JP3571314B2 - Heat equalizer - Google Patents

Heat equalizer Download PDF

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Publication number
JP3571314B2
JP3571314B2 JP2001248648A JP2001248648A JP3571314B2 JP 3571314 B2 JP3571314 B2 JP 3571314B2 JP 2001248648 A JP2001248648 A JP 2001248648A JP 2001248648 A JP2001248648 A JP 2001248648A JP 3571314 B2 JP3571314 B2 JP 3571314B2
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JP
Japan
Prior art keywords
plate
outer peripheral
heat
heat equalizer
working fluid
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Expired - Fee Related
Application number
JP2001248648A
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Japanese (ja)
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JP2003053741A (en
Inventor
邦男 小谷
久明 山蔭
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Toshiba Mitsubishi Electric Industrial Systems Corp
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Toshiba Mitsubishi Electric Industrial Systems Corp
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Priority to JP2001248648A priority Critical patent/JP3571314B2/en
Publication of JP2003053741A publication Critical patent/JP2003053741A/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular

Description

【０００１】
【発明の属する技術分野】
この発明は、例えば樹脂成型品、半導体ウエハ、液晶パネル等の被加工物を、加工される定盤上で均一に加熱あるいは冷却することができる均熱装置に関するものである。
【０００２】
【従来の技術】
従来の均熱装置としては、例えば特開平９−３２７８２７号公報に開示される図２に示すものがある。図２において、１は下面に同心状に配置される環状の複数の溝２が形成された第１の板状部材であり、上面には複数の被加工物３が載置される。４は環状の各溝２を覆うように第１の板状部材１の下面に、例えばろう付け等で接合される第２の板状部材であり、第１の板状部材１とともに定盤５を構成している。６は環状の各溝２と第２の板状部材４とで形成される複数の流通路であり、各内部にはそれぞれ真空排気された後、所定量の作動液７が封入されている。
【０００３】
上記のように構成された均熱装置において、定盤５の下面から、例えばヒーター等の加熱体（図示せず）により図中矢印にて示すように加熱されると、各流通路６内の作動液７も加熱され、蒸気となって密閉された流通路６内にある空間に拡散し、この蒸気は流通路６内の温度の低い上面側で凝縮潜熱として熱を放出し液化する。そして、液化した作動液７は流通路６の内部で下面側に流下して還流する。これらの動作が順次繰り返されることにより、加熱体から定盤５の上面に熱輸送され、定盤５の上面に載置される複数の被加工物３をそれぞれ加熱処理する。
【０００４】
また、従来の均熱装置として、例えば特開平１１−３２０５５５号公報に開示された図３に示すものがあり、図３において、１〜７は上述した従来の均熱装置の構成と同様である。８は第２の板状部材４から下方に突出して配置され、第１の板状部材１の溝２、すなわち流通路６と連通する複数の液溜り部であり、箱部材を溶接等により接合するか、第２の板状部材４を深絞り加工等して形成されており、この液溜り部８に作動液７が貯溜されている。９は液溜り部８内に貯溜された作動液７中に浸漬され、作動液７を直接加熱して蒸発させるようにしているので、熱輸送効率を向上させることができ、高精度な表面温度分布を達成することができる。１０は定盤５の裏面下方にスペーサ１１を介して取り付けられた蓋体であり、この蓋体１０と定盤５裏面との間に空間１２が設けられている。１３ａ，１３ｂは蓋体１０に形成され、空気などの冷却媒体を導入、導出する導入口、導出口であり、導入口１３ａから冷却媒体を導入し、定盤５裏面の空間１２を通過させて導出口１３ｂから導出させることにより、定盤５を所定温度まで冷却することができる。
【０００５】
上記の均熱装置では、定盤の外周面から放熱するために、定盤の外周側の温度が中央部に比べて低下し、定盤表面の均熱特性が得られないので、加熱手段を定盤の下面外周側に加熱手段を配置し、下面中央部に冷却手段を配置した構成にすることにより、定盤表面の均熱特性が良くなる。
【０００６】
【発明が解決しようとする課題】
従来の均熱装置は以上のように構成され、真空排気の後に封入された作動液７の潜熱によって加熱体からの熱を均一に定盤５表面に伝熱する構造のものであるが、一般に外周に至るにつれて放熱面積が増大するとともに、外周端面からの放熱の影響が表れることにより、外周側の放熱量が大きくなるため、定盤５の外周側の温度が内周側に比べて低下し、定盤５表面の均熱特性が十分に得られないので、加熱手段を定盤５の下面外周側に加熱手段を配置し、下面中央部に冷却手段を配置する構成にすると、定盤表面の均熱特性が良くなる。しかし、均熱装置内部の作動液の流通路の底面が同一平面に位置し、外周部下面に加熱手段が配置された構成にすると、均熱装置の中央部下面は加熱源が存在しないので、液化した作動液が中央部の流通路に滞留し、加熱源が配置された外周部の作動液が不足する液枯れ現象が発生し、均熱装置が均一に加熱されない状態が発生する問題点があった。
【０００７】
この発明は上記のような問題点を解消するためになされたもので、内部に充填された作動液が中央部で滞留することをなくした安定して均一な温度分布となる均熱装置を得ることを目的とするものである。
【０００８】
【課題を解決するための手段】
この発明の請求項１に係る均熱装置は、
溝状の流通路が複数形成された第１の板状部材と、この第１の板状部材に形成された流通路を覆うように第１の板状部材に接合された第２の板状部材とにより定盤を構成し、この定盤の内部に作動液を封入し、定盤の外周部の下面に加熱手段を設け、第一の板状部材の流通路が中央部の位置に対して、外周側になるにしたがって低位置になるように構成したものである。
【０００９】
【発明の実施の形態】
実施の形態１．
図１はこの発明の実施の形態１における均熱装置の構成を示す断面図である。
図１において、４０は上面に同心状に配置され、かつ底面が中央側より外周側になるにしたがって低位置となるよう順次深く形成された環状の複数の溝４１が形成された第１の板状部材であり、下面中央部が凹状に形成されている。４２は環状の各溝４１を覆うように第１の板状部材４０の上面に、例えばろう付け等で接合された第２の板状部材であり、この第２の板状部材４２の上面に被加工物が載置され、第１の板状部材４０とともに定盤４３を構成している。４４は環状の各溝４１と第２の板状部材４２とで形成される複数の流通路であり、内部には真空排気された後、所定量の作動液４５が封入されている。４６は定盤４３の外周部の下面に配置された面状ヒーター等の加熱手段である。
【００１０】
このように、流通路４４の底部が中央部に対して外周側が低位置となるよう順次深く形成したことにより、流通路４４内部で凝縮された作動液４５が中央部で滞留することなく、定盤４３外周側の加熱部分に戻りやすくなり、外周部の加熱源部分の液枯れ現象の発生が回避でき、蒸発から凝縮までのサイクルが円滑に行われ、定盤４３の熱特性を向上させることができる。
【００１１】
【発明の効果】
以上のように、この発明の請求項１によれば、流通路の底部が中央部に対して外周側が低位置となるよう順次深く形成したことにより、流通路内部で凝縮された作動液が定盤外周側の加熱部分に戻りやすくなり、中央部の流通路に作動液が滞留しなくなり、外周部における作動液の液枯れ現象の発生がなくなり、作動液の蒸発・凝縮のサイクルを円滑に行われ、定盤の均熱特性を向上させることができる。
【図面の簡単な説明】
【図１】この発明の実施の形態１の均熱装置の構成を示す断面図である。
【図２】従来の均熱装置を示す断面図である。
【図３】従来の均熱装置を示す断面図である。[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a heat equalizer that can uniformly heat or cool a workpiece such as a resin molded product, a semiconductor wafer, or a liquid crystal panel on a surface plate to be processed.
[0002]
[Prior art]
