層に仮接合した後に、ボンディングワイヤを機械的に変形して第二ボールを形成する。
【０００５】
また従来技術では、一般的に、第一ボンディングパッド上での第一ボールの形成作業、第二ボンディングパッド上での第二ボールの形成作業、および第一ボールと第二ボールとのワイヤボンディング作業が個別の工程で行われてきている。例えば、第二ボンディングパッド上に第二ボールとしてのスタッドバンプを形成したのち、キャピラリーを使用して第一ボンディングパッド上に第一ボールを実装し、ついでボンディングワイヤをループを形成しながら、前段階にて形成したスタッドバンプと第一ボールとをワイヤボンディングする。
【０００６】
ところで、従来のワイヤボンディング装置およびワイヤボンディング方法では、上記した複数の工程を別々に行うので作業能率が悪いのみならず、以下の諸問題もある。即ち、第二ボンディングパッド側がチップなどの実装場所が小さい個所や、ダメージを加えてはいけない個所、実装強度が確保し難い個所などである場合は、ボンディングをすることが困難な場合がしばしばある。また２回同一の場所にボンディングする場合は、１回目の位置と２回目の位置がズレてしまう可能性があり、さらに第一ボール上からワイヤのループを形成するので、低ループボンディグが困難である。
【０００７】
【発明が解決しようとする課題】
本発明は、斯界における如上の実情に鑑みて、複数のボンディングパッド上に能率よくボンディング用ボールの形成と当該ボール間のワイヤボンディングが可能なワイヤボンディング装置およびワイヤボンディング方法を提供することを課題とするものである。
【０００８】
【課題を解決するための手段】
本発明の請求項１に係るワイヤボンディング装置は、複数本のボンディング用ワイヤのそれぞれを互いに個別に排出するための複数のワイヤ排出口を有する共用ワイヤ案内装置、上記複数本のボンディング用ワイヤのそれぞれを切断するために一時的に拘束可能な複数のワイヤ拘束装置、少なくとも一つの上記ワイヤ排出口から排出されているボンディング用ワイヤ部分を加熱してボンディング用ボールを形成するボール形成装置、および上記共用ワイヤ案内装置を所望個所に移動させる移動装置を備えたことを特徴とするものである。
【０００９】
本発明の請求項２に係るワイヤボンディング装置は、第一ボンディング用ワイヤを排出する第一ワイヤ案内装置、上記第一ボンディング用ワイヤを切断するために一時的に拘束可能な第一ワイヤ拘束装置、第二ボンディング用ワイヤを排出する第二ワイヤ案内装置、上記第二ボンディング用ワイヤを切断するために一時的に拘束可能な第二ワイヤ拘束装置、上記第一ワイヤ案内装置または／および上記第二ワイヤ案内装置から排出されているボンディング用ワイヤ部分を加熱してボンディング用ボールを形成するボール形成装置、および上記第一ワイヤ案内装置と上記第二ワイヤ案内装置とを一緒に所望個所に移動させる移動装置を備えたことを特徴とするものである。
【００１０】
本発明の請求項３に係るワイヤボンディング装置は、請求項１記載のワイヤボンディング装置を用い、上記共用ワイヤ案内装置の少なくとも一つの上記ワイヤ排出口から排出されたボンディング用ワイヤを上記ボール形成装置にて加熱して第一ボンディング用ボールを形成する第一工程、第一導電体に上記第一ボンディング用ボールを実装する第二工程、一端が上記第一ボンディング用ボールに接続された上記ボンディング用ワイヤが上記共用ワイヤ案内装置から排出し続けられる状態で上記共用ワイヤ案内装置を上記移動装置により第二導電体の近傍まで移動させる第三工程、上記第三工程中または後において、上記共用ワイヤ案内装置の他のワイヤ排出口からボンディング用ワイヤを排出させ、上記ボール形成装置にて加熱して第二ボンディング用ボールを形成する第四工程、および上記第二ボンディング用ボールと上記第一ボンディング用ボールに接続された上記ボンディング用ワイヤとを上記第二導電体に実装する第五工程を備えたことを特徴とするものである。
【００１１】
本発明の請求項４に係るワイヤボンディング装置は、請求項２記載のワイヤボンディング装置を用い、第一ボンディング用ワイヤを加熱して第一ボンディング用ボールを形成する第六工程、上記第二ボンディング用ワイヤと上記第一ボンディング用ボールとを第一導電体に実装する第七工程、一端が上記第一ボンディング用ボールに接続された上記第二ボンディング用ワイヤが上記第二ワイヤ案内装置から排出し続けられる状態で上記第一ワイヤ案内装置と上記第二ワイヤ案内装置とを上記移動装置により第二導電体の近傍まで移動させる第八工程、上記第八工程中または後において、上記第一ボンディング用ワイヤを加熱して第二ボンディング用ボールを形成する第九工程、および上記第一ボンディング用ボールに接続された上記第二ボンディング用ワイヤと上記第二ボンディング用ボールとを上記第二導電体に実装する第十工程を備えたことを特徴とするものである。
【００１２】
【発明の実施の形態】
以下において、先行説明図と後続説明図における互いに同じ部位または表示に就いては、同じ符号を付して後続説明図では説明を省略することがある。
【００１３】
実施の形態１．
図１〜図６は、本発明のワイヤボンド装置およびワイヤボンド方法における実施の形態１を説明するものであって、図１は実施の形態１のワイヤボンド装置の一部斜視図を含む概略断面図であり、且つワイヤボンド方法の第一工程の説明図であり、図２はワイヤボンド方法の第二工程の説明図、図３は同第三工程の説明図、図４は同第四工程の説明図、図５は同第五工程の説明図、図６はワイヤボンドがなされた後の状態を示す断面図である。
【００１４】
