JP3561324B2 - Adhesive composition - Google Patents

Adhesive composition Download PDF

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Publication number
JP3561324B2
JP3561324B2 JP05917595A JP5917595A JP3561324B2 JP 3561324 B2 JP3561324 B2 JP 3561324B2 JP 05917595 A JP05917595 A JP 05917595A JP 5917595 A JP5917595 A JP 5917595A JP 3561324 B2 JP3561324 B2 JP 3561324B2
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Japan
Prior art keywords
coo
adhesive
weight
parts
pressure
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JP05917595A
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Japanese (ja)
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JPH08253746A (en
Inventor
拓 宮下
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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Priority to JP05917595A priority Critical patent/JP3561324B2/en
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Description

【0001】
【産業上の利用分野】
本発明は、粘着剤組成物に関する。
【0002】
【従来の技術】
加熱により接着力を制御することができる粘着剤は、自動車等の塗装用マスキングテープ、電子部品等の組立工程で使用される仮固定用粘着テープ等に用いられている。このような熱剥離性粘着剤は、不要時に加熱により簡単に除去することができるので、作業の簡便化を促進する等の利点を有している。
【0003】
特開昭56−61468号公報、特開昭60−252681号公報等には、加熱により膨張する熱膨張性樹脂を含有する粘着剤に関する技術が開示されている。しかし、これらの粘着剤には、熱膨張性樹脂を調製する際に使用される比較的低温でガスを発生する有機溶媒、粘着剤層に熱膨張性樹脂を混入分散する際に使用される可燃性ガス等が含有されているので、引火の危険性があり、作業環境の衛生面からも望ましいものではない。
【0004】
【発明が解決しようとする課題】
本発明は、上記に鑑み、安全であり、加熱後に剥離が容易である粘着剤組成物を提供することを目的とする。
【0005】
【課題を解決するための手段】
本発明の粘着剤組成物は、粘着成分100重量部に、脱水温度が50〜150℃である結晶水を含有し、平均粒径が0.5〜100μmである無機塩の粒状物0.5〜200重量部を分散させてなる粘着剤組成物であって、粘着剤が加熱時に結晶水を放出して、界面の接着力が弱められ、剥離力が低下することを特徴とする粘着剤組成物である
【0006】
上記粘着成分に使用される粘着主剤としては特に限定されず、例えば、天然ゴム、再生ゴム、スチレン−ブタジエンゴム、アクリロニトリル−ブタジエンゴム、ポリイソブチレン、ポリビニルエーテル、ポリアクリル酸エステル、熱可塑性エラストマー等の従来から粘着剤として使用されているものが挙げられる。
【0007】
本発明においては、上記粘着成分として、例えば、ゴム、熱可塑性樹脂等を水に乳化させたエマルジョン型粘着剤;ペースト型粘着剤;(メタ)アクリレートエステル等を主成分とする組成物を光重合して得られる粘着剤等を使用してもよい。
【0008】
本発明においては、上記粘着主剤に通常の粘着剤に用いられている粘着付与樹脂を添加して、粘着力を上げてもよい。上記粘着付与樹脂としては特に限定されず、例えば、ガム系、ウッド系等のロジン樹脂;水添ロジンエステル、重合ロジンのペンタエリスリトールエステル、重合ロジンのグリセリンエステル等のロジン誘導体;α−ピネン系、β−ピネン系、テルペンフェノール系等のテルペン樹脂;脂環族飽和炭化水素樹脂、脂肪族系炭化水素樹脂、芳香族系炭化水素樹脂等の石油樹脂;クマロンインデン樹脂、スチレン系樹脂、フェノール樹脂、キシレン樹脂等が挙げられる。
上記粘着付与樹脂の添加量は、上記粘着主剤100重量部に対して1〜70重量部が好ましい。
【0009】
本発明においては、上記粘着主剤に可塑剤を添加して、可とう性を与えてもよい。上記可塑剤としては特に限定されず、例えば、フタル酸エステル、不乾性植物油、鉱物油、ラノリン、ポリブテン、ポリアクリレート、低分子ポリイソブチレン等が挙げられる。
【0010】
本発明においては、上記粘着主剤に架橋剤を添加して、凝集力を上げてもよい。上記架橋剤としては特に限定されず、例えば、イソシアネート系架橋剤、エポキシ系架橋剤、メラミン系架橋剤、金属キレート系架橋剤、過酸化物等が挙げられる。
【0011】
本発明においては、上記粘着主剤に、例えば、亜鉛華、酸化マグネシウム、炭酸カルシウム、クレー、水酸化アルミニウム、無水けい酸、カーボンブラック、チタン白、顔料等の充填剤を添加してもよい。
【0012】
本発明で使用される無機塩は、脱水温度が50〜150℃である結晶水を含有する。50℃未満であると、保存時に粘着物性が低下しやすくなり、150℃を超えると、熱剥離性が発現しにくくなるので、上記範囲に限定される。
【0013】
上記脱水温度が50〜150℃である結晶水を含有する無機塩としては特に限定されず、例えば、以下のものが挙げられる。
FeSO・7HO(90℃でFeSO・HO)
Al・3HO(150℃でAl・HO)
Al(ClO・6HO(178℃でAl(ClO
AlK(SO・12HO(64.5℃でAlK(SO・3HO)
AlK(NH)(SO・12HO(120℃でAlK(NH)(SO・2HO)
K[AuCl]・2HO(100℃でK[AuCl])
【0014】
K[AuBr]・2HO(60℃でK[AuBr])
BaCl・2HO(121℃でBaCl
Ba(ClO・HO(120℃でBa(ClO
BaBr・2HO(75℃でBaBr・HO、120℃でBaBr
Ba(BrO)・HO(170℃でBa(BrO
BaI・2HO(98.9℃でBaI・HO)
Ba(IO・HO(130℃でBa(IO
Ba(SCN)・2HO(160℃でBa(SCN)・HO)
Ba(CHCOO)・HO(150℃でBa(CHCOO)
BeSO・4HO(100℃でBeSO・2HO)
Bi・2HO(100℃でBi・HO、180℃でBi
Bi(OH)(100℃でBiO(OH))
Bi(NO)O・HO(105℃でBi(NO))
【0015】
Bi(C・7HO(約130℃でBi(C・HO)
CaBr・6HO(149℃でCaBr
Ca(BrO・HO(180℃でCa(BrO
CaI・6HO(160℃でCaI
CaO・8HO(100℃でCaO
CaSO・2HO(100℃でCaSO
CaSO・2HO(128℃でCaSO・0.5HO、163℃でCaSO
CaSeO・2HO(200℃でCaSeO
Ca(NO・HO(100℃でCa(NO
Ca(NO・4HO(132℃でCa(NO
【0016】
Ca(PHO)・HO(200℃でCa(PHO))
CaHPO・2HO(109℃でCaHPO
Ca(HPO・HO(109℃でCa(HPO
Ca(AsO・3HO(100℃でCa(AsO
CaCrO・2HO(200℃でCaCrO
Ca(C)・HO(200℃でCa(C))
CdCl・2.5HO(120℃でCdCl
CdBr・4HO(200℃でCdBr
3CdSO・8HO(41.5℃で3CdSO・HO)
Cd(CHCOO)・2HO(130℃でCd(CHCOO)・HO)
Ce(NO・6HO(150℃でCe(NO・3HO)
