JP3638748B2 - Mounting device - Google Patents

Mounting device Download PDF

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Publication number
JP3638748B2
JP3638748B2 JP5103797A JP5103797A JP3638748B2 JP 3638748 B2 JP3638748 B2 JP 3638748B2 JP 5103797 A JP5103797 A JP 5103797A JP 5103797 A JP5103797 A JP 5103797A JP 3638748 B2 JP3638748 B2 JP 3638748B2
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Prior art keywords
main body
mounting apparatus
pressurizing
pressure head
heaters
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Expired - Fee Related
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JP5103797A
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Japanese (ja)
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JPH10233418A (en
Inventor
泰蔵 中川
学 草野
文彦 佐川
直樹 竹下
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Alps Alpine Co Ltd
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Alps Electric Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

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  • Wire Bonding (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、二つの電気部品の電気的な接続を行うに好適な実装装置に関する。
【０００２】
【従来の技術】
従来における実装装置を説明する前に、実装装置を適用する電気部品における接続構造を、図７、図８に基づいて説明する。
図７、図８に示すように、ガラス等の絶縁板１上には、ＩＴＯ膜（酸化インジウムから成る透明抵抗膜）等から成る複数の導電配線２、３が形成されて、一つの電気部品４が構成されている。
また、枠体５の下面には、複数個の導電体（バンプ）６、７が形成されて、ＩＣチップ等のもう一つの電気部品８が構成されている。
また、前記絶縁板１上には、他の電気部品１１が取り付けられている。
そして、前記電気部品８は、その導電体６、７を、絶縁板１上の導電配線２、３に対向させ、導電粒子９を混入した熱硬化エポキシ接着剤等から成る熱硬化型異方性導電体１０によって、電気部品４と８とを接着すると共に、導電粒子９によって、上下に位置する導電体６と導電配線２、及び導電体７と導電配線３とを接続した構成となっている。
【０００３】
このような接続構造を得るために用いられる従来の実装装置を、図９、図１０に基づいて説明する。
従来の実装装置は、図９、図１０に示すように、平坦面を有する支持台３０と、この支持台３０に対して上下動可能に支持され、下部に平坦面を有する加圧ヘッド３１とで構成されている。
そして、この加圧ヘッド３１は、一方の下部の隅部を切り落として逃げ部３２ａを設けた鉄製の本体部３２と、この本体部３２と別個に作られ、本体部３２の下部に取り付けられた超硬合金製の加圧部３３と、本体部３２の長手方向に間隔を置いて本体部３２に取り付けられ、本体部３２、加圧部３３を加熱するための一対のヒータ３４とを具備している。
【０００４】
このような実装装置における電気部品の実装方法を、図１１に基づいて説明すると、先ず、平坦な支持台３０上に、電気部品１１を具備する前記電気部品４、シート状の前記熱硬化型異方性導電体（Ａｎｉｓｏｔｒｏｐｉｃ Ｃｏｎｄｃｔｉｖｅ Ｆｉｌｍを以後、ＡＣＦと略称する）１０、電気部品８を順次、載置する。
次に、ヒータ３４によって約２２０℃に加熱された加圧ヘッド３１を、油圧シリンダ、サーボモータ等によって、下方に降下して電気部品８に当接させる。
この時、逃げ部３２ａによって、加圧ヘッド３１は、電気部品１１とはぶつからないようになっている。
【０００５】
次いで、加圧ヘッド３１に押圧力を加え、加圧ヘッド３１で電気部品８を押圧する。
