JP3709349B2 - Optical disc substrate, optical disc - Google Patents

Optical disc substrate, optical disc Download PDF

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Publication number
JP3709349B2
JP3709349B2 JP2001102639A JP2001102639A JP3709349B2 JP 3709349 B2 JP3709349 B2 JP 3709349B2 JP 2001102639 A JP2001102639 A JP 2001102639A JP 2001102639 A JP2001102639 A JP 2001102639A JP 3709349 B2 JP3709349 B2 JP 3709349B2
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Japan
Prior art keywords
substrate
optical disc
recess
light transmission
transmission layer
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JP2001102639A
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Japanese (ja)
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JP2002298435A (en
Inventor
裕一 川口
研二 山家
由美 坂井
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TDK Corp
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TDK Corp
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Priority to JP2001102639A priority Critical patent/JP3709349B2/en
Priority to TW091105344A priority patent/TW584848B/en
Priority to US10/103,113 priority patent/US6815029B2/en
Priority to DE60208943T priority patent/DE60208943T2/en
Priority to EP02006804A priority patent/EP1245363B1/en
Priority to CNB021087474A priority patent/CN1220194C/en
Publication of JP2002298435A publication Critical patent/JP2002298435A/en
Priority to US10/718,801 priority patent/US6835435B2/en
Priority to US10/953,517 priority patent/US20050034617A1/en
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Description

【0001】
【発明の属する技術分野】
本発明は、少なくとも光透過層が積層される光ディスク用基板に関するものである。
【0002】
【従来の技術】
従来、オーディオ用、ビデオ用、コンピュータ用等の各種情報を記録する光ディスクとしては、CD(コンパクトディスク)、MD(ミニディスク)、DVD(デジタルバーサタイルディスク)等があるが、今後の情報量の増加に対応してこれら光ディスクにおける記録密度を更に向上させる必要がある。
【0003】
光ディスク等の記録密度を向上させるには、用いるレーザ光の集光スポット径を小さくすることが必要であり、そのためにはレーザ光の短波長化やレーザ光学系における対物レンズの高NA(開口数)化が必要となる。
【0004】
上記のようなレーザ光は、情報記録面を被っている光透過層を介して情報記録面に集光させるが、上記のように短波長化・高NA化が進展すると光学収差が顕著となる。従って、光学収差を抑制するためには前記光透過層をできるだけ薄くしなければならない。
【0005】
CDやMDにおいては、用いるレーザ光の波長が780nm、NAが0.45、光透過層の厚みが1.2mmとなり、又CD等より高密度に情報を記録するDVDにおいては、用いるレーザ光の波長が650nm、NAが0.6、光透過層の厚みが0.6mmである。これらの範囲内であれば、通常、透明材料を用いて射出成形によって形成された基板を上記光透過層とすることができる。
【0006】
今後より一層の記録密度の上昇を図るために、レーザ光の波長を更に短く、NAを更に大きくした場合、基板である光透過層も更に薄くしなければならない。しかし、従来の射出成形法(射出圧縮も含む)で今以上に薄く且つ精度良く基板を製作することが極めて困難となってきている。つまり、基板を光透過層として用いる従来構造の光ディスクでは、レーザ光の短波長化・高NA化による記録密度を向上させる手法が製造技術の面から限界に達している。
【0007】
これに対して、例えば特開平10−289489号公報に開示されるように、光を透過させる必要がない保護板を基板として射出成形により厚く形成し、この基板の情報記録面に記録膜/再生用反射膜を成膜後、その上に薄い光透過層を積層形成する構造の光ディスクがある。このようにすると、光透過層を薄く形成することが可能になると共に、基板側で全体の強度を確保することが出来るので、レーザ光の短波長化・高NA化に柔軟に対応する事が出来るようになる。
【0008】
なお、光透過層の形成方法としては、スピンコート法により基板上に紫外線硬化性樹脂液を塗布した後に硬化させる方法や、別途形成した透明シートを、紫外線硬化性樹脂あるいは粘着材料を接着剤として基板上に接着して一体化する方法等がある。しかし、透明シートを基板に接着する方法は、光透過層の光学特性や厚み精度に厳しいものが要求されるために、製造コストが高くなるという問題がある。これに対して、スピンコート法は比較的要求特性を充足し易く、例えば前記特開平10−289489号公報、特開平11−73691号公報、特開平11−203724号公報等に具体的なスピンコート法による光透過層の形成手段が開示されている。
