JP3726390B2 - Ink jet head and method of manufacturing ink jet head - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electrostatic actuator that uses an electrostatic force generated by applying a voltage between opposing electrodes as a drive source, and a method for manufacturing the same. More specifically, the present invention relates to a method for forming a hydrophobic film in an electrostatic actuator having a hydrophobic film on the surface of a member that is relatively displaced by electrostatic force.
[0002]
[Prior art]
An ink jet head or the like of an ink jet printer is a micro structure actuator formed by using a semiconductor micro processing technique. As such a micro structure actuator, an actuator using electrostatic force as a drive source is known. For example, an electrostatic ink jet head that discharges ink droplets using electrostatic force is disclosed in Japanese Patent Application Laid-Open Nos. 5-50601 and 6-71882.
[0003]
In this type of ink jet head, the bottom surface of the ink chamber communicating with the ink nozzle is formed to be elastically deformable, and a substrate is disposed opposite to the bottom surface at regular intervals, and a counter electrode is provided on each of the bottom surface and the substrate. It is an arranged configuration. When a voltage is applied between the counter electrodes, the bottom surface of the ink chamber vibrates due to electrostatic attraction or electrostatic repulsion toward the substrate due to the electrostatic force generated between them. Ink droplets are ejected from the ink nozzles due to fluctuations in the internal pressure of the ink chamber caused by the vibration of the bottom surface of the ink chamber.
[0004]
Here, if moisture or the like adheres to the surface of the counter electrode, that is, the bottom surface of the ink chamber and the surface of the substrate while the inkjet head is driven by applying a voltage repeatedly between the counter electrodes, these polarities There is a possibility that electrostatic attraction characteristics or electrostatic repulsion characteristics may deteriorate due to charging of molecules. In addition, polar molecules adsorbed on the surface may be coupled to each other, and the bottom surface of the ink chamber may remain attached to the substrate side, resulting in a problem that the operation becomes impossible.
[0005]
In order to avoid such a problem, it is conceivable to apply a hydrophobic treatment to the bottom surface of the ink chamber and the surface of the substrate. For example, it is conceivable to make these surfaces hydrophobic by forming oriented monomolecular layers of perfluorodecanoic acid (PFDA) on these surfaces.
[0006]
An example of an electrostatic actuator that has been hydrophobized using PFDA is disclosed, for example, in JP-A-5-54259. In this publication, an oriented monomolecular layer of PFDA is formed on the surface of a counter electrode in a micromechanical device that is an electrostatic actuator so as to prevent them from becoming stuck during driving.
[0007]
[Problems to be solved by the invention]
However, the hydrophobization treatment using PFDA has the following problems to be solved. First, simply attaching PFDA to the opposing surface of a member that relatively displaces does not provide sufficient durability of the layer. For this reason, the PFDA layer peels off from the surface of the member due to the repeated electric field generated between these members that are repeatedly relatively displaced by the electrostatic force, and the foreign matter prevents the relative displacement between the members by aggregating the peeled portion. May occur. When such a foreign substance is generated, there is a risk that the electrostatic actuator may become inoperable.
[0008]
Next, in the electrostatic actuator, in order to make the electrostatic force generated between the opposing members that are relatively displaced into a sufficiently large force, it is desirable that the interval between these opposing members be as narrow as possible. Further, in order to achieve higher density and further miniaturization of the electrostatic actuator, it is desirable to make the interval between the opposing members as narrow as possible. However, if the interval between the opposing members is narrowed, the PFDA molecules are large, so that it becomes impossible to attach them to the surface of the opposing member with a narrow interval.
[0009]
In view of these points, an object of the present invention is to propose an electrostatic actuator including a durable hydrophobic film and a method for manufacturing the electrostatic actuator.
[0010]
Another object of the present invention is to propose an electrostatic actuator provided with a hydrophobic film that can be adhered to the surface of the opposing member even when the interval between the opposing members that are relatively displaced by electrostatic force is narrow, and a method for manufacturing the same. It is in.
[0011]
[Means for solving the problems]
The present invention comprises a diaphragm that is disposed opposite to an electrode at a constant interval and is capable of relative displacement,
Driving means for generating an electrostatic force between the electrode and the diaphragm to relatively displace the diaphragm;
An ink chamber whose volume varies due to the relative displacement of the diaphragm;
An ink nozzle communicating with the ink chamber,
The drive means includes an electrode formed on each of the diaphragms, and a voltage application means for applying an electric pulse between these electrodes, and an ink jet in which ink droplets are ejected from ink nozzles in response to the application of the electric pulse. Head,
A hydrophobic film is formed on a surface of at least one member of the electrode or the diaphragm facing the other member, and the hydrophobic film is formed of hexamethyldisilazane (HMDS).