すると、加熱された加圧ヘッド３１により電気部品８が加熱され、次いで、加熱された電気部品８によりＡＣＦ１０が加熱されて、ＡＣＦ１０は、液状となる。
このため、加圧ヘッド３１は降下すると共に、導電配線２、３と導電体６、７との間にある導電粒子９は押し潰され、図８に示すように、導電配線２、３と導電体６、７とが電気的に接続された状態となる。
そして、加熱された加圧ヘッド３１を冷却すると、ＡＣＦ１０は硬化して、電気部品４と８とが接着された状態となると共に、導電配線２、３と導電体６、７とが接続された状態となる。
次に、加圧ヘッド３１を上方に上昇すれば、電気部品の実装が完了する。
そして、超硬合金製の加圧部３３のＡＣＦ１０に対する熱エネルギーを測定すると、図１２に示すように、ＡＣＦ１０が液状となるに必要な温度に成るまで６秒かかり、且つ、その熱エネルギーは緩やかなカーブＣ１で上昇するものである。
【０００６】
【発明が解決しようとする課題】
上述したように、従来の実装装置においては、本体部３２と加圧部３３とが別体で、熱膨張係数の異なる金属で組み合わされているため、この組合せ時の両者の接触面のバラツキにより、本体部３２からの加圧部３３への伝達熱量の差異を生じ、熱膨張による加圧部３３の下部の平坦面が不均一となり、支持台３０の平坦面に対して不平行になると言う問題がある。
そして、この不平行状態で加圧部３３により電気部品を加圧すると、電気部品の一端側では、導電粒子９が潰されものの、他端側では導電粒子９が潰れ無いという事態が生じ、このため、導電配線２、３と導電体６、７間の電気的な接続が不安定に成るという問題を生じるものであった。
また、本体部３２の隅部に逃げ部３２ａを設けたものであるため、図１０から明らかなように、本体部３２の左右から加圧部３３に伝達される熱量が異なり、これによっても上記と同様に、加圧部３３が支持台３０に対して不平行に成るという問題があり、電気的な接続が不安定になるものである。
また、従来のように、本体部３２と加圧部３３とが別体で、加圧部３３が超硬合金製のものは、ＡＣＦ１０への熱エネルギー効率が悪く、生産性が悪いものであった。
また、従来においては、ヒータ３４で加圧部３３が加熱されたとき、加圧部３３の両端部は、自由な状態で膨張するため、図９に示すように、その両端部における膨張は、他の平坦部よりも大きく突出し、二点鎖線３３ａで示した状態となり、このため、加圧部３３で電気部品８を平行状態で加圧することが出来ず、電気的な接続が不安定に成るという問題がある。
【０００７】
上記課題を解決するための第１の解決手段として、加圧部とヒータを内蔵した本体部とが金属製の一体物からなり、前記本体部の下部の短手方向中央部に位置し、前記本体部の長手方向に延在する帯状の突部から成る前記加圧部を設けて成る加圧ヘッドを備え、前記本体部には、複数の前記ヒータが、前記加圧部の長手方向に沿って所定の間隔を置いて前記長手方向と直交する方向に内蔵されている構成とした。
また、第２の解決手段として、前記本体部に、所定の間隔を置いて２個の前記ヒータを内蔵し、該それぞれのヒータと前記加圧部の端部との距離Ｙを等しくすると共に、前記２個のヒータ間を、２倍の前記距離Ｙとした加圧ヘッドを備えた構成とした。
また、第３の解決手段として、前記本体部と前記加圧部とをステンレス材等の低熱膨張金属で形成した加圧ヘッドを備えた構成とした。
また、第４の解決手段として、ヒータを内蔵した金属製の本体部と、該本体部の下部の短手方向中央部に位置し、本体部の長手方向に延在する帯状の突部から成る金属製の加圧部とを有し、該加圧部の長手方向中央部に、加圧部の熱膨張係数より大きな熱膨張係数の金属から成る熱伝導部材を取り付けて成る加圧ヘッドを備えた構成とした。
また、第５の解決手段として、前記本体部に、所定の間隔を置いて２個の前記ヒータが内蔵され、該２個のヒータ間の中央部に前記熱伝導部材を設けた加圧ヘッドを備えた構成とした。
また、第６の解決手段として、前記本体部と前記加圧部とがステンレス材の低熱膨張金属の一体物で形成した加圧ヘッドを備えた構成とした。
【０００８】
【発明の実施の形態】
次に、本発明における実装装置を説明する前に、この実装装置が適用される電気部品の接続構造を図７、図８で説明する。
先ず、図７は本発明の実装装置が適用される電気部品の接続構造を示す要部の平面図、図８は要部の断面図であって、この図面に示す接続構造は前述したように、ガラス等の絶縁板１上には、ＩＴＯ膜（酸化インジウムから成る透明抵抗膜）等から成る複数の導電配線２、３が形成されて、一つの電気部品４が構成されている。
【０００９】
また、枠体５の下面には、複数個の導電体（バンプ）６、７が形成されて、ＩＣチップ等のもう一つの電気部品８が構成されている。
また、前記絶縁板１上には、他の電気部品１１が取り付けられている。
そして、前記電気部品８は、その導電体６、７を、絶縁板１上の導電配線２、３に対向させ、導電粒子９を混入した熱硬化エポキシ接着剤等から成る熱硬化型異方性導電体１０によって、電気部品４と８とを接着すると共に、導電粒子９によって、上下に位置する導電体６と導電配線２、及び導電体７と導電配線３とを接続した構成となっている。