【0009】
【発明が解決しようとする課題】
以上のように、保護板側を基板として用いる構造の光ディスクは記録密度を向上させることが出来るが、製造技術面で下記のような問題点を有している。
【0010】
(1)基板の収縮誤差の問題
射出成形で基板を製造する場合、成形時の冷却速度の違いから基板の外周近傍が中心側より厚くなることがある。即ち、図6に示されるように、射出成形による樹脂基板1の外周には、スキージャンプと呼ばれる盛り上り部2ができることがあり、このままではレーザ光の入射及び反射角度が悪化したり、或いは、対物レンズ等のレーザ光学系が盛り上がり部2に衝突したりする可能性があった。従って、例えば特開平5−200791号公報に開示されるように、前記盛り上り部2を後処理で除去しなければならず、製造コストの増大となっていた。
【0011】
(2)光透過層の厚み不均一問題
スピンコート法は、基板をスピンドルによって回転させつつその表面に塗布液を流下して基板の回転に従って塗布液が均一に広がるようにして塗布するものである。この場合、前記スピンドルの回転数や塗布時間、塗布液の粘度を制御することによって、塗布液の厚みを調整できるが、基板の外周部分にはどうしても塗布液の偏りが発生し、盛り上りが生じ易いという問題点がある。この状態を下記に示す。
【0012】
例えば図7に示される基板1は、その表面(上面)の最外周の一定幅の領域(空白領域3)の内側に信号記録領域4が設けられ、空白領域3及び信号記録領域4の表面(上面)が光透過層5によって被われている。樹脂をスピンコート法によって塗布・硬化させて光透過層5を形成した結果、信号記録領域4の最外周部から空白領域3にかけて盛り上り部5Aが形成されてしまう。特にスピンコート法の適用例としては比較的厚い部類に入る光透過層5(例えば100μm)を形成すると、盛り上り部5Aの厚みTと幅Wが非常に大きくなることによって当該盛り上がり部5Aが信号記録領域4に重なってしまい情報記録領域が減少するという問題があった。
【0013】
更に、この盛り上がり部5Aには、レーザ光学系が衝突する可能性が十分にあるので、例えば特開平11−86355号公報、特開平11−86356号公報等に開示されているように、前記盛り上り部5Aを後処理で除去しなければならないという問題があり、製造コストの増大に繋がっていた。
【0014】
又前述の特開平11−86356号公報には、図8(A)、(B)に示されるように、前記図7の場合よりも一回り大きい外径の基板1を用いて光透過層5を塗布した後に、盛り上り部5Aを含んだ外周部を切削等により除去する方法が開示されている。
【0015】
しかしながら、基板1の外周を除去する際の加工精度が悪いと、基板内径に対する外径(外周部側面)の同心度(偏重心)が低下するため、ディスクドライブに装着して回転させた時の動的アンバランスが大きくなり、記録/再生に不具合が生じるという問題点があった。又、外周部を除去する分だけ材料の歩留まりが悪いという問題があった。
【0016】
この発明は、上記従来の問題点に鑑みてなされたものであって、低コストで、且つ、同心度を低下させることなく基板や光透過層の外周不均一部分の拡大を抑制することができるようにした光ディスク用基板、及び光ディスク用基板から形成した光ディスクを提供することを目的とする。
【0017】
【課題を解決するための手段】
本発明者が光ディスクの構造等について鋭意努力した結果、基板の形状を工夫することによって外周部の不均一化を抑制できることが明らかとなった。つまり、以下に示す発明によって上記目的が達成される。
【0018】
(1)一方の表面側に少なくとも光透過層が積層されることで光ディスクを構成可能とされた光ディスク用基板であって、前記一方の表面における信号記録領域より外周側に、周方向の凹部を形成されていて、前記一方の表面における前記凹部の径方向外側端が、該凹部の径方向内側端よりも厚さ方向に低く、且つ該凹部の最深部よりも厚さ方向に高く設定され、さらに、前記凹部がその最深部から径方向外側に向かって徐々に浅く設定されて周縁部と略連続し、該周縁部の径方向断面が略鋸歯形状となっていることを特徴とする光ディスク用基板。
【0021】
)一方の表面側に少なくとも光透過層が積層されることで光ディスクを構成可能とされた光ディスク用基板であって、前記一方の表面における信号記録領域より外周側に、周方向の凹部を形成されていて、前記凹部がその最深部から径方向外側に向かって徐々に浅く設定されて周縁部と略連続し、該周縁部の径方向断面が略鋸歯形状となっていることを特徴とする光ディスク用基板。
【0022】
)上記(1)又は(2)において、
当該基板の最外周面の半径をdとした場合に、前記周方向の凹部における径方向内側端が、基板中心から0.965×dの位置より外周側、好ましくは0.975×dの位置より外周側、更に好ましくは0.983×dの位置より外周側に設定されていることを特徴とする光ディスク用基板。
【0023】
)上記(1)乃至()のいずれかに記載の光ディスク用基板の前記一方の表面側に少なくとも光透過層が積層されていることを特徴とする光ディスク。
【0024】
なお、ここで「信号記録領域」とは、実質的に内周側から連続してあらかじめ信号が記録されている領域、又は、実質的に内周側から連続して信号が記録可能な状態とされている領域をさす。又、ここで基板中心とは、少なくとも2ヶ所の基板直径を表す仮想線の交点によって得られる位置とする。
【0025】
光ディスク用基板に形成される上記凹部は、一見すると、スピンコート中の塗布液の円滑な広がり阻害されて不合理と考えられる。しかし、実際に試してみると、塗布液は、基板の回転による遠心力によって凹部を超えて周縁部(或いは凹部の径方向外側端)側に拡散して盛り上がり、基板の回転が静止すると、盛り上がっていた塗布液が戻るようにして上記凹部に流れ込む。
【0026】
この結果、塗布液による光ディスク周縁の盛り上がりが積極的に防止される。しかも、この凹部の径方向幅は比較的狭く設定することが可能になり、その範囲内で盛り上がりが抑制できれば内部の情報記録領域を拡張できる。又このように凹部を形成しておくと、基板自体の周縁近傍が射出成形後の熱収縮等によって厚くなることが防止され、いわゆるスキージャンプが形成されないで済む。
【0027】
更に、凹部を利用して基板の周縁を略鋸歯形状(断面)にすると、スピンコート中の塗布液の液切れが良好になり、液溜まり量が低減されて盛り上がりを更に低減することが可能になる。
【0028】
以上のように、基板に凹部を形成するという簡潔な構造によって、基板自体の周縁近傍の肉厚化及び積層される光透過層の周縁近傍の盛り上がりの双方を合理的な思想によって抑制し、製造コストを大幅に低減することが出来るようになる。
【0029】
