JP3654496B2 - Power converter - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a power conversion device including a plurality of power semiconductor elements, a heat pipe type cooler for cooling power semiconductor elements, a conductor, and other electrical appliances.
[0002]
[Prior art]
In recent years, an increase in heat generation loss has become a problem with power converters as the capacity and speed of power semiconductor elements increase. For this reason, it is an important technical problem to improve the cooling efficiency of the cooling device for power semiconductor elements, cope with the increase in heat loss, and avoid the enlargement of the device.
FIG. 11 shows the configuration of a self-cooling type power converter using a heat pipe type cooler. As shown in the figure, the power converter includes a heat pipe cooler 3 that is a cooler, a power semiconductor element 4, an electrical product 23 such as a conductor, a frame 24, and the like as main components.
As shown in FIG. 11, the heat pipe type cooler 3 mainly includes the heat receiving portion 10 that contacts the power semiconductor element 4, the heat pipe 19, and the radiation fins 17. The heat radiating fins 17 are arranged perpendicular to the heat pipe 19.
In the case of a self-cooling type power converter that does not have a forced cooling system such as a fan and that cools by natural convection due to this shape, each fin is arranged so that the radiating fins 17 of the heat pipe cooler 3 are horizontal. Air stagnates between them, and cooling efficiency falls.
Therefore, the arrangement of the heat pipe cooler 3 is generally arranged laterally with a certain angle in consideration of liquid return of the encapsulated refrigerant as shown in FIG.
[0003]
The power converter configured as described above is often used for applications such as inverters and rectifiers, and is indispensable in the power field.
[0004]
[Problems to be solved by the invention]
However, in the self-cooling type power conversion device using the conventional heat pipe type cooler, the arrangement is limited due to the characteristic of the shape of the radiating fin of the heat pipe type cooler as described above, as shown in FIG. Since the heat dissipating fins are arranged as vertical as possible, the shape of the apparatus greatly depends on the shape of the heat pipe cooler.
In addition, considering the configuration of the main circuit and the space saving of the device, when adopting a configuration in which the stack constituting the main circuit is stacked upward, the temperature rise during operation of the device varies depending on each stage. The structure in the height direction of the apparatus has been increased in size because it has to take a structure that makes the cooling capacity of each stage uniform.
Further, in order to cope with an increase in capacity, a heat pipe type cooler and a power semiconductor element are alternately connected in parallel to constitute a main circuit, so that the size of the apparatus is further increased.
For the reasons as described above, the arrangement method and shape dimensions of the heat pipe type cooler have been a big problem when the entire apparatus is downsized.
Therefore, in order to solve these problems, it is conceivable to use a vertically arranged heat pipe type cooler that performs cooling by natural convection.
By the way, in a power conversion device using a vertically arranged heat pipe type cooler, when arranging a plurality of semiconductor stacks composed of a power semiconductor element and a vertically arranged type heat pipe type cooler, these maintainability and work It is necessary to improve the performance.
[0005]
Further, there is a demand for further downsizing of a power conversion device using such a vertically arranged heat pipe type cooler.
The present invention has been made in view of these points, and an object thereof is to provide a power conversion device with improved maintainability and workability.
It is another object of the present invention to provide a power conversion device that can be downsized.
[Means for Solving the Problems]
In order to achieve the above object, the present invention according to claim 1 is a power having a plurality of semiconductor stacks composed of a power semiconductor element and a vertically arranged heat pipe type cooler for cooling the power semiconductor element. The conversion device is characterized in that a plurality of semiconductor stacks are arranged with a step so that the lower one is at the center .
With such a configuration, visual observation from both maintenance surfaces becomes possible. This improves work efficiency in equipment maintenance and inspection and contributes to early detection of abnormalities. Also, work efficiency is improved in operations such as device assembly and repair.