【００１０】
このような接続構造を得るための本発明における実装装置を、図１、図２に基づいて説明する。
図１は実装装置の平面図、図２は加圧ヘッドの要部縦断面図であり、この実装装置は、平坦面を有する支持台２０と、下面に平坦面を有し、前記支持台２０に対してサーボモータ等によって上下動可能な加圧ヘッド２１とで構成されている。
そして、加圧ヘッド２１は、ステンレス材等の低熱膨張金属から成る本体部２２と、この本体部２２と一体物で形成され、本体部２２の下部２２ａの短手方向中央部に位置し、本体部２２の長手方向に延在する帯状の突部から成る加圧部２３と、本体部２２に間隔を置いて取り付け（内蔵）られた一対のヒータ２４とを具備している。
また、図１に示すように、一対のヒータ２４のそれぞれから加圧部２３の端部２３ａまでの距離Ｙを等しく、また、一対のヒータ２４のそれぞれから本体部２２の側端２２ｂまでの距離Ｙを等しく、且つ、ヒータ２４と端部２３ａ間の距離Ｙと同等にし、更に、一対のヒータ２４間の距離を、ヒータ２４と端部２３ａ間の距離Ｙの２倍の距離２Ｙとしてある。
そして、図１に示すように、加圧ヘッド２１の長手方向から見て、加圧ヘッド２１のヒータ２４取付部より下部の形状は、加圧ヘッド２３の中心線Ｔ１に対して左右対称の形状と成っている。
即ち、中心線Ｔ１に対して、本体部２２と加圧部２３の形状、及びヒータ２４の配置が左右対称と成っている。
また、図２に示すように、加圧ヘッド２１の短手方向から見て、加圧ヘッド２１のヒータ２４取付部より下部の形状は、加圧ヘッド２１の中心線Ｔ２に対して左右対称の形状と成っている。
即ち、中心線Ｔ２に対して、本体部２２と加圧部２３の形状が左右対称と成っている。
【００１１】
次に、このような実装装置における電気部品の実装方法を、図７、図８に示した電気部品の接続構造を例にして、図３に基づいて説明すると、先ず、平坦な支持台２０上に、電気部品１１を具備する前記電気部品４、シート状の熱硬化型異方性導電体（以後、ＡＣＦと略称する）１０、電気部品８を順次、載置する。
次に、ヒータ２４によって約２２０℃に加熱された加圧ヘッド２１を、サーボモータ等を介して電気部品８に当接するまで降下させる。
次に、加圧ヘッド２１に押圧力を加え、加圧ヘッド２１で電気部品８を押圧する。
すると、加熱された加圧ヘッド２１により電気部品８が加熱され、次いで、加熱された電気部品８によりＡＣＦ１０が加熱されて、ＡＣＦ１０は液状となる。
このため、加圧ヘッド２１は降下すると共に、導電配線２、３と導電体６、７との間にある導電粒子９は押し潰され、図８に示すように、導電配線２、３と導電体６、７とが電気的に接続された状態となる。
【００１２】
次に、加圧ヘッド２１を冷却すると、ＡＣＦ１０は硬化して、電気部品４と８とが接着された状態となると共に、導電配線２、３と導電体６、７が接続された図７、８の状態となる。
次に、加圧ヘッド２１を上方に移動すれば、電気部品の実装が完了する。
そして、上述のような加圧ヘッド２１のＡＣＦ１０に対する熱エネルギーを測定すると、図４に示すように、ＡＣＦ１０が液状と成るに必要な温度になるまでが０、５秒となり、且つ、その熱エネルギーは急峻なカーブＣ２で上昇して、熱エネルギー効率が極めて良好となる。
【００１３】
また、図５、図６は本発明の実装装置に係わる加圧ヘッドの他の実施例を示し、図５は加圧ヘッドの要部平面図、図６はその要部縦断面図で、この実施例では、一対のヒータ２４間の本体部２２と加圧部２３の中央部に、加圧部２３の熱膨張係数より大きい、例えばＪＩＳ規格のＳ５０Ｃから成る熱伝導部材２５を取り付けたもので、その他の構成は、上記実施例と同様の構成を有しているので、ここではその説明を上略する。
そして、熱伝導部材２５は加熱された際、加圧部２３より大きな膨張を行うため、加圧部２３の下面中央部を押し出し、図５に示すように、下面中央部が突出し、二点鎖線２３ｂで示した状態となり、これによって、加圧部２３は電気部品８を平行状態で加圧することが出来る。
なお、上記実施例では、熱伝導部材２５を円柱状のもので示したが、楕円状などの適宜、形状を選定しても良いこと勿論である。
【００１４】
【発明の効果】
本発明の実装装置によれば、加圧部と本体部とを金属製の一体物とし、且つ、本体部の短手方向中央部に位置し、本体部の長手方向に延在する帯状の突部から成る加圧部を設けたものであるため、従来のような別体による接触面のバラツキ
、及び非対称による加圧部への伝達熱量の差異を、従来に比して少なくでき、加圧ヘッドを支持台に対して平行状態とすることが出来る。
これによって、支持台と加圧ヘッドの平行度を向上できて、電気部品の接続の確実なものを提供できる。
また、一対のヒータ間の距離を、ヒータと加圧部の端部との距離の２倍としたものであるため、本体部からの加圧部への伝達熱量をほぼ均一に出来、熱エネルギー効率が良く、生産性が良好である。