【発明の実施の形態】
以下本発明の実施の形態の例を図面を参照して詳細に説明する。
【0030】
図1に示されるように、本発明の実施の形態の第1例に係る光ディスク10は、基板12の表面に情報記録面14及び光透過層16を順次形成したものである。
【0031】
光ディスク10が読取り専用タイプの場合は、基板12自体にデータピットが形成され、その上にアルミニウムやアルミニウム合金等の反射膜が成膜されて情報記録面14が形成される。光ディスク10が記録可能タイプの場合は、反射膜、及び記録用レーザビームによって反射率を変調可能な記録膜や誘電体膜等が積層されて情報記録面14が形成される。
【0032】
前記光透過層16は、紫外線硬化性樹脂溶液をスピンコート法により前記情報記録面14側の表面に塗布した後、紫外線を照射して硬化させたものである。
【0033】
基板12における情報記録面14側の周縁近傍には、周方向の凹部50が形成されている。この凹部50は、径方向外側に向かって徐々に浅く設定されて周縁部52と略連続しており、結果として周縁部52の径方向断面が、先端(周縁)52Aが鋭角となる略鋸歯形状となっている。
【0034】
なお、より詳細には、基板12の最外周面の半径をdとした場合、凹部50の径方向内側端50Aの位置が基板中心から0.965×dよりも外側に設定され、より好ましくは基板中心から0.975×dよりも外側に設定され、更に好ましくは基板中心から0.983×dよりも外側に設定される。
【0035】
更に、凹部50の径方向外側端50C(ここでは先端52Aと一致する)が、凹部50の径方向内側端50Aよりも厚さ方向にH1だけ低く、且つ凹部50の最深部50Bよりも厚さ方向にH2だけ高く設定されている。つまり、厚さ方向における内側端50Aと最深部50Bの間に外側端50Cが位置する。最深部50Bは、ここでは凹部50の幅Wの中間位置Mよりも径方向内側に位置するように設定されている。
【0036】
又本実施形態においては凹部50の幅Wを1(mm)以下に設定しており、具体的には0.5(mm)程度に設定している。従って基板12の周縁52Aから径方向内側に1(mm)以内の範囲は、情報が記録されない空白領域20Aとされ、その内周側には信号記録領域20が位置している。
【0037】
なお、凹部50の深さ(内側端50Aと最深部50Bとの高さの差(=H1+H2))は0.02(mm)<H1+H2<0.4(mm)、好ましくは0.02(mm)<H1+H2<0.2(mm)、更に好ましくは0.02(mm)<H1+H2<0.1(mm)に設定される。又内側端50Aと外側端50Cとの高さの差H1は0.01(mm)<H1<0.4(mm)、好ましくは0.01(mm)<H1<0.2(mm)、更に好ましくは0.02(mm)<H1<0.1(mm)に設定される。
【0038】
次に、本基板12上にスピンコートによって光透過層16を形成する過程の状態を説明する。
【0039】
図2に示されるように、基板12が回転している状態で塗布液(光透過層16)を流下した場合、周縁部52近傍に盛り上がり部16Aが一時的に形成される。又、この盛り上がり部16Aの表面エネルギーによって、凹部50内の塗布液(光透過層16)は盛り上がり部16A側に引き出されるので、該凹部50内に塗布液はさほど滞留していないと推察される。即ち、基板12の回転中は、凹部50に相当する位置の光透過層16に、同様な凹み空間16Bが形成される。
【0040】
この状態で基板12の回転を静止すると、図3に示されるように上記盛り上がり部16Aが径方向内側に逆流し、凹部50の底面の傾斜を利用して上記凹み空間16Bに流れ込む。この結果、盛り上がり部16Aの残留が抑制され、光透過層16の表面を従来よりも平滑にすることが可能になる。以上のようにして図1で示した光ディスク10が得られる。
【0041】
本実施形態では、上述のように凹部50の存在によって光透過層16の周縁の盛り上がりが積極的に防止される。しかも、この凹部50の径方向幅Wを比較的狭く設定することが可能になり(例えば1(mm)以内)、その範囲内で盛り上がりを抑制できるので結果として信号記録領域20を拡張できる。又光透過層16を形成した後の(盛り上がり部をカットするための)切削工程が不要になるので、加工コストの上昇を抑制できると共に、加工誤差による光ディスク10の動的アンバランスの悪化を防止できる。
【0042】
又このように凹部50を形成しておくと、射出成形後の基板12自体にいわゆるスキージャンプが形成されないで済む。
【0043】
更に、凹部50を利用して基板12の周縁部52が略鋸歯形状(断面)となっているので、スピンコート中の塗布液の液切れが良好になり、液溜まり量が低減されて周縁の盛り上がりをより低減することが可能になる。
【0044】
なお、前記基板12は、通常の射出成形法や2P(Photo−Polymer)法等により作成される。射出成形法は、アクリルやポリカーボネイト樹脂等を成形機の可塑化装置により溶融し、記録/再生信号用の微小凹凸パターンを有する原盤を装着した金型のキャビティ内に該溶融樹脂を充填し、冷却固化後に金型を開いて基板を取り出す方法である。
【0045】
前記2P法は、微小凹凸パターンの無いガラスや樹脂基板と微小凹凸パターンを有する原盤との間に紫外線硬化性樹脂や2液混合硬化性樹脂等を介在させて両者を密着し、樹脂の硬化後に原盤を剥離して微小凹凸パターンを有する基板を作成する方法である。又、前記情報記録面14を構成する反射膜等は、前記記録/再生信号用の微小凹凸パターン上に、例えばスピンコート法、スパッタ法、蒸着法等により成膜される。
【0046】
上記実施の形態の例における基板12は、凹部50と周縁部52とが連続している場合に限って示したが、本発明はそれに限定されない。例えば図4に示される光ディスク60のように、周縁部52と凹部50が離れていても構わない。又本光ディスク60のように、周縁部52の断面が鋸歯形状では無い場合も本発明は含んでいる。
【0047】
更に上記実施形態では凹部50の径方向外側端50Cが、内側端50Aよりも厚さ方向にH1だけ低い場合を示したが、本発明はそれに限定されず、例えば図5に示される光ディスク70のように、両者が同等の高さ或いは外側端50Cの方が高い場合を含んでいる。これらは光ディスクに要求される平滑度を考慮して適宜設定すればよい。なお、図1で示したように内側端50Aより外側端50Cを低く設定した方が、周縁部52における光透過層16の多少の盛り上がりを吸収できるので望ましいと言える。
【0048】
又上記実施の形態の例では、基板12を射出成形法によって製造し、光透過層16をスピンコート法によって形成する場合を示したが本発明はこれに限定されない。更に、基板12の凹部50はプレス加工や切削加工等によって形成するようにしても良い。
