JP3575431B2 - Tube - Google Patents

Description

【００３８】
表１から明らかなように、液相線温度が２３３℃を越える無鉛はんだ合金１２，１３を用いた例えば実施例４、実施例５および実施例６では、１０００本中全てのものにおいて、アイレット部１０の貫通孔１４付近に位置しているリード線７とアイレット部１０とを接続する無鉛はんだ合金１２に穴が空いているものはなく、リード線７とアイレット部１０とが安定にかつ確実に接続されていた。
【００３９】
一方、液相線温度が２３３℃以下の無鉛はんだ合金を用いた例えば実施例１では１０００本中１０本のものが、実施例２では１０００本中６本のものが、実施例３では１０００本中２本のものがアイレット部１０の貫通孔１４付近に位置している無鉛はんだ合金１２に穴が空いているのが確認され、リード線７とアイレット部１０との接続が不十分であった。
【００４０】
リード線７とアイレット部１０とを安定にかつ確実に接続することができた実施例４、実施例５および実施例６の場合、製造工程において、これらの実施例に用いられた無鉛はんだ合金１２，１３の液相線温度と、アイレット部１０の表面上に溶融した無鉛はんだ合金１２を付ける時のアイレット部１０の表面温度（３００℃前後）との温度差が６７℃未満と小さく、その結果、無鉛はんだ合金１２をアイレット部１０の表面上に溶融付着させた後、アイレット部１０の表面温度が下がるのにともなって溶融した無鉛はんだ合金１２が固化し始めるのに要する時間が短時間になるためであると考えられる。つまり、管球本体３と口金５とを固着している接着剤４に含まれる残留揮発成分から発生したガスがアイレット部１０の貫通孔１４を通じて外部へ噴流しようとしても、無鉛はんだ合金１２はその一部がすでに固化して粘性が増しているので、そのガスの噴流圧力に十分耐え得ることができたためであると考えられる。
【００４１】
一方、リード線７とアイレット部１０との接続が不十分であった実施例１、実施例２および実施例３の場合、製造工程において、これらの実施例に用いられた無鉛はんだ合金の液相線温度と、アイレット部１０の表面上に溶融した無鉛はんだ合金を付ける時のアイレット部１０の表面温度との温度差が６７℃以上と大きく、アイレット部１０の表面上に溶融付着させた無鉛はんだ合金は直ちに固化し始めないので、その粘性が低く、よって上記残留揮発成分から発生し、アイレット部１０の貫通孔１４を通じて外部へ噴流しようとするガスの噴流圧力に耐え得ることができなかったためであると考えられる。
【００４２】
また、表１から明らかなように、液相線温度が２３３℃を越える無鉛はんだ合金１２，１３を用いた例えば実施例４、実施例５および実施例６では、１０００本中全てのものにおいて、製造工程中、シェル部１１の表面上に溶融付着させた無鉛はんだ合金１３が垂れ落ちることはなく、リード線８とシェル部１１とが安定にかつ確実に接続されていた。
【００４３】
一方、液相線温度が２３３℃以下の無鉛はんだ合金を用いた例えば実施例１では１０００本中４本のものが、実施例２では１０００本中２本のものが、実施例３では１０００本中１本のものが、製造工程中、シェル部１１の表面上に溶融付着させた無鉛はんだ合金の一部が垂れ落ちているのが確認され、リード線８とシェル部１１との接続が不十分であった。
【００４４】
リード線８とシェル部１１とを安定にかつ確実に接続することができた実施例４、実施例５および実施例６の場合、製造工程において、これらの実施例に用いられた無鉛はんだ合金１２，１３の液相線温度と、シェル部１１の表面上に溶融した無鉛はんだ合金１３を付ける時のシェル部１１の表面温度との温度差が小さいために、溶融した無鉛はんだ合金１３は短時間で固化し始めてその粘性が増しているので、次の工程への搬送時の振動等が口金５に加わったとしても、シェル部１１から垂れ落ちにくい状態にあったためであると考えられる。
【００４５】
一方、リード線８とシェル部１１との接続が不十分であった実施例１、実施例２および実施例３の場合、製造工程において、これらの実施例に用いられた無鉛はんだ合金の液相線温度と、シェル部１１の表面上に溶融した無鉛はんだ合金１３を付ける時のシェル部１１の表面温度との温度差が大きいために、溶融した無鉛はんだ合金は直ちに固化し始めず、その粘性が低い状態のままなので、口金５に加わる搬送時の振動等に対して垂れ落ちやすい状態にあったためであると考えられる。
【００４６】
さらに、実施例７に用いられている液相線温度が３０５℃である銅２．５重量％、錫９７．５重量％からなる無鉛はんだ合金は、その液相線温度がアイレット部１０およびシェル部１１の表面上に溶融した無鉛はんだ合金１２，１３を付ける時のアイレット部１０およびシェル部１１の表面温度とほぼ同じであるため、アイレット部１０およびシェル部１１の表面上の無鉛はんだ合金１２，１３が初期の段階から完全に溶融せずに、その結果、リード線７，８とアイレット部１０およびシェル部１１とを確実に接続することができない。そこで、その無鉛はんだ合金１２，１３を初期の段階で完全に溶融させるために、アイレット部１０およびシェル部１１の表面温度を高くすればよいが、その場合、製造コストが高くなるだけでなく、省エネルギーの観点から好ましくない。また、液相線温度が３０５℃である銅２．５重量％、錫９７．５重量％からなる無鉛はんだ合金を完全に溶融させることができたとしても、銅の含有量が多いために無鉛はんだ合金の硬度が大きくなりすぎ、リード線７，８とアイレット部１０およびシェル部１１との接続作業が困難になる。