図１において、実施の形態１のワイヤボンド装置１は、前記共用ワイヤ案内装置の一例としてのキャピラリー２０、前記ワイヤ拘束装置の一例としてのカットクランパ３０、および前記ボール形成装置の一例としてのトーチ電極４０、およびキャピラリー２０を所望個所に移動させる移動装置（図示せず）を備えている。キャピラリー２０は、二つのワイヤ案内路２０１およびワイヤ案内路２０２を内蔵している。ワイヤ案内路２０１は、ボンディング用ワイヤ（以下、ワイヤ）５１を導入するためのワイヤ導入口２０１１と、ワイヤ５１を排出するためのワイヤ排出口２０１２を有する。
【００１５】
同様に、ワイヤ案内路２０２は、ワイヤ５２を導入するためのワイヤ導入口２０２１と、当該ワイヤ５２を排出するためのワイヤ排出口２０２２を有し、ワイヤ排出口２０１２とワイヤ排出口２０２２とは互いに近接しているが異なる個所に設けられている。しかしてキャピラリー２０は、２本のワイヤ５１，５２のそれぞれをワイヤ排出口２０１２およびワイヤ排出口２０２２から個別に、ボンディング用ボール（以下、ボール）の形成のために一部長のみ露出させること、および／または連続的に排出させることが可能であって、かかるワイヤ５１，５２のキャピラリー２０への導入並びに排出は、ワイヤ５１の送出装置、およびワイヤ５２の送出装置（いずれも図示せず）側での操作により行われる。
【００１６】
カットクランパ３０は、ワイヤ導入口２０１１の手前に設置されて、ワイヤ５１を切断するためのカットクランパ部分３０１とワイヤ導入口２０２１の手前に設置されて、ワイヤ５２を切断するためのカットクランパ部分３０２とを備えている。カットクランパ部分３０１やカットクランパ部分３０２は、後記するカットクランパ３１、３２などと同じ構造並びに機能を有する。トーチ電極４０は、ワイヤ排出口２０１２またはワイヤ排出口２０２２からボール形成のために排出される一部長のワイヤを加熱してボールを形成する作用をなす。なお図１〜図５において、６１は前記第一導電体の一例としての第一ボンディングパッド、６２は前記第二導電体の一例としての第二ボンディングパッド、７１は第一ボール、７２は第二ボールである。
【００１７】
つぎに図１〜図６により、上記各ボンディングパッド６１、６２間をワイヤボンディングする方法に就き説明する。図１に示すように、キャピラリー２０のワイヤ排出口２０１２およびワイヤ排出口２０２２から個別に一部長のみ露出しているワイヤ５１とワイヤ５２とは、トーチ電極４０により一緒に加熱溶融され、１つの第一ボール７１が形成される。第一ボール７１を有するキャピラリー２０は、図２に示すように両カットクランパ部分３０１、分３０２が開放された状態にて第一ボンディングパッド６１に向かって下降されて、第一ボール７１は、第一ボンディングパッド６１に実装される。
【００１８】
第一ボール７１の実装後、図３に示すように、図３上で右方向にループを形成する場合は、カットクランパ部分３０１は開放され、カットクランパ部分３２は閉じられて、換言するとワイヤ５２はカットクランパ部分３０２により拘束されて、キャピラリー２０は右上方に移動せしめられる。この移動の際、カットクランパ部分３０２が閉じられた側のワイヤ５２は、スタッドバンプを行うようにひきちぎられ、一方、カットクランパ部分３０１が開放された側のワイヤ５１は、通常のワイヤボンドを行うようにループ形成される。なお図３上で左方向にループを形成する場合、両カットクランパ部分３０１、分３０２の開閉は、上記と反対となる。図３に示すように、ワイヤ５１がループを形成している間において、スタッドバンプを行うようにひきちぎられたワイヤ５２側は、再度トーチ電極４０によって加熱されて、第二ボール７２が形成される。
【００１９】
ついで図４に示すように、両カットクランパ部分３０１、分３０２は、共に開放状態とされ、キャピラリー２０は、第二ボンディングパッド６２に向かって下降され、第二ボンディングパッド６２上への第二ボール７２の実装と、ワイヤ５１による第一ボール７１と第二ボール７２との間でのワイヤボンディングとが同時に行われる。この後、キャピラリー２０は、図５に示すように、カットクランパ部分３０１とカットクランパ部分３０２とが閉じられた状態で上昇され、ワイヤ５１、ワイヤ５２は引きちぎられ、かくして図６に示すワイヤボンドが達成される。
【００２０】
以上のように、第二ボール７２の形成と第二ボンディングパッド６２上での第二ボール７２の実装とワイヤボンディングとが同時に行われるので、第二ボンディングパッド６２側のダメージを低減させる事ができ、しかもワイヤボンディングの安定性が向上する。
【００２１】
実施の形態２．
図７〜図１２は、本発明のワイヤボンド装置およびワイヤボンド方法における実施の形態２を説明するものであって、図７は実施の形態２のワイヤボンド装置の一部斜視図を含む概略断面図であり、且つワイヤボンド方法の第六工程の説明図であり、図８はワイヤボンド方法の第七工程の説明図、図９は同第八工程の説明図、図１０は同第九工程の説明図、図１１は同第十工程の説明図、図１２はワイヤボンドがなされた後の状態図である。
【００２２】
図７において、実施の形態２のワイヤボンド装置１は、前記第一ワイヤ案内装置の一例としてのキャピラリー２１、前記第一ワイヤ拘束装置の一例としてのカットクランパ３１、前記第二ワイヤ案内装置の一例としてのキャピラリー２２、前記第二ワイヤ拘束装置の一例としてのカットクランパ３２、前記ボール形成装置の一例としてのトーチ電極４０、およびおよび両キャピラリー２１，２２を一緒に所望個所に移動させる移動装置（図示せず）を備えている。
【００２３】
