JP3735052B2 - Substrate contact temperature measuring apparatus and substrate heat treatment apparatus having the same - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
This invention carries a substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display device, a glass substrate for a photomask, and an optical disk substrate into a heat treatment furnace one by one and heats the substrate by light irradiation or the like to heat-treat the substrate. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a temperature measuring device that measures the temperature of a substrate to be heat-treated in a contact manner, and a substrate heat treatment device equipped with the contact temperature measuring device, and more particularly to a technique for adjusting the attitude of a temperature measuring body. .
[0002]
[Prior art]
In a semiconductor device manufacturing process, like a lamp annealing apparatus or a CVD apparatus, a substrate, for example, a semiconductor wafer, for example, is carried one by one into a heat treatment furnace, and the wafer is heated and heat-treated by irradiating the wafer with light. Leaf-type heat treatment apparatuses are widely used in various processes. FIG. 2 shows an example of the configuration of the lamp annealing apparatus.
[0003]
The lamp annealing apparatus shown in a schematic side sectional view in FIG. 2 includes a heat treatment furnace 50 having an opening 52 for carrying in and out the semiconductor wafer W on the front side. The furnace wall of the heat treatment furnace 50 is formed of a light transmissive material, for example, quartz glass. A furnace port block 54 is provided on the opening 52 side of the heat treatment furnace 50 so as to be connected to the heat treatment furnace 50. An O-ring 56 is attached to the joint surface between the front end surface of the heat treatment furnace 50 and the furnace port block 54, and the airtightness inside the heat treatment furnace 50 is maintained.
[0004]
A mounting portion 58 is provided in the furnace port block 54, and a susceptor 60 made of quartz is fixed to the mounting portion 58. The susceptor 60 is horizontally held with a soaking ring 62 that is formed in a thin plate-like ring shape of high-purity SiC and has an inner diameter dimension equivalent to the outer diameter dimension of the wafer W. Support pins 64 are implanted in the susceptor 60 at a plurality of places, for example, two places. In addition, a temperature measuring body 66 of a temperature measuring device that measures the temperature of the wafer W by a contact method is attached to the attaching portion 58 in the horizontal direction. The temperature measuring element 66 has a structure in which, for example, an R thermocouple is inserted into a covering member formed in a narrow tubular shape whose tip is closed with high-purity SiC. The upper end of the temperature measuring body 66 is formed on a flat surface and is held horizontally. The wafer W is supported in a horizontal posture concentrically with the heat equalizing ring 62 by the tip of the temperature measuring body 66 and the two support pins 64 of the susceptor 60.
[0005]
Although not shown, the front opening of the furnace port block 54 is opened and closed by a movable flange so as to face the front opening of the furnace port block 54 so that the wafer W is in a horizontal posture. A wafer loading / unloading robot that has a supporting arm and loads the unprocessed wafer W into the heat treatment furnace 50 and unloads the processed wafer W from the heat treatment furnace 50 is installed.
[0006]
A plurality of lamps 68 as light irradiation means such as a halogen lamp and a xenon lamp are arranged in a row above and below the heat treatment furnace 50 so as to face the upper furnace wall and the lower furnace wall, respectively. A reflector (reflector) 70 whose inner surface is mirror-polished or the like is disposed so as to surround the heat treatment furnace 50 behind the lamp 68 and on both sides and the rear side of the heat treatment furnace 50. Note that the lamp 68 may be disposed only above the heat treatment furnace 50.
[0007]
A gas introduction path 72 is formed on the rear side of the heat treatment furnace 50, and the gas introduction path 72 is connected to a supply source of a processing gas such as nitrogen. Although not shown, a gas exhaust path is formed in the furnace port block 54.
[0008]
In this lamp annealing apparatus, the temperature measuring body 66 is brought into contact with the lower surface of the wafer W, the temperature of the wafer W is measured by the temperature measuring apparatus, and a controller (not shown) is based on the deviation between the measured temperature and the target temperature. ) To perform the control operation and calculate the electric power supplied to the lamp 68. As described above, since the temperature measuring body 66 is brought into contact with the lower surface of the wafer W and the temperature of the wafer W is measured in a contact manner, the contact state between the temperature measuring body 66 and the lower surface of the wafer W affects the temperature measurement accuracy. . Since the wafer W is heated by feedback control based on the measured temperature, the quality of the temperature measurement accuracy is a dominant factor in process reproducibility and machine-to-apparatus difference. Therefore, it is extremely important to optimize the contact state between the temperature measuring member 66 and the lower surface of the wafer W. Conventionally, the positional relationship between the temperature measuring element 66 and the wafer W is adjusted between the flat surface on the upper end of the temperature measuring element 66 and the lower surface of the wafer W as shown in FIGS. The operator manually operates the base of the temperature measuring body 66 from the position of the mounting portion 58 of the furnace port block 54 so that the gap cannot be visually confirmed. It was done by adjusting the posture.
