JP3733838B2 - 赤外線検出素子および測温計 - Google Patents
赤外線検出素子および測温計 Download PDFInfo
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- JP3733838B2 JP3733838B2 JP2000169694A JP2000169694A JP3733838B2 JP 3733838 B2 JP3733838 B2 JP 3733838B2 JP 2000169694 A JP2000169694 A JP 2000169694A JP 2000169694 A JP2000169694 A JP 2000169694A JP 3733838 B2 JP3733838 B2 JP 3733838B2
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- Prior art keywords
- temperature
- region
- thermopile
- infrared
- diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 claims description 76
- 238000001514 detection method Methods 0.000 claims description 72
- 239000000758 substrate Substances 0.000 claims description 46
- 238000009529 body temperature measurement Methods 0.000 claims description 39
- 239000006096 absorbing agent Substances 0.000 claims description 27
- 230000008859 change Effects 0.000 claims description 24
- 238000005259 measurement Methods 0.000 description 58
- 239000004020 conductor Substances 0.000 description 24
- 229910052710 silicon Inorganic materials 0.000 description 20
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 19
- 230000036760 body temperature Effects 0.000 description 19
- 239000010408 film Substances 0.000 description 19
- 239000010703 silicon Substances 0.000 description 19
- 238000000034 method Methods 0.000 description 17
- 230000035945 sensitivity Effects 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 14
- 239000010409 thin film Substances 0.000 description 13
- 230000001965 increasing effect Effects 0.000 description 12
- 210000003454 tympanic membrane Anatomy 0.000 description 11
- 238000005530 etching Methods 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 230000008569 process Effects 0.000 description 9
- 230000009467 reduction Effects 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 8
- 238000013461 design Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 8
- 229920005591 polysilicon Polymers 0.000 description 8
- 229910006367 Si—P Inorganic materials 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 239000012528 membrane Substances 0.000 description 6
- 102100031250 Disks large-associated protein 1 Human genes 0.000 description 5
- 102100031245 Disks large-associated protein 2 Human genes 0.000 description 5
- 101150020562 Dlgap2 gene Proteins 0.000 description 5
- 101000731000 Homo sapiens Membrane-associated progesterone receptor component 1 Proteins 0.000 description 5
- 101100062430 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) DAP2 gene Proteins 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000007613 environmental effect Effects 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 4
- 229910052732 germanium Inorganic materials 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 206010037660 Pyrexia Diseases 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- 239000005083 Zinc sulfide Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910052984 zinc sulfide Inorganic materials 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000005678 Seebeck effect Effects 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 229910021478 group 5 element Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000169694A JP3733838B2 (ja) | 2000-06-06 | 2000-06-06 | 赤外線検出素子および測温計 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000169694A JP3733838B2 (ja) | 2000-06-06 | 2000-06-06 | 赤外線検出素子および測温計 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001349783A JP2001349783A (ja) | 2001-12-21 |
| JP2001349783A5 JP2001349783A5 (https=) | 2005-02-24 |
| JP3733838B2 true JP3733838B2 (ja) | 2006-01-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000169694A Expired - Fee Related JP3733838B2 (ja) | 2000-06-06 | 2000-06-06 | 赤外線検出素子および測温計 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3733838B2 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ITMI20012828A1 (it) | 2001-12-28 | 2003-06-28 | Gambro Dasco Spa | Dispositivo non invasivo per il rilevamento della temperatura ematicain un circuito per la circolazione extracorporea del sangue e apparato |
| CN110384887A (zh) * | 2019-06-21 | 2019-10-29 | 山西新思备科技股份有限公司 | 一种矿山用热点监测预警智能定位灭火系统 |
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2000
- 2000-06-06 JP JP2000169694A patent/JP3733838B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001349783A (ja) | 2001-12-21 |
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