JP3649786B2 - Treatment liquid for perovskite type single crystal and processing method for perovskite type single crystal - Google Patents
Treatment liquid for perovskite type single crystal and processing method for perovskite type single crystal Download PDFInfo
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- JP3649786B2 JP3649786B2 JP25719695A JP25719695A JP3649786B2 JP 3649786 B2 JP3649786 B2 JP 3649786B2 JP 25719695 A JP25719695 A JP 25719695A JP 25719695 A JP25719695 A JP 25719695A JP 3649786 B2 JP3649786 B2 JP 3649786B2
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- single crystal
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Description
【0001】
【発明の属する技術分野】
ペロブスカイト型構造単結晶用処理液及びペロブスカイト型構造単結晶の処理方法に関する。特に、GaN系青色半導体材料、超電導材料用の基板として有望な希土類13(3B)族ペロブスカイト型構造単結晶用の処理液とその処理方法に関するものである。
【0002】
【従来の技術】
最近、青色半導体発光素子として窒化ガリウム系化合物半導体(InxGayAl1-x-yN(0≦x,y;x+y≦1))が注目を集めている。窒化ガリウム系化合物半導体結晶をサファイア(α-Al2O3)基板に成長させる場合、一般に窒化ガリウム系化合物半導体結晶の(0001)面をサファイアの(0001)面上に成長させることが多く、その場合の格子定数のずれは16%にもなり、結晶性の優れた窒化ガリウム系化合物半導体結晶を成長させることができなかった。その解決手段として、
▲1▼サファイア基板上にまずバッファー層(例えば、AlNバッファ層やGaAlNバッファ層)を成長させた後窒化ガリウム系化合物半導体結晶を成長する方法(特公S59-48794、特開H4-297023)、
▲2▼単結晶基板として、窒化ガリウム系化合物半導体単結晶と結晶構造及び格子定数のできるだけ近い結晶(例えば、アルミニウムガーネット(ReAl2Al3O12)やガリウムガーネット(ReAl2Ga3O12)(特開S49-3899)、MgOやZnOやCaO等(特開H04-209577))を用いる方法、
が知られている。しかし、基板との格子整合性、基板の熱安定性等に問題があり、本出願人は、希土類13(3B)族ペロブスカイト型構造単結晶を提案している。
【0003】
また、希土類13(3B)族ペロブスカイト型構造単結晶のNdGaO3単結晶は、酸化物超電導用基板として有望な材料であることも知られている(例えば、アプライドフィジックス レターズ(Applied Physics Letters) 54巻 P1054〜1056)。
【0004】
このように、ペロブスカイト型構造単結晶は青色半導体発光素子用材料やそのほか超電導用材料として非常に有望な材料である。特に、ペロブスカイト型構造単結晶としては、前記希土類13(3B)族がアルミニウム、ガリウムおよびインジウムの少なくとも1種である希土類13(3B)族ペロブスカイト型構造、特にその{110}面、{011}面、{101}面が好適に用いられる。
【0005】
【発明が解決しようとする課題】
このような薄膜をペロブスカイト型構造単結晶基板上に成膜する前には、一旦、基板表面の加工変質層を除去するために基板を処理する必要がある。加工変質層は基板を研磨する際に導入される原子配列の歪んだ層であり通常1〜10μm程度の厚さである。NdGaO3基板表面の処理方法としては、温度100〜230℃の燐酸で表面を処理することが知られている(特開H04-202100)。しかし、この処理液には、次のような問題があった。
【0006】
▲1▼処理液の温度が100℃以下では、エッチング速度が遅くて実用的ではない。
▲2▼処理液の温度が100℃〜230℃では、エッチングによりエッチピットが発生する。
▲3▼処理液の温度が230℃以上では、エッチング速度が速すぎ処理を制御するのが困難であり、また工業上、安全上問題がある。
【0007】
基板表面に加工変質層が残ったままその上に膜を成長させると膜の品質が悪くなり、一方、エッチピットが発生した基板上に成膜を行った場合はエッチピットを核としてヒロック等の異常成長が生じる。
【0008】
【課題を解決するための手段】
そこで、本発明者はペロブスカイト型構造単結晶基板の適当な処理液について鋭意検討した結果本発明に至った。すなわち、本発明は、リン酸と王水の混合液からなることを特徴とするペロブスカイト型構造単結晶用処理液及びペロブスカイト型構造単結晶をリン酸と王水の混合液で処理することを特徴とするペロブスカイト型構造単結晶の処理方法である。また、前記ペロブスカイト型構造が希土類13(3B)族ペロブスカイト型構造、更には前記希土類13(3B)族がアルミニウム、ガリウムおよびインジウムの少なくとも1種であることを特徴とするペロブスカイト型構造単結晶用処理液である。
【0009】
【発明の実施の形態】
燐酸と王水の混合液からなる処理液を用いペロブスカイト型構造単結晶を処理することで、エピタキシャル成長に適した平滑な基板表面が得られる。その適切な混合比は、処理温度によって左右されるが、例えば60℃程度の処理温度では燐酸が多すぎるとエッチピットが発生しやすくなり、燐酸が少なすぎるとエッチング速度が遅くなる。
【0010】
【実施例】
一例として、ペロブスカイト型構造基板としてNdGaO3基板の(101)面を各処理液で処理した後、その上に窒化ガリウム系半導体膜を成長させた実施例を示す。
【0011】
(実施例)
(101)面NdGaO3基板を、60℃の燐酸:王水(HCl/HNO3=3/1)=1:3(容量比)の処理液に15分間浸漬した。NdGaO3基板は約4μmエッチングされた。その表面を光学顕微鏡で観察したところにはエッチピットは観察されなかった。
【0012】
この基板を洗浄、乾燥し、ハイドライドVPE装置にセットした。窒素ガスを流しながら、基板部の温度を900℃、ガリウム原料としてGaを用いガリウム原料の温度を850℃とした。ガリウム原料の上流から窒素ガスで希釈された塩化ガスを流し、同時にガリウム原料をバイパスして基板直前にアンモニアガスを流し、基板上にGaNを30分間成膜させた。得られたGaN膜の厚さは約3μmであり、異常粒成長は観察されなかった。
