JP3728412B2 - Solid-state imaging device - Google Patents

Solid-state imaging device Download PDF

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Publication number
JP3728412B2
JP3728412B2 JP2001311209A JP2001311209A JP3728412B2 JP 3728412 B2 JP3728412 B2 JP 3728412B2 JP 2001311209 A JP2001311209 A JP 2001311209A JP 2001311209 A JP2001311209 A JP 2001311209A JP 3728412 B2 JP3728412 B2 JP 3728412B2
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JP
Japan
Prior art keywords
wiring pattern
solid
lens barrel
imaging device
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001311209A
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Japanese (ja)
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JP2003124447A5 (en
JP2003124447A (en
Inventor
一夫 秋元
基晴 櫻井
順一 仁尾
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Seiko Precision Inc
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Seiko Precision Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to JP2001311209A priority Critical patent/JP3728412B2/en
Priority to CN 02131902 priority patent/CN1410792A/en
Publication of JP2003124447A publication Critical patent/JP2003124447A/en
Publication of JP2003124447A5 publication Critical patent/JP2003124447A5/ja
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Publication of JP3728412B2 publication Critical patent/JP3728412B2/en
Anticipated expiration legal-status Critical
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  • Solid State Image Pick-Up Elements (AREA)
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Description

【０００１】
【発明の属する技術分野】
本発明は、携帯電話機やノート型パソコンの携帯機器等に搭載される固定撮像装置に関する。
【０００２】
【従来の技術】
従来の固体撮像装置には、図３、４に示すように基板１に配線パターン２、固体撮像素子３及び固体撮像素子３を駆動するときに使用する電子部品４が設けられ、基板１上の固体撮像素子３及び電子部品４が配線パターン２に接続されている。基板１には穴部１ａ，１ｂが貫通して設けられ、穴部１ａ，１ｂに係合可能な図示しない係合部を備えたレンズ鏡筒５が基板１に接着剤により固着して設けられている。レンズ鏡筒５には、固体撮像素子３上に被写体像を結像させるためのレンズ６が設けられている。また、レンズ鏡筒５の下部は矩形状の筒部５ａとなっており、筒部５ａの端部に全周に亘って接着剤が設けられて基板１に固着されている。
【０００３】
【発明が解決しようとする課題】
従来、基板１上の配線パターン２は、導通に必要なところのみにライン状に設けられていたが、図４に示すように、配線パターン２が基板１の端面１ｃまで達して設けられている部分と、基板１ａの四隅のように配線パターン２が設けられていない部分とができ、図３に示すように、筒部５ａの端部の下に隙間Ａが存在していた。レンズ鏡筒５を基板１に接着剤により固着させて取り付けるときに、この配線パターン２が設けられていない部分（隙間Ａ）にレンズ鏡筒５が沈み込み、レンズ鏡筒５が基板１に対して傾いて取り付けられてしまうことがあった。レンズ鏡筒５が傾いて取り付けられてしまうと、レンズ鏡筒５に設けられたレンズ６の光軸が固体撮像素子３からずれて、固体撮像素子３上に被写体の結像ができなくなる不具合が発生する恐れがあった。
【０００４】
【課題を解決するための手段】
配線パターンが設けられている基板には、配線パターンに接続される固体撮像素子および固体撮像素子を包囲するレンズ鏡筒が搭載されており、基板には、配線パターンの近傍に前記配線パターンと同一の高さのダミーパターンを設けてある。そして、レンズ鏡筒は、ダミーパターンおよび配線パターンの両パターンに搭載されている。また、前記ダミーパターンの高さを前記配線パターンよりも高くして、前記レンズ鏡筒がダミーパターンに搭載されてもよい。
【０００５】
【発明の実施の形態】
本発明の実施の形態を実施例に基づき図面を参照して説明する。
従来の技術で説明した構成で同一のものには同一の符号をつけて説明を省略する。図１に示すように、基板１上には複数本の配線パターン２とＣＣＤ等の固体撮像素子３と電子部品４とが設けられ、固体撮像素子３と電子部品４とは配線パターン２に接続されて導通している。基板１には穴部１ａ，１ｂが貫通して設けられ、穴部１ａ，１ｂに係合可能な図示しない係合部を備えたレンズ鏡筒５が基板１に接着剤により固着して設けられている。穴部１ｂは対角線に沿う方向に僅かに長い長穴に形成してあり、若干の寸法誤差を吸収できるようにしている。レンズ鏡筒５には、固体撮像素子３上に被写体像を結像させるためのレンズ６が設けられている。
【０００６】
図２に示すように、基板１の４隅に近い配線パターン２ａ，２ｂ，２ｃ，２ｄには、レンズ鏡筒５の基板１への固着時の安定をはかるダミーパターン２ａ１，２ｂ１，２ｃ１，２ｄ１が一体に設けられている。ダミーパターン２ａ１，２ｂ１，２ｃ１，２ｄ１の高さは配線パターン２の高さと同一となっている。レンズ鏡筒５の下部は矩形状の筒部５ａとなっており、筒部５ａの端部に全周に亘って接着剤が設けられて基板１に固着されているが、ダミーパターン２ａ１，２ｂ１，２ｃ１，２ｄ１が基板１の４隅まで延伸して設けられているため、筒部５ａの端部が配線パターン２およびダミーパターン２ａ１，２ｂ１，２ｃ１，２ｄ１上に位置し、従来の構成では存在した隙間Ａ（図３参照）が存在しなくなる。
【０００７】
このため、レンズ鏡筒５を取り付けるときレンズ鏡筒５が沈み込み、レンズ鏡筒５が基板１に対して傾いて取り付けられてしまうということがなく、レンズ鏡筒５が安定して基板１上に設けられる。このため、固体撮像装置を組み立てるときには、単純にレンズ鏡筒５を基板１に押し付けて固着すればよく、組み立てが容易になる。また、レンズ鏡筒５が傾いて取り付けられることがないのでレンズ鏡筒５に設けられているレンズ６の位置が設計通りの位置に配置され、レンズ６の光軸が固体撮像素子３の撮像面からずれることがなく、被写体を確実に結像させることができる。
【０００８】
なお、本実施例では、ダミーパターン２ａ１，２ｂ１，２ｃ１，２ｄ１を配線パターン２と同じ高さで設けたが、ダミーパターン２ａ１，２ｂ１，２ｃ１，２ｄ１の各々の高さを配線パターン２よりも高くしてレンズ鏡筒５がダミーパターン２ａ１，２ｂ１，２ｃ１，２ｄ１のみに搭載される構成としてもよい。このようにすると、配線パターン２が必ずしも端面１ｃまで達する必要がなく配線パターン２の配置の仕方に自由度が増す。また、レンズ鏡筒５がダミーパターン２ａ１，２ｂ１，２ｃ１，２ｄ１のみに搭載されると配線パターン２と筒部５ａの端部との間に間隙ができることになるが、間隙ができることによりレンズ鏡筒５の内部の通気性がよくなり、結露が起こりにくくなる。このため、画像精度が安定する。また、間隙の幅が大きすぎてレンズ鏡筒５の内部にごみが入る恐れがあるときには、ごみが入らない程度の間隙になるように配線パターン２と筒部５ａの端部との間の所望位置に接着剤を設けてもよい。