【0049】
本発明の基板(凹部を含む)及び光ディスク形状は、上記例に限定されるものでなく、本発明の要旨を逸脱しない範囲において適宜変更されるべきものである。
【0050】
【発明の効果】
本発明は上記のように構成したので、製造コストを低減しながらも、外周の光透過層の盛り上り部等を含む外側領域の形状の不均一を抑制することが出来るという優れた効果を有する。
【図面の簡単な説明】
【図1】本発明の実施の形態の例に係る光ディスクの要部を示す拡大断面図
【図2】同光ディスクにおいてスピンコートによって光透過層を形成している状態の要部を拡大して示す断面図
【図3】同光ディスクにおいて光透過層を硬化させている状態の要部を拡大して示す断面図
【図4】同光ディスクにおける基板の形状の他の例を拡大して示す断面図
【図5】同光ディスクにおける基板の形状の他の例を拡大して示す断面図
【図6】外周に盛り上り部が形成された従来の基板の要部を拡大して示す断面図
【図7】基板における光透過層の盛り上り部を拡大して示す断面図
【図8】予め外径を大きくした基板における光透過層の盛り上がり部及びこの盛り上がり部を除去した状態を示す拡大断面図
【符号の説明】
10、60、70・・・光ディスク
12・・・基板
14・・・情報記録面
16・・・光透過層
16A・・・盛り上り部
16B・・・凹み空間
20・・・信号記録領域
20A・・・空白領域
50・・・凹部
50A・・・内側端
50B・・・最深部
50C・・・外側端
52・・・周縁部
52A・・・先端
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an optical disk substrate on which at least a light transmission layer is laminated.
[0002]
[Prior art]
Conventionally, there are CDs (compact discs), MDs (mini discs), DVDs (digital versatile discs), etc. as optical discs for recording various types of information such as audio, video, and computer. Accordingly, it is necessary to further improve the recording density of these optical discs.
[0003]
In order to improve the recording density of an optical disk or the like, it is necessary to reduce the focused spot diameter of the laser beam to be used. For this purpose, the wavelength of the laser beam is shortened or the objective lens in the laser optical system has a high NA (numerical aperture). ) Is required.
[0004]
The laser light as described above is condensed on the information recording surface through the light transmission layer covering the information recording surface, but the optical aberration becomes noticeable as the wavelength is shortened and the NA is increased as described above. . Therefore, in order to suppress optical aberration, the light transmission layer must be made as thin as possible.
[0005]
In CD and MD, the wavelength of the laser beam used is 780 nm, NA is 0.45, and the thickness of the light transmission layer is 1.2 mm. The wavelength is 650 nm, NA is 0.6, and the thickness of the light transmission layer is 0.6 mm. Within these ranges, a substrate formed by injection molding using a transparent material can usually be used as the light transmission layer.
[0006]
In order to further increase the recording density in the future, when the wavelength of the laser beam is further shortened and the NA is further increased, the light transmission layer as the substrate must be further thinned. However, it has become extremely difficult to produce a substrate that is thinner and more accurate than conventional injection molding methods (including injection compression). In other words, in a conventional optical disk using a substrate as a light transmission layer, a technique for improving the recording density by shortening the wavelength of the laser light and increasing the NA has reached the limit in terms of manufacturing technology.