Ce(NH)(SO・4HO(100℃でCe(NH)(SO・HO、150℃でCe(NH)(SO
Ce(C・9HO(110℃でCe(C・HO)
【0017】
CoCl・6HO(約55℃でCoCl・2HO、100℃で
CoCl・HO、約130℃でCoCl
Co(ClO・6HO(153℃でCo(ClO・2HO)
CoBr・6HO(100℃でCoBr・2HO、130℃でCoBr
CoI・6HO(130℃でCoI
CoSO・7HO(41.5℃でCoSO・6HO、70℃でCoSO・6HO)
Co(NO・6HO(55℃でCo(NO・3HO)
Co(PO・8HO(200℃でCo(PO
Co(SCN)・3HO(105℃でCo(SCN)
Co(CHCOO)・4HO(140℃でCo(CHCOO)
【0018】
CoK(SO・6HO(95℃でCoK(SO・HO)
cis−[CoCl(NH]Cl・0.5HO(60℃でcis−[CoCl(NH]Cl)
[Co(C]Cl・3HO(100℃で[Co(C]Cl
K[Co(C1012)]・2HO(105℃でK[Co(C1012)])
Cr(SO・18HO(100℃でCr(SO・6HO)Cr(CHCOO)・HO(100℃でCr(CHCOO)
CrK(SO・12HO(100℃でCrK(SO・2HO)
CrK(NH)(SO・12HO(100℃でCrK(NH)(SO・3HO)
[Cr(NH]Cl・HO(60℃で−0.5HO)
【0019】
[Cr(NCS)]・4HO(110℃でK[Cr(NCS)])
trans−NH[Cr(NCS)(NH]・HO(100℃でtrans−NH[Cr(NCS)(NH])
CsHCO(175℃で−0.5HO)
CuSeO・5HO(100℃でCuSeO・HO)
Cu(NO・3HO(170℃で−HNO
Cu(C)・0.5HO(200℃でCu(C))
[Cu(C]・2HO(150℃でK[Cu(C])
[Cu(NHCHCOO)]・HO(130℃で[Cu(NHCHCOO)])
【0020】
Dy(CO・4HO(150℃でDy(CO
Dy(C・4HO(40℃でDy(C
Er(NO・5HO(150℃でEr(NO・HO)
FeF・4.5HO(100℃でFeF・3HO)
FeCl・4HO(105℃でFeCl・2HO)
FeO(OH)(136℃でFe
Na[Fe(C]・3HO(100℃でNa[Fe(C]・2HO)
[Fe(C]・3HO(100℃でK[Fe(C])
[Fe(CN)]・3HO(100℃でK[Fe(CN)])
Ga(C・4HO(180℃でGa(C
Gd(C・10HO(110℃でGd(C・4HO)
Ho(C・10HO(40℃でHo(C・9HO)
【0021】
In(OH)(約150℃でInO(OH))
In(NO・3HO(100℃でIn(NO・HO)
InBr・4HO(100℃でInBr・HO)
Na[IrCl]・6HO(100℃でNa[IrCl])
[Ir(C]・4HO(40℃でK[Ir(C]・3HO)
S・5HO(150℃でKS・2HO)
3K・HO(180℃でK
TeO・5HO(200℃で−(HO+O))
・3HO(100℃でK・2HO、180℃でK・HO)
【0022】
SnS・3HO(100℃でKSnS
KB・4HO(約100℃でKB・HO)
RuO・HO(200℃でKRuO
OsO・2HO(200℃でKOsO・HO)
・HO(160℃でK
KNaCO・6HO(100℃でKNaCO
La(CO・8HO(100℃でLa(CO・HO)
La(CHCOO)・1.5HO(100℃でLa(CHCOO)・HO、120℃でLa(CHCOO)
LiBr・2HO(44℃でLiBr・HO)
LiClO・3HO(100℃でLiClO・HO、150℃でLiClO
LiSO・HO(130℃でLiSO
LiNO・3HO(61.1℃でLiNO
MgSO・7HO(150℃でMgSO・HO、200℃でMgSO
【0023】
Mg(PH・6HO(100℃でMg(PH・HO、180℃でMg(PH
MgHPO・3HO(170℃でMgHPO
MgHPO・7HO(170℃でMgHPO・4HO)
Mg(PO・8HO(150℃でMg(PO・3HO)
MgCO・3HO(100℃でMgCO
Mg(NH(SO・6HO(100℃でMg(NH(SO・HO、132℃でMg(NH(SO
MgNHCl・6HO(100℃でMgNHCl・4HO)
MgNHPO・6HO(100℃でMgNHPO
MgNHAsO・6HO(約100℃でMgNHAsO・0.5HO)
【0024】
MnCl・4HO(106℃でMnCl・3HO、198℃でMnCl
Mg(PH・HO(約150℃でMg(PH
Mg(HPO・2HO(100℃でMg(HPO・HO)
Mn(PH・HO(約150℃でMn(PH
Mn(HPO・2HO(約100℃でMn(HPO・HO)
MnHPO・3HO(200℃でMnHPO
Mn・3HO(120℃でMn
Mn(SCN)・3HO(100℃でMn(SCN)
Mn(CHCOO)・4HO(137℃でMn(CHCOO)
Mn(C)・2HO(100℃でMn(C))
(NH[MnCl]・2HO(100℃で(NH[MnCl])
【0025】
[Mn(CN)]・3HO(100℃でK[Mn(CN)])
MoO・HO(70℃でMoO
MoO・2HO(70℃でMoO・HO)
[Mo(CN)]・2HO(110℃でK[Mo(CN)])
Na[Mo10]・7HO(100℃でNa[Mo10]・HO)
Na[Mo24]・22HO(120℃でNa[Mo24]・21HO)
(NH[Mo24]・4HO(90℃で(NH[Mo24])
Na[SiMo1240]・20HO(90℃でNa[SiMo1240]・13HO)
NaSO・7HO(150℃でNaSO
【0026】
NaSO・10HO(100℃でNaSO
Na・5HO(100℃でNa
Na・2HO(110℃でNa
NaPHO・5HO(100℃でNaPHO
NaHPHO・2.5HO(100℃でNaHPHO
NaPO・12HO(100℃でNaPO・HO)
NaHPO・HO(100℃でNaHPO
NaHPO・2HO(95℃でNaHPO
Na・6HO(100℃でNa
Na・10HO(93.8℃でNa・9HO)
NaHAsO・7HO(100℃でNaHAsO
NaHAsO・HO(130℃でNaHAsO
NaCO・HO(100℃でNaCO
NaSiO・9HO(100℃でNaSiO・3HO)
Na・10HO(60℃でNa・2HO)
【0027】
NaBO・4HO(120℃でNaBO・3HO)
NaCr・2HO(100℃でNaCr
NaWO・2HO(120℃でNaWO
Na[Sn(OH)](140℃でNaSnO
Na[XeO]・6HO(100℃でNa[XeO])
NaCHCOO・3HO(123℃でNaCHCOO)
NaHC・HO(100℃でNaHC
[NbFO]・HO(100℃でK[NbFO])
NdCl・6HO(150℃でNdCl
Nd(CO・8HO(100℃でNd(CO・HO)
NiCl・6HO(140℃でNiCl
NiSO・6HO(103℃でNiSO
【0028】
Ni(CN)・4HO(200℃でNi(CN)
NiC・2HO(190℃でNiC
[Ni(CN)]・HO(105℃でK[Ni(CN)])
[Ni(C(HO)](100℃で(真空中)[Ni(C
[OsCl]・3HO(150℃でK[OsCl]
Pb(CHCOO)・3HO(75℃でPb(CHCOO)・2HO)
[Pd(CN)]・3HO(100℃でK[Pd(CN)]・HO、200℃でK[Pd(CN)])
Pr(CO・8HO(100℃でPr(CO・2HO、200℃でPr(CO
Na[PtCl]・4HO(150℃でNa[PtCl]・3HO)
Na[PtCl]・6HO(100℃でNa[PtCl])
【0029】
Na[Pt(OH)](150〜170℃でNa[PtO])
[Pt(NH]Cl・HO(110℃で[Pt(NH]Cl
[Pt(CN)]・3HO(100℃でK[Pt(CN)])
Ba[Pt(CN)]・4HO(100℃でBa[Pt(CN)]・2HO、150℃でBa[Pt(CN)])
(NH[RhCl]・HO(140℃で(NH[RhCl])
[Rh(C]・4.5HO(150℃でK[Rh(C]・HO)、190℃でK[Rh(C])
[Rh(CHCOO(HO)](120℃で[Rh(CHCOO
【0030】
[Ru(C10]Cl・6HO(200℃で[Ru(C10]Cl
[Ru(CN)]・3HO(115℃でK[Ru(CN)])
