JP3741923B2 - Method of processing member by laser - Google Patents

Description

【００２３】
（３）次に、図１（ｃ）に示すように、エキシマレーザ５の弱めの加工により、樹脂基板１に予め形成された液室２からはみ出した接着剤４及び少々樹脂基板１を除去することにより、液室２からの流通路（流路、連絡路、吐出路）６を加工することができる。その上面が図２に示されている。なお、上記の流通路は、カード型分析器では試験機によって観察・分析される試験部ともなる。
【００２４】
なお、この第１実施例では、接着剤に基板が接した部位の接着剤の加工を行っているが、接着剤に接しない基板の下位に加工部位を配置するようにしてもよい。つまり、その加工部位に液室を加工することができる。
【００２５】
図３は係る接着剤に接しない樹脂基板の下位に加工部位（液室や流路）を配置するレーザ加工方法の説明図である。
【００２６】
この図において、樹脂基板１１の下部には窪み１２を介して加工部位１６が配置される。この加工部位１６に液室を加工する。つまり、樹脂基板１１とカバーとしての石英ガラス板１３は接着剤１４で接着され、この石英ガラス板１３上からエキシマレーザ１５を照射すると、接着剤１４が除去されるとともに、樹脂基板１１の表面から離れた加工部位１６の加工を行い、液室を形成することができる。
【００２７】
図４は多層の樹脂基板が接着剤により積層された樹脂基板におけるレーザ加工例を示す図である。
【００２８】
この図において、２１は下層の樹脂基板、２２は石英ガラス板、２３はその樹脂基板２１と石英ガラス板２２を接着する接着剤、その石英ガラス板２２上には接着剤２４を介して上層の樹脂基板２５を積み、その樹脂基板２５上には接着剤２６を介して石英ガラス板２７を接着する。つまり、２段に樹脂基板２１，２５が積層されている。
【００２９】
そこで、石英ガラス板２７の上方からエキシマレーザ２８を照射して、接着剤２６、接着剤２４、接着剤２３が除去されて、更に、その下位部位２９が液室として加工される。また、多層の途中の部位を加工して、液室や流路を形成するようにしてもよい。
【００３０】
なお、上記したように、エキシマレーザにより接着剤を加工した状態で、理想的には加工部分には付着物がない状態が望ましい。
【００３１】
しかしながら、図５に示すように、樹脂基板３１に予め形成された液室３２よりはみ出した接着剤３４を石英ガラス板３３を介してエキシマレーザ３８により加工すると、加工部分には、生成物３７が生じ、流通路３６を閉塞する恐れがある。
【００３２】
この生成物３７を除く方法として、従来は、一般には真空内で加工する、Ｈｅガスを充填するなどの方法が採られているが、設備等が増大することになる。
【００３３】
そこで、本発明では、以下のようにして、その生成物を除くようにしている。
【００３４】
図６は本発明の実施例を示すレーザ加工時の生成物の除去工程断面図である。
【００３５】
この図において、４１は樹脂基板、４２は予め形成された液室、４３はカバーとしての石英ガラス板、４４は樹脂基板４１に石英ガラス板４３を接着する接着剤である。そこで、図１に示したようにして、液室４２からはみ出した部位４５の接着剤４４が主にエキシマレーザにより除去される（接着剤４４と樹脂基板４１も除去される場合がある）と、そこに生成物４６が生じる場合がある。その生成物４６を除去するために、図６（ａ）の液室に水４７を導入する。
【００３６】
次に、図６（ｂ）に示すように、水の面に対してエキシマレーザ４８を照射する。これにより、水４７が反応し、そのとき発生する圧力で、生成物４６を除去する。
【００３７】
また、図６（ｃ）に示すように、その勢いで水が加工した部位内に導かれる。この作業を繰り返すことにより、加工による生成物４６を除去し、流通路４９を形成することができる。
【００３８】
流通路４９をさらに深く加工するには、図６（ｄ）に示すように、水４７が導入された流通路４９の上部からエキシマレーザ４８を照射する。水４７がはじかれる力により、表２に示すように流通路４９がより深く加工される。
【００３９】
【表２】

【００４０】
表２に示すように、水がある状態でエキシマレーザ加工を行うと、加工深さは深くなるが、表面の精度は粗い。一方、水がない状態でエキシマレーザ加工を行うと、加工深さは浅いが、表面の精度は細かい。
【００４１】
エキシマレーザにて作製した流通路の化学的性質をＦＴ・ＩＲ（フーリエ変換・赤外分光光度計）にて計測した結果を図７に示す。
【００４２】
図７では横軸に波数（ｃｍ^-1）を縦軸に吸光度を示しており、下部にアクリル表面ａの吸光度、上部にエキシマレーザによる加工面ｂ（流通路）の吸光度を示している。
【００４３】
この図から明らかなように、波数が約３０００ｃｍ^-1付近に変化が生じているが、これは表面に水酸基（ＯＨ基）が増えたことを表しており、親水性が増加していることが判明した。血液など液体を流す流通路の加工方法として、エキシマレーザ加工により親水化したことで、エキシマレーザによる流通路加工の優位性が示された。