According to a second aspect of the present invention, there is provided the power conversion device according to the first aspect, wherein the vertically arranged heat pipe cooler is provided in a heat receiving portion of each vertically arranged heat pipe cooler in each semiconductor stack . An insulator for securing a creeping insulation distance between them is provided.
[0006]
With such a configuration, it is possible to ensure a creeping insulation distance between the vertically arranged heat pipe type coolers.
According to a third aspect of the present invention, in the power conversion device according to the first aspect, a plurality of vertically arranged heat pipe type coolers in each semiconductor stack are alternately arranged one by one in the vertical direction. It is characterized by being arranged in a state inclined in the opposite direction .
With such a configuration, it is possible to eliminate the interference of the heat dissipating fins of the vertically arranged heat pipe cooler and to reduce the size of the semiconductor stack.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following drawings, the same symbols indicate the same or corresponding parts.
[0008]
(First embodiment)
A power converter according to a first embodiment of the present invention will be described with reference to FIGS. 1 and 2.
1A and 1B are diagrams showing a configuration of a semiconductor stack, in which FIG. 1A is a front view and FIG. 1B is a side view of a part thereof. FIG. 2 is a diagram showing the configuration of the power conversion apparatus according to the present embodiment. FIG. 2A shows an arrangement when the semiconductor stack is three rows, and FIG. 2B shows an arrangement when the semiconductor stack is four rows. FIG.
In this embodiment, the semiconductor stack 2 installed inside the power conversion device 1 is installed with a step.
As shown in FIG. 1, the semiconductor stack 2 includes a combination of a heat pipe type cooler 3 and a power semiconductor element 4. The heat pipe type cooler 3 is a vertically arranged heat pipe type cooler. For example, a plurality of heat radiating fins are inclined at a predetermined angle from the horizontal direction with respect to the heat radiating fins as a whole or a part thereof. It is installed in such a state.
And when the semiconductor stack 2 is arrange | positioned over 3 rows, as shown to Fig.2 (a), it arrange | positions from the maintenance surface of the both sides of the power converter device 1 by arrange | positioning the center semiconductor stack 2 below. Visual inspection is possible. This improves work efficiency in equipment maintenance and inspection and contributes to early detection of abnormalities. In addition, work efficiency is improved in work such as assembly and repair of the apparatus.
[0009]
Further, when the semiconductor stack 2 is arranged in four rows, the same effect can be obtained by arranging the middle two rows downward as shown in FIG. 2B.
When the number of semiconductor stacks 2 is two, especially when the maintenance surface is limited to one side and there is no maintenance space, the same effect can be obtained by arranging the steps as described above.
As for the arrangement of five or more rows of the semiconductor stack 2, the same effect can be obtained by arranging the semiconductor stack 2 so as to become downward as it goes to the center, as in the above case.
Further, according to this arrangement method, the distance between the semiconductor stack 2 and the upper surface of the power converter 1 is increased. Thereby, what is called a chimney effect is acquired and the improvement of the cooling performance as the power converter device 1 is also realizable.
The installation position and installation method of the semiconductor stack 2 are not limited to the above-described configuration because the arrangement differs depending on the main circuit configuration, that is, the number of the semiconductor stacks 2.
[0010]
(Second Embodiment)
Next, the power converter device which concerns on the 2nd Embodiment of this invention is demonstrated using FIG.3 and FIG.4.
FIG. 3 is a perspective view showing the configuration of the power conversion device of this embodiment. 4A and 4B are diagrams showing the configuration of the ventilation mechanism, where FIG. 4A is a partial front view thereof, and FIG. 4B is a partial cross-sectional view thereof.
In the present embodiment, for example, a power conversion device as in the first embodiment is provided with a ventilation mechanism that opens and closes depending on temperature and humidity.
That is, as shown in FIG. 3, the power conversion device 1 installed outdoors is provided with a ventilation mechanism 7 that automatically opens and closes.