【００４７】
以上のように管球本体３と、この管球本体３の端部に固着された口金５と、この口金５に無鉛はんだ合金１２，１３を介して接続された電力供給用のリード線７，８とを備えた管球において、二つの元素からなり、かつ液相線温度が２３３℃を越え３０５℃未満の無鉛はんだ合金１２，１３、例えば銅の含有量が１．０重量％を越え２．５重量％未満、残部が錫からなる無鉛はんだ合金１２，１３を用いることにより、リード線７とアイレット部１０とを無鉛はんだ合金１２を介して接続する際、アイレット部１０の貫通孔１４付近に位置している無鉛はんだ合金１２に穴が空くのを防止することができ、リード線７とアイレット部１０とを安定にかつ確実に接続することができる。その上、口金５を管球本体３の端部に嵌装した後、接着剤４中の残留揮発成分から発生するガスを抜く必要等がないため、生産速度を従来の生産速度とほぼ同じ速度を維持することができ、よって生産効率が低下することはない。一方、リード線８とシェル部１１との接続においては、同じく二つの元素からなり、かつ液相線温度が２３３℃を越え３０５℃未満の例えば銅の含有量が１．０重量％を越え２．５重量％未満、残部が錫からなる無鉛はんだ合金１３を用いることにより、製造工程において、シェル部１１の表面上に溶融付着させた無鉛はんだ合金１３が垂れ落ちるのを防止することができ、リード線８とシェル部１１とを安定にかつ確実に接続することができる。また、無鉛はんだ合金１２，１３は二つの元素からなるため、組成管理が容易になり、製造コストを低く抑えることができ、しかも有毒な鉛を含んでいないため、地球環境に優しい管球を実現することができる。
【００４８】
特に、銅の含有量が１．２重量％以上２．０重量％以下、残部が錫からなる無鉛はんだ合金１２，１３を用いてリード線７，８とアイレット部１０およびシェル部１１とを接続することにより、溶融した無鉛はんだ合金１２，１３がさらに短時間で固化し始めて粘性が一層増すので、リード線７，８とアイレット部１０およびシェル部１１とを一層安定にかつ確実に接続することができる。
【００４９】
また、表１から明らかなように好ましい結果が得られた実施例４、実施例５および実施例６に用いられた無鉛はんだ合金１２，１３はいずれも固相線温度が２２７℃以上であり、ＪＩＳＣ７５０１（１９９６）記載の口金接着強度の試験温度である１６５℃を上回っており、この規定を満足している。
【００５０】
さらに、特に、無鉛はんだ合金１３に銅が含まれ、かつシェル部１１の材料としてアルミニウムが用いられている場合、製造工程において、溶融した無鉛はんだ合金１３を構成する銅とシェル部１１の材料であるアルミニウムとがその界面で化合物を形成するため、シェル部１１と溶融したはんだ合金１３との接着力は強く、よって溶融したはんだ合金１３が垂れ落ちるのを一層防止することができる。もちろん点灯中においても、万一、リード線８とシェル部１１とを接続している無鉛はんだ合金１３の一部が溶けてしまうことがあっても、上述した理由により、溶融したはんだ合金１３がシェル部１１から垂れ落ちることはない。
【００５１】
なお、上記実施の形態では、白熱電球を例示して説明したが、本発明は白熱電球以外にハロゲン電球、電球形蛍光ランプ、および高圧放電ランプ等にも適用することができる。
【００５２】
【発明の効果】
以上説明したように本発明は、製造工程において、生産効率を低下させることなく、口金と電力供給用のリード線とを安定にかつ確実に接続することができるとともに、組成管理が容易なために製造コストを低く抑えることができ、また地球環境に配慮した管球を提供することができるものである。
【図面の簡単な説明】
【図１】本発明の実施の形態である白熱電球の一部切欠正面図
【図２】同じく白熱電球の要部拡大断面図
【符号の説明】
１ バルブ
２ ステム
３ 管球本体
４ 接着剤
５ 口金
６ アンカー線
７，８ リード線
９ フィラメント
１０ アイレット部
１１ シェル部
１２，１３ 無鉛はんだ合金
１４ 貫通孔
１５ 絶縁ガラス部[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a tube.
[0002]
[Prior art]
