JP3669997B2 - Semiconductor wafer polishing equipment - Google Patents

Description

The present invention relates to a semiconductor wafer polishing equipment, relates to a semiconductor wafer polishing equipment having a cleaning function particularly cleaning after polishing the semiconductor wafer to a flat mirror finish.

In recent years, as semiconductor devices are highly integrated, circuit wiring is becoming finer and the distance between wirings is becoming narrower. In particular, in the case of optical lithography of 0.5 μm or less, the depth of focus becomes shallow, so that the flatness of the imaging surface of the stepper is required.
Therefore, it is necessary to flatten the surface of the semiconductor wafer, and polishing is performed by a semiconductor wafer polishing apparatus as one means of this flattening method.

  Conventionally, this type of semiconductor wafer polishing apparatus has a turntable and a top ring that rotate at independent rotation speeds, and the top ring applies a constant pressure to the turntable, and between the turntable and the top ring. The surface of the semiconductor wafer is polished to a flat and mirror surface through the semiconductor wafer.

  In order to better polish the semiconductor wafer, a polishing liquid is usually supplied onto the polishing cloth on the turntable. As the polishing liquid, for example, a liquid containing an abrasive such as silicon oxide or cerium oxide having a particle diameter of 1 μm or less is used. In addition to water and abrasives, the polishing liquid contains a small amount of a dispersing agent to prevent agglomeration of the abrasive, and in addition to physical polishing action, acid, alkali, etc. are added to obtain chemical polishing action. May be included.

  On the polished semiconductor wafer, a large amount of abrasive material adheres and becomes dirty in addition to the wafer polishing powder. The number of contaminated particles immediately after polishing is about 100,000 / wafer, and it is desired to reduce this to 100 / wafer or less efficiently.

  A conventional semiconductor wafer polishing apparatus cannot be installed in a clean room because of the large amount of dust generated from the apparatus main body. Once the polished semiconductor wafer has been dried, once it has been dried, the dirt will not be removed. Therefore, immediately after polishing, the wafer was brought into a clean room with a special wafer carrier and washed with a wafer cleaner. .

  The conventional semiconductor wafer polishing apparatus is placed at a position away from the cleaning machine, and the polished semiconductor wafer is transported while being stored in water, so that the production efficiency in the clean room is poor.

  Also for the cleaning machine, the dust on the semiconductor wafer after polishing is so much that it contaminates the cleaning machine, so it is not possible to use the one installed in the conventional clean room, and a dedicated cleaning machine is required. Therefore, the equipment cost was high.

The present invention is a semiconductor wafer that can be installed in a clean room and can be discharged to the next process with a wafer carrier normally used in the clean room after cleaning and drying the polished semiconductor wafer without contaminating the clean room. and to provide a polishing equipment.

In order to achieve the above-described object, one aspect of a semiconductor wafer polishing apparatus of the present invention stores a polishing unit for polishing a semiconductor wafer and a cleaning unit for cleaning and drying the semiconductor wafer in a housing having a side wall, A semiconductor wafer polishing apparatus provided with a partition for separating the polishing unit and the cleaning unit and having a transport mechanism for transporting a polished semiconductor wafer from the polishing unit to the cleaning unit through an opening of the partition The casing has a rectangular planar shape, and the cassette for storing the semiconductor wafer before polishing and the cassette for storing the cleaned and dried semiconductor wafer after polishing are placed on the same side surface of the casing. An exhaust system for exhausting air from the polishing section separated by the partition is provided .

Here, a shutter for opening and closing the opening of the partition is provided.
Further, the polishing unit has a turntable.
The turntable is connected to a motor.
Further, the polishing unit has a top ring for holding the semiconductor wafer.
The top ring can be moved up and down.
The top ring is rotatable.

Further, the polishing unit includes an abrasive liquid supply nozzle.
Further, the polishing unit has a semiconductor wafer reversing machine.
The cleaning unit includes a primary cleaning device that performs primary cleaning of the semiconductor wafer and a secondary cleaning device that performs secondary cleaning of the semiconductor wafer.
In addition, a transport unit that transports the semiconductor wafer between the primary cleaning device and the secondary cleaning device is provided .
Further, an exhaust system for exhausting air independently from the polishing unit and the cleaning unit separated by the partition is provided.

