JP3710296B2 - Bulk supply equipment for semiconductor process gas - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention provides a semiconductor process gas used in semiconductor manufacturing processes such as monogermane, monosilane, disilane, diborane, arsine, phosphine, hydrogen selenide, hydrogen chloride, hydrogen bromide, etc., in large quantities and safely. The present invention relates to a bulk supply apparatus for semiconductor process gas comprising compact equipment.
[0002]
[Prior art]
The consumption of semiconductor processes used in the semiconductor industry increases with an increase in the number of wafers processed per factory, and further increases in consumption are expected when the future 300 mm wafer age is entered. Many semiconductor process gases are generally flammable, toxic, and corrosive. In particular, highly flammable and highly toxic gases are specially high-pressure gases (monogermane, monosilane, disilane, diborane, arsine, phosphine, hydrogen selenide) that are technically and facilityally equipped with the High Pressure Gas Safety Act. The requirements that must be met are clarified, safety is strictly regulated according to the increase in the amount of gas used, and the maintenance of further safety is an indispensable requirement item.
[0003]
Generally, a semiconductor process gas filling container is housed in a cylinder cabinet that houses the container in order to ensure safety in supplying toxic and flammable gases. The cylinder cabinet must be equipped with an alarm or an exhaust system for gas leakage. When a gas leaks, the system must be configured so that a toxic gas or a combustible gas leaked instantaneously is eliminated by these systems to prevent a serious accident from occurring. However, in order to supply a large amount of semiconductor process gas, it is usually necessary to use a 47 liter container (cylinder) that is generally used to store one container, one container in a cylinder cabinet, or several. They will be stored together in a cylinder cabinet. Although this is possible, there are problems and inconveniences such as a large installation space, complicated supply system piping, and complicated container replacement work after consumption.
[0004]
As a gas supply method when using a large amount of gas, the above-mentioned 47 liter container is connected in units of dozens of frames, and the supply is made by a so-called cardle system, or the outer diameter is 350 to 400 mm and the length is 6 A loader type supply or the like in which 18 to 20 containers of ˜8 m are assembled and assembled is adopted.
That is,FIG.Is a schematic view illustrating a curdle type gas supply device 50, in which a plurality of containers 51, 51,... Are connected together by a manifold 53 via container valves 52, 52,. Built into the body 60. Then, the gas is supplied through a valve 57 and a pipe 55 connected to a pipe of a receiving facility 56 installed at a gas use destination by a joint 57. Reference numerals 58 and 59 denote a pressure reducing valve and an on-off valve arranged in the receiving facility 56.
Then, two gas supply devices 50 of this curdle type are arranged and continuously supplied by switching and using them.
[0005]
The gas supply method by these curdle method and loader method requires a manifold 53 for attaching the container valve 52 to one container and one container, and further connecting the mouths of the container valve 52 to each other. There are many problems in terms of safety, such as the fact that there are many places where there is a risk of leakage and that there is no facility for exhausting the leaked gas, which may lead to a serious accident. There is.
In addition, in the gasle type gas supply device 50, high-pressure gas flows over a long pipeline such as the manifold 53 between the container 51 and the receiving facility 56 and the pipe 55 at the time of gas supply. It is a device that has.
[0006]
In addition, in the gas supply device of the curdle type or loader type, careful attention and certainty are required in handling dangerous gas when exchanging the curdle or loader. As countermeasures for this, the curdle itself and the manifold are put into a casing to form a semi-sealed structure, and then a gas leakage alarm, an exhaust system, etc. are provided, which is not preferable because the casing itself becomes extremely large.
[0007]
Furthermore, the semiconductor process gas is required to be supplied with a high-purity gas in order to maintain the quality of the product, and it is necessary to completely purge the semiconductor process gas in order to remove atmospheric components that tend to be mixed into the piping when the container is replaced. In other words, many semiconductor process gases react easily with atmospheric components, especially moisture and oxygen, and the gas itself becomes oxides and oxide compounds, and the presence of moisture corrodes the piping, thereby producing semiconductors. Giving significant obstacles to the process. Specifically, contamination of metal impurities generated by corrosion into the semiconductor manufacturing process degrades the electrical characteristics of the device, or causes structural defects in the device due to the generated ultrafine particles, resulting in a decrease in yield. It will be.
[0008]
Furthermore, as described above, the curdle system requires a complicated manifold to collect dozens of containers in the same supply piping system, and in order to supply high-purity semiconductor process gas, the curdle itself It was necessary to completely purge both the manifold and the piping between the receiving equipment, and this purging was time consuming.