A bulb, for example an incandescent lamp, generally comprises a bulb body having a bulb provided with a filament therein and a stem sealed at the end of the bulb, and a thermosetting bulb at the end of the bulb body. And a screw-in base having an eyelet part and a shell part, a part of which is sealed in the stem, one end of which is connected to the filament, and the other end of which is a tube body. And two lead wires for power supply which are respectively derived from the eyelet portion and connected to the shell portion via a solder alloy.
[0003]
Conventionally, S-Pb80Sn20 and S-Pb90Sn10 described in a description table of JISZ3282 (1999) have been widely used as solder alloys for connecting lead wires to an eyelet portion and a shell portion, respectively.
[0004]
However, recently, the use of such a lead-containing solder alloy is not preferable from the viewpoint of the global environment, and therefore, a solder containing no toxic substance such as lead has been proposed.
[0005]
For example, Japanese Unexamined Patent Publication No. Hei 10-107420 discloses that 99.3% by weight of tin and 0.7% by weight of copper are used for assembling a substrate and an electronic component. (Hereinafter simply referred to as “tin-copper eutectic alloy”).
[0006]
Further, as another solder for connecting lead wires to the eyelet portion and the shell portion, a 100% tin solder having a high solidus temperature has been proposed.
[0007]
Here, a method for manufacturing the incandescent lamp will be described.
[0008]
After the stem is sealed to the end of the valve by a usual manufacturing method, an impurity gas or the like in the valve is evacuated to produce a tube body. At this point, the temperature of the end of the tube body on the side where the base is fixed has reached about 700 ° C.
[0009]
Subsequently, a base having a liquid adhesive applied inside is fitted to the end of the high-temperature tube body, and then the adhesive is cured by residual heat of the bulb and heating by a gas burner, thereby forming the tube bulb. Secure to the end of the body. When the base is fitted, one of the two lead wires led out of the tube body is inserted into a through hole provided at the center of the eyelet portion, and the other lead wire is bent and the valve is bent. And the shell portion is led out of the base.