[0009]
[Problems to be solved by the invention]
However, in the method in which the operator manually operates the base of the temperature measuring body 66 from the position of the mounting portion 58 of the furnace port block 54 to adjust the posture of the tip of the rod-shaped temperature measuring body 66, the measurement is performed. It is very difficult to make fine adjustment so that the gap between the flat surface on the upper end of the warm body 66 and the lower surface of the wafer W is as small as possible.
[0010]
The present invention has been made in view of such circumstances, and provides a contact temperature measuring device for a substrate that can easily fine-tune the position of the tip of a rod-shaped temperature measuring element, and Another object of the present invention is to provide a substrate heat treatment apparatus including a contact temperature measuring apparatus.
[0011]
[Means for Solving the Problems]
According to the first aspect of the present invention, the temperature of the substrate is controlled by bringing the flat surface on the top end of the temperature measuring element arranged in a horizontal direction in a bar shape into contact with the lower surface of the substrate heated by the heating means and heat-treated. In a contact temperature measuring apparatus for a substrate to be measured by a contact method, a holder for holding the temperature measuring body in a cantilever manner with the base of the temperature measuring body fixed, and a tip of the temperature measuring body centered on the holder As a pitching adjustment unit that swings in the vertical direction, a rolling adjustment unit that rotates the temperature sensor around its axis, and a Z-axis direction adjustment unit that moves the temperature sensor as a whole in the vertical direction. An adjustment mechanism configured to slightly move the holder to adjust the posture of the flat surface on the upper end of the temperature measuring element, a space in which the adjustment mechanism is provided, and the temperature measuring element are provided. Isolates the space by allowing the temperature sensor to move and maintaining airtightness An airtight isolation means that, characterized by comprising a.
[0012]
According to a second aspect of the present invention, in the contact-type temperature measuring device according to the first aspect, the holder and the adjusting mechanism are connected by a connecting shaft orthogonal to the temperature measuring body, and the hermetic isolation means is connected to the connecting temperature measuring device. An outer fitting member that is integrally fitted to the shaft and has a collar portion that tightly adheres to the holder, a cylindrical member that is fixed so as to surround the holder and the connecting shaft, and is fixed to the inside of the cylindrical member Or an inner cylinder member held slidably, a seal member interposed between an inner circumferential surface of the cylindrical member and an outer circumferential surface of the inner cylinder member, a flange portion of the outer fitting member, and the And a cylindrical bellows member connecting the inner cylinder member .
[0013]
According to a third aspect of the present invention, the temperature of the substrate is adjusted by bringing a flat surface on the upper end of the temperature measuring element arranged in a horizontal direction in a rod shape into contact with the lower surface of the substrate heated by the heating means and heat-treated. In the contact-type temperature measuring device for a substrate to be measured by a contact type , a holder for holding the temperature measuring body in a cantilever manner with the base of the temperature measuring body fixed, and a connecting shaft orthogonal to the temperature measuring body on the holder. And an adjustment mechanism that adjusts the attitude of the flat surface on the top end of the temperature sensing element by slightly moving the holder, and is externally fitted integrally with the connecting shaft and is hermetically adhered to the holder outer fitting member having a flange portion which, the holder and fixed so as to surround the connecting shaft-cylinder member is fixed inside of the cylindrical member or slidably retained within the cylindrical member, the It is inserted between the inner peripheral surface of the cylindrical member and the outer peripheral surface of the inner cylindrical member. Sealing member, and is configured to include a tubular bellows member which connects the the inner cylinder member and the flange portion of said outer fitting member, the temperature sensing element and the space in which the adjusting mechanism is disposed is arranged And a hermetic isolation means for allowing the temperature measuring body to move and isolating the space while maintaining airtightness .
