JP2001068235A - Power feeder component made of resin - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form a current carrying circuit without using a lead frame or a lead wire and reduce manufacturing processes, the number of component items and the manufacturing cost of a power feed component. SOLUTION: A current carrying circuit 2 is formed on a molded board 1 formed of a synthetic resin having an electric insulation property, and the current carrying circuit 2 is formed of a resin composition having electric conductivity and composed of a thermoplastic resin, metal powder or metal fiber, and a low-melting-point metal. Thereby, the need to position the current carrying circuit 2 by another structure such as a rib or boss is obviated. Therefore, increase in die manufacturing cost is restrained, and an appearance defect such as sink or warping can be prevented. Since the current carrying circuit 2 can be formed with the resin composition without using a lead frame or a lead wire, the number of component items can be reduced. Connection parts 3a, 3b to be connected to an external component 5 by being elastically deformed are formed, and components 4a, 4b for positioning the connection parts 3a, 3b are formed of the same resin composition as the current carrying circuit 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin power supply component having a molded substrate formed of a resin material having electrical insulation, and having an energizing circuit formed on the molded substrate.

[0002]

2. Description of the Related Art A conventional power supply component is formed by forming a synthetic resin molding material having electrical insulation into an arbitrary shape to form a substrate, and then forming a lead frame or lead made of metal such as copper (Cu). Wires have been inserted and fixed at predetermined positions on the substrate by mechanical equipment or by hand, or a current-carrying circuit has been formed by a wet method such as plating. FIG. 5 shows an example of the power supply component. FIG.
(A) is a schematic view of a power supply component, (b) is a cross-sectional view showing an internal structure thereof, 50 is an energizing circuit, 51 is a positioning pin, 52 is a positioning rib, and 53 is a fluorescent tube grip.

[0003]

However, the method of forming a current-carrying circuit on a substrate by the above-described method requires a large number of manufacturing steps, and thus has a problem in that the cost of manufacturing a power supply component increases. .

In recent years, power supply components have also been reduced in size in parallel with miniaturization of electric and electronic components. Therefore, when arranging a plurality of lead frames and lead wires as energizing circuits on one substrate, the energizing circuits may come into contact with each other and short-circuit. To prevent this, bend and arrange lead frames and lead wires into complicated shapes,
As shown in FIG.
2. It was necessary to provide a boss (not shown) and the like.

Although the use of the above-described method can prevent a short circuit accident caused by contact between a plurality of lead frames and lead wires arranged on a substrate, complicated bending of the lead frame and lead wires may cause power supply parts. To further increase the manufacturing cost. Further, when ribs, bosses, and the like are formed on a molded substrate, there is a problem that the mold manufacturing cost is increased due to an increase in the mold processing time, and appearance defects such as sinking and warping are generated on the molded substrate.

Further, most of the power supply components are fiercely competitive for cost reduction, and a polypropylene (PP) resin, whose material cost is relatively low, is often used as a synthetic resin molding material for forming a molded substrate. . On the other hand, most current-carrying circuits are Cu (copper)
Lead frames and lead wires are often used.
However, in order to prevent the PP resin from being oxidized by long-term contact with copper to cause deterioration such as discoloration and cracking, a decrease in mechanical strength and a decrease in electrical insulation, the PP resin constituting the molded substrate has a copper damage inhibitor. It is necessary to previously add an aromatic amine-based naphthylamine or the like to form a substrate.

However, there is a problem that the addition of such a copper damage inhibitor increases the material cost of the PP resin constituting the substrate and further increases the manufacturing cost of the power supply component.

Accordingly, an object of the present invention is to form a current-carrying circuit without using a lead frame or a lead wire, thereby reducing the number of manufacturing steps, the number of components, and the manufacturing cost of a power-supplying component, and increasing the degree of freedom of the shape of the current-carrying circuit. It is to provide a high resin power supply component.

[0009]

According to a first aspect of the present invention, there is provided a power supply part made of a resin in which a current-carrying circuit is formed on a molded substrate made of synthetic resin having electrical insulation. The current-carrying circuit is formed of a resin composition having electrical conductivity composed of a thermoplastic resin, metal powder or metal fiber, and a low-melting metal.

As described above, an energizing circuit is formed on a molded substrate made of a synthetic resin having electrical insulation, and the energizing circuit is formed of a thermoplastic resin, metal powder or metal fiber, or a low-melting metal. Therefore, there is no need to position the current-carrying circuit with other structures such as ribs and bosses. For this reason, it is possible to suppress an increase in die manufacturing cost, which has been caused when forming ribs, bosses, and the like on a molded substrate, and to solve the problem of poor appearance such as sink marks and warpage. In addition, since a current-carrying circuit can be formed using a resin composition without using a lead frame, a lead wire, or the like, the number of components can be reduced, and the degree of freedom of the shape of the current-carrying circuit increases.