[0007]
On the other hand, as disclosed in, for example, Japanese Patent Laid-Open No. 10-289489, a protective plate that does not need to transmit light is formed thick by injection molding as a substrate, and a recording film / reproduction is recorded on the information recording surface of the substrate. There is an optical disc having a structure in which a thin light transmission layer is formed on a reflective film after forming a reflective film for use. In this way, the light transmission layer can be formed thin, and the overall strength can be ensured on the substrate side. Therefore, it is possible to flexibly cope with the shorter wavelength and higher NA of the laser beam. become able to do.
[0008]
As a method for forming the light transmission layer, a method of curing after applying an ultraviolet curable resin liquid on a substrate by a spin coating method, or a separately formed transparent sheet using an ultraviolet curable resin or an adhesive material as an adhesive. There is a method of bonding and integrating on a substrate. However, the method of adhering the transparent sheet to the substrate has a problem that the manufacturing cost is high because the optical properties and thickness accuracy of the light transmission layer are required to be strict. On the other hand, the spin coat method is relatively easy to satisfy the required characteristics. For example, the specific spin coat described in JP-A-10-289489, JP-A-11-73691, JP-A-11-203724, etc. Means for forming a light transmission layer by the method is disclosed.
[0009]
[Problems to be solved by the invention]
As described above, an optical disk having a structure using the protective plate side as a substrate can improve the recording density, but has the following problems in terms of manufacturing technology.
[0010]
(1) Problem of substrate shrinkage error When a substrate is manufactured by injection molding, the vicinity of the outer periphery of the substrate may be thicker than the center side due to a difference in cooling rate during molding. That is, as shown in FIG. 6, there may be a raised portion 2 called a ski jump on the outer periphery of the resin substrate 1 by injection molding, and the incident and reflection angle of the laser beam deteriorates as it is, or There is a possibility that a laser optical system such as an objective lens may collide with the raised portion 2. Therefore, as disclosed in, for example, Japanese Patent Application Laid-Open No. 5-200791, the raised portion 2 has to be removed by post-processing, resulting in an increase in manufacturing cost.
[0011]
(2) Non-uniform thickness problem of light transmitting layer The spin coating method is to apply a coating solution so that the coating solution spreads uniformly according to the rotation of the substrate while the substrate is rotated by a spindle and the coating solution flows down to the surface. . In this case, the thickness of the coating liquid can be adjusted by controlling the rotation speed of the spindle, the coating time, and the viscosity of the coating liquid. However, the bias of the coating liquid inevitably occurs on the outer peripheral portion of the substrate, resulting in swell. There is a problem that it is easy. This state is shown below.
[0012]
For example, the substrate 1 shown in FIG. 7 is provided with a signal recording area 4 inside a constant width area (blank area 3) on the outermost periphery of the surface (upper surface), and the surface of the blank area 3 and the signal recording area 4 ( The upper surface is covered with the light transmission layer 5. As a result of forming the light transmission layer 5 by applying and curing the resin by spin coating, a raised portion 5A is formed from the outermost peripheral portion of the signal recording region 4 to the blank region 3. In particular, as an application example of the spin coating method, when the light transmission layer 5 (for example, 100 μm) that falls into a relatively thick class is formed, the thickness T and the width W of the raised portion 5A become very large, so that the raised portion 5A has a signal. There is a problem that the information recording area is reduced because it overlaps the recording area 4.
[0013]
Further, since the raised portion 5A has a sufficient possibility that the laser optical system will collide, as described in, for example, JP-A-11-86355, JP-A-11-86356, etc. There was a problem that the upstream portion 5A had to be removed by post-processing, leading to an increase in manufacturing cost.
[0014]
Further, in the above-mentioned Japanese Patent Application Laid-Open No. 11-86356, as shown in FIGS. 8A and 8B, a light transmitting layer 5 is used by using a substrate 1 having an outer diameter slightly larger than that in the case of FIG. A method of removing the outer peripheral portion including the raised portion 5 </ b> A by cutting or the like after coating is disclosed.
[0015]
However, if the processing accuracy when removing the outer periphery of the substrate 1 is poor, the concentricity (eccentric gravity) of the outer diameter (outer peripheral side surface) with respect to the inner diameter of the substrate is lowered. There is a problem that the dynamic imbalance becomes large and a defect occurs in recording / reproduction. In addition, there is a problem that the yield of the material is poor as much as the outer peripheral portion is removed.
[0016]
The present invention has been made in view of the above-described conventional problems, and can suppress the expansion of the non-uniform portion of the outer periphery of the substrate or the light transmission layer at a low cost and without reducing the concentricity. An object of the present invention is to provide an optical disk substrate and an optical disk formed from the optical disk substrate.
[0017]
[Means for Solving the Problems]
As a result of diligent efforts by the inventor regarding the structure and the like of the optical disk, it has become clear that the nonuniformity of the outer peripheral portion can be suppressed by devising the shape of the substrate. That is, the above object is achieved by the following invention.
[0018]
(1) An optical disk substrate that can be configured as an optical disk by laminating at least a light transmission layer on one surface side, and a circumferential recess is formed on the outer peripheral side of the signal recording area on the one surface. The radially outer end of the recess on the one surface is set lower in the thickness direction than the radially inner end of the recess and higher in the thickness direction than the deepest part of the recess , Further, the concave portion is set to be gradually shallower from the deepest portion toward the radially outer side and is substantially continuous with the peripheral portion, and the radial cross section of the peripheral portion has a substantially serrated shape . substrate.