Further, when filling each container of the semiconductor process gas curdle, there is a high possibility that the pipe will be insufficiently purged.
[0009]
[Problems to be solved by the invention]
In view of the above-mentioned present situation, the present invention solves the above-mentioned conventional inconveniences and problems, and in manufacturing semiconductors, a high-purity semiconductor process gas used in large quantities is safe and reduces the purity of the gas in the container. SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor process gas bulk supply apparatus that can be supplied without damaging, and that can reduce the arrangement space and can be used for mass use.
[0010]
[Means for Solving the Problems]
  To solve the above problem,
  The invention according to claim 1 is a large-capacity bulk supply apparatus that supplies a semiconductor process gas to a supply location.
  Gas container filled with semiconductor process gas having two openings in the containerFixedA process valve is connected to one of the two openings of the gas container to form a process gas filling port, and a gas extraction unit having a container valve and a pressure reducing valve is connected to the other opening. As a gas supply port,
  Arranged on the side of the gas container, a purge gas container having a container valve attached to each end.FixedOne purge valve of the purge gas container is connected to the gas extraction unit to serve as a purge gas supply valve, and the other container valve is a purge gas filling valve.
  At the bottom of the container is formed a lifting port for transportA bulk supply apparatus for semiconductor process gas.
  The invention according to claim 2 is a large-capacity bulk supply apparatus for supplying a semiconductor process gas to a supply location.
  Gas container filled with semiconductor process gas having two openings in the containerFixedA process valve is connected to one of the two openings of the gas container to form a process gas filling port, and a gas extraction unit having a container valve and a pressure reducing valve is connected to the other opening. As a gas supply port,
  Arranged on the side of the gas container, a purge gas container having a container valve attached to each end.FixedOne purge valve of the purge gas container is connected to the gas extraction unit to serve as a purge gas supply valve, and the other container valve is a purge gas filling valve.
  A fixed base for fixing the gas container is provided inside the container, and a lifting ring for transport is provided on the fixed base.A bulk supply apparatus for semiconductor process gas.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
The target gas for bulk supply of the present invention is SiH, which is a semiconductor process gas._Four, AsH_Three, PH_Three, SF₆, NF_Three, CF_Four, C₂F₆, CH_Four, HF, HCl, HBr, ClF_Three, NH_Three, N₂O, He, H₂, O₂, CO₂, CO, etc.
Containers for bulk supply filled with these gases are made of materials such as SUS steel, CrMo steel, carbon steel, Mn steel, Al alloy, Al lining reinforced plastic, and the size is 300 mm or more, for example. It is 1200 mm or less and the length is 1.5 m or more and 12 m or less, and is appropriately selected and designed according to the semiconductor manufacturing scale, and has a size suitable for placement in a semiconductor factory.
This gas container has openings at both ends in the longitudinal direction of the container, a container valve having an opening / closing function is arranged on one opening, and a container valve having an opening / closing function is decompressed on the other opening. A pressure reducing valve having a function is arranged in series.
[0012]
Since the container valve and the pressure reducing valve are arranged close to each other, the gas replacement characteristics are greatly improved, and the portion exposed to the high pressure in the arranged piping is reduced. This is also preferable.
Further, the container valve and the pressure reducing valve can be attached as a so-called block valve in which these are highly integrated and integrated. As the block valve, a triple three-way valve or a quadruple four-way valve can be used. These container valves are forged from brass, stainless steel, nickel alloy, etc., and machined to manufacture.
[0013]
For the purpose of improving the corrosion resistance of the metal surface, the container, container valve, pressure reducing valve and pipes are reduced as much as possible the amount of moisture, gas molecules or particles adsorbed on the surface of the gas contact part where gas flows. The gas contact surface portion is subjected to surface polishing such as mechanical polishing, abrasive polishing, electrolytic polishing, composite electrolytic polishing, chemical polishing, and composite chemical polishing, or Ni is electrolessly or electroplated. Furthermore, a passive film may be formed by fluorine on the Ni-coated surface. In stainless steel, a passive oxide film such as iron or chromium may be formed by heat treatment after surface polishing.
The inner wall surface roughness (R) in the container is preferably 25 μm or less, preferably 12 μm or less, at the maximum Rmax. Further, the inner wall surface roughness of the container valve, the pressure reducing valve and the piping should be 1 μm or less, more preferably 0.5 μm or less.