Another aspect of the semiconductor wafer polishing device of the present invention is a semiconductor wafer polishing apparatus can be installed in the clean room; washing the semiconductor wafer; side wall and housing having; a polishing unit for polishing the semiconductor wafer A cleaning unit to be dried; a partition separating the polishing unit and the cleaning unit; an exhaust system exhausting from the polishing unit separated by the partition ; and the semiconductor wafer after polishing from the polishing unit A cleaning mechanism that performs sponge cleaning and rotary drying; the polishing unit, the cleaning unit, and the transport mechanism are housed in the housing ; The casing has a rectangular planar shape, and a cassette for storing a semiconductor wafer before polishing and a cassette for storing a cleaned and dried semiconductor wafer after polishing are placed on the same side of the casing. Wherein the Unisa was.

Here, the polishing unit has a turntable.
The turntable is connected to a motor.
Further, the polishing unit has a top ring for holding the semiconductor wafer.
The top ring can be moved up and down.
The top ring is rotatable.
Further, the polishing unit includes an abrasive liquid supply nozzle.

Further, the polishing unit has a semiconductor wafer reversing machine.
The cleaning unit includes a primary cleaning device that performs primary cleaning of the semiconductor wafer and a secondary cleaning device that performs secondary cleaning of the semiconductor wafer.
In addition, a transport unit that transports the semiconductor wafer between the primary cleaning device and the secondary cleaning device is provided.
In addition, an opening is formed in the partition, and the transport mechanism is configured to transport the polished semiconductor wafer from the polishing unit to the cleaning unit through the opening of the partition.
In addition, a shutter for opening and closing the opening of the partition wall is provided .
Further, an exhaust system for exhausting air independently from the polishing unit and the cleaning unit separated by the partition is provided.

Further, after the sponge cleaned in the cleaning unit, and saves the sponge, to stop the supply of the cleaning water, wherein said a semiconductor wafer rotating drying.

A preferred embodiment of the semiconductor wafer polishing apparatus of the present invention includes a polishing unit for polishing a semiconductor wafer by pressing the semiconductor wafer against a turntable while holding the semiconductor wafer by a top ring in a housing having a side wall, and a cleaning unit for cleaning the semiconductor wafer. Including a partition that separates between the polishing unit and the cleaning unit, and a transport mechanism that transports the polished semiconductor wafer from the polishing unit to the cleaning unit through the opening of the partition, An exhaust system is provided for exhausting air independently from the polishing section and the cleaning section.
Here, it is preferable to provide a shutter for opening and closing the opening of the partition wall.

According to a preferred aspect of the semiconductor wafer polishing apparatus of the present invention, a polishing unit that polishes a semiconductor wafer and a cleaning unit that cleans the semiconductor wafer are housed in a housing having a side wall and that can be installed in a clean room. A semiconductor wafer polishing apparatus provided with a transfer mechanism for transferring a semiconductor wafer in the body, wherein an exhaust system for exhausting the inside of the housing is provided so as to keep the pressure of the polishing unit lower than the pressure of the cleaning unit.
Here, the polishing unit preferably has a turntable.
The turntable is preferably connected to a motor.
The polishing unit preferably has a top ring for holding the semiconductor wafer.
The top ring is preferably movable up and down.
The top ring is preferably rotatable.
Further, it is preferable that the polishing section has an abrasive liquid supply nozzle.
Moreover, it is preferable that the polishing unit has a reversing machine for the semiconductor wafer.

A preferred embodiment of the semiconductor wafer polishing apparatus of the present invention is a semiconductor wafer polishing apparatus that can be installed in a clean room; a housing having a side wall; a polishing unit that polishes the semiconductor wafer; and a cleaning that cleans the semiconductor wafer A partition that separates between the polishing unit and the cleaning unit; a transport mechanism that transports the polished semiconductor wafer from the polishing unit to the cleaning unit; and the polishing unit, the cleaning unit, and The transport mechanism is housed in the housing.
Here, it is preferable that the cleaning unit includes a primary cleaning apparatus that performs a primary cleaning of the semiconductor wafer and a secondary cleaning apparatus that performs a secondary cleaning of the semiconductor wafer.
Furthermore, it is preferable that a transport means for transporting the semiconductor wafer is provided between the primary cleaning device and the secondary cleaning device.
Moreover, it is preferable that an opening is formed in the partition, and the transport mechanism is configured to transport the polished semiconductor wafer from the polishing unit to the cleaning unit through the opening of the partition.
Moreover, it is preferable to provide an exhaust system that exhausts air from the polishing section separated by the partition.
Moreover, it is preferable to provide an exhaust system that exhausts air independently from the polishing unit and the cleaning unit separated by the partition.