The power conversion apparatus 1 installed outdoors often has a completely sealed structure or a sealed structure except for a heat dissipation portion of a cooler that dissipates a loss generated from the main circuit. The structure shown in FIG. 3 is the latter structure, and the upper part of the power converter 1 is an open part 5 and the lower part is a sealed part 6.
These sealed structures are designed to prevent electrical insulation and corrosion of parts with potential, especially the main circuit, and prevent factors that may cause performance deterioration such as rainwater, humidity, salt, and dust. It is carried out for the purpose.
The problem with this sealed structure is that the performance of the sealed internal equipment and cooler is greatly influenced by changes in the outside air temperature and internal temperature rise due to irradiation with sunlight.
[0011]
Therefore, in the present embodiment, a ventilation mechanism 7 that automatically opens and closes according to the temperature and humidity is provided for the sealed portion 6, thereby suppressing an increase in the temperature inside the sealed interior and reducing the performance of the cooler. Can be prevented.
In addition, in order to solve the problems such as insulation, dust proofing and rust proofing, as shown in FIG. 4, a vent 9 of the ventilation mechanism 7 provided in the sealed portion 6 is provided with a fence 9 for preventing rainwater from entering, The ventilation amount is adjusted by the movable slit member 8 arranged inside. That is, as shown in FIG. 4, when the position of the ventilation portion of the kite 9 and the position of the ventilation portion of the movable slit member 8 are substantially opposite to each other, the ventilation amount becomes large, and the movable slit member 8 is When the position of the ventilation portion of the eaves 9 and the position of the ventilation portion of the movable slit member 8 are shifted from each other by moving up or down, the amount of ventilation becomes small. Therefore, the movable slit member 8 is moved up and down. The ventilation volume can be adjusted. In addition, a further effect can be obtained by providing a filter or the like in the ventilation portion of the movable slit member 8.
The ventilation mechanism 7 is a mechanism that opens and closes according to temperature and humidity, but the structure and method thereof are not limited. Further, since the ventilation amount varies depending on the rating of the device and the environmental temperature, the size and shape of the ventilation port are not limited.
[0012]
Note that this embodiment is not applied to a power converter having a structure in which a casing is sealed and a gas or the like for the purpose of internal insulation is filled.
Hereinafter, third to sixth embodiments of the present invention will be described. These third to sixth embodiments are, for example, heat used in the power conversion devices of the first and second embodiments described above. The present invention relates to a pipe type cooler.
In addition, the heat pipe type cooler used in the power converters of the first and second embodiments and the heat pipe type cooler in the third to sixth embodiments have a shape in which the entire radiating fin or a part thereof is inclined. It has a natural cooling and enables vertical arrangement.
[0013]
(Third embodiment)
Next, a heat pipe type cooler according to a third embodiment of the present invention will be described with reference to FIG.
FIGS. 5A and 5B show the configuration of the heat pipe type cooler of the present embodiment. FIG. 5A is a front view thereof, and FIG. 5B is a plan view thereof.
In this embodiment, an insulating portion is provided in the heat receiving portion of the heat pipe type cooler.
In the assembly of a semiconductor stack composed of a plurality of semiconductor elements and a heat pipe type cooler, etc., this makes it possible to heat the semiconductor stack composed of a plurality of power semiconductor elements and a plurality of heat pipe type coolers. The creeping insulation distance between the devices can be secured.
In assembling the large heat pipe type cooler 3 used in the power converter 1, it is effective to slide and move it by using the guide rail 12 or the like in order to improve workability as shown in the figure. Although it is a means, the insulation distance between each heat pipe type cooler 3 which has touched the guide rail 12 in this case becomes a problem. Therefore, the creeping insulation distance is ensured by providing the insulating portion 11 at the portion where the heat receiving portion 10 is in contact with the guide rail 12.
Further, by selecting a slippery material with less mechanical friction as the insulator of the insulating portion 11, workability can be further improved.
[0014]
However, the material and shape of the insulator are not limited.