【００４４】
図８は本発明の他の実施例を示すレーザ加工時の生成物の除去工程断面図である。
【００４５】
この図において、５１は多孔質の樹脂基板、５２は予め形成された液室、５３はカバーとしての石英ガラス板、５４は多孔質の樹脂基板５１と石英ガラス板５３とを接着する接着剤、５５は予め加工した通路である。
【００４６】
図６に示したように、図８（ａ）に示すように、液室５２からはみ出した部位の接着剤５４がエキシマレーザにより除去されると、そこに生成物が生じる場合がある。その生成物を除去するために、多孔質の樹脂基板５１を用いる。そこで、図８（ｂ）に示すように、石英ガラス板５３の上方よりエキシマレーザ５６を照射し、接着剤５４の加工を行う。
【００４７】
これにより、生じた生成物５７は、図８（ｃ）に示すように、多孔質の樹脂基板５１の隙間に入り込み、除去されて液室５２の閉塞を防ぐことができる。
【００４８】
上記したように、本発明の生成物の除去方法によれば、エキシマレーザ透過物質と下部の樹脂とを、予め接着剤（粘着剤、接着膜）で固定しておき、接合後に上面よりエキシマレーザにより、接着剤の加工を施すことにより、接着剤の流れ込みによる、流通路の閉塞がなくなる。
【００４９】
本発明は、従来例で示した血液検査等を簡便に行う使い捨てのカード型分析器の流通路の形成加工に好適であり、予めカバーと基板とを接合した後で、エキシマレーザをそのカバー越しに照射することで流通路を形成することができる。
【００５０】
また、加工後に生じる生成物（汚染物質）に対しては流通路に近い部分の水をレーザ照射することで反応による圧力を活用して取り除くことができる。
【００５１】
更に、多孔質の樹脂基板を用いて、レーザ加工時の生成物（汚染物質）をその多孔質の樹脂基板の隙間に吸収することにより、除去することができる。
【００５２】
なお、本発明のレーザ加工方法により、カード型分析器の他に、試薬の流通路加工や、インクジェットプリンターのインクの通路加工への応用も可能である。
【００５３】
また、上記実施例はエキシマレーザについて述べたが、これに限定するものではなく、各種の紫外線レーザを用いることができる。
【００５４】
なお、本発明は上記実施例に限定されるものではなく、本発明の趣旨に基づいて種々の変形が可能であり、これらを本発明の範囲から排除するものではない。
【００５５】
【発明の効果】
以上、詳細に説明したように、本発明によれば、以下のような効果を奏することができる。
【００５６】
（１）流通路を加工する前に、カバーを接着してから、レーザ透過物質上面より液室に通じる流通路を加工することにより、余剰な接着剤による流通路への流れ込みを防ぐことができる。
【００５７】
（２）予め形成された液室に水を封入しておくことにより、レーザによって圧力が生じ、加工によって発生する生成物（汚染物質）を除去することができる。
【００５８】
更に、水を封入した上でエキシマレーザ加工を行うと、水がない状態に比べて加工深度が深くなるため、高速加工や深さの深い加工が可能となる。
【００５９】
（３）多孔質の樹脂基板を用いることにより、レーザ加工時の生成物（汚染物質）をその多孔質の樹脂基板の隙間に吸収することができ、その生成物（汚染物質）を除去することができる。
【図面の簡単な説明】
【図１】 本発明の実施例を示すレーザによる流通路の加工工程断面図である。
【図２】 本発明の実施例を示すレーザによる流通路の加工された上面図である。
【図３】 接着剤に接しない樹脂基板の下位に加工部位（液室）を配置するレーザ加工方法の説明図である。
【図４】 多層の樹脂基板が接着剤により積層された樹脂基板におけるレーザ加工例を示す図である。
【図５】 レーザ加工による生成物が生じる状態を示す断面図である。
【図６】 本発明の実施例を示すレーザ加工時の生成物の除去工程断面図である。
【図７】 エキシマレーザ加工による親水基が増加した結果を示す図である。
【図８】 本発明の他の実施例を示すレーザ加工時の生成物の除去工程断面図である。
【符号の説明】
１，１１，３１，４１ 樹脂基板
２，３２，４２，５２ 液室（例えば、血液槽、試薬槽、インク槽など）
３，１３，２２，２７，３３，４３，５３ 石英ガラス板（カバー）
４，１４，２３，２４，２６，３４，４４，５４ 接着剤（粘着剤、接着膜）
５，１５，２８，３８，４８，５６ エキシマレーザ
６，３６，４９ 流通路（流路、連絡路、吐出路）
１２ 窪み
１６ 加工部位
２１ 下層の樹脂基板
２５ 上層の樹脂基板
２９ 下位部位
３７，４６，５７ 生成物
４５ 液室からはみだした部位
４７ 水
５１ 多孔質の樹脂基板
５５ 予め加工した通路[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a processing method for processing a member (flow passage) by irradiating a resin with an ultraviolet laser.