A preferred embodiment of the semiconductor wafer polishing method of the present invention is a semiconductor wafer polishing method in which a semiconductor wafer is polished and then cleaned, and a polishing apparatus is installed in a clean room, polished in a polishing section, and the polished semiconductor wafer is processed as a wafer. The arm is held on the support table, the arm holds the wafer, the arm passes through the opening of the partition wall, and the arm passes the wafer to the cleaning unit.
Here, it is preferable that a shutter is provided in the opening of the partition wall, and the shutter is opened when the arm holding the wafer passes through the opening.

A preferred embodiment of the semiconductor wafer polishing method of the present invention includes a polishing unit, a cleaning unit, a transport mechanism, and a partition that separates the polishing unit and the cleaning unit, and is installed in a clean room. A semiconductor wafer polishing method for polishing a semiconductor wafer by a semiconductor wafer polishing apparatus, comprising: a polishing step of polishing the semiconductor wafer by the polishing unit; and cleaning the polished semiconductor wafer by the cleaning unit A cleaning step; and a transfer step of transferring the polished semiconductor wafer from the polishing portion to the cleaning portion through an opening formed in the partition wall.
Here, it is preferable that the cleaning step includes a primary cleaning step of performing a primary cleaning of the semiconductor wafer and a secondary cleaning step of performing a secondary cleaning of the semiconductor wafer after the primary cleaning.
Further, it is preferable to exhaust air from the polishing section by an exhaust system.
In addition, it is preferable that air is exhausted independently from the polishing unit and the cleaning unit by an exhaust system.

A preferable aspect of the semiconductor device manufacturing method of the present invention includes a polishing unit, a cleaning unit, a transport mechanism, and a partition wall that separates the polishing unit and the cleaning unit, and is provided in a clean room. A semiconductor device manufacturing method for manufacturing a semiconductor device using a semiconductor wafer polishing apparatus installed; a polishing step of polishing the semiconductor wafer with the polishing unit; and cleaning the polished semiconductor wafer with the cleaning unit A cleaning step; and a transfer step of transferring the polished semiconductor wafer from the polishing portion to the cleaning portion through an opening formed in the partition wall.
Here, it is preferable that the cleaning step includes a primary cleaning step of performing a primary cleaning of the semiconductor wafer and a secondary cleaning step of performing a secondary cleaning of the semiconductor wafer after the primary cleaning.
Moreover, it is preferable that the partition be provided with a shutter that opens and closes the opening.
Further, it is preferable to exhaust air from the polishing section by an exhaust system.
In addition, it is preferable that air is exhausted independently from the polishing unit and the cleaning unit by an exhaust system.
Moreover, it is preferable to provide the process of carrying out the optical lithography process with respect to the said polished semiconductor wafer.

  According to the semiconductor wafer polishing apparatus of the present invention, the polishing section and the cleaning section are housed in a single body in a housing having a side wall, and the polishing section and the cleaning section are separated by the partition wall, so that the entire apparatus is placed in a clean room. It is possible to install the semiconductor wafer without contaminating the inside of the clean room, and then to clean the semiconductor wafer. Then, the dried semiconductor wafer can be discharged to the next process with a wafer carrier usually used in the clean room. In addition, the polishing unit and the cleaning unit are partitioned by a partition having a small opening for carrying the wafer, and an exhaust system is provided for exhausting air independently from the polishing unit and the cleaning unit, so that the polishing unit has a lower pressure than the cleaning unit. Since the shutter is provided at the opening of the partition wall, it is possible to prevent splashes and polishing powder generated in the polishing unit from entering the cleaning unit.