【０００９】
また、本実施例では、ダミーパターン２ａ１，２ｂ１，２ｃ１，２ｄ１を配線パターン２ａ，２ｂ，２ｃ，２ｄと一体的に設けたが、これに限らず、ダミーパターンを配線パターンと分離独立して設けるようにしてもよい。
【００１０】
【発明の効果】
このように本発明によれば、基板には配線パターンの他にダミーパターンが設けられているため、レンズ鏡筒が傾いて設けられることがなく、被写体を固体撮像素子に確実に結像させることができる。
【図面の簡単な説明】
【図１】 本発明の実施例を示す断面図である。
【図２】 本発明の実施例を示す平面図である。
【図３】 従来例を示す断面図である。
【図４】 従来例を示す平面図である。
【符号の説明】
１ 基板
２ 配線パターン
２ａ１，２ｂ１，２ｃ１，２ｄ１ ダミーパターン
３ 固体撮像素子
５ レンズ鏡筒[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a fixed imaging device mounted on a portable device such as a mobile phone or a notebook computer.
[0002]
[Prior art]
As shown in FIGS. 3 and 4, a conventional solid-state imaging device is provided with a wiring pattern 2, a solid-state imaging device 3, and an electronic component 4 that is used when driving the solid-state imaging device 3. The solid-state imaging device 3 and the electronic component 4 are connected to the wiring pattern 2. Holes 1a and 1b are provided through the substrate 1, and a lens barrel 5 having an engagement portion (not shown) that can be engaged with the holes 1a and 1b is fixed to the substrate 1 with an adhesive. ing. The lens barrel 5 is provided with a lens 6 for forming a subject image on the solid-state image sensor 3. Further, the lower portion of the lens barrel 5 is a rectangular tube portion 5a, and an adhesive is provided over the entire periphery of the end portion of the tube portion 5a so as to be fixed to the substrate 1.
[0003]
[Problems to be solved by the invention]
Conventionally, the wiring pattern 2 on the substrate 1 is provided in a line shape only where it is necessary for conduction, but the wiring pattern 2 is provided so as to reach the end face 1c of the substrate 1 as shown in FIG. A portion and a portion where the wiring pattern 2 is not provided, such as the four corners of the substrate 1a, are formed, and as shown in FIG. 3, a gap A exists below the end of the cylindrical portion 5a. When the lens barrel 5 is fixedly attached to the substrate 1 with an adhesive, the lens barrel 5 sinks into a portion (gap A) where the wiring pattern 2 is not provided, and the lens barrel 5 is attached to the substrate 1. Sometimes it was tilted and attached. If the lens barrel 5 is tilted and attached, the optical axis of the lens 6 provided in the lens barrel 5 is deviated from the solid-state image sensor 3, and the subject cannot be imaged on the solid-state image sensor 3. There was a risk of occurrence.
[0004]
[Means for Solving the Problems]
The substrate on which the wiring pattern is provided is equipped with a solid-state imaging device connected to the wiring pattern and a lens barrel surrounding the solid-state imaging device, and the substrate is the same as the wiring pattern in the vicinity of the wiring pattern. A dummy pattern of a height is provided. The lens barrel is mounted on both the dummy pattern and the wiring pattern. In addition, the lens barrel may be mounted on the dummy pattern by making the height of the dummy pattern higher than the wiring pattern .
[0005]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described based on examples with reference to the drawings.
The same components as those described in the prior art are denoted by the same reference numerals, and description thereof is omitted. As shown in FIG. 1, a plurality of wiring patterns 2, a solid-state imaging device 3 such as a CCD, and an electronic component 4 are provided on a substrate 1, and the solid-state imaging device 3 and the electronic component 4 are connected to the wiring pattern 2. Being conducted. Holes 1a and 1b are provided through the substrate 1, and a lens barrel 5 having an engagement portion (not shown) that can be engaged with the holes 1a and 1b is fixed to the substrate 1 with an adhesive. ing. The hole 1b is formed as a long hole that is slightly longer in the direction along the diagonal, so that a slight dimensional error can be absorbed. The lens barrel 5 is provided with a lens 6 for forming a subject image on the solid-state image sensor 3.