また、本体部と加圧部とを低熱膨張金属で形成することによって、加圧ヘッドの支持台に対する平行度を向上できて、より確実な接続構造が得られる。
また、加圧部の中央部に、加圧部の熱膨張係数より大きな熱膨張係数の金属から成る熱伝導部材を取り付けることにより、加圧部の中央部を加熱時に突出できて、加圧部の電気部品への加圧を良好に出来、電気部品の接続の確実なものを提供できる。
また、加圧ヘッドの第１の圧力を、第２の圧力の１／３程度にすることによって、支持台と加圧ヘッドの平行度の良好なものが得られ、電気部品の接続の確実なものを提供できる。
【図面の簡単な説明】
【図１】本発明の実装装置の要部の平面図。
【図２】本発明の実装装置に係わる加圧ヘッドの要部縦断面図。
【図３】本発明の実装装置における実装方法を説明するための説明図。
【図４】本発明における熱エネルギーの状態を示す説明図。
【図５】本発明の実装装置に係わる加圧ヘッドの他の実施例を示す要部平面図。
【図６】図５における要部縦断面図。
【図７】本発明の実装装置が適用される電気部品の接続構造を示す要部の平面図。
【図８】図７における要部の断面図。
【図９】従来の実装装置の要部の平面図。
【図１０】従来の実装装置に係わる加圧ヘッドの要部縦断面図。
【図１１】従来の実装装置における実装方法を説明するための説明図。
【図１２】従来における熱エネルギーの状態を示す説明図。
【符号の説明】
１ 絶縁板
２、３ 導電配線
４ 電気部品
５ 枠体
６、７ 導電体
８ 電気部品
９ 導電粒子
１０ 熱硬化型異方性導電体（ＡＣＦ）
１１ 電気部品
２０ 支持台
２１ 加圧ヘッド
２２ 本体部
２２ａ 下部
２２ｂ 側端
２３ 加圧部
２３ａ 端部
Ｔ１，Ｔ２ 中心線
Ｙ 距離[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a mounting apparatus suitable for electrical connection of two electrical components.
[0002]
[Prior art]
Before describing a conventional mounting apparatus, a connection structure in an electrical component to which the mounting apparatus is applied will be described with reference to FIGS.
As shown in FIGS. 7 and 8, a plurality of conductive wirings 2 and 3 made of an ITO film (transparent resistance film made of indium oxide) or the like are formed on an insulating plate 1 made of glass or the like. 4 is configured.
In addition, a plurality of conductors (bumps) 6 and 7 are formed on the lower surface of the frame 5 to constitute another electric component 8 such as an IC chip.
Further, another electrical component 11 is attached on the insulating plate 1.
The electrical component 8 has a thermosetting anisotropy made of a thermosetting epoxy adhesive or the like mixed with conductive particles 9 with the conductors 6 and 7 facing the conductive wirings 2 and 3 on the insulating plate 1. The electric parts 4 and 8 are bonded by the electric conductor 10, and the electric conductor 6 and the electric wiring 2 positioned above and below, and the electric conductor 7 and the electric wiring 3 are connected by the electric conductive particles 9. .
[0003]
A conventional mounting apparatus used for obtaining such a connection structure will be described with reference to FIGS.