[0013]
Thus, in this invention, the hydrophobic film | membrane which consists of HMDS is formed in the opposing surface of the member to displace relatively. This hydrophobic membrane is more durable than a hydrophobic membrane made of PFDA. In addition, since the molecules are small, even when the interval between the members that are relatively displaced is narrow, they can be attached to their facing surfaces.
[0014]
On the other hand, the present invention relates to a method of manufacturing the electrostatic actuator having the above-described configuration, and an adhesion step of forming the hydrophobic film by attaching HMDS to the facing surface, and stabilizing the formed hydrophobic film. A post-treatment step, wherein the post-treatment step includes a moisture application step for imparting moisture to the hydrophobic membrane, a leaving step for leaving the hydrophobic membrane for a predetermined time, and an ultraviolet ray for irradiating the hydrophobic membrane with ultraviolet rays. It is characterized by including at least one of the irradiation steps.
[0015]
It was confirmed that by performing such a post-treatment step, the formed hydrophobic film can be stabilized and its durability can be improved.
[0016]
Here, you may start the said water provision process before the completion | finish of the said adhesion process.
[0017]
Further, the leaving step may be a step of leaving the hydrophobic film in an atmosphere having a humidity of 2 to 100% and a temperature of 20 ° C. to 200 ° C. Here, it is desirable to set the atmospheric temperature within a range of 50 ° C. to 100 ° C.
[0018]
Furthermore, it is desirable that the ultraviolet rays used in the ultraviolet irradiation step be light having a wavelength band of 400 nm or less.
[0019]
On the other hand, in the method of the present invention, a pretreatment step of removing adhering moisture from the facing surface may be performed prior to the attaching step. A vacuum heating process can be adopted as the pretreatment process. Instead of this, a step of alternately switching the atmosphere of the facing surface between a vacuum atmosphere and a nitrogen atmosphere may be employed.
[0020]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an inkjet head which is an electrostatic actuator to which the present invention is applied will be described with reference to the drawings.
[0021]
(overall structure)
FIG. 1 is a sectional view of an inkjet head as an electrostatic actuator to which the present invention is applied, FIG. 2 is a plan view thereof, and FIG. 3 is a partial sectional view thereof.
[0022]
As shown in these drawings, the ink jet head 1 has a silicon substrate 2 sandwiched therebetween, and a silicon nozzle plate 3 on the upper side, and a borosilicate glass substrate 4 having a thermal expansion coefficient close to that of silicon on the lower side. It has a three-layer structure. The central silicon substrate 2 is etched from its surface, so that five independent ink chambers 5, one common ink chamber 6, and ink that communicates the common ink chamber 6 with each ink chamber 5. Grooves that function as supply paths 7 are machined. These grooves are closed by the nozzle plate 3, and the portions 5, 6, and 7 are partitioned.
[0023]
In the nozzle plate 3, ink nozzles 11 are formed at positions corresponding to the tip side portions of the respective ink chambers 5, and these communicate with the respective ink chambers 5. In addition, an ink supply port 12 (see FIG. 2) communicating with the nozzle plate 3 where the common ink chamber 6 is located is formed. Ink is supplied from an external ink tank (not shown) to the common ink chamber 6 through the ink supply port 12. The ink supplied to the common ink chamber 6 is supplied to each independent ink chamber 5 through each ink supply path 7.
[0024]
Each independent ink chamber 5 is set so that its bottom wall 51 is thin and functions as a diaphragm that can be elastically displaced in the out-of-plane direction, that is, in the vertical direction in FIG. Therefore, the portion of the bottom wall 51 is sometimes referred to as a diaphragm for the convenience of the following description.
[0025]
Next, in the glass substrate 4 positioned below the silicon substrate 2, the bonding surface with the silicon substrate 2, which is the upper surface, is etched shallowly at a position corresponding to each ink chamber 5 of the silicon substrate 2. A concave portion 9 is formed. Therefore, the bottom wall 51 of each ink chamber 5 faces the surface 92 of the opposing wall 91 made of a glass substrate on which the recess 9 is formed with a very narrow gap G. The gap G is sealed with a sealant 93 disposed between the bottom wall 51 and the opposing wall 91.