[0014]
The semiconductor process gas filled in the container passes through the container valve and is supplied to the receiving facility of the user through a spring type or diaphragm type pressure reducing valve. A pressure gauge is attached between the container valve and the pressure reducing valve in order to confirm the filling pressure of the gas in the container. As the pressure gauge, a pressure gauge such as a Bourdon tube type, a strain gauge type, or a diaphragm type semiconductor gauge can be used as appropriate, but a diaphragm type semiconductor gauge is particularly suitable as the pressure gauge. Further, a thermometer such as a sheath type thermocouple for measuring the supply gas temperature may be provided.
[0015]
The above-described two-port container having openings at both ends is accommodated in a box-shaped or kamaboko-shaped container having a volume that can be accommodated by the container. The container is provided with a door for operating the base of the container valve from the outside so that the connection piping such as a manifold can be connected to the container valve, and a shutter and door are provided on a part of the container. Etc. may be provided as necessary.
[0016]
In the container in which the container is stored, there is an alarm device for notifying the leakage of the semiconductor process gas, a forced exhaust fan for improving the ventilation, a purge system for purging the inside of the connection pipe, and an abatement means such as an abatement cylinder. It is desirable to provide It is especially desirable to install an alarm and an exhaust fan.
By providing an alarm device, the leakage of the semiconductor process gas from the container can be monitored. The alarm can be operated in conjunction with the gas extraction unit, exhaust fan, etc. to stop the gas supply or drive the exhaust fan to improve safety. it can. Further, the exhaust fan can be arranged outside to secure the exhaust in the container.
[0017]
In the container,A detoxifying material for detoxifying gas leaked into the space is directly embedded in the container, or a detoxification cylinder filled with a detoxifying material for detoxifying harmful gas in the purge exhaust gas is arranged. Detoxification means can be provided.The abatement material is a material in which diatomaceous earth is impregnated with ferric chloride and a catalyst component, a silica or alumina carrier impregnated with potassium permanganate or caustic soda, or a catalyst such as alkali or metal oxide on activated carbon. What added the component, or what shape | molded the metal oxide in the granular form etc. are used. It is better to avoid the abatement material from being exposed to the atmosphere all the time, and the abatement effect can be maintained for a long time, so the forced exhaust fan is linked with the alarm device and it is driven only when the alarm device is activated. Thus, it is preferable to use a system in which the gas in the container is exhausted to the atmosphere by the suction force of the exhaust fan via the abatement means such as the abatement cylinder.
[0018]
The bulk supply apparatus of the present invention is arranged so that two or more semiconductor process gases can be continuously supplied to a user of a semiconductor factory, and switched to the other apparatus before one is used. It is used so that the semiconductor process gas is newly filled in the container of one of the apparatuses that has been used in the meantime, and this is sequentially switched to supply gas continuously. In this switching use, it is necessary to purge the piping and valves in advance to maintain the purity of the supply gas. For this purge, a purge gas container filled with an inert gas such as nitrogen, argon or helium or hydrogen gas is placed in the container.Side by side of the gas containerBy placing and connecting this to piping or valves, it can be done in a compact state.
[0019]
In addition, the bulk supply apparatus for semiconductor process gas according to the present invention is provided with an oxygen meter or a moisture meter in the container, so that whether or not the purge is completely performed at the time of the purge operation of the piping, valves, switching unit, etc. Since the determination can be performed using the oximeter and the moisture meter and it can be confirmed that the purge has been completely performed, a desired high-purity semiconductor process gas can be always supplied. The oxygen meter and moisture meter used for this are preferably those that can be measured at a level of several tens of ppb. For the oxygen meter, a yellow phosphorus emission type, a galvanic cell type, etc. can be suitably used. An oscillation type (polymer film coat, Ba coat) or the like can be suitably used.
[0020]
【Example】
The details of the bulk supply apparatus for semiconductor process gas according to the present invention will be described below based on examples.