As shown in FIGS. 9 and 10, the conventional mounting apparatus includes a support base 30 having a flat surface, and a pressure head 31 that is supported by the support base 30 so as to be movable up and down and has a flat surface at the bottom. It consists of
The pressure head 31 is made separately from the main body 32 made of iron and provided with a relief portion 32 a by cutting off one lower corner, and is attached to the lower portion of the main body 32. A pressurizing part 33 made of cemented carbide and a pair of heaters 34 for heating the main body part 32 and the pressurizing part 33 are attached to the main body part 32 at intervals in the longitudinal direction of the main body part 32. ing.
[0004]
The mounting method of the electrical component in such a mounting apparatus will be described with reference to FIG. 11. First, the electrical component 4 including the electrical component 11 on the flat support base 30, the sheet-like thermosetting type resin. An isotropic conductor (Anisotropic Conductive Film is abbreviated as ACF hereinafter) 10 and an electrical component 8 are sequentially placed.
Next, the pressure head 31 heated to about 220 ° C. by the heater 34 is lowered and brought into contact with the electrical component 8 by a hydraulic cylinder, a servo motor, or the like.
At this time, the pressurization head 31 does not collide with the electrical component 11 by the escape portion 32a.
[0005]
Next, a pressing force is applied to the pressure head 31, and the electric component 8 is pressed by the pressure head 31.
Then, the electrical component 8 is heated by the heated pressure head 31, and then the ACF 10 is heated by the heated electrical component 8, so that the ACF 10 becomes liquid.
Therefore, the pressure head 31 is lowered, and the conductive particles 9 between the conductive wirings 2 and 3 and the conductors 6 and 7 are crushed, and as shown in FIG. The bodies 6 and 7 are electrically connected.
Then, when the heated pressure head 31 is cooled, the ACF 10 is cured and the electrical components 4 and 8 are bonded together, and the conductive wirings 2 and 3 and the conductors 6 and 7 are connected. It becomes a state.
Next, when the pressure head 31 is raised upward, the mounting of the electrical component is completed.
Then, when the thermal energy of the pressurizing section 33 made of cemented carbide is measured with respect to the ACF 10, as shown in FIG. 12, it takes 6 seconds until the ACF 10 reaches a temperature necessary for becoming liquid, and the thermal energy is moderate. It rises with a simple curve C1.
[0006]
[Problems to be solved by the invention]
As described above, in the conventional mounting apparatus, the main body portion 32 and the pressurizing portion 33 are separated and combined with metals having different thermal expansion coefficients. A difference in the amount of heat transferred from the main body 32 to the pressurizing unit 33 is caused, and the flat surface below the pressurizing unit 33 due to thermal expansion is non-uniform and non-parallel to the flat surface of the support base 30. There's a problem.
When the electric component is pressurized by the pressure unit 33 in this non-parallel state, the conductive particles 9 are crushed on one end side of the electric components, but the conductive particles 9 are not crushed on the other end side. Therefore, there is a problem that the electrical connection between the conductive wirings 2 and 3 and the conductors 6 and 7 becomes unstable.
Further, since the relief portions 32a are provided at the corners of the main body portion 32, the amount of heat transmitted from the left and right sides of the main body portion 32 to the pressurizing portion 33 is different as apparent from FIG. Similarly to the above, there is a problem that the pressurizing portion 33 is not parallel to the support base 30, and the electrical connection becomes unstable.
Further, as in the past, when the main body portion 32 and the pressure portion 33 are separate and the pressure portion 33 is made of cemented carbide, the thermal energy efficiency to the ACF 10 is poor and the productivity is poor. It was.
Conventionally, when the pressurizing unit 33 is heated by the heater 34, both end portions of the pressurizing unit 33 expand in a free state. Therefore, as shown in FIG. It protrudes larger than the other flat part, and is in a state shown by a two-dot chain line 33a. For this reason, the electrical component 8 cannot be pressurized in a parallel state by the pressurizing part 33, and the electrical connection becomes unstable. There is a problem.
[0007]
As a first solving means for solving the above problems, and the pressure and the body portion having a built-in heater is a metallic monolith, located in the short direction central portion of the bottom of the body portion, the A pressurizing head provided with the pressurizing portion formed of a belt-like protrusion extending in the longitudinal direction of the main body, and a plurality of the heaters along the longitudinal direction of the pressurizing portion; Thus, it is built in a direction perpendicular to the longitudinal direction at a predetermined interval .
Further, as a second solving means, the main body portion includes two heaters at a predetermined interval, and the distance Y between each heater and the end portion of the pressurizing portion is made equal, The pressure head is provided with the distance Y doubled between the two heaters.
