JP3678044B2 - Method and apparatus for reusing abrasive slurry - Google Patents
Method and apparatus for reusing abrasive slurry Download PDFInfo
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Description
【０００１】
【発明の属する技術分野】
本発明は研磨剤スラリの再利用方法及び装置に係り、特に、半導体製造工程等から回収された使用済研磨剤スラリから、所定濃度の研磨剤スラリを所定量調製して再利用するための方法及び装置に関する。
【０００２】
【従来の技術】
多層配線ロジックＬＳＩの層間絶縁膜平坦化技術としてＣＭＰ（Chemical Mechanical Polishing）技術が適用されている。本プロセスで使用する研磨剤はコロイド状ＳｉＯ2，酸化セリウムＣｅＯ2，アルミナＡｌ2Ｏ3の微細粒子（数十ｎｍから数ｎｍ）であり、その中には、添加薬剤としてｐＨ調整剤（ＫＯＨ，ＮＨ4ＯＨ，有機酸，アミン類）、界面活性剤（分散剤）、酸化剤（Ｈ2Ｏ2，ＫＩＯ3，Ｆｅ（ＮＯ3）3）等を混合して用いるか別途添加して使用される。
【０００３】
この研磨剤スラリは、非常に高価であることから、使用済研磨剤スラリはこれを回収して再利用することが望まれる。使用済研磨剤スラリの回収再利用は廃液処理量の低減の面からも重要である。
【０００４】
【発明が解決しようとする課題】
しかし、使用済研磨剤スラリは、通常、その使用により希釈されて濃度が低下していることから、これをそのまま循環再利用することはできず、再利用に当っては、使用に適した濃度に濃度調製する必要がある。
【０００５】
従来、濃度既知の研磨剤スラリを水で希釈して濃度コントロールする技術はあるが、濃度未知の使用済研磨剤スラリを回収し、回収した研磨剤スラリ（以下「回収液」と称す場合がある。）に未使用の研磨剤スラリ（以下「新液」と称す場合がある。）や水を加えて使用に適した濃度の研磨剤スラリを必要量調製することは行われていない。
【０００６】
本発明は上記従来の実情に鑑みてなされたものであって、半導体製造工程等から回収された使用済研磨剤スラリに水及び／又は研磨剤スラリの新液を加えて、使用に適した濃度の研磨剤スラリを必要量調製して有効に再利用するための方法及び装置を提供することを目的とするものである。
【０００７】
【課題を解決するための手段】
本発明の研磨剤スラリの再利用方法は、使用済みの研磨剤スラリを回収し、新液（未使用研磨剤スラリ）及び／又は水を添加して所定濃度の研磨剤スラリを所定量調製して再利用する方法であって、所定量の回収した研磨剤スラリを調製槽に導入し、該調製槽内の液を取り出して該調製槽に戻す循環配管に設けた濃度測定器により、該研磨剤スラリの濃度を計測し、この計測結果及び研磨剤スラリの目標濃度及び目標調製量に基いて回収研磨剤スラリに対し添加すべき水及び／又は新液の量を決定し、この決定量の水及び／又は新液を前記調製槽内の液面から液量を測定する超音波液面計の検出値に基く注入量制御のもとに前記調製槽に供給し、その後該調製槽内の研磨剤スラリを再利用することを特徴とする。
【０００８】
この方法によれば、回収液から使用に適した濃度の研磨剤スラリを必要量調製して有効に再利用することができる。
【０００９】
本発明の研磨剤スラリの再利用方法では、調製槽に水及び／又は新液を供給した後、該調製槽内の研磨剤スラリ濃度を計測し、この計測結果に基いて水及び／又は新液を調製槽に添加して研磨剤スラリ濃度を微調整することにより、調製される研磨剤スラリの濃度を所望濃度範囲内におさめることができる。
【００１０】
本発明の研磨剤スラリの再利用装置は、使用済み研磨剤スラリを回収し、新液（未使用研磨剤スラリ）及び／又は水を添加して所定濃度の研磨剤スラリを所定量調製して再利用するための装置であって、回収した研磨剤スラリの受槽と、回収した研磨剤スラリに新液及び／又は水を添加するための調製槽と、該受槽から所定量の研磨剤スラリを該調製槽に移送する手段と、該調製槽内の研磨剤スラリの濃度の検出手段と、この検出手段の検出結果と目標濃度及び目標調製量に応じて水及び／又は新液を該調製槽に添加する手段と、該調製槽内の液面から液量を測定する超音波液面計と、該調製槽内の研磨剤スラリを送り出す手段とを備えてなり、前記調製槽内の研磨剤スラリの濃度の検出手段は、該調製槽内の液を取り出して該調製槽に戻す循環配管に設けられた濃度測定器であり、前記水及び／又は新液を該調製槽に添加する手段は、前記超音波液面計の検出値に基いて前記調整槽への新液及び／又は水の注入量を制御する手段であることを特徴とする。
