JP3701288B2 - Sealing device - Google Patents

Description

  The present invention detects and memorizes and notifies that when the casing containing the article is opened, thereby detecting early detection such as theft, unauthorized copying, and unauthorized modification of the article in the casing. The present invention relates to a sealing device that enables appropriate countermeasures and thus prevents such fraud.

  Even if a flexible disk or CD containing important data is stored in a lockable enclosure such as a safe, if the enclosure is opened and the data is copied and returned to its original state, fraud will be It can happen that you don't even realize you were there. If it is an important document, it is the same if it is taken or copied. In addition, products and blueprints based on new technologies may lose value even if they are seen.

  In pachinko and pachislot machines, a microcomputer (control device) with an approved program is housed in a sealed housing to prevent unauthorized modification, but it is opened with advanced technology and replaced with an illegal microcomputer with the same appearance. If it is done, it will be difficult to find and illegal games will be possible.

  In addition, in a reading device such as a magnetic card or an IC card, which has been rapidly spreading recently, a casing is opened, and a device for reading and storing a personal identification number or the like, or transferring data wirelessly, is assembled. The risk of wrongdoing is increasing. In fact, such crimes are reported.

From such a background, a technique for accurately detecting the unauthorized opening of the casing is required, and a technique related to the sealing device for that purpose has already been proposed by the present applicant. For example, in JP-A-9-34365, JP-A-11-190972, JP-A-11-202769, JP-A-11-231790, JP-A-11-258997, JP-A-11-283890, etc. is there.
Japanese Patent Laid-Open No. 11-283890 (paragraphs 0050 to 0088, FIG. 3)

The present inventor has conducted intensive research as shown in each of the above-mentioned publications. However, there was a point to be technically improved along with immaturity of society's recognition of the necessity of a sealing device.
For example, 1) Downsizing and cost reduction of the detection element for detecting opening, 2) The detection element is simple and inexpensive to be closed when the casing is closed and open when opened. 3) The circuit system that enables low-power consumption and long-term storage was immature. 3) Leave the internal power supply empty, attach the sealing device to the case, and charge the internal power supply after closing the case. Since the procedure of doing is taken, a long waiting time for charging the internal power supply is required.

The invention according to claim 1 is a detection element of a sealing device that is attached to a case to be closed and detects opening of the case, and is provided on one side of a lid and a bottom of the case. And a first detection contact and a second detection contact provided on the other side. When the housing is closed, the binding material closes between the detection contacts. The detection element of the sealing device is configured so that the action of the binder disappears when the seal is opened and the detection contacts are opened.

A detection element is configured by providing a conductive material binding material on one side of the lid and bottom of the housing, and first and second detection contacts on the other side, and when the housing is closed For example, the material contacts both detection contacts to close the detection contacts, and when the housing is opened, the action of the bonding material is lost and the detection contacts are opened, which can be used for a sealing device.

The detection element of claim 1 is preferably used as the detection element (SE) of the sealing device according to claim 3 , for example. However, the present invention is not limited to this, and the contact is opened when the casing is opened. It can be used for all sealing devices that use detection elements.

Since the detection element is composed of the first and second detection contacts and a conductive material binder, the detection element can be reduced in size and cost.
The invention according to claim 2 is a detection element of a sealing device that is attached to a closed casing and detects opening of the casing, and is a coupling provided on one side of the lid and the bottom of the casing And a first detection contact and a second detection contact provided on the other side. When the casing is closed, the coupling material prevents conduction between the detection contacts and opens the contact. The detection element of the sealing device is configured such that when the casing is opened, blocking of conduction by the binding material is released and the detection contacts are closed.

  The detection element is configured by providing a binding material on one side of the lid and bottom of the housing and providing the first and second detection contacts on the other side. The detection element according to claim 1 is prevented from entering between the detection contacts and preventing the detection contacts from being closed, and when the housing is opened, the conduction preventing action by the binder is lost and the detection contacts are closed. Similarly, it can be used for a sealing device.

Since this detection element is composed of the first and second detection contacts and the binding material, the detection element can be reduced in size and cost.
The invention according to claim 3 is a sealing device that is attached to a case to be closed and detects opening of the case, and includes an internal power source charged by an external power source, and a contact when the case is opened. a detection device (SE) but to be open, the first C-MOS gate detection elements (SE) receives a signal that changes the potential at the time of the opening when closed (Q1), the first A C-MOS buffer (Q2) for receiving a signal obtained by integrating the output of the C-MOS gate (Q1) by a diode (D2) and a capacitor (C2), and the C-MOS buffer input via the diode (D3) An electric double layer capacitor (C3) charged by the output of (Q2), and supplying power from the internal power source to the first C-MOS gate (Q1) and the C-MOS buffer (Q2). The external power supply is cut off In a sealing device capable of storing that the housing has been opened even when
A second C-MOS gate (Q3) that operates with a power source derived from the external power source and determines the potential of the electric double layer capacitor (C3) to change the output level, and a voltage of the external power source are divided. Means for operating the second C-MOS gate (Q3) with a reduced power supply or means for adding a bias voltage reduced by dividing the voltage of the external power supply to the potential of the electric double layer capacitor (C3) A sealing device for a housing, wherein the presence or absence of opening is notified according to the output level of the second C-MOS gate (Q3).

  When the casing is opened and the detection element (SE) is opened from the closed state, the input potential of the first C-MOS gate (Q1) changes and the output level of the C-MOS gate (Q1) is inverted. The output of the C-MOS gate (Q1) charges the capacitor (C2) through the diode (D2).

  The potential of the capacitor (C2), that is, the C-MOS buffer (Q2) that receives a signal obtained by integrating the output of the C-MOS gate (Q1) by the diode (D2) and the capacitor (C2) has the potential of the capacitor (C2). The power supplied to the power supply terminal flows to the output terminal while it is equal to or higher than the determination threshold (approximately half of the power supply voltage) (between the power supply terminal and the output terminal is a resistor in the C-MOS buffer (Q2)). Therefore, the electric double layer capacitor (C3) is charged by the output of the C-MOS buffer (Q2) via the diode (D3) connected to the output terminal. This electric double layer capacitor (C3) is a memory element, and the presence or absence of charging corresponds to the presence or absence of memory.

The second C-MOS gate (Q3) operates with a power source derived from an external power source, determines the potential of the electric double layer capacitor (C3), and changes the output level.
Here, in the present invention, a means for operating the second C-MOS gate (Q3) with a power source that has been reduced by dividing the voltage of the external power source or a bias voltage that has been reduced by dividing the voltage of the external power source is the electric 2 Means are provided for adding to the potential of the multilayer capacitor (C3).

  As is well known, the C-MOS gate has a judgment threshold value that is approximately 1/2 of the power supply voltage, and the output low (L) and high (H) are low when the input voltage is above or below this judgment threshold. Determined. Hereinafter, low is described as L and high as H.

  Since the electric potential of the charged electric double layer capacitor (C3) gradually decreases, if it is left as it is, it will eventually fall below the determination threshold of the C-MOS gate (Q3). Then, the output level of the C-MOS gate (Q3) becomes a level indicating “no opening memory”.

  However, in the case where a means for operating the C-MOS gate (Q3) with a power source obtained by dividing and reducing the voltage of the external power source is provided, the determination threshold of the C-MOS gate (Q3) is reduced by the partial pressure. Accordingly, the level indicating “with open memory” can be maintained even when the electric double layer capacitor (C3) has a low potential. That is, it takes a long time for the potential of the electric double layer capacitor (C3) to fall below the determination threshold value of the C-MOS gate (Q3). Memory).

  In addition, when means for adding a bias voltage, which is obtained by dividing and reducing the voltage of the external power supply, to the potential of the electric double layer capacitor (C3), the input voltage of the C-MOS gate (Q3) is increased by the bias. Therefore, the lower potential of the electric double layer capacitor (C3) can also be determined as “with unsealed memory”.

  As a result, the storage time can be remarkably increased, and the parts can be miniaturized. In addition, by using a detection element that is simple and inexpensive and is closed when the casing is closed and opened when the casing is opened, it can be stored for a long time with low power consumption.

The invention according to claim 4 is a sealing device that is attached to a case to be closed and detects opening of the case, and includes an internal power source charged by an external power source and detection for detecting opening of the case. In a sealing device having an element (SE) and a storage element that is operated by the internal power source and stores that the detection element (SE) detects the opening of the housing, the sensor device has a string-like sensor switch wire, When the sensor switch wire is pulled, the sensor switch changes from a state in which the signal of the detection element (SE) is disabled to a state in which the signal of the detection element (SE) is enabled, and one of the sensor switch wires The end is taken out of the housing through a hole or gap provided in the housing and attached to the inside of the housing, and the sensor switch wire is pulled after the housing is closed to Sensor switch The sealing device is characterized in that the switch is switched to a state in which the signal of the detection element (SE) is made valid.

