JP3575372B2 - Wire bonding equipment - Google Patents

Wire bonding equipment Download PDF

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Publication number
JP3575372B2
JP3575372B2 JP2000025031A JP2000025031A JP3575372B2 JP 3575372 B2 JP3575372 B2 JP 3575372B2 JP 2000025031 A JP2000025031 A JP 2000025031A JP 2000025031 A JP2000025031 A JP 2000025031A JP 3575372 B2 JP3575372 B2 JP 3575372B2
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Prior art keywords
horn
swing
wire
base
wire bonding
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JP2001217276A (en
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仁 向島
誠司 ▲高▼橋
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、ワイヤをボンディング対象物にボンディングするワイヤボンディング装置に関するものである。
【０００２】
【従来の技術】
半導体素子を基板の回路電極と電気的に接続する方法としてワイヤボンディングが広く用いられている。このワイヤボンディングでは、半導体素子の外部接続用電極に金線などのワイヤの一端部をキャピラリツールによってボンディングし、この一端部がボンディングされた状態のワイヤをキャピラリツールを移動させることにより引き回して基板の回路電極上のボンディング点にボンディングする。
【０００３】
このボンディング動作においては、各ボンディング点毎にワイヤをボンディング部位に押圧するためキャピラリツールは高頻度で上下動を繰り返す。この上下動は一般にキャピラリツールを保持した棒状のホーン部材を水平方向の揺動軸周りに揺動させることにより行われる。このため、ホーン部材は揺動自在に支持されており、従来よりこのホーン部材を軸支する構造として一般の回転軸受けが用いられていた。
【０００４】
【発明が解決しようとする課題】
しかしながらボンディング動作においてはキャピラリはわずかな高さ範囲を上下動するのみであるため、ホーン部材を軸支する揺動軸の回転角度はきわめて小さい。このためホーン部材を軸支する回転軸受けは通常の回転を行うことなく常に微小角度のみ回転する。この結果、回転軸受け中のボールなどの転動部は常に同一点のみが接触状態にあり、この接触面には転動によって他の部分からの潤滑剤の供給が行われないことから常に潤滑不十分となる。この結果、フレッチングにより回転軸受けがきわめて短い期間で使用不能となり、軸受け交換などの保守作業を高頻度で行わなければならないという問題点があった。
【０００５】
そこで本発明は、ホーン部材を軸支する揺動軸の回転軸受けを廃止し、保守作業の頻度を低減させることができるワイヤボンディング装置を提供することを目的とする。
【０００６】
【課題を解決するための手段】
請求項１記載のワイヤボンディング装置は、ワイヤをボンディング対象面にボンディングするワイヤボンディング装置であって、ワイヤが挿通するキャピラリツールを保持するホーンと、このホーンが結合された基部と、この基部を両側から水平方向の揺動軸廻りに揺動自在に支持する軸支持部と、前記ホーンを前記揺動軸廻りに揺動させる揺動駆動部とを備え、前記軸支持部は前記揺動軸を中心に放射状に配置された複数枚の板バネ部材を有し、前記板バネ部材の中間部に外側から内側に向かって切り欠き部が設けられている。
【０００８】
本発明によれば、ホーンが結合されたブロックを両側から水平な揺動軸周りに揺動自在に保持する軸支持部を揺動軸を中心に放射状に配置された複数枚の板バネ部材で構成することにより、回転軸受けを使用せずにホーンを揺動自在に支持することができる。
【０００９】
【発明の実施の形態】
次に本発明の実施の形態を図面を参照して説明する。図１は本発明の一実施の形態のワイヤボンディング装置の斜視図、図２は本発明の一実施の形態のワイヤボンディング装置のホーン駆動機構の部分断面図、図３は本発明の一実施の形態のワイヤボンディング装置のホーンの斜視図、図４は本発明の一実施の形態のワイヤボンディング装置のホーン支持部の分解斜視図である。
【００１０】
まず、図１を参照してワイヤボンディング装置の全体構造を説明する。基台１の上面には、基板２が載置されている。基板２には、ワイヤボンディング対象のチップ３が搭載されている。チップ３の周辺にはワイヤボンディング点である回路電極５が多数形成されており、ワイヤボンディングにおいては、チップ３の外部接続用電極と回路電極５とをワイヤによって接続する。
【００１１】
基板２上には押さえ板６が配設されている。押さえ板６はシリンダ７のロッド７ａに連結されており、ロッド７ａが引き込むと基板２は押さえ板６で押さえつけられて固定される。基台１の側方には可動テーブル１０が設置されており、可動テーブル１０上には駆動ボックス１１が設けられている。駆動ボックス１１からはホーン１２が前方へ延出しており、ホーン１２の先端部にはキャピラリツール１３が保持されている。
【００１２】
キャピラリツール１３には、ワイヤボンディングに用いられるワイヤ１５が挿通する。ワイヤ１５はスプール１４に卷回された状態で供給され、スプール１４から繰り出されたワイヤ１５はテンション付与部１７、カットクランパ１６を経てキャピラリツール１３に挿通する。カットクランパ１６は開閉動作を行うことによりワイヤ１５をクランプして固定する。キャピラリツール１３の下端部に近接して、トーチ１９が配設されている。トーチ１９は、キャピラリツール１３の下端部から突出したワイヤ１５との間でスパークを発生させることにより、ワイヤ１５の下端部に金属のボールを形成する。
【００１３】
Ｘ方向モータ１０ＸとＹ方向モータ１０Ｙが駆動して可動テーブル１０が作動すると、可動テーブル１０上の駆動ボックス１１、ホーン１２、キャピラリツール１３などはＸ方向やＹ方向へ水平移動する。また、キャピラリツール１３は駆動ボックス１１内に収納され図示しないホーン駆動機構に駆動されＺ方向の上下動を行う。
【００１４】
次に図２、図３、図４を参照して、駆動ボックス１１内に収納されホーン１２を上下方向に揺動させるホーン駆動機構について説明する。図２において、駆動ボックス１１の側面には固定軸受け２３がボルト３１によって固着されている。固定軸受け２３には、円板状の揺動支持部材２４が嵌合している。揺動支持部材２４は、セットボルト３２によって固定軸受け２３に固定されている。
【００１５】
揺動支持部材２４の中心線は、図４に示すようにホーン１２が結合された基部２０を揺動回転させる揺動軸ＣＬと一致している。そして基部２０は以下に説明する弾性軸構造を介して揺動支持部材２４によって水平方向の揺動軸ＣＬ廻りに揺動自在に支持されている。
【００１６】
図３に示すように、キャピラリツール１３が装着されたホーン１２は基部２０に支持されており、基部２０にはボイスコイル２１が装着されている。図２に示す駆動ボックス１１の底面に配設されたステータ２２はボイスコイル２１内部に挿通しており、ボイスコイル２１とステータ２２より構成されるボイスコイルモータを駆動することにより、基部２０は揺動軸ＣＬ廻りに揺動回転を行う。これにより、ホーン１２の先端部のキャピラリツール１３は上下動を行う。ボイスコイル２１とステータ２２は、ホーン１２を揺動軸廻りに揺動させる揺動駆動部となっている。