【００１１】
【発明の実施の形態】
以下に図面を参照して本発明の実施の形態を詳細に説明する。
【００１２】
図１は本発明の研磨剤スラリの再利用装置の実施の形態を示す系統図である。
【００１３】
図１において、１は回収した使用済研磨剤スラリ（回収液）の受槽てあり、水位センサ３（高水位側センサ３Ｈ及び低水位側センサ３Ｌ）を備える。使用場所から回収された回収液は、自動弁Ｖ1を備える配管１１よりこの受槽１に導入される。
【００１４】
２は、回収液と未使用の研磨剤スラリ（新液）と純水とで所望濃度の研磨剤スラリ（以下「調製液」と称す場合がある。）が調製される調製槽であり、受槽１内の回収液は、ポンプＰ1により配管１２を経て、この調製槽２に移送される。この移送の間に、フィルター４で回収液中に含まれる研磨屑等が除去される。また、新液及び純水は、それぞれ自動弁Ｖ2を備える配管１５及び自動弁Ｖ3を備える配管１６によりこの調製槽２内に導入される。
【００１５】
５は超音波液面計であり調製槽２内の液面から液量を測定する。
【００１６】
調製槽２には装置内の液を取り出すポンプＰ2を備える配管１３が設けられ、この配管１３は、液を調製槽２に戻す循環配管１４と、液をフィルター７を通過させた後使用場所へ送る配管１７とに分岐している。循環配管１４には濃度測定器６が設けられている。また、送液配管１７にはフィルター７が設けられている。Ｖ4は液の移送方向を選択する三方弁である。
【００１７】
１０は、超音波液面計５や濃度測定器６の計測結果に基いて、自動弁Ｖ2，Ｖ3の開閉、ポンプＰ1，Ｐ2等の作動を制御するシーケンサである。
【００１８】
この装置により、回収液から調製液を調製する手順は次の通りである。
【００１９】
▲１▼ 自動弁Ｖ1を開として、回収液を受槽１に受ける。自動弁Ｖ1は、水位センサ３Ｈが水位を検知することで閉とされる。これにより受槽１には所定容量の回収液が導入される。
【００２０】
▲２▼ ポンプＰ1を作動させ受槽１内の回収液をフィルター４で濾過した後調製槽２に導入する。ポンプＰ1は、水位センサ３Ｌが水位を検知すると停止する。これにより、調製槽２には所定容量の回収液が導入される。
【００２１】
▲３▼ ポンプＰ2を作動させて調製槽２内の回収液を配管１３，１４に循環させる過程において、濃度測定器６で回収液の濃度を測定する。
【００２２】
▲４▼ 自動弁Ｖ2、Ｖ3を開とし、純水と新液を調製槽２に加え、その後ポンプＰ2を作動させて調製槽２内の液（以下「予備調製液」と称す。）を攪拌、混合すると共に濃度測定器６で濃度測定を行うと共に、必要とされる調製液の量を設定する。
【００２３】
▲５▼ ▲３▼で測定した回収液の濃度及び量と、▲４▼で加えた純水量と新液量と、▲４▼で測定した予備調製液の濃度と、必要とする調製液の量とから、シーケンサ１０の内部回路のプログラムにより演算を行い、更に添加すべき新液量及び純水量を決定し、自動弁Ｖ2，Ｖ3の開閉で規定量の新液及び純水を調製槽２に加える。
【００２４】
▲６▼ ポンプＰ2を作動させて調製槽２内の液を攪拌、混合すると共に濃度測定器６で濃度チェックを行う。
【００２５】
▲７▼ ▲６▼の濃度チェックで、濃度が設定範囲よりも低い場合は自動弁Ｖ3を開いて新液を、また、濃度が設定範囲よりも高い場合は自動弁Ｖ2を開いて純水をそれぞれ調製槽２に注入し、同様に攪拌混合すると共に濃度測定器６で再度濃度チェックを行う。
【００２６】
▲８▼ 濃度が設定範囲内であることが確認された場合には、三方弁Ｖ4を切り換えて調製された液を配管１７よりフィルター７で濾過して使用場所へ送る。
【００２７】
なお、上記▲１▼〜▲８▼の一連の調製工程において、調製槽２への新液及び純水の注入量は、超音波液面計５の検出値に基いて制御することができる。
【００２８】
図１に示す装置は、本発明の実施の形態の一例であって、本発明はその要旨を超えない限り、何ら示唆のものに限定されるものではない。
【００２９】
濃度測定器６としては、比重計、質量計、歪計（ロードセル）を利用した比重計や超音波式濃度計等を用いることができる。
【００３０】
また、通常、回収液中には、研磨工程において、半導体基板側から削り取られた研磨屑の粗大粒子の他に、研磨剤粒子が破壊された極微細粒子が混入していることから、回収液の再利用に当っては、粗大粒子を除去するためのフィルターの他に、微細粒子を除去するための膜分離装置等を設けても良い。
【００３１】
【発明の効果】
以上詳述した通り、本発明の研磨剤スラリの再利用方法及び装置によれば、半導体製造工程等から回収された使用済研磨剤スラリに水や研磨剤スラリの新液を加えて、使用に適した濃度の研磨剤スラリを必要量調製して有効に再利用することができる。
【００３２】