[0026]
Here, the bottom wall 51 of each ink chamber 5 functions as a common electrode on each ink chamber side. A hydrophobic film 53 made of hexamethyldisilazane (HMDS) is formed on the surface of the bottom wall 51. A segment electrode 10 made of ITO is formed on the concave surface 91 of the glass substrate 4 so as to face the bottom wall 51 as the common electrode. A hydrophobic film 15 made of hexamethyldisilazane (HMDS) is also formed on the surface of each segment electrode 10. The ink chamber bottom wall 51, which is a common electrode, and the corresponding segment electrode 10 form a counter electrode with the gap G interposed therebetween.
[0027]
As shown in FIG. 2, the voltage application means 21 for applying a drive voltage between these counter electrodes applies a drive voltage between these counter electrodes in response to an external print signal (not shown). To do. One output of the voltage applying means 21 is connected to each segment electrode 10, and the other output is connected to a common electrode terminal 22 formed on the silicon substrate 2. Since the silicon substrate 2 itself has conductivity, a voltage can be supplied from the common electrode terminal 22 to the common electrode on the bottom wall 51. When it is necessary to supply a voltage to the common electrode with a lower electric resistance, for example, a thin film of a conductive material such as gold may be formed on one surface of the silicon substrate by vapor deposition or sputtering. In this embodiment, since anodic bonding is used to connect the silicon substrate 2 and the glass substrate 4, a conductive film is formed on the flow path forming surface side of the silicon substrate 2.
[0028]
Here, in the inkjet head 1 configured as described above, when the driving voltage from the voltage applying unit 21 is applied between the counter electrodes, a Coulomb force is generated by the charge charged between the counter electrodes, and the bottom wall ( The diaphragm 51 is bent toward the segment electrode 10, and the volume of the ink chamber 5 is increased. Next, when the driving voltage from the voltage application unit 21 is released and the electric charge between the opposing electrodes is discharged, the diaphragm 51 is restored by its elastic restoring force, and the volume of the ink chamber 5 is rapidly contracted. Due to the ink pressure generated at this time, a part of the ink filling the ink chamber 5 is ejected as an ink droplet from the ink nozzle 11 communicating with the ink chamber.
[0029]
(Production method)
FIG. 4 shows a schematic flowchart of the manufacturing process of the ink jet head 1 having the above-described configuration. As shown in this figure, first, in step ST1, the silicon substrate 2, the silicon nozzle plate 3, and the glass substrate 4 constituting the inkjet head 1 are each processed from a wafer and manufactured. Next, in step ST2, these three members are assembled together to form an ink jet head. That is, the glass substrate 4 is assembled to the bottom surface side of the silicon substrate 2 so that the gap G is formed. In this state, the hydrophobic film is not formed on either the surface of the bottom wall 51 which is a common electrode or the surface of the segment electrode 10.
[0030]
Thereafter, in the pretreatment process of step ST3, the ink jet head 1 is pretreated to remove moisture adhering to the surface. Thereafter, in the HMDS attachment process of step ST4, hydrophobic films 53 and 15 made of HMDS are formed on the surface of the bottom wall 51 and the surface of the segment electrode 10 which are common electrodes, respectively. Thereafter, in the post-processing step of step ST5, post-processing for stabilizing the formed hydrophobic films 53 and 15 is performed on the hydrophobic film. Thereafter, in step ST6, the gap G is hermetically sealed with the sealant 93.
[0031]
Next, the pretreatment process, the HMDS adhesion process, and the posttreatment process will be described in more detail.
[0032]
First, the pretreatment process of step ST3 is a process performed in order to stabilize the HMDS adhesion state. That is, in order to avoid excess dispersion of moisture from the surface of the bottom wall 51 and the surface of the segment electrode 10 to stabilize the state of HMDS adhesion, and to avoid variations in the state of HMDS adhesion in the next step. belongs to.
[0033]
In this pretreatment step, excess water may be removed from the surface of the ink jet head 1 by vacuum heating. For example, the inkjet head 1 is placed in a vacuum chamber, the ambient temperature is set to 100 ° C. or higher, the degree of vacuum is set higher than 10 ⁻¹ Torr, and this state is maintained for a predetermined time. Instead of vacuum heating, the operation of placing the inkjet head 1 in a vacuum atmosphere and the operation of placing it in a nitrogen atmosphere may be repeated. Thus, excess water can also be removed from the surface of the inkjet head 1 by pumping nitrogen into a vacuum atmosphere containing the inkjet head 1.