Further, as a third solving means, the main body portion and the pressing portion are configured to include a pressing head formed of a low thermal expansion metal such as a stainless material.
As a fourth solution, a metal main body having a heater and a belt-like protrusion that is located in the center in the short direction of the lower portion of the main body and extends in the longitudinal direction of the main body. A pressurizing head comprising a heat conducting member made of a metal having a thermal expansion coefficient larger than the thermal expansion coefficient of the pressurizing part at the center in the longitudinal direction of the pressurizing part. The configuration was as follows.
Further, as a fifth solving means, there is provided a pressure head in which two heaters are built in the main body portion at a predetermined interval, and the heat conducting member is provided in a central portion between the two heaters. The configuration was provided.
Further, as a sixth solving means, and configured to include the main body portion and the pressure head formed integrally of a low thermal expansion metal of the and the pressure is stainless steel.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Next, before explaining the mounting apparatus according to the present invention, a connection structure of electrical components to which the mounting apparatus is applied will be described with reference to FIGS.
First, FIG. 7 is a plan view of a principal part showing a connection structure of electrical components to which the mounting apparatus of the present invention is applied, and FIG. 8 is a sectional view of the principal part. The connection structure shown in this drawing is as described above. On the insulating plate 1 made of glass or the like, a plurality of conductive wirings 2 and 3 made of an ITO film (transparent resistance film made of indium oxide) or the like are formed to constitute one electric component 4.
[0009]
In addition, a plurality of conductors (bumps) 6 and 7 are formed on the lower surface of the frame 5 to constitute another electric component 8 such as an IC chip.
Further, another electrical component 11 is mounted on the insulating plate 1.
The electrical component 8 has a thermosetting anisotropy made of a thermosetting epoxy adhesive or the like mixed with conductive particles 9 with the conductors 6 and 7 facing the conductive wirings 2 and 3 on the insulating plate 1. The electric parts 4 and 8 are bonded by the electric conductor 10, and the electric conductor 6 and the electric wiring 2 positioned above and below, and the electric conductor 7 and the electric wiring 3 are connected by the electric conductive particles 9. .
[0010]
A mounting apparatus according to the present invention for obtaining such a connection structure will be described with reference to FIGS.
FIG. 1 is a plan view of the mounting apparatus, and FIG. 2 is a longitudinal sectional view of a main part of the pressure head. The mounting apparatus has a support base 20 having a flat surface and a flat surface on the lower surface. On the other hand, it is comprised with the pressurization head 21 which can be moved up and down by a servomotor.
The pressurizing head 21 is formed of a body portion 22 made of a low thermal expansion metal such as stainless steel and the body portion 22, and is located at the center in the short direction of the lower portion 22 a of the body portion 22. The pressurizing part 23 which consists of a strip | belt-shaped protrusion extended in the longitudinal direction of the part 22 and the pair of heater 24 attached to the main-body part 22 at intervals (built-in) are comprised.
Further, as shown in FIG. 1, the distance Y from each of the pair of heaters 24 to the end 23 a of the pressure unit 23 is equal, and the distance from each of the pair of heaters 24 to the side end 22 b of the main body 22. Y is made equal and equal to the distance Y between the heater 24 and the end 23a, and the distance between the pair of heaters 24 is a distance 2Y that is twice the distance Y between the heater 24 and the end 23a.
As shown in FIG. 1, when viewed from the longitudinal direction of the pressure head 21, the shape below the heater 24 mounting portion of the pressure head 21 is symmetrical with respect to the center line T <b> 1 of the pressure head 23. It consists of.
That is, the shape of the main body portion 22 and the pressurizing portion 23 and the arrangement of the heater 24 are symmetrical with respect to the center line T1.
Further, as shown in FIG. 2, when viewed from the short side of the pressure head 21, the shape below the heater 24 mounting portion of the pressure head 21 is symmetrical with respect to the center line T <b> 2 of the pressure head 21. Made of shape.
That is, the shapes of the main body portion 22 and the pressure portion 23 are symmetrical with respect to the center line T2.
[0011]
Next, a method for mounting electrical components in such a mounting apparatus will be described with reference to FIG. 3, taking the connection structure of electrical components shown in FIGS. 7 and 8 as an example. The electric component 4 including the electric component 11, the sheet-like thermosetting anisotropic conductor (hereinafter abbreviated as ACF) 10, and the electric component 8 are sequentially mounted.