Furthermore, even when the guide rail 12 is made of an insulating material, the creeping insulation distance can be further ensured by providing the insulating portion 11 at a portion where the heat receiving portion 10 is in contact with the guide rail 12.
[0015]
(Fourth embodiment)
Next, the 4th Embodiment of this invention is described using FIG.6 and FIG.7.
FIG. 6 is a front view showing the configuration of the heat pipe type cooler of the present embodiment. FIG. 7 is a side view showing a part of the semiconductor stack.
In the present embodiment, as shown in FIG. 6, a through hole 13 is provided in the heat receiving portion 10 of the heat pipe type cooler 3.
As shown in FIG. 7, the semiconductor stack includes a plurality of heat pipe type coolers 3 and a plurality of power semiconductor elements 4, a holding plate 14, a rod 15 such as a bolt, and a fastening part 16 such as a nut. Adopt a structure to tighten by.
In this way, by assembling the bar 15 through the through-hole 13 provided in the heat receiving part 10 of the heat pipe cooler 3, the arrangement of each component of the semiconductor stack can be fixed, so that the assembly work efficiency is improved and the drop Safety is also improved by the prevention effect.
The shape of the through hole 13 is not limited.
(Fifth embodiment)
Next, a fifth embodiment of the present invention will be described with reference to FIG.
FIGS. 8A and 8B show the configuration of the semiconductor stack in this embodiment. FIG. 8A is a front view thereof, and FIG. 8B is a side view of a part thereof. FIGS. 3C and 3D are diagrams for explaining a configuration example of the heat radiation fins in the portion A of the heat pipe type cooler which is a component of the semiconductor stack.
[0016]
In the present embodiment, the heat pipe cooler 3 that is a component of the semiconductor stack is tilted, and the heat fins of the heat pipe cooler 3 are not interfered with each other by tilting the heat pipe cooler 3 alternately to the opposite side. At the same time, the semiconductor stack can be miniaturized.
When a plurality of power semiconductor elements 4 and heat pipe coolers 3 are arranged in series, heat and electrical insulation are required, and the heat radiation fins 17 should not be brought into contact with each other. Therefore, if mutual contact cannot be avoided even if the shape of the heat pipe cooler 3 is taken into consideration, it is necessary to prevent the contact by inserting the spacer 18 or the like, but this increases the size of the semiconductor stack.
On the other hand, as shown in FIGS. 8A and 8B, the heat pipe type cooler 3 is inclined at a certain angle with respect to the vertical, and the heat radiating fins are alternately inclined in the opposite direction one by one. The contact of 17 can be prevented and the apparatus can be miniaturized.
Further, the heat dissipating fins 17 attached to the heat pipe 19 of the heat pipe cooler 3 are vertically arranged because the whole or a part thereof has an inclined shape as shown in FIG. 8 (c) or (d). Although it is possible, by inclining the heat pipe type cooler 3 itself, the inclination angle of the radiating fins 17 is increased, and the loss in the flow between the radiating fins 17 is reduced, so that the performance is greatly improved.
[0017]
The inclination angle of the heat pipe type cooler 3 is not limited because it depends on the inclination angle of the radiating fins 17. Further, the shape of the heat dissipating fins 17 is a shape necessary for enabling vertical arrangement, and the shape is not limited.
However, as shown in FIG. 8 (a), it is effective to have the radiating fins 17 inclined in the same direction as the inclination direction of the heat pipe cooler, but the heat having the radiating fins inclined in the orthogonal direction. Pipe coolers are not suitable.
[0018]
(Sixth embodiment)
Next, a sixth embodiment of the present invention will be described with reference to FIGS.
FIG. 9 shows the configuration of the heat pipe type cooler of this embodiment. FIG. 9 (a) is a plan view thereof, FIG. 9 (b) is a front view thereof, and FIG. 9 (c) is a portion A thereof. It is a front view which shows the detailed structure of these. FIG. 10 is a diagram for explaining the details of the support structure. FIG. 10A is a plan view thereof, and FIG. 10B is a front view thereof.