[0034]
Next, in the HMDS attaching process in step ST4, HMDS can be attached to the surface of the bottom wall 51 and the surface of the segment electrode 10 which are common electrodes by gas phase processing or liquid phase processing. Gas phase treatment includes a method of depositing HMDS at atmospheric pressure and a method of depositing in vacuum. In these methods, the inkjet head 1 may be left in the HMDS atmosphere. For example, if the inkjet head 1 is maintained at 20 ° C. to 200 ° C. in a HMDS atmosphere, the vacuum is maintained at a level higher than 10 Torr, and left for about 5 to 150 minutes, a hydrophobic film made of HMDS is formed. It can be formed on the surface of the bottom plate 51 and the surface of the segment electrode 10. When the atmospheric pressure is maintained at atmospheric pressure under the same conditions, it is necessary to leave the inkjet head 1 for about 1 to 24 hours.
[0035]
The liquid phase treatment is a method of adhering HMDS by immersing an ink jet head in HMDS. In this method, HMDS enters the gap G by capillary force, and the surface of the bottom wall 51 and the surface of the segment electrode 10. HMDS adheres to the surface. In this method, for example, the inkjet head 1 and the HMDS are held at room temperature, the inkjet head 1 is immersed in the HMDS liquid for 5 minutes or more, and then the extra space that enters the gap G in an atmosphere of 20 ° to 200 ° C. What is necessary is just to vaporize and remove HMDS.
[0036]
FIG. 5 shows the molecular bonding state of the hydrophobic layers 53 and 15 of HMDS formed on the surface of the bottom wall 51 made of silicon and the surface of the segment electrode 10 made of ITO. As shown in this figure, on each surface, OH groups are replaced with OSi (CH ₃ ) ₃ groups which are hydrophobic groups.
[0037]
Next, examples of the post-treatment process in step ST5 include a moisture application process, a leaving process, and an ultraviolet irradiation process. Each of these steps may be used alone or in combination.
[0038]
First, the moisture application process is a process of removing excess HMDS from the formed hydrophobic film made of HMDS by hydrolysis. It was confirmed that when moisture was applied to the formed hydrophobic film of HMDS, the formation of foreign matter due to the change of the hydrophobic film over time could be suppressed, and the stabilization of the film could be improved. Examples of this step include a step of leaving the inkjet head in an atmosphere having a humidity of 2 to 100% RH and a temperature of 20 ° C. to 200 ° C. after completion of the above-described HMDS adhesion step. . Here, the moisture application step may be started after the end of the HMDS attaching step, but may be started in the middle of the HMDS attaching step. In this case, at the beginning of the HMDS attachment process, the ink jet head is placed in an atmosphere containing only HMDS, and water is added to the atmosphere together with HMDS from the middle.
[0039]
Next, the leaving step is a step of leaving the inkjet head, for example, in an atmosphere having a temperature of 20 ° C. to 200 ° C. and a humidity of several percent for a few days to a week after HMDS is attached. Through this process, it was confirmed that the binding state of HMDS can be stabilized, the formation of foreign matters due to the change of the hydrophobic film over time can be suppressed, and the stabilization of the film can be improved.
[0040]
On the other hand, the ultraviolet irradiation step is a step of irradiating the hydrophobic film portion with ultraviolet light having a wavelength band of 400 nm or less after the HMDS is attached, for example, so that excess HMDS is absorbed from the hydrophobic film by the ultraviolet light. It was confirmed that the stabilization can be improved by decomposing and removing.
[0041]
【Example】
Hereinafter, specific examples of the hydrophobic treatment of the surfaces of the common electrode and the segment electrode performed by the present inventors will be listed. Each of the following specific examples was carried out using the ink jet head 1 having the structure shown in FIGS.
[0042]
(Experimental example 1)
(1) Pretreatment process (vacuum heating)
The processing chamber containing the inkjet head was held at a temperature of 340 ° C. and a vacuum of 10 ⁻³ Torr for 9 minutes, and then held in a nitrogen atmosphere for 1 minute. This treatment was repeated for a total of 12 cycles with 1 cycle (10 minutes).