According to a second aspect of the present invention, there is provided a resin-made power supply component according to the first aspect, wherein a connection component that elastically deforms and is connected to the external component is provided at a location connected to the external component, and the connection component is positioned. Was composed of the same resin composition as the energizing circuit. As described above, the connecting part that connects to the external part by being elastically deformed is provided at the place where the external part is connected, and the part for positioning the connecting part is made of the same resin composition as the energizing circuit. Repeatedly connected to power supply components,
It can be used for a long time without being damaged even if it is removed. Further, since the positioning member of the wiring component is formed of a resin composition that is the same good conductor of electricity as the current-carrying circuit, the current-carrying circuit and the wiring component can be reliably contacted.

According to a third aspect of the present invention, in the resin-made power supply component according to the first aspect, the molded substrate is made of a polypropylene resin containing no copper damage inhibitor. Since a copper product such as a lead frame or a lead wire is not used, the molded substrate can be made of a polypropylene resin containing no copper damage inhibitor as described above. Therefore, it is possible to manufacture a power supply component having excellent long-term reliability without the substrate being deteriorated due to copper damage. Also,
The copper damage inhibitor added to the polypropylene resin constituting the substrate is not required, and the material cost can be reduced. Further, the polypropylene resin has an advantage that it is excellent in productivity and the material cost is relatively low.

According to a fourth aspect of the present invention, in the resin power supply component, the thermoplastic resin is made of the same material as that of the molded substrate. As described above, since the thermoplastic resin is made of the same material as the material of the molded substrate, higher adhesion between the substrate and the current-carrying circuit can be obtained.

According to a fifth aspect of the present invention, in the resin power supply component according to the third aspect, the thermoplastic resin is a polypropylene resin. As described above, since the thermoplastic resin is the same polypropylene resin as that of the molded substrate of the third aspect, high adhesion between the substrate and the electric circuit can be obtained by the same material.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A resin power supply component according to an embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a schematic plan view of a resin power supply component according to an embodiment of the present invention, and FIGS. 2A and 2B are perspective views of wiring components, respectively.
FIG. 3 is a cross-sectional view of the energizing circuit according to the embodiment of the present invention, and FIG. 4 is a cross-sectional view of another example of the energizing circuit according to the embodiment of the present invention.

As shown in FIG. 1, this resin-made power supply component 1
0 is a molded substrate 1 made of synthetic resin having electrical insulation
An energization circuit 2 is formed thereon, and the energization circuit 2 is formed of a resin composition having electrical conductivity composed of a thermoplastic resin, metal powder or metal fiber, and a low melting point metal. In FIG. 1, 3a and 3b are wiring components, 4a is a wiring component positioning member (boss), 4b is a wiring component positioning member (rib), 5 is an external component, and 6 is a lead of the external component.

The substrate material of the molded substrate 1 of the power supply component 10 disclosed in this embodiment is made of polypropylene (PP) resin or polyethylene (P) which can be molded into a predetermined shape.
E) Resin, polyvinyl chloride (PVC) resin, ABS resin, polyamide (PA) resin, polycarbonate (P
C) It is not particularly limited as long as it is a thermoplastic resin molding material such as a resin or a thermosetting resin molding material such as a phenol resin or an epoxy resin. However, among them, PP resin which is excellent in productivity and has relatively low material cost is preferable.
Further, the molded substrate 1 does not contain a copper damage inhibitor.

The material forming the power supply circuit 2 of the power supply component 10 is made of at least a thermoplastic resin, metal powder or metal fiber, or a low melting point metal such as lead-free solder.
These materials are made by melting and kneading them in advance. This material has a volume resistivity of 1.0 × 10 ⁻⁵ Ω · c
It has a volume resistance value substantially equal to that of metal and a high electrical conductivity. Note that the volume specific resistance value of this material is variable depending on the mixing ratio of the conductive substance (metal powder or metal fiber, lead-free solder), and is not limited to the value described above. The thermoplastic resin described here is not particularly limited, such as polypropylene (PP) resin, polyethylene (PE) resin, vinyl chloride (PVC) resin, ABS resin, polyamide (PA) resin, and polycarbonate (PC) resin. By using the same material as the material of the molded substrate 1, higher adhesion between the substrate 1 and the energizing circuit 2 can be obtained, and it is desirable to select this intentionally. The material of the metal powder or metal fiber is copper (Cu), nickel (N
i), iron (Fe), aluminum (Al), and alloys thereof, but are not particularly limited. Examples of the low melting point metal include tin (Sn), bismuth (Bi), zinc (Zn), and alloys thereof that do not contain lead (Pb).