[0014]
According to a fourth aspect of the present invention, in the contact-type temperature measuring device according to the third aspect, the adjustment mechanism includes a pitching adjustment unit that swings the tip of the temperature measuring element in the vertical direction around the holder; The temperature measuring element is composed of a rolling adjustment unit that rotates about its axis, and a Z-axis direction adjustment unit that moves the whole temperature measuring element in the vertical direction.
An invention according to claim 5 is a substrate heat treatment apparatus, comprising the substrate contact temperature measuring apparatus according to any one of claims 1 to 4 , wherein the heating means is a light irradiation means, The substrate is heated and heat-treated.
[0015]
In the contact-type temperature measuring device according to the first aspect of the present invention, the attitude of the flat surface on the upper end of the temperature measuring body can be adjusted by slightly moving the holder by the adjusting mechanism. That is, the pitching adjustment unit swings the tip of the temperature measuring element in the vertical direction around the holder, so that when the temperature measuring object is viewed from the side of the flat surface above the tip of the temperature measuring element. The tilt angle with respect to the horizontal plane is finely adjusted. In addition, by rotating the temperature measuring element around its axis by the rolling adjustment unit, the inclination angle of the flat surface above the tip of the temperature measuring element with respect to the horizontal plane when the temperature measuring object is viewed from the front direction Is fine-tuned. Furthermore, the height position of the flat surface on the upper end of the temperature measuring element, which is changed by the adjustment operation by the pitching adjusting unit, is moved by moving the entire temperature measuring element in the vertical direction by the Z-axis direction adjusting unit. Is adjusted again to a predetermined position where it can be supported in a horizontal posture. Therefore, it is possible to easily finely adjust the posture of the tip of the rod-shaped temperature measuring element. In addition, the space where the temperature measuring element is arranged, that is, the inside of the heat treatment furnace of the heat treatment apparatus and the space where the adjusting mechanism is arranged, that is, the outside of the heat treatment furnace, allow the movement of the temperature measuring element by airtight isolation means. However, since it is isolated while maintaining airtightness, even if an operation for adjusting the attitude of the temperature measuring body is performed, no leakage or the like from the inside of the heat treatment furnace occurs.
[0016]
In the contact-type temperature measuring device according to the second aspect of the present invention, the space in which the temperature measuring body is disposed and the space in which the adjustment mechanism is disposed include a holder, an outer fitting member, a cylindrical bellows member, an inner cylindrical member, and The seal member keeps airtight and is isolated. Further, a flange portion of the outer fitting member that is airtightly attached to a holder that moves slightly in accordance with an adjustment operation by the adjustment mechanism, and an inner cylinder member that is fixed or slidably held inside the fixed cylinder member Are connected via a cylindrical bellows member, and therefore, when adjusting the attitude of the temperature measuring body, the movement of the holder, and hence the temperature measuring body held by the holder, is not restricted by the inner cylinder member. .
[0017]
In the contact-type temperature measuring device according to the third aspect of the present invention, the attitude of the flat surface on the upper end of the temperature measuring body can be adjusted by slightly moving the holder by the adjusting mechanism. Therefore, it is possible to easily finely adjust the posture of the tip of the rod-shaped temperature measuring element. In addition, the space in which the temperature measuring element is arranged, that is , the inside of the heat treatment furnace of the heat treatment apparatus, and the space in which the adjustment mechanism is arranged , that is, the outside of the heat treatment furnace are a holder, an external fitting member, a cylindrical bellows member, The inner cylinder member and the seal member are isolated from each other while maintaining airtightness. Further, a flange portion of the outer fitting member that is airtightly attached to a holder that moves slightly in accordance with an adjustment operation by the adjustment mechanism, and an inner cylinder member that is fixed or slidably held inside the fixed cylinder member Are connected via a cylindrical bellows member, and therefore, when adjusting the attitude of the temperature measuring body, the movement of the holder, and hence the temperature measuring body held by the holder, is not restricted by the inner cylinder member. . As described above, it is possible to perform an operation of adjusting the posture of the temperature measuring body without causing a leak from the heat treatment furnace.