【００１７】
次にこの基部２０の揺動回転を支持する弾性軸構造について説明する。図４に示すように、基部２０の側面には、揺動軸ＣＬを中心とした軸対称位置に三角形状の突起部２０ａ，２０ｂが固着されている。また揺動支持部材２４の側面にも同様形状の突起部２４ａ，２４ｂが形成されている。
【００１８】
基部２０と揺動支持部材２４は、揺動軸ＣＬを中心として放射状に配置された４枚の板バネ部材２５によって結合されている。板バネ部材２５は、図４に示すように略矩形状の板バネの中間部に外側から内側に向って切り欠き部２５ａを設けた形状となっている。
【００１９】
板バネ部材２５の基部２０側の端部は、図２（ｂ）のＡ−Ａ断面に示すように、突起部２０ａ，２０ｂと固定部材２７Ａ，２７Ｂとの間に挟み込まれている。板バネ部材２５が挟み込まれた状態で、ボルト３０によって固定部材２７Ａ，２７Ｂを締め付けることにより、板バネ部材２５は基部２０と結合される。板バネ部材２５の揺動支持部材２４側の端部も同様に、突起部２４ａ，２４ｂと固定部材２８Ａ，２８Ｂとの間に板バネ部材２５を挟み込み、ボルト３０によって締め付けることにより、板バネ部材２５は揺動支持部材２４と結合される。
【００２０】
これにより、基部２０は揺動支持部材２４に４枚の板バネ部材２５を介して結合される。板バネ部材２５は板面と垂直方向の荷重に対して撓みを生じやすく、揺動軸ＣＬ廻りのねじりモーメントに対して容易にねじり変形を生じる。したがって、揺動支持部材２４により揺動軸ＣＬの位置を固定した状態において、基部２０に揺動軸ＣＬ廻りに揺動駆動力を作用させることにより、基部２０は揺動軸ＣＬ廻りに揺動する。すなわち、固定軸受け２３、揺動支持部材２４および４枚の板バネ部材２５は基部２０を両側から揺動自在に支持する軸支持部となっている。
【００２１】
この弾性軸構造において、図２（ｃ）のＢ−Ｂ断面図に示すように、弾性軸の中間部の断面は各板バネ部材２５に設けられた切り欠き部２５ａの存在により、断面積が他の断面と比較して極めて小さくなっている。このため、４枚の板バネを組み合わせた弾性軸構造は捻り剛性が小さく、基部２０が揺動支持部材２４に対して回転揺動を行う際の駆動負荷が軽減される。
【００２２】
また本実施の形態の弾性軸構造では、４枚の板バネを放射状に配置した構成であることから、小さい断面積で大きな曲げ剛性を得る断面形状となっている。この弾性軸構造を左右２つの揺動支持部材２４の間をスパンとする梁としてみた場合、梁全体のたわみ量は梁の長手方向の曲げ剛性の分布によって決定されるが、上述のようにこの弾性軸構造は曲げ剛性が大きいことから、たわみ量を極小に抑えてホーン１２の先端のキャピラリツール１３に生じる位置ずれを極力小さくすることができるようになっている。
【００２３】
このように、本実施の形態に示す構成の軸支持部によってホーン１２を支持することにより、揺動軸の撓みを抑えてボンディング位置精度を維持すると共に、キャピラリツール１３を上下動させるための揺動駆動負荷の低減を可能とするものとなっている。また本構成によれば、従来用いられていた回転軸受けを使用しないので、従来必要とされた回転軸受けの交換や給脂などの保守作業を不要にすることができる。
【００２４】
【発明の効果】
本発明によれば、ホーンが結合された基部を両側から水平方向の揺動軸廻りに揺動自在に支持する軸支持部を揺動軸を中心に放射状に配置された複数枚の板バネ部材で構成するようにしたので、回転軸受けを使用せずにホーンを揺動自在に支持することができる。
【図面の簡単な説明】
【図１】本発明の一実施の形態のワイヤボンディング装置の斜視図
【図２】本発明の一実施の形態のワイヤボンディング装置のホーン駆動機構の部分断面図
【図３】本発明の一実施の形態のワイヤボンディング装置のホーンの斜視図
【図４】本発明の一実施の形態のワイヤボンディング装置のホーン支持部の分解斜視図
【符号の説明】
２ 基板
３ チップ
１２ ホーン
１３ キャピラリツール
２０ 基部
２１ ボイスコイル
２２ ステータ
２３ 固定軸受け
２４ 揺動支持部材
２５ 板バネ部材[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a wire bonding apparatus for bonding a wire to a bonding object.
[0002]
[Prior art]
Wire bonding is widely used as a method for electrically connecting a semiconductor element to a circuit electrode of a substrate. In this wire bonding, one end of a wire such as a gold wire is bonded to the external connection electrode of the semiconductor element by a capillary tool, and the wire having the one end bonded is routed by moving the capillary tool to move the substrate. Bond to the bonding point on the circuit electrode.
[0003]
In this bonding operation, the capillary tool repeatedly moves up and down at a high frequency in order to press the wire against the bonding site at each bonding point. This vertical movement is generally performed by swinging a rod-shaped horn member holding a capillary tool around a horizontal swing axis. For this reason, the horn member is supported so as to be able to swing, and conventionally, a general rotary bearing has been used as a structure for supporting the horn member.
[0004]
[Problems to be solved by the invention]
However, in the bonding operation, the capillary only moves up and down in a slight height range, so the rotation angle of the swing shaft that pivotally supports the horn member is extremely small. Therefore, the rotary bearing that supports the horn member always rotates only a minute angle without performing normal rotation. As a result, the rolling parts such as balls in the rotating bearing are always in contact with each other only at the same point, and lubricant is not supplied to the contact surface from other parts by rolling. It will be enough. As a result, the rotary bearings cannot be used in a very short period due to fretting, and there is a problem that maintenance work such as bearing replacement must be performed at a high frequency.