  According to the present invention, the polishing unit and the cleaning unit are housed in one body in a housing having a side wall, and the polishing unit and the cleaning unit are separated by the partition wall, so that the entire apparatus can be installed in the clean room. The semiconductor wafer can be polished and polished without contaminating the clean room, and the dried semiconductor wafer can be dispensed to the next process by the wafer carrier normally used in the clean room.

  Further, according to the present invention, the polishing unit and the cleaning unit are partitioned by the partition wall, the shutter provided in the partition wall, and the exhaust system for exhausting air independently from the polishing unit and the cleaning unit is provided. It is possible to prevent splashes and polishing powder generated in the case of entering the cleaning section.

  An embodiment of a semiconductor wafer polishing apparatus according to the present invention will be described below with reference to FIGS. FIG. 1 is an elevation view of the semiconductor wafer polishing apparatus, and FIG. 2 is a plan view of the semiconductor wafer polishing apparatus.

  1 and 2, reference numeral 1 denotes a housing having a side wall. The housing 1 houses a polishing unit 2 for polishing a semiconductor wafer and a cleaning unit 30 for cleaning the semiconductor wafer. . The polishing unit 2 and the cleaning unit 30 are separated by a partition wall 22.

The polishing unit 2 is provided with a polishing mechanism 6 including a turntable 3 and a top ring 5 that holds the semiconductor wafer 4 and presses it against the turntable 3. The turntable 3 on the upper surface thereof while being connected to the motor M ₁ is the polishing cloth 7 affixed. The top ring 5 is connected to a top ring head 8 and a top ring rotating motor M ₂ and the top ring lifting cylinders 11, the axial center of the rotating fairly with the top ring 5 is in a vertically movable It can be rotated. The top ring head 8 is movable to the left and right on the guide rail 9. The polishing cloth 7 is supplied with an abrasive liquid containing an abrasive from the abrasive liquid supply nozzle 10 on the upper surface thereof.

  On the other hand, the supply mechanism 12 for supplying the semiconductor wafer 4 to the polishing mechanism 6 includes a first wafer transfer mechanism 13, a wafer reversing machine 14, and a second wafer transfer mechanism 15. Then, the semiconductor wafer 4 is taken out from the wafer cassette 17 placed in the wafer cassette storage place 16 and transferred to the wafer reversing machine 14, and the semiconductor reversing machine 14 is reversed by the wafer reversing machine 14 so that the polishing surface is directed downward. The wafer 4 is received by the first wafer transfer mechanism 13 and transferred to the second wafer transfer mechanism 15.

  The second wafer transfer mechanism 15 includes a wafer holding member 19 and a wafer holding member lifting / lowering screw rod 20, and passes the semiconductor wafer 4 received from the first wafer transfer mechanism 13 to the top ring 5. Yes.

  The semiconductor wafer 4 held by the top ring 5 and pressed against the turntable 3 and polished is moved to the wafer support 21 by moving the top ring head 8 on the guide rail 9 while being held by the top ring 5 after polishing. It is conveyed to just above. Then, the semiconductor wafer 4 is detached from the top ring 5 and placed on the wafer support 21.

  An opening 22a is formed in the partition wall 22 that separates the polishing unit 2 and the cleaning unit 30, and a shutter 23 for opening and closing the opening 22a is provided adjacent to the opening 22a. Further, a wafer reversing machine 24 is installed adjacent to the partition wall 22. The wafer reversing machine 24 includes a wafer reversing shaft 25, a wafer reversing actuator 26, and a wafer reversing arm 27, and the reversing arm 27 is rotated by the actuator 26 via the reversing shaft 25.

  In the wafer reversing machine 24, the reversing arm 27 rotates to suck the semiconductor wafer 4 on the wafer support 21 when the shutter 23 is open, and then the reversing arm 27 reverses to hold the semiconductor wafer 4. Invert and convey to cleaning unit 30.

  The cleaning unit 30 includes a primary cleaning device 31 that performs primary cleaning of the semiconductor wafer 4 and a secondary cleaning device 40 that performs secondary cleaning of the semiconductor wafer 4. The primary cleaning device 31 includes a plurality of rollers 32 that rotate while holding the outer periphery of the semiconductor wafer 4, a cleaning sponge roller 33 that cleans the semiconductor wafer 4, and a cleaning water supply pipe 34. . The semiconductor wafer 4 is rotated by a rotational drive by a drive motor of some rollers while being held by a roller 32. The rotating cleaning sponge roller 33 is pressed against the rotating semiconductor wafer 4, and cleaning water is supplied thereto to perform the primary cleaning. Then, the semiconductor wafer 4 after the primary cleaning is transferred to the secondary cleaning apparatus 40 by the third wafer transfer mechanism 35.