  The sensor switch has a string-like sensor switch wire. When the sensor switch wire is pulled, the sensor switch changes from a state in which the signal of the detection element (SE) is disabled to a state in which the signal of the detection element (SE) is enabled.

  One end of the sensor switch wire is taken out of the housing through a hole or gap provided in the housing, attached to the inside of the housing, and the sensor switch wire is pulled after the housing is closed The sensor switch is switched to a state in which the signal of the detection element (SE) is made valid.

  That is, the casing is closed after charging (or charging) the internal power supply of the sealing device. At this time, the sensor switch is in a state of invalidating the signal of the detection element (SE). Therefore, even if the casing is opened to set the sealing device, the opening is not stored.

  Then, after the housing is closed, the sensor switch wire is pulled to change the sensor switch to a state in which the signal of the detection element (SE) is valid. Thereafter, when the casing is opened, the detection element (SE) detects this, and the storage element operated by the internal power supply stores the opening of the casing.

  It is not necessary to take the procedure of attaching the sealing device to the housing with the internal power supply empty, and charging the internal power supply after closing the housing, and need a long waiting time to charge the internal power supply. do not do.

It is desirable that the sensor switch be configured to irreversibly change from a state in which the signal of the detection element (SE) is disabled to a state in which the signal of the detection element (SE) is enabled when the sensor switch wire is pulled. .

Each invention of claim 1 to 4, as described above, respectively, mentioned as the object of the present invention is to provide 1), 2), 3) solves one of claims 1, 2 Two problems can be solved by combining any of the above and claim 3 or claim 4, and all three problems can be solved by combining any of claims 1 and 2, and claims 3 and 4. .

Next, the best embodiment of the present invention will be described with various specific examples. In the following examples, numerical values such as component constants, device component names, etc. are specifically disclosed for easy understanding of the description, but are merely examples, and the present invention is limited to these specific numerical values. I don't mean.
[Circuit configuration example 1]

  A circuit configuration example 1 of the sealing device will be described with reference to FIG. This circuit configuration example is an example in which, among various detection elements to be described later, a detection element of a type that opens when the casing is closed and the casing is opened when the casing is closed is employed.

First, an external power supply 5V can be applied between the connectors CN-1 and CN-2. Although not shown, an external power source can be turned on and off with a power switch.
The power switch P-SW is for prohibiting charging of the capacitor C1 (electric double layer capacitor, which serves as an internal power source) when testing an electric device (for example, a control board) in which the sealing device 10 is incorporated. Is provided. The resistor R1 serves to limit the current when the power switch P-SW is closed.

  The role of the power switch P-SW is to form a bypass in parallel with the internal power supply C1. If the power supply (in this case, the internal power supply C1) is not empty when the sealing device 10 is set, it is stored that it was opened at the time of setting. The sealing device 10 is not only used alone, but may be used by being incorporated in another electric device (for example, a control board of a gaming machine, a control board of a credit card reader). In this case, the external power supply (5 V) is received from the control board or the like.

  The control board and the like are naturally subjected to an electrical test for quality confirmation during production and shipment. The role of the power switch P-SW is provided to prevent the internal power supply C1 from being charged at this time.

  That is, when incorporated in a control board or the like, an electrical test of the control board or the like is performed in a state where the contacts P-SW1 and P-SW2 of the power switch P-SW are short-circuited by the power switch wire P-SW-Wire. After the electrical test, the power switch P-SW-Wire is removed by removing the power switch wire P-SW-Wire in the absence of 5 V of the external power supply, the power switch P-SW is opened, and the sealing device 10 is set in the housing, and then the external power supply ( The procedure of applying 5V) is observed. Hereinafter, it is assumed that the power switch wire P-SW-Wire has been removed.

  The external power supply charges the internal power supply C1 via the resistor R1 and the diode D1. In the figure, the internal power supply C1 has a relatively large capacity value of 0.33F, and the internal resistance is as large as 75Ω even when new, and the internal resistance increases (deteriorates) as much as 1kΩ when used for a long time. The time required for is not short. Practically, it is desirable to charge in 30 minutes to several hours. When incorporated in a control board or the like, the battery is naturally charged during operation of the control board or the like.

  The diode D1 is provided in order to prevent the connectors CN-1 and CN-2 from being short-circuited and discharging the internal power supply C1. Therefore, a small Schottky diode such as 1SS332, which has a small voltage drop in the forward direction and a small leakage current in the reverse direction, is desirable.

The positive pole of the internal power supply C1 is connected to the power supply terminal VDD of the C-MOS buffers Q1 and Q2, and is connected to the input terminal IN of the C-MOS buffer Q1 via the resistor R6.
The input terminal IN of the C-MOS buffer Q1 is connected to the negative pole of the internal power supply C1 via the contacts SE1 and SE2 of the detection element SE and the resistor R7 (hereinafter referred to as “ground”), and also via the capacitor C4. Grounded.

  The output OUT of the C-MOS buffer Q1 is connected to the input IN of the C-MOS buffer Q2 via the diode D2, and the input IN of the C-MOS buffer Q2 is grounded via the capacitor C2.

The output OUT of the C-MOS buffer Q2 is connected to the input IN of the C-MOS inverter Q3 via the diode D3.
The power supply terminal VDD of the C-MOS inverter Q3 is connected to 2V of the junction point of the resistor R3 and the resistor R4 obtained by dividing the external power supply 5V by the resistor R3, the resistor R4, and the resistor R5, and the input terminal IN is connected via the capacitor C3. The power supply terminal VSS is grounded by connecting to the point of the intermediate point 0.4V between R4 and the resistor R5.

  The output terminal 0UT is connected to the base of a transistor TR with a built-in resistor. The emitter of the transistor TR is grounded, and the collector is connected to the positive pole of the external power supply via the green LED and the resistor R2.

Next, the operation of the sealing device 10 will be described. The operation of the sealing device 10 is divided into two types depending on whether or not an external power supply is applied.
In the state where the external power supply is applied, the intermediate point between the resistors R3 and R4 is designed to be 2V, and is provided as the power supply for the C-MOS inverter Q3. The intermediate point between the resistors R4 and R5 is designed to be 0.4V, and the input of the C-MOS inverter Q3 is 0.4V if the capacitor C3 has no charge. Since the input potential 0.4V is lower than the guaranteed value 0.5V determined as the L input in the C-MOS inverter Q3, the output OUT of the C-MOS inverter Q3 generates about 2V which is H, and the transistor TR The green LED is turned on via “” to notify “safe state = not opened”.

  In the state where the external power supply is not applied, the power supply to the C-MOS inverter Q3 via the resistor R3 is not applied, and the operation is disabled. Also, since no power is supplied to the green LED via the resistor R2, this is also unlit. Of course, the green LED is turned on as described above at the moment when the external power supply is applied, and "safe" is notified.

Next, the relationship with the detection element SE will be described.
As described above, the detection element SE is closed when the casing is closed and opened when the casing is opened. As can be seen from the circuit diagram of FIG. 1, the charge of the internal power supply C1 is discharged through the resistor R6, the detection element SE, and the resistor R7. In order to reduce this wasteful discharge, a high resistance value of 20 MΩ is used for the resistor R6 in this example, and the leakage current is set to 5 V / 20 MΩ = 0.25 μA (in fact, there is a voltage drop at the diode D1). So smaller than this.)

  The detection element SE will be described in detail with reference to various methods later. However, the sealing device 10 detects unauthorized opening during transportation on a truck or the like, or monitors a device used in an environment with a lot of electrical noise. In some cases, it should not malfunction due to vibration, impact, electrical noise, etc.

When the detection element SE including the movable part receives a large impact, it is fatal that the contact points SE1 and SE2 float (open) for a moment, but the capacitor C4 addresses this problem. In this example, since R6 = 20 MΩ and C4 = 0.022 μF, the time constant is 20 × 10 ⁶ × 0.022 × 10 ⁻⁶ = 0.44 seconds, and the opening direction of the detection element SE is about 0.1 seconds. It is considered insensitive to malfunctions.

  Here, there arises a problem in increasing the value of the capacitor C4 to increase the safety. For example, if C4 = 1 μF and the time constant is set to 20 seconds, it cannot be detected for 20 seconds after the housing is opened, and it is not possible to cope with the act of opening the detection element SE within 20 seconds after the fraudster opens. .

  In the case of the time constant of 0.44 seconds in the example of FIG. 1, even if the fraudster is smart, for example, even if the detection element SE is returned to the closed state again in 1 second, it is already from the output OUT of the C-MOS buffer Q1. The capacitor C2 is charged via the diode D2. In addition, backflow is prevented by the diode D2, and the configuration of the sealing device 10 is placed in a resin potting and protective case as illustrated in FIG.