[0002]
[Prior art]
Conventionally, when bonding the lid of the micro conduit made of a resin, to prevent flow into the conduit of the adhesive, and Unishi by Ru a groove and availability across the conduit.
[0003]
Recently, the use of disposable card-type analyzers for performing blood tests and the like has been rapidly spreading. Conventional products have been formed by a method such as bonding a lid after forming a fine groove for guiding blood to the sensor.
[0004]
Further, laser processing has been used as the processing method.
[0005]
[Problems to be solved by the invention]
However, the conventional groove processing method described above has a problem in that defective products that are difficult to discriminate are mixed, for example, the fine grooves are clogged with excess adhesive.
[0006]
In addition, an increase in processing man-hours is a factor causing an increase in cost.
[0007]
Further, there is a problem with a method for removing a product (contaminant) generated by the laser processing.
[0008]
An object of the present invention is to provide a method and apparatus for processing a member using a laser capable of eliminating the above-mentioned problems, reducing the number of processing steps, and easily forming a flow path of a liquid chamber.
[0009]
[Means for Solving the Problems]
[1] The method for processing member by a laser, a cover of transparent material to the laser by means of an adhesive that absorbs a laser on a substrate obtained by processing the previously liquid chamber, with respect to the adhesive protruding from the liquid chamber It is characterized by irradiating a laser mainly from the upper surface of the cover of the transparent body, and processing the flow path from which the adhesive is removed at the portion irradiated with the laser .
[0010]
[2] The member processing method using a laser according to [1], wherein the liquid chamber is a liquid tank to be inspected.
[0011]
[3] The member processing method using a laser according to [2], wherein the liquid tank to be inspected is a blood tank.
[0012]
[4] In the member processing method using a laser as described in [1] above, the liquid chamber is a reagent tank.