  The third wafer transfer mechanism 35 includes a wafer holding table 36, a wafer holding member 37 provided on the wafer holding table 36, a wafer holding table rotating motor 38, and a wafer holding table lifting screw rod 39. . The wafer holding member 37 moves in the horizontal direction on the wafer holding table 36 as indicated by an arrow in the drawing, so that the semiconductor wafer 4 located away from the wafer holding table 36 can be delivered. The third wafer transfer mechanism 35 that has received the semiconductor wafer 4 after the primary cleaning retracts the wafer holding member 37 and moves the semiconductor wafer 4 above the wafer holding table 36, while the wafer holding table 36 rotates. The semiconductor wafer 4 is transferred to the secondary cleaning device 40 by lowering and pushing out the wafer holding member 37 again.

  The secondary cleaning device 40 includes a wafer holding table 41, a wafer holding table rotating motor 42, a cleaning sponge 43, and a cleaning water supply pipe 44. Then, cleaning water is supplied to the wafer surface from the cleaning water supply pipe 44 while rotating while supporting the semiconductor wafer 4 by the wafer holding table 41, and the cleaning sponge 43 is pressed to perform cleaning. After cleaning, the sponge 43 is withdrawn, the supply of cleaning water is stopped, the number of rotations of the rotary motor 42 is increased, the wafer holder 41 is rotated at high speed, and the semiconductor wafer 4 is spin-dried.

The wafer holding member 37 of the third wafer transfer mechanism 35 receives the semiconductor wafer 4 that has been subjected to the secondary cleaning and drying again, and moves the semiconductor wafer 4 above the wafer holding table 36, and then the wafer holding table 36 rotates. The wafer holding member 37 is pushed out and the semiconductor wafer 4 is accommodated in the polished wafer cassette 45.
The polishing unit 2 and the cleaning unit 30 are provided with exhaust ducts 46 and 47 for exhausting air independently from the polishing unit 2 and the cleaning unit 30.

Next, the operation of the semiconductor wafer polishing apparatus configured as described above will be described.
First, the semiconductor wafer 4 is taken out from the wafer cassette 17 placed in the wafer cassette place 16 by the tongue 13 a of the first transfer mechanism 13 and transferred to the wafer reversing machine 14. After the semiconductor wafer 4 is reversed by the wafer reversing machine 14 and the polishing surface is directed downward, the first transport mechanism 13 receives the semiconductor wafer 4 and transfers it to the second transport mechanism 15 again.

  Next, the top ring head 8 moves on the guide rail 9, the top ring 5 is positioned on the wafer holding member 19 of the second wafer transfer mechanism 15, and the wafer holding member 19 is raised and held. The semiconductor wafer 4 to be polished is transferred to the top ring 5.

  The top ring 5 moves while holding the semiconductor wafer 4 and is positioned at the polishing position on the turntable 3. Then, the turntable 3 and the top ring 5 rotate, and the abrasive liquid containing the abrasive is supplied from the abrasive liquid supply nozzle 10 onto the polishing cloth 7 adhered on the turntable 3, the top ring 5 is lowered, and the top The semiconductor wafer 4 held on the ring 5 is pressed against the polishing pad 7 for polishing.

  After polishing, the top ring head 8 moves while holding the semiconductor wafer 4, and the top ring 5 is positioned directly above the wafer support 21. Then, the semiconductor wafer 4 is detached from the top ring 5 and the semiconductor wafer 4 is placed on the wafer support 21. The top ring 5 moves toward the second wafer transfer mechanism 15 for the next polishing.

  When the polished semiconductor wafer 4 is placed on the wafer support 21, the shutter 23 opens, and the wafer reversing arm 27 of the wafer reversing machine 24 rotates and moves onto the semiconductor wafer 4 to attract the semiconductor wafer 4. .