[Ru(C]・4.5HO(100℃でK[Ru(C]・HO、150℃でK[Ru(C]・0.5HO)
Sb・2HO(200℃でSb・2HO)
[Sb((R,R)−C]・3HO(100℃でK[Sb((R,R)−C])
SeO(70℃でSeO
SmCl・6HO(100℃でSmCl・HO)
Sm(SO・8HO(105℃でSm(SO・5HO)
SrCl・6HO(60℃でSrCl・2HO、100℃でSrCl
SrBr・6HO(88.2℃でSrBr・2HO)
SrO・8HO(100℃でSrO
【0031】
Sr(OH)・8HO(100℃でSr(OH)
Sr(NO・4HO(110℃でSr(NO
Sr(CHCOO)・0.5HO(150℃でSr(CHCOO)
Sr(C)・HO(150℃でSr(C))
Tb(C・10HO(40℃でTb(C・9HO)
TeO(120℃で−2HO)
ThF・4HO(100℃でThF・3HO、140℃でThF・2HO)
Th(SO・9HO(47℃でTh(SO・4HO)
TlCl・4HO(100℃でTlCl
【0032】
[TlCl]・2HO(150℃でK[TlCl])
Tm(C・6HO(50℃でTm(C・5HO)
(UO)HPO・4HO(110℃で(UO)HPO・2HO)
UO(CHCOO)・2HO(110℃でUO(CHCOO)
UO(C)・3HO(110℃でUO(C))
[U(C]・5HO(130℃でK[U(C])
VF・3HO(100℃でVF・2HO、130℃でVF
WO・HO(100℃でWO
[W(CN)]・2HO(115℃でK[W(CN)])
Na101241・28HO(100℃でNa101241・16HO)
(NH10[H1242]・10HO(100℃で(NH10[H1242]・4HO)
【0033】
[SiW1240]・18HO(100℃でK[SiW1240]・HO)
YCl・6HO(100℃でYCl・HO、160℃でYCl
(SO・8HO(120℃でY(SO
Y(NO・6HO(100℃でY(NO・3HO)
(CO・3HO(100℃でY(CO・2HO、130℃でY(CO
YbCl・6HO(180℃でYbCl
Yb(SO・8HO(120℃でYb(SO
Yb(CHCOO)・4HO(100℃でYb(CHCOO)
Yb(C・10HO(100℃でYb(C・3HO)
【0034】
ZnF・4HO(100℃でZnF
ZnSO・2HO(100℃でZnSO
Zn(NO・6HO(105℃でZn(NO
Zn(PO・4HO(100℃でZn(PO・2HO、190℃でZn(PO・HO)
Zn(CHCOO)・2HO(100℃でZn(CHCOO)
ZrClO・8HO(150℃でZrClO・2HO)
Zr(SO・4HO(120℃でZr(SO・HO)
上記脱水温度が50〜150℃である結晶水を含有する無機塩は、加熱時に結晶水を放出するので、本発明の粘着剤組成物から得られる粘着剤層と基板との界面の接着力が弱められ、剥離力が低下する。
【0035】
本発明においては、上記無機塩の粒状物を使用する。上記無機塩の粒状物は、上記無機塩が水溶性であるものが多いので、例えば、ボールミル、カウンタージェットミル等のジェットミル;コントラプレックス等のピンミル等の乾式により、上記無機塩を粉砕して入手することができる。
【0036】
上記無機塩の粒状物は、平均粒径が0.5〜100μmである。0.5μm以下であると、粒径が細かく、加熱時に接着力の変化が速やかに起こり易いので、2次凝集が起こり上記無機塩の粒状物が平均粒径0.5μm以上になって粉砕した意味がなくなり、100μmを超えると、本発明の粘着剤組成物を粘着剤層に用いて粘着テープを入手した場合、上記粘着剤層の厚みが大きくなり粘着テープに適さないので、上記範囲に限定される。
【0037】
上記無機塩の粒状物の含有量は、上記粘着成分100重量部に対して0.5〜200重量部である。0.5重量部未満であると、上記無機塩の粒状物を添加した効果がほとんど見られず、200重量部を超えると、柔軟性が失われテープ形状を保つことが難しくなるので、上記範囲に限定される。
【0038】
【実施例】
以下に実施例を掲げて本発明を更に詳しく説明するが、本発明はこれら実施例のみに限定されるものではない。
【0039】
実施例1
アクリル粘着剤SKダイン♯1700(綜研化学社製)100重量部(固形分換算)に対し、ジェットミルにて体積平均粒径15μmに粉砕したFeSO・7HOの微粉20重量部をホモディスパーにて分散し、得られた組成物を38μm厚のポリエチレンテレフタレート(PET)フィルム上にキャストし、60℃のオーブンにて50μm厚の粘着層となるように乾燥させ粘着テープ1を得た。
【0040】
実施例2
ブチルアクリレート94重量部、カルボキシエチルアクリレート6重量部、1,6−ヘキサンジオールジアクリレート0.06重量部、イルガキュア−651(チバガイギー社製)0.2重量部、アエロジル♯200(日本エアロジル社製)2.5重量部を予め混合しておき、そこに更にジェットミルにて体積平均粒径15μmに粉砕したFeSO・7HOの微粉20重量部をホモディスパーにて分散し、得られた組成物を38μm厚のポリエチレンテレフタレート(PET)フィルム上にキャストし、窒素気流中で、15mWの紫外線を5分間照射して重合させ粘着テープ2を得た。
【0041】
実施例3
アクリルエマルジョン粘着剤SKダイン♯E−2080(綜研化学社製)100重量部(固形分換算)に対し、ジェットミルにて体積平均粒径15μmに粉砕したFeSO・7HOの微粉20重量部をホモディスパーにて分散し、得られた組成物を38μm厚のポリエチレンテレフタレート(PET)フィルム上にキャストし、60℃のオーブンにて50μm厚の粘着層となるように乾燥させ粘着テープ3を得た。
【0042】
実施例4
アクリル粘着剤SKダイン♯1700(綜研化学社製)100重量部(固形分換算)に対し、ジェットミルにて体積平均粒径12μmに粉砕したNa・5HOの微粉20重量部をホモディスパーにて分散し、得られた組成物を38μm厚のポリエチレンテレフタレート(PET)フィルム上にキャストし、60℃のオーブンにて50μm厚の粘着層となるように乾燥させ粘着テープ4を得た。
【0043】
比較例1
アクリル粘着剤SKダイン♯1700(綜研化学社製)100重量部(固形分換算)に対し、ジェットミルにて体積平均粒径150μmに粉砕したFeSO・7HOの微粉20重量部をホモディスパーにて分散し、得られた組成物を38μm厚のポリエチレンテレフタレート(PET)フィルム上にキャストし、60℃のオーブンにて50μm厚の粘着層となるように乾燥させ粘着テープ5を得た。
【0044】
粘着テープ1〜5の粘着性能を加熱前と加熱後について、剥離試験によって評価した。剥離試験の評価法は、JIS Z 0237−1980に準じて行った。結果を表1に示した。
【0045】
【表1】

Figure 0003561324
【0046】
【発明の効果】
本発明の粘着剤組成物は上述の構成よりなるので、安全な作業環境を維持しつつ加熱により可燃性ガス等を発生することなく剥離力低下が得られる粘着テープ等に好適な粘着剤組成物を得ることができる。[0001]
[Industrial applications]
The present invention relates to a pressure-sensitive adhesive composition.
[0002]
[Prior art]
BACKGROUND ART Adhesives whose adhesive strength can be controlled by heating are used for masking tapes for painting automobiles and the like, adhesive tapes for temporary fixing used in an assembly process of electronic components and the like. Since such a heat-peelable pressure-sensitive adhesive can be easily removed by heating when unnecessary, it has advantages such as promoting simplification of work.