[0006]
As shown in FIG. 2, dummy patterns 2a1, 2b1, 2c1, 2d1 for stabilizing the lens barrel 5 when the lens barrel 5 is fixed to the substrate 1 are arranged on the wiring patterns 2a, 2b, 2c, 2d near the four corners of the substrate 1. Are provided integrally. The height of the dummy patterns 2a1, 2b1, 2c1, and 2d1 is the same as the height of the wiring pattern 2. The lower part of the lens barrel 5 is a rectangular cylindrical part 5a, and an adhesive is provided over the entire periphery of the cylindrical part 5a and is fixed to the substrate 1, but the dummy patterns 2a1, 2b1 , 2c1, 2d1 are provided to extend to the four corners of the substrate 1, so that the end of the cylindrical part 5a is located on the wiring pattern 2 and the dummy patterns 2a1, 2b1, 2c1, 2d1, and exists in the conventional configuration. The gap A (see FIG. 3) does not exist.
[0007]
Therefore, the lens barrel 5 does not sink when the lens barrel 5 is attached, and the lens barrel 5 is not inclined and attached to the substrate 1, and the lens barrel 5 is stably mounted on the substrate 1. Is provided. For this reason, when assembling the solid-state imaging device, the lens barrel 5 may be simply pressed and fixed to the substrate 1 to facilitate assembly. Further, since the lens barrel 5 is not attached with an inclination, the position of the lens 6 provided in the lens barrel 5 is arranged at the designed position, and the optical axis of the lens 6 is the imaging surface of the solid-state imaging device 3. The subject can be reliably imaged without being misaligned.
[0008]
In this embodiment, the dummy patterns 2a1, 2b1, 2c1, and 2d1 are provided at the same height as the wiring pattern 2. However, each of the dummy patterns 2a1, 2b1, 2c1, and 2d1 is set higher than the wiring pattern 2. The lens barrel 5 may be mounted only on the dummy patterns 2a1, 2b1, 2c1, and 2d1. If it does in this way, the wiring pattern 2 does not necessarily need to reach the end surface 1c, and the degree of freedom increases in the way of arranging the wiring pattern 2. In addition, when the lens barrel 5 is mounted only on the dummy patterns 2a1, 2b1, 2c1, and 2d1, a gap is formed between the wiring pattern 2 and the end of the cylinder portion 5a. The air permeability of the interior of 5 is improved and condensation is less likely to occur. For this reason, image accuracy is stabilized. Further, when there is a risk that dust may enter the lens barrel 5 because the gap width is too large, a desired gap between the wiring pattern 2 and the end of the cylinder portion 5a is set so that the dust does not enter. An adhesive may be provided at the position.
[0009]
In this embodiment, the dummy patterns 2a1, 2b1, 2c1, and 2d1 are provided integrally with the wiring patterns 2a, 2b, 2c, and 2d. However, the present invention is not limited thereto, and the dummy patterns are provided separately from the wiring patterns. You may do it.
[0010]
【The invention's effect】
As described above, according to the present invention, since the substrate is provided with the dummy pattern in addition to the wiring pattern, the lens barrel is not inclined and the subject is reliably imaged on the solid-state imaging device. Can do.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing an embodiment of the present invention.
FIG. 2 is a plan view showing an embodiment of the present invention.
FIG. 3 is a cross-sectional view showing a conventional example.
FIG. 4 is a plan view showing a conventional example.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Wiring pattern 2a1, 2b1, 2c1, 2d1 Dummy pattern 3 Solid-state image sensor 5 Lens barrel