キャピラリー２１は、ワイヤ５１を導入するためのワイヤ導入口２１１１と同ワイヤを排出するためのワイヤ排出口２１１２を有するワイヤ案内路２１１を内蔵しており、ワイヤ導入口２１１１の近傍にカットクランパ３１を備えている。キャピラリー２２は、ワイヤ５２を導入するためのワイヤ導入口２２１１と同ワイヤを排出するためのワイヤ排出口２２１２を有するワイヤ案内路２２１を内蔵しており、ワイヤ導入口２２１１の近傍にカットクランパ３２を備えている。しかしてキャピラリー２１およびキャピラリー２２は、それぞれワイヤ５１，５２をワイヤ排出口２１２２およびワイヤ排出口２２１２から個別に、ボール形成のために一部長のみ露出させること、および／または連続的に排出させることが可能であって、かかるワイヤ５１，５２のキャピラリー２１、２２への導入並びに排出は、それぞれワイヤ５１の送出装置、およびワイヤ５２の送出装置（いずれも図示せず）側での操作により行われる。また両キャピラリー２１、２２は、互いに近接して設けられており、移動装置（図示せず）により一緒に所望個所に移動せしめられる。
【００２４】
つぎに図７〜図１２により、上記各ボンディングパッド６１、６２間をワイヤボンディングする方法に就き説明する。図７に示すように、キャピラリー２１のワイヤ排出口２１１２から一部長のみ露出しているワイヤ５１は、トーチ電極４０により加熱溶融されて第一ボール７１が形成される。ついで図８に示すように、キャピラリー２２から供給されたワイヤ５２の先端部と第一ボール７１とは、第一ボンディングパッド６１上で接続されると共に当該ボンディングパッド６１上に実装される。
【００２５】
第一ボール７１の実装後、図９に示すように、カットクランパ３１は閉じた状態とし、カットクランパ３２は開放した状態として、両キャピラリー２１、２２を第二ボンディングパッド６２に向かって移動させるために、移動装置によりキャピラリー２１は上昇せしめられ、その際にカットクランパ３１側のワイヤ５１は、スタッドバンプを行うようにひきちぎられ、一方カットクランパ３２側のワイヤ５２は、通常のワイヤボンドを行うようにループ形成される。さらにワイヤ５２がループを形成している間に、ひきちぎられたワイヤ５１側は、再度トーチ電極４０によって第二ボール７２が形成される。
【００２６】
つぎに図１０のように、カットクランパ３１，３２は開放した状態とされて第二ボンディングパッド６２上のワイヤ５２に向けてキャピラリー２１が下降され、ワイヤ５１の先端に形成された第二ボール７２とワイヤ５２とが第二ボンディングパッド６２上で接続されると共に同時に実装される。
【００２７】
第二ボール７２の実装後、図１１のように、両カットクランパ３１、３２は閉じた状態とされて、両キャピラリー２１，２２は上昇せしめられ、ワイヤ５１およびワイヤ５２は引きちぎられ、図１２の状態のワイヤボンディングが達成される。
【００２８】
以上のように、第二ボール７２の形成と第二ボンディングパッド６２上で第二ボール７２の実装とワイヤボンディングとが同時に行われるので、第二ボンディングパッド６２側のダメージを低減させる事ができ、なおかつ低ループボンディングが可能になり、また接合の安定性を向上せしめることが出来る。なお実施の形態２においては、第二ボール７２の形成を行わないキャピラリー２２は、ワイヤ５２を案内可能な他のツール、例えば金属や樹脂のパイプなどであってよい。
【００２９】
【発明の効果】
本発明の請求項１に係るワイヤボンディング装置は、以上説明した通り、複数本のボンディング用ワイヤのそれぞれを互いに個別に排出するための複数のワイヤ排出口を有する共用ワイヤ案内装置、上記複数本のボンディング用ワイヤのそれぞれを切断する際に一時的に拘束可能な複数のワイヤ拘束装置、少なくとも一つの上記ワイヤ排出口から排出されているボンディング用ワイヤ部分を加熱してボンディング用ボールを形成するボール形成装置、および上記共用ワイヤ案内装置を所望個所に移動させる移動装置を備えたことを特徴とするものであるので、能率よく、しかして短時間で且つ低マンパワーにて第一ボール、第二ボールの形成と当該両ボール間の安定したワイヤボンディングが可能となる。
【００３０】
また第二ボールの形成と当該両ボール間のワイヤボンディングとを同時に行うことが可能であることにより、第二ボンディングパッド側でのダメージが低減した状態で安定したワイヤボンディングを容易に形成することができ、またワイヤボンディングが困難な場所でもそれを簡単に行うことができる。
【００３１】
また低ループボンディングが可能になるので、ボンディング用ワイヤの材質を選択して、例えば２本中１本の当該ワイヤは金のワイヤとは別の種類にすることにより、コストを下げることできる。
【００３２】
以上の効果は、本発明の請求項２に係るワイヤボンディング装置、並びに本発明の請求項３および請求項４のワイヤボンディング方法についても当てはまる。
【図面の簡単な説明】
【図１】 実施の形態１のワイヤボンド装置の一部斜視図を含む概略断面図であり、且つワイヤボンド方法の第一工程の説明図。
【図２】 実施の形態１のワイヤボンド方法の第二工程の説明図。
【図３】 実施の形態１のワイヤボンド方法の第三工程の説明図。
【図４】 実施の形態１のワイヤボンド方法の第四工程の説明図。
【図５】 実施の形態１のワイヤボンド方法の第五工程の説明図。
【図６】 実施の形態１においてワイヤボンドがなされた後の状態図。
【図７】 実施の形態２のワイヤボンド装置の一部斜視図を含む概略断面図であり、且つワイヤボンド方法の第六工程の説明図。
【図８】 実施の形態２のワイヤボンド方法の第七工程の説明図。
【図９】 実施の形態２のワイヤボンド方法の第八工程の説明図。
【図１０】 実施の形態２のワイヤボンド方法の第九工程の説明図。
【図１１】 実施の形態２のワイヤボンド方法の第十工程の説明図。
【図１２】 実施の形態２においてワイヤボンドがなされた後の状態図。
【符号の説明】
１ ワイヤボンド装置、２０ キャピラリー、２０１ ワイヤ案内路、
２０１１ ワイヤ導入口、２０１２ ワイヤ排出口、２１ キャピラリー、
２１１ ワイヤ案内路、２１１１ ワイヤ導入口、２１１２ ワイヤ排出口、
２２ キャピラリー、２２１ ワイヤ案内路、２２１１ ワイヤ導入口、