[Example 1]
The first embodiment will be described with reference to FIG. FIG. 1 is a partially cutaway schematic view of a semiconductor process gas bulk supply apparatus according to Embodiment 1 of the present invention. The semiconductor process gas bulk supply apparatus 101 of the first embodiment is an apparatus having the basic configuration of the present invention. For example, a gas container 2 made of Mn steel is fixed to a fixed base 4 by bands 3 and 3 in a box-shaped container 1 that houses the gas container 2. The fixed base 4 is provided with four lifting rings 5 that are hung so that they can be conveyed by hooking at four corners. The gas container 2 has an outer diameter of 600 mm, a length of 2200 mm, and an internal volume of about 470L. Two gas containers 2 are arranged at both ends.A three-way three-way block valve 23 in which a container valve 6a, a purge gas valve 20, a pressure reducing valve 8 and a pressure gauge 10 are integrated and integrated is attached to one gas supply side of the opening to form a take-out unit U. Has been. As this unit U, a container valve and a pressure reducing valve connected to each other via a pressure gauge may be used. This unit UIs connected to a gas supply pipe 25 which communicates with a receiving facility (not shown) at the use destination.In addition, a container valve 6b is connected to the other side of the opening.The container valve 6b is used for gas filling.
[0021]
In order to partition the arrangement space of the gas container 2 from the valves 6 and 8 attached thereto and the pressure gauge 10 and the like, a space 7 and a space 9 are formed by surrounding the valves and instruments by the partition plates 7a and 9a. ing. Gas space symflex tubes 13 and 13 extending from the alarm device 11 are inserted into the space 7 and the section 9, respectively, and the presence or absence of gas leakage is constantly monitored. An exhaust fan 12 is provided on the ceiling of the container 1 so that the space in the container 1 can be forcibly exhausted.
In the lower part of the container 1, a lifting port 14 is provided to lift the semiconductor process gas bulk supply device 101 and facilitate the transfer by a lifter.
[0022]
Further, when connecting a gas supply pipe 25 communicating with a receiving facility (not shown) at a use destination to the take-out unit U, for example, nitrogen can be purged so that the fitting joint and the gas supply pipe 25 can be purged. A purge gas container 17 filled with an inert gas such as a gas is installed in the container 1 alongside the gas container 2 as shown in the figure. The purge gas container 17 is composed of a two-necked container with container valves 18a and 18b attached to both ends thereof. One container valve 18a is connected to a purge gas valve 20 of a triple three-way block valve 23 (U) disposed in the gas container 2, and the other container valve 18b is used for filling purge gas. The purge gas container 17 may be a general gas container. For example, a 10 L container made of Mn steel may be used.
[0023]
The purge gas container 17 is filled with, for example, 14.7 Mpa of high-purity nitrogen gas having a moisture content of 5 ppb or less. A valve 15 is connected to the take-out unit U connected to the gas container 2 filled with the semiconductor process gas. A container valve disposed in the gas container 2 via the container valve 18a of the purge gas container 17 in order to purge the pipe 25 and the joint when connecting the pipe 25 communicating with the receiving facility of the user through Purge gas is supplied to the purge gas valve 20 disposed between 6a and the pressure reducing valve 8 to purge them.
[0024]
Purging measures the moisture concentration and oxygen concentration in the exhaust gas after purging, stops the supply of the purge gas when those concentrations reach 10 ppb or less, and then derives the semiconductor process gas from the gas container 2 to Purge with gas as well. Prior to the purging of the process gas, the pipe 25, the joint part, and also the take-out unit U and the like are several T orr It is preferable to evacuate to the following pressure.
The semiconductor process gas used and exhausted for this purge is introduced into the abatement cylinder 19 disposed in the container 1 through the valve 16 and removed. And in order to supply this semiconductor process gas to a semiconductor manufacturing apparatus, it is preferable to repeat purging and evacuation by this semiconductor process gas 5 times or more.
[0025]
The gas container 2 of the bulk supply apparatus 101 includes, for example, S i H ₄ (Monosilane) is filled with 100 kg, and by installing two of these apparatuses 101, the installation space of the conventional curdle type gas supply apparatus is 5 m. ² It was about half the installation space.
In addition, the conventional cylinder cabinet is not required, and the bulk supply device of the present invention has a simple structure compared to the curdle method, so the investment amount of the gas container for gas supply is almost halved. Can save.
[0026]
Further, in the semiconductor process gas bulk supply apparatus 101 according to the first embodiment, the purge gas container 17 is disposed in the container 1 together with the semiconductor process gas container, so that the number of pipes exposed to the atmosphere is increased. In order to improve the purge efficiency and reduce the water concentration and the oxygen concentration to 10 ppb or less, 3 hours are conventionally required. In contrast, this apparatus of the present invention requires 10 ppb in about half of 1.5 hours. Reached:
[0027]
 Further, since the abatement cylinder 19 is provided in the container, the semiconductor process gas bulk supply device itself of the first embodiment can perform the abatement process of the harmful process gas, and each receiving facility of the use destination. It is no longer necessary to install abatement equipment at the plant, and the equipment costs of the receiving equipment can be reduced.