[0013]
[5] In the member processing method using a laser as described in [1] above, the liquid chamber is an ink tank.
[0014]
[6] In a member processing method using laser, a transparent cover is adhered to a substrate with an adhesive that absorbs laser light, and a processing portion that becomes a liquid chamber on the substrate so as not to contact the adhesive. It was placed, the laser is irradiated with from the top of the cover mainly the transparent body with respect to the adhesive, characterized by machining the flow path to remove the adhesive portion to which the laser is irradiated.
[0015]
[7] In a member processing method using a laser, a processing portion to be a liquid chamber is disposed on a plurality of substrates bonded to a substrate with a transparent cover attached to the laser by an adhesive that absorbs the laser, and the multilayer bonding is performed. It is characterized by irradiating the agent mainly with a laser from the upper surface of the cover of the transparent body, and processing the flow path from which the multilayer adhesive is removed at the location irradiated with the laser. .
[0016]
[8] The method for processing member by laser, by means of an adhesive that absorbs a laser beam covers the transparent member to the laser on the substrate obtained by processing the previously liquid chamber, with respect to the adhesive protruding from the liquid chamber laser is irradiated with from the top of the cover mainly the transparent body Te, when processing the flow path to remove the adhesive portion to which the laser is irradiated, before Symbol liquid filled with water in a room, the protruding adhesive The product is mainly removed by a pressure that reacts with water during removal by a laser.
[0017]
[9] The method for processing member by laser, by means of an adhesive that absorbs a laser beam the cover of the transparent body with respect to the laser to the resin substrate of porous processing the previously liquid chamber, protruding from the fluid chamber wherein irradiating a laser from the top of the cover mainly the transparent body with respect to the adhesive, primarily due to laser Upon the pre Symbol protruded adhesive said laser machining passage for removing the adhesive locations irradiated During removal, the product enters the gap between the porous resin substrates to prevent the liquid chamber from being blocked.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0019]
FIG. 1 is a sectional view of a flow path machining process using a laser according to an embodiment of the present invention.
[0020]
(1) First, as shown in FIG. 1A, a resin substrate 1 such as acrylic in which a liquid chamber (for example, a liquid tank to be inspected, a blood tank, a reagent tank, an ink tank, etc.) 2 is processed, and a cover The quartz glass plate 3 is bonded with an adhesive 4 (including an adhesive and an adhesive film).
[0021]
(2) Next, as shown in FIG. 1B, the excimer laser 5 is irradiated from the upper surface of the quartz glass plate 3. At this time, since the workability of the adhesive 4, the resin substrate 1, and the quartz glass plate 3 varies depending on the intensity of the excimer laser 5, it is necessary to reduce the laser intensity for processing. That is, as shown in Table 1, (1) When the laser intensity is weak (for example, 100 mJ / cm ² or less), the adhesive and the resin substrate are processed, and the glass surface is not processed. (2) When the laser intensity is medium (for example, 100 mJ / cm ^{2 to} 380 m J / cm ² ), the adhesive and the resin substrate are processed, and the glass surface is partially processed. (3) When the laser intensity is high (380 mJ / cm ² or more), the adhesive and the resin substrate are not processed, and the glass surface is processed.
[0022]
[Table 1]

[0023]
(3) Next, as shown in FIG. 1 (c), the adhesive 4 protruding slightly from the liquid chamber 2 previously formed on the resin substrate 1 and a little resin substrate 1 are removed by a weak process of the excimer laser 5. Thus, the flow path (flow path, communication path, discharge path) 6 from the liquid chamber 2 can be processed. Its top surface is shown in FIG. In the card type analyzer, the flow passage is also a test unit that is observed and analyzed by a tester.
[0024]
In the first embodiment, the processing of the adhesive at the portion where the substrate is in contact with the adhesive is performed, but the processing portion may be arranged below the substrate that is not in contact with the adhesive. That is, the liquid chamber can be processed at the processing site.