[0043]
(2) HMDS attachment process (attachment by immersion)
The atmospheric temperature was maintained at 25 ° C. (room temperature), and the inkjet head was immersed in the HMDS liquid tank for 90 minutes. Next, the inkjet head was pulled up from the HMDS liquid tank and left at 25 ° C. (room temperature) for 24 hours to dry the HMDS naturally.
[0044]
(3) Post-processing process (leaving process)
The ink jet head after the HMDS was adhered was left for 1 week in an environment of a temperature of 70 ° C. and an absolute humidity of 8 g / m ³ (relative humidity of 2 to 4%).
[0045]
(Experimental example 2)
(1) Pretreatment process (vacuum heating)
The treatment was performed under the same conditions as in Experimental Example 1.
[0046]
(2) HMDS adhesion process (method by vapor deposition)
An HMDS atmosphere having a degree of vacuum of 10 Torr or more was formed, and an inkjet head heated to around 80 ° C. was left in the chamber for 150 minutes to deposit HMDS.
[0047]
(3) Post-processing process (leaving process)
The treatment was performed under the same conditions as in Experimental Example 1.
[0048]
(Experimental example 3)
(1) Pretreatment process (vacuum heating)
The treatment was performed under the same conditions as in Experimental Example 1.
[0049]
(2) HMDS attachment process (attachment by immersion)
The treatment was performed under the same conditions as in Experimental Example 1.
[0050]
(3) Post-processing process (moisture application process + leaving process)
Moisture was imparted to the hydrophobic layer of HMDS by leaving the inkjet head in an atmosphere of 50 ° C. and 90% humidity for 12 hours.
[0051]
Next, the ink jet head was allowed to stand under the same conditions as those in Experimental Example 1.
[0052]
(Experimental example 4)
(1) Pretreatment process (vacuum heating)
The treatment was performed under the same conditions as in Experimental Example 1.
[0053]
(2) HMDS attachment process (attachment by immersion)
The treatment was performed under the same conditions as in Experimental Example 1.
[0054]
(3) Post-processing process (ultraviolet irradiation process)
The HMDS film of the inkjet head placed at room temperature was irradiated with ultraviolet light having a wavelength of 440 nm for 10 minutes.
[0055]
(Experimental result)
In each of the above-described experimental examples, it was confirmed that the ink-jet heads on which the hydrophobic film made of HMDS was formed were uniform, uniform and durable with no variation. It was. Further, even when an electric field is repeatedly applied between the opposing electrodes of the ink jet head, it is confirmed that the bottom wall 51 of the ink chamber always vibrates properly. No defects such as sticking were found. Furthermore, there were no negative effects such as the hydrophobic film becoming a foreign substance and the vibration of the bottom wall 51 being inhibited by continuous use.
[0056]
In particular, the best results were obtained when the method according to Experimental Example 1 was adopted. That is, the most durable and stable hydrophobic film made of HMDS could be obtained.
[0057]
When the gap between the electrodes of the inkjet head is about 2000 angstroms, if PFDA is left in an environment where it is vaporized in a vacuum for 90 minutes, PFDA cannot sufficiently enter between the electrodes. It was confirmed that the durability of the inkjet head was not different from that of an untreated one. That is, the durability of the inkjet head was only about several hundred thousand cycles when measured by the vibration cycle of the vibration wall accompanying voltage application.
[0058]
On the other hand, when the HMDS hydrophobic film was formed by the method according to Experimental Example 1, the durability was about several billion cycles, and it was confirmed that the effect of the HMDS hydrophobic film was remarkably excellent. It was done.
[0059]
(Other embodiments)
The above description is an example in which the present invention is applied to an inkjet head. The present invention can be similarly applied to electrostatic actuators other than inkjet heads. For example, the present invention can be similarly applied to a micromechanical device as disclosed in JP-A-5-54259.
[0060]
【The invention's effect】
As described above, the electrostatic actuator of the present invention employs a configuration in which a hydrophobic film made of HMDS is formed on the opposing surface of the opposing member that is relatively displaced by electrostatic force. HMDS has smaller molecules than PFDA and the like, and the formed hydrophobic membrane has high durability and high membrane stability. Therefore, according to the present invention, a uniform and uniform hydrophobic film can be formed even for an electrostatic actuator in which the interval between the opposing members is narrow. In addition, it is possible to realize an electrostatic actuator having high durability and high operational stability.
[0061]
In the method for manufacturing an electrostatic actuator according to the present invention, the hydrophobic film made of HMDS is subjected to post-treatments such as moisture application, standing, and ultraviolet irradiation to improve the stability of the hydrophobic film. Accordingly, an electrostatic actuator with further improved durability can be realized.