Conventional heat equalizer, for example, there is shown in FIG. 2 as disclosed in JP-A-9-327827. In FIG. 2 , reference numeral 1 denotes a first plate-like member having a plurality of annular grooves 2 arranged concentrically on a lower surface, and a plurality of workpieces 3 are placed on an upper surface. Reference numeral 4 denotes a second plate-like member joined to the lower surface of the first plate-like member 1 by, for example, brazing so as to cover each of the annular grooves 2, and a platen 5 together with the first plate-like member 1. Is composed. Numeral 6 denotes a plurality of flow passages formed by the annular grooves 2 and the second plate-like member 4, each of which is evacuated and filled with a predetermined amount of a working fluid 7 respectively.
[0003]
In the heat equalizer configured as described above, when heated from the lower surface of the platen 5 by a heating body (not shown) such as a heater as shown by arrows in the drawing, the inside of each flow path 6 The working fluid 7 is also heated and diffuses as vapor into the space in the closed flow passage 6, and the vapor discharges and liquefies as latent heat of condensation on the lower surface side of the flow passage 6 where the temperature is low. Then, the liquefied working fluid 7 flows down to the lower surface side inside the flow passage 6 and returns. By repeating these operations sequentially, the heat is transported from the heating body to the upper surface of the surface plate 5, and the plurality of workpieces 3 placed on the upper surface of the surface plate 5 are each heated.
[0004]
Further, as a conventional heat equalizer, there is one shown in FIG. 3, for example disclosed in Japanese Patent Laid-Open No. 11-320555, in FIG. 3, 1-7 is the same as that of the conventional heat equalizer described above . Reference numeral 8 denotes a plurality of liquid reservoirs which are arranged so as to protrude downward from the second plate-shaped member 4 and communicate with the grooves 2 of the first plate-shaped member 1, that is, with the flow passages 6, and join the box members by welding or the like. Alternatively, the second plate-shaped member 4 is formed by deep drawing or the like, and the hydraulic fluid 7 is stored in the liquid reservoir 8. 9 is immersed in the working fluid 7 stored in the liquid reservoir 8 to directly heat and evaporate the working fluid 7, so that the heat transport efficiency can be improved and the surface temperature can be adjusted with high precision. Distribution can be achieved. Reference numeral 10 denotes a cover attached below the back surface of the base 5 via a spacer 11, and a space 12 is provided between the cover 10 and the back surface of the base 5. 13a and 13b are formed in the lid 10 and are inlets and outlets for introducing and discharging a cooling medium such as air. The cooling medium is introduced from the inlet 13a and passes through the space 12 on the back surface of the platen 5. By drawing out from the outlet 13b, the surface plate 5 can be cooled to a predetermined temperature.
[0005]
In the above-mentioned heat equalizer, in order to radiate heat from the outer peripheral surface of the surface plate, the temperature on the outer peripheral side of the surface plate is lower than that of the central portion, and the heat equalizing characteristic of the surface of the surface plate cannot be obtained. By arranging the heating means on the outer peripheral side of the lower surface of the surface plate and the cooling means at the center of the lower surface, the uniform heat characteristics of the surface of the surface plate are improved.
[0006]
[Problems to be solved by the invention]
The conventional heat equalizer is configured as described above, and has a structure in which the heat from the heating body is uniformly transferred to the surface of the surface plate 5 by the latent heat of the working fluid 7 sealed after evacuation. The heat radiation area increases toward the outer periphery, and the influence of heat radiation from the outer peripheral end surface appears, so that the amount of heat radiation on the outer peripheral side increases, so that the temperature on the outer peripheral side of the surface plate 5 decreases as compared with the inner peripheral side. Since the heat equalizing characteristic of the surface of the surface plate 5 cannot be