[0003]
JP-A-56-61468 and JP-A-60-252681 disclose techniques relating to a pressure-sensitive adhesive containing a heat-expandable resin which expands when heated. However, these adhesives include an organic solvent that generates gas at a relatively low temperature used when preparing a thermally expandable resin, and a flammable liquid that is used when mixing and dispersing the thermally expandable resin in the adhesive layer. Since it contains volatile gas and the like, there is a danger of ignition, which is not desirable from the viewpoint of working environment hygiene.
[0004]
[Problems to be solved by the invention]
In view of the above, an object of the present invention is to provide a pressure-sensitive adhesive composition that is safe and easy to peel off after heating.
[0005]
[Means for Solving the Problems]
Of the present invention Adhesive composition Contains 100 parts by weight of an adhesive component, contains water of crystallization having a dehydration temperature of 50 to 150 ° C., and disperses 0.5 to 200 parts by weight of inorganic salt particles having an average particle size of 0.5 to 100 μm. A pressure-sensitive adhesive composition comprising: a pressure-sensitive adhesive which releases water of crystallization when heated, adhesive force at an interface is weakened, and peeling force is reduced. .
[0006]
The pressure-sensitive adhesive used in the pressure-sensitive adhesive component is not particularly limited, and includes, for example, natural rubber, recycled rubber, styrene-butadiene rubber, acrylonitrile-butadiene rubber, polyisobutylene, polyvinyl ether, polyacrylate, thermoplastic elastomer, and the like. Examples of such adhesives include those conventionally used as pressure-sensitive adhesives.
[0007]
In the present invention, as the adhesive component, for example, an emulsion-type adhesive obtained by emulsifying rubber, a thermoplastic resin, or the like in water; a paste-type adhesive; An adhesive obtained by the above method may be used.
[0008]
In the present invention, the tackiness may be increased by adding a tackifier resin used in a normal pressure-sensitive adhesive to the pressure-sensitive adhesive main agent. The tackifier resin is not particularly limited, and examples thereof include rosin resins such as gum-based and wood-based; rosin derivatives such as hydrogenated rosin ester, pentaerythritol ester of polymerized rosin, and glycerin ester of polymerized rosin; α-pinene-based resins; Terpene resins such as β-pinene and terpene phenols; petroleum resins such as alicyclic saturated hydrocarbon resins, aliphatic hydrocarbon resins and aromatic hydrocarbon resins; cumarone indene resins, styrene resins and phenol resins And xylene resin.
The addition amount of the tackifier resin is preferably from 1 to 70 parts by weight based on 100 parts by weight of the adhesive main agent.
[0009]
In the present invention, a plasticizer may be added to the adhesive main agent to impart flexibility. The plasticizer is not particularly limited, and includes, for example, phthalate, non-drying vegetable oil, mineral oil, lanolin, polybutene, polyacrylate, low molecular weight polyisobutylene and the like.
[0010]
In the present invention, a crosslinking agent may be added to the adhesive main agent to increase the cohesive strength. The crosslinking agent is not particularly limited, and examples thereof include an isocyanate-based crosslinking agent, an epoxy-based crosslinking agent, a melamine-based crosslinking agent, a metal chelate-based crosslinking agent, and a peroxide.
[0011]
In the present invention, a filler such as zinc white, magnesium oxide, calcium carbonate, clay, aluminum hydroxide, silicic anhydride, carbon black, titanium white, and pigment may be added to the adhesive main agent.
[0012]
The inorganic salt used in the present invention contains water of crystallization having a dehydration temperature of 50 to 150 ° C. When the temperature is lower than 50 ° C., the adhesive property tends to decrease during storage.
[0013]
The inorganic salt containing water of crystallization whose dehydration temperature is 50 to 150 ° C is not particularly limited, and examples thereof include the following.