[0025]
FIG. 3 is an explanatory diagram of a laser processing method in which a processing site (liquid chamber or flow path) is arranged below the resin substrate that does not contact the adhesive.
[0026]
In this figure, a processing site 16 is disposed under the resin substrate 11 via a recess 12. A liquid chamber is processed in the processing portion 16. That is, the resin substrate 11 and the quartz glass plate 13 as a cover are bonded together with an adhesive 14. When the excimer laser 15 is irradiated from above the quartz glass plate 13, the adhesive 14 is removed and the surface of the resin substrate 11 is removed. The liquid chamber can be formed by processing the remote processing portion 16.
[0027]
FIG. 4 is a diagram showing an example of laser processing on a resin substrate in which a multilayer resin substrate is laminated with an adhesive.
[0028]
In this figure, 21 is a lower resin substrate, 22 is a quartz glass plate, 23 is an adhesive for bonding the resin substrate 21 and the quartz glass plate 22, and an upper layer is bonded on the quartz glass plate 22 via an adhesive 24. A resin substrate 25 is stacked, and a quartz glass plate 27 is bonded onto the resin substrate 25 via an adhesive 26. That is, the resin substrates 21 and 25 are laminated in two stages.
[0029]
Therefore, the excimer laser 28 is irradiated from above the quartz glass plate 27, the adhesive 26, the adhesive 24, and the adhesive 23 are removed, and the lower portion 29 is further processed as a liquid chamber. Alternatively, a liquid chamber or a flow path may be formed by processing a part in the middle of the multilayer.
[0030]
Note that, as described above, in a state where the adhesive is processed by an excimer laser, ideally, a state where there is no deposit on the processed portion is desirable.
[0031]
However, as shown in FIG. 5, when the adhesive 34 protruding from the liquid chamber 32 formed in advance on the resin substrate 31 is processed by the excimer laser 38 through the quartz glass plate 33, the product 37 is formed in the processed portion. This may cause the flow path 36 to be blocked.
[0032]
As a method for removing the product 37, conventionally, methods such as processing in a vacuum or filling with He gas are generally used, but the facilities and the like increase.
[0033]
Therefore, in the present invention, the product is removed as follows.
[0034]
FIG. 6 is a sectional view of a product removal process during laser processing showing an embodiment of the present invention.
[0035]
In this figure, 41 is a resin substrate, 42 is a liquid chamber formed in advance, 43 is a quartz glass plate as a cover, and 44 is an adhesive for bonding the quartz glass plate 43 to the resin substrate 41. Therefore, as shown in FIG. 1, when the adhesive 44 in the portion 45 protruding from the liquid chamber 42 is mainly removed by the excimer laser (the adhesive 44 and the resin substrate 41 may also be removed), There may be a product 46. In order to remove the product 46, water 47 is introduced into the liquid chamber of FIG.
[0036]
Next, as shown in FIG. 6B, an excimer laser 48 is irradiated on the surface of water. Thereby, the water 47 reacts, and the product 46 is removed by the pressure generated at that time.
[0037]
Moreover, as shown in FIG.6 (c), water is guide | induced in the site | part which processed with that momentum. By repeating this operation, the product 46 resulting from the processing can be removed and the flow passage 49 can be formed.
[0038]
In order to process the flow path 49 further deeply, as shown in FIG. 6D, the excimer laser 48 is irradiated from the upper part of the flow path 49 into which the water 47 is introduced. As shown in Table 2, the flow path 49 is processed deeper due to the force by which the water 47 is repelled.
[0039]
[Table 2]

[0040]
As shown in Table 2, when excimer laser processing is performed in the presence of water, the processing depth increases, but the surface accuracy is rough. On the other hand, when excimer laser processing is performed in the absence of water, the processing depth is shallow, but the surface accuracy is fine.
[0041]
FIG. 7 shows the results of measuring the chemical properties of the flow path produced by the excimer laser using FT / IR (Fourier transform / infrared spectrophotometer).