[0010]
After the unnecessary portions of the lead wires led out are melted by a gas burner or the like, a flux is applied to the entire surface of the eyelet portion and the surface of the portion of the shell portion to be connected to the lead wires. Thereafter, a solder alloy melted by a gas burner or the like is applied on the surfaces of the eyelet portion and the shell portion, and the solder alloy is cooled and solidified, thereby connecting lead wires to the eyelet portion and the shell portion, respectively. The surface temperature of the eyelet portion and the shell portion at the time of soldering is around 300 ° C.
[0011]
Thereafter, the lamp is naturally cooled to produce an incandescent lamp.
[0012]
[Problems to be solved by the invention]
However, when an incandescent lamp is manufactured by using the above-described manufacturing method, particularly when the tin-copper eutectic alloy or 100% tin solder is used as a solder alloy for connecting a lead wire to an eyelet portion, an eyelet is used. After a while after applying the molten solder on the surface of the part, there is a hole in the molten solder located near the through hole in the eyelet part, and the solder solidifies as it is, so the eyelet part And lead wires cannot be reliably connected.
[0013]
The inventor has studied this problem and found that when a lead wire is connected to an eyelet portion via solder, when the surface temperature of the eyelet portion is in a high temperature state of about 300 ° C., a solder is formed on the surface of the eyelet portion. Therefore, it takes time for the molten solder to start solidifying, during which gas generated from residual volatile components contained in the adhesive fixing the tube body and the base passes through the through holes in the eyelet. And tried to jet it to the outside, and found that there was a hole in the molten solder due to the jet pressure of the gas.
[0014]
Therefore, after sufficient time has passed since the base was fitted to the end of the tube body, that is, after the gas generated from the residual volatile components in the adhesive was sufficiently removed, the solder was placed on the surface of the eyelet. The phenomenon of forming holes in the solidified solder as described above did not occur. However, this method has a problem in that the production speed must be reduced, and the production efficiency is reduced.
[0015]
On the other hand, regarding the connection between the shell portion and the lead wire via the solder, it takes time for the molten solder to start to solidify, so that the solder drips from the shell portion due to vibration during transportation to the next step. There is a problem of falling.
[0016]
The present invention has been made in order to solve such a problem, and can stably and reliably connect a base and a lead wire for power supply without reducing production efficiency in a manufacturing process. The purpose of the present invention is to provide a bulb in consideration of the global environment.
[0017]
[Means for Solving the Problems]
The tube of the present invention is a tube body having a bulb , and a screw-in having an eyelet portion and a shell portion, which are fixed to an end portion of the tube body using an adhesive containing a volatile component and provided with a through hole. A power supply lead wire extending outside the bulb, the lead wire being inserted through the through-hole, connected to the eyelet portion via a lead-free solder alloy, the lead- free solder The alloy is composed of two elements, and has a liquidus temperature of more than 233 ° C. and less than 305 ° C. , and its liquidus temperature and the above-mentioned temperature when applying the molten lead-free solder alloy on the surface of the eyelet portion. temperature difference between the surface temperature of the eyelet portion has a configuration Ru der below 67 ° C..
[0018]
Thereby, in particular, when using a screw-type base having an eyelet part and a shell part provided with a through hole for inserting a lead wire in the center part as a base, the liquid phase line of a lead-free solder alloy is used in the manufacturing process. The temperature difference between the temperature and the surface temperature of the eyelet when the molten lead-free solder alloy is applied on the surface of the eyelet can be reduced, and as a result, the lead-free solder alloy is melted and adhered on the surface of the eyelet. After that, the time required for the molten lead-free solder alloy to begin to solidify with a decrease in the surface temperature of the eyelet portion is short, so it is included in the adhesive fixing the tube body and the base. Even if the gas generated from the residual volatile components tries to jet to the outside through the through hole in the eyelet, part of the lead-free solder alloy has already solidified and the viscosity has increased. Since, it is possible that the jet pressure of the gas can withstand sufficiently to prevent holes become free in a portion located near the through-hole of the eyelet section. In addition, after fitting the base to the end of the tube body, there is no need to remove gas generated from the residual volatile components in the adhesive, so that the production speed is maintained at substantially the same speed as the conventional production speed. Therefore, the production efficiency is not reduced.