  The capacitor C4 is also important in terms of dealing with an environment with a lot of electrical noise. The impedance of the capacitor is expressed as 1 / 2πfc. 0.022 μF is 7.2Ω for a frequency of 1 MHz, and 7.2 KΩ for 1 KHz. Further, it is 144 KΩ for a commercial frequency of 50 Hz.

  As described above, the output of the C-MOS buffer Q1 is stored in the capacitor C2 via the diode D2 and supplied to the C-MOS buffer Q2. However, the property stored in the capacitor C2 is short in terms of electrical noise. Even if it is noise, if there is a potential of VC1 / 2 [V] or higher at the input level of the C-MOS buffer Q1, it is repeatedly input, so that the input voltage of the C-MOS buffer Q2 becomes VC1 / 2 [V] or higher. Means that it will malfunction. That is, the effect of keeping the electric noise at VC1 / 2 [V] or less by the effect of the capacitor C4 is important.

  The detection element SE will be described later in various examples, but the method shown in FIG. 5 is that the casing is tied with the electric wire and the casing cannot be opened unless the binding of the electric wire is released. ing. However, as will be described with reference to FIG. 5, there is a disadvantage that if an electric wire bypass is provided, it is vulnerable to fraud.

  The resistor R7 corresponds to the above drawback. Since the human body has an induced potential when the hand of a person who performs the operation of connecting the detection element SE to the ground of the control board (same as the ground of the sealing device 10) touches the contact SE1 or SE2, the C-MOS buffer Q1 A potential of VC1 / 2 [V] or higher is applied to the input IN. The magnitude of the potential can be adjusted by the resistance value of the resistor R7. The larger the value, the better the sensitivity. That is, it has a circuit configuration that compensates for the defect of the detection element SE.

  In this example, the induced potential due to the presence of the resistor R7 is used. However, a technology using the capacitance of the human body, for example, a touch switch technology often used for an elevator or the like is used instead of the resistor R7. It goes without saying that it is possible.

  Since the description related to the detection element SE is slightly longer, the operation of FIG. 1 will be described again. In a state where the housing is closed, the detection element SE is closed, and the potential of the input IN of the C-MOS buffer Q1 is set to (0.4. 4V is a voltage drop of the diode D1), which is 4.6 × 1/21 = 0.22V, which is sufficiently lower than ½ of the power supply voltage VDD of the C-MOS buffer Q1. Therefore, the output OUT of the C-MOS buffer Q1 is almost 0V, and the capacitor C2 is not charged. Further, the input of the C-MOS buffer Q2 is also at the low level (hereinafter, the low level is written as L and the high level is written as H), the capacitor C3 is not charged, and the input of the C-MOS inverter Q3 is also L. is there.

  When an external power supply is applied, 2V given by the divided voltage of the resistors R3, R4, and R5 is the power supply voltage of the C-MOS inverter Q3. Therefore, the potential of the output OUT becomes almost 2V. The green LED is lit through TR. When the external power supply is not applied, the green LED is not lit, but is lit by the operation described above at the given moment.

Next, it is assumed that the casing is opened and the detection element SE is opened.
The potential of the input terminal IN of the C-MOS buffer Q1 is H of 4.6V even through 20 MΩ (actually, the potential drops slightly due to the input leakage current of the C-MOS buffer Q1 and the leakage current of the capacitor C4). Anyway, it is H enough.) The output OUT of the C-MOS buffer Q1 also becomes H, the capacitor C2 is charged via the diode D2, and the input of the C-MOS buffer Q2 is also set to H. As a result, the output of the C-MOS buffer Q2 also becomes H, and the capacitor C3 is charged through the capacitor C3 and the resistor R5 via the diode D3.

  If an external power supply (5V) is applied, the power supply voltage VDD of the C-MOS inverter Q3 is 2V, the input voltage is an intermediate potential (bias potential) between the resistors R4 and R5 = 0.4V, and the capacitor C3. The added value of the potentials.

  The C-MOS gate is well known to invert L and H of its output when the input voltage is ½ of the power supply voltage. Here, the voltage of the capacitor C3 is 0.6 V or more. Thus, the output of the C-MOS inverter Q3 is set to L to turn off the green LED. If the external power supply is not applied, the green LED is originally turned off, and the operation is not performed even when the external power supply is applied.

  The C-MOS buffer Q2 seems to be useless at first glance because it simply transmits the output of the C-MOS buffer Q1 to the C-MOS inverter Q3 as it is (L for L, H for H). But its existence is important. The reason is that the internal resistances of the internal power supply C1 and the capacitor C3 are large. The internal power supply C1 may be an electric double layer capacitor or a secondary battery such as a lithium battery, but both have high internal resistance, and particularly deteriorate with use time and become a large value.

  Consider the time constant when charging the capacitor C3 with the internal power supply C1. The internal power supply C1 is deteriorated and the internal resistance is set to 500Ω, and the capacitor C3 is set to 120Ω of the initial product characteristic because it is not used. The charging loop also includes a resistor R5. Since the 0.047F capacitor is charged through the resistance of (500Ω + 120Ω + 170Ω) = 790Ω, 0.047 × 790≈37 seconds. It should be noted that the time of 37 seconds is too much time for an act of an unauthorized person to close the detection element SE again after opening the casing.

  On the other hand, in this example, which is configured in two stages with C-MOS buffers Q1 and Q2, and the capacitor C2 (0.1 μF) is charged by preventing backflow by the diode D2, charging to the capacitor C2 is completed instantly. Even if the cheating person opens the casing and then closes the detection element SE again, since the potential of the capacitor C2 remains, fraud does not hold.

The time constant of the 0.1 μF capacitor C2 is that the input leakage current of the C-MOS buffer Q2 is 10 ⁻⁵ μA on average, so that the leakage resistance is 5V / 10 ⁻⁵ μA = 5 × 10 ⁵ MΩ 5 × 10 ⁵ × 10 ⁶ × 0.1 × 10 ⁻⁶ = 5 × 10 ⁴ seconds, which is extremely large, and the capacitor C3 is charged while taking a sufficient time.

  It is also important that the C-MOS buffers Q1 and Q2 are C-MOS buffers. The reason is related to the fact that the potential of the internal power supply C1 is lowered to charge the capacitor C3 having a large capacitance value. As for the C-MOS buffer, even if the power supply voltage is reduced to nearly 1 V, a C-MOS buffer that can operate correctly depending on whether the input voltage is ½ or more of the power supply voltage can be easily obtained. Charges can be transferred more efficiently than in the circuit system.

  Next, calculate how many volts the capacitor C3 is charged. The internal power supply C1 is also an electric double layer capacitor, and its capacitance value is 0.33F. According to the law of conservation of charge, 0.33F × 4.6V = (0.33 + 0.047) F × xV, and x≈4.03V. When the voltage drop of the diode D3 is 0.4V, a voltage of about 3.6V is generated in the capacitor C3.

  Next, 3.6V of the capacitor C3 is 0.6V (because the resistor R5 is biased with 0.4V, 0.6 + 0.4 = 1V is L of the C-MOS inverter Q3 that operates with the 2V power supply voltage. , H inversion level) is calculated. The time required for the voltage to decrease to 0.6 V is the storage time of the capacitor C3 as a storage element.

The sum of the input current of the C-MOS inverter Q3 and the leakage current of the diode D3 is about 0.1 μA, and expressed as a resistance when 3.6 V is applied to the capacitor C3, 3.6 V / 0.1 μA = 36 MΩ, and The time constant with 047F is 36 MΩ × 0.047 F≈1.7 × 10 ⁶ seconds = (1.7 × 10 ⁶ ) / (3.6 × 10 ³ ) time = 4.7 × 10 ² hours, 48 hours The above calculation is an example in which the internal power supply C1 is 4.6V, but after the external power supply is cut off, the internal power supply C1 also leaks from the diode D1, and the current consumption of the C-MOS buffers Q1 and Q2 Gradually voltage drop. In the case of the component shown in FIG. 1, the internal power source C1 holds 2V or more after 100 hours. Now, assuming that the voltage is 2V, the voltage drop of the diode D3 is calculated from 0.33F × 2V = (0.33 + 0.047) F × xV, and x = 1.75V. Subtracting 0.4V produces a voltage of 1.35V.

The time for 1.35V to drop to 0.6V is 0.1 μA since the sum of the input current of the C-MOS inverter Q3 and the leakage current of the diode D3 is reduced from 3.6V to 1.35V. Although it is as follows, even if there is a large 0.1 μA, 1.35 × 0.6 = 0.81 V after 2.35 × 10 ² hours, which is half the time constant of 4.7 × 10 ² hours Still remains above 0.6V and still stores H.

