JP3684933B2 - Plastic power supply parts - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a resin-made power supply component having a molded substrate formed of a resin material having electrical insulation and having an energization circuit formed on the molded substrate.
[0002]
[Prior art]
In conventional power supply parts, a synthetic resin molding material having electrical insulation is formed into a desired shape to form a substrate, and then a metallic lead frame or lead wire represented by copper (Cu) or the like is used for mechanical equipment or An energization circuit is formed by a wet method such as manual insertion or fixing at a predetermined position of the substrate or plating. FIG. 5 shows an example of the power feeding component. FIG. 5A is a schematic view of a power feeding component, and FIG. 5B is a cross-sectional view showing an internal structure thereof. 50 is an energizing circuit, 51 is a positioning pin, 52 is a positioning rib, and 53 is a fluorescent tube gripping portion. is there.
[0003]
[Problems to be solved by the invention]
However, the method of forming the energization circuit on the substrate by the above-described method has a problem that the cost for manufacturing the power feeding component increases because a number of manufacturing steps are required.
[0004]
In recent years, power supply parts have also been downsized in parallel with downsizing of electric / electronic parts. For this reason, when a plurality of lead frames and lead wires are arranged as energization circuits on one substrate, the energization circuits may come into contact with each other and short-circuit. In order to prevent this, the lead frame and the lead wire are each bent and arranged in a complicated shape, or ribs 52 and bosses (not shown) are provided between the energization circuits 50 of the substrate 60 as shown in FIG. There was a need.
[0005]
By using the above-mentioned method, it is possible to prevent short-circuit accidents that occur when multiple lead frames and lead wires arranged on the substrate come into contact with each other. However, complicated bending of the lead frame and lead wires is a cost for manufacturing power supply components. To further improve. Further, when ribs, bosses, and the like are formed on the molded substrate, there are problems in that the mold manufacturing cost increases due to an increase in the mold processing time, and appearance defects such as sink marks and warpage occur on the molded substrate.
[0006]
Further, many power supply components are highly competitive in cost reduction, and polypropylene (PP) resin, which is relatively inexpensive in material cost, is often used as a synthetic resin molding material constituting the molding substrate. On the other hand, since many of the energization circuits have high workability and are inexpensive, Cu (copper) lead frames and lead wires are often used. However, the PP resin is oxidized by contact with copper for a long time to prevent deterioration phenomenon such as discoloration and cracking, mechanical strength decrease and electrical insulation decrease. It is necessary to add an aromatic amine-based naphthylamine or the like called in advance to form a substrate.
[0007]
However, there has been a problem in that the material cost of the PP resin constituting the substrate is increased by adding such a copper damage prevention agent, and the manufacturing cost of the power feeding component is further increased.
[0008]
Accordingly, an object of the present invention is to form a current-carrying circuit without using a lead frame or a lead wire, to reduce the manufacturing process, the number of parts, and the manufacturing cost of power-feeding parts, and to make the current-carrying circuit highly flexible in shape. It is to provide power supply components.
[0009]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, in the resin power supply component according to claim 1 of the present invention, an energization circuit is formed on a molded substrate made of a synthetic resin having electrical insulation, and this energization circuit is formed of a thermoplastic resin, a metal Formed by a resin composition having electrical conductivity composed of powder, metal fiber, or low-melting-point metal, and provided with a connecting component that is elastically deformed and connected to the external component at a location where the external circuit is connected to the external component The component for positioning the connecting component is formed integrally with the energizing circuit with the same resin composition as the energizing circuit .
[0010]
In this way, an energization circuit is formed on a molded substrate made of a synthetic resin having electrical insulation, and this energization circuit is an electrically conductive resin composed of thermoplastic resin, metal powder or metal fiber, and a low melting point metal. Since it is formed of the composition, it is not necessary to position the energizing circuit with other structures such as ribs and bosses. For this reason, it is possible to suppress an increase in mold manufacturing cost that occurs when ribs, bosses, and the like are formed on the molded substrate, and to solve problems of appearance defects such as sinks and warpage. In addition, since the energization circuit can be formed from the resin composition without using a lead frame, a lead wire or the like, the number of parts can be reduced and the degree of freedom of the energization circuit shape can be increased.
In addition, a connection component that elastically deforms and connects to the external component is provided at a location where the external circuit of the energization circuit is connected, and the component for positioning the connection component is formed integrally with the energization circuit using the same resin composition as the energization circuit. Therefore, it can be used for a long time without being damaged even if the external component is repeatedly connected to and removed from the power supply component. Moreover, since the positioning member of the wiring component is formed of a resin composition that is the same electrical good conductor as the energization circuit, the energization circuit and the wiring component can be reliably brought into contact with each other.