本発明によれば、使用済研磨剤スラリを回収再利用することで高価な研磨剤スラリの新液の使用量を削減して薬剤コストの低減を図ることができ、また、排出される排液量を削減して排水処理装置の負荷を軽減し、排水処理コストの低減を図ることもできる。
【図面の簡単な説明】
【図１】本発明の研磨剤スラリの再利用装置の実施の形態を示す系統図である。
【符号の説明】
１ 受槽
２ 調製槽
３ 水位センサ
４，７ フィルター
５ 超音波液面計
６ 濃度測定器[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method and apparatus for reusing an abrasive slurry, and in particular, a method for preparing and reusing a predetermined amount of a slurry of a predetermined concentration from a used abrasive slurry recovered from a semiconductor manufacturing process or the like. And an apparatus.
[0002]
[Prior art]
A CMP (Chemical Mechanical Polishing) technique is applied as a technique for planarizing an interlayer insulating film of a multilayer wiring logic LSI. The polishing agent used in this process is colloidal SiO 2 , cerium oxide CeO 2 , and alumina Al 2 O 3 fine particles (several tens to several nm), including a pH adjuster (KOH) as an additive. , NH 4 OH, organic acids, amines), surfactants (dispersing agents), oxidants (H 2 O 2 , KIO 3 , Fe (NO 3 ) 3 ), etc. Is done.
[0003]
Since this abrasive slurry is very expensive, it is desirable to recover and reuse the used abrasive slurry. The recovery and reuse of used abrasive slurry is also important from the viewpoint of reducing the amount of waste liquid.
[0004]
[Problems to be solved by the invention]
However, since the used abrasive slurry is usually diluted by its use and its concentration is lowered, it cannot be recycled as it is, and the concentration suitable for use is reused. It is necessary to adjust the concentration.
[0005]
Conventionally, there is a technique for controlling the concentration by diluting an abrasive slurry with a known concentration with water, but the used abrasive slurry with an unknown concentration is recovered, and the recovered abrasive slurry (hereinafter sometimes referred to as “collected liquid”) )) Is not used to prepare a necessary amount of an abrasive slurry (hereinafter sometimes referred to as “new solution”) or water having a concentration suitable for use.