  Due to the above rotation, the arm 27 holding the polished semiconductor wafer 4 rotates in the reverse direction, and passes the semiconductor wafer 4 to the primary cleaning device 31. The opening 22a of the partition wall 22 has a shape that allows the arm 27 holding the semiconductor wafer 4 to pass therethrough. When the semiconductor wafer 4 and the arm 27 pass through the opening 22a and move to the cleaning unit 30 side, the shutter 23 closes to close the opening 22a.

  After the semiconductor wafer 4 is transferred to the primary cleaning device 31 by the arm 27, the arm 27 is retracted downward. In the primary cleaning device 31, the semiconductor wafer 4 is rotated by the rotation of some of the rollers 32 while being held by the rollers 32. Then, the rotating cleaning sponge roller 33 is pressed against the rotating semiconductor wafer 4, and cleaning water is supplied from the cleaning water supply pipe 34 to perform primary cleaning.

  The semiconductor wafer 4 after the primary cleaning is received by the third wafer transfer mechanism 35. After receiving the semiconductor wafer 4, the wafer transfer mechanism 35 retracts the wafer holding member 37 to move the semiconductor wafer 4 above the wafer holding table 36, and the wafer holding table 36 is lowered while rotating, and the wafer holding member 37. The semiconductor wafer 4 is transferred to the secondary cleaning device 40 by pushing out again.

  In the secondary cleaning device 40, the cleaning water is supplied to the wafer surface from the cleaning water supply pipe 44 while rotating the semiconductor wafer 4 by the wafer holding table 41, and the cleaning sponge 43 is pressed to perform cleaning. After cleaning, the sponge 43 is withdrawn, the supply of cleaning water is stopped, the rotational speed of the rotary motor 42 is increased, the wafer holder 41 is rotated at a high speed, and the semiconductor wafer 4 is spin-dried.

  The wafer holding member 37 of the third wafer transfer mechanism 35 receives the semiconductor wafer 4 that has been subjected to the secondary cleaning and drying again, and moves the semiconductor wafer 4 above the wafer holding table 36, and then the wafer holding table 36 rotates. The wafer holding member 37 is pushed out and the semiconductor wafer 4 is stored in the polished wafer cassette 45.

  The polishing unit 2 and the cleaning unit 30 are partitioned by the partition wall 22 and the shutter 23 while the polishing and the cleaning are performed in the above-described process, so that the polishing abrasive liquid droplets and the polishing powder generated in the polishing unit 2 are cleaned. To prevent entering 30. In accordance with this structure, an exhaust system including exhaust ducts 46 and 47 is provided so that exhaust can be performed separately from the polishing unit 2 and the cleaning unit 30. Moreover, the shutter of the partition wall can be omitted by keeping the pressure of the polishing section lower than the pressure of the cleaning section.

1 is an elevation view showing an embodiment of a semiconductor wafer polishing apparatus according to the present invention. 1 is a plan view showing an embodiment of a semiconductor wafer polishing apparatus according to the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Housing | casing 2 Polishing part 3 Turntable 5 Top ring 6 Polishing mechanism 7 Polishing cloth 8 Top ring head 12 Supply mechanism 13 1st wafer conveyance mechanism 14 Wafer reversing machine 15 2nd wafer conveyance mechanism 17 Wafer cassette 22 Bulkhead 23 Shutter 24 Wafer Inversion machine 30 Cleaning unit 31 Primary cleaning device 35 Third wafer transfer mechanism 40 Secondary cleaning device 45 Polished wafer cassette 46, 47 Exhaust duct

Claims (26)

