JP3665772B2 - Manufacturing method of composite electroformed metal mold - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for producing a kind of electroformed metal mold, in particular, a kind of method for producing a composite electroformed metal mold, in which the bonding interface is firm, the processing is fast, and it is not easily deformed at high temperatures and It has an effect.
[0002]
[Prior art]
Each of the conventional methods of joining an electroformed metal plate formed by an electroforming method and a die steel core has its drawbacks.
The vacuum suction method can achieve the thickness of the electroformed plate necessary for high speed, but the manufacture of the mold requires considerable precision, and also requires vacuum equipment. Have difficulty.
[0003]
When the flame injection welding or laser welding method is used, the electroformed metal plate is deformed and the surface contour of the electroformed metal plate is destroyed.
Also, when using the mechanical fitting or bolting method, the electroformed metal plate requires a considerable thickness, so the electroforming time is considerably long.
[0004]
For example, when an electroformed metal plate having a sufficient thickness is formed by a conventional electroforming method, for example, when the thickness is 3 mm (3000 μm), the deposition growth rate is calculated at 0.4 μm / min. Since it is a unidirectional deposition, theoretically, 7500 minutes are required, and if converted, 125 hours are required. This corresponds to 5.2 days and is very time consuming. In addition, after electroforming is completed, internal stress accumulates in a thick layer and may be easily deformed.
[0005]
Please refer to Fig.1. The electroformed substrate 91 has a designed and manufactured plastic mold core 92 with insulating plates 93 on both sides thereof, and this original very thin electroformed metal plate 80 completes electroforming. After that, it is considerably thicker (for example, thicker from several hundred μm to 3 mm). The internal stress at this time easily causes a defect of deformation after being accumulated. FIG. 1 shows an exaggerated illustration intention.
[0006]
[Problems to be solved by the invention]
For this reason, it is necessary to research and develop a new manufacturing method to solve the above-mentioned drawbacks.
That is, the object of the present invention is to provide a composite electroformed metal mold that has a solid joining interface after joining and can significantly reduce the manufacturing time of the mold, and can achieve the effect of not easily deforming at high temperatures. It is to provide a manufacturing method.
[0007]
[Means for Solving the Problems]
The present invention has been made to solve the above-described problems, and a manufacturing method thereof includes the following steps.
First, the metal material preparation step.
2. Preparation step of electroformed metal plate and plastic mold core and electroformed substrate.
[0008]
Three, power supply preparation steps.
4. Electroforming deposition layer forming step.
Five, mold release step.
In the manufacturing method provided as described above, a metal material having a considerable thickness is skillfully used, and electroforming deposition is simultaneously performed on both coupling surfaces in the inner direction (both directions). The bonded interface after the bonding is firm, and the manufacturing time of the mold can be greatly shortened, and the object of the effect of not easily deforming at high temperatures can be achieved.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
Please refer to Figure 2. The steps of a method of manufacturing a type of composite electroformed metal mold according to an embodiment of the present invention include the following.
First, metal material preparation step 11.
[0010]
2. Preparation step 12 of the electroformed metal plate and plastic mold core and the electroformed substrate.
3. Power supply preparation step 13.
4. Step 14 of forming an electroformed sediment layer.
5. Mold release step 15.
[0011]
Each step of the present embodiment will be described in detail below.
First, metal material preparation step 11: Please refer to FIG. One metal material 20 (which may be steel or copper) having a predetermined thickness and capable of conducting is prepared. The metal material 20 has one slightly protruding first bonding surface 21, the other surface is covered with one insulating layer 22, and the thickness of the metal material 20 exceeds a minimum of 1 mm. At times, pinch the tool.
[0012]
2. Preparation of electroformed metal plate / plastic core and electroformed substrate Step 12: One electroformed metal plate 30 having an average thickness of less than 500 μm is prepared. There is one second coupling surface 31 corresponding to one coupling surface 21 and one machining surface 32. The machining surface 32 of the electroformed metal plate 30 has one non-conductive plastic core 40 and one machining surface 32. A non-conductive electroformed substrate 50 is coupled. These three parties are joined together for a while. The processed surface 32 of the electroformed metal plate 30 has a structure for forming a predetermined shape or a specific outer shape pattern (for example, one specific microstructure, and a light guide module is formed in a later process) ) Structure is provided.