Note that the effect of greatly extending the storage time is that the power supply voltage of the C-MOS inverter Q3 is made lower than the external power supply (5V) and the potential charged in the capacitor C3 is effectively used by applying a bias voltage. It depends heavily on being.
[Circuit configuration example 2]

FIG. 2 shows an example in which the arrangement of the detection elements SE is different from that in the example of FIG. 1 and Q1 is a C-MOS inverter. This is the same as the case of 1. Further, the resistor R3 is omitted and the external power supply 5V is applied to the C-MOS inverter Q3, but the bias voltage is as high as 1.5V. The circuit configuration of FIG. 2 has an effect of reducing the number of parts. Q1 is the C-MOS buffer in FIG. 1, and the C-MOS inverter in FIG. 2 achieves the same function. Therefore, it can be said that the element of the invention is a C-MOS gate which is a general concept of the buffer and the inverter.
[Circuit Configuration Example 3]

  FIG. 3 shows that the resistor R1, the power switch P-SW, the C-MOS buffer Q1, the resistor R6, and the resistor R7 of FIG. 1 (circuit configuration example 1) are eliminated, and the resistor R8, the capacitor C5, and the sensor switch S- SW is added, and the detection element SE is an example in which the detection element SE is opened when the casing is closed and closed when the casing is opened. Note that components having the same functions as those in FIG. 1 (Circuit Configuration Example 1) are denoted by the same reference numerals, and thus description of the overlapping parts is omitted.

  In the circuit configuration of FIG. 3, an internal power supply C1 (electric double layer capacitor or secondary battery) is charged from an external power supply (5 V) via a diode D1. The positive terminal of the internal power supply C1 is connected to the power supply terminal VDD of Q2 and the resistor R8. One end of the capacitor C5 and one contact point SE1 of the detection element SE are connected from the other end of the resistor R8. From the other contact SE2 of the detection element SE, one end of the capacitor C2 and the input terminal IN of Q2 are connected via one terminal S-SW1 of the sensor switch S-SW and the diode D2. The other end of the capacitor C5, the other terminal S-SW2 of the sensor switch S-SW, the other end of the capacitor C2, and the power supply terminal VSS of Q2 are connected to the negative pole of the internal power supply C1. D3, C3, R3, R4, R5, Q3, TR, R2, and the green LED are the same as in FIG.

Since the internal power supply C1 does not have the power switch P-SW shown in FIG. 1, it is charged when an external power supply is applied. In the example of FIG. 1, it has been explained that charging is not performed during the quality test of the control board to which the sealing device 10 is attached. However, this example is also charged during the test.
A secondary battery of a type that is charged in the initial state and does not need to be charged again, such as a lithium secondary battery, may be used.

  Capacitor C5 is charged via resistor R8. Since the resistor R8 has a large internal resistance of the internal power supply C1, a voltage drop occurs when a large current for charging the electric double layer capacitor C3 flows when the detection element SE is turned on, and the input voltage to Q2 is sufficiently increased. In addition to preventing the problem of disappearance, the contact SE1 of the detection element SE that cannot be completely protected by a resin mold or the like is short-circuited to the ground to prevent an illegal act of trying to empty the internal power supply C1.

The terminals S-SW1 and S-SW2 of the sensor switch S-SW are sheeted with the sensor switch wire S-SW-Wire until the sealing device 10 is set in the housing.
The detection element SE naturally detects “closed” until the sealing device 10 is set in the casing and the casing is closed, and the contact points SE1 and SE2 are closed. That is, when the sealing device 10 is attached to another device, for example, a control board and energized for quality inspection of the control board, an attempt is made to give H to the input of Q2. However, since the sensor switch S-SW is grounded as described above, the input of Q2 is naturally L and the detection element SE is insensitive.

  When the quality inspection of the control board is completed and the sealing device 10 is set in the casing together, the sensor switch wire S-SW-Wire of the sensor switch S-SW is pulled out of the casing through a hole or a gap in the casing. Then, after sealing the casing, the sensor switch wire S-SW-Wire is pulled to open the terminals S-SW1 and S-SW2, and the operation of the detection element SE is made effective.

  The role of the capacitor C2 is the same as that of FIG. 1, and even if an unauthorized person attempts to invalidate the detection element SE after opening the casing, the charge of the charged capacitor C2 keeps turning on Q2 for a long time. There is.

The diode D2 prevents an illegal act of discharging the charge of the capacitor C2 by connecting the contact SE2 of the detection element SE and the terminal S-SW1 of the sensor switch S-SW to the ground.
The application of the sensor switch S-SW is not limited to the example of FIG. 3, and can be applied to the example of FIG. 1 and the example of FIG. This can be stated as a generalized expression as follows. That is, the condition for detecting the opening of the housing and setting the sealing device to be stored is that the housing is open at the time of setting, so at least one of whether the power supply is empty or the detection element is insensitive. It is necessary that both the power supply and the detection element be in an operating state after the housing is closed.

  Use of the sensor switch S-SW has an advantage that the sensor switch wire S-SW-Wire is pulled out of the casing and torn off, but the operation state is started immediately after the sealing device 10 is set. .

  Whether the internal power source C1 is an electric double layer capacitor or a secondary battery such as lithium, there is a problem that sufficient characteristics cannot be obtained unless it is gradually charged over several hours to fully charge it from an empty state. So the above merits are important.

The C-MOS inverter Q3 operates the one-stage transistor TR in FIGS. 1, 2, and 3, but may be a buffer if driven through the two-stage transistor. It can be said that it is a high-level gate.
[Structure example of sealing device]

A sealing device 10 shown in FIG. 4 is configured by mounting the circuit components shown in FIG. 1, FIG. 2, or FIG. 3 on a printed board.

  Terminals CN-1 to CN-4 and SE1 and SE2 are the same function terminals as shown in the circuit diagram. The power switch P-SW in FIGS. 1 and 2 and the sensor switch S-SW in FIG. Is shown.

  The terminals P-SW1 and P-SW2 of the P-SW are made as copper foil having a diameter of about 0.5 mm on the printed board. The power switch wire P-SW-Wire having a diameter of about 0.5 mm, which is partially covered with a coated copper wire, is soldered to the P-SW to be short-circuited. It is shown.

  To bring the sealing device 10 into an operating state, the power switch wire P-SW-Wire is pulled strongly, the terminals P-SW1 and P-SW2 are disconnected, and then an external power supply (5V) is applied to the internal power supply. C1 is charged and used.

  The sensor switch S-SW shown in FIG. 4 is made in the same configuration, but the length of the sensor switch wire S-SW-Wire is long enough to be pulled out of the casing. different.

  In order to put the sealing device 10 into an operating state, after closing the casing, the sensor switch wire S-SW-Wire that is exposed to the outside from the outlet such as a hole or a gap in the casing is pulled strongly, and the terminal S-SW1, This is achieved by disconnecting the electrical short between S-SW2.

  In FIG. 4, the green LED is provided in parallel with the terminals CN-3 and CN-4 so that it can be discriminated without providing the green LED outside. However, when the green LED is provided outside as well. A conventional means when using a plurality of LEDs is employed in which a resistor is connected in series to prevent current from concentrating on any one LED and causing light non-uniformity.

Moreover, the area | region above the 1-A line | wire in a figure has shown that it protects from an unauthorized act by potting with resin which is an insulator, and also puts it in a protective case, and may improve tolerance.
[Configuration Example of Detection Element SE]

  The detection element SE shown in FIG. 5 to FIG. 7 is configured by tying a housing 4 (in this example, a board box that accommodates a control board of a gaming machine) composed of a bottom 2 and a lid 3 with an electric wire 5. And has the characteristics of being simple and inexpensive at the same time.

  In FIG. 5, the control board 6 including the sealing device 10 is fixed to the bottom 2 of the casing 4 with screws 7, and the lid 3 is covered, and then fixed with the sealing screw 8 that is a one-way screw. Is shown closed.

The lid 3 is provided with an opening 11 for the connector 12 and is electrically connected to the outside via the connector 12.
Terminals SE1 and SE2 of the detection element SE are provided as pins on the control board 6, and an opening 14 for passing the electric wire 5 is provided in the lid 3 corresponding to the terminals SE1 and SE2. .

  Contacts 13 matching the pins (terminals SE1, SE2) are crimped to both ends of the electric wire 5, and when the contacts 13 passed through the openings 14 are fitted to the pins (terminals SE1, SE2), FIG. As shown in the circuit diagram of FIG. 2), the detection element SE is closed. The length of the electric wire 5 is set so as not to loosen or loosen when the terminals SE1 and SE2 are connected along the outer surface of the lid 3 so that the contact 13 can be removed from the pin. The casing 4 cannot be opened unless it is removed or the electric wire 5 is cut.