Next, the pressure head 21 heated to about 220 ° C. by the heater 24 is lowered until it comes into contact with the electrical component 8 via a servo motor or the like.
Next, a pressing force is applied to the pressure head 21 and the electric component 8 is pressed by the pressure head 21.
Then, the electrical component 8 is heated by the heated pressure head 21, and then the ACF 10 is heated by the heated electrical component 8, so that the ACF 10 becomes liquid.
Therefore, the pressure head 21 is lowered, and the conductive particles 9 between the conductive wirings 2 and 3 and the conductors 6 and 7 are crushed, and as shown in FIG. The bodies 6 and 7 are electrically connected.
[0012]
Next, when the pressure head 21 is cooled, the ACF 10 is cured, and the electrical components 4 and 8 are bonded together, and the conductive wirings 2 and 3 and the conductors 6 and 7 are connected as shown in FIG. 8 state is obtained.
Next, when the pressure head 21 is moved upward, the mounting of the electrical components is completed.
Then, when the thermal energy of the pressure head 21 as described above for the ACF 10 is measured, as shown in FIG. 4, it takes 0 to 5 seconds until the temperature necessary for the ACF 10 to become liquid, and the thermal energy. Rises with a steep curve C2, and the thermal energy efficiency becomes very good.
[0013]
5 and 6 show another embodiment of the pressure head according to the mounting apparatus of the present invention, FIG. 5 is a plan view of the main part of the pressure head, and FIG. 6 is a vertical sectional view of the main part. In the embodiment, a heat conduction member 25 made of, for example, S50C of JIS standard larger than the thermal expansion coefficient of the pressurizing unit 23 is attached to the central portion of the main body 22 and the pressurizing unit 23 between the pair of heaters 24. Since other configurations have the same configurations as those of the above-described embodiment, the description thereof is omitted here.
When the heat conducting member 25 is heated, the heat conducting member 25 expands more than the pressurizing unit 23, and therefore, the lower surface central portion of the pressurizing unit 23 is pushed out. As shown in FIG. 23b, so that the pressing unit 23 can press the electric component 8 in a parallel state.
In the above-described embodiment, the heat conductive member 25 is shown as a cylindrical shape, but it is needless to say that an appropriate shape such as an elliptical shape may be selected.
[0014]
【The invention's effect】
According to the mounting apparatus of the present invention, the pressing portion and the main body are made of a single metal, and are located in the center in the short direction of the main body and extend in the longitudinal direction of the main body. Since the pressurizing part consists of parts, the variation in the contact surface due to separate parts as in the past and the difference in the amount of heat transferred to the pressurizing part due to asymmetry can be reduced compared to the conventional, pressurizing The head can be parallel to the support base.
Accordingly, the parallelism between the support base and the pressure head can be improved, and a reliable connection of electrical components can be provided.
In addition, since the distance between the pair of heaters is twice the distance between the heater and the end of the pressurizing unit, the amount of heat transferred from the main unit to the pressurizing unit can be made almost uniform, and the heat energy Efficiency is good and productivity is good.
Further, by forming the main body portion and the pressure portion with a low thermal expansion metal, the parallelism of the pressure head with respect to the support base can be improved, and a more reliable connection structure can be obtained.
In addition, by attaching a heat conduction member made of a metal having a thermal expansion coefficient larger than that of the pressurizing part to the central part of the pressurizing part, the central part of the pressurizing part can be protruded during heating, It is possible to improve the pressure applied to the electrical parts and provide a reliable connection of the electrical parts.
Also, by setting the first pressure of the pressure head to about 1/3 of the second pressure, a good parallelism between the support base and the pressure head can be obtained, and the electrical components can be securely connected. Can offer things.
[Brief description of the drawings]
FIG. 1 is a plan view of a main part of a mounting apparatus according to the present invention.
FIG. 2 is a longitudinal sectional view of an essential part of a pressure head according to a mounting apparatus of the present invention.
FIG. 3 is an explanatory diagram for explaining a mounting method in the mounting apparatus of the present invention.
FIG. 4 is an explanatory diagram showing a state of thermal energy in the present invention.
FIG. 5 is a plan view of an essential part showing another embodiment of the pressure head according to the mounting apparatus of the present invention.
6 is a longitudinal sectional view of a main part in FIG.
FIG. 7 is a plan view of an essential part showing a connection structure of electrical components to which the mounting apparatus of the present invention is applied.
8 is a cross-sectional view of the main part in FIG.