FeSO 4 ・ 7H 2 O (90 ° C FeSO 4 ・ H 2 O)
Al 2 O 3 ・ 3H 2 O (Al at 150 ° C 2 O 3 ・ H 2 O)
Al (ClO 4 ) 3 ・ 6H 2 O (178 ° C at Al (ClO 4 ) 3 )
AlK (SO 4 ) 2 ・ 12H 2 O (AlK (SO 4 ) 2 ・ 3H 2 O)
AlK (NH 4 ) (SO 4 ) 2 ・ 12H 2 O (AlK (NH at 120 ° C) 4 ) (SO 4 ) 2 ・ 2H 2 O)
K [AuCl 4 ] ・ 2H 2 O (K [AuCl at 100 ° C) 4 ])
[0014]
K [AuBr 4 ] ・ 2H 2 O (K [AuBr at 60 ° C) 4 ])
BaCl 2 ・ 2H 2 O (BaCl at 121 ° C) 2 )
Ba (ClO 3 ) 2 ・ H 2 O (Ba (ClO 3 ) 2 )
BaBr 2 ・ 2H 2 O (BaBr at 75 ° C) 2 ・ H 2 O, BaBr at 120 ° C 2 )
Ba (BrO 3 ) ・ H 2 O (at 170 ° C Ba (BrO 3 ) 2 )
BaI 2 ・ 2H 2 O (BaI at 98.9 ° C) 2 ・ H 2 O)
Ba (IO 3 ) 2 ・ H 2 O (Ba (IO 3 ) 2 )
Ba (SCN) 2 ・ 2H 2 O (Ba (SCN) at 160 ° C) 2 ・ H 2 O)
Ba (CH 3 COO) 2 ・ H 2 O (Ba (CH at 150 ° C.) 3 COO) 2 )
BeSO 4 ・ 4H 2 O (BeSO at 100 ° C 4 ・ 2H 2 O)
Bi 2 O 4 ・ 2H 2 O (Bi at 100 ° C 2 O 4 ・ H 2 O, Bi at 180 ° C 2 O 4 )
Bi (OH) 3 (BiO (OH) at 100 ° C)
Bi (NO 3 ) OH 2 O (Bi (NO at 105 ° C) 3 ))
[0015]
Bi 2 (C 2 O 4 ) 3 ・ 7H 2 O (Bi at about 130 ° C) 2 (C 2 O 4 ) 3 ・ H 2 O)
CaBr 2 ・ 6H 2 O (CaBr at 149 ° C) 2 )
Ca (BrO 3 ) 2 ・ H 2 O (Ca (BrO at 180 ° C) 3 ) 2 )
CaI 2 ・ 6H 2 O (CaI at 160 ° C 2 )
CaO 2 ・ 8H 2 O (CaO at 100 ° C 2 )
CaSO 3 ・ 2H 2 O (CaSO at 100 ° C 3 )
CaSO 4 ・ 2H 2 O (CaSO at 128 ° C 4 ・ 0.5H 2 O, CaSO at 163 ° C. 4 )
CaSeO 4 ・ 2H 2 O (CaSeO at 200 ° C 4 )
Ca (NO 2 ) 2 ・ H 2 O (Ca (NO) at 100 ° C 2 ) 2 )
Ca (NO 3 ) 2 ・ 4H 2 O (Ca (NO) at 132 ° C 3 ) 2 )
[0016]
Ca (PHO 3 ) ・ H 2 O (Ca at 200 ° C 3 ))
CaHPO 4 ・ 2H 2 O (CaHPO at 109 ° C 4 )
Ca (H 2 PO 4 ) 2 ・ H 2 O (109 ° C at Ca (H 2 PO 4 ) 2 )
Ca 3 (AsO 4 ) 2 ・ 3H 2 O (Ca at 100 ° C 3 (AsO 4 ) 2 )
CaCrO 4 ・ 2H 2 O (CaCrO at 200 ° C 4 )
Ca (C 2 O 4 ) ・ H 2 O (Ca (C) at 200 ° C 2 O 4 ))
CdCl 2 ・ 2.5H 2 O (CdCl at 120 ° C) 2 )
CdBr 2 ・ 4H 2 O (CdBr at 200 ° C) 2 )
3CdSO 4 ・ 8H 2 O (3CdSO at 41.5 ° C) 4 ・ H 2 O)
Cd (CH 3 COO) 2 ・ 2H 2 O (Cd (CH at 130 ° C) 3 COO) 2 ・ H 2 O)
Ce (NO 3 ) 3 ・ 6H 2 O (Ce (NO at 150 ° C) 3 ) 3 ・ 3H 2 O)
Ce (NH 4 ) (SO 4 ) 2 ・ 4H 2 O (Ce (NH at 100 ° C) 4 ) (SO 4 ) 2 ・ H 2 O, Ce (NH 4 ) (SO 4 ) 2 )
Ce 2 (C 2 O 4 ) 3 ・ 9H 2 O (Ce at 110 ° C 2 (C 2 O 4 ) 3 ・ H 2 O)
[0017]
CoCl 2 ・ 6H 2 O (CoCl at about 55 ° C) 2 ・ 2H 2 O at 100 ° C
CoCl 2 ・ H 2 O, CoCl at about 130 ° C 2 )
Co (CLO 4 ) 2 ・ 6H 2 O (153 ° C at Co (ClO 4 ) 2 ・ 2H 2 O)
CoBr 2 ・ 6H 2 O (CoBr at 100 ° C) 2 ・ 2H 2 O, CoBr at 130 ° C 2 )
CoI 2 ・ 6H 2 O (CoI at 130 ° C 2 )
CoSO 4 ・ 7H 2 O (CoSO at 41.5 ° C) 4 ・ 6H 2 O, CoSO at 70 ° C 4 ・ 6H 2 O)
Co (NO 3 ) 2 ・ 6H 2 O (at 55 ° C, Co (NO 3 ) 2 ・ 3H 2 O)
Co 3 (PO 4 ) 2 ・ 8H 2 O (Co at 200 ° C 3 (PO 4 ) 2 )
Co (SCN) 2 ・ 3H 2 O (Co (SCN) at 105 ° C) 2 )
Co (CH 3 COO) 2 ・ 4H 2 O (At 140 ° C., Co (CH 3 COO) 2 )
[0018]
CoK 2 (SO 4 ) 2 ・ 6H 2 O (CoK at 95 ° C) 2 (SO 4 ) 2 ・ H 2 O)
cis- [CoCl 2 (NH 3 ) 4 ] Cl ・ 0.5H 2 O (cis- [CoCl at 60 ° C. 2 (NH 3 ) 4 ] Cl)
[Co (C 2 H 8 N 2 ) 3 ] Cl 3 ・ 3H 2 O (100 ° C [Co (C 2 H 8 N 2 ) 3 ] Cl 3 )
K [Co (C 10 H 12 N 2 O 8 )] ・ 2H 2 O [K (Co (C 10 H 12 N 2 O 8 )])
Cr 2 (SO 4 ) 3 ・ 18H 2 O (Cr at 100 ° C) 2 (SO 4 ) 3 ・ 6H 2 O) Cr (CH 3 COO) 2 ・ H 2 O (Cr (CH at 100 ° C) 3 COO) 2 )
CrK (SO 4 ) 2 ・ 12H 2 O (CrK (SO 4 ) 2 ・ 2H 2 O)
CrK (NH 4 ) (SO 4 ) 2 ・ 12H 2 O (CrK (NH at 100 ° C) 4 ) (SO 4 ) 2 ・ 3H 2 O)
[Cr (NH 3 ) 6 ] Cl 3 ・ H 2 O (-0.5H at 60 ° C) 2 O)
[0019]
K 3 [Cr (NCS) 6 ] ・ 4H 2 O (K at 110 ° C 3 [Cr (NCS) 6 ])
trans-NH 4 [Cr (NCS) 4 (NH 3 ) 2 ] ・ H 2 O (trans-NH at 100 ° C) 4 [Cr (NCS) 4 (NH 3 ) 2 ])
CsHCO 3 (-0.5H at 175 ° C 2 O)
CuSeO 4 ・ 5H 2 O (CuSeO at 100 ° C 4 ・ H 2 O)
Cu (NO 3 ) 2 ・ 3H 2 O (-HNO at 170 ° C 3 )
Cu (C 2 O 4 ) ・ 0.5H 2 O (Cu (C 2 O 4 ))
K 2 [Cu (C 2 O 4 ) 2 ] ・ 2H 2 O (K at 150 ° C 2 [Cu (C 2 O 4 ) 2 ])
[Cu (NH 2 CH 2 COO) 2 ] ・ H 2 O (130 [deg.] C [Cu (NH 2 CH 2 COO) 2 ])
[0020]
Dy 2 (CO 3 ) 3 ・ 4H 2 O (Dy at 150 ° C 2 (CO 3 ) 3 )
Dy 2 (C 2 O 4 ) 3 ・ 4H 2 O (Dy at 40 ° C) 2 (C 2 O 4 ) 3 )
Er (NO 3 ) 3 ・ 5H 2 O (Er (NO at 150 ° C) 3 ) 3 ・ H 2 O)
FeF 3 ・ 4.5H 2 O (FeF at 100 ° C) 3 ・ 3H 2 O)
FeCl 2 ・ 4H 2 O (FeCl at 105 ° C) 2 ・ 2H 2 O)
FeO (OH) (Fe 2 O 3 )
Na 3 [Fe (C 2 O 4 ) 3 ] ・ 3H 2 O (Na at 100 ° C) 3 [Fe (C 2 O 4 ) 3 ] ・ 2H 2 O)
K 3 [Fe (C 2 O 4 ) 3 ] ・ 3H 2 O (K at 100 ° C 3 [Fe (C 2 O 4 ) 3 ])
K 4 [Fe (CN) 6 ] ・ 3H 2 O (K at 100 ° C 4 [Fe (CN) 6 ])
Ga 2 (C 2 O 4 ) 3 ・ 4H 2 O (Ga at 180 ° C 2 (C 2 O 4 ) 3 )