[0021]
( 2 ) An optical disk substrate in which an optical disk can be configured by laminating at least a light transmission layer on one surface side, and a circumferential recess is formed on the outer peripheral side of the signal recording area on the one surface. The recessed portion is formed to be gradually shallower from the deepest portion toward the radially outer side and is substantially continuous with the peripheral portion, and the radial cross section of the peripheral portion has a substantially serrated shape. Optical disk substrate.
[0022]
( 3 ) In the above (1) or (2) ,
When the radius of the outermost peripheral surface of the substrate is d, the radially inner end of the circumferential recess is on the outer peripheral side from the position of 0.965 × d, preferably 0.975 × d from the center of the substrate. An optical disk substrate characterized in that it is set on the outer peripheral side, more preferably on the outer peripheral side from a position of 0.983 × d.
[0023]
( 4 ) An optical disc, wherein at least a light transmission layer is laminated on the one surface side of the optical disc substrate according to any one of (1) to ( 3 ).
[0024]
Here, the “signal recording area” is an area in which signals are recorded substantially continuously from the inner circumference side, or a state in which signals can be recorded substantially continuously from the inner circumference side. Indicates the area that has been marked. Here, the substrate center is a position obtained by an intersection of virtual lines representing the diameters of at least two locations.
[0025]
At first glance, the concave portion formed on the optical disk substrate is considered to be unreasonable because the smooth spreading of the coating liquid during spin coating is inhibited. However, when actually tried, the coating solution spreads and rises to the peripheral edge (or the radially outer end of the recess) by the centrifugal force due to the rotation of the substrate, and rises when the rotation of the substrate stops. The applied coating solution flows back into the recess.
[0026]
As a result, the rising of the periphery of the optical disk due to the coating liquid is positively prevented. In addition, the radial width of the recess can be set to be relatively narrow, and the internal information recording area can be expanded if the bulge can be suppressed within the range. In addition, if the recesses are formed in this way, the vicinity of the periphery of the substrate itself can be prevented from becoming thick due to heat shrinkage after injection molding, and so-called ski jumps need not be formed.
[0027]
Furthermore, if the concave portion is used to make the peripheral edge of the substrate substantially saw-tooth shape (cross section), the coating liquid during spin coating will be well out, the amount of liquid pool will be reduced, and the rise can be further reduced. Become.
[0028]
As described above, the simple structure of forming the recess in the substrate suppresses both the thickening of the vicinity of the periphery of the substrate itself and the rising of the vicinity of the periphery of the light-transmitting layer to be laminated by a rational idea. Cost can be greatly reduced.
[0029]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below in detail with reference to the drawings.
[0030]
As shown in FIG. 1, an optical disc 10 according to a first example of an embodiment of the present invention is obtained by sequentially forming an information recording surface 14 and a light transmission layer 16 on the surface of a substrate 12.
[0031]
When the optical disk 10 is a read-only type, data pits are formed on the substrate 12 itself, and a reflective film such as aluminum or aluminum alloy is formed thereon to form the information recording surface 14. When the optical disk 10 is a recordable type, the information recording surface 14 is formed by laminating a reflection film and a recording film, a dielectric film, etc. whose reflectance can be modulated by a recording laser beam.
[0032]
The light transmission layer 16 is formed by applying an ultraviolet curable resin solution to the surface on the information recording surface 14 side by spin coating and then irradiating it with ultraviolet rays.
[0033]
In the vicinity of the peripheral edge of the substrate 12 on the information recording surface 14 side, a circumferential recess 50 is formed. The concave portion 50 is gradually shallower toward the outer side in the radial direction and is substantially continuous with the peripheral portion 52. As a result, the radial cross section of the peripheral portion 52 has a substantially saw-tooth shape with a sharp tip 52A. It has become.
[0034]
In more detail, when the radius of the outermost peripheral surface of the substrate 12 is d, the position of the radially inner end 50A of the recess 50 is set outside 0.965 × d from the substrate center, more preferably It is set outside 0.975 × d from the substrate center, and more preferably set outside 0.983 × d from the substrate center.
[0035]
Furthermore, the radially outer end 50C of the recess 50 (here, coincides with the tip 52A) is lower by H1 in the thickness direction than the radially inner end 50A of the recess 50 and is thicker than the deepest portion 50B of the recess 50. The direction is set higher by H2. That is, the outer end 50C is located between the inner end 50A and the deepest portion 50B in the thickness direction. Here, the deepest portion 50B is set so as to be located radially inward from the intermediate position M of the width W of the recess 50.
[0036]
In the present embodiment, the width W of the recess 50 is set to 1 (mm) or less, and specifically set to about 0.5 (mm). Accordingly, a range within 1 (mm) radially inward from the peripheral edge 52A of the substrate 12 is a blank area 20A where no information is recorded, and the signal recording area 20 is located on the inner peripheral side.