[0062]
Further, when forming a HMDS hydrophobic film on an ink jet head as an electrostatic actuator, there are the following advantages. The formation of the hydrophobic film by HMDS needs to be performed after assembling the silicon substrate, the silicon nozzle plate, and the glass substrate constituting the inkjet head, in other words, after arranging the counter electrode with a certain gap. . This is because the hydrophobic film is prevented from being decomposed and the AB bonding strength is ensured in the AB bonding performed at a high temperature. However, if a hydrophobic film is formed after joining each member, the silicon substrate also serves as an ink flow path, so that the hydrophobic film is also formed in the ink flow path to impart hydrophobicity, and the bubble discharge performance deteriorates. Cause problems. However, HMDS can be easily removed from the surface of the ink flow path by performing RCA cleaning or the like after hermetic sealing with a sealant, and can prevent the occurrence of problems such as deterioration in bubble discharge performance. .
[Brief description of the drawings]
FIG. 1 is a schematic longitudinal sectional view of an ink jet head to which the present invention is applied.
FIG. 2 is a plan view of the ink jet head of FIG.
3 is a schematic cross-sectional view showing a part of the ink-jet head of FIG.
4 is a schematic flowchart showing manufacturing steps of the ink jet head of FIG. 1. FIG.
FIG. 5 is a schematic diagram showing a formed hydrophobic layer of HMDS.
[Explanation of symbols]
1 Inkjet head 2 Substrate 3 Nozzle plate 4 Glass substrate 5 Ink chamber 51 Bottom wall of ink chamber (common electrode)
53 HMDS hydrophobic layer 6 Common ink chamber 7 Ink supply path 9 Recess 91 Opposite wall 92 Opposite wall surface 10 Electrode 11 Ink nozzle 12 Ink supply port 10 Segment electrode 15 HMDS hydrophobic layer 21 Voltage application means 22 Common electrode terminal G Diaphragm And the gap between the opposing walls

Claims (9)

A diaphragm that is disposed opposite to the electrode at a constant interval and is capable of relative displacement,
Drive means for generating an electrostatic force between the electrode and the diaphragm to relatively displace the diaphragm;
An ink chamber whose volume varies due to the relative displacement of the diaphragm;
An ink nozzle communicating with the ink chamber,
The driving means includes electrodes formed on the diaphragms and voltage applying means for applying an electric pulse between the electrodes, and ink droplets are ejected from the ink nozzles in response to the application of the electric pulse. An inkjet head to be ejected,
A hydrophobic film is formed on the surface of at least one member of the electrode or the diaphragm facing the other member, and the hydrophobic film is formed of hexamethyldisilazane (HMDS). An inkjet head.  2. The method of manufacturing an ink jet head according to claim 1, comprising: an attaching step of attaching HMDS to the opposing surface to form the hydrophobic film; and a post-processing step of stabilizing the formed hydrophobic film. The post-treatment step includes at least one of a moisture application step for applying moisture to the hydrophobic membrane, a leaving step for leaving the hydrophobic membrane for a predetermined time, and an ultraviolet irradiation step for irradiating the hydrophobic membrane with ultraviolet rays. A method for manufacturing an ink jet head, comprising one step.  3. The method of manufacturing an ink jet head according to claim 2, wherein the moisture application step is started before the end of the attaching step.  4. The method of manufacturing an ink jet head according to claim 2, wherein the leaving step comprises leaving the hydrophobic film in an atmosphere having a humidity of 2 to 100% and a temperature of 20 ° C. to 200 ° C.  5. The method of manufacturing an ink jet head according to claim 2, wherein an atmospheric temperature in the leaving step is in a range of 70 ° C. to 150 ° C. 5.  6. The method of manufacturing an ink jet head according to claim 2, wherein the ultraviolet ray used in the ultraviolet irradiation step is light having a wavelength band of 400 nm or less.  7. The method of manufacturing an ink jet head according to claim 2, further comprising a pretreatment step of removing adhering moisture from the facing surface prior to the attaching step.  8. The method of manufacturing an ink jet head according to claim 7, wherein the pretreatment step is a vacuum heating step.  9. The method of manufacturing an ink jet head according to claim 7, wherein the pretreatment step is a step of alternately switching the atmosphere of the facing surface between a vacuum atmosphere and a nitrogen atmosphere.

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