[0013]
3. Power supply preparation step 13: Two power supplies 60, 70 are prepared, and each power supply has one cathode 61, 71 and one anode 62, 72.
4. Electroforming deposition layer forming step 14: Please refer to Fig.3, Fig.4 and Fig.5. Electroforming is performed by bringing the first coupling surface 21 and the second coupling surface 31 protruding slightly into contact with each other in a predetermined small area. When performing electroforming, the anodes 62 and 72 of the two power sources 60 and 70 are connected to one electroforming material source 80 (for example, nickel), and at the time of electroforming, the metal material 20 and the electroformed metal are connected. The plate 30 is connected to the cathodes 61 and 71 of the two power sources 60 and 70 simultaneously. The two gradually deposit in the space between the first bonding surface 21 of the metal material 20 and the second bonding surface 31 of the electroformed metal plate 30 at the same time. Please refer to Fig.5 and Fig.6. The metal material 20 and the electroformed metal plate 30 are tightly coupled to each other by the newly formed electroformed deposition laminate 15 due to the increase in the thickness of the deposit in both directions and the bonding force between the metals, The metal material 20, the electroformed deposit 15, the electroformed metal plate 30, the plastic core 40, and the nonconductive electroformed substrate 50 are joined together in order.
[0014]
5. Mold release step 15: Please refer to Fig.7. The non-conductive plastic core 40 and the electroformed substrate 50 are removed (including the insulating layer 22), that is, the original processing surface 32 is retained on the electroformed metal plate 30 by mold release, and this electroformed sedimentation is performed. 15 is tightly joined to the metal material 20 to form one composite electroformed metal mold.
[0015]
More specifically, the material of the electroformed substrate 50 can be selected from one non-conductive material among silicon, silicon dioxide, glass, quartz, plastic or epoxy resin.
In practice, when processing a precision fitting such as a liquid crystal screen (LCD) on a light guide module, the thickness of the metal material is about 2 to 3 mm, and the thickness of the electroformed metal plate is 250 to 350 μm.
[0016]
Naturally, the first coupling surface 21 can be changed to one slightly protruding conical surface as shown in FIG. 8, and the second coupling surface 31 is a single plane, and gradually gradually from a small area contact. Sedimentation is performed.
In addition to the light guide module described above, the present invention can be applied to related industries. For example, a lamp module of a four-wheeled vehicle or a motorcycle needs a minute pattern on the surface thereof (this allows the diffusion of light atomization to pass through). It is also applied to all laser photos.
[0017]
The above-described embodiment has the following advantages and effects.
(1) The interface between the bonds is solid. Since the bonding force of the electroformed sedimentation layer 15 is a bonding force between metals inside the material, the metal material 20 and the electroformed metal plate 30 can be fixed sufficiently firmly. The service life of the cast metal mold can be improved.
[0018]
(2) Processing is fast. The main thickness portion (assuming that it is for 2.5 mm clamping) is provided from the existing metal material 20, and the required thickness of the electroformed deposit is very small. If it is 0.5 mm and the deposition growth rate is calculated at 0.4 μm per minute, this embodiment grows inward with respect to the two inner surfaces at the same time. The length is 250 μm (0.25 mm), and dividing this by 0.4 μm / sec theoretically requires 625 minutes (about 10.4 hours). Since the time required to deposit 3 mm (2.5 + 0.5 mm) of electroformed deposition in all the conventional processes is 7500 minutes (approximately 125 hours, equal to 5.2 days), the processing speed of this example is The processing speed of the metal mold can be greatly shortened by about 12 times faster than the processing speed of the prior art.
[0019]
(3) Does not easily deform at high temperatures. Since the bonding interface according to the present embodiment is a combination of metal and metal electroforming deposition, after bonding, it has high temperature resistance during post-processing and does not easily deform.
Although the foregoing has described the invention in detail with relatively good embodiments, it is particularly emphasized that all simple modifications and variations made to the embodiments will be found in the spirit and scope of the invention.
From the above detailed description, it is clear that an engineer who is familiar with the technology of the present invention can surely achieve the above-mentioned object, and is consistent with the provisions of the Patent Law. hand in.