[0006]
The present invention has been made in view of the above-described conventional circumstances, and is a concentration suitable for use by adding water and / or a new slurry of abrasive slurry to a used abrasive slurry recovered from a semiconductor manufacturing process or the like. It is an object of the present invention to provide a method and an apparatus for preparing a necessary amount of an abrasive slurry and effectively reusing it.
[0007]
[Means for Solving the Problems]
The method of reusing an abrasive slurry according to the present invention is to collect a used abrasive slurry and add a new liquid (unused abrasive slurry) and / or water to prepare a predetermined amount of abrasive slurry of a predetermined concentration. A predetermined amount of the recovered abrasive slurry is introduced into a preparation tank, the liquid in the preparation tank is taken out and returned to the preparation tank, and the polishing is performed by a concentration measuring device provided in a circulation pipe. The concentration of the abrasive slurry is measured, the amount of water and / or new liquid to be added to the recovered abrasive slurry is determined based on the measurement result and the target concentration and target preparation amount of the abrasive slurry. Water and / or new liquid is supplied to the preparation tank under injection amount control based on the detection value of an ultrasonic liquid level gauge that measures the liquid volume from the liquid level in the preparation tank, and then in the preparation tank. It is characterized by reusing the abrasive slurry.
[0008]
According to this method, a necessary amount of abrasive slurry having a concentration suitable for use can be prepared from the recovered liquid and effectively reused.
[0009]
In the abrasive slurry reuse method of the present invention, after supplying water and / or a new liquid to the preparation tank, the concentration of the abrasive slurry in the preparation tank is measured, and the water and / or new slurry is measured based on the measurement result. By finely adjusting the abrasive slurry concentration by adding the liquid to the preparation tank, the concentration of the prepared abrasive slurry can be kept within the desired concentration range.
[0010]
The abrasive slurry recycling apparatus of the present invention collects a used abrasive slurry and adds a new liquid (unused abrasive slurry) and / or water to prepare a predetermined amount of an abrasive slurry of a predetermined concentration. An apparatus for reusing, a receiving tank for recovered abrasive slurry, a preparation tank for adding new liquid and / or water to the recovered abrasive slurry, and a predetermined amount of abrasive slurry from the receiving tank Means for transferring to the preparation tank, means for detecting the concentration of the abrasive slurry in the preparation tank, and water and / or new liquid depending on the detection result, target concentration and target preparation amount of the detection means And an ultrasonic liquid level gauge for measuring the amount of liquid from the liquid level in the preparation tank, and a means for sending out an abrasive slurry in the preparation tank, and the abrasive in the preparation tank The slurry concentration detection means takes out the liquid in the preparation tank and returns it to the preparation tank. Ri densitometry der provided in the ring pipe, means for adding the water and / or fresh liquid into said preparation vessel, it said fresh liquid and to the adjusting tank based on a value detected by the ultrasonic level gauge It is a means for controlling the injection amount of water.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0012]
FIG. 1 is a system diagram showing an embodiment of an apparatus for reusing an abrasive slurry according to the present invention.
[0013]
In FIG. 1, reference numeral 1 denotes a receiving tank for recovered used abrasive slurry (recovered liquid), which includes a water level sensor 3 (a high
[0014]
Reference numeral 2 denotes a preparation tank in which an abrasive slurry of a desired concentration (hereinafter sometimes referred to as “preparation liquid”) is prepared from the recovered liquid, an unused abrasive slurry (new liquid), and pure water. The recovered liquid in 1 is transferred to the preparation tank 2 via the
[0015]
Reference numeral 5 denotes an ultrasonic liquid level gauge, which measures the amount of liquid from the liquid level in the preparation tank 2.
[0016]
The preparation tank 2 is provided with a pipe 13 equipped with a pump P 2 for taking out the liquid in the apparatus. The pipe 13 is a
[0017]
A
[0018]
The procedure for preparing the preparation liquid from the recovered liquid using this apparatus is as follows.