[0019]
In the case where the lead-free solder alloy is used for connecting the lead wire and the shell portion, the molten lead-free solder alloy starts to solidify in a short time and its viscosity increases as described above. Even if vibration or the like during transportation to the base is applied to the die, the molten lead-free solder alloy can be prevented from dripping from the shell portion.
[0020]
Furthermore, since lead-free solder alloys are composed of two elements, composition management is easy, manufacturing costs can be kept low, and because they do not contain toxic lead, it is possible to realize a bulb that is friendly to the global environment. it can.
[0021]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0022]
An incandescent lamp with a rated voltage of 100 V and a rated power of 54 W according to an embodiment of the present invention is a glass having a bulb 1 and a stem 2 sealed to an end of the bulb 1 as shown in FIGS. And a screw-type base 5 fixed to an end of the tube main body 3 with an adhesive 4.
[0023]
1 and 2, reference numeral 6 denotes an anchor line.
[0024]
The stem 2 is partially sealed with two power supply lead wires 7 and 8, respectively.
[0025]
A filament 9 made of tungsten is provided between the ends of the two lead wires 7, 8 extending into the bulb 1. On the other hand, the ends of the lead wires 7 and 8 extending outside the bulb 1 are connected to an eyelet portion 10 and a shell portion 11 of a base 5 described later via solder alloys 12 and 13, respectively.
[0026]
The base 5 includes, as shown in FIG. 2, a brass eyelet portion 10 having a through hole 14 for inserting one lead wire 7 in the center portion, an aluminum or brass shell portion 11, An insulating glass part 15 for insulating the eyelet part 10 and the shell part 11 is provided.
[0027]
The surfaces of the brass eyelet portion 10 and the shell portion 11 may be plated with nickel.
[0028]
The solder alloys 12, 13 for connecting the lead wires 7, 8 to the eyelet portion 10 and the shell portion 11, respectively, are composed of two elements, for example, copper and tin, and have a liquidus temperature exceeding 233 ° C. and exceeding 305 ° C. A lead-free solder alloy having a temperature of less than ℃ is used.
[0029]
When the lead-free solder alloys 12 and 13 are made of copper and tin, the component ratio is specified so that copper exceeds 1.0% by weight and less than 2.5% by weight, and the balance is tin. Preferably, copper is 1.2% by weight or more and 2.0% by weight or less, and the balance is tin.
[0030]
The lead-free solder alloys 12 and 13 may contain a flux or the like, and may contain unavoidable impurities.
[0031]
As the adhesive 4 for fixing the tube body 3 and the base 5, for example, an ethanol compound containing a heat-resistant resin such as novolak or rosin is used.
[0032]
Next, the operation and effect of the incandescent lamp according to the embodiment of the present invention were studied.
[0033]
First, it is composed of copper and tin, and the component ratio thereof is 0.0% by weight of copper (Example 1), 0.7% by weight of copper (Example 2), 1.0% by weight of copper (Example 3), Copper 1.2% by weight (Example 4), copper 1.5% by weight (Example 5), copper 2.0% by weight (Example 6), copper 2.5% by weight (Example 7), and the rest Each of 1,000 incandescent lamps was manufactured by a conventional manufacturing method using the lead-free solder alloys 12 and 13 each made of tin. Then, in each of the incandescent lamps produced, the connection state between the lead wire 7 and the eyelet part 10 and the connection state between the lead wire 8 and the shell part 11 were examined, and the results shown in Table 1 were obtained. .