【0013】
(比較例)
(101)面NdGaO3基板を、130℃の燐酸:硫酸=1:3(容量比)の処理液に15分間浸漬した。NdGaO3基板は約4μmエッチングされた。その表面を光学顕微鏡で観察したところにはエッチピットが多数観察された。
【0014】
この基板を洗浄、乾燥し、実施例と同様にハイドライドVPEによりGaN膜を成膜した。得られたGaN膜の厚さは約3μmであるが、多くの異常粒成長が観察された。
【0015】
【発明の効果】
リン酸と王水の混合液からなる処理液を用い、ペロブスカイト型構造単結晶、希土類13(3B)族ペロブスカイト型構造、特に希土類13(3B)族がアルミニウム、ガリウムおよびインジウムのペロブスカイト型構造単結晶を処理することで、平滑な処理面が得られる。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a processing solution for a perovskite structure single crystal and a method for processing a perovskite structure single crystal. In particular, the present invention relates to a processing solution for a rare earth 13 (3B) group perovskite structure single crystal and a processing method thereof, which are promising as substrates for GaN-based blue semiconductor materials and superconducting materials.
[0002]
[Prior art]
Recently, a gallium nitride compound semiconductor (In x Ga y Al 1-xy N (0 ≦ x, y; x + y ≦ 1)) has attracted attention as a blue semiconductor light emitting device. When a gallium nitride compound semiconductor crystal is grown on a sapphire (α-Al 2 O 3 ) substrate, the (0001) plane of the gallium nitride compound semiconductor crystal is generally grown on the (0001) plane of sapphire. In this case, the deviation of the lattice constant was 16%, and a gallium nitride compound semiconductor crystal having excellent crystallinity could not be grown. As a solution,
(1) A method of growing a gallium nitride-based compound semiconductor crystal after first growing a buffer layer (for example, an AlN buffer layer or a GaAlN buffer layer) on a sapphire substrate (Japanese Patent Publication S59-48794, JP H4-297023),
(2) As a single crystal substrate, a crystal having a crystal structure and lattice constant as close as possible to those of a gallium nitride compound semiconductor single crystal (for example, aluminum garnet (ReAl 2 Al 3 O 12 ) or gallium garnet (ReAl 2 Ga 3 O 12 )) JP, S49-3899), a method using MgO, ZnO, CaO, etc. (JP H04-209577)),
It has been known. However, there are problems with lattice matching with the substrate, thermal stability of the substrate, and the like, and the present applicant has proposed a rare earth 13 (3B) group perovskite structure single crystal.
[0003]
In addition, rare earth 13 (3B) group perovskite structure single crystal NdGaO 3 single crystal is also known to be a promising material as a substrate for oxide superconductivity (for example, Applied Physics Letters, Vol. 54). P1054-1056).
[0004]
As described above, the perovskite structure single crystal is a very promising material as a blue semiconductor light emitting device material and other superconducting materials. In particular, as the perovskite structure single crystal, the rare earth 13 (3B) group is a rare earth 13 (3B) group perovskite structure in which the rare earth 13 (3B) group is at least one of aluminum, gallium and indium, particularly its {110} plane, {011} plane , {101} plane is preferably used.