[0028]
Next, the example2As other semiconductor process gas for bulk supply equipment101The figure2Will be described. Figure2Example of the present invention2It is a partial cutaway schematic diagram of the bulk supply apparatus for semiconductor process gases concerning. In addition,2 in FIG.Components common to the illustrated components are denoted by the same reference numerals, and detailed description thereof is omitted.
2 is the same as FIG.An analyzer 21 such as a moisture meter, an oxygen meter, and a particle counter for analyzing the presence of impurities such as moisture and oxygen is disposed in a container 1 of a semiconductor process gas bulk supply device. When connecting the process gas bulk supply device to a receiving facility (not shown) at the user's site, it is used to determine the appropriate end point of the purge when purging the piping 25 or the take-out unit U as described above. To do. As the analyzer 21, a crystal oscillation type Ba coat type moisture meter, a galvanic cell type oxygen meter, a particle counter, or the like can be suitably used as necessary.
[0029]
That is, as described above, when connecting the pipe 25 that connects the take-out unit U attached to the semiconductor process gas gas container 2 to the receiving facility of the user through the valve 15, for example, nitrogen is supplied from the purge gas container 17. A purge gas made of an inert gas such as a gas is supplied from the valve 18a through the triple three-way block valve 23 to the pipe 25 via the valve 15 to purge these pipes. Then, the purge exhaust gas after being used for the purge is introduced into the analyzer 21 through the valve 22 from the receiving facility side (not shown), and the moisture concentration and oxygen concentration of the purge exhaust gas are detected there. When the concentration of these components becomes 10 ppb or less, the purge with the purge gas is completed, and then the operation of evacuation and the purge with the semiconductor process gas is repeated five times or more, and then the semiconductor process gas is taken out from the gas container 2 U is supplied to the receiving facility by the pipe 25 through the valve 15.
[0030]
Therefore, the example2Bulk supply equipment for semiconductor process gas101Then, in purging with an inert gas, analyzing and evaluating the moisture concentration and oxygen concentration of the purge exhaust gas depends on the oxide generated by the reaction between the semiconductor process gas flowing as the purge gas and water in the subsequent purge process. It is extremely effective in reliably preventing clogging of equipment pipes, pressure reducing valves, pressure gauges, flow meters, mass flow controllers, and other equipment attached to semiconductor manufacturing equipment and the outflow phenomenon of regulators.
For example, SiH as a semiconductor process gas₄If moisture is left in equipment such as piping, the remaining moisture, oxygen and SiH₄Reacts with SiO₂As described above, the clogging of the equipment and the outflow phenomenon occur. Therefore, the example2Bulk supply equipment for semiconductor process gas101Then, by installing an analyzer such as a moisture meter or oxygen meter in the device itself, the bulk supply device itself uses a high-purity semiconductor process gas in a form that is almost fully satisfactory. It became possible to supply it first.
[0031]
Next, this example2A bulk supply device for semiconductor process gas was manufactured with the following specifications.
● Gas container for semiconductor process gas
Volume: 470L
Dimensions: Outer diameter 600mm, length 2200mm
● Dimensions of the above gas containers and containers for storing various devices
2500mm (length) x 800mm (width) x 800mm (height)
[0032]
[Comparative example]
In order to evaluate the performance of the bulk supply apparatus for semiconductor process gas according to the present invention, the specification dimensions of a gas supply apparatus of the same capacity that is conventionally used for supplying a large volume of gas are as follows.
● Gas container used for curdle
Volume: 47L / book
Accumulated number: 10
Total capacity: 470L
● Space required to integrate 10 gas containers
2000mm (length) x 1200mm (width) x 1800mm (height)
● Dimensions of the frame required for integration as a cardle
2500mm (length) x 2000mm (width) x 1800mm (height)
[0033]
[Comparison]
Embodiment of the present invention described above2Comparing the dimensions of the bulk supply device and the conventional gas supply type gas supply device,
● Installation area
The present invention = [(2500 mm (length) × 800 mm (width)) / (2500 mm (length) × 2000 mm (width))] × [Kardle method] = 0.4 × [Kardle method]
The installation area of the bulk supply apparatus of the present invention is about 40% of the installation area of the conventional cardle system apparatus.