A polishing unit for polishing a semiconductor wafer and a cleaning unit for cleaning and drying the semiconductor wafer are housed in a housing having a side wall, and a partition for separating the polishing unit and the cleaning unit is provided. A semiconductor wafer polishing apparatus provided with a transfer mechanism for transferring a polished semiconductor wafer from the polishing unit to the cleaning unit through an opening, the housing having a rectangular planar shape, An exhaust system for exhausting from the polishing part separated by the partition, wherein a cassette for storing semiconductor wafers and a cassette for storing semiconductor wafers cleaned and dried after polishing are placed on the same side of the housing. semiconductor wafer polishing apparatus characterized by comprising.   2. The semiconductor wafer polishing apparatus according to claim 1, further comprising a shutter for opening and closing the opening of the partition wall.   The semiconductor wafer polishing apparatus according to claim 1, wherein the polishing unit includes a turntable.   4. The semiconductor wafer polishing apparatus according to claim 3, wherein the turntable is connected to a motor.   The semiconductor wafer polishing apparatus according to claim 1, wherein the polishing unit includes a top ring for holding the semiconductor wafer.   6. The semiconductor wafer polishing apparatus according to claim 5, wherein the top ring can be moved up and down.   The semiconductor wafer polishing apparatus according to claim 5, wherein the top ring is rotatable.   The semiconductor wafer polishing apparatus according to claim 1, wherein the polishing unit includes an abrasive liquid supply nozzle.   The semiconductor wafer polishing apparatus according to claim 1, wherein the polishing unit includes a reversing device for the semiconductor wafer.   10. The device according to claim 1, wherein the cleaning unit includes a primary cleaning device that performs a primary cleaning of the semiconductor wafer, and a secondary cleaning device that performs a secondary cleaning of the semiconductor wafer. Semiconductor wafer polishing equipment.   The semiconductor wafer polishing apparatus according to claim 10, further comprising a transfer unit that transfers the semiconductor wafer between the primary cleaning apparatus and the secondary cleaning apparatus.   12. The semiconductor wafer polishing apparatus according to claim 1, further comprising an exhaust system that exhausts air independently from the polishing unit and the cleaning unit separated by the partition wall. A semiconductor wafer polishing apparatus that can be installed in a clean room;
A housing having side walls;
A polishing section for polishing the semiconductor wafer;
A cleaning section for cleaning and drying the semiconductor wafer;
A partition wall separating the polishing unit and the cleaning unit;
An exhaust system exhausting from the polishing section separated by the partition;
A transport mechanism for transporting the semiconductor wafer after polishing from the polishing unit to the cleaning unit;
The cleaning unit has a cleaning device that performs sponge cleaning and rotary drying;
The polishing section, the cleaning section and the transport mechanism are housed in the housing ;
The casing has a rectangular planar shape, and a cassette for storing a semiconductor wafer before polishing and a cassette for storing a semiconductor wafer cleaned and dried after polishing are placed on the same side of the casing. characterized in that the;
Semiconductor wafer polishing equipment. 14. The semiconductor wafer polishing apparatus according to claim 13, wherein the polishing unit has a turntable. 15. The semiconductor wafer polishing apparatus according to claim 14, wherein the turntable is connected to a motor. Semiconductor wafer polishing apparatus according to any one of claims 13 to 15 in the polishing section and having a top ring for holding the semiconductor wafer. 17. The semiconductor wafer polishing apparatus according to claim 16, wherein the top ring is movable up and down. Semiconductor wafer polishing apparatus according to claim 16 or 17 wherein said top ring is rotatable. Semiconductor wafer polishing apparatus according to any one of claims 13 to 18, characterized in that the said polishing unit has the abrasive liquid supply nozzle. Semiconductor wafer polishing apparatus according to any one of claims 13 to 19 in the polishing section and having a reversing machine of the semiconductor wafer. The cleaning unit includes a primary cleaning device for performing primary cleaning of the semiconductor wafer, and a second cleaning apparatus for performing secondary cleaning of the semiconductor wafer, according to any one of claims 13 to 20 Semiconductor wafer polishing equipment. The semiconductor wafer polishing apparatus according to claim 21 , further comprising a transfer unit that transfers the semiconductor wafer between the primary cleaning apparatus and the secondary cleaning apparatus. Said partition wall is opening is formed, the transport mechanism was composed of the semiconductor wafer after polishing through an opening of the partition wall so as to convey from the polishing section to the cleaning section, claims 13 to 22 The semiconductor wafer polishing apparatus according to any one of the above. 24. The semiconductor wafer polishing apparatus according to claim 23, further comprising a shutter that opens and closes the opening of the partition wall. Characterized by providing an exhaust system that exhausts independently from the cleaning unit and separated the polishing portion by the partition wall, a semiconductor wafer polishing apparatus according to any one of claims 13 to 24. After the sponge washed before Symbol cleaning unit, and saves the sponge, to stop the supply of the cleaning water, the semiconductor wafer polishing device of claim 13, wherein the said semiconductor wafer rotary translocated dried.

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