JP3751383B2 - Mold structure for temperature control in a short time - Google Patents
Mold structure for temperature control in a short time Download PDFInfo
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- JP3751383B2 JP3751383B2 JP28037496A JP28037496A JP3751383B2 JP 3751383 B2 JP3751383 B2 JP 3751383B2 JP 28037496 A JP28037496 A JP 28037496A JP 28037496 A JP28037496 A JP 28037496A JP 3751383 B2 JP3751383 B2 JP 3751383B2
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- temperature control
- mold temperature
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【０００１】
【発明の属する技術分野】
本発明は、熱可塑性樹脂の一般射出成形及びガスアシスト成形において、各種製品の外装部品、外板、精密部品等の成形品で高品質の表面、高い寸法精度を要求され、かつハイサイクルが要求される分野の成形方法に適用可能な金型構造に関するものである。
【０００２】
本発明は、特に、各種成形品のウエルドラインの発生やジェッティング等の外観不良、寸法精度不良、無機フィラー充填材料における外観不良を解消するために、金型温度を高くした場合のハイサイクル成形用の金型構造に関するものである。
【０００３】
【従来の技術】
従来、熱可塑性樹脂の成形加工、特にエンジニアリングプラスチックにおいては、成形残留応力や成形品外観不良の問題、無機フィラー充填材料においてはフィラーの浮きの問題を解決するために、金型温度を樹脂の熱変形温度よりも５〜２０度程度低く設定するということが知られている。
【０００４】
しかしながら、前記設定温度にする場合は、金型の昇温、降温のための所要時間が長くなる、金型温度を１００℃を超える高温に上げることができない、成形サイクルが長くなる、等の諸問題があった。
【０００５】
また、金型昇温、降温の時間短縮や均一金型温度制御を行なうためには、金型温調管路をできるだけ多く設定し、金型を昇温、降温するための温調用媒体の流量を多くすることも周知の事実である。
【０００６】
しかしながら、成形品を金型から脱型させるための突き出しピンが優先され、金型温調管路を設定できないという問題がある。また、金型温調管路の径を小さくすれば、前記突き出しピンを避けて設定する事も可能であるが、金型温調機と連結するためのホースの接続用口金が取り付けられない場合や取り付けられても口金の径が狭められるため前記媒体の圧力損失が起こり、金型昇温および降温の効率が悪くなるという問題があった。
【０００７】
これらの問題を解決するために金型温調管路を直列に連結する方法をとるが、この場合、前記温調用媒体の流動長が長くなり圧力損失が起こり効率が悪くなってしまう。
【０００８】
【発明が解決しようとする課題】
本発明は、従来の射出成形、ガスアシスト成形等における金型の昇温、降温の温度制御が効率良くかつ短時間内で実施可能な成形用金型構造を提供することを課題とする。
【０００９】
【課題を解決するための手段】
本発明の課題は、固定側入駒を有する固定側主型と、可動側入駒を有する可動側主型とを備え、該固定側主型と可動側主型との合わせ面にキャビティが形成される樹脂成形用金型において、金型温度制御を効率良く行なうために該固定側入駒と可動側入駒にそれぞれ、内径の小さな金型温調用管路と、金型温調機に接続される温調用媒体の供給用ホースおよび回収用ホースの両接続部に接続用構造体（以下、マニホールドという）を脱着可能な別部品として各入駒と接するように設けた、短時間で温度制御可能な金型構造によって解決される。
【００１０】
この金型構造において、前記それぞれのマニホールドの金型に接する側には、金型温調用管路と同じ位置で同じ数の開孔が設けてあり、金型温調機に接続されるホース側には、ホース接続用の接続管が設けてあり、それぞれがマニホールド内の中空部を介して連結されるようになっている。
【００１１】
この際、金型温調用管路の数や径を考慮し前記媒体の圧力損失が懸念される場合には、金型温調機に接続されるホースの数を増やしマニホールドを分割することもできる。
【００１２】
本発明にかかる金型構造を利用することにより、車両用のグリル類、ドアハンドル、グリップ等の自動車部品、Fax装置、複写機等の各種事務機器、携帯電話、携帯用端末等の通信機器、家庭用電気製品のハウジングやシャーシ等に適する成形品を安定して得ることができる。この金型は、熱可塑性樹脂の射出成形、中空成形部を有するガスアシスト成形、射出圧縮成形等の各種成形法に適用することができる。
【００１３】
本発明により得られる、温度を効率良く迅速、かつ均一に昇温、降温させる金型構造は、前述のように金型温調用管路と金型温調機に接続されるホースとの接続部にマニーホールドを設けるものであるが、その際、金型温調用管路の内径は、３mmから８mmの大きさで、金型強度上問題の無い範囲で数多く均一に設けることで実現できる。
【００１４】
本発明による金型構造は、迅速な温度制御を行なう目的のために、その熱伝導率が２０〜１５０Ｊ／ｓｅｃ・ｍ・degの範囲に属する金属素材により金型本体が形成されることが望ましい。このような範囲に属する金属材料としては、例えば、鋼、ＳＵＳ等の他、アルミ合金、亜鉛合金、ベリリウム銅合金等の非鉄合金が挙げられる。
【００１５】
【発明の作用】
本発明によれば、金型温度の昇温、降温が効率良く迅速に行え、作業準備の所要時間を短縮することができる。また、１００℃以上の金型温度も容易に短時間でかつ金型表面の温度分布を均一にしつつ実現できる。
【００１６】