sufficiently obtained, if the heating means is arranged on the outer peripheral side of the lower surface of the surface plate 5 and the cooling device is arranged at the center of the lower surface, Has a good soaking property. However, if the bottom surface of the flow path of the working fluid inside the heat equalizer is located on the same plane and the heating means is arranged on the lower surface of the outer peripheral portion, since the lower surface of the central portion of the heat equalizer has no heating source, The problem is that the liquefied working fluid stays in the flow passage in the center, causing a liquid withdrawal phenomenon in which the working fluid on the outer periphery where the heating source is located runs short, and the heat equalizer is not uniformly heated. there were.
[0007]
The present invention has been made in order to solve the above-described problems, and provides a heat equalizer that has a stable and uniform temperature distribution in which a working fluid filled therein does not stay in a central portion. It is intended for that purpose.
[0008]
[Means for Solving the Problems]
The heat equalizer according to claim 1 of the present invention includes:
A first plate-like member having a plurality of groove-like flow passages formed therein, and a second plate-like member joined to the first plate-like member so as to cover the flow passages formed in the first plate-like member A surface plate is constituted by the members, a working fluid is sealed in the surface of the surface plate, and a heating means is provided on a lower surface of an outer peripheral portion of the surface plate. Thus, it is configured such that the lower the position is, the closer to the outer peripheral side.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
Embodiment 1 FIG.
FIG. 1 is a cross-sectional view illustrating a configuration of a heat equalizer according to Embodiment 1 of the present invention.
In Figure 1, a first plate 40 is arranged concentrically on the upper surface, and bottom surface a plurality of grooves 41 sequentially deeply formed annular so as to be lower position to an outermost side from the center side is formed And a central portion of the lower surface is formed in a concave shape. Reference numeral 42 denotes a second plate member joined to the upper surface of the first plate member 40 by, for example, brazing so as to cover each annular groove 41. The workpiece is placed on the platen 43 together with the first plate member 40. 44 is a plurality of flow passages formed by the respective grooves 41 of the annular and the second plate-like member 42, after being evacuated inside, a predetermined amount of hydraulic fluid 45 is sealed. Reference numeral 46 denotes a heating means such as a planar heater disposed on the lower surface of the outer peripheral portion of the surface plate 43.
[0010]
As described above, the bottom portion of the flow passage 44 is formed so as to be deeper so that the outer peripheral side is lower than the center portion, so that the working fluid 45 condensed inside the flow passage 44 does not stay in the center portion, It is easy to return to the heating portion on the outer peripheral side of the platen 43, and it is possible to avoid the occurrence of liquid withdrawal in the heat source portion on the outer peripheral portion. be able to.
[0011]
【The invention's effect】
As described above, according to the first aspect of the present invention, the hydraulic fluid condensed inside the flow passage is constant because the bottom of the flow passage is formed so as to be deeper so that the outer peripheral side is lower than the center. It is easy to return to the heating part on the outer peripheral side of the panel, the hydraulic fluid does not stay in the flow passage at the center, the hydraulic fluid does not wither in the outer peripheral part, and the cycle of evaporation and condensation of the hydraulic fluid is performed smoothly. Thus, the soaking characteristics of the surface plate can be improved.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view illustrating a configuration of a heat equalizer according to Embodiment 1 of the present invention.
FIG. 2 is a sectional view showing a conventional heat equalizer.
FIG. 3 is a cross-sectional view showing a conventional heat equalizer.

