JP3671104B2 - Semiconductor manufacturing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor manufacturing apparatus used for manufacturing a semiconductor device, and more particularly to a transportation means thereof.
[0002]
[Prior art]
To transport a semiconductor manufacturing device equipped with a coating processing unit, heat treatment unit, development processing unit, substrate transfer unit, etc. to a predetermined installation location in a clean room, the device has conventionally been mounted on a cart with casters using a forklift or the like. Was once moved to move the device on the carriage. At the installation site, the forklift or the like is used to lower the device from the carriage and perform installation.
[0003]
[Problems to be solved by the invention]
However, in the transportation method as described above, it takes a lot of labor and time to transfer the semiconductor manufacturing apparatus onto the carriage, or to lower the apparatus from the carriage and position it at a predetermined installation location. .
[0004]
The present invention has been made in view of the current situation as described above, and an object of the present invention is to provide a semiconductor manufacturing apparatus capable of reducing the time required for carrying in and starting up the apparatus and reducing labor.
[0005]
[Means for Solving the Problems]
According to a first aspect of the present invention, at least three pairs of casters for moving the apparatus , which can be fixed to the upper position and the lower position, respectively and the directions of the axles are orthogonal to each other , are provided in the semiconductor manufacturing apparatus. It is characterized in that at least three installation legs for fixing the device that can be fixed at each lowered position are provided.
[0008]
According to a second aspect of the present invention, in the semiconductor manufacturing apparatus , at least three rows of casters for moving the apparatus that can be fixed at the upper position and the lowered position are provided in the moving direction of the apparatus, and at each of the raised position and the lowered position. At least three installation legs for fixing the apparatus that can be fixed are provided.
[0009]
In the semiconductor manufacturing apparatus according to the first aspect, the apparatus can be moved simply by fixing the installation leg in the raised position and supporting the apparatus on the floor surface by the casters. When installing the apparatus at the installation location, the installation leg is fixed at the lowered position, the apparatus is supported on the floor by the installation leg, and the casters are floated above the floor. Thereby, the apparatus is fixed without moving. In addition, the apparatus can be moved by fixing the caster at the lowered position and supporting the apparatus on the floor surface by the caster. On the other hand, the apparatus can be fixed by fixing the caster in the raised position and floating it above the floor surface. Further, a plurality of first casters having the same axle direction are fixed to the lowered position, and the apparatus is supported on the floor by the first casters, and the remaining plurality of second casters are raised to the raised position. The apparatus can be moved in the first direction by being fixed to the floor and floating above the floor surface. Further, a plurality of second casters having the same axle direction are fixed at the lowered position, and the apparatus is supported on the floor surface by the second casters, and the remaining plurality of first casters are raised. The apparatus can be moved in a second direction perpendicular to the first direction without rotating the apparatus by fixing the apparatus to the upper surface of the floor.
[0012]
In the semiconductor manufacturing apparatus according to the second aspect of the present invention , the apparatus can be moved only by fixing the installation leg in the raised position and supporting the apparatus on the floor surface by the casters. When installing the apparatus at the installation location, the installation leg is fixed at the lowered position, the apparatus is supported on the floor by the installation leg, and the casters are floated above the floor. Thereby, the apparatus is fixed without moving. In addition, the apparatus can be moved by fixing the caster at the lowered position and supporting the apparatus on the floor surface by the caster. On the other hand, the apparatus can be fixed by fixing the caster in the raised position and floating it above the floor surface. Furthermore, when there is a step in a part of the floor , for example, a pipe placed across the direction of device movement on the floor, only the casters in the row located on the front side of the step among the multiple rows of casters Is fixed in the raised position and floated, and the casters in the remaining rows are fixed in the lowered position, and the equipment is supported on the floor by these casters, and the equipment is moved forward and fixed in the raised position. The caster is passed through the position without climbing on the step. Then, by moving the device while the casters of only one row of the plurality of rows of casters are sequentially fixed to the raised position and are in a floating state, it is possible to keep the device in a fixed posture without climbing any casters on the steps. It can be moved without swinging up and down while being maintained.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
[0014]
FIG. 1 shows one embodiment of the first invention, in which (a) is a schematic plan view of a semiconductor manufacturing apparatus , and (b) is a schematic side view thereof. The semiconductor manufacturing apparatus 16 has three or more, for example, four sets of casters 18 and 20 with a pair of casters 18 and 20 whose axle directions are orthogonal to each other at the bottom , and three or more, for example, four installation legs. 22 are provided at four corners . Each of the casters 18 and 20 and each of the installation legs 22 can be expanded and contracted from the bottom of the apparatus, and can be fixed to the raised position and the lowered position. As the raising / lowering mechanisms of the casters 18 and 20 and the installation legs 22 , known ones may be adopted. For example, a suitable one of screw rotation type, hydraulic cylinder type, motor drive type, lever type, etc. may be adopted. That's fine. Moreover, it is good to set it as the mechanism which raises / lowers simultaneously 4 sets of casters 18 and 20 and 4 installation legs 22 using an actuator.
[0018]