  In the example of FIG. 6, there are two electric wires 5, one end of each of which is connected to terminals SE <b> 1 and SE <b> 2, and the other end is crimped with a female / female connector 15 and a male / male connector 16, respectively. The giboshi / female connector 15 and the giboshi / male connector 16 are drawn out of the housing 4 through an outlet 17 provided in the lid 3. As shown in the circuit diagram of FIG. 1 (or FIG. 2), when the housing 4 is closed, the wire / female connector 15 and the wire / male connector 16 are joined together to form a series of two electric wires 5. Thus, the detection element SE is closed.

  Needless to say, in this case as well, the length of the electric wire 5 is too long, and the lid 3 is pulled away from the bottom 2 without releasing the connection between the male / female connector 15 and the male / male connector 16. (That is, opening the housing 4) should not be possible.

However, if the length of the electric wire 5 is too small, it is impossible to cover the lid 3 while the electric wire 5 is passed through the outlet 17.
Therefore, if the guide string 18 having male and female bulges at the ends is used, this operation can be facilitated. In other words, the guide string 18 is coupled to the boss / female connector 15 and the boss / male connector 16, the electric wire 5 is passed through the outlet 17, the cover portion 3 is covered, the guide string 18 is removed, and the boss / female connection is made. The child 15 and the male / male connector 16 are combined. By doing so, the margin of the length of the electric wire 5 can be suppressed to the minimum, and workability is also improved.

  Compared only with the workability for sealing, FIG. 5 is superior, but in FIG. 5, it is necessary to route the wiring for the pins (terminals SE1, SE2) to the positions close to both ends of the control board 6. There are drawbacks. In implementation, it is only necessary to appropriately select after comparing such advantages and disadvantages.

  The configurations of FIGS. 5 and 6 are very simple and excellent as described above, but also have drawbacks. Referring to the circuit diagram of FIG. 1, one of the contacts 13 corresponds to the contact SE1, and one of the connectors 12 on the control board has a ground. Now, if a fraudulent wire 20 having a sufficient length is prepared, the clip at one end is coupled to the ground pin of the control board, and the clip at the other end is coupled to the contact 13 on the terminal SE1 side, the input of Q1 is connected to the ground. This is the same as making the detection element SE insensitive. If the contact 13 on the contact SE2 side of the electric wire 5 is removed from the pin in this state, the lid portion 3 can be opened and fraud is possible.

  However, this drawback is solved by the action of the resistor R7 in FIG. The contacts SE1, SE2 connected to the ground with a high resistance value of 1 MΩ, that is, the input of Q1, has the effect of turning on Q1 due to the induced potential of the human body when touched by the human body, thus preventing the above-mentioned fraud Can do. In the case of FIG. 6 as well, fraud can be prevented.

  As described above, it is possible to change to a circuit that detects the capacitance of the human body instead of the induced potential. Although not limited to these methods, the simple detection element SE shown in FIGS. 5 and 6 can be put into practical use by providing means in the sealing device 10 that can detect that a human body has touched.

  Of course, it is assumed that the fraudster uses wisdom such as working with an insulating tool. For this, a configuration in which an important part is not exposed outside the housing 4 is effective. Next, some configuration examples in which the important part of the detection element SE is not exposed outside the housing 4 will be described.

  First, in the example of FIG. 7, the lid 3 and the bottom 2 are tied together with the electric wire 5 as in FIG. 5, but one end of the electric wire 5 is soldered to a contact SE <b> 1 provided as a copper foil on the control board 6. Then, the other end of the electric wire 5 once drawn through the outlet 17 of the lid 3 is drawn from the second outlet 19 of the lid 3 and soldered to the contact SE2 which is also provided as a copper foil on the control board 6. This is an example. The outlet 19 has a dimension that allows the tip of the soldering iron to be inserted in order to solder the electric wire 5 and the contact SE2. Further, the copper foil serving as the contact SE2 is provided corresponding to the entire area of the outlet 19 (only the copper foil is exposed at the outlet 19).

  In FIG. 1, assuming that the resistance R7 is 0Ω, the contact SE2 is connected to the ground. That is, even if the contact SE2 and the ground pin are connected by the bypass circuit of the fraudulent wire 20 shown in FIG. 5, there is no effect only by connecting the ground and the ground. Further, since the contact SE1 is in the closed casing 4, fraud cannot be performed.

  That is, the example of FIG. 7 is a touch switch for detecting contact with a human body by using only one electric wire 5 (both ends are soldered and no connector is required), being simple and inexpensive, and also capable of preventing fraud due to a bypass circuit. It is a highly practical means that does not require such a circuit.

However, it is preferable that the coating of the electric wire 5 of this example is very strong or, on the contrary, is weak and has a property that a trace is likely to remain for some processing.
The reason is that the electric wire 5 that is exposed to the outside of the housing 4 is not cut, but is sandwiched with a blade so that it passes through the coating and comes into contact with the core wire, and the blade is clamped by the fraudulent electric wire 20 shown in FIG. This is because after joining to the ground, the solder of the illustrated SE2 that has been soldered is removed, the housing 4 is opened, fraud is performed, and the solder of the illustrated SE2 is reattached.

  For this application, it is preferable to use a shielded shielded electric wire as the electric wire 5. Because it is difficult to bring the blade into contact with the core wire so that the core wire protected by the shield is not cut, and a special tool that cuts the shield but not the core wire is conceived and the shield and the core wire are in electrical contact even if used. This is because it is possible to obtain a tampering signal by detecting falling to the ground, and it can be used as a signal of the sealing device. In addition, even if it is a shielded shielded cable, it can be covered with a pipe with a metal that does not work with a knife, or with a coating that leaves traces clearly when the coating itself is broken or glassy, etc. In this way, fraud can be prevented more reliably.

Moreover, the tolerance with respect to unauthorized opening increases by making the connection structure 21 of the cover part 3 and the bottom part 2 into a hinge shape.
By the way, said method using the electric wire 5 has a fault in the point that an assembly operation | work is a little difficult. The following are some examples of detection elements that can be easily assembled.

  FIG. 8 is a diagram for explaining a portion common to each detection element SE described below. Common items shown here are the following (1) to (6). (1) The contacts SE1 and SE2 of the sealing device 10 and the detection element SE are arranged on one side of the lid portion 3 and the bottom portion 2 of the housing 4, in this example, the bottom portion 2 side (fixed directly or indirectly to the bottom portion 2). (2) The other side, that is, the lid portion 3 is provided with a coupling opening (here, the lid portion opening 23). (3) The bonding material 25 including the action part 27 that can enter and exit the case 4 through the lid opening 23 is at least inside the case 4 with the action part 27 in the case 4. The lid portion 3 is attached to the lid portion 3 with the lid portion opening 23 being closed. (4) In a state where the housing 4 is closed, the binding material 25 acts on the contacts SE1 and SE2 to open or close the detection element SE. (5) When the housing 4 is opened, the bonding material 25 is separated from the bottom 2 side integrally with the lid 3, so that the action of the bonding material 25 is released and the detection element SE is closed or opened (housing) 4 is the opposite of when it was closed). (6) When the binding material 25 is removed, the detection element SE changes as in the case of opening the housing 4.

  In order to prevent the binding material 25 from falling off at least inside the housing 4, for example, a locking portion 29 having a diameter larger than that of the lid opening 23 may be provided at the upper end of the binding material 25. By fitting or screwing the binding material 25 into the lid opening 23, the lid opening 23 can be closed and falling off can be prevented. Further, the lower end side (acting part side) of the binding material 25 is separated from the contacts SE1 and SE2 by means of disengagement prevention means such as engaging, fitting or screwing with the contacts SE1 and SE2 side (that is, the sealing device 10 main body side). The withdrawal may be prevented.

  The action part 27 may be a conductor (for example, entering between the contacts SE1 and SE2 to close the detection element SE), or may be an insulator (for example, entering between the contacts SE1 and SE2 to detect the detection element SE). Is also open).

Next, a specific configuration example of the detection element SE will be described.
First, the contacts SE1 and SE2 of the detection element SE shown in FIG. 9 ((a) is a front view and (b) is an AA cross-sectional view) are manufactured by, for example, pressing a spring plate such as phosphor bronze. Yes.

The contacts SE1 and SE2 are mirror images of each other, and as shown in FIG. 9B, the upper part is bent in a “<” shape. The upper end is an opening 31, and a narrow joint portion 32 is formed at the lower crease. The distance between the openings 31 is set larger than the diameter of the action part 27 of the bonding material 25, and the distance between the joint parts 32 is set smaller than the diameter of the action part 27.
Therefore, when the bonding material 25 (action part 27) is pushed from the opening part 31, the inclined surface that follows the opening part 31 is guided as a guide surface, and the action part 27 that has entered between the joint parts 32 is elastic. Hold with repulsive force.