本発明によれば、成形１サイクルの間に金型温度を昇温、降温させる金型冷熱サイクルにおいて、成形サイクルを長くすること無く実現できる。
【００１７】
【発明の実施の形態】
以下、実施例を示す添付図を参照しつつ本発明を開示する。図１は本発明にかかる金型構造の断面図である。この金型は、固定側主型１と可動側主型２との合せ面にキャビティ３が形成される。
【００１８】
キャビティ３は固定側入れ駒４と可動側入れ駒５の対向部により形成されている。固定側入れ駒４及び可動側入れ駒５には、金型温調用管路６(管路内径８mm)が１０本形成されており、該金型温調用管路６は流路分岐管であるマニホールド７とシール材８を挟んで接続されている。
【００１９】
マニーホールド７は、水または油等の温調用媒体の供給側と回収側の２つが別々に固定側入れ駒４と可動側入れ駒５にそれぞれ設置してある。マニホールド７は、金型温調機から温調用媒体を流すホース９と接続する接続部１０及び金型温調用管路と接続する開孔１１のそれぞれがマニホールド内の中空部１２でつながっている。温調用媒体は、実線矢印または破線矢印のようにホース９、マニホールド中空部１２を介して入れ駒４（５）に形成された金型温調用管路６に対して供給されかつ回収される。
【００２０】
実施例１
実施例１では、温調機TURBU-TD-U4-H（（株）シスコ製）を使用し、１００℃の加圧した熱水を1200 l／hrで本発明の金型に巡回させ金型表面温度の昇温速度の測定と金型温度のバラツキを測定した。比較例として同じ大きさの金型で冷却管路内径１２mmが６本の金型を用い同じ実験を行い比較した。なお、金型本体の素材としては、熱伝導率が６１Ｊ／ｓｅｃ・ｍ・degの鋼材を使用した。
【００２１】
昇温速度については本発明の実施例は比較例の５倍の速度であり、温度のバラツキについては比較例の１／１１であった。表１にその結果を示す。
【００２２】
【表１】
実施例２
実施例２では、温調機TURBU-TD-U4-H（（株）シスコ製）を使用し、１００℃の加圧した熱水を1200 l／hrで本発明の金型に循環させ、熱可塑性樹脂である変性PPO樹脂NORYL SE1(日本ジーイープラスッチクス（株）製）により図３に示す成形品Ｍを５０ショット成形した後の金型表面温度と温度バラツキを評価した。比較例として同じ入れ駒構造の同じ金型で温調用管路内径１２mmが５本の場合での同じ実験を行い比較した。
【００２４】
本発明の金型によれば、成形後の平均表面温度は101℃、バラツキは３degであったのに対し、比較例では成形後の平均表面温度は112℃、バラツキは１５degであった。表２に実施例２の金型表面温度の結果を示す。
【００２５】
【表２】
【発明の効果】
本発明によれば、金型の昇温、降温を効率良く短時間でしかも均一にすることができ成形準備の作業時間を短縮、安定した成形が可能になる。また、１００℃以上の金型温度についても確実に設定温度通りに調節することができる。
【図面の簡単な説明】
【図１】図１は、本発明にかかる金型構造の実施例の構成例を示す断面図である。
【図２】図２は、本発明にかかる金型構造の実施例のマニホールド部構成例を示す図である。
【図３】図３は、本発明にかかる金型を用いて成形した成形品の斜視図である。
【符号の説明】
1 固定側主型
2 可動側主型
3 キャビティ
4 固定側入れ駒
5 可動側入れ駒
6 金型温調用管路
7 マニホールド
8 シール材
9 流体ホース
10 ホース接続用開孔
11 金型温調管路接続用開孔
12 マニホールド中空部
Ｍ 成形品[0001]
BACKGROUND OF THE INVENTION
In the general injection molding and gas assist molding of thermoplastic resins, the present invention requires a high-quality surface, high dimensional accuracy, and a high cycle for molded products such as exterior parts, outer plates, and precision parts of various products. The present invention relates to a mold structure applicable to a molding method in a certain field.
[0002]
In particular, the present invention provides high cycle molding when the mold temperature is raised in order to eliminate appearance defects such as generation of weld lines and jetting in various molded products, poor dimensional accuracy, and poor appearance in inorganic filler-filled materials. It relates to a mold structure for use.
[0003]
[Prior art]
Conventionally, in order to solve the problem of molding residual stress and defective appearance of molded products in the molding process of thermoplastic resins, especially engineering plastics, and the problem of floating of fillers in inorganic filler-filled materials, the mold temperature is set to the heat of the resin. It is known that the temperature is set lower by about 5 to 20 degrees than the deformation temperature.