[0005]
Therefore, an object of the present invention is to provide a wire bonding apparatus that can eliminate the rotation bearing of the swing shaft that supports the horn member and can reduce the frequency of maintenance work.
[0006]
[Means for Solving the Problems]
The wire bonding apparatus according to claim 1 is a wire bonding apparatus for bonding a wire to a bonding target surface, a horn for holding a capillary tool through which the wire is inserted, a base portion to which the horn is coupled, and the base portion on both sides. A shaft support portion that swings around a swing shaft in a horizontal direction, and a swing drive portion that swings the horn about the swing shaft. The shaft support portion supports the swing shaft. have a plurality of plate spring members arranged radially about, away portion outright from the outside to the inside in the middle portion of the plate spring member that is provided.
[0008]
According to the present invention, the shaft support portion for holding the block to which the horn is coupled so as to be swingable around the horizontal swing shaft from both sides is provided by a plurality of leaf spring members arranged radially about the swing shaft. By configuring, the horn can be swingably supported without using a rotary bearing.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. 1 is a perspective view of a wire bonding apparatus according to an embodiment of the present invention, FIG. 2 is a partial sectional view of a horn drive mechanism of the wire bonding apparatus according to an embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. FIG. 4 is an exploded perspective view of a horn support portion of the wire bonding apparatus according to the embodiment of the present invention.
[0010]
First, the overall structure of the wire bonding apparatus will be described with reference to FIG. A substrate 2 is placed on the upper surface of the base 1. A chip 3 to be wire bonded is mounted on the substrate 2. A large number of circuit electrodes 5 as wire bonding points are formed around the chip 3, and in wire bonding, the external connection electrodes of the chip 3 and the circuit electrodes 5 are connected by wires.
[0011]
A holding plate 6 is disposed on the substrate 2. The holding plate 6 is connected to the rod 7a of the cylinder 7. When the rod 7a is pulled, the substrate 2 is pressed and fixed by the holding plate 6. A movable table 10 is installed on the side of the base 1, and a drive box 11 is provided on the movable table 10. A horn 12 extends forward from the drive box 11, and a capillary tool 13 is held at the tip of the horn 12.
[0012]
A wire 15 used for wire bonding is inserted into the capillary tool 13. The wire 15 is supplied while being wound around the spool 14, and the wire 15 fed out from the spool 14 is inserted into the capillary tool 13 through the tension applying unit 17 and the cut clamper 16. The cut clamper 16 clamps and fixes the wire 15 by performing an opening / closing operation. A torch 19 is disposed in the vicinity of the lower end of the capillary tool 13. The torch 19 forms a metal ball at the lower end of the wire 15 by generating a spark with the wire 15 protruding from the lower end of the capillary tool 13.