● Occupied volume
The present invention = [(2500 mm (length) × 800 mm (width) × 800 mm (height)) / (2500 mm (length) × 2000 mm (width) × 1800 mm (height))] × [Kardle method] = 0. 17 x [Kardle method]
As for the occupied volume, the bulk supply apparatus of the present invention requires 17% of the conventional curdle type apparatus.
[0034]
【The invention's effect】
Of the present inventionFor semiconductor process gas bulk supply equipment, the processThe high-pressure gas part that is likely to cause gas leakage is reduced and is limited to the inside of the container, and operates as a bulk supply device for semiconductor process gas with high safety. In addition, it is a mass supply device for semiconductor process gas with safety in gas supply, and it is also possible to arrange a plurality of this bulk supply device, so gas supply at the semiconductor factory where it is used It is possible to suppress the exclusive area of the device as much as possible.
[0035]
Further, in the semiconductor process gas bulk supply apparatus of the present invention, since a small gas container for purge gas is installed in the container, the internal air such as pipes and valves is connected to the receiving equipment of the user. Purge gas can be quickly purged, and purge gas can be supplied to specified locations with a simple and small-pitch piping configuration, and high-purity semiconductor process gas can be supplied without impairing the impurity level of the gas in the gas container. Can do.
[0036]
In addition, by providing an analyzer such as a moisture meter and an oxygen meter to monitor atmospheric components, the presence of atmospheric components such as moisture remaining in these piping and valves during the purge processing of piping and valves Alternatively, it is possible to always monitor and confirm whether or not it is below a certain level. This prevents the supplied semiconductor process gas from reacting with water, oxygen, etc. to produce oxides and corrosion products, thereby clogging the piping, valves, and instruments that occur. This can prevent the semiconductor process gas from being supplied without any trouble.
[0037]
Furthermore, by installing a detoxification means such as an alarm, exhaust fan, and decontamination cylinder, it is possible to quickly detect the leakage of the semiconductor process gas, and to remove the semiconductor process gas that contains a lot of harmful gases with a detoxifying material. It is possible to perform operation without detoxifying and releasing dangerous gas to the atmosphere.
In addition, the bulk supply apparatus for semiconductor process gas of the present invention not only can supply a large amount of semiconductor process gas at a lower cost than before, but also has an effect of constantly supplying high-purity semiconductor process gas stably with improved safety. Play.
[Brief description of the drawings]
FIG. 1 is a partially cutaway schematic view of a semiconductor process gas bulk supply apparatus according to Embodiment 1 of the present invention.
FIG. 2 is a partially cutaway schematic view of a semiconductor process gas bulk supply apparatus according to Embodiment 2 of the present invention.
[Fig. 3]It is the schematic explaining the conventional gas supply type gas supply apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 101 ... Bulk supply apparatus for semiconductor process gas, 1 ... Container, 2 ... Gas container, 6a, 6b ... Container valve, 8 ... Pressure reducing valve, 10 ... Pressure gauge, 11 ... Alarm, 12 ... Exhaust fan, 17 ... For purge Gas container, 19 ... Detoxification cylinder, 20 ... Purge gas valve, 23 ... Triple 3-way block valve, U ... Extraction unit

Claims (2)

In large-capacity bulk supply equipment that supplies semiconductor process gas to the supply location
A gas container filled with a semiconductor process gas having two openings is fixed in the container, and a container valve is connected to one of the two openings of the gas container to form a process gas filling port. A gas extraction unit equipped with a container valve and a pressure reducing valve is connected to the opening to form a process gas supply port,
Arranged on the side of the gas container, fixed a purge gas container having a container valve attached to both ends, and connected one of the purge gas containers to the gas extraction unit as a purge gas supply valve, The other container valve is a purge gas filling valve,
A bulk supply apparatus for semiconductor process gas, wherein a lifting opening for transport is formed in a lower part of the container . In large-capacity bulk supply equipment that supplies semiconductor process gas to the supply location
A gas container filled with a semiconductor process gas having two openings is fixed in the container, and a container valve is connected to one of the two openings of the gas container to form a process gas filling port. A gas extraction unit equipped with a container valve and a pressure reducing valve is connected to the opening to form a process gas supply port,
Arranged on the side of the gas container, fixed a purge gas container having a container valve attached to both ends, and connected one of the purge gas containers to the gas extraction unit as a purge gas supply valve, The other container valve is a purge gas filling valve,
A bulk supply apparatus for semiconductor process gas , wherein a fixing base for fixing the gas container is provided inside the container, and a lifting ring for transport is provided on the fixing base .

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