[0004]
However, when the set temperature is set, the time required for raising and lowering the mold becomes longer, the mold temperature cannot be raised to a high temperature exceeding 100 ° C., and the molding cycle becomes longer. There was a problem.
[0005]
Also, in order to shorten the mold temperature rise / fall time and perform uniform mold temperature control, set as many mold temperature control pipelines as possible, and the flow rate of the temperature adjustment medium to raise and lower the mold temperature. It is also a well-known fact to increase the number.
[0006]
However, there is a problem that a protruding pin for removing the molded product from the mold is given priority, and the mold temperature control pipeline cannot be set. In addition, if the diameter of the mold temperature control pipeline is reduced, it is possible to avoid the protruding pin and set it, but if the hose connection base for connecting to the mold temperature controller cannot be installed Even if it is attached, the diameter of the die is narrowed, so that there is a problem that the pressure loss of the medium occurs, and the efficiency of temperature raising and lowering of the mold deteriorates.
[0007]
In order to solve these problems, a method is used in which the mold temperature control pipes are connected in series. However, in this case, the flow length of the temperature control medium becomes long, pressure loss occurs, and the efficiency deteriorates.
[0008]
[Problems to be solved by the invention]
It is an object of the present invention to provide a molding die structure that can efficiently perform temperature rise and fall temperature control in conventional injection molding, gas assist molding, and the like within a short time.
[0009]
[Means for Solving the Problems]
An object of the present invention is to provide a fixed-side main mold having a fixed-side entrance piece and a movable-side main mold having a movable-side entry piece, and forming a cavity on the mating surface of the fixed-side main mold and the movable-side main mold in the resin molding die are, respectively to the fixed-side inlet piece and the movable inlet piece in order to perform efficiently the mold temperature control, and small mold temperature control conduit internal diameter, connected to the mold temperature controller The temperature control medium is provided in a short time so that the connection structure (hereinafter referred to as the manifold) can be attached to and removed from each connecting piece at both connection parts of the temperature control medium supply hose and recovery hose. Solved by possible mold structure.