[0018]
In the contact-type temperature measuring device according to the fourth aspect of the present invention, the tip of the temperature measuring element is swung in the vertical direction around the holder by the pitching adjustment unit, so that the flat surface above the tip of the temperature measuring element is The inclination angle with respect to the horizontal plane when the temperature measuring body is viewed from the side is finely adjusted. In addition, by rotating the temperature measuring element around its axis by the rolling adjustment unit, the inclination angle of the flat surface above the tip of the temperature measuring element with respect to the horizontal plane when the temperature measuring object is viewed from the front direction Is fine-tuned. Furthermore, the height position of the flat surface on the upper end of the temperature measuring element, which is changed by the adjustment operation by the pitching adjusting unit, is moved by moving the entire temperature measuring element in the vertical direction by the Z-axis direction adjusting unit. Is adjusted again to a predetermined position where it can be supported in a horizontal posture.
In the substrate heat treatment apparatus of the invention according to claim 5, since the temperature measuring body is held in an optimum posture by finely adjusting the posture of the tip of the temperature measuring member by the adjustment mechanism, during the heat treatment of the substrate, The temperature of the substrate is accurately detected by the temperature sensor.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
A preferred embodiment of the present invention will be described below with reference to FIG.
[0020]
FIG. 1 shows an example of an embodiment of the present invention, and is a side view partially showing a substrate contact temperature measuring device in a longitudinal section. This contact temperature measuring apparatus is used by being mounted on a substrate heat treatment apparatus, for example, a lamp annealing apparatus. FIG. 1 does not show the overall configuration of the lamp annealing apparatus, but the main body portion of the temperature measuring apparatus is installed in a furnace port block mounting portion (see FIG. 2) provided on the opening side of the heat treatment furnace. .
[0021]
This contact-type temperature measuring device has a rod-like shape and is arranged in the horizontal direction (the structure of the temperature measuring body 10 itself is not different from the conventional one, so the description thereof is omitted here). A holder 12 for holding the temperature measuring body 10 in a cantilever manner, an adjustment mechanism 14 for adjusting the posture of the flat surface on the upper end of the temperature measuring body 10 by slightly moving the holder 12, and a holder 12 and the connecting shaft 16 that connects the adjusting mechanism 14 and the space in which the temperature measuring body 10 is provided, that is, the inside of the heat treatment furnace 20, and the space in which the adjusting mechanism 14 is provided, that is, the outside of the heat treatment furnace 20. Are provided with a movable seal portion 18 that allows the temperature sensing element 10 to move and keeps hermeticity and is isolated.
[0022]
The connecting shaft 16 has an upper end fixed to the lower surface side of the holder 12 and is arranged in a vertical direction so as to be orthogonal to the temperature measuring body 10. The lower end side is not shown in detail, but via a connector. The adjustment mechanism 14 is detachably connected. The adjustment mechanism 14 includes a rolling adjustment stage 22, a pitching adjustment stage 24, and a Z-axis direction adjustment stage 26.
[0023]
The rolling adjustment stage 22 has a movable base 22b with respect to the fixed base 22a with the center position of the holder 12 (position where the axis of the temperature measuring body 10 and the axis of the connecting shaft 16 intersect) O as the center of FIG. It is configured to swing in a direction orthogonal to the paper surface. The temperature measuring body 10 is rotated around the axial center line by the rolling adjustment stage 22 as indicated by an arrow A, and the temperature measuring body 10 on the flat surface on the upper end of the temperature measuring body 10 is moved in the front direction. The inclination angle with respect to the horizontal plane when viewed from (see FIG. 3B) is finely adjusted. In addition, the pitching adjustment stage 24 has a movable base 24b (and a rolling adjustment stage 22 attached on the movable base 24b) with respect to the fixed base 24a in a direction along the paper surface of FIG. Is configured to swing. By this pitching adjustment stage 24, the tip of the temperature sensing element 10 is swung up and down around the center position O of the holder 12 as shown by an arrow B, and the temperature sensor 10 is flat above the tip of the temperature sensing element 10. The inclination angle of the surface with respect to the horizontal plane when the temperature measuring element 10 is viewed from the side (see FIG. 3A) is finely adjusted. The rolling adjustment stage 22 and the pitching adjustment stage 24 are each provided with a scale indicating an adjustment angle with respect to the horizontal plane, and the operator can perform an adjustment operation while viewing the scale. .