[0034]
The solidus temperature (° C.) and the liquidus temperature (° C.) of the lead-free solder alloys 12 and 13 used in each example are also shown in Table 1. A differential calorimeter (manufactured by Rigaku Corporation; TAS300 DSC8230D) was used to measure the solidus temperature and liquidus temperature.
[0035]
The lead wires 7 and 8 used are Monel wires having a diameter of 0.2 mm, and the diameter of the through hole 14 of the eyelet portion 10 is 1.2 mm.
[0036]
Further, the production speed of the production line used is one per second.
[0037]
[Table 1]

[0038]
As is clear from Table 1, in Examples 4, 5, and 6 using lead-free solder alloys 12 and 13 having a liquidus temperature exceeding 233 ° C., the eyelet portion was found in all of the 1,000 solders. There is no hole in the lead-free solder alloy 12 connecting the lead wire 7 and the eyelet portion 10 located in the vicinity of the through hole 14 of the lead wire 10, and the lead wire 7 and the eyelet portion 10 are stably and surely formed. Was connected.
[0039]
On the other hand, for example, 10 out of 1000 solders using a lead-free solder alloy having a liquidus temperature of 233 ° C. or lower, 6 out of 1000 solders in Example 2, and 1000 solders in Example 3 Two of them were confirmed to have holes in the lead-free solder alloy 12 located near the through hole 14 of the eyelet part 10, and the connection between the lead wire 7 and the eyelet part 10 was insufficient. .
[0040]
In the case of the fourth, fifth, and sixth embodiments in which the lead wire 7 and the eyelet portion 10 could be connected stably and reliably, in the manufacturing process, the lead-free solder alloy 12 used in these embodiments was used. , 13 and the surface temperature of the eyelet 10 (around 300 ° C.) when the molten lead-free solder alloy 12 is applied on the surface of the eyelet 10 is as small as less than 67 ° C., and as a result, After the lead-free solder alloy 12 is melt-adhered to the surface of the eyelet portion 10, the time required for the molten lead-free solder alloy 12 to start solidifying as the surface temperature of the eyelet portion 10 decreases becomes short. It is thought that it is. In other words, even if the gas generated from the residual volatile components contained in the adhesive 4 fixing the tube body 3 and the base 5 tries to jet to the outside through the through hole 14 of the eyelet part 10, the lead-free solder alloy 12 is not It is considered that this was because a portion of the gas had already been solidified and the viscosity had increased, so that the gas could sufficiently withstand the jet pressure of the gas.
[0041]
On the other hand, in the case of Examples 1, 2 and 3 where the connection between the lead wire 7 and the eyelet portion 10 was insufficient, the liquid phase of the lead-free solder alloy used in these examples was used in the manufacturing process. The temperature difference between the linear temperature and the surface temperature of the eyelet portion 10 when applying the molten lead-free solder alloy on the surface of the eyelet portion 10 is as large as 67 ° C. or more, and the lead-free solder melted and adhered on the surface of the eyelet portion 10 Since the alloy does not immediately start to solidify, its viscosity is low, and thus it cannot withstand the jet pressure of the gas generated from the residual volatile components and going to jet to the outside through the through hole 14 of the eyelet portion 10. It is believed that there is.
[0042]
As is clear from Table 1, in Examples 4, 5 and 6 using lead-free solder alloys 12 and 13 whose liquidus temperature exceeds 233 ° C. During the manufacturing process, the lead-free solder alloy 13 melt-adhered to the surface of the shell portion 11 did not drip, and the lead wire 8 and the shell portion 11 were connected stably and reliably.
[0043]
On the other hand, for example, a lead-free solder alloy having a liquidus temperature of 233 ° C. or less is used, for example, four out of 1,000 in Example 1, two out of 1,000 in Example 2, and 1,000 in Example 3. During the manufacturing process, it was confirmed that part of the lead-free solder alloy melt-adhered to the surface of the shell part 11 was dripped, and the connection between the lead wire 8 and the shell part 11 was not successful. Was enough.