[0010]
In this mold structure, on the side of each manifold in contact with the mold, the same number of holes are provided at the same position as the mold temperature control conduit, and the hose side connected to the mold temperature controller Are provided with connecting pipes for connecting hoses, each of which is connected via a hollow portion in the manifold.
[0011]
At this time, if there is a concern about pressure loss of the medium in consideration of the number and diameter of the mold temperature control pipelines, the manifold can be divided by increasing the number of hoses connected to the mold temperature controller. .
[0012]
By utilizing the mold structure according to the present invention, automobile parts such as vehicle grills, door handles, grips, various office equipment such as fax machines and copying machines, communication equipment such as mobile phones and portable terminals, A molded product suitable for a housing or chassis of a household electric product can be obtained stably. This mold can be applied to various molding methods such as injection molding of a thermoplastic resin, gas assist molding having a hollow molding part, and injection compression molding.
[0013]
The mold structure obtained by the present invention for raising and lowering the temperature efficiently and quickly and uniformly is the connecting part between the mold temperature control conduit and the hose connected to the mold temperature controller as described above. In this case, the inner diameter of the mold temperature control conduit is 3 mm to 8 mm, and can be realized by providing a large number of them within a range where there is no problem in mold strength.
[0014]
In the mold structure according to the present invention, it is desirable that the mold body be formed of a metal material having a thermal conductivity of 20 to 150 J / sec · m · deg for the purpose of quick temperature control. . Examples of the metal material belonging to such a range include non-ferrous alloys such as aluminum alloy, zinc alloy, and beryllium copper alloy in addition to steel and SUS.
[0015]
[Effects of the Invention]
According to the present invention, the mold temperature can be raised and lowered efficiently and quickly, and the time required for work preparation can be shortened. In addition, a mold temperature of 100 ° C. or higher can be easily realized in a short time and with a uniform temperature distribution on the mold surface.
[0016]
According to the present invention, a mold cooling / heating cycle in which the mold temperature is raised and lowered during one molding cycle can be realized without lengthening the molding cycle.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be disclosed with reference to the accompanying drawings showing examples. FIG. 1 is a sectional view of a mold structure according to the present invention. In this mold, a cavity 3 is formed on a mating surface between the fixed main mold 1 and the movable main mold 2.
[0018]
The cavity 3 is formed by a facing portion of the fixed side insertion piece 4 and the movable side insertion piece 5. The fixed side insert piece 4 and the movable side insert piece 5 are formed with ten mold temperature control pipes 6 (pipe
[0019]
In the
[0020]
Example 1
In Example 1, a temperature controller TURBU-TD-U4-H (manufactured by Cisco Corporation) was used, and hot water pressurized at 100 ° C. was circulated to the mold of the present invention at 1200 l / hr. The temperature rise rate and the mold temperature variation were measured. As a comparative example, the same experiment was performed using a mold of the same size and a mold with six cooling pipe inner diameters of 12 mm and compared. Note that a steel material having a thermal conductivity of 61 J / sec · m · deg was used as a material of the mold body.
[0021]
Regarding the heating rate, the example of the present invention was 5 times faster than the comparative example, and the temperature variation was 1/11 of the comparative example. Table 1 shows the results.
[0022]
[Table 1]
Example 2
In Example 2, a temperature controller TURBU-TD-U4-H (manufactured by Cisco) was used, and hot water pressurized at 100 ° C. was circulated through the mold of the present invention at 1200 l / hr to generate heat. The mold surface temperature and temperature variation after 50 shots of the molded product M shown in FIG. 3 were evaluated using a modified PPO resin NORYL SE1 (manufactured by GE Plastics Co., Ltd.), which is a plastic resin. As a comparative example, the same experiment was performed in the case where the same mold with the same insert piece structure and five inner diameters 12 mm for temperature control were performed and compared.
[0024]
According to the mold of the present invention, the average surface temperature after molding was 101 ° C. and the variation was 3 deg, whereas in the comparative example, the average surface temperature after molding was 112 ° C. and the variation was 15 deg. Table 2 shows the results of the mold surface temperature of Example 2.