[0024]
The Z-axis direction adjustment stage 26 is configured to reciprocate the rolling adjustment stage 22 and the pitching adjustment stage 24 attached to the Z-axis direction adjustment stage 24 and the connecting shaft 16 and the entire holder 12 in the vertical direction. With the Z-axis direction adjustment stage 26, the whole temperature sensing element 10 is moved in the vertical direction. The height position of the flat surface on the upper end of the temperature sensing element 10 changes with the adjustment operation by the pitching adjustment stage 24. After the adjustment by the pitching adjustment stage 24, the Z-axis direction adjustment stage 26 By moving the whole temperature sensing element 10 in the vertical direction, the height position of the flat surface on the upper end of the temperature sensing element 10 is adjusted to a predetermined position where the substrate can be supported in a horizontal posture. You can fix it. The Z-axis direction adjustment stage 26 is provided with a scale indicating the height position with respect to the reference plane, and the operator can perform an adjustment operation while viewing the scale.
[0025]
The movable seal portion 18 is integrally fitted to the outer peripheral surface side of the connecting shaft 16 and has an outer fitting member 30 having a flange portion 32 that is tightly adhered to the lower surface of the holder 12 with an O-ring 28 interposed therebetween. And a cylindrical member 34 fixed so as to surround the connecting shaft 16, an inner cylindrical member 36 fixed (or slidably held) inside the cylindrical member 34, an inner peripheral surface of the cylindrical member 34, and an inner cylindrical member The seal ring 38 is interposed between the outer peripheral surface 36 and the cylindrical bellows member 40 that connects the flange portion 32 of the outer fitting member 30 and the inner cylindrical member 36. The cylindrical member 34 is in airtight contact with the opening-side end surface of the heat treatment furnace 20 with an O-ring 42 interposed therebetween.
[0026]
By including the movable seal portion 18 having such a configuration, gas leaks from the inside of the heat treatment furnace 20 in which the temperature measuring body 10 is disposed, or outside air enters the heat treatment furnace 20, There is no worry. In addition, since the flange portion 32 of the outer fitting member 30 that is in close contact with the holder 12 and the inner cylindrical member 36 disposed inside the cylindrical member 34 are connected via the cylindrical bellows member 40, the cylindrical member 34 and The temperature measuring body 10, the holder 12, the connecting shaft 16, and the outer fitting member 30 can slightly move with respect to the inner cylinder member 36. For this reason, while the airtight state between the inner peripheral surface of the cylindrical member 34 and the outer peripheral surface of the inner cylindrical member 36 is maintained by the seal ring 38, the holder 12 and the temperature measuring body 10 are slightly moved by the adjustment mechanism 14 to measure the temperature. The posture of the body 10 can be adjusted.
[0027]
The adjustment mechanism 14 and the movable seal portion 18 are not limited to the configuration shown in the above embodiment, and may have any configuration as long as they have similar functions.
[0028]
The contact-type temperature measuring apparatus having the configuration shown in FIG. 1 can be provided in a substrate heat treatment apparatus, for example, a lamp annealing apparatus shown in FIG. The configuration of the lamp annealing apparatus has been described above with reference to FIG. Thus, in the lamp annealing apparatus provided with the contact-type temperature measuring device, the wafer W is adjusted by finely adjusting the attitude of the tip of the temperature measuring body 14 (the temperature measuring body 66 in FIG. 2; the same applies hereinafter). On the other hand, the temperature measuring body 14 can be held in an optimum posture. Therefore, since the heat treatment of the wafer W is performed in a state in which the gap between the flat surface of the tip of the temperature measuring body 14 and the lower surface of the wafer W is minimized, the temperature of the wafer W being heat treated by the temperature measuring body 14 is increased. It is detected with high accuracy. For this reason, it becomes possible to heat-treat the wafer W with higher accuracy.
[0029]
【The invention's effect】
According to the substrate contact temperature measuring device of each of the first and third aspects of the present invention, the posture of the tip of the rod-shaped temperature measuring element can be easily finely adjusted, and the time required for adjustment can be shortened. Labor can be reduced.
[0030]
In the contact-type temperature measuring device according to the second aspect of the present invention, the space in which the temperature measuring body is disposed and the space in which the adjustment mechanism is disposed are reliably separated from each other while maintaining airtightness. The posture can be adjusted .
[0031]
In the contact-type temperature measuring device according to the fourth aspect of the present invention, the posture of the tip of the temperature measuring element can be easily adjusted by operating the three adjustment units, the pitching adjustment unit, the rolling adjustment unit, and the Z-axis direction adjustment unit. Can be adjusted .
[0032]
When the substrate heat treatment apparatus of the invention according to claim 5 is used, the above-described effects of the inventions according to claims 1 to 4 can be obtained, so that the temperature of the substrate subjected to the heat treatment can be detected more accurately. It becomes possible to do. For this reason, heat treatment with higher accuracy can be performed on the substrate.