[0005]
[Problems to be solved by the invention]
Before such a thin film is formed on a perovskite structure single crystal substrate, it is necessary to process the substrate once in order to remove the work-affected layer on the substrate surface. The work-affected layer is a layer having a distorted atomic arrangement introduced when the substrate is polished, and usually has a thickness of about 1 to 10 μm. As a method for treating the surface of an NdGaO 3 substrate, it is known to treat the surface with phosphoric acid at a temperature of 100 to 230 ° C. (Japanese Patent Laid-Open No. H04-202100). However, this processing solution has the following problems.
[0006]
(1) If the temperature of the treatment liquid is 100 ° C. or lower, the etching rate is slow and is not practical.
(2) When the temperature of the processing solution is 100 ° C. to 230 ° C., etch pits are generated by etching.
(3) When the temperature of the treatment liquid is 230 ° C. or higher, the etching rate is too high to control the treatment, and there are industrial and safety problems.
[0007]
If a film is grown on the substrate with the work-affected layer remaining on the substrate surface, the quality of the film deteriorates.On the other hand, when a film is formed on a substrate on which etch pits have been generated, Abnormal growth occurs.
[0008]
[Means for Solving the Problems]
Therefore, the present inventors have intensively studied a suitable treatment liquid for the perovskite structure single crystal substrate, and have reached the present invention. That is, the present invention is characterized in that a perovskite type structure single crystal treatment liquid and a perovskite type structure single crystal, which are composed of a mixed liquid of phosphoric acid and aqua regia, are treated with a mixed liquid of phosphoric acid and aqua regia. This is a method for processing a perovskite type single crystal. Further, the perovskite structure single crystal treatment is characterized in that the perovskite structure is a rare earth 13 (3B) group perovskite structure, and the rare earth 13 (3B) group is at least one of aluminum, gallium and indium. It is a liquid.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
A smooth substrate surface suitable for epitaxial growth can be obtained by treating the perovskite structure single crystal with a treatment liquid composed of a mixture of phosphoric acid and aqua regia. The appropriate mixing ratio depends on the processing temperature. For example, at a processing temperature of about 60 ° C., too much phosphoric acid tends to generate etch pits, and too little phosphoric acid results in a slow etching rate.
[0010]
【Example】
As an example, an example is shown in which a (101) plane of an NdGaO 3 substrate as a perovskite structure substrate is treated with each treatment solution, and then a gallium nitride based semiconductor film is grown thereon.
[0011]
(Example)
The (101) plane NdGaO 3 substrate was immersed in a treatment solution of phosphoric acid: aqua regia (HCl / HNO 3 = 3/1) = 1: 3 (volume ratio) at 60 ° C. for 15 minutes. The NdGaO 3 substrate was etched by about 4 μm. Etch pits were not observed when the surface was observed with an optical microscope.
[0012]
This substrate was washed and dried, and set in a hydride VPE apparatus. While flowing nitrogen gas, the temperature of the substrate portion was 900 ° C., Ga was used as the gallium raw material, and the temperature of the gallium raw material was 850 ° C. A chloride gas diluted with nitrogen gas was flowed from the upstream of the gallium raw material, and at the same time, the gallium raw material was bypassed and ammonia gas was flowed immediately before the substrate to form a GaN film on the substrate for 30 minutes. The thickness of the obtained GaN film was about 3 μm, and no abnormal grain growth was observed.
[0013]
(Comparative example)
The (101) plane NdGaO 3 substrate was immersed in a treatment solution of phosphoric acid: sulfuric acid = 1: 3 (volume ratio) at 130 ° C. for 15 minutes. The NdGaO 3 substrate was etched by about 4 μm. When the surface was observed with an optical microscope, many etch pits were observed.
[0014]
This substrate was washed and dried, and a GaN film was formed by hydride VPE in the same manner as in the example. Although the thickness of the obtained GaN film was about 3 μm, many abnormal grain growths were observed.
[0015]
【The invention's effect】
Perovskite structure single crystal, rare earth 13 (3B) group perovskite structure, especially rare earth 13 (3B) group aluminum, gallium and indium perovskite structure single crystal using treatment liquid composed of phosphoric acid and aqua regia By processing this, a smooth processed surface can be obtained.
Claims (6)
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JP25719695A JP3649786B2 (en) | 1995-09-11 | 1995-09-11 | Treatment liquid for perovskite type single crystal and processing method for perovskite type single crystal |
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JP25719695A JP3649786B2 (en) | 1995-09-11 | 1995-09-11 | Treatment liquid for perovskite type single crystal and processing method for perovskite type single crystal |
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JP4264992B2 (en) * | 1997-05-28 | 2009-05-20 | ソニー株式会社 | Manufacturing method of semiconductor device |
CZ2014763A3 (en) * | 2014-11-07 | 2016-01-06 | Crytur, Spol.S R.O. | Modification method of monocrystalline scintillator surface and monocrystalline scintillator with surface modified by such a method |
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