[0019]
(1) Open the automatic valve V 1 and receive the recovered liquid in the receiving tank 1. The automatic valve V 1 is closed when the
[0020]
{Circle around (2)} The pump P 1 is operated and the recovered liquid in the receiving tank 1 is filtered through the
[0021]
(3) In the process of operating the pump P 2 and circulating the recovered liquid in the preparation tank 2 to the
[0022]
{Circle around (4)} Automatic valves V 2 and V 3 are opened, pure water and new liquid are added to the preparation tank 2, and then the pump P 2 is operated and the liquid in the preparation tank 2 (hereinafter referred to as “preliminary preparation liquid”). ) Is stirred and mixed, the concentration is measured with the concentration measuring device 6, and the required amount of the preparation solution is set.
[0023]
(5) Concentration and amount of recovered liquid measured in (3), pure water amount and new liquid amount added in (4), concentration of preparatory liquid measured in (4), and required preparation liquid Based on the amount, calculation is performed by the program of the internal circuit of the
[0024]
(6) Operate the pump P 2 to stir and mix the liquid in the preparation tank 2 and check the concentration with the concentration measuring device 6.
[0025]
(7) In the concentration check of (6), if the concentration is lower than the set range, open the automatic valve V 3 to open the new solution, and if the concentration is higher than the set range, open the automatic valve V 2 to Water is poured into the preparation tank 2 and stirred and mixed in the same manner, and the concentration check is performed again by the concentration measuring device 6.
[0026]
(8) When it is confirmed that the concentration is within the set range, the liquid prepared by switching the three-way valve V 4 is filtered through the
[0027]
In the series of preparation steps (1) to (8), the amount of new liquid and pure water injected into the preparation tank 2 can be controlled based on the detection value of the ultrasonic liquid level gauge 5.
[0028]
The apparatus shown in FIG. 1 is an example of an embodiment of the present invention, and the present invention is not limited to any suggestion as long as the gist thereof is not exceeded.
[0029]
As the concentration measuring device 6, a hydrometer, a mass meter, a hydrometer using a strain meter (load cell), an ultrasonic densitometer, or the like can be used .
[0030]
In addition, the recovered liquid usually contains extra fine particles in which the abrasive particles are destroyed in addition to the coarse particles of abrasive scraps scraped from the semiconductor substrate side in the polishing step. In the reuse, a membrane separation device or the like for removing fine particles may be provided in addition to a filter for removing coarse particles.
[0031]
【The invention's effect】
As described in detail above, according to the method and apparatus for reusing abrasive slurry of the present invention, water or a new slurry of abrasive slurry is added to the used abrasive slurry recovered from the semiconductor manufacturing process, etc. for use. A necessary amount of an abrasive slurry of suitable concentration can be prepared and reused effectively.
[0032]
According to the present invention, it is possible to reduce the cost of chemicals by reducing the amount of new liquid used for an expensive abrasive slurry by recovering and reusing the used abrasive slurry, and the discharged waste liquid. It is also possible to reduce the amount of wastewater treatment equipment by reducing the amount of wastewater treatment costs.
[Brief description of the drawings]
FIG. 1 is a system diagram showing an embodiment of an abrasive slurry recycling apparatus of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Receiving tank 2
Claims (3)
所定量の回収した研磨剤スラリを調製槽に導入し、該調製槽内の液を取り出して該調製槽に戻す循環配管に設けた濃度測定器により、該研磨剤スラリの濃度を計測し、この計測結果及び研磨剤スラリの目標濃度及び目標調製量に基いて回収研磨剤スラリに対し添加すべき水及び／又は新液の量を決定し、この決定量の水及び／又は新液を前記調製槽内の液面から液量を測定する超音波液面計の検出値に基く注入量制御のもとに前記調製槽に供給し、その後該調製槽内の研磨剤スラリを再利用することを特徴とする研磨剤スラリの再利用方法。A method of recovering a used abrasive slurry, adding a new liquid (unused abrasive slurry) and / or water to prepare a predetermined amount of an abrasive slurry and reusing it.