  A flat plate portion 33 is provided below the contacts SE1 and SE2 so as to face each other in parallel with an insulator 35 interposed therebetween, and is thermally welded to the insulator 35 through a mounting hole 34. Further, a terminal portion 36 that extends from the insulator 35 extends from the flat plate portion 33. The contacts SE1 and SE2 are soldered to the pattern of the printed circuit board 6 at the terminal portion 36 (see FIG. 8), and are connected to the terminals SE1 and SE2 (see FIG. 4) to become a part of the sealing device 10. .

A hole penetrating vertically is formed in the central portion of the insulator 35, a female screw 37 is provided in the upper half portion, and a marginal region 38 is provided in the lower half portion.
In the case of this example, a metal headed screw, for example, a 3 mm screw is used as the bonding material 25. The screw head is the locking portion 29 and the screw portion is the action portion 27. When a 3 mm screw is used as the binder 25, the diameter of the head is 5.5 mm, so the lid opening 23 is a hole having a diameter of about 4 mm. The dimension between the joints 32 is about 2.5 mm. In addition, the reason why the diameter of the lid opening 23 is about 4 mm is to cope with the positional deviation between the lid 3 side and the bottom 2 side.

  The female screw 37 of the insulator 35 is aligned with a headed screw (male screw) serving as the bonding material 25, and the bonding material 25 is screwed when the housing 4 is closed. This is for the purpose of causing the detection element SE to act stably even under strong vibration conditions. For applications where there is little vibration (or no vibration), the female screw 37 may be eliminated and only the clamping by the joint portion 32 may be performed.

  Because of the above configuration, when the housing 4 is closed, the contact points SE1 and SE2 that are metal are closed by the action of the binding material 25 that is metal, and the housing 4 is opened and the binding material 25 is opened. Is released from between the contacts SE1 and SE2, the detection element SE is opened.

Next, a detection element SE having a simpler configuration and suitable for downsizing will be described with reference to FIG.
FIG. 10A shows a part of the printed circuit board 6 attached to the bottom 2 side. As shown in this figure, a guide hole 41 penetrating the printed circuit board 6 is provided.

  FIG. 10B is a sectional view of FIG. 10A. As shown in FIG. 10A and FIG. 10A, the copper foil portions constituting the contacts SE1 and SE2 are printed around the guide hole 41, respectively. It is left on the front and back of the substrate 6. No conductive member such as a plating layer is provided on the inner surface of the guide hole 41 (not a through hole), and the contacts SE1 and SE2 are insulated. Although not shown in detail, the contacts SE1 and SE2 are connected to the terminals SE1 and SE2 (see FIG. 4) of the sealing device 10 by the pattern of the printed circuit board 6.

  FIG. 10C is a front view of the binder 25, and FIG. 10D is a plan view thereof. The binding material 25 of this example is made of a material having flexibility and conductivity, such as conductive rubber. A flange-shaped locking portion 29 is provided at one end of the binding material 25, and a tapered guide portion 45 is provided at the other end. The intermediate portion is a main body portion 42 having a diameter smaller than that of the guide hole 41. On the outer periphery of the main body portion 42, a plurality of rib portions 43 (four in this example) projecting in the radial direction and extending in the axial direction are provided. ing. The diameter of the virtual circle connecting the tops of the ribs 43 is set larger than that of the guide holes 41. Further, a retaining portion 44 is formed to project from a lower end portion of the rib portion 43 (there is a single portion but may be a plurality of rib portions 43).

  When the housing 4 is closed and the binder 25 is pushed in from the lid opening 23, the action portion 27 (rib portion 43) enters the guide hole 41 while being elastically deformed. When the rib part 43 penetrates the guide hole 41, the rib part 43 elastically deformed in the contracting direction by the guide hole 41 comes into close contact with the contacts SE1 and SE2 by its elastic repulsive force, so that the contacts SE1 and SE2 are electrically connected ( The detection element SE is closed). At this time, the rib portion 43a bulging outwards above and below the guide hole 41 (opening portion) also reinforces the conduction.

  Thereafter, when the housing 4 is opened, the binding material 25 is pulled away from the bottom portion 2 together with the lid portion 3 by the locking portion 29, so that the rib portion 43 comes out of the guide hole 41. That is, the conduction between the contacts SE1 and SE2 by the rib portion 43 is released, and the detection element SE is opened.

  Since the copper foil of the printed circuit board 6 is usually 35 μm and thin, it can be thickened by plating, for example, about 70 μm, or can be made thicker by joining other metal plates in order to stabilize the contact.

  Also, since the copper foil is prone to rust, the front and back surfaces of the printed circuit board 6 are subjected to solder leveler (solder plating) processing, and particularly the edge of the copper foil on the inner surface side of the guide hole 41 is protected by plating. Is desirable.

  The bonding material 25 is not an integral conductive rubber. For example, a ring made of conductive rubber may be fitted on a resin member, or the surface of the resin bonding material 25 that is easily deformed by providing a slit is plastic plated. Thus, conductivity may be imparted.

  The retaining of the binding material 25 is constituted by the repulsive force resulting from the elastic deformation of the rib portion 43 with the wall surface of the guide hole 41, and its frictional force. By locking this to the edge portion of the guide hole 41, it is better to prevent the removal more reliably. The retaining portion 44 is not essential.

Next, another example of the detection element SE will be described with reference to FIG.
FIG. 11A is a plan view showing a part of the printed circuit board 6 attached to the bottom 2 side, and FIG. 11B is a sectional view thereof. As shown in these figures, a through hole is provided as a guide hole 51 in the printed circuit board 6. A pair of contact mounting holes 52 are provided at positions facing each other with the guide hole 51 interposed therebetween, and contacts SE1 and SE2 made of conductive rubber are respectively attached to the contact mounting holes 52.
On the printed board 6, a copper foil portion 53 is provided so as to be in contact with the respective contacts SE 1 and SE 2 and to be connected to the terminals SE 1 and SE 2 (see FIG. 4) of the sealing device 10.

  As shown in FIG. 11B, the contacts SE <b> 1 and SE <b> 2 have the same shape and include an overhang portion 55, a column portion 56, and a lock portion 57. The overhanging portion 55 has a disk shape that exceeds the diameter of the contact mounting hole 52. The diameter of the cylindrical portion 56 is slightly larger than the diameter of the contact mounting hole 52, and the length is slightly shorter than the thickness of the printed board 6. The diameter of the tip of the lock portion 57 is smaller than the diameter of the contact mounting hole 52, and the diameter on the cylindrical portion 56 side is larger than the diameter of the contact mounting hole 52.

  Both contacts SE1, SE2 are attached by being pushed into the contact attachment hole 52 from the lock portion 57 side. Since the length of the cylindrical portion 56 is slightly shorter than the thickness of the printed board 6, a tensile stress is applied to the cylindrical portion 56, and the overhang 55 is applied to the copper foil portion 53 on the printed board 6 by the force. The lock portion 57 is brought into close contact with the back surface of the printed circuit board 6 to ensure stable and reliable electrical contact between the overhang portion 55 and the copper foil portion 53. Further, the overhang portion 55 projects over the guide hole 51.

11C is a front view, and FIG. 11D is a bottom view. The binding material 25 is a conductive material such as metal or plastic-plated resin.
The head of the binding material 25 is a locking portion 29 having a diameter larger than that of the lid opening 23, and a groove 58 for inserting a tool such as a flathead screwdriver is provided on the upper surface thereof.

  A male screw portion 59 is provided below the locking portion 29. The male screw portion 59 can be screwed with a female screw (not shown) provided in the lid portion opening 23, and the binding material 25 is attached to the lid portion 3 by the screwing. The groove 58 is used for this screwing operation.

A cylindrical action portion 27 is connected to the lower side of the male screw portion 59, and a lower end is a tapered guide portion 61.
The diameter of the action portion 27 is smaller than that of the guide hole 51, but is larger than the distance between the overhang portions 55 that overhang the guide hole 51. For this reason, as shown in FIG. 11A, when the action part 27 is inserted through the guide hole 51, both the projecting parts 55, that is, the contacts SE1 and SE2 are electrically connected to each other. Let

  The operation of the detection element SE by the contacts SE1 and SE2 and the bonding material 25 configured as described above is the same as that of the detection element SE described with reference to FIG. This detection element SE has an advantage of being resistant to vibration because the binding material 25 is attached to the lid portion 3 by screwing the male screw portion 59 into the female screw of the lid portion opening 23. On the other hand, there is a surface that requires a technique for managing the concentricity (accuracy of the positions of the lid portion 3 and the bottom portion 2) of the binding material 25 and the guide hole 51.