[0013]
When the X direction motor 10X and the Y direction motor 10Y are driven to operate the movable table 10, the drive box 11, the horn 12, the capillary tool 13 and the like on the movable table 10 move horizontally in the X direction and the Y direction. The capillary tool 13 is housed in the drive box 11 and driven by a horn drive mechanism (not shown) to move up and down in the Z direction.
[0014]
Next, a horn drive mechanism that is housed in the drive box 11 and swings the horn 12 in the vertical direction will be described with reference to FIGS. In FIG. 2, a fixed bearing 23 is fixed to the side surface of the drive box 11 with a bolt 31. A disk-shaped swing support member 24 is fitted to the fixed bearing 23. The swing support member 24 is fixed to the fixed bearing 23 by a set bolt 32.
[0015]
The center line of the swing support member 24 coincides with the swing axis CL for swinging and rotating the base 20 to which the horn 12 is coupled as shown in FIG. The base 20 is supported by a swing support member 24 so as to be swingable about a horizontal swing axis CL via an elastic shaft structure described below.
[0016]
As shown in FIG. 3, the horn 12 to which the capillary tool 13 is attached is supported by the base 20, and the voice coil 21 is attached to the base 20. The stator 22 disposed on the bottom surface of the drive box 11 shown in FIG. 2 is inserted into the voice coil 21. By driving a voice coil motor composed of the voice coil 21 and the stator 22, the base 20 is shaken. Swing and rotate around the moving axis CL. Thereby, the capillary tool 13 at the tip of the horn 12 moves up and down. The voice coil 21 and the stator 22 serve as a swing drive unit that swings the horn 12 about the swing axis.
[0017]
Next, an elastic shaft structure that supports the rocking rotation of the base 20 will be described. As shown in FIG. 4, triangular projections 20 a and 20 b are fixed to the side surface of the base 20 at axially symmetric positions around the swing axis CL. Also, protrusions 24 a and 24 b having the same shape are formed on the side surface of the swing support member 24.
[0018]
The base 20 and the swing support member 24 are coupled by four leaf spring members 25 that are arranged radially about the swing axis CL. As shown in FIG. 4, the leaf spring member 25 has a shape in which a cutout portion 25 a is provided in the middle portion of the substantially rectangular leaf spring from the outside toward the inside.
[0019]
The end of the leaf spring member 25 on the base 20 side is sandwiched between the protrusions 20a and 20b and the fixing members 27A and 27B as shown in the AA cross section of FIG. The plate spring member 25 is coupled to the base portion 20 by tightening the fixing members 27 </ b> A and 27 </ b> B with the bolt 30 in a state where the plate spring member 25 is sandwiched. Similarly, the end portion of the leaf spring member 25 on the swing support member 24 side is also sandwiched between the protrusions 24a and 24b and the fixing members 28A and 28B, and tightened with the bolts 30, whereby the leaf spring member. 25 is coupled to the swing support member 24.
[0020]