Gd 2 (C 2 O 4 ) 3 ・ 10H 2 O (Gd at 110 ° C) 2 (C 2 O 4 ) 3 ・ 4H 2 O)
Ho 2 (C 2 O 4 ) 3 ・ 10H 2 O (Ho at 40 ° C) 2 (C 2 O 4 ) 3 ・ 9H 2 O)
[0021]
In (OH) 3 (InO (OH) at about 150 ° C)
In (NO 3 ) 3 ・ 3H 2 O (In (NO 3 ) 3 ・ H 2 O)
InBr 3 ・ 4H 2 O (InBr at 100 ° C) 3 ・ H 2 O)
Na 2 [IrCl 6 ] ・ 6H 2 O (Na at 100 ° C) 2 [IrCl 6 ])
K 3 [Ir (C 2 O 4 ) 3 ] ・ 4H 2 O (K at 40 ° C 3 [Ir (C 2 O 4 ) 3 ] ・ 3H 2 O)
K 2 S ・ 5H 2 O (K at 150 ° C 2 S ・ 2H 2 O)
3K 2 S 2 O 3 ・ H 2 O (K at 180 ° C 2 S 2 O 3 )
K 2 TeO 4 ・ 5H 2 O (−200 ° C.-(H 2 O + O))
K 4 P 2 O 7 ・ 3H 2 O (K at 100 ° C 4 P 2 O 7 ・ 2H 2 O, K at 180 ° C 4 P 2 O 7 ・ H 2 O)
[0022]
K 2 SnS 3 ・ 3H 2 O (K at 100 ° C 2 SnS 3 )
KB 5 O 8 ・ 4H 2 O (KB at about 100 ° C 5 O 8 ・ H 2 O)
K 2 RuO 4 ・ H 2 O (K at 200 ° C 2 RuO 4 )
K 2 OsO 4 ・ 2H 2 O (K at 200 ° C 2 OsO 4 ・ H 2 O)
K 2 C 2 O 4 ・ H 2 O (K at 160 ° C 2 C 2 O 4 )
KNaCO 3 ・ 6H 2 O (KNaCO at 100 ° C 3 )
La 2 (CO 3 ) 3 ・ 8H 2 O (La at 100 ° C) 2 (CO 3 ) 3 ・ H 2 O)
La (CH 3 COO) 3 ・ 1.5H 2 O (La (CH at 100 ° C) 3 COO) 3 ・ H 2 O, La (CH 3 COO) 3 )
LiBr 2H 2 O (LiBr · H at 44 ° C) 2 O)
LiClO 4 ・ 3H 2 O (LiClO at 100 ° C 4 ・ H 2 O, LiClO at 150 ° C 4 )
LiSO 4 ・ H 2 O (LiSO at 130 ° C 4 )
LiNO 3 ・ 3H 2 O (LiNO at 61.1 ° C) 3 )
MgSO 4 ・ 7H 2 O (MgSO 4 at 150 ° C) 4 ・ H 2 O, MgSO at 200 ° C 4 )
[0023]
Mg (PH 2 O 2 ) 2 ・ 6H 2 O (Mg (PH at 100 ° C) 2 O 2 ) 2 ・ H 2 O, Mg (PH 2 O 2 ) 2 )
MgHPO 3 ・ 3H 2 O (MgHPO at 170 ° C 3 )
MgHPO 3 ・ 7H 2 O (MgHPO at 170 ° C 3 ・ 4H 2 O)
Mg 3 (PO 4 ) 2 ・ 8H 2 O (Mg at 150 ° C 3 (PO 4 ) 2 ・ 3H 2 O)
MgCO 3 ・ 3H 2 O (MgCO at 100 ° C 3 )
Mg (NH 4 ) 2 (SO 4 ) 2 ・ 6H 2 O (Mg (NH 4 ) 2 (SO 4 ) 2 ・ H 2 O, Mg (NH 4 ) 2 (SO 4 ) 2 )
MgNH 4 Cl 3 ・ 6H 2 O (MgNH at 100 ° C 4 Cl 3 ・ 4H 2 O)
MgNH 4 PO 4 ・ 6H 2 O (MgNH at 100 ° C 4 PO 4 )
MgNH 4 AsO 4 ・ 6H 2 O (MgNH at about 100 ° C) 4 AsO 4 ・ 0.5H 2 O)
[0024]
MnCl 2 ・ 4H 2 O (MnCl at 106 ° C) 2 ・ 3H 2 O, MnCl at 198 ° C 2 )
Mg (PH 2 O 2 ) 2 ・ H 2 O (Mg (PH at about 150 ° C) 2 O 2 ) 2 )
Mg (H 2 PO 4 ) 2 ・ 2H 2 O (Mg (H 2 PO 4 ) 2 ・ H 2 O)
Mn (PH 2 O 2 ) 2 ・ H 2 O (Mn (PH at about 150 ° C) 2 O 2 ) 2 )
Mn (H 2 PO 4 ) 2 ・ 2H 2 O (Mn (H 2 PO 4 ) 2 ・ H 2 O)
MnHPO 4 ・ 3H 2 O (MnHPO at 200 ° C 4 )
Mn 2 P 2 O 7 ・ 3H 2 O (Mn at 120 ° C 2 P 2 O 7 )
Mn (SCN) 2 ・ 3H 2 O (Mn (SCN) at 100 ° C) 2 )
Mn (CH 3 COO) 2 ・ 4H 2 O (Mn (CH 3 COO) 2 )
Mn (C 2 O 4 ) ・ 2H 2 O (Mn (C 2 O 4 ))
(NH 4 ) 2 [MnCl 4 ] ・ 2H 2 O (at 100 ° C (NH 4 ) 2 [MnCl 4 ])
[0025]
K 4 [Mn (CN) 6 ] ・ 3H 2 O (K at 100 ° C 4 [Mn (CN) 6 ])
MoO 3 ・ H 2 O (MoO at 70 ° C 3 )
MoO 3 ・ 2H 2 O (MoO at 70 ° C 3 ・ H 2 O)
K 4 [Mo (CN) 8 ] ・ 2H 2 O (K at 110 ° C 4 [Mo (CN) 8 ])
Na 2 [Mo 3 O 10 ] ・ 7H 2 O (Na at 100 ° C) 2 [Mo 3 O 10 ] ・ H 2 O)
Na 6 [Mo 7 O 24 ] 22H 2 O (Na at 120 ° C) 6 [Mo 7 O 24 ] ・ 21H 2 O)
(NH 4 ) 6 [Mo 7 O 24 ] ・ 4H 2 O (at 90 ° C (NH 4 ) 6 [Mo 7 O 24 ])
Na 4 [SiMo 12 O 40 ] ・ 20H 2 O (Na at 90 ° C) 4 [SiMo 12 O 40 ] ・ 13H 2 O)
Na 2 SO 3 ・ 7H 2 O (Na at 150 ° C) 2 SO 3 )
[0026]
Na 2 SO 4 ・ 10H 2 O (Na at 100 ° C) 2 SO 4 )
Na 2 S 2 O 3 ・ 5H 2 O (Na at 100 ° C) 2 S 2 O 3 )
Na 2 S 2 O 6 ・ 2H 2 O (Na at 110 ° C) 2 S 2 O 6 )
Na 2 PHO 3 ・ 5H 2 O (Na at 100 ° C) 2 PHO 3 )
NaHPHO 3 ・ 2.5H 2 O (NaHPHO at 100 ° C) 3 )
Na 3 PO 4 ・ 12H 2 O (Na at 100 ° C) 3 PO 4 ・ H 2 O)
NaH 2 PO 4 ・ H 2 O (NaH at 100 ° C) 2 PO 4 )
NaH 2 PO 4 ・ 2H 2 O (NaH at 95 ° C) 2 PO 4 )
Na 2 H 2 P 2 O 6 ・ 6H 2 O (Na at 100 ° C) 2 H 2 P 2 O 6 )
Na 4 P 2 O 7 ・ 10H 2 O (Na at 93.8 ° C) 4 P 2 O 7 ・ 9H 2 O)
Na 2 HAsO 4 ・ 7H 2 O (Na at 100 ° C) 2 HAsO 4 )
NaH 2 AsO 4 ・ H 2 O (NaH at 130 ° C) 2 AsO 4 )
Na 2 CO 3 ・ H 2 O (Na at 100 ° C) 2 CO 3 )
Na 2 SiO 3 ・ 9H 2 O (Na at 100 ° C) 2 SiO 3 ・ 3H 2 O)
Na 2 B 4 O 7 ・ 10H 2 O (Na at 60 ° C) 2 B 4 O 7 ・ 2H 2 O)
[0027]
NaBO 2 ・ 4H 2 O (NaBO at 120 ° C) 2 ・ 3H 2 O)
Na 2 Cr 2 O 7 ・ 2H 2 O (Na at 100 ° C) 2 Cr 2 O 7 )
Na 2 WO 4 ・ 2H 2 O (Na at 120 ° C) 2 WO 4 )
Na 2 [Sn (OH) 6 (Na at 140 ° C.) 2 SnO 3 )
Na 4 [XeO 6 ] ・ 6H 2 O (Na at 100 ° C) 4 [XeO 6 ])
NaCH 3 COO ・ 3H 2 O (NaCH at 123 ° C) 3 COO)
NaHC 2 O 4 ・ H 2 O (NaHC at 100 ° C) 2 O 4 )
K 2 [NbF 5 O] ・ H 2 O (K at 100 ° C 2 [NbF 5 O])
NdCl 3 ・ 6H 2 O (NdCl at 150 ° C) 3 )
Nd 2 (CO 3 ) 3 ・ 8H 2 O (Nd at 100 ° C) 2 (CO 3 ) 3 ・ H 2 O)
NiCl 2 ・ 6H 2 O (NiCl at 140 ° C) 2 )
NiSO 4 ・ 6H 2 O (NiSO at 103 ° C) 4 )