[0012]
According to a second aspect of the present invention, in the resin power supply component of the first aspect, the molded substrate is made of a polypropylene resin that does not contain a copper damage inhibitor. Since copper products such as lead frames and lead wires are not used, the molded substrate can be made of a polypropylene resin that does not contain a copper damage inhibitor as described above. For this reason, it is possible to manufacture a power supply component having excellent long-term reliability without deterioration of the substrate due to copper damage. Moreover, the copper damage prevention agent added to the polypropylene resin which comprises a board | substrate becomes unnecessary, and material cost can be reduced. Polypropylene resin has the advantages of excellent productivity and relatively low material costs.
[0013]
According to a third aspect of the present invention, in the resin power supply component according to the first aspect, the thermoplastic resin is made of the same material as that of the molded substrate. Thus, since the thermoplastic resin is made of the same material as that of the molded substrate, higher adhesion between the substrate and the energization circuit can be obtained.
[0014]
According to a fourth aspect of the present invention, in the resin power supply component of the second aspect , the thermoplastic resin is a polypropylene resin. Thus, since the thermoplastic resin is the same polypropylene resin as the molded substrate of claim 2 , high adhesion between the substrate and the energization circuit can be obtained by the same material.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
A resin power supply component according to an embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a schematic plan view of a resin power supply component according to an embodiment of the present invention, FIGS. 2 (a) and 2 (b) are perspective views of wiring components, and FIG. 3 is a diagram of an energization circuit according to an embodiment of the present invention. Sectional drawing and FIG. 4 are sectional drawings of another example of the energization circuit in embodiment of this invention.
[0016]
As shown in FIG. 1, in the resin power supply component 10, an energization circuit 2 is formed on a molded substrate 1 made of a synthetic resin having electrical insulation, and the energization circuit 2 is made of thermoplastic resin, metal powder, or metal fiber. And an electrically conductive resin composition composed of a low melting point metal. In FIG. 1, 3a and 3b are wiring components, 4a is a wiring component positioning member (boss), 4b is a wiring component positioning member (rib), 5 is an external component, and 6 is a lead of the external component.
[0017]
The substrate material of the molded substrate 1 of the power supply component 10 disclosed in this embodiment is a polypropylene (PP) resin, a polyethylene (PE) resin, a polyvinyl chloride (PVC) resin, an ABS resin, which can be molded into a predetermined shape. There is no particular limitation as long as it is a thermoplastic resin molding material such as polyamide (PA) resin or polycarbonate (PC) resin, or a thermosetting resin molding material such as phenol resin or epoxy resin. However, among them, a PP resin having excellent productivity and relatively low material cost is preferable. Moreover, the molded substrate 1 does not contain a copper damage inhibitor.
[0018]
The material forming the energization circuit 2 of the power supply component 10 is composed of at least a thermoplastic resin, a metal powder or metal fiber, a low melting point metal such as lead-free solder, and a material obtained by melting and kneading these materials in advance. ing. This material has a volume resistivity value of 1.0 × 10 ⁻⁵ Ω · cm, almost the same as that of a metal, and is excellent in electrical conductivity. The volume resistivity value of this material is variable depending on the blending ratio of the conductive substance (metal powder or metal fiber, lead-free solder), and is not limited to the above-described value. The thermoplastic resin described here is not particularly limited, such as polypropylene (PP) resin, polyethylene (PE) resin, vinyl chloride (PVC) resin, ABS resin, polyamide (PA) resin, polycarbonate (PC) resin, etc. By using the same material as that of the molded substrate 1, higher adhesion between the substrate 1 and the energization circuit 2 can be obtained. Therefore, it is desirable to select this intentionally. Examples of the material of the metal powder or metal fiber include copper (Cu), nickel (Ni), iron (Fe), aluminum (Al), and alloys thereof, but are not particularly limited. Moreover, examples of the low melting point metal include tin (Sn), bismuth (Bi), zinc (Zn), and the like, and alloys containing no lead (Pb).
[0019]
The energizing circuit 2 is formed on the substrate 1 using the material. For example, in order to form the energization circuit 2 on the substrate 1 of the power supply component 10, as shown in FIG. 3, a concave energization circuit groove 7 is provided in the substrate thickness direction in advance, and the energization circuit 2 is formed in the groove 7. . In this case, the cross-sectional shape of the energizing circuit groove 7 is not particularly limited, such as a square shape or a semicircular shape, and the thickness, width, and other dimensions of the groove 7 are not limited. Further, the length, shape, and number of energization circuits 2 are not particularly limited. When the energization circuit 2 is formed in the concave energization circuit groove 7 in this way, the position where the energization circuit 2 is formed in advance is formed in a concave shape on the substrate 1, so that the energization circuit is positioned by another structure. There is an advantage that there is no need to do. Moreover, as shown in FIG. 4, you may form the electricity supply circuit 2 on the board | substrate plane 1 without a groove | channel.