Claims (1)

溝状の流通路が複数形成された第１の板状部材と、該第１の板状部材に形成された上記流通路を覆うように上記第１の板状部材に接合された第２の板状部材とにより定盤が構成され、該定盤の内部に作動液が封入され、上記定盤の外周部の下面に加熱手段が設けられた均熱装置において、上記第一の板状部材は、上記溝状の流通路が中央部に対して、外周側になるにしたがって低位置になるように構成されていることを特徴とする均熱装置。 A first plate-shaped member having a plurality of groove-shaped flow paths formed therein, and a second plate-shaped member joined to the first plate-shaped member so as to cover the flow paths formed in the first plate-shaped member. A platen is formed by the plate-like member, a working fluid is sealed in the platen, and a heating means is provided on a lower surface of an outer peripheral portion of the platen. The heat equalizer according to claim 1, wherein the groove-shaped flow passage is located at a lower position with respect to a central portion toward an outer peripheral side .
JP2001248648A 2001-08-20 2001-08-20 Heat equalizer Expired - Fee Related JP3571314B2 (en)

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JP3571314B2 true JP3571314B2 (en) 2004-09-29

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2865027B1 (en) * 2004-01-12 2006-05-05 Air Liquide FIN FOR HEAT EXCHANGER AND HEAT EXCHANGER PROVIDED WITH SUCH FINS
JP5153201B2 (en) * 2007-05-01 2013-02-27 三菱電機株式会社 Soaking equipment

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