２２１２ ワイヤ排出口、３０ カットクランパ、
３０１ カットクランパ部分、３０２ カットクランパ部分、
３１ カットクランパ、３２ カットクランパ、４０ トーチ電極、
５１ ワイヤ、５２ ワイヤ、６１ 第一ボンディングパッド、
６２ 第二ボンディングパッド、７１ 第一ボール、７２ 第二ボール。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a wire bonding apparatus and a wire bonding method, and more particularly to a wire bonding apparatus and a wire bonding method capable of efficiently performing wire bonding.
[0002]
[Prior art]
Conventionally, a first conductive layer such as a bonding pad, a first ball formed on the first conductive layer, a second conductive layer spaced from the first conductive layer, and the second A semiconductor device comprising: a second ball formed on a conductive layer; and a bonding wire connecting the first ball and the second ball, wherein the bonding ball is mechanically deformed to form the second ball. For example, it is known from Patent Document 1 described later.
[0003]
[Patent Document 1]
JP 2002-280414 A (Claim 1, paragraph number 0015, FIGS. 1 to 5)
[0004]
In the above prior art, when forming the second ball by mechanically deforming the bonding wire, for example, after temporarily bonding the bonding wire to the second conductive layer, the bonding wire is mechanically deformed to form the second ball. Two balls are formed.
[0005]
Also, in the prior art, generally, a first ball forming operation on the first bonding pad, a second ball forming operation on the second bonding pad, and a wire bonding operation between the first ball and the second ball. Has been carried out in a separate process. For example, after forming a stud bump as a second ball on the second bonding pad, the first ball is mounted on the first bonding pad using a capillary, and then the bonding wire is formed into a loop while forming a loop. The stud bump formed in step 1 and the first ball are wire-bonded.
[0006]
By the way, in the conventional wire bonding apparatus and the wire bonding method, since the above-described plurality of steps are performed separately, not only the work efficiency is poor, but also the following problems are caused. That is, when the second bonding pad side is a place where a mounting place such as a chip is small, a place where damage should not be applied, or a place where mounting strength is difficult to ensure, bonding is often difficult. In addition, when bonding at the same place twice, the first position and the second position may be misaligned, and further, a loop of wire is formed on the first ball, making low loop bonding difficult. It is.