[0020]
The energization circuit 2 of the power supply component 10 may need to be connected to a lead frame, a lead wire, or the like of the external component 5 such as an electric / electronic component. However, the current-carrying circuit 2 formed of a material having electrical conductivity contains a large amount of a metal substance, and thus has high rigidity but is very brittle and does not have spring properties. Therefore, when the power supply component 10 and the external component 5 are connected and the power supply component 10 is repeatedly removed from the external component 5 and used, the energization circuit 2 of the power supply component 10 is partially damaged and cannot be used.
[0021]
Therefore, as shown in FIG. 1, a portion of the energizing circuit 2 of the power feeding component 10 that is repeatedly connected to and detached from the external component 5 is a metal having electrical conductivity such as copper (Cu) or nickel (Ni). It is separately provided as wiring components (connecting components) 3a and 3b that use materials (including alloys) and are elastically deformed to be connected to the leads 6 of the external component 5. In this case, as shown in FIGS. 2 (a) and 2 (b), the wiring components 3a and 3b have an L shape and a groove shape. As shown in FIG. 1, the energizing circuit 2 has positioning members 4a and 4b such as ribs and bosses for positioning the wiring components 3a and 3b, which have the same electrical conductivity as the energizing circuit 2 described above. The current-carrying circuit 2 and the material are formed integrally with the material. The shape, size, number, etc. of the positioning members 4a, 4b are not particularly limited as long as the wiring components 3a, 3b are fixed at predetermined positions.
[0022]
By forming the power supply component in this manner, it is possible to provide a resin power supply component that can be used for a long time without being damaged even if the external component 5 is repeatedly connected and disconnected .
[0023]
Next, a method for manufacturing a power feeding component using the two materials of the molded substrate and the energization circuit will be described. The substrate material described above can be molded into an arbitrary shape by an injection molding method, a compression molding method, a vacuum molding method, or the like. However, the injection molding method is desirable because the shape can be accurately reproduced and productivity is high. The material constituting the energization circuit 2 can be molded by an injection molding method, a compression molding method, or the like, but the injection molding method is desirable as described above.
[0024]
There is an insert molding method as a typical method for manufacturing the substrate 1 made of resin and the energization circuit 2 integrally. In the insert molding method, a substrate 1 molded in an arbitrary shape in advance is inserted into a mold for forming an energization circuit 2, and then a material for forming the energization circuit 2 in a molten state is injected into the mold. In this way, the substrate and the energization circuit 2 are integrated. Note that there is no problem if the energization circuit 2 is inserted into a mold for molding the substrate 1 after the energization circuit 2 is formed.
[0025]
Although it is possible to manufacture a power supply component by the above-described method, there is a two-color molding method as a method for manufacturing the power supply component further by reducing the manufacturing process and at a lower cost. This method is a method of injecting a material for forming the substrate into the same mold and then injecting the material to integrate the current-carrying circuit 2 (the molding order can be reversed).
[0026]
By manufacturing resin power supply parts using these methods, the substrate 1 and the current-carrying circuit 2 are completely adhered and integrated, so that a short-circuit accident where the current-carrying circuits come into contact with each other at the time of use does not occur. Parts can be supplied.
[0027]
【Example】
Embodiments of the present invention will be described. The specific substrate material used in the embodiment of the present invention is ◆ Substrate material: PP resin (MS500W, Matsushita Electric Works, Ltd.).
[0028]
Specific energizing circuit materials used in the embodiment of the present invention are as follows: ◆ Energizing circuit material: (a) thermoplastic resin; PP resin (MS500W, manufactured by Matsushita Electric Works), (b) copper powder; FCC- 115, Fukuda Metal Foil Powder Co., Ltd., (c) Lead-free solder; Sn-Cu-Ni-AtW-150, Fukuda Metal Foil Powder Industry Co., Ltd., ◆ Material composition: (a) 45 vol% , (B) 40 vol 1%, (c) 15 vol%, ◆ Volume resistance value: 1.0 × 10 ⁻⁵ Ω · cm.