Next, another example of the detection element SE will be described with reference to FIG.
FIG. 12A is a plan view showing a part of the printed circuit board 6 attached to the bottom 2 side, and FIG. 12B is a sectional view thereof.

As shown in these figures, a through hole is provided as a guide hole 62 in the printed circuit board 6.
On the guide hole 62, spring phosphor bronze wire contacts SE <b> 1 and SE <b> 2 are arranged in parallel to the diameter of the guide hole 62, but greatly deviating from the diameter. The contacts SE1 and SE2 maintain a slight gap on the guide hole 62 and are not in contact with each other. Further, the contacts SE1 and SE2 are soldered to the copper foil portion 63 on the printed board 6 at the end portions of the contacts SE1 and SE2 at a location away from the guide hole 62. The copper foil portion 63 is connected to terminals SE1 and SE2 (see FIG. 4) of the sealing device 10.

  The contact points SE1 and SE2 are the contact point SE1 + the contact point SE2 + one wire having the above gap length, and both ends of the wire rod are soldered to the copper foil part 63, and then the gap portion is cut by a press or the like. Has been. Manufacturing in this way is advantageous in that workability is good and the size of the gap can be made uniform.

The binding material 25 whose front view is shown in FIG. 12C and whose bottom view is shown in FIG. 12D is a conductive material such as metal or plastic-plated resin.
The head of the binding material 25 is a locking portion 29 having a larger diameter than the lid opening 23.

  Below the locking portion 29, there is a trough portion 64 having a diameter larger than the distance L (longer along the diameter of the guide hole 62) from the gap side end of the contacts SE1, SE2 to the inner surface of the guide hole 62; A working portion 27 is provided in which ridges 65 having a larger diameter but smaller than the diameter of the guide hole 62 are alternately formed. The lower end portion is a tapered guiding portion 66.

  In this detection element SE, when the coupling member 25 is pushed through the lid opening 23 of the closed housing 4, the leading end enters the guide hole 62 by the action of the guiding portion 66. When further pushed in, the action part 27 enters the guide hole 62 while pushing the contact points SE1, SE2 of the spring material. The binding material 25 enters to the position where the locking portion 29 hits the lid portion 3. The position of the binding material 25 is determined at this position or a position where the elastic force of the spring material (contacts SE1, SE2) acts slightly on the tapered portion formed by the peak portion 65 and the valley portion 64, and is slightly pushed back. Do not fall off.

  In the state where the bonding material 25 is inserted as described above, the contacts SE1 and SE2 are electrically closed by the bonding material 25. On the other hand, if the lid part 3 is opened, it will be hit by the latching part 29, so that the binding material 25 also adheres to the lid part 3 and moves and separates from between the contacts SE1 and SE2, so that there is a gap between the contacts SE1 and SE2. Revive and become electrically open.

Each of the detection elements SE described above is in a form that opens when the casing 4 is closed and is opened when the casing 4 is closed. Next, a detection element SE that operates in reverse will be described.
The example shown in FIG. 13 is an example in which the opening / closing operation of the detection element SE shown in FIG. 9 is reversed. Since the main configuration is the same as that of FIG. The difference from FIG. 9 is that the portions that become the contact points SE1 and SE2 are extended to a position that is out of the moving area of the bonding material 25, and when the bonding material 25 is not acting, they are brought into contact with each other by their own bending force. Thus, it is electrically closed.

Further, the bonding material 25 of this example is made of an insulating material, and for example, polyacetal screws are used. Except for the fact that the material is insulative, the shape and the like are the same as the binding material 25 of FIG.
With such a configuration, when the casing 4 is closed and the bonding material 25 is inserted through the lid opening 23, the bonding material 25 is received by the opening 31 and reaches the female screw portion 37 while expanding between the joint portions 32. Further, the binding material 25 is screwed in until the locking portion 29 hits the lid portion 3. Since the dimension between the joint parts 32 is made smaller than the diameter of the screw which is the binder 25, the part between the joint parts 32 is expanded and the contacts SE1 and SE2 are also opened by the action. That is, the detection element SE is opened.

If the screw which is the bonding material 25 is removed to open the housing 4, the joint 32 is elastically restored, so that the contacts SE1 and SE2 are also closed, that is, the detection element SE is returned to the closed state.
The next example will be described with reference to FIGS.

FIG. 14A is a partial plan view of the printed circuit board 6 attached to the bottom 2 side, and FIG. 14B is a side view thereof.
A guide hole 71 is provided through the printed circuit board 6. Further, two contact bars serving as contacts SE1 and SE2 are fixed to the printed circuit board 6. These are soldered to copper foils 70 connected to terminals SE1 and SE2 (see FIG. 4) of the sealing device 10, respectively.

  A spring support shaft 72 is fixed to the printed circuit board 6 by soldering between the contact rods SE1 and SE2. A torsion spring 73 is loosely fitted on the spring support shaft 72, and a retaining ring 74 (E type, C type, etc.) is fitted to prevent the spring from falling off.

  The torsion spring 73 is elastically deformed, and its repulsive force presses one end against the contact bar SE1 and the other end against the contact bar SE2. Further, a working portion receiver 75 is formed by bending a spring at the intermediate portion on the contact rod SE2 side.

The structure of the binder 25 is as shown in FIGS. 15 (a) and 15 (b). In this example, the material of the binder 25 may be either conductive or insulating.
A locking portion 29 having a diameter larger than that of the lid opening 23 is provided at the head of the binding material 25, and a cylindrical body 76 that is slightly smaller than the diameter of the guide hole 71 is continuously provided below the locking portion 29. The front end of the body portion 76 is a tapered guide portion 77. A plate-like action portion 27 extends from the side surface of the body portion 76 in the radial direction of the body portion 76, and a drop-off prevention groove 78 is provided on the front end surface thereof.

  Further, as shown in FIG. 15 (c), the lid portion opening 23 is formed by an arc portion 23 a having a diameter slightly larger than the diameter of the body portion 76 of the binding material 25 and a long hole 23 b having a size allowing the action portion 27 to pass therethrough. It is configured.

  When the bonding material 25 is inserted through the lid portion opening 23 of the closed casing 4, the guide portion 71 enters the guide hole 71 of the printed circuit board 6 by the action of the guide portion 77. When the binder 25 is further inserted, the action portion 27 hits the printed circuit board 6 and cannot enter further. Assuming that the position of the action portion 27 is the position A shown in FIG. 14A, when the binding material 25 is rotated counterclockwise, the action portion 27 is accommodated in the action portion receiver 75 of the torsion spring 73 at the position B. The protrusion length of the action part 27 is made to be a dimension for rotating the torsion spring 73 in the clockwise direction at this time. Therefore, the rotation of the binding member 25 pulls the torsion spring 73 away from the contact bar SE2. For this reason, the contact between the torsion spring 73 and the contact SE2 is released, and the detection element SE is electrically opened.

  Further, if the lid 3 is lifted to open the housing 4, the binding member 25 moves upward together with the lid 3 while keeping the action portion 27 at the position B, so that the action portion 27 is received by the action portion receiving portion. Deviate from 75. As a result, the torsion spring 73 recovers the contact with the contact bar SE2 by the elastic force, and the detection element SE is electrically closed.

  In addition, since the dropping of the bonding material 25 uses the force of the torsion spring 73, in order to prevent the dropping, the bonding material 25 is made of a light resin, made lighter with a hollow shape, or shown in the drawing. A prevention groove 78 may be provided. The dropout prevention groove 78 is not essential.

The next example will be described with reference to FIGS.
16A is a partial plan view of the printed circuit board 6 attached to the bottom 2 side, and FIG. 16B is a cross-sectional view taken along the line AA.

A guide hole 81 is provided through the printed circuit board 6.
On the back surface of the printed circuit board 6, a contact SE <b> 1 composed of a copper foil and a leaf spring 82 is provided. Specifically, one end portion of the leaf spring 82 is disposed on the copper foil that becomes the contact SE <b> 1, and is caulked by a flange 83 that penetrates the end portion and the printed board 6.

  The other end (free end) of the leaf spring 82 passes through the guide hole 81 and reaches the contact point SE2 of the copper foil. The leaf spring 82 is subjected to basic elastic deformation, and the repulsive force brings the free end convex portion 84 into pressure contact with the contact SE2. The contacts SE1 and SE2 are connected to terminals SE1 and SE2 (see FIG. 4) of the sealing device 10, respectively.

The structure of the binder 25 is as shown in FIGS. 17 (a) and 17 (b). In this example, the material of the binder 25 may be either conductive or insulating.
The head portion 88 of the binding material 25 corresponds to the locking portion 29 in each of the above examples. In this example, a male screw portion 87 is provided on the outer peripheral portion of the head portion 88, and the upper surface of a minus driver is provided on the upper surface. A groove 85 for inserting such a tool is provided. The male screw portion 87 can be screwed into a female screw 86 (see FIG. 17C) provided in the lid portion opening 23.