[0037]
The depth of the recess 50 (the difference in height between the inner end 50A and the deepest portion 50B (= H1 + H2)) is 0.02 (mm) <H1 + H2 <0.4 (mm), preferably 0.02 (mm ) <H1 + H2 <0.2 (mm), more preferably 0.02 (mm) <H1 + H2 <0.1 (mm). The height difference H1 between the inner end 50A and the outer end 50C is 0.01 (mm) <H1 <0.4 (mm), preferably 0.01 (mm) <H1 <0.2 (mm). More preferably, 0.02 (mm) <H1 <0.1 (mm) is set.
[0038]
Next, the state of the process of forming the light transmission layer 16 on the substrate 12 by spin coating will be described.
[0039]
As shown in FIG. 2, when the coating liquid (light transmission layer 16) flows down while the substrate 12 is rotating, a raised portion 16 </ b> A is temporarily formed near the peripheral edge 52. In addition, since the coating liquid (light transmission layer 16) in the recess 50 is drawn to the rising portion 16A side by the surface energy of the raised portion 16A, it is assumed that the coating liquid does not stay so much in the recessed portion 50. . That is, during the rotation of the substrate 12, a similar recessed space 16 </ b> B is formed in the light transmission layer 16 at a position corresponding to the recessed portion 50.
[0040]
When the rotation of the substrate 12 is stopped in this state, as shown in FIG. 3, the swelled portion 16A flows backward inward in the radial direction, and flows into the recessed space 16B using the inclination of the bottom surface of the recessed portion 50. As a result, the remaining of the raised portion 16A is suppressed, and the surface of the light transmission layer 16 can be made smoother than before. The optical disc 10 shown in FIG. 1 is obtained as described above.
[0041]
In the present embodiment, the rising of the peripheral edge of the light transmission layer 16 is positively prevented by the presence of the recess 50 as described above. In addition, the radial width W of the concave portion 50 can be set to be relatively narrow (for example, within 1 (mm)), and the rise can be suppressed within the range, so that the signal recording area 20 can be expanded as a result. Further, since a cutting step (for cutting the raised portion) after forming the light transmission layer 16 is not required, an increase in processing cost can be suppressed and deterioration of dynamic unbalance of the optical disc 10 due to processing errors can be prevented. it can.
[0042]
If the recess 50 is formed in this manner, a so-called ski jump does not need to be formed on the substrate 12 itself after injection molding.
[0043]
Furthermore, since the peripheral edge 52 of the substrate 12 has a substantially serrated shape (cross section) using the concave portion 50, the coating liquid in the spin coat is excellently drained, the amount of liquid pool is reduced, and the peripheral edge 52 is reduced. It is possible to further reduce the swell.
[0044]
The substrate 12 is formed by a normal injection molding method, a 2P (Photo-Polymer) method, or the like. In the injection molding method, acrylic or polycarbonate resin is melted by a plasticizer of a molding machine, and the molten resin is filled into a mold cavity equipped with a master having a micro uneven pattern for recording / reproducing signals, and cooled. This is a method of opening a mold after solidification and taking out the substrate.
[0045]
In the 2P method, an ultraviolet curable resin, a two-component mixed curable resin, or the like is interposed between a glass or resin substrate without a fine uneven pattern and a master having a fine uneven pattern, and the two are adhered to each other. In this method, the master is peeled off to form a substrate having a micro uneven pattern. Further, the reflective film or the like constituting the information recording surface 14 is formed on the fine uneven pattern for recording / reproducing signals by, for example, spin coating, sputtering, vapor deposition or the like.
[0046]
Although the board | substrate 12 in the example of the said embodiment was shown only when the recessed part 50 and the peripheral part 52 were continuing, this invention is not limited to it. For example, like the optical disc 60 shown in FIG. 4, the peripheral edge 52 and the recess 50 may be separated from each other. Further, the present invention includes the case where the cross section of the peripheral edge 52 is not a sawtooth shape as in the case of the present optical disk 60.
[0047]
Further, in the above embodiment, the case where the radially outer end 50C of the recess 50 is lower by H1 in the thickness direction than the inner end 50A is shown, but the present invention is not limited thereto, and for example, the optical disc 70 shown in FIG. Thus, the case where both are the same height or the outer end 50C is higher is included. These may be appropriately set in consideration of the smoothness required for the optical disc. As shown in FIG. 1, it can be said that setting the outer end 50C lower than the inner end 50A is preferable because it can absorb a slight rise of the light transmission layer 16 in the peripheral edge 52.
[0048]
In the example of the above embodiment, the case where the substrate 12 is manufactured by the injection molding method and the light transmission layer 16 is formed by the spin coating method is shown, but the present invention is not limited to this. Further, the concave portion 50 of the substrate 12 may be formed by pressing or cutting.
[0049]
The substrate (including the recess) and the optical disk shape of the present invention are not limited to the above examples, and should be appropriately changed without departing from the gist of the present invention.
[0050]
【The invention's effect】
Since the present invention is configured as described above, it has an excellent effect that it is possible to suppress non-uniformity of the shape of the outer region including the raised portion of the outer light transmitting layer while reducing the manufacturing cost. .