[0029]
The specific power supply component outline used in the embodiment of the present invention is as follows: ◆ Name: for lighting fixtures / round fluorescent tube holder (for three lamps, L529), ◆ Substrate shape: Same as the shape shown in FIG. Substrate cross-sectional shape: FIG. 3, ◆ dimension and number of energization circuits: square cross section of w4 × t2 mm, 6 pieces.
[0030]
The specific manufacturing method implemented in the embodiment of the present invention is as follows: ◆ Two-color molding method: (1) Injection of the PP resin into a mold to mold a substrate, (2) After (1), a current-carrying circuit The material for forming is injected, and an energization circuit is formed in the substrate recess.
[0031]
【The invention's effect】
According to the resin power supply component of the present invention, an energization circuit is formed on a molded substrate made of a synthetic resin having electrical insulation, and the energization circuit is made of thermoplastic resin, metal powder or metal fiber, or low melting point metal. In addition, since it is formed of a resin composition having electrical conductivity, it is not necessary to position the energizing circuit with other structures such as ribs and bosses. For this reason, it is possible to suppress the increase in mold manufacturing cost that occurred when forming ribs, bosses, etc. on the molded substrate, and to form power supply parts with excellent appearance that do not cause substrate molding defects (sink, warp). Become.
[0032]
Further, since the substrate and the energization circuit can be integrally formed, the manufacturing process of the power feeding component can be reduced, and the manufacturing cost can be reduced. In addition, since the energization circuit can be formed from the resin composition without using a lead frame, a lead wire or the like, the number of parts can be reduced and the degree of freedom of the energization circuit shape can be increased.
[0033]
In addition, a connection component that elastically deforms and connects to the external component is provided at a location where the external circuit of the energization circuit is connected, and the component for positioning the connection component is formed integrally with the energization circuit using the same resin composition as the energization circuit. Therefore, it can be used for a long time without being damaged even if the external component is repeatedly connected to and removed from the power supply component. Moreover, since the positioning member of the wiring component is formed of a resin composition that is the same electrical good conductor as the energization circuit, the energization circuit and the wiring component can be reliably brought into contact with each other.
[0034]
According to the second aspect of the present invention , since the molded substrate is made of a polypropylene resin that does not contain a copper damage preventing agent, the power supply component having excellent long-term reliability can be manufactured without the substrate being deteriorated by copper damage. Moreover, the copper damage prevention agent added to the polypropylene resin which comprises a board | substrate becomes unnecessary, and material cost can be reduced. Polypropylene resin has the advantages of excellent productivity and relatively low material costs.
[0035]
According to a third aspect of the present invention, in the resin power supply component according to the first aspect, the thermoplastic resin is made of the same material as that of the molded substrate. Thus, since the thermoplastic resin is made of the same material as that of the molded substrate, higher adhesion between the substrate and the energization circuit can be obtained.
[0036]
According to a fourth aspect of the present invention, in the resin power supply component of the second aspect , the thermoplastic resin is a polypropylene resin. Thus, since the thermoplastic resin is the same polypropylene resin as the molded substrate of claim 2 , high adhesion between the substrate and the energization circuit can be obtained by the same material.
[Brief description of the drawings]
FIG. 1 is a schematic partial plan view of a resin power supply component according to an embodiment of the present invention.
2A and 2B are perspective views of wiring components in FIG.
FIG. 3 is a cross-sectional view of an energization circuit according to the embodiment of the present invention.
FIG. 4 is a cross-sectional view of another example of the energization circuit according to the embodiment of the present invention.
5A is a schematic view of a conventional power feeding component, and FIG. 5B is a cross-sectional view showing the internal structure thereof.
FIG. 6 is an explanatory diagram showing a problem of a conventional example.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Molding board 2 Current supply circuit 3a, 3b Wiring components 4a, 4b Positioning member 5 External component 6 Lead 10 Resin power supply component

Claims (4)

An energization circuit is formed on a molded substrate made of a synthetic resin having electrical insulation, and this energization circuit is made of a thermoplastic resin, metal powder or metal fiber, and an electrically conductive resin composition composed of a low melting point metal. A connection component that is elastically deformed and connected to the external component is provided at a location that is formed and connected to the external component of the energization circuit, and the component that positions the connection component is made of the same resin composition as the energization circuit. Resin power supply parts, which are formed integrally with   The resin power supply component according to claim 1, wherein the molded substrate is made of a polypropylene resin containing no copper damage inhibitor.   The resin-made power supply component according to claim 1, wherein the thermoplastic resin is the same material as that of the molded substrate. The resin power supply component according to claim 2 , wherein the thermoplastic resin is a polypropylene resin.

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