[0028]
Ni (CN) 2 ・ 4H 2 O (Ni (CN) at 200 ° C 2 )
NiC 2 O 4 ・ 2H 2 O (NiC at 190 ° C 2 O 4 )
K 2 [Ni (CN) 4 ] ・ H 2 O (K at 105 ° C 2 [Ni (CN) 4 ])
[Ni (C 5 H 7 O 2 ) 2 (H 2 O) 2 ] (At 100 ° C. (in vacuum) [Ni (C 5 H 7 O 2 ) 2 ]
K 3 [OsCl] 6 ・ 3H 2 O (K at 150 ° C 3 [OsCl] 6 )
Pb (CH 3 COO) 2 ・ 3H 2 O (Pb (CH at 75 ° C) 3 COO) 2 ・ 2H 2 O)
K 2 [Pd (CN) 4 ] ・ 3H 2 O (K at 100 ° C 2 [Pd (CN) 4 ] ・ H 2 O, K at 200 ° C 2 [Pd (CN) 4 ])
Pr 2 (CO 3 ) 3 ・ 8H 2 O (Pr at 100 ° C 2 (CO 3 ) 3 ・ 2H 2 O, Pr at 200 ° C 2 (CO 3 ) 3 )
Na 2 [PtCl 4 ] ・ 4H 2 O (Na [PtCl at 150 ° C) 4 ] ・ 3H 2 O)
Na 2 [PtCl 6 ] ・ 6H 2 O (Na at 100 ° C) 2 [PtCl 6 ])
[0029]
Na 2 [Pt (OH) 6 (Na at 150-170 ° C.) 2 [PtO 3 ])
[Pt (NH 3 ) 4 ] Cl 2 ・ H 2 O (Pt (NH 3 ) 4 ] Cl 2 )
K 2 [Pt (CN) 4 ] ・ 3H 2 O (K at 100 ° C 2 [Pt (CN) 4 ])
Ba [Pt (CN) 4 ] ・ 4H 2 O (Ba [Pt (CN) at 100 ° C) 4 ] ・ 2H 2 O, Ba [Pt (CN) at 150 ° C 4 ])
(NH 4 ) 3 [RhCl 6 ] ・ H 2 O (at 140 ° C (NH 4 ) 3 [RhCl 6 ])
K 3 [Rh (C 2 O 4 ) 3 ] 4.5H 2 O (K at 150 ° C 3 [Rh (C 2 O 4 ) 3 ] ・ H 2 O), K at 190 ° C 3 [Rh (C 2 O 4 ) 3 ])
[Rh 2 (CH 3 COO 2 ) 4 (H 2 O) 2 ] [Rh at 120 ° C 2 (CH 3 COO 2 ) 4 )
[0030]
[Ru (C 10 H 8 N 2 ) 3 ] Cl 2 ・ 6H 2 O (200 ° C [Ru (C 10 H 8 N 2 ) 3 ] Cl 2 )
K 4 [Ru (CN) 6 ] ・ 3H 2 O (K at 115 ° C 4 [Ru (CN) 6 ])
K 3 [Ru (C 2 O 4 ) 3 ] 4.5H 2 O (K at 100 ° C 3 [Ru (C 2 O 4 ) 3 ] ・ H 2 O, K at 150 ° C 3 [Ru (C 2 O 4 ) 3 ] ・ 0.5H 2 O)
Sb 2 O 5 ・ 2H 2 O (Sb at 200 ° C 2 O 5 ・ 2H 2 O)
K 2 [Sb 2 ((R, R) -C 4 H 2 O 6 ) 2 ] ・ 3H 2 O (K at 100 ° C 2 [Sb 2 ((R, R) -C 4 H 2 O 6 ) 2 ])
H 2 SeO 3 (SeO at 70 ° C 2 )
SmCl 3 ・ 6H 2 O (SmCl at 100 ° C) 3 ・ H 2 O)
Sm 2 (SO 4 ) 3 ・ 8H 2 O (Sm at 105 ° C 2 (SO 4 ) 3 ・ 5H 2 O)
SrCl 2 ・ 6H 2 O (SrCl at 60 ° C) 2 ・ 2H 2 O, SrCl at 100 ° C 2 )
SrBr 2 ・ 6H 2 O (SrBr at 88.2 ° C) 2 ・ 2H 2 O)
SrO 2 ・ 8H 2 O (SrO at 100 ° C) 2 )
[0031]
Sr (OH) 2 ・ 8H 2 O (Sr (OH) at 100 ° C 2 )
Sr (NO 3 ) 2 ・ 4H 2 O (Sr (NO at 110 ° C) 3 ) 2 )
Sr (CH 3 COO) 2 ・ 0.5H 2 O (Sr (CH at 150 ° C) 3 COO) 2 )
Sr (C 2 O 4 ) ・ H 2 O (Sr (C at 150 ° C 2 O 4 ))
Tb 2 (C 2 O 4 ) 3 ・ 10H 2 O (Tb at 40 ° C 2 (C 2 O 4 ) 3 ・ 9H 2 O)
H 6 TeO 6 (-2H at 120 ° C 2 O)
ThF 4 ・ 4H 2 O (ThF at 100 ° C) 4 ・ 3H 2 O, ThF at 140 ° C 4 ・ 2H 2 O)
Th (SO 4 ) 2 ・ 9H 2 O (47 ° C and Th (SO 4 ) 2 ・ 4H 2 O)
TlCl 3 ・ 4H 2 O (TlCl at 100 ° C) 3 )
[0032]
K 3 [TlCl 6 ] ・ 2H 2 O (K at 150 ° C 3 [TlCl 6 ])
Tm 2 (C 2 O 4 ) 3 ・ 6H 2 O (Tm at 50 ° C 2 (C 2 O 4 ) 3 ・ 5H 2 O)
(UO 2 ) HPO 4 ・ 4H 2 O (110 ° C (UO 2 ) HPO 4 ・ 2H 2 O)
UO 2 (CH 3 COO) 2 ・ 2H 2 O (UO at 110 ° C 2 (CH 3 COO) 2 )
UO 2 (C 2 O 4 ) 3H 2 O (UO at 110 ° C 2 (C 2 O 4 ))
K 4 [U (C 2 O 4 ) 4 ] ・ 5H 2 O (K at 130 ° C 4 [U (C 2 O 4 ) 4 ])
VF 3 ・ 3H 2 O (VF at 100 ° C 3 ・ 2H 2 O, VF at 130 ° C 3 )
WO 3 ・ H 2 O (WO at 100 ° C 3 )
K 4 [W (CN) 8 ] ・ 2H 2 O (K at 115 ° C 4 [W (CN) 8 ])
Na 10 W 12 O 41 ・ 28H 2 O (Na at 100 ° C) 10 W 12 O 41 ・ 16H 2 O)
(NH 4 ) 10 [H 2 W 12 O 42 ] ・ 10H 2 O (at 100 ° C (NH 4 ) 10 [H 2 W 12 O 42 ] ・ 4H 2 O)
[0033]
K 4 [SiW 12 O 40 ] ・ 18H 2 O (K at 100 ° C 4 [SiW 12 O 40 ] ・ H 2 O)
YCl 3 ・ 6H 2 O (YCl at 100 ° C) 3 ・ H 2 O, YCl at 160 ° C 3 )
Y 2 (SO 4 ) 3 ・ 8H 2 O (Y at 120 ° C 2 (SO 4 ) 3 )
Y (NO 3 ) 3 ・ 6H 2 O (Y at 100 ° C 3 ) 3 ・ 3H 2 O)
Y 2 (CO 3 ) 3 ・ 3H 2 O (Y at 100 ° C) 2 (CO 3 ) 3 ・ 2H 2 O, Y at 130 ° C 2 (CO 3 ) 3 )
YbCl 3 ・ 6H 2 O (YbCl at 180 ° C) 3 )
Yb 2 (SO 4 ) 3 ・ 8H 2 O (Yb at 120 ° C) 2 (SO 4 ) 3 )
Yb (CH 3 COO) 3 ・ 4H 2 O (Yb (CH at 100 ° C.) 3 COO) 3 )
Yb 2 (C 2 O 4 ) 3 ・ 10H 2 O (Yb at 100 ° C) 2 (C 2 O 4 ) 3 ・ 3H 2 O)
[0034]
ZnF 2 ・ 4H 2 O (ZnF at 100 ° C) 2 )
ZnSO 3 ・ 2H 2 O (ZnSO at 100 ° C 3 )
Zn (NO 3 ) 2 ・ 6H 2 O (Zn (NO 3 ) 2 )
Zn 3 (PO 4 ) 2 ・ 4H 2 O (Zinc at 100 ° C 3 (PO 4 ) 2 ・ 2H 2 O, Zn at 190 ° C 3 (PO 4 ) 2 ・ H 2 O)
Zn (CH 3 COO) 2 ・ 2H 2 O (Zinc (CH 3 COO) 2 )
ZrCl 2 O ・ 8H 2 O (ZrCl at 150 ° C) 2 O ・ 2H 2 O)
Zr (SO 4 ) 2 ・ 4H 2 O (Zr (SO 4 ) 2 ・ H 2 O)
Since the inorganic salt containing water of crystallization whose dehydration temperature is 50 to 150 ° C. releases water of crystallization when heated, the adhesive force at the interface between the pressure-sensitive adhesive layer obtained from the pressure-sensitive adhesive composition of the present invention and the substrate is low. It is weakened and the peeling force is reduced.