[0044]
In the case of the fourth, fifth, and sixth embodiments in which the lead wire 8 and the shell part 11 could be connected stably and reliably, in the manufacturing process, the lead-free solder alloy 12 used in these embodiments was used. , 13 and the surface temperature of the shell part 11 when the molten lead-free solder alloy 13 is applied on the surface of the shell part 11, the molten lead-free solder alloy 13 It is considered that this is because the viscous material has started to solidify and the viscosity has increased, so that even if vibrations or the like during the transfer to the next step are applied to the base 5, it is unlikely to hang down from the shell portion 11.
[0045]
On the other hand, in the case of Examples 1, 2 and 3 where the connection between the lead wire 8 and the shell portion 11 was insufficient, the liquid phase of the lead-free solder alloy used in these examples was used in the manufacturing process. Since the temperature difference between the linear temperature and the surface temperature of the shell part 11 when the molten lead-free solder alloy 13 is applied on the surface of the shell part 11 is large, the molten lead-free solder alloy does not immediately start to solidify, but its viscosity increases. This is considered to be due to the fact that the liquid crystal was kept in a low state, and was likely to hang down due to vibration or the like at the time of conveyance applied to the base 5.
[0046]
Further, the lead-free solder alloy composed of 2.5% by weight of copper having a liquidus temperature of 305 ° C. and 97.5% by weight of tin used in Example 7 has the liquidus temperature of the eyelet portion 10 and the shell. Since the surface temperatures of the eyelet portion 10 and the shell portion 11 when the molten lead-free solder alloys 12 and 13 are applied on the surface of the portion 11 are substantially the same, the lead-free solder alloy 12 on the surface of the eyelet portion 10 and the shell portion 11 is used. , 13 are not completely melted from the initial stage, and as a result, the lead wires 7, 8 cannot be securely connected to the eyelet portion 10 and the shell portion 11. Therefore, in order to completely melt the lead-free solder alloys 12 and 13 at the initial stage, the surface temperatures of the eyelet portion 10 and the shell portion 11 may be increased, but in this case, not only the manufacturing cost is increased but also the cost is increased. It is not preferable from the viewpoint of energy saving. Further, even if a lead-free solder alloy consisting of 2.5% by weight of copper and 97.5% by weight of tin having a liquidus temperature of 305 ° C. can be completely melted, since the content of copper is large, it is unleaded. The hardness of the solder alloy becomes too large, and it becomes difficult to connect the lead wires 7, 8 to the eyelet portion 10 and the shell portion 11.
[0047]
As described above, the tube body 3, the base 5 fixed to the end of the tube body 3, and the power supply lead wires 7 connected to the base 5 through the lead-free solder alloys 12 and 13. 8, the lead-free solder alloys 12, 13 consisting of two elements and having a liquidus temperature of more than 233 ° C. and less than 305 ° C., for example, a copper content of more than 1.0% by weight When the lead wire 7 and the eyelet portion 10 are connected to each other through the lead-free solder alloy 12 by using the lead-free solder alloys 12 and 13 whose balance is less than 0.5% by weight and tin, the vicinity of the through hole 14 of the eyelet portion 10 is used. Holes can be prevented from being formed in the lead-free solder alloy 12 located at the position (1), and the lead wire 7 and the eyelet portion 10 can be connected stably and reliably. In addition, after the base 5 is fitted to the end of the tube body 3, there is no need to remove gas generated from the residual volatile components in the adhesive 4, so that the production speed is almost the same as the conventional production speed. Can be maintained, so that the production efficiency does not decrease. On the other hand, in the connection between the lead wire 8 and the shell 11, the liquidus temperature is higher than 233 ° C. and lower than 305 ° C., for example, the copper content is higher than 1.0% by weight and higher than 233 ° C. By using the lead-free solder alloy 13 containing less than 0.5% by weight and the balance being tin, it is possible to prevent the lead-free solder alloy 13 melt-adhered onto the surface of the shell portion 11 from dripping in the manufacturing process, The lead wire 8 and the shell 11 can be connected stably and reliably. In addition, since the lead-free solder alloys 12 and 13 are composed of two elements, composition control is easy, manufacturing costs can be kept low, and since no toxic lead is contained, a bulb friendly to the global environment is realized. can do.