Claims (2)

配線パターンが設けられている基板には、前記配線パターンに接続される固体撮像素子および前記固体撮像素子を包囲するレンズ鏡筒が搭載されており、
前記基板には、前記配線パターンの近傍に前記配線パターンと同一の高さのダミーパターンを設けてあり、
前記レンズ鏡筒は、前記ダミーパターンおよび前記配線パターンの両パターンに搭載されている
ことを特徴とする固体撮像装置。The substrate provided with the wiring pattern is mounted with a solid-state imaging device connected to the wiring pattern and a lens barrel surrounding the solid-state imaging device,
On the substrate, Ri Oh provided the wiring pattern the same height of the dummy pattern and in the vicinity of the wiring pattern,
The solid-state imaging device , wherein the lens barrel is mounted on both the dummy pattern and the wiring pattern . 配線パターンが設けられている基板には、前記配線パターンに接続される固体撮像素子および前記固体撮像素子を包囲するレンズ鏡筒が搭載されており、
前記基板には、前記配線パターンの近傍に前記配線パターンよりも高さが高いダミーパターンを設けてあり、
前記レンズ鏡筒は、前記ダミーパターンに搭載されている
ことを特徴とする固体撮像装置。 The substrate provided with the wiring pattern is mounted with a solid-state imaging device connected to the wiring pattern and a lens barrel surrounding the solid-state imaging device,
In the substrate, a dummy pattern having a height higher than the wiring pattern is provided in the vicinity of the wiring pattern,
The solid-state imaging device , wherein the lens barrel is mounted on the dummy pattern .
JP2001311209A 2001-10-09 2001-10-09 Solid-state imaging device Expired - Fee Related JP3728412B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2001311209A JP3728412B2 (en) 2001-10-09 2001-10-09 Solid-state imaging device
CN 02131902 CN1410792A (en) 2001-10-09 2002-09-04 Solid image testing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001311209A JP3728412B2 (en) 2001-10-09 2001-10-09 Solid-state imaging device

Publications (3)

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JP2003124447A JP2003124447A (en) 2003-04-25
JP2003124447A5 JP2003124447A5 (en) 2005-04-07
JP3728412B2 true JP3728412B2 (en) 2005-12-21

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CN (1) CN1410792A (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101007328B1 (en) * 2009-05-12 2011-01-13 삼성전기주식회사 Printed circuit board and camera module

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CN1410792A (en) 2003-04-16
JP2003124447A (en) 2003-04-25

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