As a result, the base 20 is coupled to the swing support member 24 via the four leaf spring members 25. The leaf spring member 25 tends to bend with respect to a load in a direction perpendicular to the plate surface, and easily torsionally deforms with respect to a torsional moment about the swing axis CL. Accordingly, in a state where the position of the swing axis CL is fixed by the swing support member 24, the base 20 swings around the swing axis CL by applying a swing driving force to the base 20 around the swing axis CL. To do. That is, the fixed bearing 23, the swing support member 24, and the four leaf spring members 25 are shaft support portions that support the base 20 so as to be swingable from both sides.
[0021]
In this elastic shaft structure, as shown in the BB cross-sectional view of FIG. 2C, the cross section of the intermediate portion of the elastic shaft has a cross-sectional area due to the presence of the notch portions 25a provided in each leaf spring member 25. It is very small compared to other cross sections. For this reason, the elastic shaft structure in which the four leaf springs are combined has a small torsional rigidity, and the driving load when the base 20 rotates and swings with respect to the swing support member 24 is reduced.
[0022]
Further, since the elastic shaft structure of the present embodiment has a configuration in which four leaf springs are arranged radially, it has a cross-sectional shape that obtains a large bending rigidity with a small cross-sectional area. When this elastic shaft structure is viewed as a beam having a span between the two swing support members 24 on the left and right, the deflection amount of the entire beam is determined by the distribution of the bending rigidity in the longitudinal direction of the beam. Since the elastic shaft structure has high bending rigidity, it is possible to minimize the amount of deflection and minimize the displacement generated in the capillary tool 13 at the tip of the horn 12.
[0023]
Thus, by supporting the horn 12 by the shaft support portion having the configuration shown in the present embodiment, it is possible to suppress the bending of the swing shaft and maintain the bonding position accuracy and to swing the capillary tool 13 up and down. The dynamic drive load can be reduced. Further, according to the present configuration, since the conventionally used rotary bearing is not used, maintenance work such as replacement of the rotary bearing and lubrication required conventionally can be made unnecessary.
[0024]
【The invention's effect】
According to the present invention, a plurality of leaf spring members in which shaft support portions that support a base portion to which a horn is coupled from both sides so as to be swingable around a horizontal swing shaft are arranged radially about the swing shaft. Thus, the horn can be swingably supported without using a rotary bearing.
[Brief description of the drawings]
FIG. 1 is a perspective view of a wire bonding apparatus according to an embodiment of the present invention. FIG. 2 is a partial sectional view of a horn drive mechanism of the wire bonding apparatus according to an embodiment of the present invention. FIG. 4 is an exploded perspective view of a horn support portion of a wire bonding apparatus according to an embodiment of the present invention.
2 Substrate 3 Chip 12 Horn 13 Capillary tool 20 Base 21 Voice coil 22 Stator 23 Fixed bearing 24 Swing support member 25 Leaf spring member