A predetermined amount of the recovered abrasive slurry is introduced into a preparation tank, and the concentration of the abrasive slurry is measured by a concentration measuring device provided in a circulation pipe that takes out the liquid in the preparation tank and returns it to the preparation tank. The amount of water and / or new liquid to be added to the recovered abrasive slurry is determined based on the measurement result and the target concentration and target preparation amount of the abrasive slurry, and the determined amount of water and / or new liquid is prepared as described above. Supplying to the preparation tank under injection volume control based on the detection value of an ultrasonic liquid level gauge that measures the liquid volume from the liquid level in the tank, and then reusing the abrasive slurry in the preparation tank A method of reusing an abrasive slurry characterized.
回収した研磨剤スラリの受槽と、回収した研磨剤スラリに新液及び／又は水を添加するための調製槽と、該受槽から所定量の研磨剤スラリを該調製槽に移送する手段と、該調製槽内の研磨剤スラリの濃度の検出手段と、この検出手段の検出結果と目標濃度及び目標調製量に応じて水及び／又は新液を該調製槽に添加する手段と、該調製槽内の液面から液量を測定する超音波液面計と、該調製槽内の研磨剤スラリを送り出す手段とを備えてなり、
前記調製槽内の研磨剤スラリの濃度の検出手段は、該調製槽内の液を取り出して該調製槽に戻す循環配管に設けられた濃度測定器であり、前記水及び／又は新液を該調製槽に添加する手段は、前記超音波液面計の検出値に基いて前記調整槽への新液及び／又は水の注入量を制御する手段であることを特徴とする研磨剤スラリの再利用装置。A device for recovering a used abrasive slurry, adding a new liquid (unused abrasive slurry) and / or water to prepare a predetermined amount of an abrasive slurry of a predetermined concentration and reusing it.
A receiving tank for the recovered abrasive slurry, a preparation tank for adding new liquid and / or water to the recovered abrasive slurry, means for transferring a predetermined amount of abrasive slurry from the receiving tank to the preparation tank, Means for detecting the concentration of the abrasive slurry in the preparation tank, means for adding water and / or a new liquid to the preparation tank in accordance with the detection result of the detection means, the target concentration and the target preparation amount, and the inside of the preparation tank An ultrasonic liquid level gauge for measuring the liquid volume from the liquid level, and means for sending out the abrasive slurry in the preparation tank,
Detection means of the concentration of the abrasive slurry of the preparation tank is Ri densitometry der provided in the circulation pipe for returning the said preparation tank removed liquid said preparation tank, the water and / or fresh liquid means for adding to the said preparation tank, the abrasive slurry, wherein means der Rukoto for controlling the injection amount of the fresh solution and / or water of the to the adjusting tank based on a value detected by the ultrasonic level gauge Reuse device.
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| Application Number | Priority Date | Filing Date | Title |
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| JP7602799A JP3678044B2 (en) | 1999-03-19 | 1999-03-19 | Method and apparatus for reusing abrasive slurry |
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| JP7602799A JP3678044B2 (en) | 1999-03-19 | 1999-03-19 | Method and apparatus for reusing abrasive slurry |
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| JP5676832B2 (en) * | 2001-06-08 | 2015-02-25 | エルエスアイ コーポレーション | Defect density reduction method and slurry flow rate control method in chemical mechanical polishing of semiconductor wafer |
| JP4456308B2 (en) * | 2001-12-05 | 2010-04-28 | 富士通マイクロエレクトロニクス株式会社 | Chemical supply device |
| JP4004795B2 (en) * | 2001-12-28 | 2007-11-07 | 松下環境空調エンジニアリング株式会社 | Polishing fluid supply device |
| JP2006165104A (en) * | 2004-12-03 | 2006-06-22 | Toshiro Doi | Method and device for chemical and mechanical polishing and method and device for reproducing slurry at the time of performing chemical and mechanical polishing work |
| JP2009214193A (en) * | 2008-03-07 | 2009-09-24 | Disco Abrasive Syst Ltd | Processing waste liquid treatment device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20190019590A (en) * | 2017-08-18 | 2019-02-27 | 에스케이실트론 주식회사 | Edge polishing unit of wafer, edge polishing apparatus and method of wafer including the same |
| KR101971150B1 (en) * | 2017-08-18 | 2019-04-22 | 에스케이실트론 주식회사 | Edge polishing unit of wafer, edge polishing apparatus and method of wafer including the same |
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