[0025]
[Table 2]
【The invention's effect】
According to the present invention, the temperature rise and fall of the mold can be made uniform efficiently and in a short time, and the working time for the molding preparation can be shortened and stable molding becomes possible. Further, the mold temperature of 100 ° C. or higher can be reliably adjusted according to the set temperature.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a configuration example of an embodiment of a mold structure according to the present invention.
FIG. 2 is a diagram showing a configuration example of a manifold portion of an embodiment of a mold structure according to the present invention.
FIG. 3 is a perspective view of a molded product molded using the mold according to the present invention.
[Explanation of symbols]
1 Fixed side main type
2 Movable side main type
3 cavity
4 Fixed side insert
5 Movable side insert
6 Mold temperature control pipeline
7 Manifold
8 Seal material
9 Fluid hose
10 Hose connection opening
11 Opening for mold temperature control pipe connection
12 Manifold hollow part M Molded product
Claims (3)
該固定側入駒と可動側入駒には、それぞれ、内径３mmから８mmの金型温調用管路が金型強度上問題にならない範囲に設置され、
前記金型温調用管路には、
前記金型温調用管路に対して温調用媒体を供給するためのホース接続部を有し、前記金型温調用管路に適合せしめて分岐させるための供給側マニホールドと、
前記金型温調用管路からの温調用媒体を前記金型温調機に向けて回収するためのホース接続部を有し、前記金型温調用管路に適合せしめて分岐させるための回収側マニホールドとが、シール材を挟んで接続されており、
かつ、前記両マニホールドは脱着可能な別部品として構成され、供給側マニホールドと回収側マニホールドの双方が別々に固定側入駒と可動側入駒にそれぞれ、各入駒と接するように設置されていることを特徴とする短時間で温度制御可能な金型構造。 A resin molding die comprising a fixed main mold having a fixed entrance piece and a movable main mold having a movable entrance piece, and a cavity is formed on the mating surface of the fixed main mold and the movable main mold In the mold,
Each of the fixed-side entrance and the movable-side entrance is provided with a mold temperature control pipe having an inner diameter of 3 mm to 8 mm within a range where there is no problem in mold strength.
In the mold temperature control pipeline,
A supply side manifold for having a hose connection part for supplying a temperature control medium to the mold temperature control pipeline, and for branching in accordance with the mold temperature control pipeline;
A recovery side for having a hose connection part for recovering the temperature control medium from the mold temperature control pipeline toward the mold temperature controller, and for branching in accordance with the mold temperature control pipeline The manifold is connected with the sealing material in between.
In addition, both the manifolds are configured as detachable separate parts, and both the supply-side manifold and the recovery-side manifold are separately installed on the fixed-side entrance and the movable-side entrance respectively so as to contact each entrance . A mold structure capable of temperature control in a short time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28037496A JP3751383B2 (en) | 1996-09-30 | 1996-09-30 | Mold structure for temperature control in a short time |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28037496A JP3751383B2 (en) | 1996-09-30 | 1996-09-30 | Mold structure for temperature control in a short time |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10100157A JPH10100157A (en) | 1998-04-21 |
| JP3751383B2 true JP3751383B2 (en) | 2006-03-01 |
Family
ID=17624131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28037496A Expired - Lifetime JP3751383B2 (en) | 1996-09-30 | 1996-09-30 | Mold structure for temperature control in a short time |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3751383B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6861021B2 (en) | 2002-04-16 | 2005-03-01 | General Electric Company | Molding tool construction and molding method |
| JP4836131B2 (en) * | 2006-09-26 | 2011-12-14 | 三菱重工プラスチックテクノロジー株式会社 | Mold capable of rapid heating and cooling |
| JP5167074B2 (en) * | 2008-11-06 | 2013-03-21 | 株式会社松井製作所 | Heating / cooling switching device and mold heating / cooling system provided with the same |
| CN108407242B (en) * | 2018-05-11 | 2023-10-27 | 珠海格力精密模具有限公司 | Mould |
-
1996
- 1996-09-30 JP JP28037496A patent/JP3751383B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10100157A (en) | 1998-04-21 |
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