[0007]
[Problems to be solved by the invention]
In view of the above circumstances in the field, the present invention provides a wire bonding apparatus and a wire bonding method capable of efficiently forming bonding balls on a plurality of bonding pads and wire bonding between the balls. To do.
[0008]
[Means for Solving the Problems]
A wire bonding apparatus according to claim 1 of the present invention is a common wire guide apparatus having a plurality of wire discharge ports for individually discharging a plurality of bonding wires, and each of the plurality of bonding wires. A plurality of wire restraining devices that can be temporarily restrained to cut a wire, a ball forming device that forms a bonding ball by heating at least one bonding wire portion discharged from the wire discharge port, and the common A moving device for moving the wire guiding device to a desired location is provided.
[0009]
A wire bonding apparatus according to a second aspect of the present invention is a first wire guide device that discharges a first bonding wire, a first wire restraining device that can be temporarily restrained to cut the first bonding wire, Second wire guide device for discharging second bonding wire, second wire restraint device which can be temporarily restrained to cut second bonding wire, first wire guide device and / or second wire A ball forming apparatus for forming a bonding ball by heating a bonding wire portion discharged from a guiding apparatus, and a moving apparatus for moving the first wire guiding apparatus and the second wire guiding apparatus together to a desired location It is characterized by comprising.
[0010]
According to a third aspect of the present invention, there is provided a wire bonding apparatus using the wire bonding apparatus according to the first aspect, wherein the bonding wire discharged from at least one of the wire discharge ports of the common wire guiding apparatus is used as the ball forming apparatus. A first step of forming a first bonding ball by heating, a second step of mounting the first bonding ball on a first conductor, and the bonding wire having one end connected to the first bonding ball In the third step of moving the shared wire guide device to the vicinity of the second conductor by the moving device in a state in which the wire is continuously discharged from the shared wire guide device, the shared wire guide device during or after the third step The wire for bonding is discharged from the other wire discharge port and heated by the ball forming apparatus to A fourth step of forming a bonding ball, and a fifth step of mounting the second bonding ball and the bonding wire connected to the first bonding ball on the second conductor. It is a feature.
[0011]
A wire bonding apparatus according to a fourth aspect of the present invention uses the wire bonding apparatus according to the second aspect to heat a first bonding wire to form a first bonding ball, the second bonding use A seventh step of mounting the wire and the first bonding ball on the first conductor; the second bonding wire having one end connected to the first bonding ball continues to be discharged from the second wire guiding device; The first bonding wire and the second wire guiding device are moved to the vicinity of the second conductor by the moving device in the state where the first bonding wire is moved during or after the eighth step. A second step of forming a second bonding ball by heating the first bonding ball, and the second bonding unit connected to the first bonding ball And Ingu wire and the second bonding ball is characterized in that it comprises a tenth step of mounting to said second conductor.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
In the following description, the same parts or displays in the preceding explanatory diagram and the subsequent explanatory diagram are denoted by the same reference numerals, and the description may be omitted in the subsequent explanatory diagram.
[0013]
Embodiment 1 FIG.
1 to 6 illustrate a first embodiment of a wire bonding apparatus and a wire bonding method according to the present invention. FIG. 1 is a schematic cross section including a partial perspective view of the wire bonding apparatus of the first embodiment. FIG. 2 is an explanatory diagram of the first step of the wire bonding method, FIG. 2 is an explanatory diagram of the second step of the wire bonding method, FIG. 3 is an explanatory diagram of the third step, and FIG. 4 is the fourth step. FIG. 5 is an explanatory view of the fifth step, and FIG. 6 is a cross-sectional view showing a state after wire bonding is performed.
[0014]
In FIG. 1, the wire bonding apparatus 1 according to the first embodiment includes a capillary 20 as an example of the shared wire guiding apparatus, a cut clamper 30 as an example of the wire restraining apparatus, and a torch electrode as an example of the ball forming apparatus. 40 and a moving device (not shown) for moving the capillary 20 to a desired location. The capillary 20 incorporates two wire guide paths 201 and a wire guide path 202. The wire guide path 201 has a wire introduction port 2011 for introducing a bonding wire (hereinafter referred to as a wire) 51 and a wire discharge port 2012 for discharging the wire 51.
[0015]
Similarly, the wire guide path 202 has a wire introduction port 2021 for introducing the wire 52 and a wire discharge port 2022 for discharging the wire 52. The wire discharge port 2012 and the wire discharge port 2022 are mutually connected. Proximity but at different locations. Thus, the capillary 20 exposes each of the two wires 51 and 52 individually from the wire discharge port 2012 and the wire discharge port 2022 for only a part of the length to form a bonding ball (hereinafter referred to as a ball), and The wires 51 and 52 can be continuously discharged and introduced into the capillary 20 and discharged on the side of the wire 51 delivery device and the wire 52 delivery device (both not shown). It is performed by the operation.