The energizing circuit 2 is formed on the substrate 1 using the above-mentioned material. For example, in order to form the energizing circuit 2 on the substrate 1 of the power supply component 10, as shown in FIG. 3, a concave energizing circuit groove 7 is provided in advance in the thickness direction of the substrate, and the energizing circuit 2 is formed in the groove 7. . In this case, the cross-sectional shape of the energizing circuit groove 7 is not particularly limited, such as a square shape or a semicircular shape, and the thickness, width, and other dimensions of the groove 7 are not limited. Further, the length, shape, and number of the energizing circuits 2 are not particularly limited. When the energizing circuit 2 is formed in the concave energizing circuit groove 7 in this manner, since the position where the energizing circuit 2 is formed is previously formed in a concave shape on the substrate 1, the energizing circuit is positioned by another structure. There is an advantage that there is no need to do this. FIG.
As shown in (1), the energizing circuit 2 may be formed on the substrate plane 1 having no groove.

In some cases, the power supply circuit 2 of the power supply component 10 needs to be connected to a lead frame, a lead wire, or the like of the external component 5 such as an electric / electronic component. However, the current-carrying circuit 2 formed of a material having electrical conductivity has a high rigidity because of containing a large amount of a metal substance, but is very brittle.
Does not have spring properties. Therefore, the power supply component 10 and the external component 5
And the power supply component 10 is repeatedly removed from the external component 5 for use.
Are partially damaged and cannot be used.

For this reason, as shown in FIG.
0 is a portion of the energizing circuit 2 that is repeatedly connected to and detached from the external component 5, and is made of copper (Cu), nickel (N
i) and other metal materials (including alloys) having electrical conductivity, and are separately provided as wiring components (connection components) 3a and 3b which are elastically deformed and connected to the leads 6 and the like of the external component 5. In this case, as shown in FIGS. 2A and 2B, the shapes of the wiring components 3a and 3b are L-shaped and groove-shaped, but may be any other shapes and are not particularly limited. FIG.
As shown in FIG. 2, the energizing circuit 2 includes positioning members 4 such as ribs and bosses for positioning the wiring components 3a and 3b.
a and 4b are integrally formed with the energizing circuit 2 using a material having the same electrical conductivity as that of the energizing circuit 2 described above. The shape, size, number, etc. of the positioning members 4a, 4b are not particularly limited, and may be any as long as the wiring components 3a, 3b are fixed at predetermined positions.

By forming the power supply component in this way, it is possible to provide a resin power supply component that can be used for a long time without being damaged even if the external component 5 is repeatedly connected and disconnected. When the connection between the power supply circuit and the external component is not required, the wiring component and the positioning member are not required.

Next, a description will be given of a method of manufacturing a power supply component using the above-described two materials of the molded substrate and the conductive circuit. The above-mentioned substrate material can be formed into an arbitrary shape by an injection molding method, a compression molding method, a vacuum molding method, or the like, but the injection molding method is desirable because the shape can be accurately reproduced and the productivity is high. Further, the material constituting the energizing circuit 2 can be formed by an injection molding method, a compression molding method, or the like, but the injection molding method is preferable as described above.

Substrate 1 made of resin and energizing circuit 2
As a typical method of integrally manufacturing the components, there is an insert molding method. In the insert molding method, after a substrate 1 previously formed into an arbitrary shape is inserted into a mold for forming the energizing circuit 2, a material for forming the energizing circuit 2 in a molten state is injected into the mold. And the circuit board 2
This is a method of integrating It is to be noted that there is no problem if the energizing circuit 2 is molded and then the energizing circuit 2 is inserted into a mold for molding the substrate 1 for manufacturing.

Although it is possible to manufacture a power supply component by the above-described method, there is a two-color molding method as a method of further reducing the number of manufacturing steps and manufacturing the power supply component at lower cost. In this method, after injecting the material that forms the substrate into the same mold,
This is a method in which the energization circuit 2 is integrated by injecting a material (the order of molding may be reversed).

By manufacturing the resin-made power supply component by these methods, the substrate 1 and the energizing circuit 2 are completely adhered and integrated, so that a short circuit accident in which the energizing circuits come into contact with each other during use does not occur. It becomes possible to supply power supply components at low cost.

[0027]

An embodiment of the present invention will be described. The specific substrate material used in the embodiment of the present invention is (1) substrate material: PP resin (MS500W, Matsushita Electric Works, Ltd.).

Specific energizing circuit materials used in the embodiment of the present invention are as follows: (a) energizing circuit material: (a) thermoplastic resin; PP resin (MS500W, manufactured by Matsushita Electric Works, Ltd.);
(B) Copper powder; FCC-115, manufactured by Fukuda Metal Foil & Powder Co., Ltd., (c) Lead-free solder; Sn-Cu-Ni-
AtW-150, manufactured by Fukuda Metal Foil & Powder Industry Co., Ltd. {Material composition: (a) 45 vol%, (b) 40 vol1%,
(C) Composed of 15% by volume, ΔVolume resistance: 1.0 × 1
0 ⁻⁵ Ω · cm.