[Brief description of the drawings]
FIG. 1 is an enlarged cross-sectional view showing a main part of an optical disc according to an example of an embodiment of the present invention. FIG. 2 is an enlarged view showing a main part in a state where a light transmission layer is formed by spin coating on the optical disc. Sectional view [FIG. 3] An enlarged sectional view showing the main part of the optical disc in a state where the light transmission layer is cured. [FIG. 4] An enlarged sectional view showing another example of the shape of the substrate on the optical disc. FIG. 5 is an enlarged cross-sectional view showing another example of the shape of the substrate in the optical disc. FIG. 6 is an enlarged cross-sectional view showing the main part of a conventional substrate having a raised portion formed on the outer periphery. FIG. 8 is an enlarged cross-sectional view showing a raised portion of the light transmitting layer in the substrate. Description】
10, 60, 70 ... optical disc 12 ... substrate 14 ... information recording surface 16 ... light transmission layer 16A ... raised portion 16B ... recessed space 20 ... signal recording region 20A .... Blank area 50 ... Concave part 50A ... Inner end 50B ... Deepest part 50C ... Outer end 52 ... Peripheral part 52A ... Tip

Claims (4)

一方の表面側に少なくとも光透過層が積層されることで光ディスクを構成可能とされた光ディスク用基板であって、
前記一方の表面における信号記録領域より外周側に、周方向の凹部を形成されていて、
前記一方の表面における前記凹部の径方向外側端が、該凹部の径方向内側端よりも厚さ方向に低く、且つ該凹部の最深部よりも厚さ方向に高く設定され
さらに、前記凹部がその最深部から径方向外側に向かって徐々に浅く設定されて周縁部と略連続し、該周縁部の径方向断面が略鋸歯形状となっている
ことを特徴とする光ディスク用基板。
An optical disk substrate in which an optical disk can be configured by laminating at least a light transmission layer on one surface side,
A circumferential recess is formed on the outer peripheral side of the signal recording area on the one surface,
The radially outer end of the recess on the one surface is set lower in the thickness direction than the radially inner end of the recess and higher in the thickness direction than the deepest portion of the recess ,
Further, the concave portion is set to be gradually shallower from the deepest portion toward the radially outer side and is substantially continuous with the peripheral portion, and the radial cross section of the peripheral portion has a substantially serrated shape . substrate.
一方の表面側に少なくとも光透過層が積層されることで光ディスクを構成可能とされた光ディスク用基板であって、
前記一方の表面における信号記録領域より外周側に、周方向の凹部を形成されていて、
前記凹部がその最深部から径方向外側に向かって徐々に浅く設定されて周縁部と略連続し、該周縁部の径方向断面が略鋸歯形状となっている
ことを特徴とする光ディスク用基板。
An optical disk substrate in which an optical disk can be configured by laminating at least a light transmission layer on one surface side,
A circumferential recess is formed on the outer peripheral side of the signal recording area on the one surface,
The optical disc substrate, wherein the concave portion is set to be gradually shallower from the deepest portion toward the radially outer side and is substantially continuous with the peripheral portion, and the radial cross section of the peripheral portion has a substantially serrated shape.
請求項1又は2において、
当該基板の最外周面の半径をdとした場合に、前記周方向の凹部における径方向内側端が、基板中心から0.965×dの位置より外周側、好ましくは0.975×dの位置より外周側、更に好ましくは0.983×dの位置より外周側に設定されている
ことを特徴とする光ディスク用基板。
In claim 1 or 2 ,
When the radius of the outermost peripheral surface of the substrate is d, the radially inner end of the circumferential recess is on the outer peripheral side from the position of 0.965 × d, preferably 0.975 × d from the center of the substrate. An optical disc substrate characterized by being set on the outer peripheral side, more preferably on the outer peripheral side from a position of 0.983 × d.
請求項1乃至のいずれかに記載の光ディスク用基板の前記一方の表面側に少なくとも光透過層が積層されていることを特徴とする光ディスク。Optical disc, wherein at least the light transmitting layer is laminated on the one surface of the optical disc substrate according to any one of claims 1 to 3.
JP2001102639A 2001-03-30 2001-03-30 Optical disc substrate, optical disc Expired - Fee Related JP3709349B2 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2001102639A JP3709349B2 (en) 2001-03-30 2001-03-30 Optical disc substrate, optical disc
TW091105344A TW584848B (en) 2001-03-30 2002-03-20 Moulding die, metallic mould system, recording medium base plate, recording medium, optical disc base plate, optical disc, moulding die making method
US10/103,113 US6815029B2 (en) 2001-03-30 2002-03-22 Stamper, mold system, recording medium substrate, recording medium, optical disc substrate, optical disc, and method for producing stamper
EP02006804A EP1245363B1 (en) 2001-03-30 2002-03-25 Stamper for forming at least a data recording region on an optical recording substrate, optical recording substrate, and methods for producing such a stamper
DE60208943T DE60208943T2 (en) 2001-03-30 2002-03-25 A die for forming at least one data recording region on an optical recording medium, optical recording medium, and methods of manufacturing such a die
CNB021087474A CN1220194C (en) 2001-03-30 2002-03-29 Moulding die, mould system, recording medium base plate, recording medium, optical disc base plate, optical disc, moulding die making method
US10/718,801 US6835435B2 (en) 2001-03-30 2003-11-24 Stamper, mold system, recording medium substrate, recording medium, optical disc substrate, optical disc, and method for producing stamper
US10/953,517 US20050034617A1 (en) 2001-03-30 2004-09-30 Stamper, mold system, recording medium substrate, recording medium, optical disc substrate, optical disc, and method for producing stamper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001102639A JP3709349B2 (en) 2001-03-30 2001-03-30 Optical disc substrate, optical disc

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