[0016]
The cut clamper 30 is installed in front of the wire introduction port 2011 and is installed in front of the cut clamper portion 301 for cutting the wire 51 and the wire introduction port 2021, and the cut clamper portion 302 for cutting the wire 52. And. The cut clamper portion 301 and the cut clamper portion 302 have the same structure and function as the cut clampers 31 and 32 described later. The torch electrode 40 functions to form a ball by heating a part of the wire discharged from the wire discharge port 2012 or the wire discharge port 2022 for ball formation. 1 to 5, reference numeral 61 denotes a first bonding pad as an example of the first conductor, 62 denotes a second bonding pad as an example of the second conductor, 71 denotes a first ball, and 72 denotes a second bonding pad. It is a ball.
[0017]
Next, a method for wire bonding between the bonding pads 61 and 62 will be described with reference to FIGS. As shown in FIG. 1, the wire 51 and the wire 52, which are individually partially exposed from the wire discharge port 2012 and the wire discharge port 2022 of the capillary 20, are heated and melted together by the torch electrode 40. One ball 71 is formed. As shown in FIG. 2, the capillary 20 having the first ball 71 is lowered toward the first bonding pad 61 in a state where both the cut clamper portions 301 and the portion 302 are opened, and the first ball 71 It is mounted on one bonding pad 61.
[0018]
When the loop is formed in the right direction in FIG. 3 after mounting the first ball 71, the cut clamper portion 301 is opened and the cut clamper portion 32 is closed, in other words, the wire 52 Is constrained by the cut clamper portion 302, and the capillary 20 is moved to the upper right. During this movement, the wire 52 on the side where the cut clamper portion 302 is closed is torn off so as to make a stud bump, while the wire 51 on the side where the cut clamper portion 301 is opened does not have a normal wire bond. Looped to do. When a loop is formed in the left direction in FIG. 3, the opening and closing of both the cut clamper portions 301 and the minute 302 is opposite to the above. As shown in FIG. 3, while the wire 51 forms a loop, the side of the wire 52 that is torn off so as to perform the stud bump is heated again by the torch electrode 40 to form the second ball 72. The
[0019]
Next, as shown in FIG. 4, both the cut clamper portions 301 and 302 are opened, and the capillary 20 is lowered toward the second bonding pad 62, and the second ball on the second bonding pad 62. 72 and wire bonding between the first ball 71 and the second ball 72 by the wire 51 are simultaneously performed. Thereafter, as shown in FIG. 5, the capillary 20 is raised with the cut clamper portion 301 and the cut clamper portion 302 closed, and the wire 51 and the wire 52 are torn off, and thus the wire bond shown in FIG. Achieved.
[0020]
As described above, since the formation of the second ball 72, the mounting of the second ball 72 on the second bonding pad 62, and the wire bonding are performed simultaneously, damage on the second bonding pad 62 side can be reduced. Moreover, the stability of wire bonding is improved.
[0021]
Embodiment 2. FIG.
7 to 12 illustrate the second embodiment of the wire bonding apparatus and the wire bonding method of the present invention, and FIG. 7 is a schematic cross section including a partial perspective view of the wire bonding apparatus of the second embodiment. FIG. 8 is an explanatory diagram of the sixth step of the wire bonding method, FIG. 8 is an explanatory diagram of the seventh step of the wire bonding method, FIG. 9 is an explanatory diagram of the eighth step, and FIG. 10 is the ninth step. FIG. 11 is an explanatory diagram of the tenth process, and FIG. 12 is a state diagram after wire bonding is performed.
[0022]
In FIG. 7, the wire bonding apparatus 1 of Embodiment 2 includes a capillary 21 as an example of the first wire guiding apparatus, a cut clamper 31 as an example of the first wire restraining apparatus, and an example of the second wire guiding apparatus. Capillary 22 as an example, cut clamper 32 as an example of the second wire restraining device, torch electrode 40 as an example of the ball forming device, and a moving device for moving both capillaries 21 and 22 together to a desired location (FIG. Not shown).
[0023]
The capillary 21 incorporates a wire guide path 211 having a wire introduction port 2111 for introducing the wire 51 and a wire discharge port 2112 for discharging the wire, and a cut clamper 31 is provided in the vicinity of the wire introduction port 2111. I have. The capillary 22 incorporates a wire guide path 221 having a wire introduction port 2211 for introducing the wire 52 and a wire discharge port 2212 for discharging the wire, and a cut clamper 32 is provided in the vicinity of the wire introduction port 2211. I have. Thus, the capillary 21 and the capillary 22 can cause the wires 51 and 52 to be individually exposed from the wire discharge port 2122 and the wire discharge port 2212, only a part of the length for ball formation, and / or continuously discharged, respectively. The introduction and discharge of the wires 51 and 52 into and from the capillaries 21 and 22 are performed by operations on the wire 51 delivery device and the wire 52 delivery device (both not shown), respectively. Both capillaries 21 and 22 are provided close to each other and can be moved together to a desired location by a moving device (not shown).
[0024]
Next, a method for wire bonding between the bonding pads 61 and 62 will be described with reference to FIGS. As shown in FIG. 7, the wire 51 partially exposed from the wire discharge port 2112 of the capillary 21 is heated and melted by the torch electrode 40 to form the first ball 71. Next, as shown in FIG. 8, the tip of the wire 52 supplied from the capillary 22 and the first ball 71 are connected on the first bonding pad 61 and mounted on the bonding pad 61.