[Brief description of the drawings]
FIG. 1 is a side view showing a part of a contact temperature measuring apparatus for a substrate in a longitudinal section according to an embodiment of the present invention.
FIG. 2 is a side sectional view showing an example of the configuration of a lamp annealing apparatus.
FIG. 3 is a partially enlarged view for explaining a method of adjusting the positional relationship between the temperature measuring element and the wafer.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Temperature measuring body 12 Holder 14 Adjustment mechanism 16 Connecting shaft 18 Movable seal part 20 Heat treatment furnace 22 Rolling adjustment stage 24 Pitching adjustment stage 26 Z-axis direction adjustment stage 28, 42 O-ring 30 Outer fitting member 32 Gutter part of outer fitting member 34 cylinder member 36 inner cylinder member 38 seal ring 40 cylindrical bellows member

Claims (5)

Contact of the substrate which measures the temperature of the substrate in a contact type by bringing the flat surface on the top end of the temperature measuring element arranged in a horizontal direction into contact with the lower surface of the substrate heated by the heating means and heat-treated. In the temperature measuring device,
A holder to which the base of the temperature sensor is fixed and to hold the temperature sensor in a cantilevered manner;
A pitching adjustment unit that swings the tip of the temperature measuring element in the vertical direction around the holder, a rolling adjustment unit that rotates the temperature measuring element around its axis, and An adjustment mechanism that is composed of a Z-axis direction adjustment unit that moves the whole in the vertical direction, and that adjusts the posture of the flat surface on the upper end of the temperature sensing element by slightly moving the holder;
An airtight isolation means for isolating the space in which the adjusting mechanism is disposed and the space in which the temperature measuring body is disposed while allowing the temperature measuring body to move and maintaining airtightness;
A contact temperature measuring apparatus for a substrate, comprising: The holder and the adjustment mechanism are connected by a connecting shaft orthogonal to the temperature measuring body,
The airtight isolation means is
An outer fitting member integrally fitted to the connecting shaft and having a flange that is airtightly adhered to the holder;
A cylindrical member fixed so as to surround the holder and the connecting shaft;
An inner cylinder member fixed or slidably held inside the cylinder member;
A seal member interposed between the inner peripheral surface of the cylindrical member and the outer peripheral surface of the inner cylindrical member;
A cylindrical bellows member connecting the flange portion of the outer fitting member and the inner cylindrical member;
Contact temperature measuring device of the substrate according to claim 1, wherein configured with a. Contact of the substrate which measures the temperature of the substrate in a contact type by bringing the flat surface on the top end of the temperature measuring element arranged in a horizontal direction into contact with the lower surface of the substrate heated by the heating means and heat-treated. In the temperature measuring device,
A holder to which the base of the temperature sensor is fixed and to hold the temperature sensor in a cantilevered manner;
An adjustment mechanism that is connected to the holder via a connecting shaft orthogonal to the temperature measuring body, moves the holder slightly, and adjusts the posture of the flat surface on the top end of the temperature measuring body;
The integrally fitted to the connecting shaft and the outer fitting member having a flange portion which is in close contact airtightly to the holder, the holder and fixed so as to surround the connecting shaft-cylinder member, the inside of the cylindrical member fixed or slidably retained within the cylindrical member, the through interpolated seal member between the outer peripheral surface of the inner cylinder member and the inner circumferential surface of the cylindrical member, and the collar of the outer fitting member is configured to include a tubular bellows member which connects with said inner tube member and parts, and a space where the temperature sensing element and the space in which the adjusting mechanism is arranged is provided, the movement of the temperature sensing element An airtight isolation means for allowing and maintaining airtightness, and
A contact temperature measuring apparatus for a substrate, comprising: The adjustment mechanism is
A pitching adjustment unit that swings the tip of the temperature sensor in the vertical direction about the holder;
A rolling adjustment section for rotating the temperature sensor around its axis;
A Z-axis direction adjustment unit for moving the whole temperature sensing element in the vertical direction;
The contact temperature measuring apparatus for a substrate according to claim 3, comprising: A substrate contact temperature measuring device according to any one of claims 1 to 4, comprising:
  A substrate heat treatment apparatus, wherein the heating means is a light irradiation means, and heat treatment is performed by heating the substrate.

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