[Brief description of the drawings]
FIG. 1 is a schematic view showing a state where an electroformed metal mold is deformed by a conventional method. FIG. 2 is a schematic view showing a flow of a method of manufacturing a composite electroformed metal mold according to an embodiment of the present invention. It is.
FIG. 3 is a schematic view showing an assembled state before electroforming in a method for producing a composite electroformed metal mold according to an embodiment of the present invention.
FIG. 4 is an enlarged view (1) showing a local part during electroforming in a method for producing a composite electroformed metal mold according to an embodiment of the present invention.
FIG. 5 is an enlarged view (2) showing a local part during electroforming in a method for producing a composite electroformed metal mold according to an embodiment of the present invention.
FIG. 6 is a schematic view showing a state of completion of electroforming in a method for producing a composite electroformed metal mold according to an embodiment of the present invention.
FIG. 7 is a schematic view showing a state after a release step in a method for manufacturing a composite electroformed metal mold according to an embodiment of the present invention.
FIG. 8 is an enlarged view showing a local part in a method of manufacturing a composite electroformed metal mold according to another embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 11 Metal material preparation step 12 Electroforming metal plate and plastic mold core and electroforming substrate preparation step 13 Power supply preparation step 14 Electroforming deposition forming step 15 Mold release step 20 Metal material 21 First bonding surface 22 Insulating layer 30 Electroformed metal plate 31 Second bonding surface 32 Processing surface 40 Plastic core 50 Electroformed substrate 60, 70 Power supply 61, 71 Cathode 62, 72 Anode 90 Electroformed metal plate 91 Electroformed substrate 92 In plastic mold Child 93 Insulation plate

Claims (5)

A method of manufacturing a type of composite electroformed metal mold, including the following steps:
(1) In the metal material preparation step, a metal material having a predetermined thickness and being conductive is prepared, the metal material has a slightly protruding first bonding surface, and the other surface is covered with an insulating layer, The thickness of the metal material exceeds 1 mm,
(2) The step of preparing the electroformed metal plate and the plastic mold core and the electroformed substrate is to prepare an electroformed metal plate having an average thickness of less than 500 μm, and the electroformed metal plate includes the first bonding surface. A non-conductive plastic mold core and a non-conductive electroformed substrate are bonded to each other on the processed surface of the electroformed metal plate and bonded together for a while. On the processed surface of the cast metal plate, a structure for forming a predetermined shape, or a structure for forming a specific external pattern is provided,
(3) The power supply preparation step prepares two power supplies, each power supply has a cathode and an anode,
(4) The step of forming the electroformed sedimentation layer is carried out when the slightly protruding first bonding surface and the second bonding surface are brought into contact with each other in a predetermined small area, and the electroforming is performed. The anodes of two power sources are connected to the electroforming material source, and at the time of electroforming, the metal material and the electroformed metal plate are simultaneously connected to the cathodes of the two power sources. It is deposited in the space between the bonding surface and the second bonding surface of the electroformed metal plate, and the thickness of the deposit in both directions becomes larger and the bonding force between the metals, and the metal material and the electroforming The metal plate, the electroformed deposit layer, the electroformed metal plate, the plastic core, and the non-conductive electroformed substrate are joined together in sequence by tightly bonding the metal plate to the electroformed deposit layer. ,
(5) The mold release step is a mold release that removes the non-conductive plastic mold core and the electroformed substrate, holds the original processing surface of the reverse casting on the electroformed metal plate, A method for producing a composite electroformed metal mold, characterized in that the composite electroformed metal mold is formed by tightly joining a metal material. 2. The composite electroformed metal mold according to claim 1, wherein the material of the electroformed substrate is one non-conductive material selected from silicon, silicon dioxide, glass, quartz, plastic or epoxy resin. Method. 2. The method of manufacturing a composite electroformed metal mold according to claim 1, wherein the metal material has a thickness of 2 mm to 3 mm, and the electroformed metal plate has a thickness of 250 [mu] m to 350 [mu] m. 2. The method of manufacturing a composite electroformed metal mold according to claim 1, wherein the first bonding surface is a slightly protruding arc surface, and the second bonding surface is a flat surface. 2. The method of manufacturing a composite electroformed metal mold according to claim 1, wherein the first bonding surface is a slightly protruding conical surface, and the second bonding surface is a flat surface.

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