[0048]
In particular, the lead wires 7, 8 are connected to the eyelet portion 10 and the shell portion 11 using lead-free solder alloys 12, 13 having a copper content of 1.2% by weight or more and 2.0% by weight or less and the balance being tin. By doing so, the molten lead-free solder alloys 12 and 13 start to solidify in a shorter time and the viscosity further increases, so that the lead wires 7 and 8 are more stably and reliably connected to the eyelet portion 10 and the shell portion 11. Can be.
[0049]
Further, as is clear from Table 1, the lead-free solder alloys 12 and 13 used in Examples 4, 5 and 6 in which favorable results were obtained have a solidus temperature of 227 ° C. or higher, respectively. It exceeds the test temperature of 165 ° C., which is the test temperature of the die adhesive strength described in JIS C7501 (1996), and satisfies this requirement.
[0050]
Further, particularly, when copper is contained in the lead-free solder alloy 13 and aluminum is used as the material of the shell portion 11, in the manufacturing process, the copper constituting the molten lead-free solder alloy 13 and the material of the shell portion 11 are used. Since aluminum forms a compound at the interface with the aluminum, the adhesive strength between the shell portion 11 and the molten solder alloy 13 is strong, so that the molten solder alloy 13 can be further prevented from dripping. Of course, even during the lighting, even if a part of the lead-free solder alloy 13 connecting the lead wire 8 and the shell part 11 may be melted, the molten solder alloy 13 may be melted for the above-described reason. It does not hang down from the shell 11.
[0051]
In the above embodiment, an incandescent lamp is described as an example. However, the present invention can be applied to a halogen lamp, a bulb-type fluorescent lamp, a high-pressure discharge lamp, and the like, in addition to the incandescent lamp.
[0052]
【The invention's effect】
As described above, the present invention can stably and reliably connect the base and the lead wire for power supply without reducing the production efficiency in the manufacturing process, and the composition management is easy. The manufacturing cost can be kept low, and a bulb in consideration of the global environment can be provided.
[Brief description of the drawings]
FIG. 1 is a partially cutaway front view of an incandescent lamp according to an embodiment of the present invention. FIG. 2 is an enlarged sectional view of a main part of the incandescent lamp.
DESCRIPTION OF SYMBOLS 1 Valve 2 Stem 3 Tube main body 4 Adhesive 5 Base 6 Anchor wire 7,8 Lead wire 9 Filament 10 Eyelet part 11 Shell part 12,13 Lead-free solder alloy 14 Through hole 15 Insulating glass part

Claims (4)

A bulb main body having a bulb , a screw-in type base having an eyelet part and a shell part which are fixed to an end of the bulb main body using an adhesive containing a volatile component and provided with a through hole, and the valve And a lead wire for power supply extending outside the lead wire, the lead wire is inserted into the through-hole, connected to the eyelet portion via a lead-free solder alloy, the lead- free solder alloy is composed of two elements And the liquidus temperature is higher than 233 ° C. and lower than 305 ° C. , and the liquidus temperature is different from the surface temperature of the eyelet part when the molten lead-free solder alloy is applied on the surface of the eyelet part. bulb temperature difference, characterized in der Rukoto below 67 ° C.. The bulb according to claim 1, wherein the lead-free solder alloy comprises copper and tin. 3. The bulb according to claim 2, wherein the content of copper is more than 1.0% by weight and less than 2.5% by weight, and the balance is made of tin. 4. The bulb according to claim 2, wherein the copper content is 1.2% by weight or more and 2.0% by weight or less, and the balance is made of tin.

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