The specific power supply components used in the embodiment of the present invention are as follows: {name: for lighting fixtures / circular fluorescent tube holder (for three lamps, L529);} board shape: to the shape shown in FIG. Same as above, {circle around (substrate) shape: FIG. 3, {circle around circuit size and number: square section of w4 × t2 mm, six>.

The specific manufacturing method carried out in the embodiment of the present invention is as follows: (2) Two-color molding method: (1) Inject the PP resin into a mold to mold a substrate, (2) After (1) Then, a material for forming the current-carrying circuit is injected, and the current-carrying circuit is formed in the concave portion of the substrate.

[0031]

According to the resin power supply component of the present invention, an energizing circuit is formed on a molded substrate made of synthetic resin having electrical insulation, and the energizing circuit is made of thermoplastic resin, metal powder or metal fiber, Since it is formed of an electrically conductive resin composition made of a melting point metal, there is no need to position the energizing circuit with other structures such as ribs and bosses. For this reason, it is possible to suppress the increase in the mold manufacturing cost that has occurred when forming ribs, bosses, and the like on the molded substrate, and to form a power supply component having an excellent appearance that does not cause substrate molding defects (sink, warp). Become.

Further, since the substrate and the current-carrying circuit can be integrally formed, the number of manufacturing steps of the power supply component can be reduced, and the manufacturing cost can be reduced. In addition, since a current-carrying circuit can be formed using a resin composition without using a lead frame, a lead wire, or the like, the number of components can be reduced, and the degree of freedom of the shape of the current-carrying circuit increases.

According to a second aspect of the present invention, a connecting part which is elastically deformed and is connected to the external part is provided at a position connected to the external part.
Since the component for positioning the connection component is made of the same resin composition as the energizing circuit, the external component can be used for a long time without being damaged even if it is repeatedly connected to and disconnected from the power supply component. Further, since the positioning member of the wiring component is formed of a resin composition that is the same good conductor of electricity as the current-carrying circuit, the current-carrying circuit and the wiring component can be reliably contacted.

According to the third aspect of the present invention, since the molded substrate is made of a polypropylene resin containing no copper damage inhibitor, it is possible to manufacture a power supply component having excellent long-term reliability without deterioration of the substrate due to copper damage. Become. Also, the need for a copper harm inhibitor added to the polypropylene resin constituting the substrate is eliminated,
Material costs can be reduced. Further, the polypropylene resin has an advantage that it is excellent in productivity and the material cost is relatively low.

According to a fourth aspect of the present invention, in the resin power supply component according to the first aspect, the thermoplastic resin is made of the same material as that of the molded substrate. As described above, since the thermoplastic resin is made of the same material as the material of the molded substrate, higher adhesion between the substrate and the current-carrying circuit can be obtained.

According to a fifth aspect of the present invention, in the resin power supply component according to the third aspect, the thermoplastic resin is a polypropylene resin. As described above, since the thermoplastic resin is the same polypropylene resin as that of the molded substrate of the third aspect, high adhesion between the substrate and the electric circuit can be obtained by the same material.

[Brief description of the drawings]

FIG. 1 is a schematic plan view of a resin power supply component according to an embodiment of the present invention.

FIGS. 2A and 2B are perspective views of the wiring component in FIG. 1;

FIG. 3 is a sectional view of an energizing circuit according to the embodiment of the present invention.

FIG. 4 is a sectional view of another example of the energizing circuit according to the embodiment of the present invention.

FIG. 5A is a schematic view of a conventional power supply component, and FIG. 5B is a cross-sectional view showing the internal structure thereof.

FIG. 6 is an explanatory diagram showing a problem of a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Molded board 2 Current supply circuit 3a, 3b Wiring component 4a, 4b Positioning member 5 External component 6 Lead 10 Resin power supply component

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E024 BE10 5E317 AA04 AA11 BB02 BB03 BB12 BB15 BB25 CC01 CC22 CD34 GG20

Claims (5)

[Claims] An electric circuit is formed on a molded substrate made of a synthetic resin having electrical insulation, and the electric circuit is made of a thermoplastic resin, metal powder or metal fiber, or a metal having a low melting point and has electric conductivity. A resin-made power supply component formed of a resin composition. 2. A connecting part for elastically deforming and connecting to the external part is provided at a position where the connecting part is connected to the external part, and the part for positioning the connecting part is made of the same resin composition as the energizing circuit. The resin-made power supply component described in the above. 3. The resin-made power supply component according to claim 1, wherein the molded substrate is made of a polypropylene resin containing no copper damage inhibitor. 4. The resin-made power supply component according to claim 1, wherein the thermoplastic resin is made of the same material as that of the molded substrate. 5. The resin-made power supply component according to claim 3, wherein the thermoplastic resin is a polypropylene resin.