[0035]
In the present invention, a granular material of the above inorganic salt is used. Granules of the inorganic salt are often those in which the inorganic salt is water-soluble. For example, the inorganic salt is pulverized by a dry method such as a ball mill or a jet mill such as a counter jet mill; or a pin mill such as a contraplex. Can be obtained.
[0036]
The granular material of the inorganic salt has an average particle size of 0.5 to 100 μm. When the particle size is 0.5 μm or less, the particle size is small, and a change in adhesive force tends to occur quickly upon heating. Therefore, secondary aggregation occurs, and the granular material of the inorganic salt has an average particle size of 0.5 μm or more and is pulverized. Meaning is lost, and if it exceeds 100 μm, when the pressure-sensitive adhesive tape is obtained using the pressure-sensitive adhesive composition of the present invention for the pressure-sensitive adhesive layer, the thickness of the pressure-sensitive adhesive layer increases and is not suitable for the pressure-sensitive adhesive tape, so it is limited to the above range Is done.
[0037]
The content of the inorganic salt particles is 0.5 to 200 parts by weight based on 100 parts by weight of the adhesive component. When the amount is less than 0.5 part by weight, the effect of adding the inorganic salt granules is hardly observed. When the amount is more than 200 parts by weight, flexibility is lost and it becomes difficult to maintain a tape shape. Limited to.
[0038]
【Example】
Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited to these Examples.
[0039]
Example 1
Acrylic adhesive SK Dyne # 1700 (manufactured by Soken Chemical Co., Ltd.) 100 parts by weight (solid content), FeSO ground to a volume average particle size of 15 μm with a jet mill 4 ・ 7H 2 20 parts by weight of a fine powder of O are dispersed by a homodisper, and the obtained composition is cast on a 38 μm-thick polyethylene terephthalate (PET) film and dried in an oven at 60 ° C. to form a 50 μm-thick adhesive layer. The adhesive tape 1 was obtained.
[0040]
Example 2
94 parts by weight of butyl acrylate, 6 parts by weight of carboxyethyl acrylate, 0.06 parts by weight of 1,6-hexanediol diacrylate, 0.2 parts by weight of Irgacure 651 (manufactured by Ciba-Geigy), Aerosil 200 (manufactured by Nippon Aerosil Co., Ltd.) 2.5 parts by weight of FeSO previously mixed and further pulverized with a jet mill to a volume average particle size of 15 μm. 4 ・ 7H 2 20 parts by weight of a fine powder of O was dispersed by a homodisper, and the obtained composition was cast on a 38 μm-thick polyethylene terephthalate (PET) film and polymerized by irradiating with 15 mW ultraviolet rays for 5 minutes in a nitrogen stream. Adhesive tape 2 was obtained.
[0041]
Example 3
Acrylic emulsion adhesive SK Dyne @ E-2080 (manufactured by Soken Chemical Co., Ltd.) 100 parts by weight (solid content), FeSO pulverized to a volume average particle size of 15 μm with a jet mill 4 ・ 7H 2 20 parts by weight of a fine powder of O are dispersed by a homodisper, and the obtained composition is cast on a 38 μm-thick polyethylene terephthalate (PET) film and dried in an oven at 60 ° C. to form a 50 μm-thick adhesive layer. The adhesive tape 3 was obtained.
[0042]
Example 4
Acrylic adhesive SK Dyne # 1700 (manufactured by Soken Chemical Co., Ltd.) 100 parts by weight (solid content), Na crushed to a volume average particle size of 12 μm by a jet mill 2 S 2 O 3 ・ 5H 2 20 parts by weight of a fine powder of O are dispersed by a homodisper, and the obtained composition is cast on a 38 μm-thick polyethylene terephthalate (PET) film and dried in an oven at 60 ° C. to form a 50 μm-thick adhesive layer. The adhesive tape 4 was obtained.
[0043]
Comparative Example 1
100 parts by weight (solid content) of acrylic adhesive SK Dyne # 1700 (manufactured by Soken Chemical Co., Ltd.), FeSO ground to a volume average particle size of 150 μm with a jet mill 4 ・ 7H 2 20 parts by weight of a fine powder of O are dispersed by a homodisper, and the obtained composition is cast on a 38 μm-thick polyethylene terephthalate (PET) film and dried in an oven at 60 ° C. to form a 50 μm-thick adhesive layer. The adhesive tape 5 was obtained.
[0044]
The adhesive performance of the adhesive tapes 1 to 5 was evaluated by a peel test before and after heating. The peeling test was evaluated according to JIS Z 0237-1980. The results are shown in Table 1.
[0045]
[Table 1]
Figure 0003561324
[0046]
【The invention's effect】
Since the pressure-sensitive adhesive composition of the present invention is constituted as described above, a pressure-sensitive adhesive composition suitable for a pressure-sensitive adhesive tape or the like from which a reduction in peeling force can be obtained without generating a flammable gas or the like by heating while maintaining a safe working environment Can be obtained.

Claims (1)

粘着成分100重量部に、
脱水温度が50〜150℃である結晶水を含有し、平均粒径が0.5〜100μmである無機塩の粒状物0.5〜200重量部
を分散させてなる粘着剤組成物であって、粘着剤が加熱時に結晶水を放出して、界面の接着力が弱められ、剥離力が低下することを特徴とする粘着剤組成物
100 parts by weight of adhesive component,
Dehydration temperature containing water of crystallization is 50 to 150 ° C., an average particle size in viscous Chakuzai composition Do that by particulates 0.5 to 200 parts by weight is dispersed in the inorganic salt is 0.5~100μm A pressure-sensitive adhesive composition characterized in that the pressure-sensitive adhesive releases water of crystallization when heated, whereby the adhesive force at the interface is weakened and the peeling force is reduced .
JP05917595A 1995-03-17 1995-03-17 Adhesive composition Expired - Fee Related JP3561324B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
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Publication Number Publication Date
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JP3561324B2 true JP3561324B2 (en) 2004-09-02

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Country Status (1)

Country Link
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007284577A (en) * 2006-04-17 2007-11-01 Nitto Denko Corp Pressure-sensitive adhesive sheet and method for processing adherend by using the same

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19961940A1 (en) * 1999-12-22 2001-08-02 Henkel Kgaa Detachable adhesive connections
JP2005089640A (en) * 2003-09-18 2005-04-07 Unon Giken:Kk Re-releasable pressure-sensitive adhesive sheet and method for releasing pressure-sensitive adhesive sheet
JP5896201B2 (en) * 2011-10-19 2016-03-30 Dic株式会社 Adhesive composition and adhesive tape

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007284577A (en) * 2006-04-17 2007-11-01 Nitto Denko Corp Pressure-sensitive adhesive sheet and method for processing adherend by using the same

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