[0025]
After the first ball 71 is mounted, as shown in FIG. 9, both the capillaries 21 and 22 are moved toward the second bonding pad 62 with the cut clamper 31 closed and the cut clamper 32 open. In addition, the capillary 21 is raised by the moving device, and at that time, the wire 51 on the cut clamper 31 side is torn off so as to make a stud bump, while the wire 52 on the cut clamper 32 side performs normal wire bonding. So that the loop is formed. Further, while the wire 52 forms a loop, the second ball 72 is again formed by the torch electrode 40 on the broken wire 51 side.
[0026]
Next, as shown in FIG. 10, the cut clampers 31 and 32 are opened, the capillary 21 is lowered toward the wire 52 on the second bonding pad 62, and the second ball 72 formed at the tip of the wire 51. And the wire 52 are connected on the second bonding pad 62 and mounted simultaneously.
[0027]
After mounting the second ball 72, as shown in FIG. 11, both the cut clampers 31, 32 are closed, both the capillaries 21, 22 are raised, the wire 51 and the wire 52 are torn off, State wire bonding is achieved.
[0028]
As described above, since the formation of the second ball 72 and the mounting of the second ball 72 and the wire bonding are performed simultaneously on the second bonding pad 62, damage on the second bonding pad 62 side can be reduced. In addition, low-loop bonding is possible, and the stability of bonding can be improved. In the second embodiment, the capillary 22 on which the second ball 72 is not formed may be another tool capable of guiding the wire 52, such as a metal or resin pipe.
[0029]
【The invention's effect】
As described above, the wire bonding apparatus according to claim 1 of the present invention includes a common wire guide apparatus having a plurality of wire discharge ports for individually discharging a plurality of bonding wires, and the plurality of the wire bonding apparatuses. A plurality of wire restraint devices that can be temporarily restrained when cutting each of the bonding wires, and ball formation that forms a bonding ball by heating at least one of the bonding wire portions discharged from the wire discharge port And a moving device for moving the common wire guide device to a desired location. Therefore, the first ball and the second ball can be efficiently and quickly operated with a low manpower. Formation and stable wire bonding between the two balls are possible.
[0030]
In addition, since the formation of the second ball and the wire bonding between the two balls can be performed at the same time, stable wire bonding can be easily formed with reduced damage on the second bonding pad side. It can be done easily even in places where wire bonding is difficult.
[0031]
Further, since low-loop bonding is possible, the cost can be reduced by selecting the material of the bonding wire and making, for example, one of the two wires different from the gold wire.
[0032]
The above effects also apply to the wire bonding apparatus according to claim 2 of the present invention and the wire bonding methods of claims 3 and 4 of the present invention.
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional view including a partial perspective view of a wire bonding apparatus according to a first embodiment, and is an explanatory view of a first step of a wire bonding method.
FIG. 2 is an explanatory diagram of a second step of the wire bonding method of the first embodiment.
3 is an explanatory diagram of a third step of the wire bonding method of Embodiment 1. FIG.
FIG. 4 is an explanatory diagram of a fourth step of the wire bonding method of the first embodiment.
FIG. 5 is an explanatory diagram of a fifth step of the wire bonding method of the first embodiment.
FIG. 6 is a state diagram after wire bonding is performed in the first embodiment.
FIG. 7 is a schematic cross-sectional view including a partial perspective view of the wire bonding apparatus according to the second embodiment, and is an explanatory diagram of a sixth step of the wire bonding method.
FIG. 8 is an explanatory diagram of a seventh step of the wire bonding method of the second embodiment.
FIG. 9 is an explanatory diagram of an eighth step of the wire bonding method of the second embodiment.
FIG. 10 is an explanatory diagram of a ninth step of the wire bonding method of the second embodiment.
FIG. 11 is an explanatory diagram of a tenth step of the wire bonding method of the second embodiment.
FIG. 12 is a state diagram after wire bonding is performed in the second embodiment.
[Explanation of symbols]
1 wire bond apparatus, 20 capillaries, 201 wire guide path,
2011 wire inlet, 2012 wire outlet, 21 capillary,
211 Wire guide path, 2111 Wire introduction port, 2112 Wire discharge port,
22 capillary, 221 wire guide path, 2211 wire inlet,
2212 wire outlet, 30 cut clamper,
301 Cut clamper part, 302 Cut clamper part,
31 cut clamper, 32 cut clamper, 40 torch electrode,
51 wire, 52 wire, 61 first bonding pad,
62 second bonding pad, 71 first ball, 72 second ball.