FIG. 9 is a plan view of a main part of a conventional mounting apparatus.
FIG. 10 is a longitudinal sectional view of a main part of a pressure head according to a conventional mounting apparatus.
FIG. 11 is an explanatory diagram for explaining a mounting method in a conventional mounting apparatus.
FIG. 12 is an explanatory view showing a state of heat energy in the prior art.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Insulation board 2, 3 Conductive wiring 4 Electrical component 5 Frame 6, 7 Conductor 8 Electrical component 9 Conductive particle 10 Thermosetting anisotropic conductor (ACF)
DESCRIPTION OF SYMBOLS 11 Electrical component 20 Support stand 21 Pressure head 22 Main-body part 22a Lower part 22b Side end 23 Pressurization part 23a End part T1, T2 Centerline Y Distance

Claims (6)

加圧部とヒータを内蔵した本体部とが金属製の一体物からなり、前記本体部の下部の短手方向中央部に位置し、前記本体部の長手方向に延在する帯状の突部から成る前記加圧部を設けて成る加圧ヘッドを備え、前記本体部には、複数の前記ヒータが、前記加圧部の長手方向に沿って所定の間隔を置いて前記長手方向と直交する方向に内蔵されていることを特徴とする実装装置。  The pressurizing part and the main body part with a built-in heater are made of a single metal, and are located in the center part in the short direction of the lower part of the main body part, and from a belt-like protrusion extending in the longitudinal direction of the main body part A pressurizing head provided with the pressurizing unit, wherein the main body includes a plurality of heaters in a direction perpendicular to the longitudinal direction at predetermined intervals along the longitudinal direction of the pressurizing unit. The mounting apparatus characterized by being incorporated in the. 前記本体部に、所定の間隔を置いて２個の前記ヒータを内蔵し、該それぞれのヒータと前記加圧部の端部との距離Ｙを等しくすると共に、前記２個のヒータ間を、２倍の前記距離Ｙとした加圧ヘッドを備えたことを特徴とする請求項１記載の実装装置。  Two heaters are built in the main body part at a predetermined interval, and the distance Y between the respective heaters and the end of the pressurizing part is made equal, and between the two heaters, 2 The mounting apparatus according to claim 1, further comprising a pressure head having the doubled distance Y. 前記本体部と前記加圧部とをステンレス材等の低熱膨張金属で形成した加圧ヘッドを備えたことを特徴とする請求項１、又は２記載の実装装置。  The mounting apparatus according to claim 1, further comprising a pressure head in which the main body portion and the pressure portion are formed of a low thermal expansion metal such as a stainless steel material. ヒータを内蔵した金属製の本体部と、該本体部の下部の短手方向中央部に位置し、本体部の長手方向に延在する帯状の突部から成る金属製の加圧部とを有し、該加圧部の長手方向中央部に、加圧部の熱膨張係数より大きな熱膨張係数の金属から成る熱伝導部材を取り付けて成る加圧ヘッドを備えたことを特徴とする実装装置。  There is a metal main body with a built-in heater, and a metal pressurization section consisting of a strip-shaped protrusion that is located at the center in the short side of the main body and extends in the longitudinal direction of the main body. A mounting apparatus comprising: a pressure head formed by attaching a heat conductive member made of a metal having a thermal expansion coefficient larger than that of the pressure unit at a central portion in the longitudinal direction of the pressure unit. 前記本体部に、所定の間隔を置いて２個の前記ヒータが内蔵され、該２個のヒータ間の中央部に前記熱伝導部材を設けた加圧ヘッドを備えたことを特徴とする請求項４記載の実装装置。To the main body portion, two of the heater at a predetermined interval is incorporated, claims, characterized in that it comprises a pressure head provided with the heat conducting member in a central portion between the two heaters 4. The mounting apparatus according to 4 . 前記本体部と前記加圧部とがステンレス材の低熱膨張金属の一体物で形成した加圧ヘッドを備えたことを特徴とする請求項４、又は５記載の実装装置。  6. The mounting apparatus according to claim 4, wherein the main body portion and the pressing portion are provided with a pressing head formed of a single piece of low thermal expansion metal made of stainless steel.
JP5103797A 1997-02-19 1997-02-19 Mounting device Expired - Fee Related JP3638748B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5103797A JP3638748B2 (en) 1997-02-19 1997-02-19 Mounting device

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JPH10233418A JPH10233418A (en) 1998-09-02
JP3638748B2 true JP3638748B2 (en) 2005-04-13

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