Claims (1)

ワイヤをボンディング対象面にボンディングするワイヤボンディング装置であって、ワイヤが挿通するキャピラリツールを保持するホーンと、このホーンが結合された基部と、この基部を両側から水平方向の揺動軸廻りに揺動自在に支持する軸支持部と、前記ホーンを前記揺動軸廻りに揺動させる揺動駆動部とを備え、前記軸支持部は前記揺動軸を中心に放射状に配置された複数枚の板バネ部材を有し、前記板バネ部材の中間部に外側から内側に向かって切り欠き部が設けられていることを特徴とするワイヤボンディング装置。A wire bonding apparatus for bonding a wire to a bonding target surface, a horn holding a capillary tool through which the wire is inserted, a base to which the horn is coupled, and swinging the base from both sides around a horizontal swing axis. A shaft support portion that is movably supported; and a swing drive portion that swings the horn about the swing shaft. The shaft support portion is a plurality of sheets that are arranged radially about the swing shaft. It has a leaf spring member, a wire bonding apparatus unit cutout from the outside to the inside, characterized that you have provided in the intermediate portion of the plate spring member.
JP2000025031A 2000-02-02 2000-02-02 Wire bonding equipment Expired - Fee Related JP3575372B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000025031A JP3575372B2 (en) 2000-02-02 2000-02-02 Wire bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000025031A JP3575372B2 (en) 2000-02-02 2000-02-02 Wire bonding equipment

Publications (2)

Publication Number Publication Date
JP2001217276A JP2001217276A (en) 2001-08-10
JP3575372B2 true JP3575372B2 (en) 2004-10-13

Family

ID=18550948

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000025031A Expired - Fee Related JP3575372B2 (en) 2000-02-02 2000-02-02 Wire bonding equipment

Country Status (1)

Country Link
JP (1) JP3575372B2 (en)

Also Published As

Publication number Publication date
JP2001217276A (en) 2001-08-10

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