Claims (4)

複数本のボンディング用ワイヤのそれぞれを互いに個別に排出するための複数のワイヤ排出口を有する共用ワイヤ案内装置、上記複数本のボンディング用ワイヤのそれぞれを切断するために一時的に拘束可能な複数のワイヤ拘束装置、少なくとも一つの上記ワイヤ排出口から排出されているボンディング用ワイヤ部分を加熱してボンディング用ボールを形成するボール形成装置、および上記共用ワイヤ案内装置を所望個所に移動させる移動装置を備えたことを特徴とするワイヤボンディング装置。Shared wire guide device having a plurality of wire discharge ports for individually discharging each of the plurality of bonding wires, and a plurality of temporarily constrained members for cutting each of the plurality of bonding wires A wire restraining device, a ball forming device for forming a bonding ball by heating at least one bonding wire portion discharged from the wire discharge port, and a moving device for moving the common wire guiding device to a desired location A wire bonding apparatus characterized by that. 第一ボンディング用ワイヤを排出する第一ワイヤ案内装置、上記第一ボンディング用ワイヤを切断するために一時的に拘束可能な第一ワイヤ拘束装置、第二ボンディング用ワイヤを排出する第二ワイヤ案内装置、上記第二ボンディング用ワイヤを切断するために一時的に拘束可能な第二ワイヤ拘束装置、上記第一ワイヤ案内装置または／および上記第二ワイヤ案内装置から排出されているボンディング用ワイヤ部分を加熱してボンディング用ボールを形成するボール形成装置、および上記第一ワイヤ案内装置と上記第二ワイヤ案内装置とを一緒に所望個所に移動させる移動装置を備えたことを特徴とするワイヤボンディング装置。First wire guide device for discharging first bonding wire, first wire restraint device capable of temporarily restraining to cut the first bonding wire, second wire guide device for discharging second bonding wire The second wire restraint device that can be temporarily restrained to cut the second bonding wire, the first wire guide device or / and the bonding wire portion discharged from the second wire guide device are heated. A wire bonding apparatus comprising: a ball forming apparatus that forms bonding balls; and a moving device that moves the first wire guide apparatus and the second wire guide apparatus together to a desired location. 請求項１記載のワイヤボンディング装置を用い、上記共用ワイヤ案内装置の少なくとも一つの上記ワイヤ排出口から排出されたボンディング用ワイヤを上記ボール形成装置にて加熱して第一ボンディング用ボールを形成する第一工程、第一導電体に上記第一ボンディング用ボールを実装する第二工程、一端が上記第一ボンディング用ボールに接続された上記ボンディング用ワイヤが上記共用ワイヤ案内装置から排出し続けられる状態で上記共用ワイヤ案内装置を上記移動装置により第二導電体の近傍まで移動させる第三工程、上記第三工程中または後において、上記共用ワイヤ案内装置の他のワイヤ排出口からボンディング用ワイヤを排出させ、上記ボール形成装置にて加熱して第二ボンディング用ボールを形成する第四工程、および上記第二ボンディング用ボールと上記第一ボンディング用ボールに接続された上記ボンディング用ワイヤとを上記第二導電体に実装する第五工程を備えたことを特徴とするワイヤボンディング方法。A wire bonding apparatus according to claim 1, wherein a bonding wire discharged from at least one of the wire discharge ports of the common wire guiding apparatus is heated by the ball forming apparatus to form a first bonding ball. One step, a second step of mounting the first bonding ball on the first conductor, the bonding wire having one end connected to the first bonding ball being continuously discharged from the common wire guiding device. During or after the third step of moving the common wire guiding device to the vicinity of the second conductor by the moving device, the bonding wire is discharged from another wire outlet of the common wire guiding device. A fourth step of forming a second bonding ball by heating with the ball forming apparatus, and Wire bonding method, characterized in that the said bonding wires connected to the bonding balls and the first bonding ball with a fifth step of mounting to said second conductor. 請求項２記載のワイヤボンディング装置を用い、第一ボンディング用ワイヤを加熱して第一ボンディング用ボールを形成する第六工程、上記第二ボンディング用ワイヤと上記第一ボンディング用ボールとを第一導電体に実装する第七工程、一端が上記第一ボンディング用ボールに接続された上記第二ボンディング用ワイヤが上記第二ワイヤ案内装置から排出し続けられる状態で上記第一ワイヤ案内装置と上記第二ワイヤ案内装置とを上記移動装置により第二導電体の近傍まで移動させる第八工程、上記第八工程中または後において、上記第一ボンディング用ワイヤを加熱して第二ボンディング用ボールを形成する第九工程、および上記第一ボンディング用ボールに接続された上記第二ボンディング用ワイヤと上記第二ボンディング用ボールとを上記第二導電体に実装する第十工程を備えたことを特徴とするワイヤボンディング方法。A sixth step of heating the first bonding wire to form a first bonding ball by using the wire bonding apparatus according to claim 2, wherein the second bonding wire and the first bonding ball are electrically connected to the first conductive wire. A seventh step of mounting on the body, the first wire guiding device and the second wire in a state in which the second bonding wire, one end of which is connected to the first bonding ball, is continuously discharged from the second wire guiding device. In the eighth step of moving the wire guiding device to the vicinity of the second conductor by the moving device, and during or after the eighth step, the first bonding wire is heated to form a second bonding ball. Nine steps, and the second bonding wire and the second bonding ball connected to the first bonding ball Wire bonding method characterized by comprising a tenth step of mounting to said second conductor.
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