[0042]
In FIG. 7, the horizontal axis represents the wave number (cm ⁻¹ ), the vertical axis represents the absorbance, the lower portion represents the absorbance of the acrylic surface a, and the upper portion represents the absorbance of the processing surface b (flow path) by the excimer laser.
[0043]
As is clear from this figure, the wave number changes around 3000 cm ⁻¹ , which indicates that the number of hydroxyl groups (OH groups) on the surface has increased, and that hydrophilicity has increased. found. As a processing method of the flow path for flowing a liquid such as blood, the superiority of the flow path processing by excimer laser was shown by making it hydrophilic by excimer laser processing.
[0044]
FIG. 8 is a sectional view of a product removal process during laser processing showing another embodiment of the present invention.
[0045]
In this figure, 51 is a porous resin substrate, 52 is a pre-formed liquid chamber, 53 is a quartz glass plate as a cover, 54 is an adhesive that bonds the porous resin substrate 51 and the quartz glass plate 53, 55 is a pre-processed passage.
[0046]
As shown in FIG. 6, as shown in FIG. 8A, when the adhesive 54 at a portion protruding from the liquid chamber 52 is removed by the excimer laser, a product may be generated there. In order to remove the product, a porous resin substrate 51 is used. Therefore, as shown in FIG. 8B, the excimer laser 56 is irradiated from above the quartz glass plate 53 to process the adhesive 54.
[0047]
As a result, as shown in FIG. 8C, the generated product 57 enters the gaps in the porous resin substrate 51 and is removed to prevent the liquid chamber 52 from being blocked.
[0048]
As described above, according to the method for removing a product of the present invention, the excimer laser transmitting substance and the lower resin are fixed in advance with an adhesive (adhesive, adhesive film), and the excimer laser is bonded from the upper surface after bonding. Therefore, the flow path is not blocked by the flow of the adhesive by processing the adhesive.
[0049]
INDUSTRIAL APPLICABILITY The present invention is suitable for forming a flow path of a disposable card-type analyzer that can easily perform blood tests and the like shown in the conventional example. By irradiating, a flow path can be formed.
[0050]
Further, the product (contaminant) generated after processing can be removed by utilizing the pressure due to the reaction by irradiating a portion of water close to the flow path with laser.
[0051]
Furthermore, the porous resin substrate can be removed by absorbing a product (contaminant) at the time of laser processing in the gap between the porous resin substrates.
[0052]
In addition to the card type analyzer, the laser processing method of the present invention can be applied to reagent flow path processing and ink path processing of an ink jet printer.
[0053]
Moreover, although the said Example demonstrated the excimer laser, it is not limited to this, Various ultraviolet lasers can be used.
[0054]
In addition, this invention is not limited to the said Example, A various deformation | transformation is possible based on the meaning of this invention, and these are not excluded from the scope of the present invention.
[0055]
【The invention's effect】
As described above in detail, according to the present invention, the following effects can be obtained.
[0056]
(1) Before the flow path is processed, the cover is bonded, and then the flow path that leads from the upper surface of the laser transmitting material to the liquid chamber is processed, thereby preventing excessive adhesive from flowing into the flow path. .
[0057]
(2) By enclosing water in a liquid chamber formed in advance, pressure is generated by the laser, and products (contaminants) generated by processing can be removed.
[0058]
Furthermore, when excimer laser processing is performed after enclosing water, the processing depth becomes deeper than that without water, so that high-speed processing and deep processing are possible.
[0059]
(3) By using a porous resin substrate, the product (contaminant) at the time of laser processing can be absorbed in the gap between the porous resin substrate, and the product (contaminant) is removed. Can do.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a flow path machining process using a laser, showing an embodiment of the present invention.
FIG. 2 is a processed top view of a flow path by a laser according to an embodiment of the present invention.
FIG. 3 is an explanatory diagram of a laser processing method in which a processing site (liquid chamber) is disposed below a resin substrate that does not contact an adhesive.