A columnar cylindrical portion 89 is continuously provided on the head 88, and an action portion 90 that is a column having a smaller diameter than the columnar portion 89 extends from a lower end 89 a of the cylindrical portion 89.
In relation to the guide hole 81, the cylindrical portion 89 has a larger diameter than the guide hole 81, and the action portion 90 has a smaller diameter than the guide hole 81. Therefore, the action part 90 can enter the guide hole 81 but the cylindrical part 89 cannot enter. The length L of the action part 90 is longer than the thickness of the printed circuit board 6.

  In the case of this example, after closing the housing | casing 4, the coupling | bonding material 25 is inserted in the cover part opening 23, for example, a driver is inserted in the groove | channel 85 and is rotated. Then, the coupling member 25 moves forward (lowers) by screwing the male screw portion 87 and the female screw 86, so that the action portion 90 enters the guide hole 81. When further rotated, the tip 90a of the action part 90 comes into contact with the leaf spring 82, and the leaf spring 82 is bent with the lowering of the bonding material 25, and the convex portion 84 is detached from the contact SE2.

The lowering of the binding material 25 is prevented when the lower end 89 a of the cylindrical portion 89 contacts the printed circuit board 6.
The length L of the action portion 90 is set to a length sufficient to cause the convex portion 84 of the leaf spring 82 to be separated from the contact SE2 when the lower end 89a of the cylindrical portion 89 contacts the printed circuit board 6. In addition, even if the relative position of the action portion 90 and the leaf spring 82 is shifted to the free end side (indicated by symbol D) as shown in FIG. 16B, the convex portion 84 is separated from the contact SE2. And a length that does not exceed the elastic limit of the leaf spring 82 even if it is shifted to the side of the collar 83 (indicated by the symbol E).

  This detection element SE is characterized by being strong against vibration and having a large dimensional tolerance with respect to the positional deviation between the lid 3 side and the bottom 2 side. The reason for being strong against vibration is that the bonding material 25 is screwed to the lid portion 3 and the force of the leaf spring 82 is not required for fixing the bonding material 25. About the dimension tolerance, it is because the diameter of the guide hole 81 and the action part 90 can be taken large.

  However, the configuration employed in this example in which the binding material 25 is screwed to the lid 3 has the following weak points. In other words, it is assumed that the fraudster repeatedly screwed the binding material 25 every time the lid 3 is lifted by a very small amount when opening the housing 4. As a result, the bonding material 25 enters the housing 4 and leaves the lid portion 3. However, this problem can be solved if the design is such that the force of the leaf spring 82 exceeds the weight of the bonding material 25 and the contacts SE1 and SE2 are closed.

In addition, what is necessary is just to employ | adopt the structure which is illustrated in FIG. 18, in order to raise the tolerance with respect to the act to screw in and to increase reliability.
As shown in FIG. 18, a recess 91 is provided in the lid 3, and a lid opening 23 (with a female thread) is provided at the bottom thereof. On the other hand, the binding member 25 is provided with a head portion 92 (corresponding to the locking portion 29 in each of the above examples) having a diameter that fits into the recess 91 and larger than the lid portion opening 23, and a groove 85 is provided on the upper surface thereof. Then, a male screw portion 87 that can be screwed into the female screw of the lid portion opening 23 is provided below the head portion 92, and a cylindrical portion 89 and an action portion 90 similar to the above example are provided below the male screw portion 87.

According to this configuration, even if the binding material 25 is screwed in as much as possible, the head 92 is not in contact with the bottom of the recess 91, and the binding material 25 is not detached from the lid 3 even if screwed.
The embodiments of the present invention have been described above with the circuit configuration examples 1 to 3, the sealing device structure example, and the detection element SE configuration example. In carrying out the present invention, a suitable combination may be selected from these examples according to the application of the sealing device, the usage environment, and the like. In addition, configurations other than those exemplified (within the scope of the present invention) may be employed.

  In each of the above examples, particularly in the configuration example of the detection element, the casing is configured by two parts, the lid part and the bottom part. Since that part is opened (opened), it is natural to think of attaching a binder to that part. It goes without saying that the present invention can be applied even if the lid and the bottom are reversed.

The circuit diagram of the circuit structural example 1 of a sealing apparatus. The circuit diagram of the circuit structural example 2 of a sealing device. The circuit diagram of the circuit structural example 3 of a sealing apparatus. Explanatory drawing of the structural example of a sealing apparatus. Explanatory drawing of the structural example of the detection element which uses an electric wire. Explanatory drawing of the structural example of the detection element which uses an electric wire. Explanatory drawing of the structural example of the detection element which uses an electric wire. Explanatory drawing of the common part of the example of a detection element using a binding material. Explanatory drawing of the structural example of the detection element which is closed by insertion of a binding material. Explanatory drawing of the detection element which comprises a binding material with conductive rubber. Explanatory drawing of the detection element which comprises contact SE1, SE2 with conductive rubber. Explanatory drawing of the detection element which comprises contact SE1, SE2 with a wire. Explanatory drawing of the detection element which is closed by the detachment | leave of a binding material. Explanatory drawing of the detection element which uses a traction spring for contact SE1. Explanatory drawing of the binding material used for FIG. Explanatory drawing of the detection element which uses a leaf | plate spring for contact SE1. Explanatory drawing of the binder used for FIG. Explanatory drawing of the other example of the binding material used for FIG.

Explanation of symbols

2 ... bottom,
3 ... lid,
4 ... Case,
5 ... Electric wire,
6 ... Printed circuit board (control board),
10 ... Sealing device,
17, 19 ... Drawer exit,
23 .. lid opening,
25... Binding material,
27 ... action part,
29 ... locking part,
C1 ... Internal power supply
C3: Electric double layer capacitor,
P-SW ... Power switch,
Q1... C-MOS buffer (C-MOS gate),
Q2 ... C-MOS buffer,
Q3 ... C-MOS inverter (C-MOS gate),
R1 to R8... Resistance
S-SW: Sensor switch,
SE: detecting element,
SE1, SE2... Contact (detection contact).

Claims (4)

A detection element of a sealing device attached to a case to be closed to detect opening of the case,
Consists of a conductive material binding material provided on one side of the lid and bottom of the housing and first and second detection contacts provided on the other side,
When the casing is closed, the binding material closes between the detection contacts, and when the casing is opened, the action of the binding material disappears and the detection contacts are opened. detection element sealing device according to claim <br/> Being. A detection element of a sealing device attached to a case to be closed to detect opening of the case,
Consists of a binding material provided on one side of the lid and bottom of the housing and first and second detection contacts provided on the other side,
When the casing is closed, the binding material prevents conduction between the detection contacts and opens between the contacts, and when the casing is opened, the blocking of conduction by the binding material is released. The detection element of the sealing device, wherein the detection contacts are configured to be closed . A sealing device attached to a case to be closed to detect opening of the case,
The potential changes between an internal power source charged by an external power source, a detection element (SE) whose contact is opened when the housing is opened, and a detection element (SE) that is closed and open. A first C-MOS gate (Q1) that receives a signal, and a C-MOS buffer (Q2) that receives a signal obtained by integrating the output of the first C-MOS gate (Q1) with a diode (D2) and a capacitor (C2) )When,
An electric double layer capacitor (C3) charged by the output of the C-MOS buffer (Q2) input via the diode (D3),
By supplying power from the internal power source to the first C-MOS gate (Q1) and the C-MOS buffer (Q2), the case is opened even when the external power source is shut off. In a memorable sealing device,
A second C-MOS gate (Q3) that operates with a power source derived from the external power source and determines the potential of the electric double layer capacitor (C3) to change the output level;
Means for operating the second C-MOS gate (Q3) with a power source obtained by dividing and reducing the voltage of the external power source, or a bias voltage obtained by dividing and reducing the voltage of the external power source. Means for adding to the potential of (C3),
The presence or absence of opening is notified according to the output level of the second C-MOS gate (Q3).
A sealing device characterized by that. A sealing device attached to a case to be closed to detect opening of the case,
An internal power source that is charged by an external power source, a detection element (SE) that detects opening of the casing, and that the detection element (SE) that is operated by the internal power supply detects opening of the casing are stored. In a sealing device having a storage element,
A sensor switch having a string-like sensor switch wire that changes from a state of invalidating the signal of the detection element (SE) to a state of validating the signal of the detection element (SE) when the sensor switch wire is pulled With
One end of the sensor switch wire is brought out of the casing through an outlet such as a hole or a gap provided in the casing and attached to the inside of the casing, and the sensor is closed after the casing is closed. A sealing device, wherein a switch wire is pulled and the sensor switch is switched to a state in which a signal of the detection element (SE) is validated .

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