In the present embodiment, for example, the support mechanism 20 that fixes the heat pipe type cooler 3 of the fifth embodiment to the frame of the power conversion device has a spherical shape, so that the inclination angle to be installed has a degree of freedom. Thus, the force generated in the heat pipe 19 can be suppressed.
When installing the heat pipe type cooler 3 in the power converter, it is necessary to support at least the upper and lower ends. Therefore, if it is completely fixed at both ends, a stress is generated on the heat pipe 19 even in a normal state, and a larger force is generated due to vibration of the power conversion device or the heat pipe cooler due to some factor. It will be.
On the other hand, as shown in FIG. 10, the support mechanism 20 is passed through a long hole 22 provided in a support plate 21 supported at both ends by a pair of guide rails (not shown) having an L-shaped cross section. Since the mechanism 20 is movable in the direction of the arrow shown in the drawing, an effect of suppressing the initial stress value generated during assembly can be obtained.
[0019]
The shape and material of the support mechanism 20 are not limited.
[0020]
【The invention's effect】
According to the present invention, the maintainability and workability of a power conversion device using a vertically arranged heat pipe type cooler that performs cooling by natural convection is improved, and the device can be greatly downsized. It is possible to provide a power conversion device that can reduce the scale.
[Brief description of the drawings]
FIG. 1 is a diagram showing a configuration of a semiconductor stack according to a first embodiment of the present invention.
FIG. 2 is a diagram showing a configuration of a power conversion device according to the first embodiment of the present invention.
FIG. 3 is a diagram showing a configuration of a power conversion device according to a second embodiment of the present invention.
FIG. 4 is a diagram showing a configuration of a ventilation mechanism in a second embodiment of the present invention.
FIG. 5 is a diagram showing a configuration of a heat pipe type cooler according to a third embodiment of the present invention.
FIG. 6 is a front view showing a configuration of a heat pipe type cooler according to a fourth embodiment of the present invention.
FIG. 7 is a side view showing a partial configuration of a semiconductor stack according to a fourth embodiment of the present invention.
FIG. 8 is a diagram showing a configuration of a semiconductor stack according to a fifth embodiment of the present invention.
FIG. 9 is a view showing a configuration of a heat pipe type cooler according to a sixth embodiment of the present invention.
FIG. 10 is a view for explaining a detailed configuration of a support structure according to a sixth embodiment of the present invention.
FIG. 11 is a front view showing a configuration of a self-cooling type power converter using a conventional heat pipe type cooler.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Power converter 2 ... Semiconductor stack 3 ... Heat pipe type cooler 4 ... Power semiconductor element 5 ... Opening part 6 ... Sealing part 7 ... Ventilation mechanism 8 ... Movable slit member 9 ... 庇 10 ... Heat receiving part 11 ... Insulation Part 12 ... Guide rail 13 ... Through hole 14 ... Holding plate 15 ... Bar 16 ... Fastener 17 ... Radiation fin 18 ... Spacer 19 ... Heat pipe 20 ... Support mechanism 21 ... Support plate 22 ... Long hole

Claims (3)

In a power conversion device having a plurality of semiconductor stacks composed of a power semiconductor element and a vertically arranged heat pipe type cooler that cools the power semiconductor element, the plurality of semiconductor stacks are arranged below the center one. power conversion apparatus characterized by being arranged stepped so. 2. The power conversion device according to claim 1, wherein an insulator for securing a creeping insulation distance between the vertically arranged heat pipe coolers in a heat receiving portion of each vertically arranged heat pipe cooler in each semiconductor stack. The power converter characterized by providing. 2. The power conversion device according to claim 1, wherein a plurality of vertically arranged heat pipe coolers in each semiconductor stack are arranged in an inclined state in the opposite direction, one by one with respect to the vertical direction. The power converter characterized by this.

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