FIG. 4 is a diagram showing an example of laser processing on a resin substrate in which a multilayer resin substrate is laminated with an adhesive.
FIG. 5 is a cross-sectional view showing a state in which a product is generated by laser processing.
FIG. 6 is a cross-sectional view of a product removal process during laser processing showing an embodiment of the present invention.
FIG. 7 is a diagram showing a result of an increase in hydrophilic groups by excimer laser processing.
FIG. 8 is a cross-sectional view of a product removal process during laser processing showing another embodiment of the present invention.
[Explanation of symbols]
1, 11, 31, 41 Resin substrate 2, 32, 42, 52 Liquid chamber (for example, blood tank, reagent tank, ink tank, etc.)
3, 13, 22, 27, 33, 43, 53 Quartz glass plate (cover)
4, 14, 23, 24, 26, 34, 44, 54 Adhesive (adhesive, adhesive film)
5, 15, 28, 38, 48, 56 Excimer laser 6, 36, 49 Flow path (flow path, communication path, discharge path)
12 Indentation 16 Processed part 21 Lower layer resin substrate 25 Upper layer resin substrate 29 Lower part 37, 46, 57 Product 45 Part protruded from liquid chamber 47 Water 51 Porous resin substrate 55 Pre-processed passage

Claims (9)

In a method of processing a member by laser,
(A) Adhering a transparent cover to the substrate on which the liquid chamber has been processed in advance with an adhesive that absorbs the laser ;
(B) characterized in that the main the irradiated laser a more cover the upper surface of the transparent body, the processing flow passage removing the adhesive portion to which the laser is irradiated to the adhesive protruding from the liquid chamber The processing method of the member by the laser.   2. The laser processing method for a member according to claim 1, wherein the liquid chamber is a liquid tank to be inspected.   3. A laser processing method for a member according to claim 2, wherein the liquid tank to be inspected is a blood tank.   2. The laser processing method for a member according to claim 1, wherein the liquid chamber is a reagent tank.   2. The laser processing method for a member according to claim 1, wherein the liquid chamber is an ink tank. In a method of processing a member by laser,
(A) Adhering a transparent cover to the substrate with an adhesive that absorbs laser light to the laser ;
(B) Arrange a processing site to be a liquid chamber on the substrate so as not to contact the adhesive,
(C) the laser is irradiated with from the top of the cover mainly the transparent body with respect to the adhesive, the member by the laser, characterized in that said laser machining flow path to remove the adhesive locations irradiated Processing method. In a method of processing a member by laser,
(A) A processing portion to be a liquid chamber is arranged on a substrate having a plurality of layers bonded to the substrate with a transparent cover with respect to the laser by an adhesive that absorbs the laser ,
(B) The multi-layer adhesive is irradiated with a laser mainly from the upper surface of the cover of the transparent body , and the flow path from which the multi-layer adhesive is removed at the portion irradiated with the laser is processed. processing method of the member according to the Relais over the be with. In a method of processing a member by laser,
(A) Adhering a transparent cover to a substrate on which a liquid chamber has been processed in advance with an adhesive that absorbs laser light ;
(B) a laser is irradiated with from the top of the cover mainly the transparent body with respect to the adhesive protruding from the liquid chamber, when the laser processing a flow path to remove the adhesive locations irradiated,
(C) before SL liquid filled with water in the room, a processing method of the member by a laser, characterized in that the removal of the product adhesive the protruding pressure that reacts with water during removal primarily by laser. In a method of processing a member by laser,
(A) Adhering a transparent cover to a porous resin substrate whose liquid chamber has been processed in advance with an adhesive that absorbs laser light ;
(B) it is irradiating a laser from the top of the cover mainly the transparent body with respect to the adhesive protruding from the liquid chamber, when the laser processing a flow passage for removing the adhesive locations irradiated,
(C) before SL product upon removal primarily by laser the adhesive enters the gap between the resin substrate of the porous protruding, processing method members by laser, characterized in that to prevent the clogging of the liquid chamber.

Images