When the semiconductor manufacturing apparatus 16 shown in FIG. 1 tries to move it in the direction of arrow A, the four casters 18 directed in the direction of arrow A are lowered as shown in FIG. The apparatus 16 is supported on the floor surface F by the casters 18 fixed at the positions, and the four casters 20 directed in the direction of the arrow B are respectively fixed at the raised positions and floated above the floor surface F. . At this time, the four installation legs 22 are, of course, fixed in the raised position and floated above the floor surface F. Then, the operator pushes the device 16 in the direction of arrow A and moves it. On the other hand, when trying to move the device 16 in the direction of arrow B, the four casters 20 facing in the direction of arrow B are fixed at the lowered positions, and the device 16 is supported on the floor F by the casters 20. Then, the four casters 18 directed in the direction of the arrow A are fixed at the raised positions, and are floated above the floor surface F. Then, the operator pushes the device 16 in the direction of arrow B and moves it. Since the device 16 can be moved in the directions of the arrows A and B that are orthogonal to each other, it is necessary to transport the device 16 through a path that is narrow and bent at a right angle. In some cases, the transfer operation becomes easy. When the apparatus 16 is installed at a predetermined installation location, the four installation legs 22 are fixed to the lowered position, and the apparatus 16 is supported on the floor F by the installation legs 22 and all the eight casters 18 are supported. , 20 are fixed at their raised positions and are floated above the floor F.
In addition, it is good also as a mechanism which can remove a caster after installation of an apparatus.
[0019]
FIG. 2 is a schematic side view of a semiconductor manufacturing apparatus showing an embodiment of the second invention . At the bottom of the semiconductor manufacturing apparatus 24, a plurality of casters 26a, 26b, and 26c are provided in the moving direction of the apparatus, and in the illustrated example, in three lines. It is provided one by one. Further, three or more, for example, four installation legs 28 are provided on the bottom of the device 24. Each caster 26a, 26b, 26c and each installation leg 28 are configured to be extendable from the bottom of the device and fixed to the raised and lowered positions, respectively, in the same manner as the device 16 shown in FIG. Yes.
[0020]
When the semiconductor manufacturing apparatus 24 shown in FIG. 2 is transported, the four installation legs 28 are fixed to the raised positions and floated above the floor F, and the six casters 26a, 26b, 26c is fixed to the lowered position, and the apparatus 24 is supported on the floor F by the casters 26a, 26b, and 26c. If there is a step 30 on the floor F in the middle of the passage, the device 24 raises only the pair of casters 26a when the head caster 26a is positioned on the front side of the step 30. Then, the apparatus 24 is supported above the floor F by the casters 26b at the center and the casters 26c at the end, and the apparatus 24 is moved forward. At this time, the leading caster 26 a passes through the position without climbing on the step 30. Next, when the central caster 26b is positioned on the front side of the step 30, the leading caster 26a is lowered to land on the floor surface F, and the pair of central casters 26b are lifted and floated above the floor surface F. Then, the device 24 is supported on the floor F by the first caster 26a and the last caster 26c, and the device 24 is moved forward. FIG. 2 shows a state at this time, and the central caster 26 b passes through the position without climbing on the step 30. Finally, when the last caster 26c is positioned on the front side of the step 30, the center caster 26b is lowered and landed on the floor surface F, and the last pair of casters 26c is raised and floated above the floor surface F. Then, the device 24 is supported on the floor surface F by the head caster 26a and the center caster 26b, and the device 24 is moved forward. Also at this time, the last caster 26 c passes through the position without climbing on the step 30. Thereafter, the last caster 26c is lowered and landed on the floor surface F to return to the original state. During this passage, the device 24 translates horizontally and does not swing up and down. When the apparatus 24 is installed at a predetermined installation location, the four installation legs 28 are lowered to support the apparatus 24 on the floor F by the installation legs, and all six casters 26a, 26b, 26c are provided. Are raised to float above the floor F.
In addition, it is good also as a mechanism which can remove a caster after installation of an apparatus. Further, the caster may be a mechanism that can freely change its direction in at least two directions orthogonal to each other.
[0021]
【The invention's effect】
In the semiconductor manufacturing apparatus according to the first aspect of the present invention, it is easy to carry it to a predetermined installation location and install it at the installation location, shorten the time for bringing in the apparatus and reduce labor required for the operation. It will be. Further, when the apparatus is installed at the installation location, the caster is fixed at the raised position and is floated above the floor surface, so that the apparatus is reliably fixed. Furthermore, since the device can be moved in two directions orthogonal to each other without rotating the device, the device must be transported through a narrow path and a right-angled path. Sometimes the transportation work becomes easy.
[0024]
In the apparatus of the invention according to claim 2 , it is easy to carry it to a predetermined installation location and install it at the installation location, shorten the time for carrying in the apparatus and reduce labor required for the operation. Become. Further, when the apparatus is installed at the installation location, the caster is fixed at the raised position and is floated above the floor surface, so that the apparatus is reliably fixed. Furthermore, in this device, when there is a step on a part of the floor surface in the middle of the passage, the device can be moved in parallel in the horizontal direction without the caster riding on the step, so that the carrying work is In addition to being easy, swinging of the apparatus during transportation can be suppressed.
[Brief description of the drawings]
[1] shows one embodiment of the first invention, (a) is a schematic plan view of a semiconductor manufacturing apparatus, which is a schematic side view (b).
FIG. 2 is a schematic side view of a semiconductor manufacturing apparatus showing an embodiment of a second invention .
[Explanation of symbols]
16 , 24 Semiconductor manufacturing equipment
18 , 20, 26a, 26b, 26c Casters
22 , 28 Installation legs 30 Floor level difference

Claims (2)

At least three pairs of casters for moving the device , which can be fixed at the upper position and the lower position, respectively, and the directions of the axles are orthogonal to each other, and at the same time, the device fixing installation that can be fixed at each of the raised position and the lowered position A semiconductor manufacturing apparatus comprising at least three legs. With casters for fixably a device moving to each of the upper side position and the lowered position is provided at least in three rows in the direction of movement of the device, the installation leg for securable device secured to each of the raised position and the lowered position at least 3 A semiconductor manufacturing apparatus characterized in that it is provided individually .

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